Thermosiphon, data center cooling system and method

Abstract

A thermosyphon comprising: a condenser; an evaporator comprising a fluid channel and a heat transfer surface defining a plurality of fluid paths in the fluid channel extending through the fluid channel, the The evaporator is configured to be thermally coupled to one or more heat-generating electronic devices; and a delivery member fluidly coupling the condenser and the evaporator, the delivery member including a liquid conduit, the liquid conduit Extending through the delivery member to deliver a liquid phase of a working fluid into the fluid paths, the delivery member further includes a surface to vertically surround the plurality of fluid paths.

Description

technical field [0001] This document relates to systems and methods for utilizing thermosiphons to provide cooling to electronic equipment, such as computer server racks and related equipment in computer data centers. Background technique [0002] Computer users are often concerned with the speed (eg, megahertz and gigahertz) of a computer's microprocessor. Many people forget that this speed usually comes at a cost - higher power consumption. This power dissipation also generates heat. That's because, through the simple laws of physics, all that power has to go somewhere, where it ends up being converted to heat. A pair of microprocessors mounted on a single motherboard can draw hundreds of watts or more. Multiply that number by the thousands (or tens of thousands) to do the calculations for many computers in a large data center and get an easy idea of ​​the amount of heat that can be generated. The impact of critical load power in a data center is often compounded when ...

AI Technical Summary

Problems solved by technology

While ad hoc redundancy can be built into computer data centers, server racks, and even individual trays, equipment failure due to overheating can take a huge toll in speed, efficiency, and expense

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