Stamping method for producing a coin

Abstract

The present invention relates to a minting method for producing a coin (100), comprising the steps of preforming a relief (105-1, 105-2) for the coin (100); and striking the relief (105-1, 105-2) with a die (107-1, 107-2).

Description

[0001] The present invention relates to a minting process for producing a coin.

[0002] The technical objective of the present invention is to produce a coin with a particularly high relief and good quality.

[0003] This technical problem is solved by the articles according to the independent claims. Technically advantageous embodiments are the subject of the dependent claims, the description, and the drawings.

[0004] From a first perspective, the technical challenge is solved by a minting process for producing a coin, involving the steps of pre-forming a relief for the coin and then striking the relief with a die. This process offers the technical advantage of producing a coin with a high relief and exceptional quality. Since the relief design is already present in the coin blank, minimal material removal occurs during the subsequent minting process.

[0005] In a technically advantageous embodiment of the embossing process, the relief is pre-formed using a milling process. This achieves, for example, the technical advantage that the relief can be pre-formed particularly efficiently.

[0006] In a further technically advantageous embodiment of the minting process, a first relief is pre-formed on one side and a second relief on the opposite side. This achieves, for example, the technical advantage that a coin with a particularly high relief on both sides can be produced.

[0007] In a further technically advantageous embodiment of the minting process, a first relief on one side is struck by a first die and / or a second relief on an opposite side is struck by a second die. This also achieves, for example, the technical advantage that a coin with a particularly high relief on both sides can be produced efficiently.

[0008] In a further technically advantageous embodiment of the minting process, the relief has a height of at least 100% of the thickness of the coin blank, preferably a height of at least 150% or 200% of the thickness of the coin blank. This achieves, for example, the technical advantage of producing a particularly counterfeit-proof coin.

[0009] In another technically advantageous embodiment of the minting process, the relief is pre-formed in a plate. The plate can be large enough to pre-form several reliefs, arranged side by side, for each coin. This achieves the technical advantage, for example, of simplifying the production of the relief and allowing several coin blanks to be produced quickly and easily with a single clamping operation of the plate.

[0010] In another technically advantageous embodiment of the embossing process, the first side and / or the second side of the plate is milled flat. This achieves, for example, the technical advantage that unevenness or deviations in the plate can be compensated for and the quality of the embossing is improved.

[0011] In another technically advantageous embodiment of the minting process, a coin blank is cut out of the sheet. This achieves, for example, the technical advantage of simplifying the production of the coin blank.

[0012] In a further technically advantageous embodiment of the minting process, the pre-formed relief is heated before striking. Heating the blank increases its malleability. This achieves, for example, the technical advantage that an even higher profile can be produced through hot forming, further improving the coin's quality.

[0013] In another technically advantageous embodiment of the minting process, the relief, the coin blank, or the plate is made of gold, silver, copper, platinum, a base metal, or an alloy. This achieves, for example, the technical advantage of using particularly suitable materials for producing the coin.

[0014] Exemplary embodiments of the invention are shown in the drawings and are described in more detail below. They show:

[0015] Fig. 1 a schematic view of a minting process; Fig. 2 a schematic view of a process for producing a coin blank with a pre-formed relief; Fig. 3 a schematic view of a process for producing a coin blank by means of face milling; and Fig. 4 a block diagram of a minting process for producing the coin.

[0016] Fig. 1 Figure 1 shows a schematic view of a minting process. First, a relief 105-1 and / or 105-2 is pre-formed on one or two sides of a coin blank 103. The relief 105-1 or 105-2 protrudes in relief from the coin blank 103. The relief 105-1 or 105-2 is the three-dimensional representation of a motif. The coin blank 103 is, for example, a round. The relief 105-1, 105-2 can be pre-formed into the desired three-dimensional shape, for example, by a machining process such as milling.

[0017] The coin blank 103 with the relief is then struck using a minting process. For this, the coin blank 103 with the pre-formed relief 105-1, 105-2 is positioned between the two dies 107-1 and 107-2. The dies 107-1 and 107-2 strike the pre-formed relief 105-1, 105-2, giving the coin its final shape. The dies 107-1 and 107-2 have a recess for further processing and shaping of the relief 105-1, 105-2.

[0018] Fig. 2 Figure 1 shows a schematic view of a process for producing a coin blank 103 with a pre-formed relief 105-1 and / or 105-2. First, a plate 111 is used as a base for producing the coin blanks 103. The plate 111 has, for example, a thickness of 3 mm and is made of gold, silver, copper, platinum, a base metal, or an alloy. The plate 111 can be large enough to produce several coin blanks 103 from it. In this process, several reliefs 105-1 are milled side by side from the plate 111.

[0019] In plate 111, the three-dimensional reliefs 105-1 are pre-formed in the desired shape at several points, for example, using a CNC process. The shape corresponds approximately to the shape of the relief 105-1 after the subsequent minting process. The reliefs 105-1 and 105-2 can be pre-formed on one or both sides of plate 111. The produced three-dimensional coin blank 103 already represents the final model. The reliefs 105-1 arranged side by side are spaced apart in plate 111.

[0020] Once the reliefs 105-1 and 105-2 have been pre-formed in the plate 111, the individual coin blanks 103 are cut out of the plate 111. This can be done by cutting out the intermediate areas 113 using a slot cutter. The coin blanks 103 are, for example, circular and have a diameter of 11 mm to 120 mm. After this, the coin blanks 103 are ready for the striking process.

[0021] Fig. 3 Figure 1 shows a schematic view of a process for producing the coin blank 103 by surface milling. The plate 111 is used as the base for producing the coin blanks 103. First, the plate 111 is surface milled on one or both sides to ensure a uniform thickness, for example, approximately 0.1 mm. The surface milling is performed continuously in a spiral pattern to prevent milling edges. The uniform thickness of the plate 111 improves the quality of the minting.

[0022] In the planar milled plate 111, several reliefs 105-1 are subsequently milled side by side. The plate 111 is cut away at the areas 115 opposite the reliefs 105-2. Here, the areas 115 opposite the reliefs 105-2 are uniformly removed using a milling tool. This results in circular depressions with surfaces that correspond to the surfaces of the reliefs 105-2 on the opposite side.

[0023] Once the reliefs 105-2 have been pre-formed in the plate 111, the individual coin blanks 103 are cut out of the plate 111. This can be done by cutting out the intermediate areas 113 using a slot cutter. The coin blanks 103 are then, for example, circular and have a diameter of 11 mm to 120 mm.

[0024] Fig. 4Figure 1 shows a block diagram of the minting process for producing the coin. The minting process includes step S101, a pre-forming of the relief 105-1, 105-2 for coin 100. The coin blank 103 can be adapted in its design to produce a perfect strike (degree, impression, shadow).

[0025] Subsequently, in step S102, the relief 105-1, 105-2 is re-struck using the die 107-1, 107-2. This minting process allows for the production of coins with particularly high and raised reliefs 105-1, 105-2. The height of the relief 105-1, 105-2, for example, is 200% of the thickness of the coin blank 103.

[0026] The three-dimensional coin blank 103 is minted, for example, using dies 107-1 and 107-2 in proof quality (PP - Polished Plate). Reliefs of up to 200% per side with the highest level of detail and a mirror finish are possible. The deformation can be 200% on one side or 200% on both sides of the thickness of the coin blank 103.

[0027] The thickness of the coin blank 103 can be determined using the formula: X = Rg * 4 / Sg * π * D * D to be calculated. Where X is the thickness of the coin blank, Rg = the target weight of the coin blank, Sg the specific gravity of the material, and D the diameter of the die 107.

[0028] With a target weight of 31.1 g, a specific gravity of 0.0105 g / mm³, and a diameter of 38.35 mm, the thickness X of the coin blank 103 is 2.565 mm. A relief of 200% therefore has a height of 5.13 mm relative to the thickness of the coin blank 103. A relief of 400% has a height of 10.26 mm relative to the thickness of the coin blank 103.

[0029] All features explained and shown in connection with individual embodiments of the invention can be provided in different combinations in the object according to the invention in order to simultaneously realize their advantageous effects.

[0030] All process steps can be implemented by devices suitable for executing the respective process step. All functions performed by tangible features can constitute a process step of a process.

[0031] The scope of protection of the present invention is defined by the claims and is not limited by the features explained in the description or shown in the figures. REFERENCE MARK LIST

[0032] 100 Coin 103 Coin blank 105 Relief 107 Die 109 Side 111 Plate 113 Intermediate area 115 Area

Claims

1. Minting process for producing a coin (100), comprising the steps: - Preforming (S101) of a relief (105-1, 105-2) for the coin (100); and - Re-striking (S102) of the relief (105-1, 105-2) with a die (107-1, 107-2).

2. Embossing method according to claim 1, wherein the relief (105-1, 105-2) is preformed by means of a milling process.

3. Embossing method according to one of the preceding claims, wherein a first relief (105-1) is pre-formed on one side (109-1) and a second relief (105-2) is pre-formed on an opposite side (109-2).

4. Embossing method according to one of the preceding claims, wherein a first relief (105-1) on one side (109-1) is embossed by a first die (107-1) and / or a second relief (105-2) on an opposite side (109-2) is embossed by a second die (107-2).

5. A minting method according to one of the preceding claims, wherein the relief (105-1, 105-2) has a height of at least 200% of the thickness of the coin blank (103).

6. Embossing method according to one of the preceding claims, wherein the relief (105-1, 105-2) is preformed in a plate (111).

7. Embossing method according to one of the preceding claims, wherein the first side (109-1) and / or the second side (109-2) of the plate (111) is planar milled.

8. Minting method according to claim 6 or 7, wherein a coin blank (103) is cut out from the plate (111).

9. Embossing method according to one of the preceding claims, wherein the preformed relief (105-1, 105-2) is heated before embossing.

10. A minting method according to any one of claims 7 to 9, wherein the relief (105-1, 105-2), the coin blank (103) or the plate (111) is formed from gold, silver, copper, platinum, a non-ferrous metal or an alloy.

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