69 results about "Thermosipho" patented technology

This cooler, together with a condenser (16) that condenses a gas-phase coolant and discharges a liquid-phase coolant, constitutes a thermosyphon that causes a coolant to circulate. The cooler comprises: first channel forming parts (60a, 60b, 60c) that form a supply channel (70) through which the liquid-phase coolant from the condenser flows; second channel forming parts (60a, 43, 60b, 44) that form evaporation channels (61a, 61b) that have coolant inlets (64a, 64b) that communicate with the supply channel, that are formed to extend upward from the coolant inlets, and that cause the liquid-phase coolant to evaporate through heat exchange between cooling targets (12a, 12b) and the liquid-phase coolant that flows in from the supply channel via the coolant inlets, thereby causing the gas-phasecoolant to be generated; and third channel forming parts (60a, 60b, 45) that form a discharge channel (71) through which the gas-phase coolant from the evaporation channels flows toward the condenser. The coolant inlets are located below a vertical center part of the supply channel.

The invention discloses a novel flue gas CO2 capture system regeneration process which comprises the following steps of: S1, CO2 absorption: flue gas subjected to desulfurization, denitrification and dust removal enters a deep purification tower, the flue gas is pressurized by an induced draft fan and then enters an absorption tower, a barren liquor absorbent is added into the absorption tower, the barren liquor absorbent is in countercurrent contact with the flue gas, and CO2 absorption is completed; S2, generation of rich liquid: the barren liquor absorbent reacts with carbon elements in the flue gas in the absorption tower to form rich liquid, the rich liquid is discharged through the bottom of the absorption tower, and gas is discharged from a tail gas discharge port in the top of the absorption tower; S3, rich liquid heat exchange; S4, falling film type regeneration; and S5, siphoning type regeneration. A falling film type boiler is mainly adopted to replace a conventional thermosyphon type boiler, top spraying falling film type regeneration and boiler bottom liquid inlet syphon type regeneration can be achieved through technological process switching, two regeneration technologies are achieved through one set of technological equipment, the number of equipment is reduced, and the engineering investment cost is saved.

The invention discloses a low-energy-consumption automatic deodorization garbage can cover. The garbage can cover comprises a can cover body provided with an inner cavity for containing a garbage can, an air suction piece and an emptying piece, wherein the can cover body is provided with a garbage can transfer opening and a feeding opening, the garbage can transfer opening is provided with a transfer door, and the feeding opening is provided with a feeding door; the air suction piece is arranged in the inner cavity and communicates with the first end part of an exhaust pipe; and the emptying pipe is communicated with the second end part of the exhaust pipe and comprises a high-position emptying port, a heating pipe section and a peculiar smell treatment pipe section, and the high-position emptying port is used for exhausting rising hot air of the heating pipe section. When a fan is not started, the low-energy-consumption automatic deodorization garbage can cover heats the air in the heating pipe section, gas is heated to expand, the specific gravity is reduced, the gas floats upwards, a thermosyphon system is formed, the emptying pipe is in a vacuum state, and peculiar smell gas in the garbage can cover is forced to float upwards through the air suction piece, the exhaust pipe and the emptying pipe and is deodorized through the peculiar smell treatment pipe section. The invention further discloses a garbage can comprising the low-energy-consumption automatic deodorization garbage can cover and a using method of the garbage can.

A production method for a device temperature control device, including: connecting a filling port (36) for a circuit (10) and a container (45) housing a working fluid in a gas phase; and filling the working fluid into the circuit (10). The circuit (10) constitutes a thermosiphon-type heat pipe and circulates the working fluid. During filling, the working fluid inside the circuit (10) is cooled bya cooling source (21). The internal pressure of the circuit (10) is made lower than the internal pressure of the container (45), by reducing the internal temperature of the circuit (10) to below the internal temperature of the container (45).

The invention provides a thermosyphon heat dissipation device. A first condensing unit and a second condensing unit are arranged, a first right flow collecting cavity and a first left flow collectingcavity of the first condensing unit and a second left flow collecting cavity and a second right flow collecting cavity of the second condensing unit are perpendicular to and fixedly arranged close toan evaporator, therefore, the space occupation of the thermosyphon heat dissipation device in the vertical direction is reduced; a first steam pipe communicates with the first right flow collecting cavity of the first condensing unit and a right steam pipe connecting hole formed in the evaporator, and a second steam pipe communicates with the second left flow collecting cavity of the second condensing unit and a left steam pipe connecting hole formed in the evaporator; and compared with the mode that only one flow collecting pipe used for collecting steam is arranged on one side of the evaporator, the technical scheme can reduce a stroke difference between the steam from the left side area and the steam in the right side area of a sealed containing cavity of the evaporator to the collecting cavities, and then the temperature difference between the left side and the right side of the evaporator is reduced, and the temperatures of the left and right sides of the bottom of the evaporatorare relatively uniform.

A heat dissipating module with micro-passages includes a heat dissipating cavity connecting to a top of a heat absorbing cavity to form a distance from a heat source. When a working fluid in the heat absorbing cavity absorbs the thermal energy and is vaporized, the vapor would flow up to a vapor guiding space due to thermosyphon effect and principles of Boyle's Law, and then the vapor is projected and spread rapidly and evenly to the heat dissipating cavity through a projecting exit. Then the vapor is condensed into liquid and become the working fluid again by heat exchange. The condensed liquid then drips down and flows back to the heat absorbing cavity via micro-passages, forming a cycle of phase change of the working fluid for operation of heat dissipation.

A cooler (11) cools target equipment (2) by using latent heat from vaporization of a hydraulic fluid. A cold heat source-type heat exchanger (12) uses the cold heat of a low-temperature, low-pressurerefrigerant circulating through a freezing cycle (30), radiates heat from hydraulic fluid that has vaporized in a cooler (11), and condenses the hydraulic fluid. An air cooled heat exchanger (13) usescold heat of external air, radiates heat from hydraulic fluid that has vaporized in the cooler (11), and condenses the hydraulic fluid. The cooler (11), the cold heat source-type heat exchanger (12),and the air cooled heat exchanger (13) are connected by a gas pipe (14) and a liquid pipe (15). An external air temperature detection unit (16) detects external air temperature. A saturation temperature detection unit (17) detects the saturation temperature of hydraulic fluid circulating through a thermosiphon circuit (10). Heat radiation amount adjustment units (18, 20, 31, 33, 38, 41, 321, 322)adjust the amount of heat radiation from the hydraulic fluid flowing through the cold heat source-type heat exchanger (12), such that the saturation temperature of the hydraulic fluid is higher thanthe external air temperature.

A heat dissipating module with three-dimensional structure includes a heat dissipating cavity connecting to a top of a heat absorbing cavity to form a distance from a heat source. When a working fluid in the heat absorbing cavity absorbs the thermal energy and is vaporized, the vapor would flow up to a vapor guiding space due to thermosyphon effect and principles of Boyle's Law, and then the vapor is projected and spread rapidly and evenly to the heat dissipating cavity through a projecting exit. Then the vapor is condensed into liquid and become the working fluid again by heat exchange. The condensed liquid then drips down and flows back to the heat absorbing cavity via micro-passages, forming a cycle of phase change of the working fluid for operation of heat dissipation.

A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways. The plurality of accumulator channels extends transversely relative to and are fluidly coupled with the plurality of boiling channels. The vapor manifold is configured to collect vapor from one or more of the plurality of boiling channels, one or more of the plurality of accumulator channels, or both. The first heat-transfer component further defines an outlet fluidly coupling the vapor manifold with the second conduit. Electrical devices incorporating such a heat-transfer device also are disclosed, as well as associated methods.

A thermosiphon heat exchanger includes a chassis, an evaporation assembly and a condensation assembly. The chassis has an internal circulation chamber and an external circulation chamber separated from each other. The evaporation assembly is disposed in the internal circulation chamber. The condensation assembly is disposed in the external circulation chamber and horizontally positioned higher than the evaporation assembly, and the condensation assembly is coupled to the evaporation assembly by plural separated loops.

The invention provides a split type thermosyphon phase change radiator and industrial control equipment. The split type thermosyphon phase change radiator comprises a condenser and an evaporator. According to the technical scheme, in order to improve the heat exchange effect of the evaporator, ab evaporation cavity is formed in the evaporator and provided with a first area, a second area and a third area which communicate with one another, the first area communicates with the air outlet, the second area communicates with a liquid return opening, and a closed loop is formed. After the evaporator is tightly attached to a heating device, heat of the heating device is absorbed through a heat conduction structure and/or a flow guide structure in the third area, so that the physical state of the phase change medium in the evaporation cavity is changed, specifically, the phase change medium is vaporized in the third area to form high-temperature gas, and the high-temperature gas enters the condenser through the first area and the gas outlet in sequence; and the liquid flows back to the second area through the liquid outlet and the liquid return opening, so that the heat dissipation effect of the evaporator is improved.

The invention relates to an ejecting thermosyphon multifunctional oil return device for a heat pump unit. The ejecting thermosyphon multifunctional oil return device comprises an evaporator, a cooling heat exchanger, a compressor and an ejector. The evaporator is sequentially connected with the cooling heat exchanger and the compressor through a refrigerant liquid inlet pipeline; the ejector is respectively connected to the evaporator and the compressor through pipeline connection; the cooling heat exchanger is connected with an oil tank and further connected with the ejector through a cooling electromagnetic valve; a bypass electromagnetic valve is arranged between the ejector and the refrigerant liquid inlet pipeline, and the ejector is further connected with a condenser gas pipeline through a condensed gas electromagnetic valve; and a lubricating oil detection device is arranged on the cooling oil pipe between the compressor and the cooling heat exchanger. Oil temperature control and system oil return are achieved at the same time, the cost can be reduced, and the compressor efficiency and the system performance are improved; and lubricating oil entering the compressor is detected online through a viscosity detection device, so that the temperature of the lubricating oil entering the compressor is adjusted in time, and the lubricating effect of the lubricating oil is guaranteed.

The invention discloses a GPU (Graphics Processing Unit) heat dissipation device and a server. The GPU heat dissipation device comprises a GPU chip; the thermosyphon radiator comprises radiating fins, an evaporator and a condenser, the evaporator and the condenser are connected through a gas pipe and a liquid pipe to form a circulation structure, and the radiating fins are connected to the side portion of the condenser. The evaporator is attached to the GPU chip; the cooling fan is arranged on one side of the cooling fins and used for cooling the cooling fins. According to the GPU heat dissipation device, the GPU chip is connected with the evaporator of the thermosiphon heat dissipation device, the heat dissipation effect on the GPU chip is achieved through the siphon effect of the thermosiphon heat dissipation device on heat, and the heat dissipation effect on the GPU chip is achieved through the heat dissipation effect of the thermosiphon heat dissipation device. The power consumption of the server and even the machine room can be reduced, and the overall cost is saved.

The thermosyphon radiator comprises a base plate and a radiating fin assembly, the base plate is at least provided with a first containing cavity, a second containing cavity and a first plate face, and the first plate face is at least provided with a first radiating station and a second radiating station; the radiating fin assembly at least comprises a first radiating fin with a first gas-liquid channel and a second radiating fin with a second gas-liquid channel, the projection of the first gas-liquid channel is at least partially overlapped with the first accommodating cavity, and the projection of the second gas-liquid channel is at least partially overlapped with the second accommodating cavity and partially overlapped with the first accommodating cavity; in the vertical direction of the base plate, the first containing cavity and the first gas-liquid channel are arranged in a staggered mode, the first gas-liquid channel is located on the upper side of the first containing cavity, the second containing cavity and the second gas-liquid channel are arranged in a staggered mode, and the second gas-liquid channel is located on the upper side of the second containing cavity. Therefore, the technical problem that a good heat dissipation effect cannot be achieved when a thermosiphon radiator dissipates heat of a plurality of heat sources which are different in height and deviate from the horizontal direction is solved.

The invention discloses an evaporation cavity enhanced boiling surface structure and a thermosyphon radiator, and belongs to the technical field of radiators, the evaporation cavity enhanced boiling surface structure comprises a plurality of micro-channel structures which are located on the surface of an evaporation cavity and are different in size, and the micro-channel structures are arranged to form an enhanced boiling surface, and the micro-channel structures with the same size are uniformly distributed on the surface of the evaporation cavity. A plurality of micro-channel structures with different sizes are designed on the surface of the evaporation cavity, so that when different types of phase-change working media are filled in the thermosiphon radiator, the optimal nucleation sizes of different phase-change working media can be considered, and the same phase-change working media can be ensured to have the optimal nucleation size under different working conditions; therefore, the radiator can achieve the best enhanced boiling heat exchange effect under various working conditions, and the application range of the thermosyphon radiator is widened.