Manufacturing method and electronic arrangment for designing an electronic device comprising a non-flat laminar item with a non-flat electronic circuit thereon

Abstract

Manufacturing method of an electronic device comprising a non-flat laminar item (10) with a non-flat electronic circuit (20) thereon, by designing a flat electronic circuit (20') to become the non-flat electronic circuit (20) after the forming process, defining, for each surfacemounted component (22), an optimal adhesive distribution by determining first loads induced on a bond between the surface-mounted component and the flat laminar item; determining second loads induced on parts of the conductive track placed around a local stiffened region of the flat laminar item where the at least one adhesive is to be applied, the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined second breakage threshold of the conductive tracks.

Description

[0001] i

[0002] DESCRIPTION

[0003] MANUFACTURING METHOD AND ELECTRONIC ARRANGMENT FOR DESIGNING AN ELECTRONIC DEVICE COMPRISING A NON-FLAT LAMINAR ITEM WITH A NON-FLAT ELECTRONIC CIRCUIT THEREON

[0004] Technical field

[0005] The present invention is directed towards a manufacturing method of an electronic device comprising a non-flat electronic circuit on a non-flat laminar item.

[0006] The non-flat electronic circuit includes at least electrically conductive tracks connecting at least one surface-mounted component attached to the non-flat laminar item through at least one adhesive providing a known adhesion force per unit area.

[0007] The present invention also covers the electronic device resulting from said method.

[0008] Background of the Invention

[0009] The electronic devices, including a non-flat laminar item with a non-flat electronic circuit thereon, obtained through a forming process from a flat laminar item with a flat electronic circuit thereon, are already known. It is also known to over-mold the non-flat laminar item with the non-flat electronic circuit with a structural element through an overmolding process.

[0010] During the forming process of the flat laminar item into the non-flat laminar item it suffers local curvatures and stretching, which can produce a separation of one or several of the surface-mounted components from the surface of the non-flat laminar item, or an interruption on some of the electrically conductive tracks, causing a malfunction of the non-flat electronic circuit.

[0011] Documents EP3499393A1, EP3664586A1 and FR3127861A1 describe different methods to produce non-flat laminar items with a non-flat electronic circuit thereon.

[0012] It is also known to over-mold the non-flat laminar item with the non-flat electronic circuit with a structural element through an overmolding process.

[0013] During the overmolding process, the molding resin flows before hardening within a mold containing at least a portion of the non-flat electronic circuit, said fluid material flowing around the surface-mounted components pushing said surface-mounted components producing a shear load thereon, which can produce a separation of one or several of the surface- mounted components from the surface of the non-flat laminar item causing a malfunction of the non-flat electronic circuit.

[0014] The present invention solves the above and other problems.

[0015] Description of the Invention

[0016] According to a first aspect, the present invention concerns a manufacturing method of an electronic device comprising a non-flat laminar item with a non-flat electronic circuit thereon, as defined in claim 1.

[0017] The non-flat laminar item is a thin sheet shaped with a three-dimensional geometry including curvatures, for example curvatures in one axis, such as a zero Gaussian curvature, or in two orthogonal axes, such as a positive or negative Gaussian curvature.

[0018] Typically, such non-flat item is made of a thermoplastic which becomes deformable when heated, permitting its shaping into the non-flat shape.

[0019] The non-flat electronic circuit is supported on the non-flat laminar item, typically being a printed circuit, and includes at least electrically conductive tracks and at least one surfacemounted component.

[0020] The surface-mounted components are attached, or attached and electrically connected, to the non-laminar item and / or to the electrically conductive tracks through at least one adhesive with a known adhesion force per unit area.

[0021] The adhesive can be an electrically conductive adhesive, providing adhesion to the surfacemounted component and also providing electrical contact between electric contacts of the surface-mounted component and the electrically conductive tracks. It is considered that a soldering material provides those two functions and therefore can be considered as an adhesive.

[0022] Optionally, the dimensions of each surface-mounted component are known, including at least the dimensions of its base surface facing the non-flat laminar item.

[0023] The adhesive can be located between the surface-mounted component and the non-flat laminar item, between the surface-mounted component and the non-flat electrically conductive tracks, on the perimetral edge of the surface-mounted component, and / or completely covering the surface-mounted component enclosing it in an adhesive shell. Any combination of those adhesive distributions is contemplated, using the same or different types of adhesives with different adhesion force per unit area. Typically, the adhesive is automatically deposited as drops, the position and spacing between drops being known. Said position and spacing between drops determine the adhesive distribution of the at least one adhesive. Also, the viscosity of the adhesive determines the size of each drop, which can be also known as part of the distribution parameter.

[0024] Typically, each surface-mounted component has a bottom surface, preferably a flat bottom surface, facing the surface of the non-flat laminar item. A predefined number of drops of adhesive, with a predefined distribution, are placed between the bottom surface and the surface-mounted component and the surface of the non-flat laminar item or the electrically conductive tracks, providing adhesion. Alternatively, the adhesive drops are located in the perimeter of the surface-mounted component and / or completely covering the surfacemounted component enclosing it in an adhesion shell.

[0025] An alternative known solution to distribute the adhesive is using a stencil, typically a metal plate, with apertures in those positions where the adhesive shall be applied. The stencil is overlapped to the flat laminar item and the adhesive is distributed over the stencil, reaching the flat laminar item only on predefined position through the apertures, then the stencil is removed and the surface mounted components are placed on the flat laminar item over the adhesive deposited thereon.

[0026] The proposed manufacturing method comprises: defining the geometry and dimensions of a flat laminar item suitable to be deformed into the non-flat laminar item through a forming process; determining local bending and / or stretching on the flat laminar item during the forming process into the non-flat laminar item;

[0027] According to the above, starting from the shape of the non-flat laminar item, which has been previously defined, the shape of a flat laminar item which, through a forming process, can generate the non-flat laminar item is defined, determining which local bending and / or stretching is to be produced on each region of the flat laminar item during the forming process to become the non-flat laminar item.

[0028] The geometry and dimensions of the flat laminar item can be obtained based on the simulation of the forming process. 3D design software and forming simulation software can be used. Such simulation also provides information relative to the local bending and / or stretching suffered by each region of the flat laminar item during its formation into the non-flat laminar item. Alternatively, the definition of the shape of the flat laminar item can be obtained through an empirical process, using samples, for example samples of flat laminar item with a known pattern drawn thereon which, after the forming process, gets deformed in a measurable manner.

[0029] This forming process, also known as thermoforming, involves heating the flat laminar item so that it becomes plastic-deformable and forming the flat laminar item into the non-flat laminar item while it is still hot in the plastic state. The forming can be achieved using a mold. Once the non-flat laminar item is cooled to room temperature it loses its deformable state so that it retains the non-flat shape.

[0030] The forming process of a flat laminar item into a non-flat laminar item has known limitations in the maximal stretching and curvature of the flat laminar item. According to that, the non- laminar item will be designed considering said known limitations so that such non-flat laminar item is obtainable through the forming process of a flat laminar item.

[0031] The surface-mounted components are attached to the flat laminar item before the forming process by applying the at least one adhesive, and later the flat laminar item is formed into the non-flat laminar item producing local bending and / or stretching of at least some regions thereof.

[0032] The proposed manufacturing method further comprises designing, on the flat laminar item, a flat electronic circuit to become the non-flat electronic circuit after the forming process by: defining function determined locations on the non-flat laminar item for some of the surface-mounted components, and identify, on the flat laminar item, precursor locations which, after the forming process, become the function determined locations, positioning said surface-mounted components on the precursor locations; positioning each of the remaining surface-mounted components in a selected component eligible position of the flat laminar item on which, during the forming process, the local bending and / or stretching is a reduced bending and / or stretching below a predefined threshold.

[0033] The component eligible positions are those regions of the flat laminar item suffering reduced bending and / or stretching, below a predefined threshold, during the forming process. The predefined threshold will be selected to identify regions of the flat laminar item where the local bending and / or stretching are limited generating reduced loads on any surface-mounted component placed there above. The function determined locations are positions of the surface-mounted components determined by its function, typically surface-mounted components intended to inform or interact with a user, such a haptic interface, a button, a light emitting element, etc.

[0034] Knowing the function determined locations on the non-flat laminar item, the precursor locations on the flat laminar item intended to become the function determined locations after the forming process can be determined, for example through the simulation or the empirical experimentation described above.

[0035] The surface-mounted components whose position depends on their function are located in the defined precursor locations.

[0036] The remaining surface-mounted components, whose positions do not depend on their function, are distributed on the remaining surface of the flat laminar item.

[0037] To distribute those remaining surface-mounted components whose positions do not depend on their function and can therefore be placed in any position on the non-flat laminar item with the above mentioned reduced bending / stretching.

[0038] The component eligible positions are those positions of the flat laminar item in which the bending / stretching produced during the forming process into the non-flat laminar item generate local bending and / or stretching below the predefined threshold and are therefore secure locations for placement of the surface-mounted components.

[0039] Once the component eligible positions have been determined, the surface-mounted components are distributed thereon defining, together with the surface-mounted components whose position is determined by its function, the position of all the surface -mounted components of the electronic device.

[0040] When the surface-mounted components are on a region of the flat laminar item suffering local bending and / or stretching during the forming process, a detachment thereof can be produced if the local bending and / or stretching overcomes the adhesion provided by the at least one adhesive.

[0041] To prevent this detachment, the method comprises defining, for each surface-mounted component, an optimal adhesive distribution by: determining, for each surface-mounted component, first loads induced on a bond between the surface-mounted component and the flat laminar item by the local bending and / or stretching on the region where the at least one adhesive is to be applied; determining, for each surface-mounted component, second loads induced, on parts of the conductive track placed around a local stiffened region of the flat laminar item where the at least one adhesive is to be applied, by an accumulation of local bending and / or stretching around the local stiffened region due to the stiffening produced in the local stiffened region; the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined second breakage threshold of the conductive tracks above which the conductive tracks suffer a relevant loss in electric conductivity.

[0042] The surface-mounted components are mostly rigid components, so that the local bending and / or stretching of the flat laminar item under the surface-mounted component will create first loads on the bond between the surface-mounted component and the flat laminar item with the at least one adhesive, due to a relative displacement in a direction perpendicular to the surface-mounted component, creating a pulling load, and / or in an direction parallel to the surface-mounted component, creating a shear load. Those loads can be determined by identifying the relative movement between each part of the surface-mounted component and the flat laminar item during the forming process considering the local bending and / or stretching, for example by calculation, digital simulation, or empirically reproduced.

[0043] Also, the at least one adhesive applied on the flat laminar item produces a local stiffened region of the flat laminar item, where the local bending and / or stretching is prevented. This local stiffened region produces an accumulation of local bending and / or stretching around thereof, where the local bending and / or stretching are higher than if no adhesive had been applied. This accumulation of local bending and / or stretching around the local stiffened region can be determined, for example by calculation or digital simulation, or empirically reproduced.

[0044] This accumulation of local bending and / or stretching around the local stiffened region can produce a breakage of the electrically conductive tracks connected to the surface-mounted component if the accumulated local bending and / or stretching induces second loads above a second breakage threshold of the electrically conductive tracks.

[0045] Depending on how the at least one adhesive is distributed, the bond created between the surface-mounted component and the flat laminar item can be stronger or can be more conveniently oriented or shaped to withstand the first loads. Also, the surface covered by the at least one adhesive can be increased by the adhesive distribution, spreading the first loads on a bigger surface area, or reduced, reducing the differential displacement of the flat laminar item between extreme regions of the region covered by the adhesive due to the local bending and / or stretching, reducing the induced first loads.

[0046] Also, the adhesive distribution affects the size and shape of the local stiffened region, affecting the magnitude and distribution of the second loads there around. Therefore, the optimal adhesive distribution can be selected also considering the second loads generated to maintain such second loads below the second breakage threshold on the regions containing electrically conductive tracks.

[0047] Therefore, the method proposed determining, for each surface-mounted component, the first loads to be supported by the adhesive bond and also the second loads induced on the electrically conductive tracks around the adhesive and selecting the optimal adhesive distribution considering such first loads and second loads.

[0048] The optimal adhesive distribution can be selected through an iterative calculation, for example, calculating the first loads and the second loads using different adhesive distributions.

[0049] The optimal adhesive distribution can be selected, for example, among the following adhesive distributions: a single drop of adhesive in a central region under the surface-mounted component; multiple drops of adhesive in a perimetral region under the surface-mounted component; multiple drops of adhesive in alignment under the surface-mounted component; multiple drops of adhesive in a perimetral region around the surface-mounted component; an encasing of adhesive embedding the surface-mounted component.

[0050] To determine the first breakage threshold, the known adhesion force per unit area and the distribution of the at least one adhesive are considered and preferably also the known dimensions of the surface-mounted components.

[0051] The first breakage threshold can be determined for each surface-mounted component.

[0052] Alternatively, the first breakage threshold can be determined for each group of surfacemounted components, for example, a group of surface-mounted components of equal or similar (within a range) base surface area, width to length ratio, encapsulation and / or adhesion, for example having the same adhesive and the same or similar amount and / or distribution of adhesive. For example, all the surface-mounted components of the electronic circuit can be grouped on several groups, each group including the surface-mounted components having a similar base surface area and / or similar width to length ratio.

[0053] For example, the groups can be defined as groups including surface-mounted components with a base surface area, facing the laminar item, lower than a first value, comprised between the first value and a second value bigger than the first value, or bigger than the second value and / or with a width to length ratio lower than a first value, comprised between the first value and a second value bigger than the first value, or bigger than the second value.

[0054] Any number of threshold values can be defined and different criteria for defining the groups can be used.

[0055] The groups can be also defined as groups including surface-mounted components adhered with the same adhesive. In this case, the first breakage threshold can be determined for the less favorable surface-mounted component of each group, typically the one suffering the less favorable local bending I stretching. Such first breakage threshold will be used for all the surface-mounted components of the same group.

[0056] The distribution of the adhesive is also dependent on the size of the surface-mounted component.

[0057] Preferably, the first breakage threshold is defined as a maximum load, induced by the bending, the stretching and / or a combination of bending and stretching of the flat laminar item during the forming process, supportable for each particular amount and distribution of adhesive, typically for a given component geometry or footprint.

[0058] In some cases, some surface-mounted components lack suitable component eligible positions, or the size of the suitable component eligible positions is insufficient to accommodate all the surface-mounted components required, in which case those become endangered surface-mounted components, because locating such surface-mounted components in other regions will probably produce its detachment during the forming process.

[0059] In other cases, despite being in a component eligible position, no optimal adhesive distribution can withstand the first loads and prevents the creation of excessive second loads. According to the above, the method may comprise verifying if any surface-mounted component is an endangered surface-mounted component where no optimal adhesive distribution provides both a bond with first breakage threshold above the first loads and an accumulation of local bending and / or stretching around the local stiffened region inducing second loads below the second breakage threshold and / or where the endangered surfacemounted component lacks suitable component eligible position with reduced bending and / or stretching below the predefined threshold.

[0060] When an endangered surface-mounted components is detected, the method comprises modifying the design of the flat electronic circuit until no endangered surface mounted component remains by implementing: first corrective measures by modifying the geometry, orientation and / or dimensions of the endangered surface-mounted components allowing for different optimal adhesive distributions or substituting the adhesive attaching the surface-mounted component for an alternative adhesive with a higher known adhesion force per unit area, and / or second corrective measures to reduce the local bending and / or stretching by modifying the shape of the non-flat laminar item.

[0061] By modifying the distribution of the at least one adhesive, the adhesion surface thereof may be increased, or only its distribution may be modified, without increasing the surface area, for example to make the adhesive drops closer to each other reducing the lever and the relative displacement between said drops. The distribution of the adhesive may be also modified, for example, by moving the adhesive from below the surface-mounted component to its perimeter or vice-versa.

[0062] By reducing the size of the surface-mounted component the surface suffering local bending and / or stretching of the laminar item is also reduced, thus reducing the lever and the relative displacement between opposed ends of the surface-mounted component, permitting to withstand higher bending and / or stretching and therefore rising the first breakage threshold.

[0063] Another additional first corrective measure may comprise substitute the adhesive for another adhesive with a higher adhesion force per unit area or combining two different types of adhesives with different distributions, for example one adhesive below the surface-mounted component and another different adhesive around it.

[0064] Any of the above first corrective measures, or a combination thereof, will result in a rise in the first loads resisted and therefore a rise in the first breakage threshold, increasing the areas of the flat laminar item where said surface-mounted component can be placed without becoming an endangered surface-mounted component, permitting the installation of such endangered surface-mounted components in areas with local bending / stretching above the predefined threshold, typically areas with local bending I stretching adjacent to the predefined threshold.

[0065] If the first corrective measures listed above are not sufficient to solve all the endangered surface-mounted components, the second corrective measures can be implemented. Said second corrective measures comprises modifying the shape of the non-flat laminar item to reduce the local bending and / or stretching at least where one endangered surface-mounted component is intended to be placed, or where minor shape modifications are required to allow the safe location of the endangered surface-mounted components.

[0066] Also, a combination of first and second corrective measures are possible.

[0067] Once all the endangered surface-mounted components have been solved by the first or first and second corrective measures, the location of all the surface-mounted components has been finally determined, then the electrically conductive tracks can be also distributed on the flat laminar item to connect the surface-mounted components defining the flat electronic circuit, which will become the non-flat electronic circuit after the forming process.

[0068] Then, the flat laminar item with the flat electronic circuit thereon shall be produced according to the design obtained from the preceding steps of the method, and later formed into the non- flat laminar item with the non-flat electronic circuit thereon through the forming process.

[0069] The non-flat laminar item will be designed by defining the exact volumetric shape thereof. Typically, such shape is defined to be complementary with a support on which such electronic device has to be attached, for example an interior surface of a vehicle.

[0070] According to one embodiment of the present invention, the method further comprises determining, for each electrically conductive track, or for groups of electrically conductive tracks, such similarly wide electrically conductive tracks, a second breakage threshold above which the local bending and / or stretching induces loads overcoming the mechanical properties of the electrically conductive track leading to an interruption of its electrical conductivity, and wherein the designing of the flat electronic circuit further includes positioning the electrically conductive tracks entirely in track eligible positions on which, during the forming process, the local bending and / or stretching is below the second breakage threshold.

[0071] The second breakage threshold can be defined by calculation, using simulations, or through empirical experimentation, considering a tolerable curvature and / or stretching of the electrically conductive tracks determined considering at least fabrication material and thickness of the electrically conductive tracks, which determines the maximal curvature and / or stretching supportable by said electrically conductive tracks without affecting the required conduction of electricity through it, i.e. maintaining the conductivity of the electrically conductive paths above a threshold necessary to maintain a normal operation of the electronic circuit.

[0072] Typically, the second breakage threshold allows for bigger bending and / or stretching than the first breakage threshold.

[0073] The method may also comprise detecting, as part of the track eligible positions, track eligible paths along which the curvature and / or stretching during the forming process is below the second breakage threshold, the track eligible paths being oblique to a local maximal curvature and / or stretching direction on which the local curvature and / or stretching produced during the forming process is above the second breakage threshold.

[0074] According to that, the method can further comprise identifying track eligible paths which can be, for example, oblique, zigzagging or orthogonal to the local direction with maximal local bending and / or with maximal local stretching. The apparent bending and / or stretching, in the direction of such track eligible path, is lower than the local bending and / or stretching in the direction with maximal local bending and / or with maximal local stretching.

[0075] Therefore, the bending and / or stretching along the track eligible paths can be below the second breakage threshold despite being in a region which maximal local bending and / or maximal local stretching is above the second breakage threshold.

[0076] If any electrically conductive track lacks a suitable track eligible position with local bending and / or stretching producing induced loads below the correspondent second breaking threshold, the design of the non-flat electronic circuit may be modified to increase the second breakage threshold of at least those electrically conductive tracks lacking suitable track eligible positions by modifying the width and / or thickness of the electrically conductive track or parts thereof; or by modifying the constitutive material of the electrically conductive tracks.

[0077] The curvature and the stretching of the non-flat laminar area are directional, therefore those curvature and stretching on each point are maximum in one direction and minimal in another direction, said two directions being typically orthogonal to each other.

[0078] According to that, an area could be outside the track eligible area because its maximum curvature and / or its maximum stretching is too high, therefore ineligible for the tracks according embodiment exposed above, but in some cases on those ineligible areas a track eligible path can be determined in a direction different to the maximum curvature or maximum stretching direction, where the apparent curvature and the apparent stretching in the direction of the track eligible path are lower than the maximum curvature and the maximum stretching and below the curvature and the stretching supportable by the electrically conductive tracks considering the track breaking limit, i.e. that an electrically conductive track can be implemented outside the track eligible area if it follows one of such track eligible paths.

[0079] It will be understood that a zigzagging track eligible path is a path constituted of multiple successive segments, each segment being oblique or transverse to the maximal curvature and / or to the maximal stretching of the non-laminar item.

[0080] According to an additional embodiment, the method can further comprise defining, as part of the designing of the flat electronic circuit, additional function determined locations on the non-flat laminar item for printed sensors or printed actuators, such capacitive sensors, and identifying, on the flat laminar item, additional precursor locations which, after the forming process, become the additional function determined locations. Then, the method comprises printing printed sensors or printed actuators on the additional precursor locations as part of the flat electronic circuit.

[0081] The printed sensors or printed actuators may be located in a position defined by its functionality. Those positions are the additional function determined locations.

[0082] Optionally, the method further comprises determining, for each printed sensor or printed actuator, a third breakage threshold above which the local bending and / or stretching induces loads on the printed sensors or printed actuators which overcomes the mechanical properties of the printed sensor or printed actuator leading to an interruption on its functionality.

[0083] If any printed sensor or printed actuator is placed in one additional precursor locations suffering bending and / or stretching inducing loads above the third breakage threshold, then the design of the non-flat electronic circuit can be modified to implement third corrective measures to increment the correspondent third breakage threshold of the printed sensor or printed actuator or implementing the second corrective measures described above, consistent in modifying the shape of the non-flat laminar item.

[0084] Typically, the third breakage threshold allows for bigger bending and / or stretching than the first breakage threshold, but less than the second breakage threshold.

[0085] The third corrective measures may include modifying the width and / or thickness of the printed sensor or printed actuator or parts thereof, modifying the constitutive material of the printed sensor or printed actuator; or increasing the size of the printed sensor or printed actuator.

[0086] Modifying the shape or size of the printed sensor or printed actuator or modifying the thickness or width of the constitutive elements thereof, may produce an increase in the third breakage threshold.

[0087] According to an embodiment, the method further comprises designing a structural element to be overmolded on, or around, the non-flat laminar item and designing an overmolding process to produce the structural element and determining local flow parameters of the molding resin over the non-flat laminar item during the overmolding process.

[0088] Such local flow parameters may include for example parameters such as the fluid molding resin flow speed, direction, viscosity, temperature, or others before hardening, on each region of the non-flat laminar item during the overmolding process.

[0089] For each surface-mounted component, or for each group of surface-mounted components, for example, a group of surface-mounted components of equal or similar (within a range) base surface area, width to length ratio, encapsulation and / or adhesion, a fourth breakage threshold is determined. The fourth breakage threshold is a threshold above which the adhesion provided by the at least one adhesive is overcome by loads induced by the molding resin injected according to the local flow parameters during the overmolding process, leading to a detachment of the surface-mounted component, considering the known adhesion force and distribution of the at least one adhesive and the known dimensions of the surfacemounted components.

[0090] Each surface-mounted component protrudes from the non-flat laminar item and therefore presents an obstacle against the flowing of the molding resin during the overmolding process. The flow of molding resin surrounding the surface-mounted components generates forces on such surface-mounted components, which can be sufficient to overcome the adhesion leading to a detachment thereof.

[0091] Most of the detaching will be generated by a shear load produced on the adhesive due to a lateral pushing force produced by the flow of the molding resin injected during the overmolding process on one lateral side of the surface-mounted component. The larger the exposed side surface of the surface-mounted component, and the faster and denser the flow of injected molding resin, the worse.

[0092] The surface-mounted components of the electronic circuit can be divided in several groups, grouping those surface-mounted components having the same or similar size and having the same type of adhesive, including the same or similar amount of adhesive and / or with the adhesive having the same of similar distribution. For example, all the surface -mounted components of the electronic circuit can be grouped on several groups, each group including the surface-mounted components adhered with the same adhesive and adhered with the same or similar amount and / or distribution of such adhesive.

[0093] In this case, the fourth breakage threshold can be determined for the less favorable surfacemounted component of each group, typically the one with the less favorable amount or distribution of the adhesive. Such fourth breakage threshold will be used for all the surfacemounted components of the same group.

[0094] Then, the proposed method may comprise verifying if any surface-mounted component is an endangered surface-mounted component suffering loads above the fourth breakage threshold induced by local flow parameters. When endangered surface-mounted components are detected, modifying the design of the flat electronic circuit until no endangered surface mounted component remains by implementing:

[0095] Fourth corrective measures consisting of modifying the position of each endangered surfacemounted component to a position with local flow parameters inducing loads below the fourth breakage threshold to prevent the detachment produced during the overmolding process and with bending and / or stretching inducing loads below the first breakage threshold to prevent the detaching during the forming process.

[0096] Fifth corrective measures to increase the correspondent fourth breakage threshold above the loads induced by the local flow parameters by modifying the geometry and / or dimensions of the endangered surface-mounted components to reduce the loads induced by the local bending and / or stretching below them and / or by modifying the adhesion thereof .

[0097] The modification of the geometry and / or dimensions of the endangered surface mounted components can be obtained, for example, by substituting the surface-mounted component for an alternative surface mounted component with the same functionality but reduced crosssection surface perpendicular to the flat laminar item, which reduces the drag force against the flow of molding resin and / or with a bigger bottom surface facing the flat laminar item when more adhesive can be applied..

[0098] By modifying the geometry and / or dimensions of the endangered surface mounted components, the surface suffering local bending and / or stretching of the laminar item is also reduced, thus reducing the lever and the relative displacement between opposed ends of the surface-mounted component, permitting to withstand higher bending and / or stretching and therefore rising the first breakage threshold.

[0099] The fifth corrective measures may also comprise modifying the distribution of the at least one adhesive, to increase the adhesion surface thereof, to make the adhesive drops closer to each other reducing the lever and the relative displacement between said drops or to modify to position of the adhesive, for example moving the adhesive from below the surfacemounted component to its perimeter or vice-versa.

[0100] Sixth corrective measures to optimize the local flow parameters at least on regions coincident with the endangered surface-mounted components to reduce the shear and / or temperature therein by modifying the overmolding process.

[0101] The sixth corrective measures may include reducing the molding resin viscosity and / or speed and / or temperature during the overmolding process to reduce the local flow parameters, and / or modify the position and / or number of injection gates of the mold through which the molten plastic is introduced in the mold during the overmolding process.

[0102] The local flow parameters depend on the definition of the overmolding process. Such overmolding process can be modified to modify the local flow parameters at least in some locations, for example by modifying the position and / or number of the injection gates in the mold to modify the flow direction at least on some areas, by modifying the injection speed, by modifying the plastic viscosity or by using a different plastic composition.

[0103] Optionally, at least one surface-mounted component may have an anisotropic cross-section surface. In this case, the fourth breakage threshold thereof may be an anisotropic fourth directional breakage threshold variable depending on directional orientation of the force applied on the surface-mounted component. For example, the lateral exposed surface area of the surface-mounted component can be variable depending on the orientation thereof, and the attachment provided by the adhesive may be also dependent on the direction, for example if the adhesive is distributed in a non-radially symmetric manner or following an elongated pattern.

[0104] At least some of the local flow parameters can also be anisotropic directional local flow parameters variable depending on directional orientation. For example, the local direction or local speed of the molding resin are directional parameters.

[0105] The method may comprise verifying if any surface-mounted component is an endangered surface-mounted component suffering, in at least one direction, loads induced by the directional local flow parameters in said direction above the fourth directional breakage threshold supportable in the same direction.

[0106] When endangered surface-mounted components are detected, modifying the design of the flat electronic circuit until no endangered surface mounted component remains by implementing the fourth corrective measures, the fifth corrective measures, the sixth corrective measures and / or seventh corrective measures including the modification of the orientation of the surface-mounted component.

[0107] If the orientation of the surface-mounted component is modified, the same surface-mounted component with the same adhesion may withstand the same loads produced thereof without requiring any additional modification, simply by orienting the surface-mounted component in a better orientation optimized to increase its load resistance or to reduce the induced loads generated thereon.

[0108] The method steps related to the detachment produced due to the flow of molding resin can be implemented independently to other features described in the present invention, and therefore can be protected in a divisional application without such features.

[0109] Preferably, the first breakage threshold and / or the fourth breakage threshold and / or the fourth directional breakage threshold is / are defined individually for each surface-mounted component.

[0110] It is also proposed that, for at least one surface-mounted component, the adhesive attaching said surface-mounted component is an electrically conductive adhesive interposed between electrically connections of the surface-mounted component and the electrically conductive tracks, providing simultaneously adhesion and electrical connection. This electrically conductive adhesive can be combined with non-electrically conductive adhesive / s in the same surface-mounted component to increase the adhesion.

[0111] Optionally, the definition of the optimal adhesive distribution includes extending the at least one adhesive beyond the surface-mounted component, covering parts of the conductive track placed around the surface-mounted component to include said parts of the conductive track in the local stiffened region of the flat laminar item. Each of said extensions of the adhesive can be an elongated extension covering an elongated region of the electrically conductive track diverging from the surface-mounted component, stiffening said region of the electrically conductive track, reducing the local bending I stretching thereon.

[0112] The present invention also refers to an electronic arrangement which can facilitate the design of the non-flat laminar item with a non-flat circuit thereon. The arrangement may include at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and other data. The at least one processor will be configured, in accordance with the stored instructions, to produce the steps of the design stage described in claim 1, or in any of the dependent claims.

[0113] According to the above, the at least one processor will be configured, in accordance with the stored instructions, to: starting from the shape of the non-flat laminar item, define the geometry and dimensions of a flat laminar item required to obtain the non-flat laminar item through a forming process by calculating or by calculating a digital flattening of the non-flat laminar item; determine the local bending and / or stretching undergone by the non-flat laminar item during the forming process, required to transform the flat laminar item into the non-flat laminar item by measuring the local bending of each region of the non-flat laminar item and by calculating the local stretching by comparing the surface area of each region of the flat laminar item with each corresponding region of the non-flat laminar item; identify, on the flat laminar item, precursor locations which, after the forming process, become function determined locations coincident with predefined positions, stored in the memory, where some selected surface-mounted components have to be allocated; identify, on the flat laminar item, component eligible position on which, during the forming process, the local bending and / or stretching is a reduced bending and / or stretching below a predefined threshold where the remaining surface-mounted components of the electronic circuit can be allocated.

[0114] Said definition of the geometry and dimensions of the flat laminar item can be obtained, for example, by digitally flattening the non-flat laminar item.

[0115] The local bending of the flat laminar item into the non-flat laminar item can be easily determined simply measuring the local curvature of each region of the non-flat laminar item.

[0116] Also, the non-flat laminar item is preferably an item with regions with positive or negative Gaussian curvature, which cannot be generated by simply bending the flat laminar item, requiring also stretching thereof. Said local stretching can also be mathematically characterized to transform a flat region into a curved region with a positive or negative Gaussian curvature. Once the circuit-mounted components have been allocated on the flat laminar item, the at least one processor is also configured, in accordance with the stored instructions, to define, for each surface-mounted component, an optimal adhesive distribution by: determining, for each surface-mounted component, first loads induced on a bond between the surface-mounted component and the flat laminar item by the local bending and / or stretching on the region where the at least one adhesive is to be applied by calculating the relative movement between the regions of the flat laminar item and the regions of the surface-mounted component adhered by the at least one adhesive during the forming process; determining, for each surface-mounted component, second loads induced, on parts of the conductive track placed around a local stiffened region of the flat laminar item where the at least one adhesive is to be applied, by an accumulation of local bending and / or stretching around the local stiffened region due to the stiffening produced in the local stiffened region, by calculating the local bending I stretching considering the local stiffened region produced by the at least one adhesive applied; the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined second breakage threshold of the conductive tracks above which the conductive tracks suffer a relevant loss in electric conductivity.

[0117] The first loads can be easily calculated, by the at least one processor, because the local bending and the local stretching suffered by the flat laminar item in the region where the adhesive is to be applied is known. Therefore, the relative movement between each point of the flat laminar item and each point the surface-mounted component adhered thereto through the adhesive can be easily determined. Knowing said relative movement the magnitude of the first loads can be determined and knowing the adhesion force per unit area of the adhesive the at least one processor can determine if such first loads are above or below the first breakage threshold. Depending on the result of this calculation, modifications on the disposition of the adhesive will be required to reduce the first loads or to increase the surface area of the adhesion, or ultimately modify the adhesive to increase its adhesion force per unit area.

[0118] Those modifications can be automatically calculated by the at least one processor, for example by iterative calculations of different adhesive distributions, following the stored instructions. Then, the local bending I stretching can be newly calculated by the at least one processor considering the local stiffening region produced by the adhesive, which will accumulate local bending I stretching around the area covered by the adhesive. With the result of this new calculation of the local bending I stretching accumulated around the local stiffened area, the at least one processor can determine if some of the electrically conductive paths contained in said region surrounding the local stiffened region suffer second loads, induced by such accumulation of local bending I stretching, superior to a second breakage threshold of the conductive paths, which value can be stored in the digital memory or calculated by the at least one processor considering some characterization of the material constitutive of the electrically conductive paths stored in the digital memory.

[0119] Similarly, the at least one processor can also be configured, in accordance with the stored instructions, to define the first corrective measures or the second corrective measures.

[0120] Brief description of the Figures

[0121] The foregoing and other advantages and features will be more fully understood from the following detailed description of an embodiment with reference to the accompanying drawings, to be taken in an illustrative and non-limitative manner, in which:

[0122] Fig. 1 shows a perspective view of the non-flat laminar item, in which the three-dimensional relief has been indicated by topography lines and in which two function determined locations for two surface-mounted components and one additional function determined location for one printed sensor or printed actuator have been indicated with a dashed line rectangle;

[0123] Fig. 2 shows a perspective view of the flat laminar item from which the non-flat laminar item shown in Fig. 1 can be obtained through a forming process, in which two precursor locations for two surface-mounted components and one additional precursor location for one printed sensor or printed actuator have been indicated with a dashed line rectangle, which will become the two function determined locations and the one additional function determined location indicated in Fig. 1 , and wherein the different regions of the flat laminar item, suffering different bending and / or stretching during the forming process, have been indicated with dashed lines;

[0124] Fig. 3 shows an exploded perspective view of the flat laminar item shown in Fig. 2, with a flat electronic circuit thereon;

[0125] Fig. 4 shows a perspective ensembled view of the flat laminar item with a flat electronic circuit shown in Fig. 3; Fig. 5 shows a perspective view of the electronic device including a non-flat laminar item with the non-flat electronic circuit obtained through a forming process from the flat laminar item with the flat electronic circuit shown in Fig. 4;

[0126] Fig. 6 shows an exploded perspective view of the electronic device shown in Fig. 5 with an structural element overmolded thereon;

[0127] Figs. 7A to 7D shows a transversal cross-section of a flat laminar item with one surfacemounted component attached with adhesive, showing four different possible optimal adhesive distributions;

[0128] Figs. 8A to 8D shows a transversal cross-section of the non-flat laminar item with one surface-mounted component attached with adhesive, showing the same four different possible optimal adhesive distributions as Figs. 7A to 7D, producing a local stiffened region of different sizes and showing how this affects the local bending around the surface-mounted component.

[0129] Detailed Description of the Invention and of particular embodiments

[0130] The proposed electronic device is shown in the Figures according to a preferred embodiment, only as a non-limitative example.

[0131] The electronic device shown in Fig. 5 comprises a non-flat laminar item 10, with a predefined three dimensional shape, with a non-flat electronic circuit 20 applied thereon, the non-flat electronic circuit comprising surface-mounted components 22, electrically conductive tracks 21 and optionally printed sensors or printed actuators 23.

[0132] Some of those surface-mounted components have to be in a specific predefined function defined position 30 on the non-flat laminar item 10. Optionally, some of the printed sensors or printed actuators 23 shall be also located in a specific predefined additional function defined position 33 on the non-flat laminar item 10.

[0133] The three-dimensional shape of the non-flat laminar item 10 and the location of the function defined position 30, and of the additional function defined position 33 within said three- dimensional non-flat laminar item 10 are designed, for example, considering the function of the electronic device, the placement thereof and / or considering aesthetic criteria.

[0134] According to the above, the proposed method comprises first determining the shape of the non-flat laminar item 10 and the location of the function determined locations 30 and optionally of the additional function determined locations 33 thereon, as shown in Fig. 1. Later, the shape of a flat laminar item 10’ from which the non-flat laminar item 10 can be obtained through a forming process is determined, for example through a simulation of the forming process, identifying the local bending and / or stretching suffered of each region of the flat laminar item 10’ during the formation of the non-flat laminar item 10, and also identifying on the flat laminar item 10’ the position of precursor locations 30’, which will become the function determined locations 30 after the forming process, and the position of additional precursor locations 33’, which will become the additional function determined locations 33 after the forming process.

[0135] The method also comprises defining the scheme of the flat electronic circuit 20’ required to produce the electronic functionality of the electronic device, identifying each surface-mounted component 22, with known dimensions, and the electrically conductive tracks 21 required to obtain such electronic functionality, and optionally also printed sensors or printed actuators 23 of this flat electronic circuit 20’.

[0136] The surface-mounted components 22 are classified in two groups, one group containing the surface-mounted components 22 which position on the non-flat laminar item 10 is determined by its function, for example those surface-mounted components intended to interact with a user, such buttons and lights, and another group containing the rest of the surface-mounted components 22 which position can be freely modified.

[0137] Similarly, the printed sensors or printed actuators are also classified in those which position is determined by its function and the rest, but in this case most or all of them will be in the first group.

[0138] Also, initial adhesive parameters are determined for each surface-mounted component 22, including the adhesive type, with a known adhesion force per unit area, to provide attachment of the surface-mounted component on the flat laminar item 10’ and / or on the electrically conductive tracks 21.

[0139] Then, for each surface-mounted component 22, an optimal adhesive distribution is determined.

[0140] To obtain such optimal adhesive distribution, the method comprises determining the value of first loads induced on a bond between each surface-mounted component 22 and the flat laminar item 10’ by the local bending and / or stretching suffered by the region of the flat laminar item 10’ where the at least one adhesive is to be applied during the forming process.

[0141] The method to obtain the optimal adhesive distribution also comprises determining the value of second loads induced, on parts of the conductive track 21 placed around a local stiffened region of the flat laminar item 10’ where the at least one adhesive is to be applied, by an accumulation of local bending and / or stretching around the local stiffened region due to the stiffening produced in the local stiffened region.

[0142] Such first loads are dependent on the surface area covered by the adhesive and also dependent on the shape and disposition of such surface, because a bigger surface distributes the loads on a bigger area, but also increases the distance between extreme points of the flat laminar item increasing the relative movement between them due to the local bending I stretching inducing bigger first loads.

[0143] Therefore, the optimal adhesive distribution shall cover a surface sufficient to distribute the first loads reducing the first loads per surface unit below the known adhesion force per surface area of the at least one adhesive, and at the same time has to be distributed to minimize the distance between extreme ends of the region covered by the at least one adhesive, for example concentrating the adhesive in a central region.

[0144] Preferably, the optimal adhesive distribution can be also selected to minimize the distance between extreme ends of the surface covered by the at least one adhesive in the direction suffering most of the local bending I stretching, resulting in a region covered with adhesive elongated in a direction suffering less local bending I stretching.

[0145] The optimal adhesive distribution also affects the second loads produced on the electrically conductive tracks around the surface-mounted component, because the adhesive produces a local stiffened region of the flat laminar item with increased rigidity which suffers no local bending I stretching during the forming process. Because the local stiffened region does not suffer local bending I stretching, the surrounding regions of the flat laminar item accumulate local bending I stretching and therefore suffers additional local bending I stretching.

[0146] Those accumulated local bending I stretching depend on the size and shape of the local stiffened region, which is consequence of the optimal adhesion distribution.

[0147] Therefore, the optimal adhesive distribution shall be defined also considering that the second loads generated remains below the second breakage threshold of the electrically conductive tracks surrounding the local stiffened region, to ensure that the formation process does not produces an interruption on the electrically conductivity of the electrically conductive tracks around the surface-mounted components.

[0148] Similarly, a third breakage threshold can be determined for each printed sensor or printed actuator, or group of printed sensors or printed actuators, said third breakage threshold being also the maximal bending and / or stretching supportable by the printed sensor or printed actuator 23 without losing functionality.

[0149] Then, the geometry of the flat electronic circuit 20’ is determined, locating each surfacemounted component 22 which position depends on its function on the correspondent precursor location 30’ of the flat laminar item 10’, and also locating each printed sensor or printed actuator 23 which position depends on its function on the correspondent additional precursor location 33’ of the flat laminar item 10’ when exist.

[0150] Also, for each electrically conductive track 21 or for each group of electrically conductive tracks, a second breakage threshold is determined, for example through empirical experimentation or through simulation. The second breakage threshold is the limit above which the electrically conductive tracks suffer a deformation by the local bending and / or stretching of the flat laminar item 10’ during the formation of the non-flat laminar item which affects its electrical conductivity. Such limit can be expressed, for example, as a maximal local bending, a maximal local stretching and / or a maximal combination of local bending and local stretching, suffered for the flat laminar item 10’ during the forming process on the local region on which the electrically conductive track 21 is applied without affecting its electrical conductivity.

[0151] Electrically conductive tracks 21 can be classified in several groups, each group including those electrically conductive tracks 21 with similar wide. Then, the second breakage threshold is determined for the less wide electrically conductive track 21 of each group and considered as the second breakage threshold for all the electrically conductive tracks 21 of the group.

[0152] Tracks eligible regions are determined on the surface of the flat laminar item 10’ for each electrically conductive track or for each group of electrically conductive tracks with the same second breakage threshold. The tracks eligible regions are those regions of the flat laminar item 10’ having local bending and / or stretching below said second breakage threshold and can be easily determined considering the known local bending and / or stretching of the flat laminar item 10’ during the forming process and the second breakage threshold. Then, the electrically conductive tracks 21 are distributed within the track eligible regions, according the electric scheme to obtain the intended electronic functionality.

[0153] In some cases, the connection between surface-mounted components 22 require the electrically conductive tracks 21 to be defined across a region not initially defined as a track eligible region. In those cases, track eligible paths 34 can be determined across those regions not initially defined as a track eligible region as part of the track eligible regions.

[0154] The track eligible paths can be for example, oblique, zigzagging or orthogonal to the local direction with maximal local bending and / or with maximal local stretching. The apparent bending and / or stretching, in the direction of such track eligible path, is lower than the local bending and / or stretching in the direction with maximal local bending and / or with maximal local stretching.

[0155] Therefore, the bending and / or stretching along the track eligible paths 34 can below the second breakage threshold despite being in a region which maximal local bending and / or maximal local stretching is above the second breakage threshold.

[0156] Then, some electrically conductive tracks 21 can be implemented in the track eligible paths 34.

[0157] The electronic device may include a structural element 40 overmolded above or around the non-flat laminar item 10 with the non-flat electronic circuit 20 thereon.

[0158] In this case, the method may include designing the structural element 40 to be overmolded and also designing an overmolding process to produce the structural element 40, defining the molding resin to be overmolded, and the molding parameters thereof, for example the fluid molding resin viscosity, temperature, injection velocity before hardening and / or the location of the injection gates through which the fluid molding resin is introduced in the mold.

[0159] The material to be overmolded can be, for example, thermoplastic, silicon rubber, thermoset resins.

[0160] Then, the local flow parameters of the molding resin over the non-flat laminar item 10 during the overmolding process are determined. Such local flow parameters may include, for example, parameters of the molding resin on each region of the non-flat laminar item during the overmolding process, for example, the molding resin flow speed, direction, viscosity, temperature, or others before hardening.

[0161] For each surface-mounted component 22, or for groups of surface-mounted components 22, a fourth breakage threshold can be determined through empirical experimentation or computer simulation. Above the fourth breakage threshold the adhesion provided by the at least one adhesive is overcome by the loads induced by the local flow of fluid molding resin according to the local flow parameters during the overmolding process before hardening, leading to a detachment of the surface-mounted component 22. The determination of the fourth breakage threshold is obtained considering the known adhesion force and distribution of the at least one adhesive and the known dimensions of the surface-mounted components.

[0162] If any surface-mounted component 22 is an endangered surface-mounted component suffering induced loads above the fourth breakage threshold, then the design of the flat electronic circuit 20’ shall be modified until no endangered surface-mounted component remains, by implementing fourth, fifth or sixth corrective measures.

[0163] The fourth corrective measures consisting of modifying the position of each endangered surface-mounted component to a position with local flow parameters inducing loads below the fourth breakage threshold to prevent the detachment produced during the overmolding process and with bending and / or stretching inducing loads below the first breakage threshold to prevent the detaching during the forming process.

[0164] The fifth corrective measures consist of reducing the surface-mounted component size and / or modifying the distribution and / or adhesion force of the at least one adhesive to increment the correspondent fourth breakage threshold above the loads induced by the local flow parameters.

[0165] The fifth corrective measures may also comprise modifying the distribution of the at least one adhesive, to increase the adhesion surface thereof, to make the adhesive drops closer to each other reducing the lever and the relative displacement between said drops or to modify to position of the adhesive, for example moving the adhesive from below the surfacemounted component to its perimeter or vice-versa.

Claims

CLAIMS1. Manufacturing method of an electronic device comprising a non-flat laminar item (10) with a non-flat electronic circuit (20) thereon, the non-flat electronic circuit (20) including at least electrically conductive tracks (21) and at least one surface-mounted component (22) attached, or attached and electrically connected, through at least one adhesive with a known adhesion force per unit area, the method comprising: defining the geometry and dimensions of a flat laminar item (10’) suitable to be deformed into the non-flat laminar item (10) through a forming process; determining local bending and / or stretching on the flat laminar item (10’) during the forming process into the non-flat laminar item (10); designing, on the flat laminar item (10’), a flat electronic circuit (20’) to become the non-flat electronic circuit (20) after the forming process, by: defining function determined locations (30) on the non-flat laminar item (10) for some of the surface-mounted components (22), and identify, on the flat laminar item (10’), precursor locations (30’) which, after the forming process, become the function determined locations (30), positioning said surface-mounted components (22) on the precursor locations (30’); positioning each of the remaining surface-mounted components (22) in a selected component eligible position (31) of the flat laminar item (10’) on which, during the forming process, the local bending and / or stretching is a reduced bending and / or stretching below a predefined threshold; defining, for each surface-mounted component (22), an optimal adhesive distribution by: determining, for each surface-mounted component (22), first loads induced on a bond between the surface-mounted component (22) and the flat laminar item (10’) by the local bending and / or stretching on the region where the at least one adhesive is to be applied; determining, for each surface-mounted component (22), second loads induced, on parts of the conductive track (21) placed around a local stiffened region of the flat laminar item (10’) where the at least one adhesive is to be applied, by an accumulation of local bending and / or stretching around the local stiffened region due to the stiffening produced in the local stiffened region; the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined secondbreakage threshold of the conductive tracks (21) above which the conductive tracks suffer a relevant loss in electric conductivity; producing the flat laminar item (10’) with the flat electronic circuit (20’) thereon according to the design obtained from the preceding steps of the method and form the non -flat laminar item (10) with the non-flat electronic circuit (20) thereon through the forming process.

2. The method according to claim 1 wherein the optimal adhesive distribution is selected among the following adhesive distributions: a single drop of adhesive in a central region under the surface-mounted component; multiple drops of adhesive in a perimetral region under the surface-mounted component; multiple drops of adhesive in alignment under the surface-mounted component; multiple drops of adhesive in a perimetral region around the surface-mounted component; an encasing of adhesive embedding the surface-mounted component.

3. The method according to claim 1 or 2 wherein the optimal adhesive distribution is selected through an iterative calculation.

4. The method according to any preceding claim wherein the definition of the optimal adhesive distribution includes extending the at least one adhesive beyond the surfacemounted component, covering parts of the conductive track (21) placed around the surfacemounted component (22) to include said parts of the conductive track (21) in the local stiffened region of the flat laminar item (10’).

5. The method according to any preceding claim wherein the method further comprises verifying if any surface-mounted component (22) is an endangered surface-mounted component where no optimal adhesive distribution provides both a bond with first breakage threshold above the first loads and an accumulation of local bending and / or stretching around the local stiffened region inducing second loads below the second breakage threshold and / or where the endangered surface-mounted component lacks suitable component eligible position (31) with reduced bending and / or stretching below the predefined threshold; when endangered surface-mounted components are detected, modifying the design of the flat electronic circuit (20’) until no endangered surface mounted component remains by implementing:first corrective measures by modifying the geometry, orientation and / or dimensions of the endangered surface-mounted components allowing for different optimal adhesive distributions or substituting the adhesive attaching the surface-mounted component for an alternative adhesive with a higher known adhesion force per unit area, and / or second corrective measures to reduce the local bending and / or stretching by modifying the shape of the non-flat laminar item (10).

6. The manufacturing method according to any preceding claim wherein the method further comprises positioning the electrically conductive tracks (21) entirely in track eligible positions (32) on which, during the forming process, the local bending and / or stretching induces loads below the second breakage threshold.

7. The manufacturing method according to claim 6 wherein the method comprises detecting, as part of the track eligible positions (32), track eligible paths (34) along which the bending and / or stretching during the forming process is below the second breakage threshold in the longitudinal direction of the track eligible path (34), the track eligible paths (34) being oblique to a local maximal curvature and / or stretching direction on which the local curvature and / or stretching produced during the forming process is above the second breakage threshold.

8. The manufacturing method according to any preceding claim wherein the method further comprises: defining, as part of the designing of the flat electronic circuit (20’), additional function determined locations (33) on the non-flat laminar item for printed sensors or printed actuators (23), and identifying, on the flat laminar item (10’), additional precursor locations (33’) which, after the forming process, become the additional function determined locations (33); printing the printed sensors or printed actuators (23) on the additional precursor locations (33’) as part of the flat electronic circuit (20’).

9. The manufacturing method according to claim 8 wherein the method further comprises: determining, for each printed sensor or printed actuator (23), a third breakage threshold above which the local bending and / or stretching induces third loads on the printed sensor or printed actuator which overcomes the mechanical properties thereof leading to an interruption on its functionality; and if any printed sensor or printed actuator (23) is placed in one additional precursor locations (33’) suffering bending and / or stretching inducing third loads, modifying the design of the non-flat electronic circuit (20) implementing third corrective measures to increment the correspondent third breakage threshold of the printed sensor or printed actuator (23) bymodifying the shape or size of the printed sensor or printed actuator (23) and / or by modifying the thickness or width of at least parts of the printed sensor or printed actuator (23), or implementing the second corrective measures.

10. The manufacturing method according to any preceding claim wherein the method further comprises designing a structural element (40) to be overmolded on, or around, the non-flat laminar item (10) and designing an overmolding process to produce the structural element (40); determining local flow parameters of the moulding resin injected over the non-flat laminar item (10) during the overmolding process; determining, for each surface- mounted component (22) a fourth breakage threshold above which the adhesion provided by the at least one adhesive is overcome by loads induced by the local flow of fluid molding resin before hardening according to the local flow parameters during the overmolding process, leading to a detachment of the surface-mounted component (22), considering the known adhesion force and distribution of the at least one adhesive and the known dimensions of the surface-mounted components; verifying if any surface-mounted component (22) is an endangered surface-mounted component suffering loads above the fourth breakage threshold induced by local flow parameters, when endangered surface-mounted components are detected, modifying the design of the flat electronic circuit (20’) util no endangered surface mounted component remains by implementing: fourth corrective measures consisting of modifying the position of each endangered surfacemounted component to a position with local flow parameters inducing loads below the fourth breakage threshold and with bending and / or stretching inducing loads below the first breakage threshold; and / or fifth corrective measures to increment the correspondent fourth breakage threshold above the loads induced by the local flow parameters by modifying the geometry and / or dimensions of the endangered surface-mounted components to reduce the loads induced by the local bending and / or stretching below them and / or by modifying the adhesion thereof; and / or sixth corrective measures to optimize the local flow parameters at least on regions coincident with the endangered surface-mounted components to reduce the shear and / or temperature therein by modifying the overmolding process.

11. The manufacturing method according to claim 10 wherein at least one surface-mounted component (22) has an anisotropic cross-section surface, and the fourth breakage threshold thereof is an anisotropic fourth directional breakage threshold variable depending on directional orientation, at least some of the local flow parameters are anisotropic directional local flow parameters variable depending on directional orientation; verifying if any surface-mounted component is an endangered surface-mounted component suffering, in at least one direction, loads induced by the directional local flow parameters in said direction above the fourth directional breakage threshold supportable in the same direction; and when endangered surface-mounted components are detected, modifying the design of the flat electronic circuit util no endangered surface mounted component remains by implementing the fourth corrective measures, the fifth corrective measures, the sixth corrective measures and / or seventh corrective measures consisting in the modification of the orientation of the surface-mounted component.

12. The manufacturing method according to any preceding claim wherein the first breakage threshold and / or the fourth breakage threshold and / or the fourth directional breakage threshold is / are defined individually for each surface-mounted component.

13. The electronic device according to claim 6 or 7 wherein if any electrically conductive track lacks a suitable track eligible position with local bending and / or stretching producing induced loads below the correspondent second breaking threshold, modifying the design of the nonflat electronic circuit to increase the second breakage threshold of at least those electrically conductive tracks lacking suitable track eligible positions by: modify the wide and / or thickness of the electrically conductive track or parts thereof; or modify the material constitutive of the electrically conductive tracks.

14. The electronic device according to claim 9 wherein the third corrective measures to increase the third breakage threshold include, for at least one printed sensor or printed actuator suffering induced loads above the third breakage threshold: modify the wide and / or thickness of the printed sensor or printed actuator or parts thereof; modify the material constitutive of the printed sensor or printed actuator; or increase the size of the printed sensor or printed actuator.

15. The electronic device according to claim 10, 11 or 12 wherein the fifth corrective measures to increase the fourth breakage threshold include, for at least one surfacemounted component suffering induced loads above the fourth breakage threshold: substituting the surface-mounted component for an alternative surface mounted component with the same functionality but reduced cross-section surface perpendicular to the flat laminar item to reduce drag and / or with a bigger bottom surface facing the flat laminar item to increase adhesion; or increasing the adhesion force by replacing the at least one adhesive by an adhesive with stronger adhesion force per unit area, by modifying the distribution of the at least one adhesive, by increasing the quantity of the at least one adhesive, and / or by adding a quantity of a different additional adhesive; and / or wherein the sixth corrective measures to optimize the local flow parameters at least on the regions where induce loads on surface-mounted components above the fourth breakage threshold include: reduce the molding resin viscosity and / or speed and / or temperature during the overmolding process to reduce the local flow parameters; modify the position and / or number of injection gates of the mold through which the molten molding resin is introduced in the mold during the overmolding process.

16. Electronic arrangement for the design of a non-flat laminar item with a non-flat circuit thereon, the electronic arrangement including at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and the other data; wherein the at least one processor is configured, in accordance with the stored instructions, to: starting from a given shape of the non-flat laminar item, define the geometry and dimensions of a flat laminar item required to obtain the non-flat laminar item by calculating or by calculating a digital flattening of the non-flat laminar item; determine the local bending and / or stretching undergone by the non-flat laminar item during the forming process, required to transform the flat laminar item into the non-flat laminar item by measuring the local bending of each region of the non-flat laminar item and by calculating the local stretching by comparing the surface area of each region of the flat laminar item with each corresponding region of the non-flat laminar item;identify, on the flat laminar item, precursor locations which, coincident with given predefined positions of the non-flat laminar item, stored in the memory, where some selected surface-mounted components have to be allocated; identify, on the flat laminar item, component eligible position on which, during the forming process, the local bending and / or stretching is a reduced bending and / or stretching below a predefined threshold where the remaining surface-mounted components of the electronic circuit can be allocated; and once the circuit-mounted components have been allocated on the flat laminar item, the at least one processor is also configured, in accordance with the stored instructions, to define, for each surface-mounted component, an optimal adhesive distribution by: determining, for each surface-mounted component, first loads induced on a bond between the surface-mounted component and the flat laminar item by the local bending and / or stretching on the region where the at least one adhesive is to be applied by calculating the relative movement between the regions of the flat laminar item and the regions of the surface-mounted component adhered by the at least one adhesive during the forming process; determining, for each surface-mounted component, second loads induced, on parts of the conductive track placed around a local stiffened region of the flat laminar item where the at least one adhesive is to be applied, by an accumulation of local bending and / or stretching around the local stiffened region due to the stiffening produced in the local stiffened region, by calculating the local bending I stretching considering the local stiffened region produced by the at least one adhesive applied; the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined second breakage threshold of the conductive tracks above which the conductive tracks suffer a relevant loss in electric conductivity.

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