Three-dimensional photomask transmission with kernel-based modeling
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- SIEMENS INDUSTRY SOFTWARE INC
- Filing Date
- 2023-08-28
- Publication Date
- 2026-06-03
AI Technical Summary
Existing model-based optical proximity correction techniques struggle to accurately simulate three-dimensional light transmission in the near-field of lithographic masks, especially when dealing with non-Manhattan or curvilinear shapes, leading to reduced accuracy in wafer image simulation and mask layout design modifications.
A computing system that simulates three-dimensional light transmission in the near-field of a lithographic mask using a compact mask model and edge grids, generating directional kernels based on through-the-lens target orders and edge grid orders to accurately model light diffraction.
The system achieves improved accuracy in simulating three-dimensional light transmission, enabling more precise optical proximity correction and mask layout design modifications, which enhances pattern fidelity and manufacturing accuracy.
Smart Images

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