Copper post design on laminate for improved performance and reliability

Abstract

The present disclosure relates to a double-side molded module with copper post structures, which are formed by using a two-step plating process. The disclosed double-side molded module includes the copper post structures and a laminate panel that has a laminate body with a first surface and a second surface opposite the first surface, and capture pads on the second surface of the laminate body. The copper post structures include a number of lower copper posts formed over the capture pads, respectively, and a number of upper copper posts directly formed over the lower copper posts. At least one of the copper post structures includes a first lower copper post of the lower copper posts and two or more of the upper copper posts confined within the first lower copper post.

Description

COPPER POST DESIGN ON LAMINATE FOR IMPROVED PERFORMANCE AND RELIABILITYRelated Applications

[0001] This application claims the benefit of provisional patent application serial number 63 / 511 ,949, filed July 5, 2023, and provisional patent application serial number 63 / 511 ,947, filed July 5, 2023, the disclosures of which are hereby incorporated herein by reference in their entireties.Field of the Disclosure

[0002] The present disclosure relates to a double-side molded module with copper posts, and a method of fabricating the double-side molded module with the copper posts in a reliable manner without die cracks or component interconnect failures. In addition, the method of fabricating the double-side molded module can also increase copper mass without increasing a thickness of the double-side molded module by a two-step plating process, thereby improving module performance.Background

[0003] With the popularity of portable consumer electronic products, such as smart phones, tablet computers, and so forth, double-sided assemblies are becoming more and more attractive in microelectronics devices to achieve electronics densification in a small footprint.

[0004] However, a conventional double-side molded module, which utilizes Ball Grid Array (BGA), may result in a relatively large thickness of the final product and have limitations for input / output (I / O) density. It is because each solder ball of the BGA has a relatively large size (in both horizontal and vertical dimensions). In order to achieve a desired module performance, a thickness of a laminate substrate of the double-side molded module typically cannot be reduced. In some applications, to improve the double-side molded module’s performance, it is necessary to increase the thickness of the laminate substrate.The conventional double-side molded module with the BGA is limited to a decreased thickness of less than 0.7mm. In addition, the BGA is not superior for thermal dissipation, especially for high frequency and high-power applications.

[0005] Accordingly, to accommodate the low-profile requirements for portable products and to enhance thermal and electrical performance, it is therefore an object of the present disclosure to provide a fabricating method for producing an improved double-side molded module with a reduced thickness or with increased copper mass without increasing the thickness. It is also desirable to fabricate the improved double-side molded module in a reliable manner without die cracks or component interconnect failures.

[0006] The present disclosure relates to a double-side molded module with copper posts, and a method of fabricating the double-side molded module with the copper posts in a reliable manner without die cracks or component interconnect failures, in particular reducing height variation of the copper posts during fabrication of the double-side molded module. In addition, the method of fabricating the double-side molded module with the copper posts can also increase copper mass without increasing a thickness of the double-side molded module by a two-step plating process, thereby improving module performance.

[0007] The disclosed method starts with providing a plating precursor, which includes a laminate panel with multiple active regions, a first plating resist, and a second plating resist. Herein, the laminate panel includes a laminate body, first pads on a first surface of the laminate body, and second pads on a second surface of the laminate body. Each of the first pads and each of the second pads are confined within a corresponding active region. The first plating resist is formed over the first surface of the laminate body to encapsulate the first pads, and the second plating resist is formed over the second surface of the laminate body to encapsulate the second pads. Next, portions of the second plating resist are selectively removed to provide a number of plating holes over certain ones of the second pads within each of the active regions, such that the certain ones ofthe second pads within each of the active regions are exposed through the plating holes, respectively. A number of copper posts are then formed in the plating holes, respectively, and each of the copper posts is connected to a corresponding one of the exposed second pads. The copper posts within each of the active regions are then planarized, such that each of the copper posts has an exposed horizontal surface through the second plating resist at a same plane.

[0008] In one embodiment of the exemplary method, each of the copper posts has a height between 100 pm and 150 pm, and a diameter between 150 pm and 250 pm.

[0009] In one embodiment of the exemplary method, the laminate panel further includes a seed metal film on the second surface of the laminate body connecting each of the second pads.

[0010] In one embodiment of the exemplary method, the copper posts are formed by an electrolytic copper plating process.

[0011] According to one embodiment, the method further includes removing the first plating resist and the second plating resist to provide the laminate panel with the plurality of copper posts within each of the active regions.

[0012] According to one embodiment, the method further includes selectively etching portions of the seed metal film to electrically separate the copper posts from each other.

[0013] According to one embodiment, the method further includes forming at least one first electronic component on the first pads, forming at least one second electronic component on the second pads, forming a first mold compound over the first surface of the laminate body to completely cover the at least one first electronic component, and forming a second mold compound over the second surface of the laminate body to completely cover the at least one second electronic component. Next, the second mold compound is thinned down to expose each upper copper post.

[0014] In one embodiment, a first alternative method starts with providing a plating precursor, which includes a laminate panel, a first plating resist, and a second plating resist. Herein, the laminate panel includes a laminate body, firstRECTIFIED SHEET (RULE 91) ISA / EPpads on a first surface of the laminate body, second pads on a second surface of the laminate body, and a seed metal film on the second surface of the laminate body connecting each of the second pads. In a horizontal aspect, the laminate panel includes multiple strips with strip margins therebetween, such that the strips are separate from each other. Each of the strips includes an active region and a non-active region surrounding the active region. In addition, each of the first pads and each of the second pads are confined within a corresponding active region, and the seed metal film extends over the non-active region of each of the strips and the strip margins. The first plating resist is formed over the first surface of the laminate body to encapsulate the first pads, and the second plating resist is formed over the seed metal film to encapsulate the second pads. Next, portions of the second plating resist are selectively removed to provide a number of plating holes over certain ones of the second pads within the active region of each of the strips, and to provide a number of additional plating holes over certain portions of the seed metal film within the non-active region of each of the strips and the strip margin. The certain ones of the second pads within the active region of each of the strips are exposed through the plating holes, respectively, and the certain portions of the seed metal film within the non-active region of each of the strips and the strip margins are exposed through the additional plating holes, respectively. A number of copper posts are then formed in the plating holes, respectively, and a number of additional copper posts are formed in the additional plating holes, respectively. Each of the copper posts is connected to a corresponding one of the exposed second pads, and each of the additional copper posts is connected to a corresponding one of the exposed portions of the seed metal film.

[0015] In one embodiment of the first alternative method, each of the copper posts has a substantially same height between 100 pm and 150 pm and a diameter between 150 pm and 250 pm, and each of the additional copper posts has a height between 100 pm and 150 pm and a diameter between 150 pm and 250 pm.

[0016] According to one embodiment, the first alternative method further includes planarizing the copper posts and the additional copper posts, such that an exposed horizontal surface of each of the copper posts through the second plating resist and an exposed horizontal surface of each of the additional copper posts through the second plating resist are at a same plane.

[0017] In one embodiment of the first alternative method, the copper posts and the additional copper posts are formed by an electrolytic copper plating process.

[0018] According to one embodiment, the first alternative method further includes removing the first plating resist and the second plating resist to provide the laminate panel with the copper posts within the active region of each of the strips and the additional copper posts within the non-active region of each of the strips and the strip margins.

[0019] According to one embodiment, the first alternative method further includes selectively etching portions of the seed metal film to electrically separate the copper posts from each other.

[0020] According to one embodiment, the first alternative method further includes forming at least one first electronic component on the first pads, forming at least one second electronic component on the second pads, forming a first mold compound over the first surface of the laminate body to completely cover the at least one first electronic component, and forming a second mold compound over the second surface of the laminate body to completely cover the at least one second electronic component. Next, the second mold compound is thinned down to expose each upper copper post.

[0021] In addition, the present disclosure also relates to a second alternative method of fabricating a double-side molded module using a two-step plating process so as to increase copper mass without increasing a thickness of the double-side molded module and the double-side molded module formed from the second alternative method. The disclosed second alternative method starts with providing an initial plating precursor having a laminate panel, a first plating resist, and a second plating resist. Herein, the laminate panel includes a laminate bodyRECTIFIED SHEET (RULE 91) ISA / EPwith a first surface and a second surface opposite the first surface, and multiple capture pads on the second surface of the laminate body. The first plating resist is formed over the first surface of the laminate body, and the second plating resist is formed over the second surface of the laminate body to encapsulate the capture pads. Portions of the second plating resist are then selectively removed to provide a number of lower plating holes. Herein, each of the lower plating holes extends through the second plating resist to expose a corresponding one of the capture pads. Next, a number of lower copper posts are formed in the lower plating holes, respectively. Each of the lower copper posts is connected to the corresponding one of the exposed capture pads. A third plating resist is then formed over the second plating resist to provide a second plating precursor. Herein, the third plating resist encapsulates each of the lower copper posts. In the following step, portions of the third plating resist are selectively removed to provide a number of upper plating holes. Herein, each of the upper plating holes extends through the third plating resist to expose a corresponding one of the lower copper posts, and two or more of the upper plating holes are formed over a first one of the lower copper posts.

[0022] In one embodiment of the second alternative method, each upper plating hole has a same shape and a same size.

[0023] In one embodiment of the second alternative method, the lower copper posts have one or more shapes consisting of circles, rectangles, squares, L- shapes, C-shapes, ovals, rings, open sided shapes, and closed sided shapes.

[0024] In one embodiment of the second alternative method, the laminate panel further includes a seed metal film. The capture pads are connected with each other by the seed metal film. Herein, forming the lower copper posts is provided by an electrolytic copper plating step. The capture pads are coupled to a voltage source via the seed metal film and function as electrolytic plating seed pads to attract a plating material though the lower plating holes to form the lower copper posts.

[0025] According to one embodiment, the second alternative method further includes forming a number of upper copper posts in the upper plating holes,respectively. Herein, each of the upper copper posts is connected to the corresponding one of the lower copper posts. A number of copper post structures are composed of the upper copper posts and the lower copper posts. A first one of the copper post structures includes the first one of the lower copper posts and two or more of the upper copper posts confined within the first one of the lower copper posts.

[0026] In one embodiment of the second alternative method, each of the copper post structures has a thickness between 20 pm and 280 pm, each of the lower copper posts has a thickness between 10 pm and 140 pm, and each of the upper copper posts has a thickness between 10 pm and 140 pm.

[0027] According to one embodiment, the second alternative method further includes grinding the upper copper posts. After the grinding, each of the copper post structures has a same height.

[0028] In one embodiment of the second alternative method, within the initial plating precursor, the laminate panel further includes first pads on the first surface of the laminate body and second pads on the second surface of the laminate body. The capture pads and the second pads are connected with each other by the seed metal film. The first plating resist formed over the first surface of the laminate body encapsulates the first pads, and the second plating resist formed over the second surface of the laminate body resides over the seed metal film and encapsulates both the capture pads and the second pads.

[0029] According to one embodiment, the second alternative method further includes, after forming the upper copper posts, removing the first plating resist, the second plating resist, and the third plating resist, so as to expose the first pads on the first surface of the laminate body and to expose the second pads, the capture pads, and the seed metal film on the second surface of the laminate body.

[0030] According to one embodiment, the second alternative method further includes selectively removing portions of the seed metal film so as to separate each of the capture pads and each of the second pads.

[0031] According to one embodiment, the second alternative method further includes forming at least one first electronic component on the first pads, forming at least one second electronic component on the second pads, forming a first mold compound over the first surface of the laminate body to completely cover the at least one first electronic component, and forming a second mold compound over the second surface of the laminate body to completely cover the at least one second electronic component. Next, the second mold compound is thinned down to expose each upper copper post.

[0032] According to one embodiment, the second alternative method further includes grinding the lower copper posts before applying the third plating resist over the second plating resist. Herein, after the grinding, each of the lower copper posts has a same height.

[0033] According to one embodiment, the disclosed double-side molded module includes a laminate panel and a number of copper post structures. The laminate panel has a laminate body with a first surface and a second surface opposite the first surface and capture pads on the second surface of the laminate body. The copper post structures are formed on the capture pads, respectively. Herein, the copper post structures include a number of lower copper posts formed over the capture pads, respectively, and a number of upper copper posts directly formed over the lower copper posts. At least one of the copper post structures includes a first lower copper post of the lower copper posts and two or more of the upper copper posts confined within the first lower copper post.

[0034] In one embodiment of the double-side molded module, each of the upper copper posts has a same shape and a same size.

[0035] In one embodiment of the double-side molded module, the lower copper posts have one or more shapes consisting of circles, rectangles, squares, L-shapes, C-shapes, ovals, rings, open sided shapes, and closed sided shapes.

[0036] In one embodiment of the double-side molded module, each of the copper post structures has a thickness between 20 pm and 280 pm, each of the lower copper posts has a thickness between 10 pm and 140 pm, and each of the upper copper posts has a thickness between 10 pm and 140 pm.RECTIFIED SHEET (RULE 91) ISA / EP

[0037] In one embodiment of the double-side molded module, at least one of the plurality of copper post structures includes a second lower copper post of the plurality of lower copper posts and only one of the plurality of upper copper posts confined within the second lower copper post.

[0038] According to one embodiment, the double-side molded module further includes at least one first electronic component formed on the first surface of the laminate body, and at least one second electronic component formed on the second surface of the laminate body and surrounded by the copper post structures.

[0039] According to one embodiment, the double-side molded module further includes a number of first pads on the first surface of the laminate body, and a number of second pads on the second surface of the laminate body and surrounded by the plurality of copper post structures. Herein, the at least one first electronic component is formed on the first pads, and the at least one second electronic component is formed on the second pads. The at least one first electronic component and the at least one second electronic component are electrically connected to corresponding ones of the copper post structures.

[0040] In one embodiment of the double-side molded module, the at least one first electronic component is one or more of flip-chip dies and surface mounted devices (SMDs). The at least one second electronic component is one or more of flip-chip dies and SMDs.

[0041] According to one embodiment, the double-side molded module further includes a first mold compound and a second mold compound. Herein, the first mold compound is formed over the first surface of the laminate body to completely cover the at least one first electronic component. The second mold compound is formed over the second surface of the laminate body. The second mold compound partially covers each copper post structure, such that a tip surface of each upper copper post is exposed through the second mold compound. The second mold compound at least partially covers the at least one second electronic component.

[0042] According to one embodiment, a communication device includes a control system, a baseband processor, receive circuitry, and transmit circuitry. Herein, at least one or any combination of the control system, the baseband processor, the transmit circuitry, and the receive circuitry is implemented in a double-side molded module, which includes a laminate panel and a number of copper post structures. The laminate panel has a laminate body with a first surface and a second surface opposite the first surface, and multiple capture pads on the second surface of the laminate body. The copper post structures are formed on the capture pads, respectively. The copper post structures include a number of lower copper posts formed over the capture pads, respectively, and a number of upper copper posts directly formed over the lower copper posts. At least one of the copper post structures includes a first lower copper post of the lower copper posts and two or more of the upper copper posts confined within the first lower copper post.

[0043] In another aspect, any of the foregoing aspects individually or together, and / or various separate aspects and features as described herein, may be combined for additional advantage. Any of the various features and elements as disclosed herein may be combined with one or more other disclosed features and elements unless indicated to the contrary herein.

[0044] Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.Brief Description of the Drawing Figures

[0045] The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0046] Figure 1 provides a flow diagram that illustrates an exemplary process to provide a double-side molded module according to some embodiments of the present disclosure.

[0047] Figures 2A-21 illustrate the steps associated with the process shown in Figure 1 .

[0048] Figure 22 provides a flow diagram that illustrates an alternative process to provide a double-side molded module according to some embodiments of the present disclosure.

[0049] Figures 23A-40 illustrate the steps associated with the process shown in Figure 22.

[0050] Figure 41 illustrates a block diagram of a communication device, which may include the double-side molded module provided by the process shown in Figure 1 or Figure 22 according to some embodiments of the present disclosure.

[0051] It will be understood that for clarity of illustration, Figures 1 -41 may not be drawn to scale.Detailed Description

[0052] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

[0053] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0054] It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it canbe directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.

[0055] Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and / or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one ofordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0058] Embodiments are described herein with reference to schematic illustrations of embodiments of the disclosure. As such, the actual dimensions of the layers and elements can be different, and variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are expected. For example, a region illustrated or described as square or rectangular can have rounded or curved features, and regions shown as straight lines may have some irregularity. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit the scope of the disclosure. Additionally, sizes of structures or regions may be exaggerated relative to other structures or regions for illustrative purposes and, thus, are provided to illustrate the general structures of the present subject matter and may or may not be drawn to scale. Common elements between figures may be shown herein with common element numbers and may not be subsequently redescribed.

[0059] The present disclosure relates to a double-side molded module with copper posts, and a method of fabricating the double-side molded module with the copper posts in a reliable manner without die cracks or component interconnect failures, in particular reducing height variation of the copper posts during fabrication of the double-side molded module. In addition, the method of fabricating the double-side molded module can also increase copper mass without increasing a thickness of the double-side molded module by a two-step plating process, thereby improving module performance.

[0060] Figure 1 provides a flow diagram that illustrates an exemplary process to provide a double-side molded module according to some embodiments of the present disclosure. Figures 2A-21 illustrate the steps associated with the processshown in Figure 1 . Although the flow diagram and the associated steps are illustrated in a series, they are not necessarily order-dependent. Some steps may be done in a different order than that presented. Further, processes within the scope of this disclosure may include fewer or more steps than those illustrated in Figure 1 .

[0061] Initially, a laminate panel 210 is provided as illustrated in Figures 2A and 2B (step 102). Figure 2A is a bottom view of the laminate panel 210, and Figure 2B is a cross-sectional view of a portion of the laminate panel 210 along a dashed line A-A’. The laminate panel 210 includes a laminate body 212, first pads 214 on a first surface of the laminate body 212, and second pads 216 on a second surface of the laminate body 212 (for clarification, only one first pad and one second pad are labeled with reference numbers). Herein, the first surface and the second surface of the laminate body 212 may be a top surface and a bottom surface of the laminate body 212, respectively.

[0062] The laminate body 212 has a thickness between 100 pm and 400 pm and is formed from alternating prepreg (PPG) layers and metal layers in a vertical direction (not shown). The first pads 214 and the second pads 216 are formed of a metal material, such as copper, and are electrically connected to corresponding metal layers within the laminate body 212. In one embodiment, the first pads 214 are separate from each other, while the second pads 216 are electrically connected by a seed metal film 218.

[0063] Viewed in plane, the laminate panel 210 can be divided into multiple strips 220 with strip margins 222 therebetween, such that the strips 220 are separate from each other. For the purpose of this illustration, the laminate panel 210 includes 2x3 strips 220. In different applications, the laminate panel 210 may include fewer or more strips with different layout configurations. Each strip 220 includes an active region 224, within which electronic components will be mounted (more details are described below), and a non-active region 225 surrounding the active region 224. Each of the first pads 214 and each of the second pads 216 are confined within a corresponding active region 224.

[0064] Next, a first plating resist 226 and a second plating resist 228 are formed to provide an initial plating precursor 230 (step 104). Figure 3 illustrates a cross-sectional view of a portion of the initial plating precursor 230 with a same horizontal coverage as shown in Figure 2B. Herein, the first plating resist 226 is formed over the first surface of the laminate body 212 to encapsulate each first pad 214, and the second plating resist 228 is formed over the seed metal film 218 (over the second surface of the laminate body 212) to encapsulate each second pad 216. Note that the seed metal film 218 is not fully covered by the second plating resist 228 (e.g., the seed metal film 218 is exposed at a side of the laminate panel 210). The first plating resist 226 and the second plating resist 228 may be formed of a polymer that can be polymerized with exposure to radiation of UV light.

[0065] The initial plating precursor 230 is then flipped and selectively etched to provide a plating precursor 232 (step 106). Figure 4A is a cross-sectional view of a portion of the plating precursor 232 with a same horizontal coverage as shown in Figure 2B along the dashed line A-A’, while Figure 4B is a top view of the same portion of the plating precursor 232 (i.e., towards the second surface of the laminate body 212). The plating precursor 232 includes a number of plating holes 234 that are formed by selectively removing portions of the second plating resist 228 over certain second pads 216 within the active region 224 of each strip 220. Herein, each plating hole 234 extends through the second plating resist 228 to expose a corresponding second pad 216. Note that not every second pad 216 is exposed through the plating holes 234. Some second pads 216, which are used to accommodate electronic components (more details are described below), are still fully covered by the second plating resist 228. In one embodiment, no plating holes 234 are formed in the non-active region 225 of each strip 220 or in the strip margins 222. The plating holes 234 may be formed by photoresist patterning. In particular, the second plating resist 228 is selectively polymerized with UV light, and a chemical developing solution is applied to remove non-polymerized portions of the second plating resist 228 to form the plating holes 234.

[0066] Figure 5 shows an electrolytic copper plating step (step 108). Herein, the plating precursor 232, functioning as a cathode, and an anode 236 are immersed in a plating material 240 within a container 242. The anode 236 is coupled to a positive terminal of a voltage source Vdd and the plating precursor 232 is coupled to a negative terminal of the voltage source Vdd via the seed metal film 218. Since the second pads 216 are connected by the seed metal film 218, each second pad 216 is electrically connected to the voltage source Vdd. The exposed second pads 216 (though the plating holes 234) function as electrolytic plating seed pads to attract the plating material 240. The plating material 240 includes copper.

[0067] During the electrolytic copper plating step, the plating material 240 will gradually fill the plating holes 234, the first plating resist 226 protects the first pads 214, and the second plating resist 228 protects unexposed second pads 216 (which are used for device mounting in a later step). Typically, outer edges of a plated area of the plating precursor 232 will have a higher current density than a middle portion of the plated area of the plating precursor 232. As such, during the same plating step, copper posts plated at the outer edge of the plated area of the plating precursor 232 will have a greater height than copper posts plated in the middle portion of the plated area of the plating precursor 232. The copper posts plated in the middle portion of the plated area of the plating precursor 232 have negligible height variation. In this embodiment, the plated area of the plating precursor 232 is a combination of all active regions 224.

[0068] Figure 6 illustrates a cross-sectional view of a portion of a post-plating precursor 244, which includes copper posts 246 within corresponding plating holes 234, respectively. Herein, Figure 6 illustrates a same horizontal coverage as shown in Figure 2B along the A-A’ dashed line. Each copper post 246 has a height between 100 pm and 150 pm, and a diameter between 150 pm and 250 pm. Herein, the copper posts 246 in outer portions of the post-plating precursor 244 (i.e., at outer edges of the combination of all active regions 224) will be taller than the copper posts 246 in a middle portion of the post-plating precursor 244 (i.e., a middle portion of the combination of all active regions 224), and thecopper posts 246 in the middle portion of the post-plating precursor 244 have negligible height variation. For the purpose of this illustration, first and second copper posts 246-1 and 246-2 located close to the point A (i.e., close to one outer edge of the combination of all active regions 224) are taller than third, fourth, and fifth copper posts 246-3, 246-4, and 246-5 located away from the point A (i.e., away from the outer edge of the combination of all active regions 224). The third, fourth, and fifth copper posts 246-3, 246-4, and 246-5 have negligible height variation. In some applications, the first copper post 246-1 (which is the copper post closest to the outer edge of the combination of all active regions 224) may be taller than the second copper post 246-2.

[0069] The height variation of the copper post 246 will lead to surface unevenness in subsequent fabrication steps (e.g., a molding step), which may cause deflection / deformation of the laminate panel 210, and in consequence will cause die cracks and component interconnect failures (more details are described below). Therefore, a grinding step is followed to planarize the copper posts 246 (step 1 10). Figure 7 is a cross-sectional view of the portion of the postplating precursor 244 during the grinding step. After the grinding step, each copper post 246 has a same height and has an exposed horizontal surface (through the second plating resist 228) at a same plane.

[0070] The first plating resist 226 and the second plating resist 228 are then removed to provide the laminate panel 210 with the copper posts 246 (step 112). Figure 8 is a cross-sectional view of a portion of the laminate panel 210 with the same height copper posts 246 (having a same horizontal coverage as shown in Figure 2B). The copper posts 246 protrude from the second surface of the laminate body 212 and provide a combined flat plane over the second surface of the laminate body 212. Certain second pads 216 without plated copper posts 246 are also exposed. The first plating resist 226 and the second plating resist 228 are removed by chemical stripping. Originally, the second pads 216 are connected by the seed metal film 218. Since the copper posts 246 are directly formed over corresponding second pads 216, respectively, the copper posts 246 are also electrically connected to each other by the seed metal film 218.

[0071] Figures 9A and 9B illustrate a flash etching step (step 1 14), in which the second pads 216 are separate from each other by selectively etching portions of the seed metal film 218 between the second pads 216. Figure 9A is a cross-sectional view of the portion of the laminate panel 210 with the copper posts 246 along the dashed line A-A’ with a same horizontal coverage as shown in Figure 2B, while Figure 9B is a top view of the same portion of the laminate panel 210 with the copper posts 246 (i.e., towards the second surface of the laminate body 212). After selectively etching the portions of the seed metal film 218, the copper posts 246 plated over certain second pads 216 are separate from each other. Remaining portions of the seed metal film 218 within each of the active regions 224 are a number of individual seed metal pieces 218P. Each individual seed metal piece 218P is vertically underneath and aligned with a corresponding second pad 216 and may have a substantially same size as the corresponding second pad 216. In some embodiments, portions of the seed metal film 218 outside the active regions 224 are removed, or portions of the seed metal film 218 outside the strips 220 are removed.

[0072] As described above, during an electrolytic copper plating step, outer edges of a plated area will have a higher current density than a middle portion of the plated area, and copper posts plated at the outer edges of the plated area will have a greater height than copper posts plated in the middle portion of the plated area. As such, if the plated area enlarges, the middle portion of the plated area, within which the plated copper posts have negligible height variation, will enlarge as well.

[0073] Figures 10A-14B show an alternative approach to form the copper posts 246 over the laminate panel 210. After the initial plating precursor 230 is formed (as shown in Figure 3), besides the plating holes 234 formed within the active regions 224, additional plating holes 248 (only a few plating holes are labeled with reference numbers for clarity) are also formed in the non-active region 225 of each strip 220 and in the strip margins 222 to provide a first alternative plating precursor 232A, as illustrated in Figures 10A and 10B.

[0074] Figure 10A is a cross-sectional view of a portion of the first alternative plating precursor 232A with a same horizontal coverage as shown in Figure 2B along the dashed line A-A’, while Figure 10B is a top view of the same portion of the first alternative plating precursor 232A (i.e., towards the second surface of the laminate body 212). In the first alternative plating precursor 232A, each additional plating hole 248 extends through the second plating resist 228 to expose a corresponding portion of the seed metal film 218. Herein, the plating holes 234 and the additional plating holes 248 are formed in a same processing step (step 106A) by photoresist patterning. Note that the laminate panel 210 may include additional pads on the second surface of the laminate body 212 (not shown). The additional pads are interspersed in the non-active region 225 of each strip 220 and in the strip margins 222 and are connected by the seed metal film 218. Each additional plating hole 248 extends through the second plating resist 228 to expose a corresponding additional pad.

[0075] In another embodiment, the additional plating holes 248 are only formed in the non-active region 225 of each strip 220 but not in the strip margins 222 to provide a second alternative plating precursor 232B, as illustrated in Figures 11 A and 11 B. Figure 1 1 A is a cross-sectional view of a portion of the second alternative plating precursor 232B with a same horizontal coverage as shown in Figure 2B along the dashed line A-A’, while Figure 11 B is a top view of the same portion of the second alternative plating precursor 232B (i.e., towards the second surface of the laminate body 212). In the second alternative plating precursor 232B, each additional plating hole 248 extends through the second plating resist 228 to expose a corresponding portion of the seed metal film 218. Herein, the plating holes 234 and the additional plating holes 248 are formed in a same processing step (step 106A) by photoresist patterning. Note that the laminate panel 210 may include additional pads on the second surface of the laminate body 212, which are interspersed in the non-active region 225 of each strip 220 and are connected by the seed metal film 218 (not shown). Each additional plating hole 248 extends through the second plating resist 228 to expose a corresponding additional pad.

[0076] In different applications, the additional plating holes 248 may be formed in different locations within the non-active regions 225 and / or the strip margins 222 with a different pattern and / or different density. As long as the additional plating holes 248 are formed in the non-active regions 225 and / or in the strip margins 222, the total plating area of one plating precursor will increase (e.g., the first alternative plating precursor 232A and the second alternative plating precursor 232B have a larger plating area than the plating precursor 232).

[0077] An electrolytic copper plating step (step 108A) is then applied to the first alternative plating precursor 232A, similar to that shown in Figure 5. Herein, the first alternative plating precursor 232A is also coupled to the negative terminal of the voltage source Vdd via the seed metal film 218. The exposed second pads 216 (through the plating holes 234) and the exposed portions of the seed metal film 218 / exposed additional pads (through the additional plating holes 248) both function as plating seed pads to attract the plating material 240. During the electrolytic copper plating step, the plating material 240 will gradually fill the plating holes 234 and the additional plating holes 248. Since the total plating area increases, current density for the electrolytic copper plating will be redistributed. Current density in the active regions 224 will be substantially uniform, which will result in negligible copper height variation in the active regions 224. The copper height variation will only exist in the non-active regions 225 and / or in the strip margins 222.

[0078] Figure 12 shows a cross-sectional view of a portion of a first alternative post-plating precursor 244A formed from the first alternative plating precursor 232A (along the dashed line A-A’ and having a same horizontal coverage as shown in Figure 2B). Herein, the copper posts 246 are formed within the corresponding plating holes 234, respectively, and additional copper posts 250 are formed within the corresponding additional plating holes 248, respectively. Each copper post 246 has a height between 100 pm and 150 pm, and a diameter between 150 pm and 250 pm. Each additional copper post 250 has a height between 100 pm and 150 pm, and a diameter between 150 pm and 250 pm. The copper posts 246 within the active region 224 have substantially a same height(i.e., negligible height variation), while the additional copper posts 250 located at outer edges of the first alternative post-plating precursor 244A have different heights (i.e., have height variation). For the purpose of this illustration, first and second additional copper posts 250-1 and 250-2 (located close to the A point / close to the outer edges of the first alternative post-plating precursor 244A and within the strip margins 222) are taller than a third additional copper post 250-3 (located within one non-active region 225). The third additional copper post 250-3 (located within the one non-active region 225) is slightly taller than the copper posts 246 within the active region 224 and fourth, fifth, and sixth additional copper posts 250-4, 250-5, and 250-6 (located close to the A’ point and away from the outer edges of the first alternative post-plating precursor 244A, A’ point located in an interior portion of the first alternative post-plating precursor 244A).

[0079] Herein, the height variation of the additional copper posts 250 will lead to surface unevenness in the subsequent fabrication steps (e.g., a molding step), which may cause deflection / deformation of the laminate panel 210. However, the possible deflection / deformation of the laminate panel 210 due to the unevenness of the additional copper posts 250 typically occurs at locations where the height variation exists. The copper posts 246 within the active regions 224 have negligible height variation and only certain additional copper posts 250 within the strip margins 222 and / or the non-active region 225 have height variation.Therefore, even though the deflection / deformation of the laminate panel 210 may occur, the deflection / deformation will only occur outside the active regions 224 and will not lead to die cracks or component interconnect failures (dies are only mounted within the active regions 224). In other words, the height variation of the additional copper posts 250 in the first alternative post-plating precursor 244A is tolerable for the subsequent fabrication steps.

[0080] Figure 13 illustrates an optional grinding step (step 1 10A) to planarize the additional copper posts 250 and the copper posts 246. After the grinding step, an exposed horizontal surface (through the second plating resist 228) ofeach copper post 246 and an exposed horizontal surface (through the second plating resist 228) of each additional copper post 250 are at a same plane.

[0081] The first plating resist 226 and the second plating resist 228 are then removed to provide the laminate panel 210 with the copper posts 246 and the additional copper posts 250, as illustrated in Figure 14 (step 112A, similar to Figure 8). Each copper post 246 and each additional copper post 250 protrude from the second surface of the laminate body 212 and provide a combined flat plane over the second surface of the laminate body 212. Certain second pads 216 without plated copper posts 246 are also exposed. The first plating resist 226 and the second plating resist 228 are removed by chemical stripping. Originally, the second pads 216 are connected by the seed metal film 218. Since the copper posts 246 are directly formed over corresponding second pads 216, respectively, the copper posts 246 are also electrically connected to each other by the seed metal film 218.

[0082] Figures 15A and 15B illustrate a flash etching step (step 114), in which the second pads 216 are separate from each other by selectively etching portions of the seed metal film 218 between the second pads 216. Figure 15A is a cross-sectional view of the portion of the laminate panel 210 with the copper posts 246 and the additional copper posts 250 along the dashed line A-A’ with a same horizontal coverage as shown in Figure 2B, while Figure 15B is a top view of the same portion of the laminate panel 210 with the copper posts 246 and the additional copper posts 250 (i.e., towards the second surface of the laminate body 212). After selectively etching the portions of the seed metal film 218, the copper posts 246 plated over certain second pads 216 are also separate from each other. Remaining portions of the seed metal film 218 within each of the active regions 224 are a number of individual seed metal pieces 218P. Each individual seed metal piece 218P is vertically underneath and aligned with a corresponding second pad 216 and may have a substantially same size as the corresponding second pad 216.

[0083] In addition, the additional copper posts 250 are directly formed over the seed metal film 218 or corresponding additional pads respectively (notshown), the additional copper posts 250 are also electrically connected to each other by the seed metal film 218. Since the additional copper posts 250 are formed merely for mechanical purposes, there is no need to separate the additional copper posts 250 from each other. Portions of the seed metal film 218 within the non-active regions 225 and the strip margins 222 may remain continuous.

[0084] After the copper posts 246 are formed on the second surface of the laminate body 212 (as illustrated in Figure 9A or 15A), one or more first electronic components 252 are mounted to certain first pads 214 for each strip 220 (step 1 16), as illustrated in Figure 16. For the purpose of this illustration, the one or more first electronic components 252 include a first surface mounted device (SMD) 252-1 , a second SMD 252-2, a first flip-chip die 252-3 with die copper pillars, and a second flip-chip die 252-4 with die solder balls. Each first electronic component 252 is confined within a corresponding active region 224. In different applications, there might be fewer or more first electronic components 252 mounted on the first surface of the laminate body 212. The first electronic components 252 may be other active or passive electronic components. The first electronic components 252 are mounted to the certain first pads 214 with or without adhesive material. The first electronic components 252 are electrically connected to the corresponding metal layers within the laminate body 212, respectively (not shown). In this step, the copper posts 246 and the additional copper posts 250 (if they exist) may stand on a support block (not shown) to mechanically support the laminate panel 210.

[0085] Next, a first mold compound 256 is applied over the first surface of the laminate body 212 to provide a single-sided molding precursor 258 (step 118). Figure 17 is a cross-sectional view of a portion of the single-side molded precursor 258 (having a same horizontal coverage as shown in Figure 2B and along the dashed line A-A’). The first mold compound 256 encapsulates each first electronic component 252. The first mold compound 256 may be an organic epoxy resin system or the like, and may be applied by various procedures, such as sheet molding, overmolding, compression molding, transfer molding, dam fillencapsulation, or screen print encapsulation. In a typical molding step (e.g., a compression molding), a molding pressure used for applying the first mold compound 256 is between 100 psi and 1000 psi. Herein, if the horizontal surface of each copper post 246 and the horizontal surface of each additional copper post 250 are at a same plane (e.g., optional grinding step 1 10A is applied), each copper post 246 and each additional copper post 250 will sit on the support block (not shown) to make the laminate panel 210 lie flat. Thus, during the molding step, the copper posts 246 and the additional copper posts 250 are capable of providing strong and solid mechanical support to the laminate panel 210. There will be no vertical deformations occurring to the laminate panel 210, no die cracks occurring to the first electronic components 252, and no connection failures for the first electronic components 252.

[0086] Alternatively, if the optional grinding step 1 10A is not applied, the additional copper posts 250 may have height variation within the strip margins 222 and / or the non-active region 225. During the molding step, there might be vertical deformations occurring to the laminate panel 210 due to the unevenness of the additional copper posts 250. However, the possible deflection / deformation of the laminate panel 210 typically occurs at locations where the height variation exists. Since the copper posts 246 within the active regions 224 have negligible height variation and only certain additional copper posts 250 within the strip margins 222 and / or the non-active region 225 have height variation, even though the deflection / deformation of the laminate panel 210 may occur, the deflection / deformation will only occur outside the active regions 224. Such deflection / deformation will not lead to die cracks in the first electronic components 252 within the active regions 224 and will not lead to connection failures for the first electronic components 252 within the active regions 224.

[0087] In another embodiment, if the additional copper posts 250 do not exist (e.g., as illustrated in Figure 6), the grinding step 1 10 is always applied to provide the copper posts 246 with a same height (e.g., as illustrated in Figures 7-8). Each copper post 246 sits on the support block (not shown) to make the laminate panel 210 lie flat. Thus, during the molding step, the copper posts 246 arecapable of providing strong and solid mechanical support to the laminate panel 210. There will be no vertical deformations occurring to the laminate panel 210, no die cracks occurring in the first electronic components 252, and no connection failures for the first electronic components 252. A curing process (not shown) is then used to harden the first mold compound 256. The curing temperature is between 100eC and 320 -C depending on which material is used as the first mold compound 256. A planarization process may also be applied to planarize a top surface of the first mold compound 256 (not shown).

[0088] The single-sided molding precursor 258 is then flipped, and at least one second electronic component 260 is mounted to the exposed second pads 216 for each strip 220 (step 120), as illustrated in Figure 18. For the purpose of this illustration, the at least one second electronic component 260 includes a flipchip die with die solder balls. In different applications, there might be more second electronic components 260 mounted on the second surface of the laminate body 212. The at least one second electronic component 260 may be other active or passive electronic components. The at least one second electronic component 260 is always confined within a corresponding active region 224. The at least one second electronic component 260 is mounted to the exposed second pads 216 with or without adhesive material. The at least one second electronic component 260 is electrically connected to the first electronic components 252 via the corresponding metal layers within the laminate body 212 (not shown). In one embodiment, each copper post 246 may extend vertically beyond a backside of the at least one second electronic component 260 (i.e. , each copper post 246 may be taller than the at least one second electronic component 260, not shown). In one embodiment, each copper post 246 may not extend vertically beyond the backside of the at least one second electronic component 260 but extends vertically beyond an active device region of the at least one second electronic component 260.

[0089] Next, a second mold compound 262 is applied over the second surface of the laminate body 212 to provide a double-side molded package 264 (step 122). Figure 19 is a cross-sectional view of a portion of the double-side moldedRECTIFIED SHEET (RULE 91) ISA / EPpackage 264 (having a same horizontal coverage as shown in Figure 2B and along the dashed line A-A’). The second mold compound 262 encapsulates the at least one second electronic component 260, each copper post 246, and each additional copper post 250 (if they exist). The second mold compound 262 may be an organic epoxy resin system or the like and may be formed of a same or different material from the first mold compound 256. The second mold compound 262 may be applied by various procedures, such as sheet molding, overmolding, compression molding, transfer molding, dam fill encapsulation, or screen print encapsulation. Herein, the planarized first mold compound 256 provides mechanical support to the laminate panel 210, such that during the second molding step, there will be no vertical deformations occurring to the laminate panel 210, no die cracks occurring to the second electronic components 260, and no connection failures for the second electronic component 260.

[0090] An additional grinding step (step 124) of the second mold compound 262 of the double-side molded package 264 is then followed. Figure 20 is a cross-sectional view of the portion of the double-side molded package 474 after this additional grinding step. The second mold compound 262 is ground until each copper post 246 is exposed. If the copper posts 246 are taller than the at least one second electronic component 260, the at least one second electronic component 260 is still fully encapsulated by the second mold compound 262 (not shown). If the copper posts 246 are shorter than the at least one second electronic component 260, a portion of the least one second electronic component 260 (e.g., die substrate) might be ground to expose each copper post 246. Since each copper post 246 always extends vertically beyond the active device region of the at least one second electronic component 260, the grinding process will not affect the active device region of the at least one second electronic component 260. The double-side molded package 264 is then singulated into individual double-side molded modules 266 (step 126). Figure 21 shows one of the double-side molded modules 266. The strip margins 222 and the non-active regions 225 of the laminate panel 210, and the additional copper posts 250 within the strip margins 222 and the non-active regions 225 may notRECTIFIED SHEET (RULE 91) ISA / EPbe included in the final individual double-side molded module 266. Each individual double-side molded module 266 includes the one or more first electronic components 252, the first mold compound 256, the at least one second electronic component 260, the second mold compound 262, the copper posts 246, and a portion of the laminate panel 210 within a corresponding active region 224. Since the copper posts 246 connect to the first electronic components 252 and / or the second electronic component 260, the copper posts 246 will also help to conduct heat generated from the first electronic components 252 and / or the second electronic component 260. Since each copper post 246 has a height only between 100 pm and 150 pm, the double-side molded module 266 may have a thickness less than 0.7 mm.

[0091] In some applications, thermal dissipation is a critical product performance, especially for high-power and high frequency applications. One way to reduce thermal resistance of a double-side molded module is to increase metal mass of the double-side molded module, such as increasing the mass of copper posts of the double-side molded module. Since a thin thickness (e.g., less than 0.7 mm) of the double-side molded module is very important for portable products, it is highly desired to increase metal mass of the double-side molded module without increasing a thickness of one double-side molded module.Herein, the present disclosure further introduces a two-step plating process to form copper posts in double-side molded modules.

[0092] Figure 22 provides a flow diagram that illustrates an exemplary process to provide a double-side molded module according to some embodiments of the present disclosure. Figures 23A-40 illustrate the steps associated with the process shown in Figure 22. Although the flow diagram and the associated steps are illustrated in a series, they are not necessarily orderdependent. Some steps may be done in a different order than that presented. Further, processes within the scope of this disclosure may include fewer or more steps than those illustrated in Figure 22.

[0093] Initially, a laminate panel 410 is provided as illustrated in Figures 23A and 23B (step 302). Figure 23A is a bottom view of the laminate panel 410, andFigure 23B is a cross-sectional view of a portion of the laminate panel 410 along a clashed line A-A’. The laminate panel 410 includes a laminate body 412, first pads 414, second pads 416, and capture pads 417 (for clarification, only certain first pads, certain second pads, and certain capture pads are labeled with reference numbers). The first pads 414 are formed on a first surface of the laminate body 412 and configured to accommodate electronic components (more details are described below) on the first surface of the laminate body 412. Each first pad 414 may have a same size and a same shape, such as a circle, square, etc. (not shown). The second pads 416 are formed on a second surface of the laminate body 412 and configured to accommodate electronic components (more details are described below) on the second surface of the laminate body 412. Each second pad 416 may have a same size and a same shape, such as a circle, square, etc. The capture pads 417 are formed on the second surface of the laminate body 412 and configured to accommodate copper post structures (more details are described below). Herein, the first surface and the second surface of the laminate body 412 are a top surface and a bottom surface of the laminate body 412, respectively.

[0094] The laminate body 412 may have a thickness between 100 pm and 400 pm (or even higher depending on different applications), and is formed from alternating prepreg (PPG) layers and metal layers in a vertical direction (not shown). The first pads 414, the second pads 416, and the capture pads 417 are formed of a metal material, such as copper, and are electrically connected to corresponding metal layers within the laminate body 412, respectively. In one embodiment, the first pads 414 on the first surface are separate from each other. The second pads 416 and the capture pads 417 are connected by a seed metal film 418, which is formed of copper and has a thickness of about 2 pm.

[0095] Viewed in a plane, the laminate panel 410 can be divided into multiple strips 420 with strip margins 422 therebetween, such that the strips 420 are separate from each other. The capture pads 417 confined within each strip 420 may have different shapes (such as circles, rectangles, squares, L-shapes, C- shapes, ovals, rings, open sided shapes, closed sided shapes, etc.) toaccommodate different copper post structures (more details are described below). For the purpose of this illustration, the laminate panel 410 includes 2x2 strips 420. The capture pads 417 confined within each strip 420 have three L- shaped capture pads 417-1 , three rectangular-shaped capture pads 417-2, and seven circle-shaped capture pads 417-3. Each L-shaped capture pad 417-1 may have a size more than three times a size of one circle-shaped capture pad 417-3, and each rectangular-shaped capture pad 417-2 may have a size more than two times the size of one circle-shaped capture pad 417-3. In different applications, the laminate panel 410 may include fewer or more strips 420 with different layout configurations. Each strip 420 may include fewer or more capture pads 417 with different shapes. Each of the first pads 414, each of the second pads 416, and each of the capture pads 417 are confined within a corresponding strip 420.

[0096] Next, a first plating resist 426 and a second plating resist 428 are formed to provide an initial plating precursor 430 (step 304). Figure 24 illustrates a cross-sectional view of a portion of the initial plating precursor 430 along the dashed line A-A’ with a same horizontal coverage as shown in Figure 23B. Herein, the first plating resist 426 is formed over the first surface of the laminate body 412 to encapsulate the first pads 414, and the second plating resist 428 is formed over the seed metal film 418 (over the second surface of the laminate body 412) to encapsulate the second pads 416 and the capture pads 417. Note that the seed metal film 418 is not fully covered by the second plating resist 428 (e.g., the seed metal film 418 is exposed at a side of the laminate panel 410). The first plating resist 426 and the second plating resist 428 may be formed of a polymer that can be polymerized with exposure to UV light. A thickness of the second plating resist 428 is based on a desired thickness of copper posts formed through the second plating resist 428 in a subsequent step (e.g., plating step 308, more details are described below).

[0097] The initial plating precursor 430 is then flipped and selectively etched to provide a first plating precursor 432 (step 306). Figure 25A is a cross-sectional view of a portion of the first plating precursor 432 along the dashed line A-A’ with a same horizontal coverage as shown in Figure 23B, while Figure 25B is a topview of the same portion of the first plating precursor 432 (i.e., towards the second surface of the laminate body 412). The first plating precursor 432 includes a number of lower plating holes 434 that are formed by selectively removing portions of the second plating resist 428 over the capture pads 417, respectively, for each strip 420. Herein, each lower plating hole 434 extends through the second plating resist 428 to expose a corresponding capture pad 417 and is confined within the corresponding capture pad 417. Each lower plating hole 434 has a same first depth D1 between 10 pm and 140 pm, or up to 200 pm, which is based on a desired thickness of the copper posts formed through the second plating resist 428 and within the lower plating holes 434 in a subsequent step (e.g., plating step 308, more details are described below).

[0098] In addition, each lower plating hole 434 may have a same or similar shape (in a horizontal plane) as the corresponding capture pad 417. For the purpose of this illustration, within each strip 420, the lower plating holes 434 include three L-shaped lower plating holes 434-1 (to expose the three L-shaped capture pads 417-1 , respectively), three rectangular-shaped lower plating holes 434-2 (to expose the three rectangular-shaped capture pads 417-2, respectively), and seven circle-shaped lower plating holes 434-3 (to expose the seven circleshaped capture pads 417-3, respectively). Herein, each L-shaped lower plating hole 434-1 may have a size more than three times a size of one circle-shaped lower plating hole 434-3, and each rectangular-shaped lower plating hole 434-2 may have a size more than two times the size of one circle-shaped lower plating hole 434-3. Note that each of the first pads 414 and each of the second pads 416, which are used to accommodate electronic components (more details are described below), are still fully covered by the first and second plating resists 426 and 428, respectively. The lower plating holes 434 may be formed by photoresist patterning. In particular, the second plating resist 428 is selectively polymerized with LIV light, and a chemical developing solution is applied to remove nonpolymerized portions of the second plating resist 428 to form the lower plating holes 434.

[0099] Figure 26 shows a first electrolytic copper plating step (step 308). Herein, the first plating precursor 432, functioning as a cathode, and an anode 436 are immersed in a plating material 440 within a container 442. The anode 436 is coupled to a positive terminal of a voltage source Vdd and the first plating precursor 432 is coupled to a negative terminal of the voltage source Vdd via the seed metal film 418. Since the capture pads 417 are connected by the seed metal film 418, each capture pad 417 is electrically connected to the voltage source Vdd. The exposed capture pads 417 (though the corresponding lower plating holes 434) function as electrolytic plating seed pads to attract the plating material 440. The plating material 440 includes copper.

[0100] During the electrolytic copper plating step, the plating material 440 will gradually fill the lower plating holes 434, the first plating resist 426 protects the first pads 414, and the second plating resist 428 protects the second pads 416. Typically, outer edges of a plated area of the first plating precursor 432 will have a higher current density than a middle portion of the plated area of the first plating precursor 432. As such, during the same plating step, copper posts plated at the outer edge of the plated area of the first plating precursor 432 will have a greater height than copper posts plated in the middle portion of the plated area of the first plating precursor 432. The copper posts plated in the middle portion of the plated area of the first plating precursor 432 have negligible height variation. In this embodiment, the plated area of the first plating precursor 432 is a combination of all strips 420.

[0101] Figures 27A and 27B show a first post-plating precursor 444, which includes lower copper posts 446 within corresponding lower plating holes 434, respectively. Figure 27A is a cross-sectional view of a portion of the first postplating precursor 444 along the dashed line A-A’ with a same horizontal coverage as shown in Figure 23B, while Figure 27B is a top view of the same portion of the first post-plating precursor 444 (i.e., towards the second surface of the laminate body 412). Each lower copper post 446 has a height between 10 pm and 140 pm, or up to 200 pm, and has a shape aligned with the corresponding lower plating hole 434. Within each strip 420, the lower copper posts 446 include threeL-shaped lower copper posts 446-1 (within the three L-shaped lower plating holes 434-1 , respectively), three rectangular-shaped lower copper posts 446-2 (within the three rectangular-shaped lower plating holes 434-2, respectively), and seven circle-shaped lower copper posts 446-3 (within the seven circle-shaped lower plating holes 434-3, respectively).

[0102] Herein, the lower copper posts 446 in outer portions of the first postplating precursor 444 (i.e., at outer edges of the combination of all strips 420) will be taller than the lower copper posts 446 in a middle portion of the first postplating precursor 444 (i.e., a middle portion of the combination of all strips 420). For the purpose of this illustration, one L-shaped lower copper post 446-1 located close to the point A (i.e., close to one outer edge of the combination of all strips 420) is taller than one rectangular-shaped lower copper post 446-2 located away from the point A (i.e., away from the outer edge of the combination of all strips).

[0103] An optional first grinding step may be followed to planarize the lower copper posts 446 (step 310). Figure 28 is a cross-sectional view of the portion of the first post-plating precursor 444 during the first grinding step. After the first grinding step, each lower copper post 446 has a same height (e.g., between 10 pm and 140 pm) and has an exposed horizontal surface (through the second plating resist 428) at a same plane. Notice that each L-shaped lower copper post 446-1 has more than three times the copper mass than one circle-shaped lower copper post 446-3, and each rectangular-shaped lower copper post 446-2 has more than two times the copper mass than one circle-shaped lower copper post 446-3.

[0104] Next, a third plating resist 448 is formed over the second plating resist 428 to provide a second plating precursor 450 (step 312). Figure 29 is a cross- sectional view of a portion of the second plating precursor 450 with a same horizontal coverage as shown in Figure 23B. The third plating resist 448 encapsulates each lower copper post 446 within the second plating resist 428. The third plating resist 448 may be formed of a polymer that can be polymerized with exposure to UV light, and has a thickness T between 10 pm and 140 pm, or up to 200 pm, which is based on a desired thickness of the copper posts formedthrough the third plating resist 448 in a subsequent step (e.g., plating step 316, described in more detail below). In other words, the thickness T of the third plating resist 448 enables a desired thickness of a final copper post structure that is formed through the second plating resist 428 and the third plating resist 448. The thickness T of the third plating resist 448 needs to be no smaller than a difference between the desired thickness of the final copper post structure and the thickness of the lower copper posts 446.

[0105] The second plating precursor 450 is then selectively etched to provide a third plating precursor 452 (step 314). Figure 30A is a cross-sectional view of a portion of the third plating precursor 452 with a same horizontal coverage as shown in Figure 23B, while Figure 30B is a top view of the same portion of the third plating precursor 452 (i.e., towards the second surface of the laminate body 412). The third plating precursor 452 includes a number of upper plating holes 454 that are formed by photoresist patterning. In particular, the third plating resist 448 is selectively polymerized with UV light, such that non-polymerized portions of the third plating resist 448 are over each of the lower copper posts 446. Then, a chemical developing solution is applied to remove the non-polymerized portions of the third plating resist 448 to form the upper plating holes 454. Herein, each upper plating hole 454 has a same size and a same shape (e.g., a cylindrical shape), and extends through the third plating resist 448 to expose a portion of a corresponding lower copper post 446. In some applications, the upper plating holes 454 may have different sizes and / or different shapes (such as a cube shape, cuboid, etc.). Each upper plating hole 454 has a second depth D2 the same as the thickness T of the third plating resist 448.

[0106] One or more upper plating holes 454 are confined within the corresponding lower copper post 446. None of the upper plating holes 454 is formed outside the lower copper post 446. For the purpose of this illustration, there are three upper plating holes 454 confined within one L-shaped lower copper post 446-1 , two upper plating holes 454 confined within one rectangularshaped lower copper post 446-2, and one upper plating hole 454 confined within one circle-shaped lower copper post 446-3. In different applications, due to thedifferent shapes of the lower copper posts 446, there might be fewer or more upper plating holes 454 confined within a corresponding lower copper post 446.

[0107] Figures 31 A and 31 B show a second post-plating precursor 456 formed from the third plating precursor 452 by a second electrolytic copper plating step (step 316, similar as step 308 shown in Figure 26). Figure 31 A is a cross-sectional view of a portion of the second post-plating precursor 456 with a same horizontal coverage as shown in Figure 23B, while Figure 31 B is a top view of the same portion of the second post-plating precursor 456 (i.e., towards the second surface of the laminate body 412).

[0108] During the second electrolytic copper plating step, each lower copper post 446 is electrically connected to the voltage source Vdd via the corresponding capture pad 417 and the seed metal film 418. Exposed portions of the lower copper posts 446 (through the corresponding upper plating holes 454) function as electrolytic plating seed pads to attract the plating material into the corresponding upper plating holes 454, so as to form upper copper posts 458 within the corresponding upper plating holes 454, respectively. As such, one or more upper copper posts 458 are formed over one corresponding lower copper post 446 to provide a combined copper post 460 (or a copper post structure 460). The upper copper posts 458 may have a same or different shapes from each other. One upper copper post 458 may have a shape of a circle, a rectangle, a square, etc. For the purpose of this illustration, one first copper post structure 460-1 is composed of one L-shaped lower copper post 446-1 and three corresponding upper copper posts 458 over the L-shaped lower copper post 446- 1 , one second copper post structure 460-2 is composed of one rectangularshaped lower copper post 446-2 and two corresponding upper copper posts 458 over the rectangular-shaped lower copper post 446-2, and one third copper post structure 460-3 is composed of one circle-shaped lower copper post 446-3 and one corresponding upper copper post 458 over the circle-shaped lower copper post 446-3. In different applications, each copper post structure 460 may be composed of one lower copper post 446 with a different shape and / or size and more corresponding upper copper posts 458 over such lower copper post 446.Each copper post structure 460 has a thickness between 20 pm and 280 pm, or up to 340 pm.

[0109] By utilizing the first and second electrolytic copper plating steps, each lower copper post 446 may have a different size and / or shape from the corresponding upper copper post(s) 458. To accommodate a following assembly (e.g., attachment to a printed circuit board), in some applications, each upper copper post 458 formed in the second electrolytic copper plating step has a same horizontal size / shape, while in some applications, the upper copper posts 458 may have different shapes and / or sizes from each other. Herein, if certain upper copper posts 458 are scheduled to be electrically connected (e.g., certain upper copper posts 458 are scheduled to be grounded), a larger lower copper post 446 can be formed in the first electrolytic copper plating step to connect at least some of the certain upper copper posts 446. As illustrated in Figure 31 B, one L-shaped lower copper post 446-1 is connected to three corresponding upper copper posts 458. Herein, the L-shaped lower copper post 446-1 has more copper mass than three individual copper posts that can accommodate the three corresponding upper copper posts 458 (e.g., having more copper mass than three circle-shaped lower copper posts 446-3). Thus, without increasing the height and a combined footprint of the lower copper posts 446 (i.e., without increasing the height and combined footprint of the copper post structures 460), the copper mass within the second post-plating precursor 456, and in consequence in a final product, will increase. The increased copper mass will enhance the thermal conductivity of electronic components connected to the copper post structure 460, and in consequence will enhance power handling capability and electrical performance of the final product. To maximize the copper mass in the second post-plating precursor 456, without changing a total thickness of one copper post structure 460, the thickness of the lower copper posts 446 increases to as thick as 140 pm, while the thickness of the upper copper posts 458 decreases to as thin as 10 pm. A thickness ratio between one lower copper post 446 and its corresponding upper copper posts 458 is dependent upon the thermal and electrical needs of the final product. In practice, the lower copper posts 446 / the capture pads 417can be grouped across the entire second surface of the laminate body 412 to enable a large ground / thermal plane.

[0110] Furthermore, each upper copper post 458 formed in the second electrolytic copper plating step has a height between 10 pm and 140 pm (or up to 200 pm), and a diameter between 150 pm and 250 pm. The upper copper posts 458 may have a 150 pm to 250 pm pitch relative to one another. Due to the non- uniform plating current density, the upper copper posts 458 / the copper post structures 460 in outer portions of the second post-plating precursor 456 (i.e., at the outer edges of the combination of all strips 420) will be taller than the upper copper posts 458 / the copper post structures 460 in a middle portion of the second post-plating precursor 456 (i.e., the middle portion of the combination of all strips 420). For the purpose of this illustration, first and second upper copper posts 458-1 and 458-2 / the first copper post structure 460-1 (located close to the A point / close to the outer edges of the second post-plating precursor 456) are taller than a third upper copper post 458-3 / the second copper post structure 460- 2 (located close to the A’ point and away from the outer edges of the second post-plating precursor 456, A’ point located in an interior portion of the second post-plating precursor 456).

[0111] The height variation of the upper copper posts 458 / the copper post structures 460 will lead to surface unevenness in subsequent fabrication steps (e.g., a molding step), which may cause deflection / deformation of the laminate panel 410, and in consequence will cause die cracks and component interconnect failures (more details are described below). Therefore, a grinding step is followed to planarize the upper copper posts 458 / the copper post structures 460 (step 318). Figure 32 is a cross-sectional view of the portion of the second post-plating precursor 456 during this grinding step. After this grinding step, each copper post structure 460 has a same height (e.g., between 20 pm and 280 pm) and has an exposed horizontal surface (through the second plating resist 428) at a same plane.

[0112] The first plating resist 426, the second plating resist 428, and the third plating resist 448 are then removed to provide the laminate panel 410 with thecopper post structures 460 (step 320). Figure 33A is a cross-sectional view of a portion of the laminate panel 410 with the copper post structures 460 (having a same horizontal coverage as shown in Figure 23B), while Figure 33B is a top view of the same portion of the laminate panel 410 with the copper post structures 460 (i.e., towards the second surface of the laminate body 412).

[0113] The copper post structures 460 protrude from the second surface of the laminate body 412 and provide a combined flat plane over the second surface of the laminate body 412. The first pads 414 on the first surface of the laminate body 412 and the second pads 416 on the second surface of the laminate body 412 are also exposed. The first plating resist 426, the second plating resist 428, and the third plating resist 448 are removed by chemical stripping.

[0114] Originally, the second pads 416 and the capture pads 417 were connected by the seed metal film 418. Since the copper post structures 460 are directly formed over corresponding capture pads 417, respectively, the copper post structures 460 are also electrically connected to each other by the seed metal film 418. Figure 34 illustrates a flash etching step (step 322), in which the second pads 416 and the capture pads 417 are separated from each other by etching portions of the seed metal film 418 between the second pads 416 and / or between the capture pads 417. As such, the copper post structures 460 formed on the capture pads 417 are also separated from each other. The remaining portions of the seed metal film 418 are a number of individual seed metal pieces 418P. Each individual seed metal piece 418P is vertically under and aligned with a corresponding second pad 416 or a corresponding capture pad 417.

[0115] After the copper post structures 460 are formed on the second surface of the laminate body 412, one or more first electronic components 462 are mounted to the first pads 414 for each strip 420 (step 324), as illustrated in Figure 35. For the purpose of this illustration, the one or more first electronic components 462 include a first surface mounted device (SMD) 462-1 , a second SMD 462-2, a first flip-chip die 462-3 with die copper pillars, and a second flipchip die 462-4 with die solder balls. Each first electronic component 462 isconfined within a corresponding strip 420. In different applications, there might be fewer or more first electronic components 462 mounted on the first surface of the laminate body 412. The first electronic components 462 may be other active or passive electronic components. The first electronic components 462 are mounted to the first pads 414 with or without adhesive material. The first electronic components 462 are electrically connected to the corresponding metal layers within the laminate body 412, respectively (not shown). In this step, the copper post structures 460 may stand on a support block (not shown) to mechanically support the laminate panel 410.

[0116] Next, a first mold compound 466 is applied over the first surface of the laminate body 412 to provide a single-side molded precursor 468 (step 326). Figure 36 is a cross-sectional view of a portion of the single-side molded precursor 468 (having a same horizontal coverage as shown in Figure 23B). The first mold compound 466 encapsulates each first electronic component 462. The first mold compound 466 may be an organic epoxy resin system or the like, and may be applied by various procedures, such as sheet molding, overmolding, compression molding, transfer molding, dam fill encapsulation, or screen print encapsulation. In a typical molding step (e.g., a compression molding), a molding pressure used for applying the first mold compound 466 is between 100 psi and 1000 psi. Herein, if the horizontal surfaces of each copper post structure 460 are at a same plane (e.g., the grinding step 318 is applied), each copper post structure 460 will sit on the support block (not shown) to make the laminate panel 410 lie flat. Thus, during the first molding step, the copper post structures 460 are capable of providing strong and solid mechanical support to the laminate panel 410. There will be no vertical deformations occurring to the laminate panel 410, no die cracks occurring to the first electronic components 462, and no connection failures for the first electronic components 462. A curing process (not shown) is then used to harden the first mold compound 466. The curing temperature is between 100QC and 320QC depending on which material is used as the first mold compound 466. A planarization process may also be applied to planarize a top surface of the first mold compound 466 (not shown).

[0117] The single-side molded precursor 468 is then flipped, and one or more second electronic components 470 are mounted to the second pads 416 for each strip 420 (step 328), as illustrated in Figure 37. For the purpose of this illustration, the one or more second electronic components 470 include a third flip-chip die 470-1 with die copper pillars, a fourth flip-chip die 470-2 with die solder balls, and a fifth flip-chip die 470-3 with die copper pillars. In different applications, there might be fewer or more second electronic components 470 mounted on the second surface of the laminate body 412. The one or more second electronic components 470 may be other active or passive electrical components. In one embodiment, the copper post structures 460 may extend vertically beyond a backside of each of the one or more second electronic components 470 (i.e., each copper post structure 460 may be taller than the one or more second electronic components 470, not shown). In one embodiment, the copper post structures 460 may not extend vertically beyond the backside of each of the one or more second electronic components 470 but extend vertically beyond an active device region of each of the one or more second electronic components 470.

[0118] The one or more second electronic components 470 are mounted to the second pads 416 with or without adhesive material. The one or more second electronic components 470 may be electrically connected to the one or more first electronic components 462 via the corresponding metal layers within the laminate body 412 (not shown). The one or more first electronic components 462 and the one or more second electronic components 470 may also be electrically connected to the copper post structures 460 via the corresponding metal layers within the laminate body 41 (not shown). Thus, the heat generated from the one or more first electronic components 462 and the one or more second electronic components 470 can be conducted through the copper posts structures 460. Since the copper post structures 460 (e.g., the first copper post structures 460-1 and the second copper post structures 460-2) may include more copper mass than individual copper posts occupying a same footprint, the thermal performance, power handling capability, and in consequence the electricalperformance, of the one or more first electronic components 462 and the one or more second electronic components 470 will be enhanced. The one or more second electronic components 470 and the one or more first electronic components 462 may be gallium arsenide devices, silicon devices, or the like.

[0119] Next, a second mold compound 472 is applied over the second surface of the laminate body 412 to provide a double-side molded package 474 (step 330). Figure 38 is a cross-sectional view of a portion of the double-side molded package 474 (having a same horizontal coverage as shown in Figure 23B). The second mold compound 472 encapsulates the one or more second electronic components 470 and the copper post structures 460. The second mold compound 472 may be an organic epoxy resin system or the like and may be formed of a same or different material from the first mold compound 466. The second mold compound 472 may be applied by various procedures, such as sheet molding, overmolding, compression molding, transfer molding, dam fill encapsulation, or screen print encapsulation. Herein, the planarized first mold compound 466 provides mechanical support to the laminate panel 410, such that during the second molding step, there will be no vertical deformations occurring to the laminate panel 410, no die cracks occurring to the second electronic components 470, and no connection failures for the second electronic component 470.

[0120] An additional grinding step (step 332) of the second mold compound 472 of the double-side molded package 474 is then followed. Figure 39 is a cross-sectional view of the portion of the double-side molded package 474 after this additional grinding step. The second mold compound 472 is ground until each copper post structure 460 is exposed. If the copper post structures 460 are taller than each of the one or more second electronic components 470, the one or more second electronic components 470 are still fully encapsulated by the second mold compound 472 after the additional grinding (not shown). If the copper post structures 460 are shorter than certain ones of the one or more second electronic components 470, a portion of each of the certain ones of the one or more second electronic components 470 (e.g., die substrate) might beground to expose each copper post structure 460. Since each copper post structure 460 always extends vertically beyond the active device region of each of the one or more second electronic components 470, this grinding process will not affect the active device region of each of the one or more second electronic components 470.

[0121] The double-side molded package 474 is then singulated into individual double-side molded modules 476 (step 334). Figure 40 shows one of the individual double-side molded modules 476. The strip margins 422 of the laminate panel 410 may not be included in the final individual double-side molded module 476. Each individual double-side molded module 476 includes the one or more first electronic components 462, the first mold compound 466, the one or more second electronic components 470, the second mold compound 472, the copper post structures 460, and a portion of the laminate panel 410 within a corresponding strip 420. Since each copper post structure 460 has a height only between 20 pm and 280 pm, the double-side molded module 476 is capable of having a thickness less than 0.7 mm.

[0122] The systems and methods for increasing copper mass of a double-side molded module without increasing a thickness of the double-side molded module, according to aspects disclosed herein, may be provided in or integrated into any electronic device where thermal challenges exist. Examples, without limitation, include a cellular handset, a set-top box, an entertainment unit, a navigation device, a communications device, a fixed location data unit, a mobile location data unit, a global positioning system (GPS) device, a mobile phone, a cellular phone, a smartphone, a session initiation protocol (SIP) phone, a tablet, a phablet, a server, a computer, a portable computer, a mobile computing device, a wearable computing device (e.g., a smartwatch, a health or fitness tracker, eyewear, etc.), a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, avionics systems, a drone, and a multicopter.

[0123] With reference to Figure 41 , the concepts described above may be implemented in various types of communication devices 500, such as those listed in the previous paragraph. The communication device 500 will generally include a control system 502, a baseband processor 504, transmit circuitry 506, receive circuitry 508, antenna switching circuitry 510, multiple antennas 512, and user interface circuitry 514. Herein, at least one or any combination of the control system 502, the baseband processor 504, the transmit circuitry 506, and the receive circuitry 508 may be implemented in the double-side molded module 266 (e.g. implemented in the first flip-chip die 252-3, the second flip-chip 252-4, and / or the second electronic component 260), which is provided by the process shown in Figure 1 as described above, or implemented in the double-side molded module 476 (e.g. implemented in the first flip-chip die 462-3, the second flip-chip 462-4, the third flip-chip die 470-1 , the fourth flip-chip die 470-2, and / or the fifth flip-chip die 470-3), which is provided by the process shown in Figure 22 as described above.

[0124] In a non-limiting example, the control system 502 can be a field- programmable gate array (FPGA) or an application-specific integrated circuit (ASIC), as an example. In this regard, the control system 502 can include at least a microprocessor(s), an embedded memory circuit(s), and a communication bus interface(s). The receive circuitry 508 receives radio frequency signals via the antennas 512 and through the antenna switching circuitry 510 from one or more base stations. A low noise amplifier and a filter of the receive circuitry 508 cooperate to amplify and remove broadband interference from the received signal for processing. Down conversion and digitization circuitry (not shown) will then down convert the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams using an analog-to-digital converter(s) (ADC).

[0125] The baseband processor 504 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations, as will be discussed in greater detail below. The baseband processor504 is generally implemented in one or more digital signal processors (DSPs) and ASICs.

[0126] For transmission, the baseband processor 504 receives digitized data, which may represent voice, data, or control information, from the control system 502, which it encodes for transmission. The encoded data is output to the transmit circuitry 506, where a digital-to-analog converter(s) (DAC) converts the digitally encoded data into an analog signal and a modulator modulates the analog signal onto a carrier signal that is at a desired transmit frequency or frequencies. A power amplifier will amplify the modulated carrier signal to a level appropriate for transmission and deliver the modulated carrier signal to the antennas 512 through the antenna switching circuitry 510. The multiple antennas 512 and the replicated transmit and receive circuitries 506, 508 may provide spatial diversity. Modulation and processing details will be understood by those skilled in the art.

[0127] It is contemplated that any of the foregoing aspects, and / or various separate aspects and features as described herein, may be combined for additional advantage. Any of the various embodiments as disclosed herein may be combined with one or more other disclosed embodiments unless indicated to the contrary herein.

[0128] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.RECTIFIED SHEET (RULE 91) ISA / EP

Claims

AMENDED CLAIMS received by the International Bureau on 27 November 2024 (27.11 .2024)1. A double-side molded module comprising: a laminate panel that includes a laminate body with a first surface and a second surface opposite the first surface;• at least one electronic component formed on the second surface of the laminate body;• a plurality of copper post structures formed on the second surface of the laminate body, wherein:• the plurality of copper post structures includes a plurality of lower copper posts that is formed on the second surface of the laminate body and surrounding the at least one electronic component, and a plurality of upper copper posts directly formed over the plurality of lower copper posts; and• at least one of the plurality of copper post structures includes a first lower copper post of the plurality of lower copper posts and two or more of the plurality of upper copper posts formed over and limited to horizontal dimensions of the first lower copper post; and• a mold compound formed over the second surface of the laminate body to partially cover the at least one electronic component and to partially cover each of the plurality of copper post structures, such that a tip surface of each of the plurality of upper copper posts is exposed through the mold compound.

2. The double-side molded module of claim 1 wherein each of the plurality of upper copper posts has a same shape and a same size.

3. The double-side molded module of claim 1 wherein the plurality of lower copper posts has one or more shapes consisting of circles, rectangles, squares, L-shapes, C-shapes, ovals, rings, open sided shapes, and closed sided shapes.

4. The double-side molded module of claim 1 wherein:• each of the plurality of copper post structures has a thickness between 20 μm and 280 μm;• each of the plurality of lower copper posts has a thickness between 10 μm and 140 μm; and• each of the plurality of upper copper posts has a thickness between 10 μm and 140 μm.

5. The double-side molded module of claim 1 wherein at least one of the plurality of copper post structures includes a second lower copper post of the plurality of lower copper posts and only one of the plurality of upper copper posts formed over and limited to horizontal dimensions of the second lower copper post.

6. The double-side molded module of claim 1 further comprising: at least one electronic component formed on the first surface of the laminate body.

7. The double-side molded module of claim 6 wherein the laminate panel further comprises a plurality of capture pads on the second surface of the laminate body, a plurality of first pads on the first surface of the laminate body, and a plurality of second pads on the second surface of the laminate body and surrounded by the plurality of capture pads, wherein:• the plurality of lower copper posts of the plurality of copper post structures is formed on the plurality of capture pads, respectively;• the at least one electronic component on the first surface of the laminate body is formed on the plurality of first pads, and the at least one electronic component on the second surface of the laminate body is formed on the plurality of second pads; and• the at least one electronic component on the first surface of the laminate body and the at least one electronic component on the second surface of the laminate body are electrically connected to corresponding ones of the plurality of copper post structures.

8. The double-side molded module of claim 6 wherein:• the at least one electronic component on the first surface of the laminate body is one or more of a group consisting of flip-chip dies and surface mounted devices (SMDs); and• the at least one electronic component on the second surface of the laminate body is one or more of a group consisting of flip-chip dies and SMDs.

9. The double-side molded module of claim 6 further comprising: another mold compound formed over the first surface of the laminate body to completely cover the at least one electronic component on the first surface of the laminate body.

10. A communication device comprising: a control system; a baseband processor; receive circuitry; and transmit circuitry, wherein at least one or any combination of the control system, the baseband processor, the transmit circuitry, and the receive circuitry is implemented in a double-side molded module, which includes a laminate panel, at least one electronic component, a plurality of copper post structures, and a mold compound, wherein:• the laminate panel includes a laminate body with a first surface and a second surface opposite the first surface;• the at least one electronic component is formed on the second surface of the laminate body;• each of the plurality of copper post structures is formed on the second surface of the laminate body;• the plurality of copper post structures includes a plurality of lower copper posts that is formed on the second surface of the laminate body and surrounding the at least one electronic component and a plurality of upper copper posts directly formed over the plurality of lower copper posts;• at least one of the plurality of copper post structures includes a first lower copper post of the plurality of lower copper posts and two or more of the plurality of upper copper posts formed over and limited to horizontal dimensions of the first lower copper post; and• the mold compound is formed over the second surface of the laminate body to partially cover the at least one electronic component and to partially cover each of the plurality of copper post structures, such that a tip surface of each of the plurality of upper copper posts is exposed through the mold compound.

11. A method comprising: providing an initial plating precursor having a laminate panel, a first plating resist, and a second plating resist, wherein:• the laminate panel includes a laminate body with a first surface and a second surface opposite the first surface, and capture pads on the second surface of the laminate body; and• the first plating resist is formed over the first surface of the laminate body, and the second plating resist is formed over the second surface of the laminate body to encapsulate the capture pads;• selectively removing portions of the second plating resist to provide a plurality of lower plating holes, wherein each of the plurality of lower plating holesextends through the second plating resist to expose a corresponding one of the capture pads;• forming a plurality of lower copper posts in the plurality of lower plating holes, respectively, wherein each of the plurality of lower copper posts is connected to the corresponding one of the exposed capture pads;• applying a third plating resist over the second plating resist to provide a second plating precursor, wherein the third plating resist encapsulates each of the plurality of lower copper posts;• selectively removing portions of the third plating resist to provide a plurality of upper plating holes, wherein:• each of the plurality of upper plating holes extends through the third plating resist to expose a corresponding one of the plurality of lower copper posts; and• two or more of the plurality of upper plating holes are formed over and limited to horizontal dimensions of a first one of the plurality of lower copper posts; and• forming a plurality of upper copper posts in the plurality of upper plating holes, respectively, wherein:• each of the plurality of upper copper posts is located in a corresponding one of the plurality of upper plating holes and directly connected to the corresponding one of the lower copper posts;• a plurality of copper post structures is composed of the plurality of upper copper posts and the plurality of lower copper posts;• one of the plurality of copper post structures includes the first one of the plurality of lower copper posts and two or more of the plurality of upper copper posts• formed over and limited to the horizontal dimensions of the first one of the plurality of lower copper posts; and• the plurality of lower copper posts and the plurality of upper copper posts are formed by two individual electrolytic copper plating steps.

12. The method of claim 11 wherein each of the plurality of upper plating holes has a same shape and a same size.

13. The method of claim 11 wherein the plurality of lower copper posts has one or more shapes consisting of circles, rectangles, squares, L-shapes, C- shapes, ovals, rings, open sided shapes, and closed sided shapes.

14. The method of claim 11 wherein the laminate panel further includes a seed metal film, wherein:• the capture pads are connected with each other by the seed metal film;• forming the plurality of lower copper posts is provided by a first electrolytic copper plating step, wherein the capture pads are coupled to a voltage source via the seed metal film and function as electrolytic plating seed pads to attract a plating material into the plurality of lower plating holes to form the plurality of lower copper posts; and• forming the plurality of upper copper posts is provided by a second electrolytic copper plating step, wherein the plurality of lower copper posts is electrically coupled to the voltage source via the capture pads and the seed metal film, and portions of the plurality of lower copper posts through the plurality of upper plating holes function as electrolytic plating seed pads to attract a plating material into the plurality of upper plating holes, so as to form the plurality of upper copper posts.

15. The method of claim 11 wherein:• each of the plurality of copper post structures has a thickness between 20 μm and 280 μm;• each of the plurality of lower copper posts has a thickness between 10 μm and 140 μm; and• each of the plurality of upper copper posts has a thickness between 10 μm and 140 μm.

16. The method of claim 11 further comprising grinding the plurality of upper copper posts, wherein after the grinding, each of the plurality of copper post structures has a same height.

17. The method of claim 11 wherein within the initial plating precursor, the laminate panel further includes first pads on the first surface of the laminate body and second pads on the second surface of the laminate body, wherein:• the capture pads and the second pads are connected with each other by the seed metal film;• the first plating resist formed over the first surface of the laminate body encapsulates the first pads; and• the second plating resist formed over the second surface of the laminate body resides over the seed metal film and encapsulates both the capture pads and the second pads.

18. The method of claim 17 further comprising, after forming the plurality of upper copper posts, removing the first plating resist, the second plating resist, and the third plating resist, so as to expose the first pads on the first surface of the laminate body and to expose the second pads, the capture pads, and the seed metal film on the second surface of the laminate body.

19. The method of claim 18 further comprising selectively removing portions of the seed metal film so as to separate each of the capture pads and each of the second pads.

20. The method of claim 19 further comprising: forming at least one first electronic component on the plurality of first pads; forming at least one second electronic component on the plurality of second pads;• forming a first mold compound over the first surface of the laminate body to completely cover the at least one first electronic component;• forming a second mold compound over the second surface of the laminate body to completely cover the at least one second electronic component; and• thinning down the second mold compound to expose each of the plurality of upper copper posts.

21. The method of claim 11 further comprising grinding the plurality of lower copper posts before applying the third plating resist over the second plating resist, wherein after the grinding, each of the plurality of lower copper posts has a same height.

22. A method comprising: providing a plating precursor having a laminate panel, a first plating resist, and a second plating resist, wherein:• the laminate panel includes a laminate body, first pads on a first surface of the laminate body, second pads on a second surface of the laminate body, and a seed metal film on the second surface of the laminate body connecting each of the second pads;• in a horizontal aspect, the laminate panel includes multiple strips with strip margins therebetween, such that the strips are separate from each other, wherein each of the strips includes an active region, in which electronic components are mounted, and a non-active region, wherein the non-active region surrounds the active region and no electronic component extends horizontally into the non-active region;• each of the first pads and each of the second pads are limited to horizontal dimensions of a corresponding active region, and the seed metal film extends over the non-active region of each of the strips and the strip margins; and• the first plating resist is formed over the first surface of the laminate body to encapsulate the first pads, and the second plating resist is formed over the seed metal film to encapsulate the second pads;• selectively removing portions of the second plating resist to provide a plurality of plating holes over certain ones of the second pads within the active region of each of the strips, and to provide a plurality of additional plating holes over certain portions of the seed metal film within the non-active region of each of the strips and the strip margins, wherein:• the certain ones of the second pads within the active region of each of the strips are exposed through the plurality of plating holes, respectively; and• the certain portions of the seed metal film within the non-active region of each of the strips and the strip margins are exposed through the plurality of additional plating holes, respectively; and• forming a plurality of copper posts in the plurality of plating holes, respectively, and a plurality of additional copper posts in the plurality of additional plating holes, respectively, wherein:• each of the plurality of copper posts is connected to a corresponding one of the exposed second pads; and• each of the plurality of additional copper posts is connected to a corresponding one of the exposed portions of the seed metal film.

23. The method of claim 22 further comprising planarizing the plurality of copper posts and the plurality of additional copper posts, such that an exposed horizontal surface of each of the plurality of copper posts through the secondplating resist and an exposed horizontal surface of each of the plurality of additional copper posts through the second plating resist are at a same plane.

24. The method of claim 22 wherein:• each of the plurality of copper posts has a substantially same height between 100 μm and 150 μm, and a diameter between 150 μm and 250 μm; and• each of the plurality of additional copper posts has a height between 100 μm and 150 μm, and a diameter between 150 μm and 250 μm.

25. The method of claim 22 wherein the plurality of copper posts and the plurality of additional copper posts are formed by an electrolytic copper plating process.

26. The method of claim 22 further comprising removing the first plating resist and the second plating resist to provide the laminate panel with the plurality of copper posts within the active region of each of the strips and the plurality of additional copper posts within the non-active region of each of the strips and the strip margins.

27. The method of claim 26 further comprising selectively etching portions of the seed metal film to electrically separate the plurality of copper posts from each other.

28. The method of claim 27 further comprising: forming at least one first electronic component on the first pads; forming at least one second electronic component on the second pads; forming a first mold compound over the first surface of the laminate body to completely cover the at least one first electronic component;• forming a second mold compound over the second surface of the laminate body to completely cover the at least one second electronic component; and• thinning down the second mold compound to expose each of the plurality of copper posts.

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