Method for manufacturing a polishing pin, polishing pin, method for machining a workpiece with this polishing pin, machine tool and machining center equipped with it, and computer program product

Abstract

For the purpose of improving the manufacture of a polishing pin (25) having a base body (25) intended for the abrasive machining of a workpiece (10) in a machine tool (1), the following steps are provided: 1. Provision of the machine tool (1) having a tool holder (15), wherein the machine tool (1) is configured to hold the workpiece (10) to be machined in a workpiece holder (5); 2. Securing the base body (20) in the tool holder (15); 3. Conditioning the base body (20) located in the tool holder (15); 4. Applying an abrasive-free carrier layer (35) to at least a part of the base body (20), wherein the modulus of elasticity of the carrier layer (35) applied to the base body (20) is less than the modulus of elasticity of the workpiece (10) to be machined, and applying an abrasive (45) in the carrier layer (35) and / or into the carrier layer (35), or 5.In the event that the carrier layer is not free of abrasive material but contains an abrasive (45), the carrier layer (35) containing the abrasive (45) is applied to at least a portion of the base body (20), wherein the modulus of elasticity of the carrier layer (35) applied to the base body (20) is smaller than the modulus of elasticity of the workpiece (10) to be machined. Further aspects of the invention relate to a polishing pin (25) manufactured according to the method, the application of the polishing pin (25) for the abrasive machining of a workpiece (10), a correspondingly equipped machine tool (1), a correspondingly equipped machining center (80), and a computer program for carrying out the aforementioned methods.

Description

[0001] The present invention relates to a method for manufacturing a polishing pin according to claim 1, a polishing pin manufactured according to the method according to claim 9, a method for machining a workpiece with such a polishing pin according to claim 11, a machine tool applying these methods or comprising such a polishing pin according to claim 13, a machining center provided therewith according to claim 17 and a computer program product or a non-volatile storage medium comprising program code according to claim 19.

[0002] Polishing pins are generally known in principle. They serve to treat the surfaces of a workpiece by means of an abrasive process, for example, to polish, smooth, or perform a finishing treatment. An exemplary polishing pin is known from WO 2021 / 018504 A1, in which a shaft-like base body made of plastic is injection-molded with an abrasive polishing material. The polishing pin thus produced is then usually transported from its place of manufacture, in particular a factory, to another location, in particular a factory located far from the first factory, where it is used, in particular, in a machine tool to carry out the abrasive surface treatment of a workpiece. As can be seen, such known polishing pins are mass-produced items that have proven their worth in practice.However, the well-known polishing sticks are not always suitable for achieving the desired accuracy in the abrasive treatment of a surface.

[0003] It is therefore an object of the present invention to provide a method for manufacturing a polishing pin which offers a desired degree of accuracy.

[0004] This problem is solved by the method according to claim 1.

[0005] Specifically, this task is solved by a method for manufacturing a polishing pin, which is set up for the abrasive machining of a workpiece in a machine tool and has a base body, and which is characterized by the following steps: 1. Providing the machine tool having a tool holder, wherein the machine tool is configured to receive the workpiece to be machined in a workpiece holder; 2. Securing the base body in the tool holder; 3. Conditioning the base body located in the tool holder; 4. Applying an abrasive-free carrier layer to the base body, wherein the modulus of elasticity of the carrier layer applied to the base body is less than the modulus of elasticity of the workpiece to be machined, and applying an abrasive to and / or into the carrier layer, or 5. in the case that the carrier layer is not abrasive-free but contains an abrasive, applying the carrier layer containing the abrasive to the base body, wherein the modulus of elasticity of the carrier layer applied to the base body is less than the modulus of elasticity of the workpiece to be machined.

[0006] As is immediately apparent from the preceding explanation, the polishing pin is therefore manufactured, at least partially, using precisely the same machine tool in which the workpiece to be abraded by it is held. This advantageously enables a maximum degree of geometric coordination between the machine tool, polishing pin, and workpiece, resulting in the desired high precision of the abrasive machining process.

[0007] It should be emphasized at this point that, when using a polishing pin according to the invention, it is easily and reproducibly possible in practice to achieve a mean arithmetic height Sa according to ISO 25178 in the range of 0.0001 µm to 0.12 µm. Thus, the mean arithmetic height Sa achievable with the polishing pin according to the invention is orders of magnitude smaller than that known from the prior art. This also applies to the mean arithmetic roughness Ra achievable with the polishing pin according to the invention, which is less than 0.1 µm, in particular less than 0.05 µm and even less than the range of 0.01 µm, and thus ten times smaller than that achievable with polishing pins known from the prior art.In fact, the polishing pen according to the invention can advantageously produce surfaces of workpieces without visually conspicuous or active structures, in particular diffractive patterns, and with a desired waviness (mid-spatial waviness).

[0008] In the previously disclosed first step, a machine tool with a tool holder and a workpiece holder is provided. The machine tool, the tool holder, and the workpiece holder can have any suitable design, as will be explained later.

[0009] The base body of the polishing pin is attached to the tool holder. As is typical for tool holders, the attachment is reversible. The tool holder is advantageously designed as a hollow taper shank holder (HSK holder), which has proven itself in practice over a long period as a standardized and reliable component.

[0010] The base body itself can be designed in any suitable way. Advantageously, it is designed as a shank. It has a first end that can be inserted into the tool holder and a free end located distal to this. The abrasive material intended for the abrasive machining of a workpiece that is removablely inserted into the workpiece holder is applied to the latter end, as will be described in detail later.

[0011] The base body is advantageously made of a material with a comparatively high modulus of elasticity, in particular a hard metal, HSS steel or a ceramic, especially aluminium oxide.

[0012] Once the polishing pin body is inserted into the tool holder, it is conditioned according to the invention. During conditioning, the shape of the body body, its concentricity, its axial runout, and / or its surface finish are specifically modified or adjusted to a desired degree. Alternatively or cumulatively, it is possible to balance it.

[0013] This advantageously achieves an initial alignment of the machine tool and the polishing pin, thereby creating an important basis for increasing the accuracy of the polishing process.

[0014] The base body is then at least partially provided with material intended to come into contact with the workpiece surface during abrasive machining and to abrade the latter. This material is a carrier layer that is chemically and / or physically bonded to the base body and to which and / or in which at least one abrasive material responsible for the abrasive effect during machining of the workpiece is applied. In other words, abrasive material is applied to the surface of the carrier layer and / or at least partially incorporated into the carrier layer. According to the invention, two different steps, i.e., partial steps of the inventive method, are provided for this purpose: If the carrier layer is essentially free of abrasive material, i.e.,If the substrate is completely or essentially without abrasive material, then in a partial step (hereinafter referred to as the "first partial step"), this carrier layer is applied to the substrate, and subsequently the abrasive is applied to and / or incorporated into this substrate. If, however, the carrier layer already contains abrasive material in the desired quantity and quality, then in an alternative partial step to the first partial step (hereinafter referred to as the "second partial step"), this abrasive is simply applied to the substrate.It should be noted that, according to the invention, it may also be provided that, in the event that the carrier layer already contains a quantity or quality of abrasive material, but this material does not have a desired condition, additional abrasive material of the same or different quantity or quality can be applied to and / or incorporated into the carrier layer already containing abrasive material (hereinafter referred to as the "third step"; thus, the third step is a combination of the first and second steps). After completion of the first, second, or third step, the polishing pin comprising a base body and abrasive material is produced, the abrasive being formed from the carrier layer and the abrasive material.

[0015] The carrier layer is advantageously formed from a thermoplastic material, in particular acrylonitrile butadiene styrene (ABS), polylactide (PLA), polyethylene (PE) or polyamide (PA), from a crystalline plastic, in particular polyetheretherketone (PEEK), an epoxy resin, an elastomer or a thermoset.

[0016] According to the invention, it is further provided that the elastic modulus of the carrier layer applied to the base body is smaller than the elastic modulus of the workpiece to be machined. This advantageously ensures that the abrasive machining of the workpiece is carried out in a controlled manner.

[0017] In principle, the elastic modulus of the abrasive is greater than the elastic modulus of the workpiece being machined. Alternatively, however, it can be provided that the elastic modulus of the abrasive is less than the elastic modulus of the workpiece being machined.

[0018] Overall, this provides a method for advantageously and simply manufacturing a polishing pin tailored to specific machine tool characteristics, workpiece characteristics and tool holder characteristics.

[0019] It is understood that the previously disclosed first step, the previously disclosed second step, or the previously disclosed third step can be carried out when the base body is located in the tool holder in the machine tool. This presupposes, not least from a machine-technical and spatial perspective, that the previously disclosed abrasive-free carrier layer and the associated abrasive, and / or the previously disclosed abrasive-containing carrier layer, can be applied to the base body when it is located in the tool holder in the machine tool.

[0020] However, if this is not possible and / or not desired, a preferred embodiment of the present invention provides that the tool holder comprising the base body is separated from the machine tool after the base body conditioning step, and then the step of applying the completely or substantially abrasive-free carrier layer to the base body, and / or its at least partial incorporation into it, or the step of applying the carrier layer already containing the abrasive to the base body, takes place. This makes it particularly possible to remove the tool holder comprising the conditioned base body at least temporarily from the area of ​​the machine tool where the tool holder is located and to position it at another location on the machine tool and / or completely separately from the machine tool.

[0021] It should be noted that the separation addressed here, and also later, can be carried out manually, automatically, or automatically. Suitable separation means are advantageously provided for this purpose.

[0022] According to a further preferred embodiment of the present invention, in the case that a complete or substantially abrasive-free carrier layer has been applied to the base body or at least partially introduced into it, it is provided that the step of applying an abrasive to the carrier layer and / or into the carrier layer takes place when the tool holder comprising the base body is separated from the machine tool.

[0023] With the aid of the two previously disclosed embodiments of the present invention, it is therefore advantageously possible to manufacture a polishing pin using the previously disclosed first partial step, the previously disclosed second partial step or the previously disclosed third partial step, while the tool holder receiving the base body is separated from the machine tool.

[0024] In principle, the polishing pin, manufactured accordingly and located in the tool holder separated from the machine tool, can be stored or positioned either together with the tool holder or separately. This frees up the machine tool for entirely different process steps in which the tool holder containing the polishing pin is not required, in particular its use for the production of other items with different tool holders or for cleaning them. For example, it is possible to house the tool holder containing the polishing pin in a tool cabinet. Optionally, according to a preferred embodiment, the separation of the tool holder containing the polishing pin from the machine tool is reversed after its manufacture.In other words, according to a preferred embodiment, the tool holder comprising the base body is reattached to the machine tool after the step of applying or introducing the carrier layer or after the step of applying the abrasive material to or into the carrier layer.

[0025] In principle, the step of applying the abrasive to the base body and / or at least partially into it can be carried out in any suitable manner. However, to further improve the bond quality between the base body and the abrasive, a preferred embodiment of the invention provides that, in the case where the tool holder containing the base body remains in the machine tool during application, the step of applying the abrasive to the base body comprises spin coating of the carrier layer and the abrasive on the base body, mechanical bonding of the carrier layer and the abrasive on the base body, or thermal bonding of the carrier layer and the abrasive on the base body.Alternatively, if the tool holder containing the base body is separated from the machine tool during application, the step of applying the abrasive to the base body includes thermal bonding of the carrier layer and the abrasive to the base body, mechanical bonding of the carrier layer and the abrasive to the base body, gluing or injection molding of the carrier layer and the abrasive to the base body, or coating of the base body with a lapping film containing an abrasive.

[0026] The previously disclosed mechanical bonding is preferably carried out in particular by pushing, hammering or pressing.

[0027] As previously disclosed, the polishing pin produced according to the process, not least because of the disclosed conditioning of the base body, is already designed for very precise abrasive machining of a workpiece located in the workpiece holder of the machine tool. This can, however, be advantageously further improved by a further preferred embodiment of the inventive method in which the polishing pin produced according to the invention is itself conditioned. In other words, a further conditioning step follows the previously disclosed steps for manufacturing the polishing pin, preferably also the step of conditioning the base body. During conditioning, the shape of the polishing pin, its concentricity, its axial runout, and / or its surface are, in particular, machined or adjusted to a desired degree. Alternatively or cumulatively, it is possible to balance it.

[0028] To further increase the precision with which a workpiece can be abrasively machined using a polishing pin manufactured according to the invention, a preferred embodiment of the manufacturing process provides for the polishing pin to be structured. This advantageously enables the formation of lubrication grooves on its surface, allowing any lubricant used during the abrasive machining process to flow off the polishing pin in a controlled manner. In a particularly preferred manner, the structuring is carried out by applying force, laser ablation, ion ablation, and / or abrasive action to the polishing pin, especially to the surface area that is coated with abrasive material or grinding agent.

[0029] As previously disclosed, the invention may provide process steps for conditioning the base body or the polishing pin. According to a preferred embodiment of the present invention, the step of conditioning the base body may involve the application of a dressing agent to the base body. According to a preferred embodiment of the present invention, the step of conditioning the polishing pin comprises the application of a dressing agent to the polishing pin. The appropriate dressing agents may be designed depending, in particular, on the objectives pursued with the dressing process and the hardness of the base body or the polishing pin.

[0030] The dressing means can advantageously be a dressing spindle, i.e. a rotating dressing body, or alternatively a stationary dressing means, preferably a single-grain dresser or a multi-grain dresser.

[0031] Depending on the desired shape of the polishing pin, the dressing agent according to the invention can have a cylindrical, spherical, circular segment-shaped, conical, lollipop-shaped, or other external geometry, particularly as defined in ISO 603-17:2014. It is also possible to design the external geometry of the dressing agent as a freeform shape, adapted to the surface to be abraded.

[0032] The dressing agent according to the invention can be made of any suitable material. Advantageously, it can be made of polycrystalline diamonds, monocrystalline diamonds, cubic boron nitride, tungsten carbide, aluminum oxide, silicon nitride, silicon carbide, or high-speed steel (HSS).

[0033] A further object of the present invention is to provide a polishing pin with which a workpiece can be abrasively machined more precisely than is known from the prior art.

[0034] This problem is solved by a polishing pin manufactured according to the previously disclosed method. The advantages described above apply accordingly.

[0035] In principle, the polishing pin can be made of any suitable material. According to a preferred embodiment of the polishing pin according to the invention, it is provided that In the event that the workpiece to be machined or a surface of the workpiece to be machined is made of an iron-containing material, in particular steel, cast iron, a nickel-iron or a nickel-iron-cobalt alloy, or a nickel-chromium superalloy, the abrasive contains an abrasive material made of diamond, cubic boron nitride, silicon carbide or aluminum oxide; in the event that the workpiece to be machined or a surface of the workpiece to be machined is made of a soft non-ferrous metal, in particular copper, aluminum, brass or bronze, the abrasive contains an abrasive material made of diamond, silicon carbide or aluminum oxide;In the event that the workpiece to be machined or a surface of the workpiece to be machined is made of a technical ceramic, in particular silicon carbide, silicon nitride, aluminum oxide, sapphire, ruby, zirconium oxide, tungsten carbide, cubic boron nitride (CBN) or aluminum nitride, the abrasive contains an abrasive material formed from diamond; and in the event that the workpiece to be machined or a surface of the workpiece to be machined is made of a single crystal, in particular silicon, germanium, gallium(II) sulfide (GaS) or zinc(II) sulfide (ZnS), the abrasive contains an abrasive material formed from diamond, cubic boron nitride, aluminum oxide, cerium oxide or chemically active barium carbonate.

[0036] By matching the materials of the polishing pin to the workpiece or its surface in this way, a polishing pin is advantageously created with which its processing can be carried out more precisely compared to the prior art.

[0037] A further object of the invention is to provide a method for the abrasive machining of a workpiece, in particular its surface, which enables more precise machining compared to corresponding methods known from the prior art.

[0038] This task is solved by an abrasive machining process for a workpiece, which comprises the following steps: 1. Providing a machine tool comprising a tool holder and a workpiece holder; 2. Manufacturing a polishing pin in the machine tool according to a method of the previously disclosed type, or providing a polishing pin of the previously disclosed type and receiving the polishing pin in the tool holder of the machine tool; 3. Providing the workpiece to be machined in the workpiece holder of the machine tool; and 4. Machining the workpiece with the polishing pin.

[0039] The advantages described above apply accordingly. This advantageously enables abrasive machining of a workpiece or its surface that is considerably more precise than known abrasive machining processes.

[0040] In principle, the abrasive process for machining the workpiece can be force-controlled. Here, the force exerted on the workpiece by the polishing pin during the machining process is continuously measured and adjusted based on a feedback loop. Thus, the abrasive machining is carried out by force-controlled guidance of the polishing pin in such a way that it acts on the workpiece with a constant force.

[0041] According to a preferred embodiment, the inventive method for the abrasive machining of a workpiece is displacement-controlled and / or distance-controlled. Here, the position of the tool holder containing the polishing pin during the abrasive machining process, or its relative distance to a fixed reference point, is detected and controlled such that the polishing pin assumes a desired position or travels a desired path during the machining process. The displacement-controlled and / or distance-controlled implementation of the inventive method for the abrasive machining of a workpiece can advantageously further improve the precision of the abrasive machining process.

[0042] A further object of the present invention is to create a machine tool comprising a tool holder and a workpiece holder, with which a workpiece can be machined more precisely by abrasion compared to the prior art.

[0043] This problem is solved by a machine tool with a tool holder and a workpiece holder, in that the machine tool is configured to perform the previously disclosed method for manufacturing a polishing pin and / or the previously disclosed method for abrasive machining of a workpiece. The aforementioned advantages apply accordingly.

[0044] The machine tool according to the invention can be configured, in particular, as a high-precision machine tool. It can be configured as a standalone unit or, advantageously, as part of a flexible manufacturing cell or as part of a flexible manufacturing system. In particular, it is possible to equip the machine tool according to the invention, especially a high-precision machine tool, with a tool cabinet including a tool changer and / or with a workpiece changer.

[0045] According to a preferred embodiment of the machine tool according to the invention, a carrier layer application device is provided, which is configured to apply a carrier layer to the base body. Furthermore, an abrasive application device is provided, which is configured to apply an abrasive to the base body. Alternatively or cumulatively, an abrasive application device is provided, which is configured to apply an abrasive to a base body. This advantageously creates, in particular, a polishing point that is tailored to the machine tool, the workpiece holder, and / or the workpiece to be machined, so that a workpiece located in the workpiece holder of the machine tool according to the invention can be machined more precisely with the polishing point than is known from the prior art.

[0046] According to a further preferred embodiment of the machine tool according to the invention, at least one dressing means is provided which is configured to dress the base body and / or the polishing pin. This advantageously improves, in particular, the manufacturing of the polishing pin, which is adapted to the machine tool, the workpiece holder and / or the workpiece to be machined, such that a workpiece located in the workpiece holder of the machine tool according to the invention can be machined more precisely with the polishing pin than is known from the prior art.

[0047] In principle, the dressing means can be designed in any suitable way. Advantageously, the dressing means according to the invention is a dressing spindle, i.e., a rotating dressing body. Alternatively, a stationary dressing means, preferably a single-grain dresser or a multi-grain dresser, can be provided.

[0048] Depending on the desired shape of the polishing pin, the dressing agent according to the invention can have a cylindrical, spherical, circular segment-shaped, conical, lollipop-shaped, or other external geometry, in particular as defined in ISO 603-17:2014. It is also possible to design the external geometry of the dressing agent as a freeform shape, which is adapted to the surface to be abraded.

[0049] The dressing agent according to the invention can be made of any suitable material. Advantageously, it can be made of polycrystalline diamonds, monocrystalline diamonds, cubic boron nitride, tungsten carbide, aluminum oxide, silicon nitride, silicon carbide, or high-speed steel (HSS).

[0050] An additional object of the present invention is to create a machining center comprising at least one machine tool in which a workpiece can be machined more precisely by abrasion compared to the prior art.

[0051] This problem is solved by a machining center comprising at least one machine tool, which includes at least one polishing pin of the type disclosed above, and / or by at least one machine tool of the type disclosed above. The aforementioned advantages apply accordingly.

[0052] According to a preferred embodiment of the machining center according to the invention, at least one carrier layer application device, separate from the machine tool, is provided, which is configured to apply a carrier layer to the base body, and at least one abrasive application device, separate from the machine tool, which is configured to apply an abrasive to the base body. Alternatively or cumulatively, at least one abrasive application device, separate from the machine tool, can be provided, which is configured to apply an abrasive to the base body. Thus, advantageously, no carrier layer application device and / or no abrasive application device and / or no abrasive application device is provided on the machine tool.This advantageously creates a machining center in which a portion of the technical equipment required for manufacturing a polishing pin can be arranged, in particular positioned and / or attached, separately from the machine tool. This allows it to be easily removed from the machine tool or machining center as desired or necessary, making the latter more accessible, particularly for carrying out other machining steps, maintenance operations, or repairs.

[0053] A further object of the present invention is to provide a computer program product or a non-volatile storage medium with program code with which an abrasive machining of a workpiece held in a machine tool can be carried out more precisely than is known from the prior art.

[0054] This problem is solved by a computer program product or a non-volatile storage medium containing program code configured to execute the previously disclosed method for manufacturing a grinding pin and / or the previously disclosed machining method when the computer program product is executed on a processor, a computer, or programmable hardware.

[0055] The processor can advantageously be located in the machine tool, in a machining center of the type disclosed above comprising such a machine tool, or remotely from these, in particular in a separate computer or appropriately localized programmable hardware.

[0056] Further features and advantages of the invention are illustrated in the accompanying, non-limiting embodiments of the present invention with reference to the accompanying, not-to-scale drawing. Fig. 1 a simplified representation of a machine tool according to the invention with a polishing pin according to the invention; Fig. 2 a simplified representation of a series of polishing pins according to the invention; Fig. 3 a simplified representation of a machining center according to the invention; Fig. 4 a sectional view through a part of a polishing pin according to the invention; Fig. 5 a block diagram illustrating a method according to the invention for manufacturing a polishing pin according to the invention; Fig. 6 a block diagram of a further development of the Fig. 5 the method shown; and Fig. 7 a block diagram of a method for the abrasive machining of a workpiece.

[0057] In Fig. 1 Figure 1 represents a machine tool 1. The machine tool 1 includes a workpiece holder 5 in which a workpiece 10 to be machined abrasively can be held, as symbolized by the dashed line. The workpiece 10 has a surface 12 that is to be machined abrasively.

[0058] The machine tool 1 further comprises a tool holder 15, which, according to the present embodiment, is designed as an HSK holder. A base body 20 is held in the tool holder 15, which is further processed into a polishing pin 25. The corresponding process will be described in detail later.

[0059] However, it should be mentioned at this point that, in order to manufacture the polishing pin 25 according to the embodiment shown here, it is necessary to condition the base body 20. For this purpose, a dressing agent 30, shown symbolically, is provided on the machine tool 1, which acts on the base body 20 as symbolized by arrow I.

[0060] After completion of the conditioning process, the now conditioned base body 20 is provided with a carrier layer 35. For this purpose, a carrier layer application device 40 (symbolically represented) is provided on the machine tool 1, which is configured to apply a carrier layer 45 to the base body 20, as symbolized by arrow II. The modulus of elasticity of the carrier layer 35 applied to the base body 20 is smaller than the modulus of elasticity of the workpiece 10 to be machined, or rather, its surface 12.

[0061] Subsequently, abrasive material 45 is applied and / or introduced onto and / or into the carrier layer 35 applied or introduced onto the base body 20, as symbolized by arrow III. For this purpose, a symbolically represented abrasive application device 50 is provided on the machine tool 1.

[0062] Therefore, the machine tool 1 shown in this embodiment has a tool holder 15, a dressing agent 30, a carrier layer application agent 40 and an abrasive application agent 50 in order to further process a base body 20 located in the tool holder 15 into a polishing pin 25.

[0063] For the purpose of operating the machine tool 1, an electronic data processing system or computer 55 is provided on it, which has an input device 60 and a display 65. The electronic data processing system 55 is configured such that the method for manufacturing the polishing pin 25, which will be described below, and the method for operating the machine tool 1 are stored in the form of a computer program, i.e., software. In order to be able to output the control commands required for carrying out the aforementioned methods and to obtain the measured values ​​required for carrying out the aforementioned methods, the electronic data processing system 55 is operatively connected to the dressing agent 30, as symbolized by the double arrow IV, to the carrier layer application agent 40, as symbolized by the double arrow V, and to the abrasive application agent 50, as symbolized by the double arrow VI.

[0064] In Fig. 2 A series of polishing pins 25 is shown, all of which have an essentially cylindrical base body 20. On the side shown in the Fig. 2 On the left side, there is a first end with which the polishing pin 25 is attached to the tool holder 15. At the end diametrically opposite to the first end, each polishing pin 25 has an abrasive 75, which consists of the carrier layer 35 (shown in white) applied to the base body 20 and the abrasive material 40 (shown in black) applied to it.

[0065] As can be seen, the sections of the polishing pins containing the respective abrasive 75 have different geometries. Thus, the abrasive 75 of the one in the Fig. 2 The polishing pin 25 shown above has an essentially lollipop-like design, while the one in the Fig. 2 The polishing pin 25 shown below has an essentially square design.

[0066] In Fig. 3 Figure 80 is a symbolically represented machining center, to which a machine tool 1 belongs. As already mentioned with reference to… Fig. 1 The figure shows a workpiece holder 5 in which a workpiece 10 with a surface 12 to be machined can be held, as symbolized by the dashed line. The machine tool 1 also includes a tool holder 15 in which a base body 20 of a polishing pin 25 to be manufactured is held. The base body 20 is conditioned by a dressing medium 30, also located on the machine tool 1, as symbolized by arrow I.

[0067] Unlike the one referring to Fig 1 In the illustrated embodiment, the carrier layer application agent 40 and the abrasive application agent 50, which are also required for the production of the polishing pin 25, are not applied on the machine tool 1, but separately from it and according to the [reference to be added]. Fig. 3 In the illustrated embodiment, the tool holder 15 is positioned in the machining center 80. To apply a carrier layer 35 to the base body 20 and an abrasive 45 to the carrier layer 35, the tool holder 15, which holds the conditioned base body 20, is detached from the machine tool 1 and moved to the carrier layer application device 40 and abrasive application device 50, as symbolized by arrow VII. After applying the carrier layer 35 to the base body 20, symbolized by arrow II, and applying the abrasive 45 to the carrier layer 35, symbolized by arrow III, the finished polishing pin 25 can be returned to the machine tool 1 by reattaching the tool holder 15 to the machine tool 1, as also symbolized by arrow VII.Alternatively, the tool holder 15 holding the completed polishing pin 25 remains in the machining center 80 and away from the machine tool 1, so that the latter is available, for example, for other uses with a different tool holder (not shown), cleaning work or maintenance work.

[0068] Again Fig. 3 As can be seen, the electronic data processing system or computer 55, including input device 60 and display 65, is also positioned away from the machine tool 1 in the machining center 80. However, as mentioned with reference to Figur 1 shown, in conjunction with the dressing agent 30 (see arrow IV), the carrier layer application agent 40 (see arrow V) and the abrasive application agent 50 (see arrow VI), in order to be able to issue the control commands required for carrying out the aforementioned procedures and to obtain the measured values ​​required for carrying out the aforementioned procedures; here too, this is done using a computer program product.

[0069] It should be emphasized that the machine tool 1 according to Fig. 1 or the one in the machine tool 1 and in the machining center 80 according to Fig. 3 The manufactured polishing pin 25 is already designed in such a way that the workpiece 10, or rather its surface 12, can be abraded with the highest degree of precision. This precision can be further improved if the polishing pin 25, manufactured as described above, is also conditioned. This conditioning can be achieved by the process described in the Fig. 1 and 3 The dressing is carried out by means of the dressing means 30 provided on the respective machine tools 1 or by means of additional or alternative dressing means not shown here.

[0070] In Fig. 4 is now a lateral sectional view through a part of a polishing pin 25 according to the invention, corresponding to section AA according to Fig. 2 shown. However, it should be emphasized that the following described construction of the polishing pin 25 also applies to the other ones in the Fig. 2 The polishing pins 25 shown are present. The partially shown base body 20 has the partially shown carrier layer 35 applied to it, on which the partially shown abrasive 45 is applied. The carrier layer 35 and the abrasive 45 together form an abrasive 75.

[0071] The base body 20 can be made of a material with a comparatively high modulus of elasticity, in particular a hard metal, HSS steel or a ceramic, in particular aluminium oxide.

[0072] The support layer 35 can be made of a thermoplastic material, in particular acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), polyethylene (PE) or polyamide (PA), of a crystalline plastic, in particular polyetheretherketone (PEEK), an epoxy resin, an elastomer or a thermoset. Therefore, the elastic modulus of the support layer 35 is smaller than the elastic modulus of the base body 20.

[0073] According to the embodiment shown here, it is provided that In the event that the workpiece 10 to be machined or its surface 12 to be machined is made of an iron-containing material, in particular steel, cast iron, a nickel-iron or a nickel-iron-cobalt alloy, or a nickel-chromium superalloy, the abrasive 75 contains an abrasive material 45 made of diamond, cubic boron nitride, silicon carbide or aluminum oxide; in the event that the workpiece 10 to be machined or its surface 12 is made of a soft non-ferrous metal, in particular copper, aluminum, brass or bronze, the abrasive 75 contains an abrasive material 45 made of diamond, silicon carbide or aluminum oxide;In the event that the workpiece 10 to be machined or its surface 12 to be machined is made of a technical ceramic, in particular silicon carbide, silicon nitride, aluminum oxide, sapphire, ruby, zirconium oxide, tungsten carbide, cubic boron nitride (CBN) or aluminum nitride, the abrasive 75 contains an abrasive 45 made of diamond; and in the event that the workpiece 10 to be machined or its surface 12 to be machined is made of a single crystal, in particular silicon, germanium, gallium(II) sulfide (GaS), zinc(II) sulfide (ZnS), the abrasive 75 contains an abrasive 45 made of diamond, cubic boron nitride, aluminum oxide, cerium oxide or chemically active barium carbonate.

[0074] In Fig. 5 A method for manufacturing a polishing pin 25 of the type described above is now presented: In In a first process step S1, the machine tool 1, which has a tool holder 15, is provided, the latter receiving the workpiece 10 to be machined in a workpiece holder 5.

[0075] In a second process step S2, the base body 20 is attached in the tool holder 15.

[0076] Then, in a third process step S3, the base body 20 located in the tool holder 15 is conditioned.

[0077] Subsequently, in a fourth process step S4, an abrasive-free carrier layer 35, i.e., a carrier layer 35 without abrasive 45, is applied to at least a part of the base body 20, wherein the elastic modulus of the carrier layer 35 applied to the base body 20 is smaller than the elastic modulus of the workpiece 10 to be machined or its surface 12 to be machined. The abrasive 45 is then applied to and / or incorporated into the carrier layer 35.

[0078] If the carrier layer 35 is not free of abrasive material but contains an abrasive material 45, in the fourth process step S4 the carrier layer 35 containing the abrasive material 45 is applied to at least a part of the base body 20, wherein the modulus of elasticity of the carrier layer 35 applied to the base body 20 is smaller than the modulus of elasticity of the workpiece 10 to be machined or its surface 12 to be machined.

[0079] In an optional process step S5 following process step S4, the polishing pin 25 is structured.

[0080] The conditioning of the base body 20 can be achieved by applying a dressing agent 30 to the base body 20. The structuring of the polishing pin 25 can be achieved by applying a structuring agent (not shown here) to the polishing pin 25.

[0081] This creates a polishing pin that enables very precise abrasive machining of the workpiece 10 or its surface 12.

[0082] The aforementioned precision is further enhanced by the in Fig. 6 The described procedure has been improved. In principle, this procedure uses the same steps S1, S2, S3 and S4, and optionally step S5, as in the procedure described with reference to the Fig. 5 The procedure described is provided for. However, if process step S5 is not to be carried out, a further process step S6, in which the polishing pin 25 is conditioned, immediately follows process step S4. If process step S5 is to be carried out, process step S6, in which the polishing pin 25 is conditioned, follows process step S5. The conditioning of the polishing pin 25 can be effected by the action of the previously described dressing agent 30, or by the action of another dressing agent not shown here, on the polishing pin 25.

[0083] Therefore, according to the procedure described here, both the base body 20 located in the tool holder 15 is conditioned (process step S3) and the polishing pin 25 is conditioned (process step S6). Optionally, the polishing pin is also textured (process step S5).

[0084] The previously described process steps can be carried out in the machine tool 1. However, it should be noted that the tool holder 15, which contains the base body 20, can also be separated from the machine tool 1 after conditioning of the base body 20 (process step S3). Subsequently, and thus removed from the machine tool 1, the abrasive-free carrier layer 35 is applied to the base body 20, onto which the abrasive 45 is then applied (process step S4). Alternatively, the conditioned base body 20, located in the tool holder 15 separated from the machine tool 1, is at least partially coated with an abrasive 75. The tool holder 15, containing the polishing pin thus produced, is then reattached to the machine tool 1.

[0085] For the sake of clarity, the process steps S1 to S6 for the production of a polishing pin 25 shall now be referred to collectively as process step S-25, as in Fig. 6 is shown.

[0086] In Fig. 7 A block diagram of a process for the abrasive machining of a workpiece 10 or its surface 12 is now shown. This process comprises the following process steps: First, in process step S10, a machine tool 1 is provided, which has a tool holder 15 and a workpiece holder 5.

[0087] A polishing pin 25 is then manufactured in machine tool 1 using the previously described method with process steps S-25 and, if not already done, inserted into the tool holder 5. Alternatively, a polishing pin 25 that has already been manufactured according to process steps S-25 can be provided and inserted into the tool holder 5.

[0088] In a subsequent process step S11, the workpiece 10 to be machined or its surface 12 to be machined is provided in the workpiece holder 5 of the machine tool 1.

[0089] Finally, the workpiece 10, or rather its surface 12, is processed in a process step S13 using the polishing pin 25. This processing is carried out, for example, using displacement control or distance control. Reference symbol list:

[0090] 1 Machine tool 5 Workpiece holder 10 Workpiece 12 Workpiece surface 15 Tool holder 20 Base body 25 Polishing pin 30 Dressing compound 35 Carrier layer 40 Carrier layer applicator 45 Abrasive 50 Abrasive applicator 55 Electronic data processing system 60 Input device 65 Display 75 Abrasive 80 Machining center A-A Section S1 .... S13 Process steps S-25 Complete set of process steps for manufacturing the polishing pin I. Action of the dressing agent II. Application of the carrier layer III. Application of abrasive IV. Working connection V. Working connection VI. Working connection VII. Removal process

Claims

1. Method for manufacturing a polishing pin (25) which is set up for abrasive machining of a workpiece (10) in a machine tool (1) and has a base body (20), characterized byThe following steps:

1. Providing the machine tool (1) having a tool holder (15), wherein the machine tool (1) is configured to hold the workpiece (10) to be machined in a workpiece holder (5); 2. Securing the base body (20) in the tool holder (15); 3. Conditioning the base body (20) located in the tool holder (15); 4. Applying an abrasive-free carrier layer (35) to at least a part of the base body (20), wherein the modulus of elasticity of the carrier layer (35) applied to the base body (20) is less than the modulus of elasticity of the workpiece (10) to be machined, and applying an abrasive (45) in and / or into the carrier layer (35); or 5.In the event that the carrier layer is not free of abrasive material but contains an abrasive material (45), the carrier layer (35) containing the abrasive material (45) is applied to at least a part of the base body (20), wherein the modulus of elasticity of the carrier layer (35) applied to the base body (20) is smaller than the modulus of elasticity of the workpiece (10) to be machined.

2. Method according to claim 1, characterized by the fact that The tool holder (15) having the base body (20) is separated from the machine tool (1) after the step of conditioning the base body (20) and then the step of applying the abrasive-free carrier layer (35) to the base body or the step of applying the abrasive-containing carrier layer (35) to the base body (20) takes place.

3. Method according to claim 2, characterized by the fact thatIn the event that an abrasive-free carrier layer (35) has been applied to the base body (20), the step of applying an abrasive (45) to the carrier layer (35) takes place when the tool holder (15) having the base body (20) is separated from the machine tool (1).

4. Method according to claim 2 or claim 3, characterized by the fact that The tool holder (15) having the base body (20) is reattached to the machine tool (1) after the step of applying the carrier layer (35) or after the step of applying the abrasive material (45) to or in the carrier layer (35).

5. Method according to any one of the preceding claims, characterized by the fact thatThe step of applying the abrasive (45) to the base body (20) – if the tool holder (15) comprising the base body (20) remains in the machine tool (1) during application, includes spin coating of the carrier layer and the abrasive (45) on the base body (20), mechanical bonding of the carrier layer (35) and the abrasive (45) to the base body (20), or thermal bonding of the abrasive (45) to the base body (20); or – if the tool holder (15) comprising the base body (20) is separated from the machine tool (1) during application, includes thermal bonding of the carrier layer (35) and the abrasive (45) to the base body (20), mechanical bonding of the carrier layer (35) and the abrasive (45) to the base body (20), adhesive bonding, or injection molding of the carrier layer (35) and the abrasive (45) on the base body (20),or has a coating of the base body (20) with a lapping film containing an abrasive (45).

6. Method according to any one of the preceding claims, characterized by the fact that the polishing pin (25) is conditioned.

7. Method according to any of the preceding claims, characterized by the fact that the polishing pin (25) is structured, wherein the structuring is preferably carried out by means of force application, laser ablation, ion ablation and / or abrasive action on the polishing pin (25).

8. Method according to any one of the preceding claims, characterized by the fact that The step of conditioning the base body (20) involves the application of a dressing agent (30) to the base body (20), and the step of conditioning the polishing pin (25) involves the application of a dressing agent (30) to the polishing pin (25).

9. Polishing pin (25), characterized by the fact that it is manufactured according to the method according to any one of claims 1 to 8.

10. Polishing pin (25) according to claim 9, characterized by the fact that- if the workpiece (10) to be machined or a surface (12) of the workpiece (10) to be machined is made of an iron-containing material or a nickel-chromium superalloy, the abrasive (75) contains an abrasive material (45) made of diamond, cubic boron nitride, silicon carbide or aluminum oxide; - if the workpiece (10) to be machined or a surface (12) of the workpiece (10) to be machined is made of a soft non-ferrous metal, the abrasive (75) contains an abrasive material (45) made of diamond, silicon carbide or aluminum oxide; - if the workpiece (10) to be machined or a surface (12) of the workpiece (10) to be machined is made of a technical ceramic, the abrasive (75) contains an abrasive material (45) made of diamond;and - in the event that the workpiece (10) to be machined or a surface (12) of the workpiece (10) to be machined is formed from a single crystal, the abrasive (75) contains an abrasive material (45) formed from diamond, cubic boron nitride, aluminum oxide, cerium oxide or chemically active barium carbonate.; 11. Method for abrasive machining of a workpiece (10), characterized byThe following steps are performed:

1. Providing a machine tool (1) having a tool holder (15) and a workpiece holder (5); 2. Producing a polishing pin (25) in the machine tool (1) according to a method according to any one of claims 1 to 8, or providing a polishing pin (25) according to any one of claims 9 to 10, and receiving the polishing pin (25) in the tool holder (15) of the machine tool (1); 3. Providing the workpiece (10) to be machined in the workpiece holder (5) of the machine tool (1); and 4. Machining the workpiece (10) with the polishing pin (25).

12. Method according to claim 11, characterized by the fact that The machining of the workpiece (10) is carried out in a path-controlled and / or distance-controlled manner.

13. Machine tool (1), with a tool holder (15) and a workpiece holder (5), characterized by the fact thatthe machine tool (1) is set up to carry out the method according to one of claims 1 to 8 and / or according to one of claims 11 to 12.

14. Machine tool according to claim 13, characterized by a carrier layer application device (40) configured to apply a carrier layer (35) to the base body (20), and an abrasive application device (50) configured to apply an abrasive (45) to the base body (20), and / or an abrasive application device (50) configured to apply a carrier layer (35) containing an abrasive (45) to a base body (20).

15. Machine tool according to one of claims 13 to 14, characterized by at least one dressing device (30) which is designed to dress the base body (20) and / or the polishing pin (25).

16. Machine tool (1) according to claim 15, characterized by the fact that the dressing device (30) is a dressing spindle, a single-grain dresser or a multi-grain dresser.

17. Machining center (80), with at least one machine tool (1), characterized by at least one polishing pin (25) according to one of claims 9 to 10 and / or at least one machine tool (1) according to one of claims 13 to 16.

18. Machining center (80) according to claim 17, characterized by at least one carrier layer application device (40) separate from the machine tool (1) which is configured to apply a carrier layer (35) to the base body (20), and at least one abrasive application device (50) separate from the machine tool (1) which is configured to apply an abrasive (45) to the base body (20), and / or at least one abrasive application device (50) separate from the machine tool (1) which is configured to apply an abrasive (75) formed from a carrier layer (35) and an abrasive (45) to the base body (20).

19. Computer program product or non-volatile storage medium containing program code for executing the method according to any one of claims 1 to 8 and / or any one of claims 11 to 12, when the computer program product is executed on a processor, a computer (55) or programmable hardware.

Images