Integrated circuit for radio signal processing, associated radio signal processing system and associated automotive vehicle

Abstract

Integrated circuit for radio signal processing, associated radio signal processing system and associated automotive vehicle The present invention relates to an integrated circuit suitable for processing radio signals comprising a substrate (12) comprising a first surface (14) and a second surface (16), the first surface (14) being suitable to receive at least one chip and the second surface (16) comprising connection elements suitable for connection to an electronic board (6), characterized in that said first surface (14) of said substrate (12) comprises at least one processing chip (18) configured to receive and demodulate radio signals and a memory chip (20), said memory chip (20) being connected to said processing chip (18) via said substrate (12).

Description

DESCRIPTIONTITLE: INTEGRATED CIRCUIT FOR RADIO SIGNAL PROCESSING, ASSOCIATED RADIO SIGNAL PROCESSING SYSTEM AND ASSOCIATED AUTOMOTIVE VEHICLE

[0001] The present invention relates to an integrated circuit suitable for processing radio signals, to a radio signal processing system comprising such an integrated circuit, and to a motor vehicle comprising a radio reception system comprising such a radio signal processing system.

[0002] The invention is in the field of radio reception and playback systems, also known as tuners, and has particular application in the automotive sector.

[0003] Radio signal processing systems incorporating software-defined radio (SDR) are known, comprising in particular a radio signal reception and demodulation device implemented partly as hardware and partly as software, using a microprocessor dedicated to digital signal processing (or a DSP). One of the advantages of such a system is that it allows adaptation, via software programming, to changes in format or radio standard.

[0004] It is advantageous to integrate such a radio signal processing system incorporating software-defined radio into a motor vehicle, in order to ensure reception and playback of radio signals in the vehicle, for example into the vehicle dashboard.

[0005] However, a number of problems and constraints arise in the context of integrating radio signal processing systems into motor vehicles.

[0006] On the one hand, as many functions are envisaged, the space available, for example in a motor vehicle dashboard, is limited and generally very small. On the other hand, in a motor vehicle, there are elements present which can add noise, for example acoustic noise and electronic or digitalnoise, whereas the radio signals are at a low level, making good-quality reception and playback of radio signals particularly difficult.

[0007] Traditionally, it is known to integrate a radio signal processing system into a motor vehicle, either via a dedicated device connected to the dashboard, or via an electronic board (or printed circuit board) integrated into the vehicle cabin.

[0008] In general, such an electronic board comprises, on the one hand, an application-specific integrated circuit (ASIC) dedicated to processing the radio signals, and, on the other hand, an electronic memory unit, called a remote memory unit, for example a RAM (random access memory) unit, which is relatively large, distinct, and remote from the ASIC, on the electronic board. For specific software processing, the internal memory of the dedicated ASIC is not sufficient, and the remote electronic memory unit is used. This requires connections and transmissions of numerous signals between the remote memory unit and the dedicated ASIC, which leads to various drawbacks, in particular digital noise. Indeed, the radiation induced by the signals (more than a dozen), all synchronized to the same clock signal (which makes it possible to add up the contributions of each signal because they occur at the same instant), creates digital noise, the main frequency of which is the memory usage frequency (and its subharmonics). This noise is both radiated by the tracks of the printed circuit board and conducted by the ground plane.

[0009] The purpose of the invention is to overcome the disadvantages of the prior art.

[0010] To this end, the invention proposes, according to one aspect, an integrated circuit suitable for processing radio signals, comprising a substrate comprising a first surface and a second surface, the first surface being suitable to receive at least one chip and the second surface comprising connection elements suitable for connection to an electronic board. The first surface of said substrate (12) comprises at least one processing chipconfigured to receive and demodulate of radio signals and a memory chip, said memory chip being connected to said processing chip via said substrate.

[0011] Advantageously, the integration of a memory chip and at least one processing chip configured to receive and demodulate radio signals on a first surface of the substrate of the integrated circuit enables both a reduction in size and a reduction in the digital noise. Thus, such an integrated circuit is particularly suitable for a motor vehicle radio signal processing system.

[0012] The integrated circuit suitable for processing radio signals according to the invention can also have one or more of the features hereunder, taken independently or according to all technically conceivable combinations.

[0013] The memory chip is a dynamic memory chip with a capacity of 64 megabytes or more, preferably 128 megabytes or more.

[0014] The memory chip is connected by a flip chip technology on said substrate, or by direct wire bonding or a bridge.

[0015] The first surface of the substrate comprises a first processing chip dedicated to receiving analog or digital radio signals and converting said radio signals into sampled digital signals, and a second processing chip dedicated to demodulating the sampled digital signals.

[0016] The circuit comprises a single processing chip configured to receive and demodulate radio signals.

[0017] According to another aspect, the invention relates to a radio signal processing system comprising an integrated circuit suitable for processing radio signals as briefly described above.

[0018] The radio signal processing system according to the invention can also have one or more of the features hereunder, taken independently or according to all technically conceivable combinations.

[0019] This radio signal processing system comprises at least one antenna suitable for receiving radio signals.

[0020] This radio signal processing system comprises two antennas suitable for receiving radio signals.

[0021] According to another aspect, the invention relates to a housing suitable for housing a radio signal processing system as briefly described above.

[0022] According to another aspect, the invention relates to a motor vehicle comprising a radio signal processing system as briefly described above.

[0023] The invention will become clearer on reading the following description, given solely by way of non-limiting example, and made with reference to the drawings, wherein:

[0024] [Fig. 1] Figure 1 is a schematic representation of a motor vehicle comprising a radio signal processing system according to one embodiment;

[0025] [Fig. 2] Figure 2 is a block diagram of an integrated circuit for processing radio signals in one embodiment.

[0026] Figure 1 schematically shows a motor vehicle 2 wherein a radio signal processing system 4 is integrated, for example into the dashboard (not shown).

[0027] The radio signal processing system 4 is configured to interact with an antenna 5 for receiving radio signals, and comprises, in the shown embodiment, an electronic board 6 (or printed circuit board) on which various electroniccomponents are connected by means of terminal pads, conductor tracks and through vias, so as to produce electrical circuits suitable for various applications.

[0028] In one variant, the radio signal processing system 4 comprises several antennas 5 for receiving radio signals.

[0029] In one embodiment, the radio signal processing system 4 comprises two antennas 5 for receiving radio signals.

[0030] In particular, the electronic board 6 comprises an integrated circuit 10, also known as an application-specific integrated circuit (ASIC), suitable for processing radio signals.

[0031] In one embodiment, the radio signal processing system 4 is encapsulated in a suitably sized housing, and forms a discrete electronic component. Preferably, the encapsulation in a housing is achieved with a cooling system integrated into the housing, enabling the heat generated by the internal chips when they are powered to be dissipated.

[0032] The integrated circuit 10 comprises a substrate 12, the substrate 12 comprising a first surface 14, visible in Figure 1 , and a second surface 16, not visible in Figure 1 , opposite the first surface 14.

[0033] The substrate 12 is a housing substrate, for example made in the same way as a PCB substrate, but with specific constraints in terms of track thinness, etching, and via.

[0034] The second surface 16 comprises connection elements (not shown) suitable for connecting the integrated circuit 10 to the electronic board 6.

[0035] Formed on the first surface 14 are respectively a die 18, a processing chip configured to receive analog or digital radio signals, convert the radiosignals into sampled digital signals, and demodulate the sampled digital signals, and a memory chip 20.

[0036] In one embodiment, the processing chip 18 is configured to receive radio signals received by the antenna 5, digitize them, and demodulate them by software processing. In addition, the processing chip 18 filters the received and demodulated signals, making it possible to obtain baseband signals which are then digitally processed.

[0037] The memory chip 20 is a dynamic memory chip with a capacity of 64 megabytes or more, preferably 128 megabytes or more.

[0038] Advantageously, the dynamic memory chip is a synchronous dynamic random access memory (SDRAM) chip.

[0039] The processing chip 18 and the memory chip 20 are connected via the substrate 12, and communicate via links shown schematically in Figure 1. The number of links shown in Figure 1 can vary, the representation in Figure 1 being given as an indication only.

[0040] Preferably, the memory chip 20 is connected on said substrate by flip chip technology. Preferably, all the chips integrated on said substrate are connected on said substrate by flip chip technology. Alternatively, the chips are integrated and connected by direct wire bonding or a bridge.

[0041] Figure 2 illustrates a second embodiment of an integrated circuit 10 suitable for processing radio signals.

[0042] In this second embodiment, the integrated circuit 10 comprises the memory chip 20, for example of the SDRAM type, as well as two radio signal processing chips, respectively a first processing chip 22 dedicated to receivinganalog or digital radio signals and converting them into sampled digital signals, and a second processing chip 24 dedicated to demodulating the radio signals.

[0043] The link between the first processing chip 22, also known as the receiver chip 22, and the second processing chip 24, also known as the demodulator chip, is a digital link via the substrate 12 which includes control signals and data.

[0044] The number of links shown in Figure 2 is given as an indication only and can vary in practice.

[0045] Advantageously, the separation between the reception of radio signals and the demodulation of sampled digital radio signals makes it possible to use one chip technology for the radio frequency (RF) part and another chip technology for the demodulation part.

[0046] This separation also makes it easier to modify the integrated circuit comprising the various processing chips. By way of example, a less noisy technology can be used on the receiver chip 22 (e.g. FD-SOI (fully depleted silicon on insulator)) and similarly a thinner technology node (that is, the minimum half-distance between two lithographed patterns) can be used on the processing chip 28 as the latter is composed solely of digital elements.

[0047] Advantageously, the integration of a memory chip, preferably a SDRAM chip, into the dedicated integrated circuit allows weak radio signals to be processed more efficiently, because of the proximity between the memory chip and the processing chip(s).

[0048] In addition, overall power consumption is advantageously reduced. Indeed, when the electronic memory unit is external to the integrated circuit dedicated to receiving radio signals, it is necessary to amplify the radio signals further. In the proposed implementation, such amplification can be avoided.

[0049] In addition, such an integrated circuit dedicated to processing radio signals is advantageously easier to integrate on a printed circuit of an electronic board, and fewer accounting tests are required at the time of integration on a printed circuit than when the electronic memory unit is external.

[0050] Finally, the size of the equipment for radio signal processing is advantageously reduced, and space is freed up by the memory chip on the printed circuit board and can be used to implement other functionalities. This is particularly advantageous for integration into a motor vehicle radio reception system.

Claims

Claims1. An integrated circuit suitable for processing radio signals comprising a substrate (12) comprising a first surface (14) and a second surface (16), the first surface (14) being suitable to receive at least one chip and the second surface (16) comprising connection elements suitable for connection to an electronic board (6), characterized in that said first surface (14) of said substrate (12) comprises at least one processing chip (18, 22, 24) configured to receive and demodulate radio signals and a memory chip (20), said memory chip (20) being connected to said processing chip (18, 22, 24) via said substrate (12).

2. The integrated circuit according to claim 1 , wherein said memory chip (20) is a dynamic memory chip with a capacity of 64 megabytes or more, preferably 128 megabytes or more.

3. The integrated circuit according to claim 1 or 2, wherein said memory chip (20) is connected by flip chip technology to said substrate (12), or by direct wire bonding or a bridge.

4. The integrated circuit according to one of claims 1 to 3, wherein said first surface (14) of the substrate (12) comprises a first processing chip (22) dedicated to receiving analog or digital radio signals and converting said radio signals into sampled digital signals and a second processing chip (24) dedicated to demodulating the sampled digital signals.

5. The integrated circuit according to any of claims 1 to 3, comprising a single processing chip (18) configured to receive and demodulate radio signals.

6. A radio signal processing system (4) comprising an electronic board (6) on which is connected an integrated circuit (10) suitable for processing radio signals in accordance with claims 1 to 6.

7. The radio signal processing system (4) according to claim 6, comprising at least one antenna (5) for receiving radio signals.

8. The radio signal processing system (4) according to claim 7, comprising two antennas (5) for receiving radio signals.

9. A housing suitable for accommodating a radio signal processing system (4) according to either of claims 7 or 8.

10. A motor vehicle comprising a radio signal processing system (4) according to either of claims 7 or 8.

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