Pump module for an electronics cooling system, electronics cooling system comprising such a pump module, and module comprising such a system

Abstract

The invention relates to a pump module (10) for an electronics cooling system, in particular for a computer server electronics cooling system, the module comprising at least one pump holder (22), a pump (12) comprising an inlet (14) and an outlet (16), and a first connector (18) capable of connecting the inlet of the pump (12) to a fluid reservoir of the electronics cooling system. According to the invention, the first connector (18) comprises a locking ring (20), and the pump module (10) further comprises a device (34) for moving the locking ring (20) of the first connector (18). The invention relates to an electronics cooling system comprising at least one pump module (10) as described above, and a module comprising such an electronics cooling system.

Description

Description Title of the invention: Pump module for an electronics cooling system, electronics cooling system comprising such a pump module and module comprising such a system.

[0001] The invention relates to a pump module for an electronics cooling system, in particular for the electronics of a computer server, and to an electronics cooling system comprising such a pump module and to a module comprising such a cooling system.

[0002] Document US2021352830 discloses a pump module for an electronics cooling system comprising at least one pump support, a pump comprising an inlet and an outlet and two blind connectors (also known by their English name "blind connector") fluidically connected and respectively to the pump inlet and to the pump outlet.

[0003] The use of these 2 blind connectors requires the use of an alignment means connected to the pump support and a guide rail system to allow the connection of the pump and the pump support to the rest of the cooling system, which complicates the cooling system.

[0004] The invention aims to improve the situation by proposing a pump module for an electronics cooling system, in particular for the electronics of a computer server, said pump module comprising at least one pump support, a pump comprising an inlet and an outlet and a first connector capable of connecting the inlet of the pump to a fluid reservoir of the electronics cooling system.

[0005] According to the invention, the first connector comprises at least one locking ring, and the pump module further comprises a device for moving the locking ring of the first connector.

[0006] Thus, the use of a connector provided with a locking ring and cooperating with a translation device allows the connector itself to be able to fix the pump module and simplify the mounting of the pump module to the electronics cooling system.

[0007] Particular embodiments of the pump module according to the invention, taken alone or in combination, propose that: the pump support comprises at least two lateral wings substantially parallel to each other and a base, said device for moving the locking ring of the first connector being secured to one of the lateral wings of the pump support, the pump support comprises a first opening capable of allowing access to at least one electrical connector of the pump for the refrigerant fluid, the device for moving the locking ring of the first connector comprises a button, a slide capable of sliding relative to the pump support, and a connecting tab capable of cooperating with the locking ring of the first connector, the slide comprises at least one opening forming a translation guide and cooperating with a guide pin arranged on one face of the pump support,the first connector is capable of connecting the inlet of the pump for the refrigerant fluid to a refrigerant collection module of the electronics cooling system, and comprises a female part equipped with the locking ring and a male part intended to be inserted into the female part of the first connector, the female part of the first connector equipped with the locking ring is capable of cooperating on the one hand with the inlet of the pump for the refrigerant fluid and on the other hand to receive the male part of the first connector, the male part of the first connector is intended on the one hand to be inserted into the female part equipped with the locking ring of the first connector and on the other hand to cooperate with the refrigerant collection module of the electronics cooling system,sealing means between the inlet of the pump for the refrigerant fluid and / or the female part equipped with the locking ring of the first connector and / or the male part of the first connector are provided, the pump module further comprises a second connector capable of connecting the outlet of the pump for the refrigerant fluid to the outlet of the refrigerant of the electronics cooling system, a non-return valve is interposed between the second connector and the outlet of the refrigerant of the electronics cooling system, the pump support has a U-shape, the pump support comprises at least one base and two lateral wings, the first lateral wing and the second lateral wing of the pump support are substantially parallel to each other, the two lateral wings are connected to each other by the base, the base extends here along a plane substantially perpendicular to the extension plane of the two lateral wings, the pump for the refrigerant fluid is secured to the pump support at the level of the first lateral wing, the pump module further comprises an electrical power source and a control module, the control module is also secured to the pump support at the level of the first lateral wing, the first lateral wing of the pump support carries the pump for the refrigerant fluid and its control module, the pump support comprises a first opening capable of allowing access to at least one electrical connector of the pump for the refrigerant fluid,the first opening is sized to allow access to the two electrical connectors of the refrigerant pump control module, the pump support has at least one second opening capable of being crossed by an electrical connector of the refrigerant pump and capable of dissipating the heat produced by the operation of the refrigerant pump, the second opening is arranged on the first lateral wing on which the refrigerant pump and its control module are secured, the second opening is arranged opposite the refrigerant pump, the support has a series of openings arranged in a circle and concentrically, the pump support has one or more additional openings arranged opposite the refrigerant pump control module the pump support is provided with a handle,the device for moving the locking ring of the first connector is placed at the level of the second wing of the pump support, the device for moving the locking ring of the first connector is subject to one of the lateral wings of the pump support, the second lateral wing has several parts, a first part of the second lateral wing is at least partly substantially parallel to the base of the pump support and has an opening capable of being crossed by a button of the moving device, the second wing has a second part substantially parallel to the first lateral wing of the pump support, the second lateral wing has a third part extending the second part of the pump support and perpendicular to the latter and to the base of the pump support, the third part comprises at least one pin intended to cooperate with the displacement device, the pin is capable of cooperating with an opening forming a translation guide for the slide of the displacement device, the button, the slide and the connecting tab are made in one piece, the device for moving the locking ring of the first connector is arranged on a lateral wing of the support of the pump module, and, the at least one guide pin is arranged on the lateral wing carrying the displacement device.

[0008] The invention also relates to an electronics cooling system comprising at least one pump module as described above.

[0009] Another particular embodiment of the electronics cooling system proposes that the cooling system further comprises at least one condensation module, a refrigerant collection module, a cooling module for a cooling fluid, and an internal control module capable of monitoring the parameters of the electronics cooling system.

[0010] The invention also relates to a module comprising an electronics cooling system as previously described.

[0011] Particular embodiments of the module comprising an electronics cooling system according to the invention, taken alone or in combination, propose that: the module comprises three pump modules arranged at a first end of the cooling system module and two condensation modules arranged at an end opposite to that where the pump modules are arranged, the control module being interposed between the two condensation modules, and, a cooling fluid collection module is interposed between the assembly formed by the control module and the two condensation modules, and, the assembly formed by the three pump modules.

[0012] The invention will be better understood from reading the following description, given solely by way of example and with reference to the drawings in which:

[0013] - Figure 1 [Fig. 1] represents a front view of a pump module according to the invention,

[0014] - figure 2 [Fig. 2] represents a perspective view of a pump module according to the invention,

[0015] - Figure 3 [Fig. 3] represents a perspective view of a pump support of a pump module according to the invention,

[0016] - Figure 4 [Fig. 4] shows a perspective view of the pump support of a pump module of Figure 3 from another perspective,

[0017] - figure 5 [Fig. 5] represents a front view of a device for moving a locking ring of a first connector according to the invention,

[0018] - Figure 6 [Fig. 6] shows a top view of the device for moving a locking ring of a first connector illustrated in Figure 5,

[0019] - Figure 7 [Fig. 7] shows a front view of a wing of the pump support, and

[0020] - Figure 8 [Fig. 8] represents a perspective view of an electronics cooling system according to the invention.

[0021] The invention relates to a pump module 10 for an electronics cooling system, in particular the electronics of at least one computer server.

[0022] In particular, the pump module 10 is intended to be part of an electronics cooling system for at least one computer server. Even more advantageously, the computer server is capable of being rack-mounted and the electronics cooling system is capable of cooling a set of rack-mounted servers.

[0023] The module comprises a pump support 22, a pump 12 for a refrigerant fluid, said pump for the refrigerant fluid comprising an inlet 14 and an outlet 16.

[0024] The pump module 10 further comprises a first connector 18 capable of connecting the inlet of the pump 12 for the refrigerant fluid to a collection module 120 for the refrigerant fluid of the electronics cooling system 100.

[0025] In this embodiment, the first connector 18 capable of connecting the inlet of the pump 12 for the refrigerant fluid to a collection module 120 of the refrigerant fluid of the electronics cooling system 100 comprises a female part equipped with a locking ring 20 and a male part intended to be inserted into the female part of the first connector 18.

[0026] In this embodiment, the female part equipped with the locking ring 20 is able to cooperate on the one hand with the inlet of the pump 12 for the refrigerant fluid and on the other hand to receive the male part of the first connector 18.

[0027] The male part is intended on the one hand to be inserted into the female part equipped with the locking ring 20 of the first connector 18 and on the other hand to cooperate with the collection module 120 of the refrigerant fluid of the electronics cooling system 100.

[0028] It is possible to provide sealing means between the inlet of the pump 12 for the refrigerant fluid and / or the female part equipped with the locking ring 20 of the first connector 18 and / or the male part of the first connector 18.

[0029] The pump module 10 further comprises a second connector 50 capable of connecting the outlet 16 of the pump 12 for the refrigerant fluid to the refrigerant outlet of the electronics cooling system 100. A particular embodiment proposes that a non-return valve be interposed between the second connector 50 and the refrigerant outlet of the electronics cooling system 100.

[0030] According to the invention, the first connector 18 comprises a locking ring 20, and the pump module 10 further comprises a device 34 for moving the locking ring 20 of the first connector 18.

[0031] Thus, the pump module 10 according to the invention allows it to be connected / disconnected to a refrigerant fluid collection module and to be kept fixed in the cooling system.

[0032] The pump support 22 has, in this embodiment and in top view, a U shape.

[0033] As best seen in Figures 3 and 4, the pump support 22 comprises at least one base 22-2 and two lateral wings hereinafter referred to as first lateral wing 22-1 and second lateral wing 22-3.

[0034] The first lateral wing 22-1 and the second lateral wing 22-3 are substantially parallel to each other.

[0035] The two side wings 22-1 and 22-3 are connected to each other by the base 22-2.

[0036] The base 22-2 extends here along a plane substantially perpendicular to the extension plane of the two lateral wings 22-1 and 22-3. In other words, the first lateral wing 22-1 and the second lateral wing 22-3 are substantially perpendicular to the base 22-2.

[0037] In the particular example shown here, and as seen in Figures 1 and 2 for example, the pump 12 for the refrigerant fluid is secured to the pump support 22 at the level of the first lateral wing 22-1.

[0038] In the embodiment presented here, the pump module 10 further comprises an electrical power source and a control module 24.

[0039] Here, the control module 24 is also secured to the pump support 22 at the level of the first side wing 22-1.

[0040] Thus, and in this particular example, the first lateral wing 22-1 of the pump support 22 carries the pump 12 for the refrigerant fluid and its control module 24.

[0041] The pump support 22 here comprises a first opening 28 capable of allowing access to at least one electrical connector 30 of the pump 12 for the refrigerant fluid.

[0042] In the embodiment illustrated here, the first opening 28 is sized to allow access to the two electrical connectors 30 of the control module 24 of the pump 12 for the refrigerant fluid.

[0043] The pump support 22 advantageously has at least one second opening 26 capable of being crossed by an electrical connector of the pump 12 for the refrigerant fluid and capable of dissipating the heat produced by the operation of the pump 12 for the refrigerant fluid. Here, the second opening 26 is arranged on the first lateral wing 22-1 on which the pump 12 for the refrigerant fluid and its control module 24 are secured.

[0044] Still advantageously, the second opening 26 is arranged opposite the pump 12 for the refrigerant fluid.

[0045] Finally, and in a particular embodiment, the pump support 22 comprises a series of openings arranged in a circle and concentrically. These openings are intended to facilitate the dissipation of the heat emitted during the operation of the pump 12 for the refrigerant fluid.

[0046] An embodiment not shown proposes to provide on the pump support 22 one or more additional openings arranged opposite the control module 24 of the pump 12 for the refrigerant fluid.

[0047] It is also possible to provide the pump support 22 with a handle 32. The handle 32 is, here, elongated and has two opposite ends secured each at opposite edges of the pump support 22.

[0048] In the embodiment illustrated in Figures 2 to 4, the handle 32 is placed on the base 22-2 of the pump support 22.

[0049] The handle 32 also has a recess allowing the pump module 10 to be gripped. As is more particularly visible, the recess of the handle 32 is placed opposite the first opening 28.

[0050] The pump module 10 comprises, according to the invention, a device 34 for moving the locking ring 20 of the first connector 18.

[0051] The displacement device 34 of the locking ring 20 of the first connector 18 is, in this example, placed at the level of the second lateral wing 22-3 of the pump support 22.

[0052] A particular embodiment proposes that the displacement device 34 of the locking ring 20 of the first connector 18 is secured to one of the lateral wings, here, the second lateral wing 22-3 of the pump support 22.

[0053] As illustrated in Figure 7, the second side wing 22-3 here has several parts.

[0054] A first portion 22-3A is at least partly substantially parallel to the base 22-2 of the pump support 22 and has an opening capable of being crossed by a button 36 of the displacement device 34 (described below).

[0055] The second lateral wing 22-3 also has a second part 22-3B substantially parallel to the first lateral wing 22-1 of the pump support 22 (and therefore, here, substantially perpendicular to the base 22-2 of the pump support 22).

[0056] The second lateral wing 22-3 also has a third part 22-3C extending the second part 22-3B of the pump support 22 and perpendicular to the latter and to the base 22-2 of the pump support 22.

[0057] The third part 22-3C comprises at least one pin (not shown) intended to cooperate with the displacement device 34 described below. In particular, the pin is capable of cooperating with an opening 42 forming a translation guide for the slide 38 of the displacement device 34.

[0058] For example, the third part 22-3C may also include a recess 46 allowing the passage of a part of the pump 12 for the refrigerant fluid, in particular a bolt.

[0059] The second lateral wing 22-3 partially accommodates one end of the pump 12 for the refrigerant.

[0060] In the embodiment illustrated here, and as better seen in Figures 5 and 6, the device 34 for moving the locking ring 20 of the first connector 18 comprises a button 36, a slide 38 capable of sliding relative to the pump support 22 and a connecting tab 40 capable of cooperating with the locking ring 20 of the first connector 18.

[0061] In the embodiment illustrated here, the button 36, the slide 38 and the connecting tab 40 are made in one piece. An embodiment not shown proposes that these three elements are separate elements connected to each other by any connecting means.

[0062] When disconnecting the pump module 10 from the electronics cooling system 100, an operator actuates the button 36 by pulling it. This action moves the slide 38 relative to the pump support 22 and in particular, relative to the third part 22-3C of the pump support 22. The movement of the slide 38 drives the connecting tab 40 cooperating with the locking ring 20 of the first connector 18.

[0063] The movement of the connecting tab 40 induces a translational movement of the locking ring 20 of the first connector 18. This translational movement of the locking ring 20 allows the decoupling of the female part of the first connector 18 from the male part of the first connector 18, thus inducing the decoupling of the pump 12 for the refrigerant fluid from the collection module 120 of the refrigerant fluid of the electronics cooling system 100.

[0064] When connecting the pump module 10 to the electronics cooling system 100, an operator actuates the button 36 by pushing it. This action moves the slide 38 in translation relative to the pump support 22 and in particular, relative to the third part 22-3C of the pump support 22. The movement of the slide 38 drives the connecting tab 40 cooperating with the locking ring 20 of the first connector 18.

[0065] The movement of the connecting tab 40 induces a translational movement of the locking ring 20 of the first connector 18. This translational movement of the locking ring 20 allows the coupling of the female part of the first connector 18 to the male part of the first connector 18, thus inducing the coupling of the pump 12 for the refrigerant fluid of the collection module 120 of the refrigerant fluid of the electronics cooling system. 100 and therefore the fluid connection between these two elements via the first connector 18.

[0066] In this exemplary embodiment, the displacement device 34 of the locking ring 20 of the first connector 18 is arranged on the lateral wing 22-3 of the support 12 of the pump module 10.

[0067] As better seen in Figure 6, the slide 38 comprises at least one opening 42 forming a translation guide and cooperating with a guide pin (not shown) arranged on one face of the pump support 22.

[0068] In the embodiment illustrated in Figure 6, the slide 38 comprises two openings 42 each forming a translation guide and each cooperating with a guide pin arranged on one face of the pump support 22.

[0069] In this particular example, the at least one guide pin is arranged on the side wing carrying the movement device 34.

[0070] Here, the displacement device 34 of the locking ring 20 of the first connector 18 comprises a third opening 44 produced in the form of a recess and allowing the passage of a part of the pump 12 for the refrigerant fluid, in particular a bolt.

[0071] Here, the third opening 44 of the displacement device 34 of the locking ring 20 of the first connector 18 is located opposite the recess 46 of the third part 22-3C of the second lateral wing 22-3 and is of greater dimension so as not to come into abutment with the part of the pump 12 passing through it.

[0072] The invention also relates to an electronics cooling system in which the refrigerant fluid circulates. In particular, this refrigerant fluid may advantageously be a non-electrically conductive dielectric fluid (for example a dielectric oil).

[0073] According to the invention, the electronics cooling system comprises at least one pump module 10 as previously described.

[0074] In the particular embodiment illustrated in Figure 8, the electronics cooling system 100 comprises three pump modules 10.

[0075] Thus, a pump module 10 can be replaced without interrupting the electronics cooling system.

[0076] The electronics cooling system 100 further comprises, in this example, a condensation module 110 capable of condensing the refrigerant circulating in vapor form in the electronics cooling system 100 into a liquid refrigerant.

[0077] The electronics cooling system 100 also comprises, in this example, a refrigerant collection module 120. This refrigerant collection module 120, also called a buffer tank, is capable of collecting the refrigerant from the condensation module 110 and returning it to the computer servers, for example, mounted in a rack.

[0078] The electronics cooling system 100 also comprises, in this example, a cooling module 130 for the cooling fluid (for example glycolated water) which is capable of providing a cooling fluid, preferably at a temperature between 2 and 45°C, to allow an exchange with the refrigerant circulating in the condensation module 110.

[0079] The cooling fluid comes, here, from a cooling circuit of the computer installation and is returned to this same circuit after passing through the condensation module 110.

[0080] The electronics cooling system 100 also comprises, in this example, an internal control module 140 capable of controlling the parameters of the electronics cooling system 100 and managing its performance.

[0081] In a particular embodiment, the internal control module 140 is connected to the control software of the central system via, for example, an API (for “Application Programming Interface”) type interface and to its connection to a network, for example via a modular RJ45 type connector.

[0082] Thus, when the electronics cooling system 100 is in operation: • The refrigerant in vapor form flows from the computer servers to the condensation module 110; • The cooling fluid (for example glycol water) from the installation is also directed towards the condensation module 110; • An exchange takes place between the refrigerant fluid and the cooling fluid in the condensation module 110. In particular, the refrigerant fluid in vapor form passes through the condensation unit 110, reducing its temperature until the refrigerant fluid passes into the liquid phase. The refrigerant fluid then circulates towards the refrigerant fluid collection module 120; The refrigerant (here in liquid phase) is then pumped out of the refrigerant collection module and returned to the computer server; • The cooling fluid which has heated up following its exchange with the refrigerant fluid in the condensation module 110 circulates from this condensation module 110 to the cooling fluid supply of the IT installation.

[0083] The electronics cooling system 100 according to the invention is integrated into a box to produce a unitary module.

[0084] In the embodiment illustrated in Figure 8, the module is produced in the form of a rectangular box closed by panels produced in the form of plates (only some of which are visible in Figure 8).

[0085] In particular, in this embodiment, it will be noted that the three pump modules 10 are arranged at a first end of the cooling system module 100.

[0086] Still in the particular embodiment illustrated in Figure 8, the module forming the electronics cooling system 100 comprises two condensation modules 110 produced here in the form of two heat exchangers. These heat exchangers could, for example, be produced by stacking plates.

[0087] The two condensation modules 110 are, in this example, arranged at an end opposite to that where the pump module 10 is arranged (here, the 3 pump modules 10.

[0088] In this embodiment, the control module 140 is interposed between the two condensation modules 110. This configuration makes it possible to obtain a compact electronics cooling system module.

[0089] The cooling fluid collection module 120 is, in this embodiment, interposed between the assembly formed by the control module 140 and the two condensation modules 110 and the assembly formed by the three pump modules 10. This configuration also makes it possible to obtain a compact electronics cooling system module.

Claims

Claims

1. Pump module (10) for an electronics cooling system, in particular the electronics of at least one computer server, the module comprising: • a pump support (22) • a pump (12) comprising an inlet (14) and an outlet (16), • a first connector (18) capable of connecting the inlet of the pump (12) to a fluid reservoir of the electronics cooling system, characterized in that the first connector (18) comprises a locking ring (20), and the pump module (10) further comprises a device (34) for moving the locking ring (20) of the first connector (18).

2. Pump module (10) according to the preceding claim in which the pump support (22) comprises at least two lateral wings (22-1; 22-3) substantially parallel to each other and a base (22-2), said displacement device (34) of the locking ring (20) of the first connector (18) being secured to one of the lateral wings (22-3) of the pump support (22).

3. Pump module (10) for an electronics cooling system according to the preceding claim in which the pump support (22) comprises a first opening (28) capable of allowing access to at least one electrical connector (30) of the pump (12) for the refrigerant fluid.

4. Pump module (10) according to claim 2 or 3 wherein the device (34) for moving the locking ring (20) of the first connector (18) comprises: a button (36), • a slide (38) capable of sliding relative to the pump support (22), and, • a connecting tab (40) capable of cooperating with the locking ring (20) of the first connector (18).

5. Pump module (10) according to the preceding claim in which the slide (38) comprises at least one opening (42) forming a translation guide and cooperating with a guide pin (44) arranged on one face of the pump support (22).

6. Electronics cooling system (100) comprising at least one pump module (10) according to one of the preceding claims.

7. Electronics cooling system (100) according to the preceding claim further comprising at least: • a condensation module (110), • a refrigerant fluid collection module (120), • a cooling module (130) for a cooling fluid, and, • an internal control module (140) capable of monitoring the parameters of the electronics cooling system (100).

8. Module comprising an electronics cooling system (100) according to claim 6 or 7.

9. Module according to the preceding claim and comprising three pump modules (10) arranged at a first end of the cooling system module (100) and two condensation modules (110) arranged at an end opposite that where the pump modules (10) are arranged, the control module (140) being interposed between the two condensation modules (110).

10. Module according to the preceding claim comprising a collection module (120) for the cooling fluid interposed between the assembly formed by the control module (140) and the two condensation modules (110), and the assembly formed by the three pump modules (10).

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