GPU heat dissipation device and server

A cooling device and heat sink technology, applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve the problems of high requirements, liquid leakage, and difficult realization of data centers, and achieve the effect of cost saving and convenient heat dissipation

Pending Publication Date: 2022-04-05
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although this liquid cooling method has a better heat dissipation effect, it has higher requirements o

Method used

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  • GPU heat dissipation device and server
  • GPU heat dissipation device and server
  • GPU heat dissipation device and server

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] The core of the present invention is to provide a GPU cooling device, which provides a stable heat dissipation method, compared with the prior art through water-cooled heat dissipation method, has lower requirements on the data center, and can reduce the power consumption of the computer room , and ensure cooling efficiency.

[0041] Another core of the present invention is to provide a server including the above-mentioned GPU cooling device.

[0042] ...

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Abstract

The invention discloses a GPU (Graphics Processing Unit) heat dissipation device and a server. The GPU heat dissipation device comprises a GPU chip; the thermosyphon radiator comprises radiating fins, an evaporator and a condenser, the evaporator and the condenser are connected through a gas pipe and a liquid pipe to form a circulation structure, and the radiating fins are connected to the side portion of the condenser. The evaporator is attached to the GPU chip; the cooling fan is arranged on one side of the cooling fins and used for cooling the cooling fins. According to the GPU heat dissipation device, the GPU chip is connected with the evaporator of the thermosiphon heat dissipation device, the heat dissipation effect on the GPU chip is achieved through the siphon effect of the thermosiphon heat dissipation device on heat, and the heat dissipation effect on the GPU chip is achieved through the heat dissipation effect of the thermosiphon heat dissipation device. The power consumption of the server and even the machine room can be reduced, and the overall cost is saved.

Description

technical field [0001] The present invention relates to the technical field of server design, and more specifically, to a GPU cooling device. In addition, the present invention also relates to a server including the above-mentioned GPU cooling device. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the image processing capability and video processing capability of electronic equipment. Therefore, more GPUs need to be placed in the limited space of the server, so higher heat dissipation requirements for GPUs are also proposed. requirements. [0003] For Gbox (Game box, game platform) servers, the traditional heat dissipation method is to dissipate heat by placing more or higher-power fans, which puts forward many requirements on the overall heat dissipation, power consumption, and noise of the chassis. There is also a water-cooled heat dissipation method. The relatively mature cold plate liquid coo...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 张金星李文方
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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