Circuit board, image sensor module, lens drive device, and camera module including the same.

Abstract

The present invention relates to a circuit board, an image sensor module, a lens drive device, and a camera module including the same. [Solution] The circuit board according to the embodiment includes an insulating portion and a pattern portion disposed on the insulating portion, the insulating portion includes a first insulating region and a second insulating region disposed outside the first insulating region and separated from the first insulating region by a separation region, the pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion, the first pattern portion includes a first terminal portion disposed in the first insulating region, a second terminal portion disposed in the second insulating region, and a connecting portion disposed in the separation region and connecting the first terminal portion and the second terminal portion, the second pattern portion includes a 2-1 pattern portion disposed in the first insulating region and a 2-2 pattern portion disposed in the second insulating region and separated from the 2-1 pattern portion.

Description

[Technical Field]

[0001] The embodiments relate to a circuit board, an image sensor module, a lens drive device, and a camera module including the same. [Background technology]

[0002] The camera module is driven based on either a sensor-shift or module-tilt actuator. Due to the structure of such actuators, the image sensor and sensor substrate are isolated from other structures. Therefore, the camera module has a structure that prevents heat generated in the image sensor and sensor substrate from being transferred to the outside. As a result, the camera module has the problem of a persistent increase in the surface temperature of the image sensor and sensor substrate.

[0003] Furthermore, the sensor shift substrate (e.g., interposer) of the camera module is in contact with the image sensor and sensor substrate. However, the contact area between the sensor shift substrate and the image sensor and sensor substrate is very small. This results in inefficient heat dissipation for the camera module.

[0004] Furthermore, when the image sensor is small, the amount of heat generated by the image sensor is not large, so this does not pose a major problem. However, recent camera modules have increased image sensor sizes due to increased resolution. As the size of the image sensor increases, reliability issues related to the amount of heat generated by the image sensor are becoming more pronounced.

[0005] This necessitates fundamental measures to resolve this issue. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] The embodiment provides a circuit board, an image sensor module, a lens drive device, and a camera module including the same, which can improve the drivability of the image sensor.

[0007] Furthermore, the embodiment provides a circuit board, an image sensor module, a lens drive device, and a camera module including the same, which can improve the heat dissipation characteristics of the image sensor.

[0008] Furthermore, the embodiment provides a circuit board, an image sensor module, a lens drive device, and a camera module including the same, which can prevent oxidation of the pattern portion.

[0009] Furthermore, the embodiment provides a circuit board, an image sensor module, a lens drive device, and a camera module including the same, which can improve the electrical reliability of the pattern portion.

[0010] Furthermore, the embodiment provides a substrate, an image sensor module, a lens drive device, and a camera module including the same, which can improve the adhesion between the insulating portion and the patterned portion.

[0011] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those with ordinary skill in the art to which the proposed embodiments belong, based on the following description. [Means for solving the problem]

[0012] The circuit board according to the embodiment includes an insulating portion and a pattern portion disposed on the insulating portion. The insulating portion includes a first insulating region and a second insulating region disposed outside the first insulating region and separated from the first insulating region across a separation region. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion disposed in the first insulating region, a second terminal portion disposed in the second insulating region, and a connecting portion disposed in the separation region and connecting the first terminal portion and the second terminal portion. The second pattern portion includes a first sub-pattern portion disposed in the first insulating region and a second sub-pattern portion disposed in the second insulating region and separated from the first sub-pattern portion.

[0013] Further, the first sub-pattern portion is disposed in a central region on the upper surface of the first insulating region, and the first terminal portion is disposed in an end region on the upper surface of the first insulating region excluding the central region.

[0014] Further, the first insulating region includes a first terminal open portion overlapping the first terminal portion in a vertical direction, a part of the first terminal portion is disposed on the first insulating region, and another part of the first terminal portion is disposed in the first terminal open portion.

[0015] Further, the second insulating region includes a second terminal open portion overlapping the second terminal portion in a vertical direction, a part of the second terminal portion is disposed on the second insulating region, and the remaining part of the second terminal portion is disposed on the second terminal open portion.

[0016] Further, at least one of the first terminal open portion and the second terminal open portion is not connected to the separation region of the insulating portion.

[0017] Further, the first insulating region includes a fixed pad open portion disposed adjacent to and separated from the first terminal open portion.

[0018] Furthermore, the fixed pad open portion is connected to the separation region.

[0019] Furthermore, the first insulating region includes a first portion that overlaps perpendicularly with the first terminal portion of the first pattern portion and the 2-1 pattern portion of the second pattern portion, and a second portion excluding the first portion.

[0020] Furthermore, the second insulating region includes a third portion that overlaps perpendicularly with the second terminal portion of the first pattern portion and the 2-2 pattern portion of the second pattern portion, and a fourth portion excluding the third portion.

[0021] Furthermore, the separation region includes the first to fourth corner portions, and the connecting portion includes the first to fourth connecting portions, each of which is located in the first to fourth corner portions, and the first to fourth connecting portions extend in the same direction from one end connected to the first terminal portion and are connected to the second terminal portion.

[0022] Furthermore, the first insulating region includes the 1-1 to 1-4 side regions, the first terminal portion includes the 1-1 to 1-4 terminals respectively arranged in the 1-1 to 1-4 side regions, the second insulating region includes the 2-1 to 2-4 side regions opposite to the 1-1 to 1-4 side regions of the first insulating region, and the second terminal portion includes the 2-1 to 2-4 terminals respectively arranged in the 2-1 to 2-4 side regions.

[0023] Furthermore, the 1-1 to 1-4 terminals are arranged adjacent to different corners among the 1 to 4 corners of the separation region, and the 2-1 to 2-4 terminals are arranged adjacent to different corners among the 1 to 4 corners of the separation region.

[0024] Furthermore, each of the first to fourth connecting portions is bent counterclockwise from one end connected to the first terminal portion and connected to the second terminal portion.

[0025] Furthermore, the first connecting portion includes one end connected to the 1-1 terminal and the other end connected to the 2-4 terminal which is not facing the 1-1 terminal; the second connecting portion includes one end connected to the 1-2 terminal and the other end connected to the 2-3 terminal which is not facing the 1-2 terminal; the third connecting portion includes one end connected to the 1-3 terminal and the other end connected to the 2-1 terminal which is not facing the 1-3 terminal; and the fourth connecting portion includes one end connected to the 1-4 terminal and the other end connected to the 2-2 terminal which is not facing the 1-4 terminal.

[0026] Furthermore, each of the first to fourth connecting portions includes an inner connecting portion located inside an open area that opens a part of each of the first to fourth corner portions, and an outer connecting portion located outside the open area, and the number of inner connecting portions is different from the number of outer connecting portions.

[0027] Furthermore, the inner connecting portion and the outer connecting portion each contain the same number of bending points.

[0028] On the other hand, the image sensor module according to the embodiment includes a first substrate, a second substrate disposed on the first substrate, and an image sensor disposed on the second substrate, wherein the first substrate includes an insulating portion including a first insulating region and a second insulating region disposed outside the first insulating region and separated from the first insulating region by a separation region, a first pattern portion including a first terminal portion disposed in the first insulating region, a second terminal portion disposed in the second insulating region, and a connecting portion disposed in the separation region and connecting the first terminal portion and the second terminal portion, a second pattern portion including a second-1 pattern portion disposed in the first insulating region separated from the first terminal portion, and a second 2-2 pattern portion disposed in the second insulating region separated from the second terminal portion and separated from the 2-1 pattern portion, wherein the second substrate includes a pad connected to the first terminal portion of the first substrate and a via penetrating the second substrate, the via being connected to the 2-1 pattern portion by an adhesive member.

[0029] Furthermore, the first insulating region of the first substrate is formed in a region that overlaps perpendicularly with the 2-1 pattern portion and includes through holes penetrating the first insulating region, and the first substrate includes an adhesive layer disposed within the through holes and a heat dissipation portion attached to the first substrate via the adhesive layer.

[0030] Furthermore, the planar area of ​​the 2-1 pattern portion is larger than the planar area of ​​the first insulating region of the first substrate.

[0031] Furthermore, at least a portion of the heat dissipation section is positioned within a through-hole formed in the first insulating region.

[0032] On the other hand, a circuit board according to another embodiment includes an insulating portion and a pattern portion disposed on the insulating portion, wherein the insulating portion includes a first insulating region and a second insulating region disposed outside the first insulating region and separated from the first insulating region by a separation region, wherein the pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes a first terminal portion disposed in the first insulating region, a second terminal portion disposed in the second insulating region, and a connecting portion disposed in the separation region and connecting the first terminal portion and the second terminal portion, wherein the first terminal portion, the second terminal portion, and the connecting portion include a metal layer and a plating layer formed on at least one surface of the metal layer, and the average size of the plating particles constituting the plating layer satisfies the range of 0.8 μm to 5.15 μm.

[0033] Furthermore, the metal layer includes a rolled copper foil alloy.

[0034] Furthermore, the plating particles in the plating layer include binary or ternary composite elements selected from Cu, Ni, Co, Mn, and Al.

[0035] Furthermore, the difference between the largest first plating particle and the smallest second plating particle among the plating particles constituting the plating layer is 7.0 μm or less.

[0036] Furthermore, the unit area of ​​the plating layer (1 μm²) 2 The surface area of ​​the plating particles contained in ) is 0.5 μm 2 That's all.

[0037] Furthermore, the centerline average roughness Ra of the plating layer satisfies the range of 0.05 μm to 1.5 μm, and the 10-point average roughness Rz of the plating layer satisfies the range of 0.6 μm to 15 μm.

[0038] Furthermore, the peel strength (90° peel strength) between the plating layer and the insulating portion is 50 gf / mm or more.

[0039] Furthermore, the first terminal portion, the second terminal portion, and the connecting portion include a surface treatment layer disposed on the metal layer and the plating layer.

[0040] Furthermore, the surface treatment layer of the connecting portion is distributed evenly on the upper and side surfaces of the metal layer of the connecting portion, and on the side and lower surfaces of the plating layer of the connecting portion.

[0041] Furthermore, the surface treatment layer of the first terminal portion is arranged on the upper and side surfaces of the metal layer of the first terminal portion, and on a portion of the lower surface of the metal layer of the first terminal portion.

[0042] Furthermore, the lower surface of the metal layer of the first terminal portion includes a 1-1 lower surface that overlaps with the first insulating region in the thickness direction, and a 1-2 lower surface other than the 1-1 lower surface, and the surface treatment layer of the first terminal portion is arranged on the 1-2 lower surface of the metal layer of the first terminal portion.

[0043] Furthermore, the lower surface of the metal layer of the second terminal portion includes a second-first lower surface that overlaps with the second insulating region in the thickness direction, and a second-second lower surface other than the second-first lower surface, and the surface treatment layer of the second terminal portion is arranged on the second-second lower surface of the metal layer of the second terminal portion.

[0044] The material also includes a second pattern portion disposed on the insulating portion and separated from the first pattern portion, wherein the first pattern portion is a pattern portion for signal transmission, and the second pattern portion is a dummy pattern portion, and the second pattern portion includes a metal layer corresponding to the first pattern portion, the plating layer, and a surface treatment layer.

[0045] Furthermore, the surface treatment layers of the first terminal portion, the second terminal portion, and the connecting portion include a first surface treatment portion disposed on the metal layer of the first terminal portion, the second terminal portion, and the connecting portion, and a second surface treatment portion disposed on the plating layer of the first terminal portion, the second terminal portion, and the connecting portion.

[0046] On the other hand, a circuit board according to another embodiment includes an insulating portion and a pattern portion disposed on the insulating portion, wherein the insulating portion includes a first insulating region and a second insulating region disposed outside the first insulating region and separated from the first insulating region by a separation region, wherein the pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes a first terminal portion disposed in the first insulating region, a second terminal portion disposed in the second insulating region, and a connecting portion disposed in the separation region and connecting the first terminal portion and the second terminal portion, wherein the first terminal portion, the second terminal portion, and the connecting portion include a metal layer and a surface treatment layer disposed on the metal layer and formed from at least one of the organic material, inorganic material, and inorganic composite.

[0047] Furthermore, the surface treatment layer of the connecting portion is distributed evenly across the upper, side, and lower surfaces of the metal layer of the connecting portion.

[0048] Furthermore, the surface treatment layer of the first terminal portion is arranged on the upper and side surfaces of the metal layer of the first terminal portion, and on a portion of the lower surface of the metal layer of the first terminal portion.

[0049] Furthermore, the lower surface of the metal layer of the first terminal portion includes a 1-1 lower surface that overlaps with the first insulating region in the thickness direction, and a 1-2 lower surface other than the 1-1 lower surface, and the surface treatment layer of the first terminal portion is arranged on the 1-2 lower surface of the metal layer of the first terminal portion.

[0050] Furthermore, the surface treatment layer of the second terminal portion is arranged on the upper and side surfaces of the metal layer of the second terminal portion, and on a portion of the lower surface of the metal layer of the second terminal portion.

[0051] Furthermore, the lower surface of the metal layer of the second terminal portion includes a second-first lower surface that overlaps with the second insulating region in the thickness direction, and a second-second lower surface other than the second-first lower surface, and the surface treatment layer of the second terminal portion is arranged on the second-second lower surface of the metal layer of the second terminal portion.

[0052] Furthermore, the surface treatment layer contains alkylimidazole.

[0053] Furthermore, the circuit board includes a second pattern section disposed on the insulating section and separated from the first pattern section, wherein the first pattern section is a pattern section for signal transmission, the second pattern section is a dummy pattern section, and the second pattern section includes a metal layer and a surface treatment layer corresponding to the first pattern section.

[0054] Furthermore, the surface treatment layers of the first terminal portion, the second terminal portion, and the connecting portion include a first surface treatment portion disposed on the metal layer of the first terminal portion, the second terminal portion, and the connecting portion, and a second surface treatment portion disposed on the plating layer of the first terminal portion, the second terminal portion, and the connecting portion.

[0055] Furthermore, the first surface-treated portion contains a metal element different from the metal element constituting the second surface-treated portion. [Effects of the Invention]

[0056] The lens driving device of the embodiment includes a sensor unit and a circuit board for moving an image sensor connected to the sensor unit. The circuit board may be an interposer. The sensor unit includes a sensor substrate connected to the circuit board and an image sensor mounted on the sensor substrate. In this case, the sensor substrate includes an electrical pad electrically connected to the circuit board and a fixed pad other than the electrical pad. In this case, the circuit board may include an open portion into which the fixed pads of the sensor substrate are inserted.

[0057] This allows the embodiment to insert the fixing pad into the open portion during the soldering process between the circuit board and the sensor board. This facilitates the alignment between the circuit board and the sensor board during the soldering process.

[0058] Furthermore, the embodiment can restrict the movement of the sensor board while the positions of the circuit board and the sensor board are aligned. This allows the embodiment to solve the problem of misalignment between the circuit board and the sensor board that occurs during the soldering process. As a result, the embodiment can improve work efficiency.

[0059] Furthermore, the embodiment can improve the electrical connectivity between the sensor substrate and the circuit board. This allows the embodiment to improve the reliability of the product.

[0060] Furthermore, the circuit board of the embodiment includes the insulating portion and the pattern portion. The insulating portion includes the first insulating region, the second insulating region, and the separation region between them. The pattern portion includes a first terminal portion located in the first insulating region and connected to the sensor board, a second terminal portion located in the second insulating region and connected to the main board, and a connecting portion located in the separation region and connecting the first terminal portion and the second terminal portion. In this case, the connecting portion includes bent portions located at each corner of the separation region. In this case, each bent portion of the connecting portion is bent by rotating in the same direction at the corner. As a result, the embodiment can improve the mobility of the sensor portion by the circuit board due to the bent structure of the connecting portion. Furthermore, the embodiment can improve the accuracy of the movement position of the sensor portion.

[0061] Furthermore, the bent portion of the connecting part in the embodiment includes a first open region that opens up in part at each corner of the separation region. In this case, the first open region may be formed at a position that overlaps with the protruding portion of the second frame constituting the first moving part in the optical axis direction. The connecting part includes an inner connecting part that is arranged inside the first open region and an outer connecting part that is arranged outside the first open region, while avoiding the first open region. In this case, the number of inner connecting parts may be less than the number of outer connecting parts.

[0062] As a result, the embodiment can improve the mobility of the first movable part by having more outer connecting parts located outside the first open region than the number of inner connecting parts located inside the first open region. For example, when the number of outer connecting parts is greater than the number of inner connecting parts, the amount of movement of the first movable part can be adjusted more easily than in the opposite case. For example, the outer connecting parts are arranged outside the first open region and have a longer length than the inner connecting parts. And because the length of the outer connecting parts is greater than the length of the inner connecting parts, the strength of the driving force required to move the first movable part can be reduced compared to the inner connecting parts. As a result, the embodiment can improve the mobility of the first movable part by the difference in the number of inner and outer connecting parts. Furthermore, the embodiment can finely adjust the amount of movement of the first movable part.

[0063] Furthermore, each of the outer connecting portion and the inner connecting portion in the embodiment includes a plurality of bending points. In this case, the number of bending points in the outer connecting portion may be the same as the number of bending points in the inner connecting portion. And by having the same number of bending points, the mobility of the first movable portion can be improved.

[0064] For example, if the number of bending points in the outer connecting portion differs from the number of bending points in the inner connecting portion, force may concentrate in the connecting portion that has a relatively large number of bending points. This can lead to a problem where the connecting portion where the force is concentrated breaks before the other connecting portions. Furthermore, problems may occur in the movement accuracy of the first moving portion.

[0065] In contrast, the embodiment allows the force applied to the inner and outer connecting parts to be uniformly distributed because the number of bending points is the same when the first movable part moves. As a result, the embodiment can uniformly distribute the force to the inner and outer connecting parts. This solves the problem of a particular connecting part breaking first. Furthermore, even if a situation arises in which the connecting part breaks, the embodiment can ensure that the inner and outer connecting parts break at the same time.

[0066] On the other hand, the embodiment involves an adhesive layer placed in a through-hole penetrating the first insulating region of the circuit board, and a heat dissipation unit attached to the circuit board via the adhesive layer. The heat dissipation unit can then release the heat generated by the sensor board.

[0067] As a result, the embodiment can release the heat generated by the image sensor to the outside, thereby improving its heat dissipation characteristics. This allows the embodiment to improve the operational reliability of the image sensor. Furthermore, the embodiment can improve the quality of the images acquired by the image sensor.

[0068] Furthermore, the pattern portion of the embodiment includes a metal layer and a surface treatment layer disposed on the metal layer. The surface treatment layer may be a thin film layer formed by coating the organic material. In this case, the relative permittivity εr of the organic material is 3.24. This is a much smaller value than the relative permittivity εr of nickel or gold (Au) that is typically found in surface treatment layers. That is, the relative permittivity εr of nickel or gold (Au) is 4 or greater.

[0069] Therefore, the embodiment can improve the signal transmission speed of the wiring, which changes inversely proportional to the relative permittivity of the surface treatment layer. As a result, the embodiment can improve the product reliability of the circuit board.

[0070] Furthermore, the thermal conductivity of the organic material used in the surface treatment layer of the embodiment is higher than that of nickel. As a result, the embodiment can increase the thermal conductivity of the patterned portion.

[0071] In particular, heat dissipation characteristics in electronic products, including camera modules, are a major issue because they affect product performance. Specifically, the components included in camera modules have structures that are vulnerable to heat dissipation. As a result, efforts are being made to improve the heat dissipation characteristics of camera modules. In this embodiment, the thermal conductivity of the pattern portion can be increased by the organic coating. As a result, the embodiment can improve the heat dissipation characteristics of the circuit board and the camera module to which the circuit board is applied.

[0072] Furthermore, the pattern portion in the embodiment is part of the configuration of the first movable part of the camera module. As a result, the pattern portion can move together with the movement of the first movable part. However, the pattern portion may come into contact with other components when the first movable part moves. When the pattern portion comes into contact with other components, problems with electrical reliability may occur.

[0073] In this embodiment, the organic material in the surface treatment layer has lower electrical conductivity than nickel or gold. As a result, when the patterned portion comes into contact with other components, the surface treatment layer can perform an insulating function. This allows the embodiment to improve the electrical reliability of the circuit board. Furthermore, by applying an organic coating method, the embodiment can simplify the plating process and further reduce plating costs.

[0074] On the other hand, the pattern portion of the embodiment includes a plating layer disposed between the metal layer and the surface treatment layer. The plating layer can improve the peel strength between the pattern portion and the insulating portion.

[0075] In this case, the plating layer has surface roughness. In this case, if the surface roughness of the plating layer increases, the adhesion between the plating layer and the insulating part may decrease. Therefore, the embodiment improves the adhesion by controlling the size of the plating particles constituting the plating layer.

[0076] For example, the average size of the plating particles in the plating layer of the example ranges from 0.8 μm to 5.15 μm. Furthermore, in the example, the difference between the first plating particle with the largest size and the second plating particle with the smallest size in the plating layer is 7.0 μm or less. Also, the unit area of ​​the plating layer (1 μm) 2 The surface area of ​​the plating particles in ) is 0.5 μm 2 The above is possible. Furthermore, the centerline average roughness Ra of the plating layer is in the range of 0.05 μm to 1.5 μm. Furthermore, the 10-point average roughness Rz of the plating layer is in the range of 0.6 μm to 15 μm. As a result, the embodiment can further improve the adhesion between the pattern portion and the insulating portion. Furthermore, the embodiment ensures that the peel strength (90° peel strength) between the pattern portion and the insulating portion is 50 gf / mm or more. As a result, the embodiment can solve the reliability problem of the pattern portion detaching from the insulating portion in the operating environment of the camera module. Furthermore, the embodiment can improve the operational reliability of the autofocus or image stabilization function of the camera module. [Brief explanation of the drawing]

[0077] [Figure 1] This is an exploded perspective view of the lens drive device according to the embodiment. [Figure 2] This is a perspective view of the main circuit board of the lens drive device in the embodiment. [Figure 3] This is a bottom view of the sensor substrate of the embodiment. [Figure 4a] This is an exploded perspective view of the substrate according to the embodiment. [Figure 4b] Figure 4a is a plan view of the insulating section. [Figure 4c] Figure 4a is a plan view of the patterned section. [Figure 4d] Figure 4c is an enlarged view of the pattern area. [Figure 4e] This is a plan view of the substrate in the embodiment. [Figure 4f] This is a diagram showing the connection between the substrate and the sensor substrate in the embodiment. [Figure 5a] This is a cross-sectional view of an image sensor module according to the first embodiment. [Figure 5b] This figure shows a modified version of the image sensor module shown in Figure 5a. [Figure 6] This is a cross-sectional view showing an image sensor module according to the second embodiment. [Figure 7] This figure shows an image sensor module according to the third embodiment. [Figure 8a] This is a diagram illustrating the layer structure of the pattern portion according to the first embodiment. [Figure 8b] This figure shows the chemical reaction equation for the surface treatment layer in Figure 8a. [Figure 8c] This figure shows the surface of the surface treatment layer in Figure 8a. [Figure 9a] This is a diagram illustrating the layer structure of the patterned portion according to the second embodiment. [Figure 9b] This is an enlarged view of the connecting section in Figure 9a. [Figure 9c] This figure shows the second surface treatment portion of the surface treatment layer in Figure 9a. [Figure 10] This figure illustrates the surface roughness of the metal layer and plating layer in the patterned portion according to the embodiment. [Figure 11a] This diagram illustrates the relationship between the plating conditions and adhesion strength of the plated layer in the example. [Figure 11b] This diagram illustrates the relationship between the plating conditions and adhesion strength of the plated layer in the example. [Figure 11c] This diagram illustrates the relationship between the plating conditions and adhesion strength of the plated layer in the example. [Figure 11d] This diagram illustrates the relationship between the plating conditions and adhesion strength of the plated layer in the example. [Figure 11e]This diagram illustrates the relationship between the plating conditions and adhesion strength of the plated layer in the example. [Figure 12a] These are SEM images showing the surface of the plated layer under the first to fifth plating conditions. [Figure 12b] These are SEM images showing the surface of the plated layer under the first to fifth plating conditions. [Figure 12c] These are SEM images showing the surface of the plated layer under the first to fifth plating conditions. [Figure 12d] These are SEM images showing the surface of the plated layer under the first to fifth plating conditions. [Figure 12e] These are SEM images showing the surface of the plated layer under the first to fifth plating conditions. [Figure 13a] This figure shows a histogram of the plating particle size of the plating layer under the first to fifth plating conditions. [Figure 13b] This figure shows a histogram of the plating particle size of the plating layer under the first to fifth plating conditions. [Figure 14] This graph shows the relationship between the surface area of ​​the plated particles and the peel strength in the example. [Figure 15] This is a mobile terminal device to which the camera module according to the embodiment is applied. [Figure 16] This is a perspective view of a vehicle to which the camera module according to the embodiment is applied. [Modes for carrying out the invention]

[0078] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0079] However, the technical concept of the present invention is not limited to the several embodiments described, but can be realized in a variety of different forms, and within the scope of the technical concept of the present invention, one or more of its components can be selectively combined or substituted between embodiments.

[0080] Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) shall be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise clearly defined and described. Commonly used terms, such as those defined in advance, may be interpreted in consideration of their meaning in the context of the relevant art. In addition, terms used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.

[0081] In this specification, the singular form may also include the plural form unless otherwise specified in the wording, and when it is written as "A and / or at least one of B, C (or more)", it may include one or more of all combinations that combine with A, B, C. In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0082] Such terminology is used solely to distinguish one component from another, and does not limit the nature, order, or procedure of the component in question. Furthermore, when it is stated that a component is “connected,” “joined,” or “linked” to another component, this includes not only cases where the component is directly connected, joined, or linked to the other component, but also cases where it is “connected,” “joined,” or “linked” by another component that lies between it and the other component.

[0083] Furthermore, when it is stated that a component is formed or positioned "above (upper part) or below (lower part)" of a component, "above (upper part)" or "below (lower part)" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above (upper part) or below (lower part)," it can include not only the upward direction but also the downward direction relative to one component.

[0084] The following explanation will refer to the diagram illustrating the configuration of the camera module.

[0085] Figure 1 is an exploded perspective view of the lens drive device according to the embodiment, Figure 2 is a perspective view of the main circuit board of the lens drive device according to the embodiment, and Figure 3 is a bottom view of the sensor circuit board according to the embodiment.

[0086] Referring to Figures 1 to 3, the lens driving device may include a fixed part 100, a first moving part 200, a second moving part 300, a guide member 400, a first elastic member 500, a second elastic member 600, and a substrate 700. The substrate 700 may be an interposer. The substrate 700 can be coupled to the first moving part 200. For example, the substrate 700 may be coupled to the sensor part 240 of the first moving part 200. The substrate 700 can electrically connect the fixed part 100 and the sensor part 240. Furthermore, the substrate 700 allows the sensor part 240 to move relative to the fixed part 100. For example, the substrate 700 can elastically support the sensor part 240 so that it can move relative to the fixed part 100 while electrically connecting the sensor part 240 and the fixed part 100. This will be explained in more detail below.

[0087] The lens drive device may be a voice coil motor (VCM). The lens drive device may be a lens drive motor. The lens drive device may be a lens drive actuator. The lens drive device may include an AF module. The lens drive device may include an OIS module.

[0088] The fixed portion 100 can refer to a part of the lens drive device whose position is fixed. For example, the fixed portion 100 can be fixed in position during OIS operation or AF operation of the lens drive device. The fixed portion 100 can be arranged surrounding the outside of the first movable portion 200. The fixed portion 100 can be separated from the first movable portion 200. Preferably, when the first movable portion 200 moves during OIS operation of the lens drive device, the fixed portion 100 may be a part whose position is fixed. Also, when the second movable portion 300 moves during AF operation of the lens drive device, the fixed portion 100 may be a part whose position is fixed. The fixed portion 100 may include the main board 110, the first frame 120, and the first drive member 130.

[0089] The first movable part 200 may be arranged in the inner space of the fixed part 100. The first movable part 200 may be arranged in the inner space of the fixed part 100 at a distance from the first movable part 200.

[0090] The first movable part 200 can move relative to the fixed part 100 within the inner space of the fixed part 100. For example, the first movable part 200 can rotate with respect to a first axis. For example, the first movable part 200 can perform a yawing motion, rotating about the x-axis corresponding to the first axis. For example, the first movable part 200 can rotate with respect to a second axis perpendicular to the first axis. For example, the first movable part 200 can perform a pitching motion, rotating about the y-axis corresponding to the second axis. Specifically, the first movable part 200 may be an OIS module for OIS operation. Here, the rotation may include inclination or tilt. The first movable part 200 may include a second frame 210, a subframe 220, a second drive member 230, and a sensor unit 240.

[0091] The second moving part 300 may be positioned in the inner space of the first moving part 200. The second moving part 300 can move relative to the fixed part 100 and the first moving part 200. For example, the second moving part 300 can move with respect to the third axis. For example, the second moving part 300 can perform an autofocus operation by moving along the z-axis (or optical axis) corresponding to the third axis. Specifically, the second moving part 300 may be an AF module for AF operation. The second moving part 300 may include a third frame 310, a lens 320, and a third drive member 330.

[0092] The guide member 400 may be a rolling member. For example, the guide member 400 may include a plurality of balls, the guide member 400 may be positioned between the fixed part 100 and the first movable part 200, the guide member 400 may guide the first movable part 200 so that it can move relative to the fixed part 100, and the guide member 400 may include an upper guide member 410 and a lower guide member 420.

[0093] The first elastic member 500 may be a pressurizing member. The first elastic member 500 may correspond to the guide member 400. The first elastic member 500 may be provided in a number corresponding to the number of balls constituting the guide member 400. The first elastic member 500 may be arranged on the fixing portion 100. The first elastic member 500 can press against the guide member 400. Specifically, the first elastic member 500 includes a coupling region that is coupled to the fixing portion 100. The first elastic member 500 may also include a contact region that extends from the coupling region and contacts the guide member 400. The contact region of the first elastic member 500 may have elastic force. This allows the guide member 400 to be pressed in the z-axis direction. The first elastic member 500 may include a first upper elastic member 510 and a first lower elastic member 520.

[0094] The second elastic member 600 can elastically connect the second movable part 300 to the first movable part 200. For example, the second elastic member 600 elastically supports the second movable part 300 relative to the first movable part 200, allowing the second movable part 300 to move within the inner space of the first movable part 200. As a result, the second movable part 300 can move in the z-axis direction corresponding to the optical axis by the elastic force of the second elastic member 600 while being elastically connected to the first movable part 200. The second elastic member 600 may include a second upper elastic member 610 and a second lower elastic member 620.

[0095] The substrate 700 can electrically connect the fixed portion 100 and the first movable portion 200. In this case, the substrate 700 can be elastically connected to the first movable portion 200 so that it can move relative to the fixed portion 100. The substrate 700 may include a "pattern portion" that bends elastically when the first movable portion 200 moves while the fixed portion 100 and the first movable portion 200 are electrically connected. For example, the substrate 700 can also be called an "interposer" placed between the fixed portion 100 and the sensor portion 240 of the first movable portion 200. For example, the substrate 700 can also be called a "sensor movement substrate" that enables relative movement of the sensor portion 240 of the first movable portion 200 with respect to the fixed portion 100.

[0096] The fixed portion 100 may include a main board 110. The main board 110 may also be called a "first board". The main board 110 may be coupled to the first frame 120. The main board 110 may be a board electrically connected to an external device, where the external device may be a power supply unit and / or control unit of an optical instrument. The main board 110 may be located below the first frame 120. The main board 110 may include a connector 115 for connecting to the external device.

[0097] The main substrate 110 may include an open portion 111 that overlaps with the first moving portion 200 and the second moving portion 300 in the optical axis direction. The main substrate 110 may include a pad 114 disposed on the upper surface adjacent to the open portion 111. The pad 114 may be formed surrounding the upper surface of the main substrate 110 adjacent to the open portion 111. The pad 114 of the main substrate 110 may be electrically connected to a coil portion (not shown) of the first drive member 130. Specifically, the pad 114 of the main substrate 110 may be electrically connected to a coil substrate (not shown) of the first drive member 130.

[0098] The main board 110 may include a first driver IC 112. The first driver IC 112 may be connected to a drive member, where the drive member may be a coil.

[0099] The first driver IC 112 can be electrically connected to a Hall sensor (not shown). The Hall sensor can sense the position of the moving part moved by the drive unit. The first driver IC 112 can supply current to the first coil 132 to control the first moving part 200 to rotate with respect to the x-axis or y-axis. The first driver IC 112 can also adjust the direction or strength of the current applied to the first coil 132 based on the position value sensed through the Hall sensor (not shown).

[0100] The main board 110 may include a gyro sensor 113. The gyro sensor 113 can detect camera shake information. For example, the gyro sensor 113 can detect the movement of a user using the camera module to which the lens drive device is attached.

[0101] On the other hand, the lower surface of the main board 110 may include additional pads 116. The pads 116 located on the lower surface of the main board 110 may be electrically connected to the board 700, which will be described later.

[0102] The first mobile unit 200 may include a sensor unit 240.

[0103] The sensor unit 240 can be coupled to the second frame 210. That is, the sensor unit 240 can rotate together with the second frame 210 with respect to the x-axis or y-axis. The sensor unit 240 may include a sensor substrate 241.

[0104] The sensor board 241 may include pads.

[0105] For example, the lower surface of the sensor substrate 241 may include pads that connect to the substrate 700. Specifically, pads that connect to the substrate 700 may be formed at the end of the lower surface of the sensor substrate 241.

[0106] For example, a first pad 241-1 may be formed in a first region on the lower surface of the sensor substrate 241. For example, a second pad 241-2 may be formed in a second region on the lower surface of the sensor substrate 241 opposite to the first region. For example, a third pad 241-3 may be formed in a third region between the first and second regions on the lower surface of the sensor substrate 241. Furthermore, a fourth pad 241-4 may be formed in a fourth region on the lower surface of the sensor substrate 241 opposite to the third region.

[0107] Each of the first pad 241-1, the second pad 241-2, the third pad 241-3, and the fourth pad 241-4 may be positioned off-center to one side in the first to fourth regions on the lower surface of the sensor substrate 241.

[0108] For example, the first pad 241-1 may be positioned adjacent to the fourth region in the first region of the lower surface of the sensor substrate 241. For example, the second pad 241-2 may be positioned adjacent to the third region in the second region of the lower surface of the sensor substrate 241. For example, the third pad 241-3 may be positioned adjacent to the first region in the third region of the lower surface of the sensor substrate 241. For example, the fourth pad 241-4 may be positioned adjacent to the second region in the fourth region of the lower surface of the sensor substrate 241. This allows the embodiment to improve the mobility of the first movable part 200.

[0109] For example, the pads of the sensor substrate 241 may be arranged in a way that allows them to rotate clockwise or counterclockwise (for example, arranged to be biased to one side in a clockwise or counterclockwise direction). This may correspond to the arrangement structure of the pattern portion of the substrate 700.

[0110] The pad formed on the lower surface of the sensor substrate 241 can be electrically connected to the first terminal portion 721-1 of the substrate 700. For example, the pad of the sensor substrate 241 and the first terminal portion 721-1 of the substrate 700 can be connected by a shoulder ring.

[0111] On the other hand, the pads on the sensor substrate 241 improve the ease of coupling between the sensor substrate 241 and the substrate 700, in addition to signal transmission.

[0112] For example, the pads of the sensor substrate 241 include electrical pads electrically connected to the pattern portion of the substrate 700. The pads of the sensor substrate 241 also include pads electrically separated from the pattern portion of the substrate 700. The electrically separated pads are fixing pads for fixing the sensor substrate 241 to the substrate 700 during the soldering process.

[0113] For example, the first pad 241-1 includes a first-first pad 241-1a that is electrically connected to the pattern portion of the substrate 700. The first-first pad 241-1a may consist of multiple pads. The first pad 241-1 may also include a first-second pad 241-1b that is not electrically connected to the pattern portion of the substrate 700. In this case, although the drawing shows that the first-second pad 241-1b consists of one pad, it is not limited to this. For example, the first-second pad 241-1b may consist of multiple pads. When the first-second pad 241-1b consists of multiple pads, all of the multiple first-second pads 241-1b may be arranged on one side of the first pad 241-1a. Alternatively, when the first-second pads 241-1b consist of multiple pads, the multiple first-second pads 241-1b may be arranged on one side and the other side of the first pad 241-1, respectively. The first-1 pad 241-1a and the first-2 pad 241-1b may be formed from the same metallic material, but only functionally distinguished. For example, the first-1 pad 241-1a and the first-2 pad 241-1b may be formed simultaneously.

[0114] For example, the second pad 241-2 includes a second-first pad 241-2a that is electrically connected to the pattern portion of the substrate 700. The second-first pad 241-2a may consist of multiple pads. The second pad 241-2 may also include a second-second pad 241-2b that is not electrically connected to the pattern portion of the substrate 700. The second-second pad 241-2b may also consist of multiple pads.

[0115] On the other hand, the third pad 241-3 may include only an electrical pad electrically connected to the pattern portion of the substrate 700. Similarly, the fourth pad 241-4 may also include only an electrical pad electrically connected to the pattern portion of the substrate 700. However, the third pad 241-3 and the fourth pad 241-4 may also include electrical pads and fixing pads corresponding to the first pad 241-1 and the second pad 241-2.

[0116] The first-second pads 241-1b and the second-second pads 241-2b may be formed to facilitate shoulder ring work between the substrate 700 and the sensor substrate 241. For example, the first-second pads 241-1b and the second-second pads 241-2b can align the pattern portion of the substrate 700 with the pads of the sensor substrate 241. For example, the first-second pads 241-1b and the second-second pads 241-2b can guide the alignment position between the substrate 700 and the sensor substrate 241.

[0117] For example, in the comparative example, which does not include the first-second pads 241-1b and the second-second pads 241-2b, there may be difficulties in the soldering process for joining the substrate 700 and the sensor substrate 241. For example, in the comparative example, the soldering process should be performed by aligning each of the multiple pads on the sensor substrate 241 and the pattern portion on the substrate 700 one by one. Furthermore, in the comparative example, misalignment between the sensor substrate 241 and the substrate 700 may occur during the soldering process.

[0118] In contrast, in this embodiment, the first-2 pads 241-1b and the second-2 pads 241-2b can be inserted into the fixed pad open portion of the substrate 700 during the soldering process of the substrate 700 and the sensor substrate 241. This makes it easier to align the substrate 700 and the sensor substrate 241. Furthermore, in this embodiment, the movement of the sensor substrate 241 can be restricted by the first-2 pads 241-1b and the second-2 pads 241-2b. For example, the movement of the first-2 pads 241-1b and the second-2 pads 241-2b can be restricted while they are inserted into the fixed pad open portion of the substrate 700. This makes it possible for this embodiment to solve the problem of misalignment that occurs during the soldering process. This makes it possible for this embodiment to improve workability. Furthermore, this embodiment makes it possible to improve the electrical connectivity and product reliability between the sensor substrate 241 and the substrate 700.

[0119] <Image sensor relocation board> Figure 4a is an exploded perspective view of the substrate according to the embodiment, Figure 4b is a plan view of the insulating portion of Figure 4a, Figure 4c is a plan view of the pattern portion of Figure 4a, Figure 4d is an enlarged view of the pattern portion of Figure 4c, Figure 4e is a plan view of the substrate of the embodiment, and Figure 4f is a coupling diagram of the substrate and sensor substrate of the embodiment.

[0120] The following describes the substrate 700 and its electrical connection structure according to the embodiment, with reference to Figures 4a to 4f.

[0121] The substrate 700 according to the embodiment includes an insulating portion 710 and a pattern portion 720. Furthermore, according to the embodiment, the substrate 700 may further include a connecting spring portion 800.

[0122] The insulating portion 710 may include the first insulating region 711 and the second insulating region 712 separated from the first insulating region 711. Furthermore, the insulating portion 710 may include a separation region 713 between the first insulating region 711 and the second insulating region 712.

[0123] For example, the first insulating region 711 and the second insulating region 712 may be separated by the separation region 713. For example, the second insulating region 712 may be arranged to surround the outside of the first insulating region 711. The first insulating region 711 and the second insulating region 712 can have various shapes, such as a square, circular, elliptical, or polygonal shape.

[0124] The first insulating region 711 may correspond to the sensor substrate 241. The second insulating region 712 may correspond to the main substrate 110. For example, the first insulating region 711 may overlap with the sensor substrate 241 in the optical axis direction. The second insulating region 712 may overlap with the main substrate 110 in the optical axis direction.

[0125] The first insulating region 711 and the second insulating region 712 can be separated from each other. There may be no other insulating regions of the insulating part between the first insulating region 711 and the second insulating region 712. The first insulating region 711 and the second insulating region 712 can be arranged in a separated state at positions spaced apart from each other. This allows the embodiment to improve the mobility of the sensor drive unit. Here, the mobility of the sensor drive unit can include tilt characteristics to the x, y, and z axes and shift characteristics in the x, y, and z axis directions. Specifically, the embodiment can reduce the strength of the driving force required to move the first moving part by the separation structure of the first and second insulating regions. That is, in the embodiment, the first insulating region 711 can move freely together with the first moving part without being obstructed by the second insulating region 712.

[0126] The first insulating region 711 may include a first portion 711a and a second portion 711b. The first portion 711a may be the central region of the first insulating region 711. The second portion 711b may be the edge region of the first insulating region 711, positioned around the first portion 711a. Preferably, the first portion 711a may overlap the second-first pattern portion 722-1 of the second pattern portion 722 perpendicularly or in the optical axis direction. The second portion 711b may not overlap the second-first pattern portion 722-1 of the second pattern portion 722 perpendicularly or in the optical axis direction. That is, the first insulating region 711 may have a greater width than the second-first pattern portion 722-1. As a result, at least a portion of the first insulating region 711 may not overlap the second-first pattern portion 722-1 perpendicularly or in the optical axis direction.

[0127] The second insulating region 712 may include a third portion 712a and a fourth portion 712b. The third portion 712a may be the central region of the second insulating region 712. The fourth portion 712b may be the edge region of the second insulating region 712, positioned around the third portion 712a of the second insulating region 712. Preferably, the third portion 712a may overlap the second-second pattern portion 722-2 of the second pattern portion 722-2 in a perpendicular or optical axis direction. The fourth portion 712b may not overlap the second-second pattern portion 722-2 of the second pattern portion 722-2 in a perpendicular or optical axis direction. That is, the second insulating region 712 may have a greater width than the second-second pattern portion 722-2. As a result, at least a portion of the second insulating region 712 may not overlap the second-second pattern portion 722-2 in a perpendicular or optical axis direction.

[0128] The first insulating region 711 may include a plurality of open portions. The first insulating region 711 may include a first terminal open portion. For example, the first insulating region 711 may include a first terminal open portion that exposes the first terminal portion 721.

[0129] The first terminal open portion may be formed in a plurality of first edge regions of the first insulating region 711. For example, the first insulating region 711 may include a plurality of first edge regions. For example, the first insulating region 711 may include the 1-1 edge region R1-1. For example, the first insulating region 711 may include the 1-2 edge region R1-2 opposite to the 1-1 edge region R1-1. For example, the first insulating region 711 may include the 1-3 edge region R1-3 between the 1-1 edge region R1-1 and the 1-2 edge region R1-2. For example, the first insulating region 711 may include the 1-4 edge region R1-4 opposite to the 1-3 edge region R1-3.

[0130] The first terminal open portion may include a first-first terminal open portion 711-1 formed in the first-first side region R1-1 of the first insulating region 711. For example, the first terminal open portion may include a first-second terminal open portion 711-2 formed in the first-second side region R1-2 of the first insulating region 711. For example, the first terminal open portion may include a first-third terminal open portion 711-3 formed in the first-third side region R1-3 of the first insulating region 711. For example, the first terminal open portion may include a first-fourth terminal open portion 711-4 formed in the first-fourth side region R1-4 of the first insulating region 711.

[0131] The first-first terminal open portion 711-1 may expose a part of the first terminal portion 721-1. For example, the first-first terminal open portion 711-1 may expose a part of the first-first terminal 721-1a of the first terminal portion 721-1. That is, it may include a first region located on the first insulating region 711 of the first-first terminal 721-1a of the first terminal portion 721-1, and a second region located on the first-first terminal open portion 711-1. The first-first terminal open portion 711-1 may overlap with the first pad 241-1 of the sensor substrate 241 in the optical axis direction. The first-first terminal open portion 711-1 can improve the shoulder ring workability between the first-first terminal 721-1a of the first terminal portion 721-1 and the first pad 241-1 of the sensor substrate 241. For example, the embodiment allows for verification of alignment between the first terminal 721-1a of the first terminal portion 721-1 and the first pad 241-1 of the sensor substrate 241 on both the upper and lower sides of the substrate 700. Furthermore, the embodiment allows for coupling testing between the substrate 700 and the sensor substrate 241 after the camera module has been manufactured. For example, the lower surface of the first terminal 721-1a exposed through the first terminal open portion 711-1 can also function as a test pad for testing mutual electrical connectivity.

[0132] The first-first terminal open portion 711-1 may have a closed loop shape. For example, the first-first terminal open portion 711-1 may not be connected to the separation region 713. For example, the separation region 713 and the first-first terminal open portion 711-1 may be separated from each other. For example, the first-first terminal open portion 711-1 and the separation region 713 may be separated by the first insulating region 711. As a result, a part of the first insulating region 711 may be located between the first-first terminal open portion 711-1 and the separation region 713. The part of the first insulating region 711 may be a region where a part of the first-first terminal 721-1a of the first terminal portion 721-1 is located. For example, a part of the first insulating region 711 may be a support region that supports a part of the first-first terminal 721-1a of the first terminal portion 721-1. However, in this embodiment, the reliability of the substrate 700 can be further improved by having the 1-1 terminal open portion 711-1 have a closed-loop shape.

[0133] In other words, if the 1-1 terminal open portion 711-1 has an open-loop shape, the reliability of the substrate 700 may decrease. For example, if the 1-1 terminal open portion 711-1 has an open-loop shape, an electrical short circuit may occur when the first movable portion 200 moves relative to the fixed portion 100 by the lens driving device. For example, when the first movable portion 200 moves, the connecting portion 721-3 bends elastically. At this time, if the 1-1 terminal open portion 711-1 has an open-loop shape, the connecting portion 721-3 may come into contact with the 1-1 terminal 721-1a located on the 1-1 terminal open portion 711-1. This may cause an electrical short circuit problem. For this reason, the embodiment ensures that the 1-1 terminal open portion 711-1 has a closed-loop shape. This allows for the prevention of contact between the 1-1 terminal 721-1a and the 1-1 terminal 721-3 even when the connecting portion 721-3 of the pattern portion 720 is bent. Therefore, the embodiment can improve electrical reliability and operational reliability. Furthermore, the 1-1 terminal open portion 711-1 also allows the sensor substrate 241 to be placed upside down when coupled with the sensor substrate 241. For example, in the first embodiment, the pads of the sensor substrate 241 may be placed on the first pattern portion 721 and the second pattern portion 722. In contrast, in the second embodiment, the first pattern portion 721 and the pads of the sensor substrate 241 may be placed facing each other with the insulating portion 710 in between. For example, in the second embodiment, the first pattern portion 721 and the pads of the sensor substrate 241 may be placed directly facing each other with the 1-1 terminal open portion 711-1 in between. As a result, in the second embodiment, the adhesive can be applied to the 1-1 terminal open portion 711- and the soldering process can be performed.

[0134] The first- and second terminal open portion 711-2 is formed in the first- and second side region R1-2 of the first insulating region 711 and may expose a part of the pattern portion 720. For example, the first- and second terminal open portion 711-2 may expose a part of the first- and second terminals 721-1b of the first terminal portion 721-1. That is, a part of the first- and second terminals 721-1b of the first terminal portion 721-1 is located on the first insulating region 711, and the remaining part of the first- and second terminals 721-1b of the first terminal portion 721-1 may be exposed through the first- and second terminal open portion 711-2. The first- and second terminal open portion 711-2 may overlap with the second pad 241-2 of the sensor substrate 241 in the optical axis direction. The first-to-second terminal open portion 711-2 may be formed to improve shoulder ring workability between the first-to-second terminal 721-1b of the first terminal portion 721-1 and the second pad 241-2 of the sensor substrate 241. The first-to-second terminal open portion 711-2 may also be formed for testing the first-to-second terminal 721-1b of the first terminal portion 721-1 and the second pad 241-2 of the sensor substrate 241.

[0135] The first-to-second terminal open portion 711-2 can have the same closed-loop shape as the first-to-first terminal open portion 711-1.

[0136] On the other hand, the first-to-second terminal open portion 711-2 may be positioned opposite the first-to-first terminal open portion 711-1. For example, the first-to-second terminal open portion 711-2 may be positioned opposite the first-to-first terminal open portion 711-1 in the x-axis direction. However, the first-to-first terminal open portion 711-1 and the first-to-second terminal open portion 711-2 may be positioned offset from each other with respect to the x-axis. For example, the center of the first-to-first terminal open portion 711-1 may be positioned offset from the center of the first-to-second terminal open portion 711-2 with respect to the x-axis.

[0137] For example, the first-1 terminal open portion 711-1 may be positioned off-center in the -y-axis direction within the first-1 side region R1-1 of the first insulating region 711. For example, the first-2 terminal open portion 711-2 may be positioned off-center in the +y-axis direction within the first-2 side region R1-2 of the first insulating region 711.

[0138] Furthermore, the first-to-third terminal open portion 711-3 is formed in the first-to-third side region R1-3 of the first insulating region 711. The first-to-third terminal open portion 711-3 may expose a portion of the first-to-third terminals 721-1c of the first terminal portion 721-1. That is, a portion of the first-to-third terminals 721-1c of the first terminal portion 721-1 is located on the first insulating region 711, and the remaining portion of the first-to-third terminals 721-1c of the first terminal portion 721-1 may be exposed through the first-to-third terminal open portion 711-3. The first-to-third terminal open portion 711-3 may overlap with the third pad 241-3 of the sensor substrate 241 in the optical axis direction. The first-to-third terminal open portion 711-3, like other terminal open portions, may be provided for shoulder ring ease and electrical coupling testing.

[0139] The first-to-third terminal open section 711-3 may have the same closed-loop shape as the first-to-first terminal open section 711-1 and the first-to-second terminal open section 711-2.

[0140] The first-to-fourth terminal open portion 711-4 is formed in the first-to-second side region R1-4 of the first insulating region 711. The first-to-fourth terminal open portion 711-4 may expose a portion of the first-to-fourth terminal 721-1d of the first terminal portion 721-1 of the pattern portion 720. That is, a portion of the first-to-fourth terminal 721-1d of the first terminal portion 721-1 is located on the first insulating region 711, and the remaining portion of the first-to-fourth terminal 721-1d of the first terminal portion 721-1 may be exposed through the first-to-fourth terminal open portion 711-4. The first-to-fourth terminal open portion 711-4 may overlap with the fourth pad 241-4 of the sensor substrate 241 in the optical axis direction. The open portion 711-4 of the first to fourth terminals may be provided for ease of shoulder ring formation and electrical connection testing between the first to fourth terminals 721-1d of the first terminal portion 721-1 and the fourth pad 241-4 of the sensor substrate 241.

[0141] On the other hand, the first-to-fourth terminal open portion 711-4 may be positioned opposite the first-to-third terminal open portion 711-3. The first-to-fourth terminal open portion 711-4 may be positioned opposite the first-to-third terminal open portion 711-3 in the y-axis direction. However, the first-to-third terminal open portion 711-3 and the first-to-fourth terminal open portion 711-4 may be positioned offset from each other with respect to the y-axis. For example, the center of the first-to-third terminal open portion 711-3 may be positioned offset from the center of the first-to-fourth terminal open portion 711-4 with respect to the y-axis. For example, the first-to-third terminal open portion 711-3 may be positioned off-center in the +x-axis direction in the first-to-third side region R1-3 of the first insulating region 711. For example, the first to fourth terminal open portions 711-4 may be positioned in the first to fourth side region R1-4 of the first insulating region 711, offset in a different -x axis direction from the first to third terminal open portions 711-3.

[0142] On the other hand, the first insulating region 711 may include a fixed pad open portion. The fixed pad open portion may be arranged adjacent to the first terminal open portion. For example, the first insulating region 711 may include a first fixed pad open portion 711-5. The first fixed pad open portion 711-5 may be arranged adjacent to the 1-1 terminal open portion 711-1. Also, the first fixed pad open portion 711-5 may be spaced apart from the 1-1 terminal open portion 711-1. The first fixed pad open portion 711-5 may correspond to a fixed pad of the sensor substrate 241. For example, the first fixed pad open portion 711-5 may correspond to the 1-2 pad 241-1b of the sensor substrate 241. For example, the first fixed pad open portion 711-5 may overlap with the 1-2 pad 241-1b in the optical axis direction. The first fixed pad open portion 711-5 may be an insertion portion into which the first and second pads 241-1b of the sensor substrate 241 are inserted when the substrate 700 and the sensor substrate 241 are coupled.

[0143] In this embodiment, the first and second pads 241-1b of the sensor substrate 241 are inserted into the first fixing pad open portion 711-5. This facilitates alignment when the sensor substrate 241 and the substrate 700 are coupled. It also allows the sensor substrate 241 to be fixed onto the substrate 700. For example, the movement of the first and second pads 241-1b of the sensor substrate 241 can be restricted while it is positioned within the first fixing pad open portion 711-5. This prevents misalignment between the sensor substrate 241 and the substrate 700.

[0144] The first fixed pad open portion 711-5 may have an open-loop shape. For example, the first fixed pad open portion 711-5 may be connected to the separation region 713. This allows the embodiment to facilitate the insertion of the first and second pads 241-1b when the sensor substrate 241 and the substrate 700 are coupled. This improves the workability of the embodiment.

[0145] On the other hand, in the embodiment, when the first fixed pad open portion 711-5 is separated from the first-first terminal open portion 411-1, it is positioned adjacent to the first-first terminal open portion 411-1. This allows the embodiment to improve the strength of the first insulating region 711. For example, the first insulating region 711 includes the first-first terminal open portion 411-1 as described above. As a result, the strength of the first insulating region 711 may be lower in the region where the first-first terminal open portion 411-1 is formed. In this case, the embodiment forms the first fixed pad open portion 711-5 adjacent to the first-first terminal open portion 411-1. This allows the embodiment to position the first-second pad 241-1b within the first fixed pad open portion 711-5. This allows the embodiment to improve the strength of the first-first side region R1-1 of the first insulating region 711 using the first-second pad 241-1b. This allows the embodiment to improve the operational reliability of the lens drive device.

[0146] Furthermore, the first insulating region 711 may include a second fixed pad open portion 711-6. The second fixed pad open portion 711-6 may be positioned adjacent to the first-second terminal open portion 711-2. Alternatively, the second fixed pad open portion 711-6 may be spaced apart from the first-second terminal open portion 711-2. The second fixed pad open portion 711-6 may correspond to the second-second pad 241-2b of the sensor substrate 241. For example, the second fixed pad open portion 711-6 may overlap with the second-second pad 241-2b in the optical axis direction. The second fixed pad open portion 711-6 may be an insertion portion into which the second-second pad 241-2b is inserted.

[0147] The second fixed pad open portion 711-6 may have the same open-loop shape as the first fixed pad open portion 711-5. The second fixed pad open portion 711-5 is arranged adjacent to the first-to-second terminal open portion 711-2. This allows the embodiment to improve the rigidity of the first insulating region 711 with respect to the first-to-second side region R1-2.

[0148] On the other hand, the embodiment includes a third fixing pad open portion 711-7. The third fixing pad open portion 711-7 is positioned adjacent to the first-to-third terminal open portions 711-3 of the first insulating region 711. In this case, fixing pads of the sensor substrate 241 may not be positioned in the third fixing pad open portion 711-7. However, the third fixing pad open portion 711-7 may be formed to improve the ease of coupling the substrate 700 and the sensor substrate 241. For example, if the third fixing pad open portion 711-7 is not formed, the first-to-second pads 241-1b of the sensor substrate 241 must be positioned only in the first fixing pad open portion 711-5 when the substrate 700 and the sensor substrate 241 are coupled. In contrast, the embodiment forms fixing pad open portions in adjacent regions of the first terminal open portion, as described above. This allows the embodiment to enable the first and second pads 241-2b of the sensor substrate 241 to connect with the substrate 700 at any of the four fixed pad open portions. This improves the ease of connecting the sensor substrate 241 and the substrate 700. However, the embodiment is not limited thereto, and the third fixed pad open portion 711-7 can be selectively omitted. Alternatively, the fixing pad of the third pad 241-3 of the sensor substrate 241 may also be located within the third fixed pad open portion 711-7.

[0149] Furthermore, the first insulating region 711 in the embodiment includes a fourth fixing pad open portion 711-8. The fourth fixing pad open portion 711-8 may be positioned adjacent to the first-to-fourth terminal open portions 711-4 of the first insulating region 711. The first-to-fourth terminal open portion 711-4 may have a fixing pad positioned in it corresponding to the third fixing pad open portion 711-7, or conversely, it may not have a fixing pad positioned there.

[0150] On the other hand, the insulating portion 710 in the embodiment includes a second insulating region 712 that is separated from the first insulating region 711 by the separation region 713.

[0151] The second insulating region 712 can include a plurality of second edge regions. For example, the second insulating region 712 can include a second edge region that faces the first edge region of the first insulating region 711 across the separation region 713. For example, the second insulating region 712 can include a second-first edge region R2-1 that faces the first-first edge region R1-1 of the first insulating region 711. For example, the second insulating region 712 can include a second-second edge region R2-2 that faces the first-second edge region R1-2 of the first insulating region 711. For example, the second insulating region 712 can include a second-third edge region R2-3 that faces the first-third edge region R1-3 of the first insulating region 711. For example, the second insulating region 712 can include a second-fourth edge region R2-4 that faces the first-fourth edge region R1-4 of the first insulating region 711.

[0152] Furthermore, the second insulating region 712 may include a second terminal open portion formed in the second edge region.

[0153] For example, the second insulating region 712 may include a second-first terminal open portion 712-1 formed in the second-first side region R2-1. The second-first terminal open portion 712-1 exposes a part of the pattern portion 720 arranged on the insulating portion 710. For example, the second-first terminal open portion 712-1 may expose a part of the second terminal portion 721-2 that constitutes the pattern portion 720. For example, the second-first terminal open portion 712-1 may expose a part of the second-first terminal 721-2a of the second terminal portion 721-2. That is, a part of the second-first terminal 721-2a of the second terminal portion 721-2 is arranged on the second insulating region 712, and the remaining part of the second-first terminal 721-2a of the second terminal portion 721-2 may be exposed through the second-first terminal open portion 712-1. For example, the second-first terminal 721-2a of the second terminal portion 721-2 may include a portion that overlaps with the second-first terminal open portion 712-1 in the optical axis direction. The second-first terminal open portion 712-1 may be formed for improved shoulder ring workability and electrical coupling testing.

[0154] The second-first terminal open portion 712-1 may be positioned off-center in one direction within the second-first side region R2-1 of the second insulating region 712. For example, in the embodiment, the second-first terminal open portion 712-1 may be positioned off-center in the +y axis direction within the second-first side region R2-1 of the second insulating region 712. This allows the embodiment to secure space for the connecting portions 721-3 of the pattern portion 720 in the separation region 713. That is, the pattern portion 720 of the embodiment connects the first terminal portion and the second terminal portion located in the first insulating region 711 and the second insulating region 712, which do not face each other. In this case, if the second-first terminal open portion 712-1 is positioned in the center of the second-first side region R2-1 of the second insulating region 712, the density of the connecting portions 721-3 in the separation region between the first-first side region R1-1 and the second-first side region R2-1 may increase. Furthermore, if the density of the connecting portions 721-3 increases, a problem may occur in which different connecting portions 721-3 come into contact with or connect to each other during the operation of the lens drive device. This can reduce the drive reliability. Therefore, the embodiment, as described above, arranges the second-first terminal open portion 712-1 biased in one direction in the second-first side region R2-1 of the second insulating region 712. As a result, the embodiment can reduce the density of the connecting portions 721-3 and improve the drive reliability of the lens drive device.

[0155] The second-first terminal open portion 712-1 is positioned opposite the first-first terminal open portion 711-1. In this case, the center of the second-first terminal open portion 712-1 may be offset from the center of the first-first terminal open portion 711-1 along the x-axis. Furthermore, the second-first terminal open portion 712-1 may have a closed-loop shape. This allows the embodiment to solve the problem of short circuits that occur during the operation of the lens drive device due to the second terminal open portion. This allows the embodiment to improve operational reliability.

[0156] Furthermore, a second terminal open portion having a structure corresponding to the 2-1 terminal open portion 712-1 is formed in the other second side region of the second insulating region 712.

[0157] For example, a second-second terminal open portion 712-2 may be formed in the second-second side region R2-2 of the second insulating region 712. For example, a second-third terminal open portion 712-3 may be formed in the second-third side region R2-3 of the second insulating region 712. For example, a second-fourth terminal open portion 712-4 may be formed in the second-fourth side region R2-4 of the second insulating region 712.

[0158] On the other hand, the second insulating region 712 may include a first coupling hole 712-5 formed in the corner region. The first coupling hole 712-5 may be for coupling the second insulating region 712 with other components of the lens drive device.

[0159] On the other hand, the substrate 700 of the embodiment includes a pattern portion 720 disposed on the insulating portion 710. The pattern portion 720 can be divided into a first pattern portion 721 and a second pattern portion 722 depending on its function. The first pattern portion 721 may represent a signal transmission pattern for electrically connecting the sensor substrate 241 and the main substrate 110. For example, the first pattern portion 721 may be a signal pattern portion. The second pattern portion 722 may be a reinforcing pattern portion for improving the rigidity of the substrate 700. For example, the second pattern portion 722 may be a dummy pattern portion that does not transmit electrical signals. For example, the second pattern portion 722 may not be electrically connected to the first pattern portion 721. As a result, the second pattern portion 722 may not be electrically connected to the sensor substrate 241 and the main substrate 110. However, the embodiment is not limited thereto. For example, the second pattern portion 722 may be connected to a ground layer (not shown) included in the sensor substrate 241. For example, the second pattern portion 722 can be connected to a ground layer (not shown) included in the main substrate 110. This allows the second pattern portion 722 to perform a ground function while dissipating heat generated on the substrate 700.

[0160] The pattern portion 720 may include a conductive metallic material. For example, the first pattern portion 721 and the second pattern portion 722 may be formed from the same conductive metallic material. However, the embodiments are not limited thereto, and the first pattern portion 721 and the second pattern portion 722 may also include different metallic materials.

[0161] The second pattern portion 722 may include a second-first pattern portion 722-1 and a second-second pattern portion 722-2. The second-first pattern portion 722-1 may be located on the first insulating region 711. The second-first pattern portion 722-1 may be located in the central region of the upper surface of the first insulating region 711.

[0162] Furthermore, the 2-1 pattern portion 722-1 may include a second open region OR that exposes a portion of the surface of the first insulating region 711. The 2-1 pattern portion 722-1 can improve the rigidity of the first insulating region 711. Also, the 2-2 pattern portion 722-2 may be positioned on the second insulating region 712 of the insulating portion 710. The 2-2 pattern portion 722-2 may be separated from the 2-1 pattern portion 722-1. The 2-2 pattern portion 722-2 can improve the rigidity of the second insulating region 712. The 2-2 pattern portion 722-2 may include a coupling hole (not shown) that is aligned with the coupling hole 712-5 formed in the second insulating region 712 of the insulating portion 710. On the other hand, the 2-1 pattern portion 722-1 may be formed with a first terminal open portion exposed on the first insulating region 711. Furthermore, the second-second pattern portion 722-2 may be formed with a second terminal open portion exposed on the second insulating region 712.

[0163] The second-first pattern portion 722-1 and the second-second pattern portion 722-2 may have a constant width. In this case, the second-first pattern portion 722-1 may be arranged on the first insulating region 711 with a width smaller than that of the first insulating region 711. For example, the upper surface of the first insulating region 711 may include a first portion 711a covered by the second-first pattern portion 722-1 and a second portion 711b excluding the first portion 711a. The second portion 711b of the upper surface of the first insulating region 711 may be the edge region of the upper surface of the first insulating region 711. For example, the second-first pattern portion 722-1 may be arranged with the edge region of the upper surface of the first insulating region 711 open.

[0164] The second-second pattern portion 722-2 may be arranged on the second insulating region 712 with a width smaller than the second insulating region 712. For example, the upper surface of the second insulating region 712 may include a third portion 712a covered by the second-second pattern portion 722-2 and a fourth portion 712b excluding the third portion 712a. The fourth portion 712b of the upper surface of the second insulating region 712 may be the edge region of the upper surface of the second insulating region 712. For example, the second-second pattern portion 722-2 may be arranged with the edge region of the upper surface of the second insulating region 712 open.

[0165] The second-first pattern portion 722-1 and the second-second pattern portion 722-2 can be separated from each other. The second-first pattern portion 722-1 and the second-second pattern portion 722-2 may not be connected to each other by any metal other than the first pattern portion which is a signal wiring. This allows the embodiment to improve the mobility of the sensor drive device. Specifically, if the first insulating region 711 and the second insulating region 712 are connected by a metal other than the first pattern portion 721, this may hinder the movement of the sensor substrate placed on the first insulating region 711. This may reduce the mobility of the sensor drive device. Therefore, the embodiment ensures that the first insulating region 711 and the second insulating region 712 are not connected by a metal other than the first pattern portion 721. This allows the embodiment to improve the movement accuracy of the first moving part placed on the first insulating region 711.

[0166] The first pattern portion 721 may be positioned on the insulating portion 710. For example, the first pattern portion 721 may be positioned on the first insulating region 711, the second insulating region 712, and the separation region 713 of the insulating portion 710. The first pattern portion 721 may be electrically insulated from the second pattern portion 722.

[0167] The first pattern portion 721 may include a first terminal portion 721-1, a second terminal portion 721-2, and a connecting portion 721-3.

[0168] The first pattern portion 721 can enable the first moving portion 200 to move relative to the fixed portion 100 while electrically connecting the main substrate 110 and the sensor substrate 241. For this purpose, the first pattern portion 721 can have elasticity. The first pattern portion 721 can be formed of an alloy containing copper (Cu). For example, the first pattern portion 721 can be a binary alloy containing at least one of copper (Cu), nickel (Ni), tin (Sn), beryllium (Be), and cobalt (Co), and can be a ternary alloy containing at least two of them.

[0169] However, the embodiments are not limited thereto, and the first pattern portion 721 can also include alloys such as iron (Fe), nickel (Ni), and zinc, which have good electrical characteristics while having an elastic force capable of serving as a spring. Also, the first pattern portion 721 can be surface-treated with a metal material or an organic material. Preferably, the first pattern portion 721 can be coated with an organic substance.

[0170] Specifically, the first pattern portion 721 can have a characteristic value above a certain level that does not break even when the first moving portion 200 moves.

[0171] For example, the first pattern portion 721 can have a tensile strength and a 0.2% offset yield strength above a certain level. For example, the first pattern portion 721 can have a tensile strength of 500 N / mm 2 or more. For example, the first pattern portion 721 can have a tensile strength of 800 N / mm 2 or more. For example, the first pattern portion 721 can have a tensile strength of 1000 N / mm 2 or more. For example, the first pattern portion 721 can have a tensile strength of 1400 N / mm 2 or more. For example, the first pattern portion 721 can have a tensile strength of 500 N / mm 2It can have a 0.2% offset yield strength of the above. For example, the first pattern portion 721 can have a yield strength of 800 N / mm². 2 It can have a 0.2% offset yield strength of the above. For example, the first pattern portion 721 can have a yield strength of 1000 N / mm². 2 It can have a 0.2% offset yield strength of the above. For example, the first pattern portion 721 can have a yield strength of 1400 N / mm². 2 It can have the above 0.2% offset yield strength.

[0172] On the other hand, the first pattern portion 721 includes a surface that contacts the first insulating region 711 and the second insulating region 712. For example, a portion of the first terminal portion 721-1 and a portion of the second terminal portion 721-2 of the first pattern portion 721 contact the first insulating region 711 and the second insulating region 712. In this case, the reliability of the substrate 700 can be determined by the roughness of the contacting surface.

[0173] In this case, if the contacting surface has a centerline average roughness Ra in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm, the first pattern portion 721 may detach from the insulating portion 710.

[0174] As a result, the surface of the first pattern portion 721 in the embodiment can have a surface roughness of a certain level or higher. For example, the surface roughness of the first pattern portion 721 may affect the adhesion force with the insulating portion 710.

[0175] For example, in the embodiment, the surface of the first pattern portion 721 may have a centerline average roughness Ra in the range of 0.05 μm to 0.5 μm. For example, the surface of the first pattern portion 721 in the embodiment may have a centerline average roughness Ra in the range of 0.05 μm to 0.2 μm. For example, the surface of the first pattern portion 721 in the embodiment may have a centerline average roughness Ra in the range of 0.08 μm to 0.15 μm. For example, the surface of the first pattern portion 721 in the embodiment may have a 10-point average roughness Rz in the range of 0.6 to 5 μm. For example, the surface of the first pattern portion 721 in the embodiment may have a 10-point average roughness Rz in the range of 0.7 to 3.0 μm. For example, the surface of the first pattern portion 721 in the embodiment may have a 10-point average roughness Rz in the range of 1.0 to 2.5 μm.

[0176] The first pattern portion 721 may include a first terminal portion 721-1, a second terminal portion 721-2, and a connecting portion 721-3. In this case, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 are distinguished only for the purpose of describing the configuration, and they can be formed integrally with one another.

[0177] The first terminal portion 721-1 may be formed in the first side region of the first insulating region 711. Furthermore, at least a portion of the first terminal portion 721-1 may be exposed through the first terminal open portion of the first insulating region 711.

[0178] The first terminal portion 721-1 may include a plurality of first terminals arranged in different side regions of the first insulating region 711. The plurality of first terminals may be arranged adjacent to different corner portions of the four corner portions of the separation region 713. This allows the embodiment to perform tilting at the corner portions (corner portions) of the substrate 700 more than tilting at the side regions when the movable portion moves. This improves the mobility of the movable portion. Furthermore, the embodiment can improve the accuracy of the overall module tilting by having the tilting occur at the corner portions where the multiple connecting portions 723 are arranged. The connecting portions 723 are arranged densely in the corner portions of the separation region 713 while having bent portions. This improves the mobility of the movable portion by having the second terminal portions 721-2 arranged adjacent to different corner portions.

[0179] For example, the first terminal portion 721-1 may include a plurality of first-first terminals 721-1a arranged in the first-first side region R1-1 of the first insulating region 711. The plurality of first-first terminals 721-1a may correspond to the first pad 241-1 of the sensor substrate 241. A portion of the first-first terminals 721-1a is arranged on the first-first side region R1-1 of the first insulating region 711. The remaining portion of the first-first terminals 721-1a may be exposed through the first-first terminal open portion 711-1 of the first insulating region 711. The first-first terminals 721-1a may be arranged adjacent to the first corner portion CN1 of the separation region 713.

[0180] For example, the first terminal portion 721-1 may include a plurality of first- and second terminals 721-1b arranged in the first- and second-side regions R1-2 of the first insulating region 711. The plurality of first- and second terminals 721-1b may correspond to the second pad 241-2 of the sensor substrate 241. A portion of the first- and second terminals 721-1b is arranged on the first- and second-side regions R1-2 of the first insulating region 711. The remaining portion of the first- and second terminals 721-1b may be exposed through the first- and second terminal open portion 711-2 of the first insulating region 711. The first- and second terminals 721-1b may be arranged adjacent to the second corner portion CN2 of the separation region 713.

[0181] For example, the first terminal portion 721-1 may include a plurality of first to third terminals 721-1c) arranged in the first to third side regions R1-3 of the first insulating region 711. The plurality of first to third terminals 721-1c may correspond to the third pad 241-3 of the sensor substrate 241. A portion of the first to third terminals 721-1c is arranged on the first to third side regions R1-3 of the first insulating region 711. The remaining portion of the first to third terminals 721-1c may be exposed through the first to third terminal open portion 711-3 of the first insulating region 711. The first to third terminals 721-1c may be arranged adjacent to the third corner portion CN3 of the separation region 713.

[0182] For example, the first terminal portion 721-1 may include a plurality of first to fourth terminals 721-1d) arranged in the first to fourth side regions R1-4 of the first insulating region 711. The plurality of first to fourth terminals 721-1d may correspond to the fourth pad 241-4 of the sensor substrate 241. A portion of the first to fourth terminals 721-1d is arranged on the first to fourth side regions R1-4 of the first insulating region 711. The remaining portion of the first to fourth terminals 721-1d may be exposed through the first to fourth terminal open portion 711-4 of the first insulating region 711. The first to fourth terminals 721-1d may be arranged adjacent to the fourth corner portion CN4 of the separation region 713.

[0183] The first terminal portion 721-1 can be electrically connected to the pad 241 of the sensor substrate 241.

[0184] The first pattern portion 721 may include a second terminal portion 721-2 connected to the main board 110. The second terminal portion 721-2 may include a plurality of second terminals arranged in different side regions of the second insulating region 712. The plurality of second terminals may be arranged adjacent to different corner portions of the four corner portions of the separation region 713.

[0185] The second terminal portion 721-2 may include a plurality of second-first terminals 721-2a formed in the second-first side region R2-1 of the second insulating region 712. The plurality of second-first terminals 721-2a may correspond to the pads 116 of the main substrate 110. A portion of the second-first terminals 721-2a is arranged on the second-first side region R2-1 of the second insulating region 712. The remaining portion of the second-first terminals 721-2a may be exposed through the second-first terminal open portion 712-1 of the second insulating region 712. The second-first terminals 721-2a may be arranged adjacent to the third corner portion CN3 of the separation region 713.

[0186] For example, the second terminal portion 721-2 may include a plurality of second-second terminals 721-2b formed in the second-second side region R2-2 of the second insulating region 712. The plurality of second-second terminals 721-2b may correspond to the pads 116 of the main substrate 110. A portion of the second-second terminals 721-2b may be located on the second-second side region R2-2 of the second insulating region 712, and the remaining portion may be exposed through the second-second terminal open portion 712-2 of the second insulating region 712. The second-second terminals 721-2b may be located adjacent to the fourth corner portion CN4 of the separation region 713.

[0187] For example, the second terminal portion 721-2 may include a plurality of second- and third terminals 721-2c formed in the second- and third-side regions R2-3 of the second insulating region 712. The plurality of second- and third terminals 721-2c may correspond to the pads 116 of the main substrate 110. A portion of the second- and third terminals 721-2c may be located on the second- and third-side regions R2-3 of the second insulating region 712, and the remaining portion may be exposed through the second- and third terminal open portion 712-3 of the second insulating region 712. The second- and third terminals 721-2c may be located adjacent to the second corner portion CN2 of the separation region 713.

[0188] For example, the second terminal portion 721-2 may include a plurality of second-to-fourth terminals 721-2d formed in the second-to-fourth side region R2-4 of the second insulating region 712. The plurality of second-to-fourth terminals 721-2d may correspond to the pads 116 of the main substrate 110. A portion of the second-to-fourth terminals 721-2d may be located on the second-to-fourth side region R2-4 of the second insulating region 712, and the remaining portion may be exposed through the second-to-third terminal open portion 712-4 of the second insulating region 712. The second-to-fourth terminals 721-2d may be located adjacent to the first corner portion CN1 of the separation region 713.

[0189] On the other hand, the connecting portion 721-3 can connect the first terminal portion 721-1 and the second terminal portion 721-2.

[0190] The connecting portion 721-3 does not connect the first terminal portion and the second terminal portion, which are located in opposite side regions. Preferably, the connecting portion 721-3 connects the first terminal portion and the second terminal portion, which are located in side regions that are not opposite each other.

[0191] The connecting portion 721-3 may not overlap with the insulating portion 710 in the optical axis direction. For example, the connecting portion 721-3 may be positioned flying in the separation region 713 of the insulating portion 710.

[0192] As a result, the embodiment can improve the mobility of the first movable part 200 by the connecting part 721-3. That is, the embodiment can improve the mobility of the first movable part 200 by improving the elastic force of the connecting part 721-3.

[0193] For example, the connecting portion 721-3 may include the first connecting portion 721-3a.

[0194] The first connecting portion 721-3a can connect the 1-1 terminal 721-1a of the first terminal portion 721-1 and the 2-4 terminal 721-2d of the second terminal portion 721-2. As a result, the first connecting portion 721-3a can include at least one bent portion BP1. The first connecting portion 721-3a connects the first terminal portion 721-1 and the second terminal portion 721-2, which are respectively located in different side regions. As a result, at least a part of the first connecting portion 721-3a can be located in the corner portion of the separation region 713. For example, the separation region 713 can include four corner portions CN1, CN2, CN3, and CN4. The first connecting portion 721-3a can include the first bent portion BP1 formed in the first corner portion CN1 region of the four corner portions of the separation region 713. The first connecting portion 721-3a may include one end connected to the first-1 terminal 721-1a and the other end extending counterclockwise from the first end and connected to the second-4 terminal 721-2d. The first bent portion BP1 of the first connecting portion 721-3a may be bent starting from the first end with the counterclockwise direction of rotation.

[0195] Furthermore, the connecting portion 721-3 may include a second connecting portion 721-3b.

[0196] The second connecting portion 721-3b can connect the first and second terminals 721-1b of the first terminal portion 721-1 and the second and third terminals 721-2c of the second terminal portion 721-2. As a result, the second connecting portion 721-3b can include at least one bent portion BP2. The second connecting portion 721-3b connects the first terminal portion 721-1 and the second terminal portion 721-2, which are respectively located in different side regions as described above. As a result, the second connecting portion 721-3b can include a second bent portion BP2 formed in the second corner portion CN2. The second connecting portion 721-3b can have one end connected to the first and second terminals 721-1b and the other end extending counterclockwise from the one end and connected to the second and third terminals 721-2c. Furthermore, the second bent portion BP2 of the second connecting portion 721-3b can be bent starting from one end and with the counterclockwise direction of rotation. The second bent portion BP2 of the second connecting portion 721-3b can be bent and extended in the same direction as the first connecting portion 721-3a.

[0197] Furthermore, the connecting portion 721-3 may include a third connecting portion 721-3c.

[0198] The third connecting portion 721-3c can connect the first to third terminals 721-1c of the first terminal portion 721-1 and the second to first terminal 721-2a of the second terminal portion 721-2. As a result, the third connecting portion 721-3c can include at least one bent portion BP3. The third connecting portion 721-3c connects the first terminal portion 721-1 and the second terminal portion 721-2, which are arranged in different side regions as described above. As a result, the third connecting portion 721-3c can include a third bent portion BP3 formed in the third corner portion CN3. The third connecting portion 721-3c can have one end connected to the first to third terminals 721-1c and the other end extending counterclockwise from the one end and connected to the second to first terminal 721-2a. Furthermore, the third bent portion BP3 of the third connecting portion 721-3c can be bent by rotating it counterclockwise, starting from one end. That is, the third bent portion BP3 of the third connecting portion 721-3c can be extended by bending in the same direction as the first connecting portion 721-3a and the second connecting portion 721-3b.

[0199] The aforementioned connecting portion 721-3 may include a fourth connecting portion 721-3d.

[0200] The fourth connecting portion 721-3d can connect the first to fourth terminals 721-1d of the first terminal portion 721-1 and the second to second terminal 721-2b of the second terminal portion 721-2. As a result, the fourth connecting portion 721-3d can include at least one bent portion BP4. The fourth connecting portion 721-3d connects the first terminal portion 721-1 and the second terminal portion 721-2, which are respectively located in different side regions as described above. As a result, the fourth connecting portion 721-3d can include a fourth bent portion BP4 formed in the fourth corner portion CN4. The fourth connecting portion 721-3d includes one end connected to the first to fourth terminals 721-1d and the other end extending counterclockwise from the one end and connected to the second to second terminal 721-2b. Furthermore, the fourth bent portion BP4 of the fourth connecting portion 721-3d can be bent by rotating from one end with the counterclockwise direction of rotation. That is, the fourth bent portion BP4 of the fourth connecting portion 721-3d can be bent in the same direction as the first connecting portion 721-3a, the second connecting portion 721-3b, and the third connecting portion 721-3c.

[0201] The connecting portion 721-3 of the embodiment includes a plurality of connecting portions that connect the first terminal portion 721-1 and the second terminal portion 721-2. Each of the plurality of connecting portions includes a bent portion located at different corners of the separation region 713. In this case, the bent portions of the plurality of connecting portions can be bent and extended with the same direction of rotation as each other. This allows the embodiment to improve the reliability of the connecting portion 721-3. Furthermore, the embodiment can improve the mobility of the first moving portion 200 by the lens driving device.

[0202] For example, if the bent portions of the multiple connecting parts are bent in different directions of rotation, different forces may act on each connecting part when the first movable part 200 moves. This may reduce the mobility of the first movable part 200. Furthermore, if the bent portions of the multiple connecting parts are bent in different directions of rotation, force may concentrate on a particular connecting part among the connecting parts. This may cause the connecting part where the force is concentrated to break before the other connecting parts.

[0203] In contrast, the embodiment ensures that the bent portions of the multiple connecting parts are bent in the same direction as the rotational direction. This allows the force acting on each connecting part to be uniformly distributed when the first movable part 200 moves. As a result, the embodiment can improve the mobility of the first movable part 200. Furthermore, by uniformly distributing the force acting on each connecting part, the embodiment can solve the problem of a particular connecting part breaking first. Moreover, even if the problem of a connecting part breaking occurs, all connecting parts can be made to break at the same time. As a result, the embodiment can improve the tilting characteristics of the first movable part 200.

[0204] On the other hand, the connecting portion 721-3 may not be supported by the first insulating region 711 and the second insulating region 712. For example, the connecting portion 721-3 may include a portion that does not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction. The bent portion of the connecting portion 721-3 does not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction. For example, the connecting portion 721-3 may be positioned in a flying state on the separation region 713.

[0205] On the other hand, the number of the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 in the embodiment may be the same. For example, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 may be connected to each other in a 1:1 ratio.

[0206] For example, the 1-1 terminal 721-1a of the first terminal section 721-1, the 2-4 terminal 721-2d of the second terminal section 721-2, and the first connecting section 721-3a can be connected to each other in a 1:1 ratio. As a result, the number of 1-1 terminals 721-1a of the first terminal section 721-1, the number of 2-4 terminals 721-2d of the second terminal section 721-2, and the number of first connecting sections 721-3a can be the same as each other.

[0207] Furthermore, the first and second terminals 721-1b of the first terminal section 721-1, the second and third terminals 721-2c of the second terminal section 721-2, and the second connecting section 721-3b can be connected to each other in a 1:1 ratio. As a result, the number of first and second terminals 721-1b of the first terminal section 721-1, the number of second and third terminals 721-2c of the second terminal section 721-2, and the number of second connecting sections 721-3b can be the same as each other.

[0208] The first to third terminals 721-1c of the first terminal section 721-1, the second to first terminal 721-2a of the second terminal section 721-2, and the third connecting section 721-3c can be connected to each other in a 1:1 ratio. The number of the first to third terminals 721-1c of the first terminal section 721-1, the number of the second to first terminal 721-2a of the second terminal section 721-2, and the number of the first three connecting sections 721-3c can be the same as each other.

[0209] Furthermore, the first to fourth terminals 721-1d of the first terminal section 721-1, the second to second terminal 721-2b of the second terminal section 721-2, and the fourth connecting section 721-3d can be connected to each other in a 1:1 ratio. As a result, the number of the first to fourth terminals 721-1d of the first terminal section 721-1, the number of the second to second terminal 721-2b of the second terminal section 721-2, and the number of the fourth connecting section 721-3d can be the same as each other.

[0210] On the other hand, the number of first terminals of the first terminal portions 721-1 arranged in different first-side regions of the first insulating region 711 may be the same. For example, the 1-1 terminal 721-1a, the 1-2 terminal 721-1b, the 1-3 terminal 721-1c, and the 1-4 terminal 721-1d may have the same number of each other.

[0211] Furthermore, the number of second terminals of the second terminal portions 721-2 arranged in different second side regions of the second insulating region 712 may be the same. For example, the second-first terminal 721-2a, the second-second terminal 721-2b, the second-third terminal 721-2c, and the second-fourth terminal 721-2d may have the same number of each other.

[0212] Furthermore, the number of connecting parts located at different corners of the separation region 713 may be the same for all of them. For example, the first connecting part 721-3a, the second connecting part 721-3b, the third connecting part 721-3c, and the fourth connecting part 721-3d may each have the same number.

[0213] In this embodiment, the number of first terminals 721-1, second terminals 721-2, and connecting parts 721-3 are made the same, thereby improving the mobility of the first movable part 200. For example, if the first terminals, second terminals, and connecting parts are concentrated in a particular area, or if the number of first terminals, second terminals, and connecting parts in a particular area is greater than in other areas, a difference may occur between the amount of movement in the concentrated area and the amount of movement in the parts where they are located. This can reduce the mobility of the first movable part 200. Therefore, in this embodiment, the first movable part is distributed across the four first side areas of the first insulating area 711, the four second side areas of the second insulating area 712, and the four corner areas of the separation area 713. Thus, in this embodiment, the mobility of the first movable part 200 can be improved, and the operational reliability can be improved as a result.

[0214] On the other hand, the number of each of the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 can correspond to the number of signal channels transmitted and received between the main board 110 and the sensor board 241. For example, the number of communication channels between the main board 110 and the sensor board 241 may be 32.

[0215] As a result, the number of the first terminals 721-1 may be 32. For example, the number of each of the first-first terminal 721-1a, the first-second terminal 721-1b, the first-third terminal 721-1c, and the first-fourth terminal 721-1d may be 8.

[0216] Furthermore, the number of the second terminals 721-2 may be 32. As a result, the number of each of the second-first terminal 721-2a, second-second terminal 721-2b, second-third terminal 721-2c, and second-fourth terminal 721-2d may be 8.

[0217] Furthermore, the number of connecting sections 721-3 may be 32. This means that the number of first connecting sections 721-3a, second connecting sections 721-3b, third connecting sections 721-3c, and fourth connecting sections 721-3d may each be 8. However, the number of communication channels is not limited to 32 and may increase or decrease.

[0218] The thickness of the first pattern portion 721 can be 10 μm to 60 μm. For example, the thickness of the first pattern portion 721 can be 15 μm to 50 μm. For example, the thickness of the first pattern portion 721 can be 20 μm to 45 μm.

[0219] If the thickness of the first pattern portion 721 is less than 10 μm, the first pattern portion 721 may easily break when the first movable portion 200 moves. Also, if the thickness of the first pattern portion 721 is greater than 60 μm, the elastic force of the connecting portion 721-3 may decrease. This can hinder the mobility of the first movable portion 200. For example, if the thickness of the first pattern portion 721 is greater than 60 μm, the decrease in elastic force may increase the driving force required to move the first movable portion 200. This may increase power consumption. Therefore, in this embodiment, the first pattern portion 721 has a thickness of 35 μm ± 5 μm so that the first movable portion 200 can move stably.

[0220] Furthermore, the length of the connecting portion 721-3 can be 1.5 times or more the width of the separation region 713. The length of the connecting portion 721-3 can be 20 times or less the width of the separation region 713. In this case, the width of the separation region 713 may be 1.5 mm. If the length of the connecting portion 721-3 is less than 1.5 times the width of the separation region 713, the mobility of the first movable portion 200 may decrease due to a decrease in the elastic force of the connecting portion 721-3. Also, if the length of the connecting portion 721-3 is greater than 20 times the width of the separation region 713, the transmission distance of the signal transmitted through the connecting portion 721-3 may increase. As a result, the resistance of the connecting portion 721-3 may increase, and the noise characteristics of the signal may decrease.

[0221] The following will provide a more detailed explanation of the connecting portion 721-3.

[0222] As described above, the connecting portion 721-3 includes a plurality of connecting portions arranged at a plurality of corners of the separation region 713. The plurality of connecting portions include bent portions that are bent at different corners of the separation region 713 based on the same direction of rotation.

[0223] For example, the connecting portion 721-3 is positioned at the first corner portion CN1 of the separation region 713 and includes a first connecting portion 721-3a which includes the first bent portion BP1.

[0224] Furthermore, the first bent portion BP1 of the first connecting portion 721-3a may be positioned to avoid a portion of the first corner portion CN1. For example, the bent portion BP1 of the first connecting portion 721-3 may include a first open region OR that opens a portion of the first corner portion CN1. The first connecting portion 721-3a may be positioned inside and outside the first open region OR while avoiding the first open region OR.

[0225] The first open region OR may be a region that overlaps with the projection of the second frame in the optical axis direction or perpendicularly. In this case, the embodiment may be for providing a space in which the projection of the second frame 210 can move. For example, the projection of the second frame 210 may be positioned to pass through the first open region OR1 of the connecting portion 732. This allows the embodiment to reduce the overall thickness of the camera module. The embodiment can also prevent the connecting portion 732 from being damaged by the projection of the second frame 210.

[0226] For example, the first connecting portion 721-3a may include an outer connecting portion 721-3a1 located outside the first open region OR and an inner connecting portion 721-3a2 located inside the first open region OR.

[0227] The outer connecting portion 721-3a1 may be located outside the first open region OR. For example, the outer connecting portion 721-3a1 may be located further away from the first insulating region 711 than the inner connecting portion 721-3a2. For example, the outer connecting portion 721-3a1 may be located adjacent to the second insulating region 712. The inner connecting portion 721-3a2 may be located inside the first open region OR. For example, the inner connecting portion 721-3a2 may be located further away from the second insulating region 712 than the outer connecting portion 721-3a1. For example, the inner connecting portion 721-3a2 may be located adjacent to the first insulating region 711.

[0228] In this case, the number of outer connecting portions 721-3a1 may differ from the number of inner connecting portions 721-3a2. For example, the first connecting portion 721-3a may include six lines. Some of the six lines of the first connecting portion 721-3a may constitute the outer connecting portion 721-3a1, and the remaining part may constitute the inner connecting portion 721-3a2. The number of lines constituting the outer connecting portion 721-3a1 may differ from the number of lines constituting the inner connecting portion 721-3a2. Preferably, the number of lines in the outer connecting portion 721-3a1 may be greater than the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connecting portion 721-3a1 may be 1.5 times or more the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connecting portion 721-3a1 may be 1.7 times or more the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connecting portion 721-3a1 may be 2 times or more the number of lines in the inner connecting portion 721-3a2.

[0229] For example, if the first connecting portion 721-3a has six lines, the outer connecting portion 721-3a1 may have four lines, and the inner connecting portion 721-3a2 may have two lines. As a result, the outer connecting portion 721-3a1 can include the first to fourth outer connecting portions 721-3a11, 721-3a12, 721-3a13, and 721-3a14. Also, the inner connecting portion 721-3a2 can include the first and second inner connecting portions 721-3a21 and 721-3a22.

[0230] In this embodiment, the number of outer connecting portions 721-3a1 of the first connecting portion 721-3a, which is located outside the first open region OR, is greater than the number of inner connecting portions 721-3a2 of the first connecting portion 721-3a, which is located inside the first open region OR. This allows the embodiment to improve the mobility of the first movable portion 200. For example, when the number of outer connecting portions 721-3a1 is greater than the number of inner connecting portions 721-3a2, the amount of movement of the first movable portion 200 can be adjusted more easily than in the opposite case. For example, the outer connecting portion 721-3a1 can have a length greater than the length of the inner connecting portion 721-3a2, located outside the first open region OR. And because the length of the outer connecting portion 721-3a1 is longer than the length of the inner connecting portion 721-3a2, the strength of the driving force required to move the first movable portion 200 can be reduced. As a result, the embodiment can improve the mobility of the first movable part 200 by having more outer connecting parts 721-3a1 than inner connecting parts 721-3a2. Furthermore, the embodiment can finely adjust the amount of movement of the first movable part 200.

[0231] On the other hand, each of the outer connecting portion 721-3a1 and the inner connecting portion 721-3a2 includes a plurality of bending points.

[0232] In this case, the number of bends in the outer connecting portion 721-3a1 may be the same as the number of bends in the inner connecting portion 721-3a2. For example, the number of bends in the outer connecting portion 721-3a1 may be the same as the number of bends in the inner connecting portion 721-3a2. As an example, the outer connecting portion 721-3a1 may have five bends. For example, the outer connecting portion 721-3a1 may have the 1-1 bend A1, 1-2 bend A2, 1-3 bend A3, 1-4 bend A4, and 1-5 bend A5 from the end connected to the first terminal portion. Correspondingly, the inner connecting portion 721-3a2 may also have five bends. For example, the inner connecting portion 721-3a2 may include a second-first bending point B1, a second-second bending point B2, a second-third bending point B3, a second-fourth bending point B4, and a second-fifth bending point B5 from one end connected to the first terminal portion.

[0233] However, the number of bending points in the outer connecting portion 721-3a1 and the inner connecting portion 721-3a2 may be four or less, or conversely, six or more.

[0234] As described above, the embodiment can improve the mobility of the first movable part 200 by making the number of bends of the outer connecting part 721-3a1 the same as the number of bends of the inner connecting part 721-3a2. For example, if the number of bends of the outer connecting part 721-3a1 and the number of bends of the inner connecting part 721-3a2 are different, force may be concentrated in the connecting part that has more bends. This may cause the connecting part where the force is concentrated to break before the other connecting parts. Furthermore, problems may occur with the movement accuracy of the first movable part 200.

[0235] Therefore, in this embodiment, the number of bending points of the outer connecting portion 721-3a1 and the number of bending points of the inner connecting portion 721-3a2 are made the same. This allows the force applied to the inner connecting portion 721-3a2 and the outer connecting portion 721-3a1 when the first movable portion 200 moves to be uniformly distributed. As a result, this embodiment can solve the problem of a particular connecting portion breaking first. Furthermore, even if the connecting portion breaks, this embodiment can ensure that the inner connecting portion 721-3a2 and the outer connecting portion 721-3a1 break at the same time.

[0236] Furthermore, when the first movable part 200 moves, rotational or tilting forces are concentrated at the respective bending points of the inner connecting part 721-3a1 or the outer connecting part 721-3a2. In this case, the embodiment can prevent forces from concentrating at specific bending points by making the number of inner connecting parts 721-3a1 and outer connecting parts 721-3a2 the same. Moreover, the embodiment can adjust the difference in the number of bending points between the inner connecting part 721-3a1 and the outer connecting part 721-3a2 to be within 40%, 20%, or 10%. This makes it possible for the embodiment to prevent a specific connecting part from breaking due to the concentration of force at a specific bending point.

[0237] The main substrate 110 is electrically connected to the first terminal portion 721-1 of the substrate 700. The sensor substrate 241 is electrically connected to the second terminal portion 721-2 of the conductive pattern portion 721 of the substrate 700. At this time, a connecting portion 721-3 having elastic force while electrically connecting the first terminal portion 721-1 and the second terminal portion 721-2 may be formed between them. As a result, the main substrate 110 and the sensor substrate 241 can be electrically connected to each other. The first movable portion 200 constituting the sensor substrate 241 can rotate about the x-axis or y-axis by the elastic force of the connecting portion 721-3. On the other hand, the sensor substrate 241 can be electrically connected to the third drive member 330.

[0238] For this purpose, the embodiment may include the connecting spring portion 800. The connecting spring portion 800 may include a first connecting spring portion 810. One end of the first connecting spring portion 810 is connected to the sensor substrate 241. The other end of the first connecting spring portion 810 is connected to one end of the second lower elastic member 620. The other end of the second lower elastic member 620 may be electrically connected to one end of the third drive member 330. The connecting spring portion 800 may also include a second connecting spring portion 820. One end of the second connecting spring portion 820 is connected to the sensor substrate 241. The other end of the second connecting spring portion 820 is connected to the other end of the second lower elastic member 620. The other end of the second lower elastic member 620 may be connected to the other end of the third drive member 330. This allows the embodiment to apply a current of a specific strength in a specific direction to the third drive member 330. On the other hand, the second lower elastic member 620 includes a first portion that is connected to the first connecting spring portion 810. The second lower elastic member 620 may also include a second portion that is electrically insulated from the first portion and connected to the second connecting spring portion 820.

[0239] <Image sensor module> The following describes the image sensor module of the embodiment.

[0240] The image sensor module may include the sensor board 241, image sensor 242, and board 700 described above.

[0241] Furthermore, the image sensor module may further include a main board 100 coupled to the substrate 700. The substrate 700 corresponding to the interposer can be called the "first substrate," the sensor substrate 241 on which the image sensor 242 is placed can be called the "second substrate," and the main board 110 can be called the "third substrate."

[0242] Figure 5a is a cross-sectional view of an image sensor module according to the first embodiment.

[0243] Referring to Figure 5a, the image sensor module of the embodiment may correspond to Figures 1 to 4.

[0244] The image sensor module includes a circuit board 700.

[0245] A sensor board 241 is placed on the substrate 700. An image sensor 242 may be mounted on the sensor board 241.

[0246] For example, a first adhesive portion SB1 may be placed on the first terminal portion 721-1 of the substrate 700. A sensor substrate 241 may be placed on the first adhesive portion SB1. For example, the sensor substrate 241 may be attached to the substrate 700 via the first adhesive portion SB1. For example, pads 241-1 and 241-2 placed on the sensor substrate 241 may be electrically connected to the first terminal portion 721-1 of the substrate 700 via the first adhesive portion SB1.

[0247] Furthermore, the main board 110 may be arranged on the substrate 700. For example, the main board 110 may include a third open region and be arranged surrounding the sensor board 241.

[0248] For example, a second adhesive portion SB may be placed on the second terminal portion 721-2 of the substrate 700. The main substrate 110 may then be attached to the substrate 700 via the second adhesive portion SB. For example, a pad 116 of the main substrate 110 may be electrically connected to the second terminal portion 721-2 of the substrate 700 via the second adhesive portion SB.

[0249] Figure 5b is a cross-sectional view of an image sensor module relating to a modified example of Figure 5a.

[0250] Referring to Figure 5b, in the embodiment, the image sensor module may be arranged with the substrate 700 in an inverted state in Figure 5a, and the sensor substrate 241 may be bonded to the inverted substrate 700.

[0251] That is, the image sensor module includes a substrate 700.

[0252] On the substrate 700, a sensor substrate 241 is disposed. An image sensor 242 may be mounted on the sensor substrate 241.

[0253] At this time, different from FIG. 5a, the substrate 700 may be arranged such that the first pattern portion 721 and the second pattern portion 722 face downward.

[0254] Then, the pads of the first pattern portion 721 and the sensor substrate 241 may be directly opposed to each other at positions spaced apart at a certain interval through a first terminal open portion formed in the substrate 700.

[0255] A first bonding portion SB1 may be disposed in the first terminal open portion of the substrate 700. The sensor substrate 241 may be disposed on the first bonding portion SB1. For example, the sensor substrate 241 may be attached to the substrate 700 through the first bonding portion SB1. For example, pads 241-1 and 241-2 disposed on the sensor substrate 241 may be electrically connected to a first terminal portion 721-1 of the substrate 700 through the first bonding portion SB1. According to the modification, by disposing a part of the first bonding portion SB1 in the first terminal open portion, the separation distance between the substrate 700 and the sensor substrate 241 can be minimized. Thereby, the embodiment can reduce the thickness of the image sensor module.

[0256] Also, the main substrate 110 may be disposed on the substrate 700. For example, the main substrate 110 includes a third open region and may be disposed surrounding the sensor substrate 241.

[0257] And a second adhesive part SB may be disposed in the second terminal open part of the substrate 700. And the main substrate 110 may be disposed on the second adhesive part SB. For example, the main substrate 110 may be attached to the substrate 700 via the second adhesive part SB. For example, pads 116 disposed on the main substrate 110 may be electrically connected to the second terminal part 721-2 of the substrate 700 via the second adhesive part SB.

[0258] On the other hand, the image sensor module may be vulnerable to heat dissipation. That is, the structure has a structure in which heat generated by the image sensor 242 is confined within the accommodation space of the lens driving device.

[0259] Thereby, the embodiment makes it possible to enhance the heat dissipation property of the image sensor module.

[0260] FIG. 6 is a cross-sectional view showing an image sensor module according to a second embodiment.

[0261] Referring to FIG. 6, compared with the image sensor module of FIG. 5, the basic structure may be the same.

[0262] However, the image sensor module of the second embodiment may further include a heat dissipation part 930 for heat dissipation.

[0263] For this reason, in the image sensor module of the second embodiment, the first insulating region 711 of the insulating part 710 and the second-1 pattern part 722-1 of the second pattern part 722 may be different from the configuration of the image sensor module of the first embodiment.

[0264] The second-1 pattern part 722-1 of the second pattern part 722 in the embodiment does not include the second open region OR.

[0265] Furthermore, the first insulating region 711 of the insulating portion 710 may include through holes 711-9 that expose the lower surface of the second-first pattern portion 722-1. The through holes 711-9 of the first insulating region 711 may penetrate the upper and lower surfaces of the first insulating region 711. For example, the through holes 711-9 of the first insulating region 711 may expose the lower surface of the second-first pattern portion 722-1. For example, the through holes 711-9 of the first insulating region 711 may expose the upper surface of the heat dissipation portion 930 attached to the lower surface of the first insulating region 711.

[0266] As a result, the area of ​​the first insulating region 711 in the embodiment may be smaller than the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 may be 95% or less of the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 may be 90% or less of the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 may be 85% or less of the area of ​​the second-first pattern portion 722-1.

[0267] As a result, the 2-1 pattern portion 722-1 may include a first portion positioned on the upper surface of the first insulating region 711 and a second portion positioned on the through-hole 711-9 of the first insulating region 711. For example, the second portion of the 2-1 pattern portion 722-1 may overlap the through-hole 711-9 of the first insulating region 711 in the optical axis direction.

[0268] On the other hand, an adhesive layer 920 can be formed within the through-holes 711-9 of the first insulating region 711. The adhesive layer 920 can be formed while filling the interior of the through-holes 711-9 of the first insulating region 711. For example, the thickness of the adhesive layer 920 may be the same as the thickness or depth of the through-holes 711-9 of the first insulating region 711.

[0269] The adhesive layer 920 is positioned within the through-holes 711-9 of the first insulating region 711, and can bond the second-first pattern portion 722-1 and the heat dissipation portion 930. For example, the heat dissipation portion 930 can be attached to the lower surface of the first insulating region 711 via the adhesive layer 920. The adhesive layer 920 may include, but is not limited to, an adhesive member such as a thermosetting adhesive or a curing adhesive. The adhesive layer 920 may be, but is not limited to, a solder paste. However, it is preferable that the adhesive layer 920 includes a material with high thermal conductivity.

[0270] On the other hand, a sensor substrate 241 may be placed on the substrate 700, and an image sensor 242 may be mounted on the sensor substrate 241.

[0271] In this case, the sensor substrate 241 may include vias 241-5. The vias 241-5 of the sensor substrate 241 may be formed to penetrate the upper and lower surfaces of the sensor substrate 241. Furthermore, the vias 241-5 of the sensor substrate 241 may be formed of a metal material with high thermal conductivity.

[0272] As a result, the upper surface of the via 241-5 may come into direct contact with the lower surface of the image sensor 242.

[0273] On the other hand, an adhesive portion 910 may be placed on the lower surface of the via 241-5. For example, the adhesive portion 910 may be attached to the lower surface of the via 241-5. The adhesive portion 910 may be connected to the lower surface of the image sensor 242 via the via 241-5.

[0274] Furthermore, the adhesive portion 910 may be positioned on the second-first pattern portion 722-1. For example, the upper surface of the adhesive portion 910 may be in direct contact with the via 241-5 of the sensor substrate 241. For example, the lower surface of the adhesive portion 910 may be in direct contact with the second-first pattern portion 722-1 positioned on the first insulating region 711. This allows the embodiment to transfer heat generated in the image sensor 242 to the second-first pattern portion 722-1 via the via 241-5 of the sensor substrate 241 and the adhesive portion 910.

[0275] On the other hand, a heat dissipation portion 930 is arranged on the lower surface of the insulating portion 710 in the embodiment. For example, the heat dissipation portion 930 may be arranged on the lower surface of the first insulating region 711 of the insulating portion 710. For example, the heat dissipation portion 930 may be attached to the lower surface of the first insulating region 711 via the adhesive layer 920.

[0276] In the second embodiment, the via 241-5 and the second-first pattern portion 722-1 are connected via the adhesive portion 910. In the embodiment, the second-first pattern portion 722-1 and the heat dissipation portion 930 are connected via the adhesive layer 920. As a result, in the embodiment, the heat generated by the image sensor 242 is transferred to the heat dissipation portion 930 via the via 241-5, the adhesive portion 910, the second-first pattern portion 722-1, and the adhesive layer 920. As a result, in the embodiment, the heat generated by the image sensor 242 can be transferred to the substrate 700 more efficiently, thereby improving the heat dissipation characteristics.

[0277] On the other hand, the heat dissipation portion 930 in the second embodiment includes a first portion that contacts the adhesive layer 920 and a second portion that contacts the first insulating region 711. For example, the area of ​​the heat dissipation portion 930 in the second embodiment may be larger than the area of ​​the adhesive layer 920. For example, the area of ​​the heat dissipation portion 930 may be larger than the area of ​​the through-holes 711-9 formed in the first insulating region 711.

[0278] As a result, the embodiment can release the heat generated in the image sensor 242 to the outside, thereby improving the heat dissipation characteristics. Further, the embodiment can improve the operational reliability of the image sensor 242. Further, the embodiment can improve the quality of the image acquired by the image sensor 242.

[0279] FIG. 7 is a diagram showing an image sensor module according to a third embodiment.

[0280] Referring to FIG. 7, the image sensor module according to the third embodiment may be the same as the module of the image sensor module according to the second embodiment of FIG. 6, except for the structures of the adhesive layer 920a and the heat dissipation part 930a.

[0281] As described above, the heat dissipation part 930 according to the second embodiment was attached to the lower surface of the first insulating region 711 via the adhesive layer 920.

[0282] In contrast, the heat dissipation part 930a in the third embodiment may not contact the lower surface of the first insulating region 711.

[0283] For example, the heat dissipation part 930a in the third embodiment may be disposed in the through hole 711-9 of the first insulating region 711. For example, the thickness of the adhesive layer 920a in the third embodiment may be smaller than the depth of the through hole 711-9 of the first insulating region 711. Therefore, the adhesive layer 920a can fill only a part of the through hole 711-9 of the first insulating region 711.

[0284] And the heat dissipation part 930a in the embodiment may be attached to the adhesive layer 920a. For example, the heat dissipation part 930a in the embodiment may be attached to the adhesive layer 920a and disposed in the through hole 711-9 of the first insulating region 711.

[0285] According to the third embodiment, at least a portion of the heat dissipation section 930a is positioned within the through-hole 711-9 of the first insulating region 711. This reduces the thickness of the image sensor module. Furthermore, by reducing the thickness of the image sensor module, the embodiment can reduce the overall thickness of the lens drive unit. This allows the embodiment to slim down the camera module.

[0286] On the other hand, the layer structure of the pattern portion 720 in the embodiment will be described in detail below.

[0287] The pattern portion 720 may have a multilayer structure. For example, the pattern portion 720 may include a metal layer and a surface treatment layer. The metal layer of the pattern portion 720 may be the base material constituting the pattern portion 720. For example, the metal layer of the pattern portion 720 may be a rolled material. The surface treatment layer may be formed on the metal layer of the pattern portion 720. The surface treatment layer may be a surface protection layer that prevents oxidation of the pattern portion 720.

[0288] In other words, if the surface treatment layer is not formed on the surface of the metal layer of the pattern portion 720, oxidation and discoloration may occur on the exposed surface of the pattern portion 720. This may reduce electrical reliability.

[0289] Therefore, the embodiment forms a surface treatment layer on the metal layer of the pattern portion 720 to protect the surface of the metal layer of the pattern portion 720.

[0290] The surface treatment layer may be an organic coating layer. That is, the embodiment allows the surface treatment layer to be formed by coating the metal layer of the pattern portion 720 with an organic substance. In other words, conventionally, a surface treatment layer was formed by plating nickel (Ni) or gold (Au) on a metal layer. However, conventional surface treatment layers like the one described above are formed by plating with the metal material described above. In this case, when the surface treatment layer is formed with nickel, it is difficult to control the phosphorus concentration in the nickel plating bath, which leads to a problem of reduced process efficiency. Furthermore, if the phosphorus concentration in the nickel plating bath cannot be properly controlled, nickel oxidation occurs, resulting in a problem of black pad formation where the surface of the pattern portion 720 turns black. In this case, gold (Au) plating is not properly performed on the part where the black pad phenomenon occurs. As a result, when the pattern portion 720 is used as a chip mounting pad, it is difficult to properly plate the gold (Au), which leads to a problem of reduced chip bonding performance. Furthermore, when the surface treatment layer is formed with gold (Au) as in the conventional method, environmental problems may arise due to cyanide ions (CN-) present in the gold (Au) plating tank. In other words, cyanide ions in the gold plating tank are not environmentally friendly substances. This leads to the problem of requiring special equipment during wastewater treatment. Also, when the surface treatment layer is formed with nickel, signal interference occurs in the high-frequency band due to the magnetism of nickel. This leads to the problem of reduced electrical reliability of the pattern portion 720.

[0291] As a result, the embodiment uses an organic material, rather than a substance such as nickel or gold (Au), to form the surface treatment layer of the patterned portion 720.

[0292] The layer structure of the pattern portion 720 in the embodiment will be described in detail below.

[0293] Figure 8a is a diagram illustrating the layer structure of the patterned portion according to the first embodiment, Figure 8b is a diagram showing the chemical reaction equation of the surface treatment layer in Figure 8a, and Figure 8c is a diagram showing the surface of the surface treatment layer in Figure 8a.

[0294] The specific structure of the aforementioned pattern section 720 has been described in detail previously, so a further explanation will be omitted.

[0295] The first pattern portion 721 and the second pattern portion 722 may include a metal layer corresponding to the rolled material and a surface treatment layer formed on the metal layer.

[0296] For example, the first terminal portion 721-1 of the first pattern portion 721 includes a metal layer 721-11 disposed on the first insulating region 711 and a surface treatment layer 721-12 disposed on the metal layer 721-11.

[0297] For example, the second terminal portion 721-2 of the first pattern portion 721 includes a metal layer 721-21 disposed on the second insulating region 712 and a surface treatment layer 721-22 disposed on the metal layer 721-21.

[0298] For example, the connecting portion 721-3 of the first pattern portion 721 includes a metal layer 721-31 disposed on the separation region 713 of the insulating portion 710 and a surface treatment layer 721-32 disposed on the metal layer 721-31.

[0299] For example, the second-first pattern portion 722-1 of the second pattern portion 722 includes a metal layer 722-11 disposed on the first insulating region 711 and a surface treatment layer 722-12 disposed on the metal layer 722-11.

[0300] For example, the second-second pattern portion 722-2 of the second pattern portion 722 includes a metal layer 722-21 disposed on the second insulating region 712 and a surface treatment layer 722-22 disposed on the metal layer 722-21.

[0301] The surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 of the first pattern portion 721 and the second pattern portion 722, respectively, may be formed on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. For example, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may be formed by coating the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 with organic material.

[0302] In other words, the embodiment involves forming a surface treatment layer using organic material to protect the surfaces of the first pattern portion 721 and the second pattern portion 722.

[0303] The surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may be formed from non-conductive organic materials. However, the examples are not limited thereto. For example, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may be formed from any one of low-conductivity organic materials, inorganic materials, or composites thereof.

[0304] In this case, the organic material constituting the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 has a low relative permittivity ε. In this case, the relative permittivity ε affects the signal transmission speed v of the wiring constituting the pattern portion 720. For example, the signal transmission speed v can be determined by the following equation 1.

[0305]

number

[0306] Here, v is the signal transmission speed, ε is the relative permittivity of the material constituting the pattern portion 720, C is the speed of light, and K is an integer.

[0307] Here, the relative permittivity ε of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is 3.24. This is considerably smaller than the relative permittivity ε of nickel and gold (Au). For example, the relative permittivity ε of nickel and gold (Au) is 4 or more. As a result, the embodiment can improve the signal transmission speed v of the wiring that constitutes the pattern portion 720. As a result, the embodiment can improve the product reliability of the circuit board.

[0308] Furthermore, the thermal conductivity of the organic materials constituting the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is higher than that of conventional nickel or metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. As a result, the embodiment can increase the thermal conductivity of the pattern portion 720 including the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22.

[0309] In other words, the examples demonstrate that by applying surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 through an organic coating, thermal conductivity and heat dissipation characteristics can be improved.

[0310] On the other hand, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may be formed on at least one side of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 that constitute the pattern portion 720. For example, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may be formed on the exposed surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, respectively.

[0311] The first terminal portion 721-1 may include an upper surface, a side surface, and a lower surface. The upper surface and side surface of the first terminal portion 721-1 do not come into contact with other components of the circuit board. As a result, a surface treatment layer 721-12 of the first terminal portion 721-1 may be formed on the upper surface and side surface of the metal layer 721-11 of the first terminal portion 721-1.

[0312] However, the surface treatment layer may not be formed on at least a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1. For example, the surface treatment layer 721-12 may not be formed on the lower surface of the metal layer 721-11 of the first terminal portion 721-1 that overlaps with the first insulating region 711 in a perpendicular or thickness direction. However, a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1 may not overlap with the first insulating region 711 in a perpendicular or thickness direction. For example, a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1 is exposed through the first terminal open portion formed in the first insulating region 711. For example, the metal layer 721-11 of the first terminal portion 721-1 includes a region that overlaps with the first terminal open portion of the first insulating region 711 in a perpendicular or thickness direction. Furthermore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be formed on the lower surface of the metal layer 721-11 of the first terminal portion 721-1 that overlaps with the first terminal open portion (not shown). For example, the lower surface of the metal layer 721-11 of the first terminal portion 721-1 may include a first-first lower surface that overlaps with the first insulating region 711 in the thickness direction, and a first-second lower surface other than the first-first lower surface. The first-second lower surface may be the portion that overlaps with the first terminal open portion of the first insulating region 711 in the thickness direction. Furthermore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be formed only on the first-second lower surface of the metal layer 721-11 of the first terminal portion 721-1.

[0313] Furthermore, the second terminal portion 721-2 may include an upper surface, a side surface, and a lower surface. The upper surface and side surface of the second terminal portion 721-2 do not come into contact with other components of the circuit board. This allows the surface treatment layer 721-22 of the second terminal portion 721-2 to be formed on the upper surface and side surface of the metal layer 721-21 of the second terminal portion 721-2.

[0314] However, the metal layer 721-21 of the second terminal portion 721-2 may not be formed on at least a portion of its lower surface. A portion of the lower surface of the metal layer 721-21 of the second terminal portion 721-2 is exposed through a second terminal open portion formed in the second insulating region 712. For example, the metal layer 721-21 of the second terminal portion 721-2 includes a region that overlaps with the second terminal open portion (not shown) of the second insulating region 712 in the vertical or thickness direction. For example, the lower surface of the metal layer 721-21 of the second terminal portion 721-2 may include a second-first lower surface that overlaps with the second insulating region 712 in the thickness direction, and a second-second lower surface other than the second-first lower surface. The second-second lower surface may be a portion that overlaps with the second terminal open portion of the second insulating region 712 in the thickness direction. Furthermore, the surface treatment layer 721-22 of the second terminal portion 721-2 may be formed on the lower surface of the metal layer 721-21 of the second terminal portion 721-2.

[0315] Furthermore, the connecting portion 721-3 includes an upper surface, a side surface, and a lower surface. In this case, the connecting portion 721-3 may not come into contact with the insulating portion 710. For example, the connecting portion 721-3 is positioned in the separation region 713 of the insulating portion 710. For example, the connecting portion 721-3 may be positioned in a flying state in the separation region 713 of the insulating portion 710. As a result, the upper, side, and lower surfaces of the metal layer 721-31 of the connecting portion 721-3 may not come into contact with other components of the circuit board. Therefore, the surface treatment layer 721-32 of the connecting portion 721-3 may be positioned on the upper, side, and lower surfaces of the metal layer 721-31 of the connecting portion 721-3 in the embodiment. The surface treatment layer 721-32 of the connecting portion 721-3 can also perform the insulating function of the connecting portion 721-3 when the image sensor according to the embodiment is moved.

[0316] On the other hand, the second-first pattern portion 722-1 of the second pattern portion 722 is positioned on the first insulating region 711 of the insulating portion 710. In this case, the second-first pattern portion 722-1 of the second pattern portion 722 may include an upper surface, side surfaces, and a lower surface. The entire area of ​​the lower surface of the second-first pattern portion 722-1 may be in contact with the upper surface of the first insulating region 711. As a result, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may not be formed on the lower surface of the metal layer 722-11 of the second-first pattern portion 722-1. For example, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may be formed only on the upper and side surfaces of the metal layer 722-11 of the second-first pattern portion 722-1.

[0317] Furthermore, the second-second pattern portion 722-2 of the second pattern portion 722 is positioned on the second insulating region 712 of the insulating portion 710. In this case, the second-second pattern portion 722-2 of the second pattern portion 722 may have an upper surface, side surfaces, and a lower surface. The entire area of ​​the lower surface of the second-second pattern portion 722-2 may be in contact with the upper surface of the second insulating region 712. Therefore, the surface treatment layer 722-22 of the second-second pattern portion 722-2 may not be formed on the lower surface of the metal layer 722-21 of the second-second pattern portion 722-2. For example, the surface treatment layer 722-22 of the second-second pattern portion 722-2 may be formed only on the upper surface and side surfaces of the metal layer 722-21 of the second-second pattern portion 722-2.

[0318] On the other hand, although not shown in the drawings, an adhesive layer (not shown) may be formed on the insulating portion 710 and the pattern portion 720. That is, the pattern portion 720 may be formed from rolled material. The adhesive layer may be formed between the insulating region 711 and the rolled metal layer for bonding the rolled metal layer of the rolled material to the insulating portion 710. As a result, an adhesive layer may be formed between the pattern portion 720 and the insulating portion 710.

[0319] On the other hand, as shown in Figure 8b, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 in the embodiment can be formed by coating a thin film on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 that constitute the pattern portion 720. The thin film can be formed by applying at least one coating method from among spray, dip, and deposition methods. The coating liquid can be an organic, inorganic, or inorganic composite material with no or low conductivity.

[0320] Preferably, in the examples, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 are formed using alkylimidazole. The alkylimidazole has low conductivity and high thermal conductivity. That is, alkylimidazole has excellent insulating properties and heat dissipation properties.

[0321] In this case, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed by coordination bonding between ions separated from the nitrogen (N) element of the alkylimidazole and copper (Cu) ions constituting the pattern portion 720. That is, a thin film is formed on the pattern portion 720 using the alkylimidazole coating solution. In this case, ions separated from the nitrogen element of the alkylimidazole and copper ions of the pattern portion 720 form a coordination bond. As a result, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed on the pattern portion 720.

[0322] The surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness in the range of 0.1 μm to 10 μm. For example, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness in the range of 0.15 μm to 8 μm. For example, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness of 0.2 μm to 5 μm. If the thickness of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is less than 0.1 μm, there is a problem that a uniform surface treatment layer cannot be formed on the surface of the pattern portion 720. Specifically, if the thickness of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is less than 0.1 μm, a problem arises in that the surface treatment layers cannot be placed on a portion of the surface of the pattern portion 720, and oxidation may occur in the areas where the surface treatment layers are not placed. Furthermore, if the thickness of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 exceeds 10 μm, a problem arises in that the resistance increases due to the increased thickness of the pattern portion 720, resulting in increased signal loss. Moreover, if the thickness of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 exceeds 10 μm, a problem arises in that the coating cost for forming the surface treatment layers increases.

[0323] On the other hand, in the embodiment, the metal layer of the rolled material in the pattern portion 720 contains copper (Cu) and titanium (Ti). As a result, the titanium (Ti) of the pattern portion 720 is contained within the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22.

[0324] That is, referring to Figure 8c, the surfaces of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may contain different concentrations of metal elements in different regions.

[0325] Table 1 shows the surface analysis results for region (a) in Figure 8c.

[0326] [Table 1]

[0327] Table 2 shows the surface analysis results for region (b) in Figure 8c.

[0328] [Table 2]

[0329] Referring to Tables 1 and 2, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 contain copper (Cu) and titanium (Ti), which are metal elements that constitute the patterned portion 720, in addition to the metal elements that constitute the alkylimidazole. However, the degree of coordination bonding with the metal elements of the patterned portion 720 may differ depending on the region of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22. As a result, the concentrations of copper (Cu) and titanium (Ti) may differ depending on the region. For example, the patterned portion 720 is made of rolled material, which may cause the copper and titanium concentrations to differ depending on the region. Furthermore, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 may contain elements at different concentrations in each region, as shown in Tables 1 and 2, due to the aforementioned regional concentration differences.

[0330] On the other hand, the manufacturing process for forming the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 described above can be briefly explained as follows.

[0331] First, in the embodiment, a pattern portion can be formed on the insulating portion. That is, in the embodiment, a metal layer of a press-formed material can be attached to the insulating portion, and the attached metal layer can be patterned to form the pattern portion 720.

[0332] Subsequently, the embodiment can perform a pretreatment step for surface treatment.

[0333] For example, the embodiment can impart a certain level of illuminance or higher to the surface of the pattern portion 720 by chemical polishing using at least one of sulfuric acid and hydrochloric acid, or by physical polishing using at least one of a brush, sand cloth and abrasive stone. For example, the embodiment can impart a surface roughness of Ra (0.05~0.2 μm) and Rz (1.0~3.0 μm) to the pattern portion 720 in order to form the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22.

[0334] Subsequently, the example prepares at least one coating solution from among non-conductive or low-conductivity organic materials, inorganic materials, and inorganic composites. Then, at least one coating method, such as spraying, dipping, and deposition, can be applied to the pre-treated patterned portion 720 using the prepared coating solution to form a surface treatment layer.

[0335] Figure 9a is a diagram illustrating the layer structure of the pattern portion according to the second embodiment, Figure 9b is an enlarged view of the connecting portion of Figure 9a, and Figure 9c is the surface of the second surface treatment portion of the surface treatment layer of Figure 9a.

[0336] The metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 constituting the pattern portion 720 are made of rolled material.

[0337] In this case, the metal layer of a typical rolled material has a centerline average roughness Ra in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm. When the metal layer has a roughness in this range, the low surface roughness reduces the adhesion between the pattern portion 720 and the insulating portion 710. This results in the problem of the pattern portion detaching from the insulating portion.

[0338] As a result, the pattern portion 720 may further include a plating layer. The plating layer may mean a plating layer formed by plating the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, which include the rolled material.

[0339] For example, a plating layer 721-13 may be formed between the metal layer 721-11 and the first insulating region 711 of the first terminal portion 721-1. As a result, the surface treatment layer 721-12 of the first terminal portion 721-1 may be positioned to cover the metal layer 721-11 and the plating layer 721-13 of the first terminal portion 721-1.

[0340] For example, a plating layer 721-23 may be placed between the metal layer 721-21 of the second terminal portion 721-2 and the second insulating region 712. This allows the surface treatment layer 721-12 of the second terminal portion 721-2 to cover both the metal layer 721-21 and the plating layer 721-23 of the second terminal portion 721-2.

[0341] Furthermore, the connecting portion 721-3 includes a plating layer 721-33 disposed beneath the metal layer 721-31. The surface treatment layer 721-33 of the connecting portion 721-3 may be arranged to surround the metal layer 721-31 and the plating layer 721-33 of the connecting portion 721-3.

[0342] Correspondingly, a plating layer 722-13 may be formed between the metal layer 722-11 of the second-first pattern portion 722-1 and the first insulating region 711. As a result, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may be positioned to cover the metal layer 722-11 and the plating layer 722-13 of the second-first pattern portion 722-1.

[0343] Furthermore, a plating layer 722-23 may be placed between the metal layer 722-21 of the second-second pattern portion 722-2 and the second insulating region 712. As a result, the surface treatment layer 722-12 of the second-second pattern portion 722-2 may be placed over the metal layer 722-21 and the plating layer 722-23 of the second-second pattern portion 722-2.

[0344] On the other hand, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may contain pure copper. As a result, the elements in the portions of the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 formed on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 may differ from the elements in the portions formed on the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23.

[0345] In this case, the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 can also be called the first metal layer, and the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can also be called the second metal layer. The connecting portion 721-3 will be explained below with an example.

[0346] The surface treatment layer 721-32 of the connecting portion 721-3 may include a first surface treatment portion 721-321 that contacts the metal layer 721-31 of the connecting portion 721-3, and a second surface treatment portion 721-322 that contacts the plating layer 721-33 of the connecting portion 721-3. The elements in the first surface treatment portion 721-321 and the elements in the second surface treatment portion 721-322 may be different from each other.

[0347] That is, the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 contain titanium, and as a result, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 contain titanium, as shown in Tables 1 and 2. As a result, the first surface treatment portion 721-321 may contain elements as shown in Tables 1 and 2.

[0348] In contrast, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 contain only copper. For example, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 do not contain titanium. As a result, the second surface-treated portion 721-322 may not contain titanium.

[0349] For example, similar to Figure 9c, the surface analysis results in region C of the second surface-treated portion 721-322 are shown in Table 3.

[0350] [Table 3]

[0351] As shown in Table 3, the second surface-treated portion 721-322 may not contain titanium (Ti) that was present in the first surface-treated portion 721-321.

[0352] The plating layer will be described in detail below.

[0353] The aforementioned plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be formed by electroplating or electroless plating onto metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, which are rolled copper foil alloys. The aforementioned plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be formed by plating copper-containing plating particles onto the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. The plating particles constituting the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 are mainly composed of copper and may also contain binary or ternary composite elements, including at least one of Ni, Co, Mn, and Al. The plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be formed on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 with a certain thickness. For example, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may have a thickness in the range of 0.5 μm to 10 μm. For example, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can have a thickness in the range of 0.8 μm to 8 μm. For example, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can have a thickness in the range of 1.0 μm to 6 μm. If the thickness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.5 μm, it may be difficult to form plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of uniform thickness on the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. For example, if the thickness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.5 μm, a problem may occur where the plating layer is not formed in specific areas of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. This can lead to oxidation of the patterned areas.If the thickness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 10 μm, the overall thickness of the patterned portion increases. This can reduce the elastic properties of the patterned portion and potentially decrease the mobility of the moving part of the camera module. Furthermore, if the thickness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 10 μm, the resistance of the patterned portion may increase, leading to increased signal transmission loss.

[0354] On the other hand, in the embodiment, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 were described as being arranged only on one surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, but the embodiment is not limited to this. That is, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may also be arranged on the upper surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, if the plating layer is also placed on the upper surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, the adhesion between the metal layers and the dry film (not shown) can be improved during the etching process for patterning the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. By improving the adhesion between the metal layers and the dry film, the etching reliability of the metal layers can be improved.

[0355] Figure 10 is a diagram illustrating the surface roughness of the metal layer and plating layer in the patterned portion according to the embodiment.

[0356] Figure 10(a) shows the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 of the patterned portion 720, and Figure 10(b) shows the surface of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of the patterned portion 720.

[0357] Similar to Figure 10(a), the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 represent the surface of the rolled copper foil alloy. As a result, the surface roughness of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 is lower than that of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23.

[0358] For example, the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 have a centerline average roughness Ra in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm. When the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 come into direct contact with the surface of the insulating part 710 (or the surface of the adhesive layer placed on the surface of the insulating part), there is a problem that the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 may detach from the insulating part 710 due to a decrease in adhesion.

[0359] In this embodiment, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 are formed on the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. In this embodiment, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23, rather than the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, come into contact with the surface of the insulating portion 710 (or the surface of the adhesive layer). In this embodiment, the adhesion between the pattern portion 720 and the insulating portion 710 can be improved.

[0360] In this case, the reference range for the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be as follows. That is, the reference range for the centerline average roughness Ra and the 10-point average roughness Rz of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be as follows. For example, the surface of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 (specifically, the lower surface facing the upper surface of the insulating portion 710) may have a centerline average roughness Ra in the range of 0.05 μm to 1.5 μm. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example may have a centerline average roughness Ra in the range of 0.05 μm to 1.0 μm. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example may have a centerline average roughness Ra in the range of 0.08 μm to 0.8 μm. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example may have a 10-point average roughness Rz in the range of 0.6 μm to 15 μm. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example may have a 10-point average roughness Rz in the range of 0.7 μm to 14.0 μm. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may have a 10-point average roughness Rz in the range of 1.0 μm to 12 μm.

[0361] That is, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the examples can have a surface roughness 10 times or more that of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. For example, the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the examples can have a surface roughness 20 times or more that of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21.

[0362] If the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.05 μm (centerline average roughness Ra) or less than 0.6 μm (10-point average roughness Rz), a decrease in adhesion between the patterned portion 720 and the insulating portion 710 may cause the patterned portion 720 to detach from the insulating portion 710. Furthermore, if the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.05 μm (centerline average roughness Ra) or less than 0.6 μm (10-point average roughness Rz), the etching efficiency of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 may decrease. Furthermore, if the etching efficiency decreases, the difference between the width of the upper surface and the width of the lower surface of the pattern portion 720 increases, which can reduce the electrical reliability of the pattern portion 720.

[0363] Furthermore, if the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 has a centerline average roughness Ra exceeding 1.5 μm or a 10-point average roughness Rz exceeding 15.0 μm, the thickness of the pattern portion 720 may increase. When the thickness of the pattern portion 720 increases, the mobility of the sensor portion relative to the fixed portion may decrease due to a reduction in the elastic force of the pattern portion 720.

[0364] Figures 11a to 11e are diagrams illustrating the relationship between the plating conditions and adhesion strength of the plating layer in the embodiment.

[0365] Figure 11a shows the relationship between the adhesion force of the plating layer and the insulating part under the first plating condition, Figure 11b shows the relationship between the adhesion force of the plating layer and the insulating part under the second plating condition, Figure 11c shows the relationship between the adhesion force of the plating layer and the insulating part under the third plating condition, Figure 11d shows the relationship between the adhesion force of the plating layer and the insulating part under the fourth plating condition, and Figure 11e shows the relationship between the adhesion force of the plating layer and the insulating part under the fifth plating condition.

[0366] The relationship between the plating conditions and adhesion strength of the plating layer will be explained below with reference to Figures 11a to 11e.

[0367] As described above, in the embodiment, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 having a certain level of centerline average roughness Ra and 10-point average roughness Rz are formed on the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 constituting the pattern portion 720. This increases the adhesion force between the pattern portion 720 and the insulating portion 710.

[0368] However, it was confirmed that even if the centerline mean roughness Ra and / or 10-point mean roughness Rz of the surface of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 satisfy the range described above, a problem occurs in which the adhesion force between the pattern portion 720 and the insulating portion 710 decreases.

[0369] Figure 11a is a diagram illustrating the peel strength (90° peel strength) between the plating layer and the insulating part under the first plating condition. Figure 11a(a) is a 3D image showing the surface roughness of the plating layer under the first plating condition, and Figure 11a(b) is a diagram showing the surface roughness profile of the plating layer under the first plating condition.

[0370] Specifically, Figure 11a shows the peel strength (90° peel strength) between the plating layer and the insulating part when the plating layer has a centerline average roughness Ra of 0.2 μm and a 10-point average roughness Rz of 6.1 μm, and the thickness of the plating layer is 3.7 μm. In this case, as shown in Figure 11a, when formed under the first plating conditions having a centerline average roughness Ra and a 10-point average roughness Rz within the range described above, it was confirmed that the peel strength (90° peel strength) between the plating layer and the insulating part was 79.5 gf / mm.

[0371] Figure 11b is a diagram illustrating the peel strength (90° peel strength) between the plating layer and the insulating part under the second plating condition. Figure 11b(a) is a 3D image showing the surface roughness of the plating layer under the second plating condition, and Figure 11b(b) is a diagram showing the surface roughness profile of the plating layer under the second plating condition.

[0372] Specifically, Figure 11b shows the peel strength (90° peel strength) between the plating layer and the insulating part when the plating layer has a centerline average roughness Ra of 0.6 μm and a 10-point average roughness Rz of 7.4 μm, and the thickness of the plating layer is 1.4 μm. In this case, as shown in Figure 11b, it was confirmed that when the plating layer has a centerline average roughness Ra and a 10-point average roughness Rz within the range described above, the peel strength (90° peel strength) is 45.5 gf / mm.

[0373] Figure 11c is a diagram illustrating the peel strength (90° peel strength) between the plating layer and the insulating part under the third plating condition. Figure 11c(a) is a 3D image of the surface roughness of the plating layer under the third plating condition. Figure 11c(b) is a profile of the surface roughness of the plating layer under the third plating condition.

[0374] Specifically, Figure 11c shows the peel strength (90° peel strength) between the plating layer and the insulating part when the plating layer has a centerline average roughness Ra of 1.0 μm and a 10-point average roughness Rz of 9.9 μm, and the thickness of the plating layer is 5.7 μm. In this case, similar to Figure 11c, it was confirmed that when the plating layer has a centerline average roughness Ra and a 10-point average roughness Rz within the range described above, the peel strength (90° peel strength) is 70.9 gf / mm.

[0375] Figure 11d is a diagram illustrating the peel strength (90° peel strength) between the plating layer and the insulating part under the fourth plating condition. Figure 11d(a) is a 3D image of the surface roughness of the plating layer under the fourth plating condition. Figure 11d(b) is a diagram showing the surface roughness profile of the plating layer under the fourth plating condition.

[0376] Specifically, Figure 11d shows the peel strength (90° peel strength) between the plating layer and the insulating part when the plating layer has a centerline average roughness Ra of 0.3 μm and a 10-point average roughness Rz of 4.5 μm, and the thickness of the plating layer is 4.5 μm. In this case, as shown in Figure 11d, it was confirmed that when the plating layer has a centerline average roughness Ra and a 10-point average roughness Rz within the range described above, the peel strength (90° peel strength) is 5.9 gf / mm.

[0377] Figure 11e is a diagram illustrating the peel strength (90° peel strength) between the plating layer and the insulating part under the fifth plating condition. Figure 11e(a) is a 3D image of the surface roughness of the plating layer under the fifth plating condition. Figure 11e(b) is a diagram showing the surface roughness profile of the plating layer under the fifth plating condition.

[0378] Specifically, Figure 11e shows the peel strength (90° peel strength) between the plating layer and the insulating part when the plating layer has a centerline average roughness Ra of 0.9 μm and a 10-point average roughness Rz of 13.4 μm, and the thickness of the plating layer is 4.3 μm. In this case, as shown in Figure 11e, it was confirmed that when the plating layer has a centerline average roughness Ra and a 10-point average roughness Rz within the range described above, the peel strength (90° peel strength) is 36.0 gf / mm.

[0379] That is, similar to Figures 11a to 11e, the surface roughness of the plating layer formed by the first to fifth plating conditions falls within the reference range of the centerline average roughness Ra and the 10-point average roughness Rz required in the examples. However, even when the centerline average roughness Ra and the 10-point average roughness Rz fall within the reference range, it was confirmed that the peel strength (90° peel strength) appears to be 50 gf / mm or less.

[0380] Furthermore, similar to Figures 11a to 11e, it was confirmed that even when the centerline average roughness Ra and the 10-point average roughness Rz of the plating layer increase, the peel strength (90° peel strength) between the plating layer and the insulating part decreases. For example, as shown in Figure 11d, even when the centerline average roughness Ra of the plating layer is 0.3 μm and the 10-point average roughness Rz of the plating layer is 4.5 μm, it was confirmed that the peel strength (90° peel strength) between the plating layer and the insulating part is considerably low at 5.9 gf / mm.

[0381] Furthermore, similar to Figures 11a to 11e, it was confirmed that even when the thickness of the plating layer increases, the peel strength (90° peel strength) between the plating layer and the insulating portion does not increase.

[0382] In conclusion, as shown in Figures 11a to 11e, it was confirmed that when the centerline average roughness Ra and the 10-point average roughness Rz of the plating layer increase, or when the thickness of the plating layer increases, the peel strength (90° peel strength) between the plating layer and the insulating part actually decreases.

[0383] In this case, the adhesion force corresponding to the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is required to be 50 gf / mm or more. For example, if the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is less than 50 gf / mm, there is a problem that the pattern portion 720 will detach from the insulating portion 710. Therefore, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 must be at least 50 gf / mm.

[0384] In conclusion, when the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of the pattern portion 720 in the example has a centerline average roughness Ra and a 10-point average roughness Rz within the reference range, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 increases. However, even when the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 has a centerline average roughness Ra and a 10-point average roughness Rz within the reference range, it was confirmed that the peel strength (90° peel strength) appears to be less than 50 gf / mm.

[0385] This allows the embodiment to control other conditions that affect the peel strength (90° peel strength) of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23, other than the surface roughness. For example, in the embodiment, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is set to a value above a certain level.

[0386] Figures 12a to 12e are SEM images showing the surface of the plated layer under the first to fifth plating conditions. For example, (a) in Figures 12a to 12e shows an SEM image under the condition of 40' tilt * 2k, and (b) shows an SEM image under the condition of 40' tilt * 10k.

[0387] Referring to Figures 12a to 12e, it was confirmed that in order to adjust the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 to 50 gf / mm or more, the size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of the pattern portion 720 must be controlled temporarily.

[0388] The size of the plating particles can be measured using a SEM device. For example, the size of the plating particles can be measured using a surface image at a constant magnification obtained by photographing the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 with an SEM device. For example, the size of the plating particles can mean the average size of the particles in the plating layer. For example, the size of the plating particles can be measured based on a surface image of the plating layer obtained at a magnification of 10,000 times. For example, the size of multiple plating particles in the surface image can be measured individually. Then, the average value of the measured sizes of the multiple plating particles can be calculated to obtain the size of the plating particles.

[0389] As shown in Figure 12a, when the average size of the plating particles in the plating layer under the first plating condition is 1.2 μm, it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is 79.5 gf / mm.

[0390] Furthermore, as shown in Figure 12b, when the average size of the plating particles in the plating layer under the second plating condition is 4.3 μm, it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is 45.5 gf / mm.

[0391] Furthermore, as shown in Figure 12c, when the average size of the plating particles in the plating layer under the third plating condition is 3.0 μm, it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is 70.9 gf / mm.

[0392] Furthermore, similar to Figure 12d, it was confirmed that when the average size of the plating particles in the plating layer under the fourth plating condition was 5.19 μm, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 was 5.9 gf / mm.

[0393] Furthermore, similar to Figure 12e, it was confirmed that when the average size of the plating particles in the plating layer under the fifth plating condition is 5.0 μm, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is 36.0 gf / mm.

[0394] That is, similar to Figures 12a to 12e, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 must be within a certain range, and it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is at a certain level.

[0395] Specifically, in the examples, it was confirmed that when the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeded 5.15 μm, the peel strength between the patterned portion 720) and the insulating portion 710 decreased sharply. Therefore, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the examples should be kept below 5.15 μm. For example, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the examples should be kept below 5.1 μm. For example, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example should be 5.0 μm or less.

[0396] On the other hand, a magnet attachment portion (not shown) on which the magnet portion 623 is arranged may be formed on the lower surface of the first frame 621a of the holder 621. The magnet portion 623 may be arranged on the magnet attachment portion of the holder 621.

[0397] Preferably, in the examples, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to satisfy the range of 0.8 μm to 5.15 μm. For example, in the examples, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to satisfy the range of 0.9 μm to 5.10 μm. For example, in the examples, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to satisfy the range of 1.0 μm to 5.0 μm.

[0398] In this case, if the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.8 μm, the centerline average roughness Ra and / or 10-point average roughness Rz of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may not satisfy the above reference range. As a result, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 may be reduced.

[0399] Furthermore, if the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 5.15 μm, a problem may occur where the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 decreases sharply, similar to Figure 12d.

[0400] Therefore, in the embodiment, the average size of the plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to 0.8 μm to 5.15 μm. This ensures that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a certain level or higher.

[0401] Figures 13a and 13b are histograms of the size of plating particles in the plating layer under the first to fifth plating conditions. For example, Figures 13a and 13b are size distribution diagrams of plating particles in the plating layer under the first to fifth plating conditions.

[0402] The average size of the plating particles in the plating layer shown in Figures 12a to 12e can also be represented by a size distribution diagram of the plating particles, similar to those in Figures 13a and 13b.

[0403] For example, the histogram or size distribution diagram of the plating particle size would be a graph showing the number of plating particles of different sizes exposed on the surface of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23. For example, Figures 13a to 13b may show the difference between the maximum and minimum sizes of the plating particles in the plating layer.

[0404] Referring to Figure 13a, it was confirmed that when the size distribution of plating particles in the plating layer under the first plating condition is 1.60 μm (in other words, when the difference between the maximum and minimum sizes of the plating particles is 1.60 μm), the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a constant level.

[0405] Referring to (A) in Figure 13b, it was confirmed that when the size distribution of plating particles in the plating layer under the second plating condition is 5.31 μm (in other words, when the difference between the maximum and minimum sizes of the plating particles is 5.31 μm), the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a constant level.

[0406] Referring to (B) in Figure 13b, it was confirmed that when the size distribution of plating particles in the plating layer under the third plating condition is 6.55 μm (in other words, when the difference between the maximum and minimum size of the plating particles is 6.55 μm), the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a constant level.

[0407] Referring to (C) in Figure 13b, it was confirmed that when the size distribution of plating particles in the plating layer under the fourth plating condition is 4.02 μm (in other words, when the difference between the maximum and minimum sizes of the plating particles is 4.02 μm), the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a constant level.

[0408] Referring to (D) in Figure 13b, it was confirmed that when the size distribution of plating particles in the plating layer under the fifth plating condition is 4.65 μm (in other words, when the difference between the maximum and minimum sizes of the plating particles is 4.65 μm), the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is maintained at a constant level.

[0409] However, it was confirmed that when the size distribution of the plating particles in the plating layer exceeds 7.0 μm, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 decreases sharply.

[0410] This ensures that the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 have a size distribution of 7.0 μm or less. For example, the size distribution of plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example is 6.5 μm or less. For example, the size distribution of plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the example is 6.0 μm or less.

[0411] For example, in the embodiment, the difference between the size of the first plating particles and the size of the second plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to 7.0 μm or less. The first plating particles are the largest plating particles among the plating particles in the plating layer. The second plating particles are the smallest plating particles among the plating particles in the plating layer. For example, in the embodiment, the difference between the size of the first plating particles and the size of the second plating particles in the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is set to 6.5 μm or less. For example, in the embodiment, the difference between the size of the first plating particles and the size of the second plating particles is set to 6.0 μm or less.

[0412] If the distribution density of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 7.0 μm, or if the difference between the first plating particles and the second plating particles exceeds 7.0 μm, the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 may decrease. This may cause the pattern portion 720 to detach from the insulating portion 710 in the operating environment of the camera module.

[0413] Figure 14 is a graph showing the relationship between the surface area of ​​the plated particles and the peel strength in the example.

[0414] Based on the average size of the plating particles in the plating layer, the size distribution diagram of the plating particles, and the difference between the maximum and minimum sizes of the plating particles described above, it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 differs.

[0415] Furthermore, the average size of the plated particles, the size distribution diagram of the plated particles, and the difference between the maximum and minimum sizes of the plated particles may also be expressed as the surface area of ​​the plated particles.

[0416] In the embodiment, the unit area of ​​the plating layer (1 μm) 2 It was confirmed that a difference in peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 occurs depending on the surface area of ​​the plating particles per unit area.

[0417] The unit area of ​​the aforementioned plating layer (1 μm) 2 The surface area per plated particle can be measured by the following assumptions:

[0418] (1) The plating particles have a spherical shape.

[0419] (2) Approximately half (hemispheric) of the plating particles are exposed on the surface of the plating layer.

[0420] The surface area can then be calculated according to the following procedure.

[0421] (1) Measure the size of the plated particles (e.g., diameter) using the method for measuring the size of plated particles described above.

[0422] (2) Calculation of the first surface area for plated particles having the above size.

[0423] (3) Unit area (1 μm 2 A first area larger than (for example, 115 μm) 2 Check the number of plating particles contained within the area.

[0424] (4) Calculation of a second surface area of ​​the plating particle that is 1 / 2 (for example, half the surface area of ​​the plating particle) of the first surface area of ​​the plating particle.

[0425] (5) Using the number of plating particles and the second surface area, calculate the first surface area of ​​the plating particles in the first area.

[0426] (6) Using the first surface area, the unit area (1 μm) 2 Calculation of the surface area of ​​plated particles in ).

[0427] Based on the above-mentioned assumptions and calculation method, the surface area of ​​plating particles per unit area of ​​the plating layer is as shown in Table 4.

[0428] [Table 4]

[0429] Referring to Table 4, when the average size of the plated particles in the plated layer under the first plating condition is 1.2 μm, then 3000 μm 2 Surface area of ​​plating particles per unit area (μm 2 It was confirmed that the value was 4351.99.

[0430] Referring to Table 4, when the average size of the plated particles in the plated layer under the second plating condition is 4.3 μm, then 3000 μm 2 Surface area of ​​plating particles per unit area (μm 2 It was confirmed that the value was 929.41.

[0431] Referring to Table 4, when the average size of the plated particles in the plated layer under the third plating condition is 3 μm, then 3000 μm 2 Surface area of ​​plating particles per unit area (μm 2 It was confirmed that the number is 3308.10.

[0432] Referring to Table 4, when the average size of the plated particles in the plated layer under the fourth plating condition is 5.19 μm, then 3000 μm 2 Surface area of ​​plating particles per unit area (μm 2 It was confirmed that the value was 507.73.

[0433] Referring to Table 4, if the average size of the plated particles in the plated layer under the fifth plating condition is 5 μm, then 3000 μm 2 Surface area of ​​plating particles per unit area (μm 2 It was confirmed that the value was 824.67.

[0434] Furthermore, the unit area (1 μm) of the plating layer in the examples shown in Table 4. 2 The surface area of ​​the plating particles per unit area can be as shown in Table 5 below.

[0435] [Table 5]

[0436] According to Table 5, the unit area of ​​the plating layer under the first plating condition (1 μm²) 2 ) Surface area of ​​plating particles per unit (μm 2 The value was 1.5, and it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 was 79.5 gf / mm.

[0437] Furthermore, the unit area of ​​the plating layer under the second plating condition (1 μm²) 2 ) Surface area of ​​plating particles per unit area (μm 2 The value was 0.3, and it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 was 45.5 gf / mm.

[0438] Furthermore, the unit area of ​​the plating layer under the third plating condition (1 μm²) 2 ) Surface area of ​​plating particles per unit area (μm 2 The ratio was 1.1, and it was confirmed that the resulting peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 was 70.9 gf / mm.

[0439] Furthermore, the unit area of ​​the plating layer under the fourth plating condition (1 μm²) 2 ) Surface area of ​​plating particles per unit area (μm 2 The value was 0.2, and it was confirmed that the resulting peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 was 5.9 gf / mm.

[0440] Furthermore, the unit area of ​​the plating layer under the fifth plating condition (1 μm²) 2 ) Surface area of ​​plating particles per unit area (μm2 The value was 0.3, and it was confirmed that the resulting peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 was 36 gf / mm.

[0441] To summarize the contents of Table 5 and Figure 14, the unit area of ​​the plating layer (1 μm²) 2 ) Surface area of ​​plating particles per unit area (μm 2 When the value is less than 0.5, it was confirmed that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 appears to be less than 50 gf / mm. Thus, in this example, the unit area (1 μm) of the plating layer is less than 0.5. 2 ) Surface area of ​​plating particles per unit area (μm 2 The value of the material is set to be 0.5 or higher. This ensures that the peel strength (90° peel strength) between the pattern portion 720 and the insulating portion 710 is 50 gf / mm or higher in the embodiment.

[0442] Figure 15 shows a mobile terminal 1500 to which the camera module according to the embodiment is applied.

[0443] As shown in Figure 15, the mobile terminal 1500 of the embodiment may include a camera module 1000, a flash module 1530, and an autofocus device 1510 located on the back. The mobile terminal 1500 of the embodiment may further include a second camera module 1100.

[0444] The camera module 1000 may include an image capture function and an autofocus function. For example, the camera module 1000 may include an autofocus function that uses an image.

[0445] The camera module 1000 processes still or moving image frames obtained by the image sensor in shooting mode or video call mode. The processed image frames can be displayed on a predetermined display unit and stored in memory. A camera (not shown) may also be located on the front of the mobile terminal body.

[0446] For example, the camera module 1000 includes a first camera module and a second camera module, and the first camera module may enable OIS implementation along with AF or zoom functionality.

[0447] The flash module 1530 may include a light-emitting element that emits light internally. The flash module 1530 may be activated by the operation of the mobile terminal's camera or by user control.

[0448] The autofocus device 1510 may include one of the packages of surface light emission laser elements as the light-emitting unit.

[0449] The autofocus device 1510 may include an autofocus function using a laser. The autofocus device 1510 may be primarily used in conditions where the autofocus function using the image of the camera module 1000 is reduced, such as close proximity of 10m or less or in dark environments. The autofocus device 1510 may include a light-emitting section including a vertical cavity surface-emitting laser (VCSEL) semiconductor element and a light-receiving section such as a photodiode that converts light energy into electrical energy.

[0450] The lens driving device of the embodiment includes a sensor unit and a circuit board for moving an image sensor connected to the sensor unit. The circuit board may be an interposer. The sensor unit includes a sensor substrate connected to the circuit board and an image sensor mounted on the sensor substrate. In this case, the sensor substrate includes an electrical pad electrically connected to the circuit board and a fixed pad other than the electrical pad. In this case, the circuit board may include an open portion into which the fixed pads of the sensor substrate are inserted.

[0451] This allows the embodiment to insert the fixing pad into the open portion during the soldering process between the circuit board and the sensor board. This facilitates the alignment between the circuit board and the sensor board during the soldering process.

[0452] Furthermore, the embodiment can restrict the movement of the sensor board while the positions of the circuit board and the sensor board are aligned. This allows the embodiment to solve the problem of misalignment between the circuit board and the sensor board that occurs during the soldering process. As a result, the embodiment can improve work efficiency.

[0453] Furthermore, the embodiment can improve the electrical connectivity between the sensor substrate and the circuit board. This allows the embodiment to improve the reliability of the product.

[0454] Furthermore, the circuit board of the embodiment includes the insulating portion and the pattern portion. The insulating portion includes the first insulating region, the second insulating region, and the separation region between them. The pattern portion includes a first terminal portion located in the first insulating region and connected to the sensor board, a second terminal portion located in the second insulating region and connected to the main board, and a connecting portion located in the separation region and connecting the first terminal portion and the second terminal portion. In this case, the connecting portion includes bent portions located at each corner of the separation region. In this case, each bent portion of the connecting portion is bent by rotating in the same direction at the corner. As a result, the embodiment can improve the mobility of the sensor portion by the circuit board due to the bent structure of the connecting portion. Furthermore, the embodiment can improve the accuracy of the movement position of the sensor portion.

[0455] Furthermore, the bent portion of the connecting part in the embodiment includes a first open region that opens up in part at each corner of the separation region. In this case, the first open region may be formed at a position that overlaps with the protruding portion of the second frame constituting the first moving part in the optical axis direction. The connecting part includes an inner connecting part that is positioned inside the first open region while avoiding the first open region, and an outer connecting part that is positioned outside it. In this case, the number of inner connecting parts may be less than the number of outer connecting parts.

[0456] As a result, the embodiment can improve the mobility of the first movable part by having more outer connecting parts located outside the first open region than the number of inner connecting parts located inside the first open region. For example, when the number of outer connecting parts is greater than the number of inner connecting parts, the amount of movement of the first movable part can be adjusted more easily than in the opposite case. For example, the outer connecting parts are arranged outside the first open region and have a longer length than the inner connecting parts. And because the length of the outer connecting parts is greater than the length of the inner connecting parts, the strength of the driving force required to move the first movable part can be reduced compared to the inner connecting parts. As a result, the embodiment can improve the mobility of the first movable part by the difference in the number of inner and outer connecting parts. Furthermore, the embodiment can finely adjust the amount of movement of the first movable part.

[0457] Furthermore, each of the outer connecting portion and the inner connecting portion in the embodiment includes a plurality of bending points. In this case, the number of bending points in the outer connecting portion may be the same as the number of bending points in the inner connecting portion. And by having the same number of bending points, the mobility of the first movable portion can be improved.

[0458] For example, if the number of bending points in the outer connecting portion differs from the number of bending points in the inner connecting portion, force may concentrate in the connecting portion that has a relatively large number of bending points. This can lead to a problem where the connecting portion where the force is concentrated breaks before the other connecting portions. Furthermore, problems may occur in the movement accuracy of the first moving portion.

[0459] In contrast, the embodiment allows the force applied to the inner and outer connecting parts to be uniformly distributed because the number of bending points is the same when the first movable part moves. As a result, the embodiment can uniformly distribute the force to the inner and outer connecting parts. This solves the problem of a particular connecting part breaking first. Furthermore, even if a situation arises in which the connecting part breaks, the embodiment can ensure that the inner and outer connecting parts break at the same time.

[0460] On the other hand, the embodiment involves an adhesive layer placed in a through-hole penetrating the first insulating region of the circuit board, and a heat dissipation portion being attached to the circuit board via the adhesive layer. The heat dissipation portion is then capable of releasing the heat generated by the sensor board.

[0461] As a result, the embodiment can release the heat generated by the image sensor to the outside, thereby improving its heat dissipation characteristics. This allows the embodiment to improve the operational reliability of the image sensor. Furthermore, the embodiment can improve the quality of the images acquired by the image sensor.

[0462] Furthermore, the pattern portion of the embodiment includes a metal layer and a surface treatment layer disposed on the metal layer. The surface treatment layer may be a thin film layer formed by coating with an organic substance. In this case, the relative permittivity εr of the organic substance is 3.24. This is considerably smaller than the relative permittivity εr of nickel or gold (Au) that is typically found in surface treatment layers. That is, the relative permittivity εr of nickel or gold (Au) is 4 or greater.

[0463] , Therefore, the embodiment can improve the signal transmission speed of the wiring, which changes inversely proportional to the relative permittivity of the surface treatment layer. As a result, the embodiment can improve the product reliability of the circuit board.

[0464] Furthermore, the thermal conductivity of the organic material used in the surface treatment layer of the embodiment is higher than that of nickel. As a result, the embodiment can increase the thermal conductivity of the patterned portion.

[0465] In particular, heat dissipation characteristics in electronic products, including camera modules, are a major issue because they affect product performance. Specifically, the components included in camera modules have structures that are vulnerable to heat dissipation. As a result, efforts are being made to improve the heat dissipation characteristics of camera modules. In this embodiment, the thermal conductivity of the pattern portion can be increased by the organic coating. As a result, the embodiment can improve the heat dissipation characteristics of the circuit board and the camera module to which the circuit board is applied.

[0466] Furthermore, the pattern portion in the embodiment is part of the configuration of the first movable part of the camera module. As a result, the pattern portion can move together with the movement of the first movable part. However, the pattern portion may come into contact with other components when the first movable part moves. When the pattern portion comes into contact with other components, problems with electrical reliability may occur.

[0467] In this embodiment, the organic material in the surface treatment layer has lower electrical conductivity than nickel or gold. As a result, when the patterned portion comes into contact with other components, the surface treatment layer can perform an insulating function. This allows the embodiment to improve the electrical reliability of the circuit board. Furthermore, by applying an organic coating method, the embodiment can simplify the plating process and further reduce plating costs.

[0468] On the other hand, the pattern portion of the embodiment includes a plating layer disposed between the metal layer and the surface treatment layer. The plating layer can improve the peel strength between the pattern portion and the insulating portion.

[0469] In this case, the plating layer has surface roughness. In this case, if the surface roughness of the plating layer increases, the adhesion between the plating layer and the insulating part may decrease. Therefore, the embodiment improves the adhesion by controlling the size of the plating particles constituting the plating layer.

[0470] For example, the average size of the plating particles in the plating layer of the example ranges from 0.8 μm to 5.15 μm. Furthermore, in the example, the difference between the first plating particle with the largest size and the second plating particle with the smallest size in the plating layer is 7.0 μm or less. Also, the unit area of ​​the plating layer (1 μm) 2 The surface area of ​​the plating particles in ) is 0.5 μm 2 The above is possible. Furthermore, the centerline average roughness Ra of the plating layer is in the range of 0.05 μm to 1.5 μm. Furthermore, the 10-point average roughness Rz of the plating layer is in the range of 0.6 μm to 15 μm. As a result, the embodiment can further improve the adhesion between the pattern portion and the insulating portion. Furthermore, the embodiment ensures that the peel strength (90° peel strength) between the pattern portion and the insulating portion is 50 gf / mm or more. As a result, the embodiment can solve the reliability problem of the pattern portion detaching from the insulating portion in the operating environment of the camera module. Furthermore, the embodiment can improve the operational reliability of the autofocus or image stabilization function of the camera module.

[0471] Next, Figure 16 is a perspective view of a vehicle to which the camera module according to the embodiment is applied.

[0472] For example, Figure 16 is an external view of a vehicle equipped with a vehicle driving assistance device to which the camera module according to the embodiment is applied.

[0473] Referring to Figure 16, the vehicle 800 of the embodiment may be equipped with wheels 13FL, 13FR that are rotated by a power source, and a predetermined sensor. The sensor may be, but is not limited to, a camera sensor 2000.

[0474] The camera 2000 may be a camera sensor to which the camera module 1000 according to the embodiment is applied.

[0475] The vehicle 800 in this embodiment can acquire image information via a camera sensor 2000 that captures forward or surrounding images, and can use the image information to determine if a lane is unidentified and generate a virtual lane when it is unidentified.

[0476] For example, the camera sensor 2000 can capture a forward-facing image of the area in front of the vehicle 800, and a processor (not shown) can analyze the objects contained in such forward-facing images to obtain image information.

[0477] For example, if the image captured by the camera sensor 2000 includes objects such as lane markings, adjacent vehicles, obstacles to driving, and indirect road markings such as median barriers, curbs, and street trees, the processor can detect such objects and include them in the image information.

[0478] At this time, the processor can acquire distance information to the object detected via the camera sensor 2000 and further supplement the image information. The image information may be information about the object captured in the image.

[0479] Such a camera sensor 2000 may include an image sensor and an image processing module. The camera sensor 2000 can process still or moving images obtained by an image sensor (e.g., CMOS or CCD). The image processing module can process the still or moving images acquired via the image sensor to extract necessary information and transmit the extracted information to a processor.

[0480] In this case, the camera sensor 2000 may include, but is not limited to, a stereo camera to improve the accuracy of object measurement and to secure further information such as the distance between the vehicle 800 and the object.

[0481] The vehicle 800 of the embodiment can provide an advanced driver assistance system (ADAS).

[0482] For example, advanced driver assistance systems (ADAS) include Autonomous Emergency Braking (AEB), which automatically reduces speed and stops the vehicle without the driver having to apply the brakes in the event of a collision risk; Lane Keep Assist System (LKAS), which adjusts the direction of travel when drifting out of a lane to maintain the lane; Advanced Smart Cruise Control (ASCC), which automatically maintains a predetermined speed while keeping the distance from the vehicle in front; Active Blind Spot Detection (ABSD), which detects collision risks in blind spots and assists in safe lane changes; and Around View Monitor (AVM), which visually displays the situation around the vehicle.

[0483] In such advanced driver-assistance systems (ADAS), camera modules function as core components along with radar and other elements, and the proportion of applications for camera modules is gradually increasing.

[0484] For example, in the case of an Automatic Emergency Braking System (AEB), a front-facing camera sensor and radar sensor detect vehicles and pedestrians ahead, and it can automatically apply emergency braking if the driver does not control the vehicle. Alternatively, in the case of a Landing Assist System (LKAS), a camera sensor can detect if the driver is leaving the roadway without any input such as turning signals, and it can automatically steer the vehicle to maintain its position. Furthermore, in the case of an Around View Monitoring System (AVM), the surrounding environment of the vehicle can be visually displayed through camera sensors placed on all four sides of the vehicle.

[0485] The features, structures, and effects described in the examples above are included in at least one example and are not necessarily limited to just one example. Furthermore, the features, structures, and effects exemplified in each example can be combined or modified and implemented in other examples by a person with ordinary skill in the art to which the example belongs. Therefore, content related to such combinations and modifications should be interpreted as being included within the scope of the examples.

[0486] The above description has focused on examples, but these are merely illustrative and not limiting. Anyone with ordinary knowledge of the field to which these examples belong will understand that a variety of modifications and applications not illustrated above are possible, as long as they do not deviate from the essential characteristics of these examples. For example, each component specifically shown in the examples can be modified and implemented. Such differences in modifications and applications should be interpreted as falling within the scope of the examples set forth in the attached claims.

Claims

1. Insulating part and, The insulating portion includes a conductive pattern portion disposed on the insulating portion, The insulating portion is The first insulating region and It includes a second insulating region located outside the first insulating region and separated from the first insulating region by a separation region, The conductive pattern portion is, A first terminal portion is arranged on the first insulating region, A second terminal portion is positioned on the second insulating region, It includes a connecting portion that connects the first terminal portion and the second terminal portion, The first terminal portion includes a first superimposed region that overlaps with the first insulating region along the thickness direction of the insulating portion, The second terminal portion includes a second superimposed region that overlaps with the second insulating region along the thickness direction, A circuit board in which the thickness of the connecting portion is greater than at least one of the thickness of the first superimposed region of the first terminal portion and the thickness of the second superimposed region of the second terminal portion.

2. The first insulating region includes a first open portion that penetrates the upper and lower surfaces of the first insulating region. The circuit board according to claim 1, wherein the first superimposed region does not overlap with the first open portion along the thickness direction.

3. The second insulating region includes a second open portion that penetrates the upper and lower surfaces of the second insulating region. The circuit board according to claim 1, wherein the second superimposed region does not overlap with the second open portion along the thickness direction.

4. The circuit board according to claim 3, wherein a plurality of the second open portions are provided within the second insulating region, spaced apart from each other in a horizontal direction perpendicular to the thickness direction.

5. The second insulating region comprises an inner surface and an outer surface, The circuit board according to claim 4, wherein the plurality of second open portions are not connected to the inner and outer surfaces of the second insulating region.

6. The second insulating region includes four edge regions, The circuit board according to claim 3, wherein the second open portion is located in at least one of the four edge regions.

7. The circuit board according to claim 3, wherein the second open portion has a rectangular shape.

8. It further includes a dummy pattern portion disposed on the insulating portion and separated from the conductive pattern portion, The circuit board according to claim 1, wherein the dummy pattern portion includes a first dummy portion disposed on the first insulating region and a second dummy portion disposed on the second insulating region.

9. The circuit board according to claim 8, wherein the outer surface of the first insulating region is positioned outside the outer surface of the first dummy portion.

10. The circuit board according to claim 8, wherein the inner surface of the second dummy portion is located closer to the outer surface of the second insulating region than the inner surface of the second insulating region.

11. The circuit board according to claim 2, wherein the horizontal isolation distance between the outer surface of the first insulating region and the inner surface of the second insulating region includes first and second isolation distances that are different from each other along the direction around the outer surface of the first insulating region.

12. The first insulating region includes the first to fourth side regions, The second insulating region includes fifth to eighth side regions having inner surfaces facing the respective outer surfaces of the first to fourth side regions, The circuit board according to claim 11, wherein the horizontal isolation distance between the inner surface of the first side region and the outer surface of the fifth side region includes a first isolation distance and a second isolation distance smaller than the first isolation distance.

13. The horizontal isolation distance between the inner surface of the second side region and the outer surface of the sixth side region includes different isolation distances from each other. The horizontal isolation distance between the inner surface of the third side region and the outer surface of the seventh side region includes different isolation distances from each other. The circuit board according to claim 12, wherein the horizontal isolation distance between the inner surface of the fourth side region and the outer surface of the eighth side region includes different isolation distances from each other.

14. The circuit board according to claim 12, wherein at least one of the outer surfaces of the first to fourth side regions and the inner surfaces of the fifth to eighth side regions is provided with at least one of a recess and a protrusion.

15. The separation region includes the first to fourth corner sections, The circuit board according to claim 1, wherein the connecting portion includes first to fourth connecting portions, each of which is a bent portion located at the first to fourth corner portions.

16. First substrate and A second substrate placed on the first substrate, The image sensor disposed on the second substrate includes, The first substrate includes an insulating portion and a conductive pattern portion disposed on the insulating portion. The insulating portion includes a first insulating region and a second insulating region located outside the first insulating region and separated from the first insulating region by a separation region. The conductive pattern portion is, A first terminal portion is arranged on the first insulating region, A second terminal portion is positioned on the second insulating region, A connecting portion that connects the first terminal portion and the second terminal portion, The first terminal portion includes a first superimposed region that overlaps with the first insulating region along the thickness direction of the insulating portion, The second terminal portion includes a second superimposed region that overlaps with the second insulating region along the thickness direction, An image sensor module in which the thickness of the connecting portion is greater than at least one of the thickness of the first superimposed region of the first terminal portion and the thickness of the second superimposed region of the second terminal portion.

17. It further includes a dummy pattern portion disposed on the insulating portion and separated from the conductive pattern portion, The image sensor module according to claim 16, wherein the dummy pattern portion includes a first dummy portion disposed on the first insulating region and a second dummy portion disposed on the second insulating region.

18. The second insulating region includes an open portion that penetrates the upper and lower surfaces of the second insulating region. The open portion is provided in at least one of the multiple edge regions provided in the second insulating region, The image sensor module according to claim 16, wherein the second superimposed region does not overlap with the open portion along the thickness direction.

19. The image sensor module according to claim 16, wherein the horizontal isolation distance between the outer surface of the first insulating region and the inner surface of the second insulating region includes first and second isolation distances that are different from each other along the direction around the outer surface of the first insulating region.

20. The first insulating region includes the first to fourth side regions, The second insulating region includes fifth to eighth side regions having inner surfaces facing the respective outer surfaces of the first to fourth side regions, The image sensor module according to claim 19, wherein each of the horizontal isolation distances between the inner surface of the first side region and the outer surface of the fifth side region, the horizontal isolation distance between the inner surface of the second side region and the outer surface of the sixth side region, the horizontal isolation distance between the inner surface of the third side region and the outer surface of the seventh side region, and the horizontal isolation distance between the inner surface of the fourth side region and the outer surface of the eighth side region includes the first and second isolation distances.

Images