Programmed food equilibration system and method for real time process yield in a thermal process

Abstract

A thermal processing apparatus for heating a first type of work products within an enclosure may include a first thermal processing zone operating under selected thermal operating parameters to heat the first type of work products to a predetermined maximum characteristic surface temperature not influenced by conditions external to a boundary of the first type of work products (TMCS); and, a programmed equilibration system, including: a second adiabatic equilibration zone defined within the enclosure of the thermal processing apparatus; and, a controller for substantially maintaining a temperature of the second adiabatic equilibration zone to a predetermined constant reference temperature (TR) that is substantially the same as the TMCS to enable the first type of work products to equilibrate adiabatically.

Description

PROGRAMMED FOOD EQUILIBRATION SYSTEM AND METHOD FOR REAL TIME PROCESS YIELD IN A THERMAL PROCESSCROSS-REFERENCE(S) TO RELATED APPLICATION S)

[0001] This application claims the benefit of US Provisional Application No. 63 / 517,204, filed August 2, 2023, the entire contents of which are incorporated herein by reference.BACKGROUND

[0002] For obvious reasons, it is vitally important in the industrial food processing industry to fully cook food products prior to packaging. Such food products may not be subjected to any further step or process for killing pathogens prior to consumption of the food. Moreover, the performance of an industrial food processing system, such as an oven, fryer, steamer, roaster, chiller, or freezer, can be significantly impacted by physical attributes of the food product, such as the thickness of the food product. Often, food product thickness can vary between batches or can trend thicker throughout a production shift without detection by personnel. If, for example, a new batch of food product enters a cooking process, and the average thickness of the new food product is larger than the thickness of the prior batch, it is desirable to proactively control the thermal process to insure proper cooking. Such proactive control is not widely practiced today. Typically, the control process is largely reactive. When an undercooked or otherwise under processed food product is detected as it leaves a thermal processing station, personnel typically respond by manually adjusting the dwell time.

[0003] The temperature of the food product leaving the physical limits of the oven enclosure or the thermal processing station is typically measured manually by inserting a thermal couple probe into the processed food product hopefully at or near the mass center of the workpiece. However, it is difficult for personnel to accurately determine where the mass center of the workpiece is located. An additional difficulty and source of temperature measurement error exists in placing the temperature probe at the estimated center of the workpiece even if the operator believes that he or she has identified the mass center. Moreover, a further source of error occurs when the measuring tip of the probe is positioned in what is thought to be the mass center of the workpiece, but in actuality is a void in the workpiece. A slight change in the position of a thermal probe can result in a significantdifference in the temperature reading achieved, especially if the temperature probe is placed into a void in the workpiece.

[0004] Moreover, typically, the number of workpiece samples that are actually selected for temperature measurement is relatively small in relation to the number of workpieces being processed. Such a relatively small sample size can be a source of temperature measurement error for representing the large quantities of products being processed.

[0005] In an effort to reduce the likelihood of food products not being fully cooked or otherwise not sufficiently thermally processed, the current food industry practice is to adjust the cooking or other thermal process so that the center of the thickest workpieces reaches a desired temperature. Such desired temperature typically is a temperature at which pathogens are instantaneously killed from the temperature of the food product. However, typically the desired temperature is higher than such kill temperature so that there is a desired confidence level that all of the food products have reached a sufficient temperature. Thus, the temperature to be achieved may be increased to a desired temperature of perhaps several standard deviations above the actual kill temperature.

[0006] Such an approach can result in a significant proportion of the workpieces being overly-cooked or otherwise overly-processed, which causes a decrease in yield as well as a decrease in profit because the overcooking or over thermal processing drives off moisture from the food product, resulting in a reduction in the weight of the processed food product as well as its quality. Eliminating overcooking in a single process line can result in an economic savings of hundreds of thousands of dollars or much more per year. This economic benefit arises from not having to cook or otherwise thermally process the food products based on the thickest, largest, or otherwise maximum or extreme food product in the population being processed. Other benefits include: (1) a reduction in labor required to monitor, control, and report on the process, (2) a reduction in unscheduled sanitation procedures of the thermal processing system, including the thermal processing station and the conveyance systems removing the food product to and from the thermal processing station, as well as (3) increased production line operational time.

[0007] Because improperly or under-thermally processed food products present a high safety risk, a highly hygienic solution is desired to ensure that the food products are fully cooked or otherwise fully thermally processed. As such, it is desirable to have minimal equipment situated over the food product traveling to a thermal processing station, duringthermal processing at the thermal processing station, as well as when traveling away from the thermal processing station, unless the equipment in question operates at a cooking temperature or is otherwise maintained at a highly hygienic state. Complex equipment located over food product being thermally processed presents a contamination hazard since contaminated droplets of water or other moisture can fall on the cooked or otherwise processed food product.

[0008] In an effort to at least partially automate the temperature measurement function of cooked or otherwise processed food products, “pick-and-place” robots have been contemplated. The envisioned systems and equipment are situated over the food product stream, are used to remove selected food products from the food product stream, and then transmit the food products to a temperature measurement location or station, where manual temperature measurement of the selected food product takes place. The complexity required to implement such a solution may have prevented pick-and-place systems from being reduced to practice for thermal processes.

[0009] An approach that is approved by food safety regulations as an alternative to simply reaching a minimum pathogen kill temperature in a food product is to achieve a required level of reduction of pathogens in the food product. Such pathogens can be killed over time, with the rate of kill depending on the temperature of the food product achieved. If the temperature profile of the food product over time is known, then the level of pathogen killed in the food product can be determined. If such temperature profile can be determined with accuracy, then the thermal processing time for the food product may be sufficiently tailored to the food product in question, rather than having to take the potentially less efficient strategy of ensuring that the thickest food product has been heated to above the instantaneous kill temperature of the pathogens in question.

[0010] Systems and methods disclosed herein relate to optimization of thermal processing of work products such as food products.SUMMARY

[0011] In some aspects, a thermal processing apparatus for heating a first type of work products within an enclosure includes a first thermal processing zone operating under selected thermal operating parameters to heat the first type of work products to a predetermined maximum characteristic surface temperature not influenced by conditions external to a boundary of the first type of work products (TMCS); and, a programmedequilibration system, including: a second adiabatic equilibration zone defined within the enclosure of the thermal processing apparatus; and, a controller for substantially maintaining a temperature of the second adiabatic equilibration zone to a predetermined constant reference temperature (TR) that is substantially the same as the TMCS to enable the first type of work products to equilibrate adiabatically.

[0012] In some aspects, a method for thermal processing a food product includes obtaining for a first type of work product a maximum characteristic surface temperature not influenced by conditions external to a boundary of the first type of work product (TMCS) having a first work product recipe; thermally processing the first type of work product in at least a first thermal processing zone of an enclosure of a first thermal processing apparatus under selected thermal operating parameters to heat the first type of work products to the TMCS; controlling, with a computing device, thermal conditions of a second adiabatic equilibration zone of the first thermal processing apparatus such that the second adiabatic equilibration zone is substantially maintained at a predetermined constant reference temperature (TR) that is substantially the same as the TMCS; and allowing the first type of work product to transit in the second adiabatic equilibration zone for a predetermined amount of dwell time to enable the first type of work product to equilibrate adiabatically such that the first type of work product has a minimum final core temperature (TM).

[0013] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.DESCRIPTION OF THE DRAWINGS

[0014] The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

[0015] FIGURE 1 is a graph of a typical cook curve for a food product during a cooking process according to various aspects of the present disclosure illustrating how the use of a programmed equilibration system and method according to various aspects of the present disclosure provides yield and throughput advantage.

[0016] FIGURE 2 is a schematic elevational view of an exemplary apparatus, in partial cross-section, showing dual spiral conveyor stacks of an oven, and incorporating a programmed equilibration system according to various aspects of the present disclosure.

[0017] FIGURE 3 is a schematic top view of the apparatus of FIGURE 1, shown in partial cross-section.

[0018] FIGURE 4 is a side cross-sectional view of first and second work (food) products on a conveyor, wherein miniature computer chips are surgically implanted at a location within each food product to provide a core temperature and a surface temperature measurement of the food product during a thermal process.

[0019] FIGURE 5 is a graph of the surface temperature and core temperature of a first work (food) product being heated using non-equilibrated methods.

[0020] FIGURE 6 is a graph of the surface temperature and core temperature of a first work (food) product being heated using programmed equilibration systems and methods of the present disclosure.

[0021] FIGURE 7 is a graph of the surface temperature and core temperature of a second work (food) product being heated using non-equilibrated methods.

[0022] FIGURE 8 is a graph of the surface temperature and core temperature of a second work (food) product being heated using programmed equilibration systems and methods of the present disclosure.

[0023] FIGURE 9 is a block diagram that illustrates aspects of a non-limiting example of a computing system configured to carry out some or all of the functions of programmed equilibration systems and methods according to various aspects of the present disclosure.

[0024] FIGURE 10 is a flowchart that illustrates a non-limiting example embodiment of a method of performing a programmed equilibration process according to various aspects of the present disclosure.

[0025] FIGURE 11 is a block diagram that illustrates a non-limiting example of a computing device appropriate for use with systems and methods of the present disclosure.DETAILED DESCRIPTION

[0026] Carryover cooking (sometimes referred to as resting) is when foods are halted from actively cooking and allowed to equilibrate under their own retained heat. Because foods such as meats are typically measured for cooking temperature near thecenter of mass as noted above, stopping cooking at a given central temperature means that the outer layers of the food will be at higher temperature than that measured. Heat therefore will continue to migrate inwards from the surface, and the food will cook further even after being removed from the source of heat.

[0027] In industrial cooking, an equilibration zone may be used to allow carryover cooking of a food product after leaving a thermal processing system, e.g., an oven. For instance, a food product may be thermally processed or cooked in an oven until the product presumably reaches a cooked level having a minimum core temperature. After leaving the oven, the food product may spend a certain amount of time in the equilibration zone to allow it to equilibrate under its own retained heat. To ensure equilibration, a significant amount of plant space may be necessary for achieving equilibration of the food product.

[0028] As discussed above, obtaining an accurate core and / or surface temperature of a sufficient sample of food products is difficult. This is because food products are non- homogeneous and heat transfer that occurs within each product is in a transient state. Further, not knowing the exact location to probe for the lowest core temperature in this scenario is challenging. Thus, the food products may be cooked to a final target temperature that is higher than needed to reach the actual kill temperature during equilibration. However, as also noted above, such an approach can result in a significant proportion of the workpieces being overly-cooked or otherwise overly-processed, which causes a decrease in yield as well as a decrease in profit because the overcooking or over thermal processing drives off moisture from the food product, resulting in a reduction in the weight of the processed food product as well as its quality.

[0029] Systems and methods disclosed herein relate to programmed equilibration of thermally treated work products for consistent and accurate final work product core temperature prediction. With final work product core temperatures accurately and consistently predicted, the food products may be cooked to a lower final target temperature because a buffer is not necessary to ensure that the food product reaches the actual kill temperature during equilibration. In other words, if work product core temperature is known, the work product may be cooked to a lower final temperature because the equilibration process does not have to account for product temperature measurement inaccuracies or inconsistencies.

[0030] To help illustrate this point, reference is made to FIGURE 1, which depicts a typical cook curve for a food product. As can be seen, the last 6-10 degrees of cookinggenerally consume a significant part of the thermal process time period. Accordingly, less thermal energy may be expended during the cooking process if at least some of that final cooking process reliably occurs during the equilibration process. Using programmed equilibration systems and methods disclosed herein, energy that is already delivered to the food product upstream in the cooking process can be redistributed in the product through internal conduction during the equilibration process. Conduction occurs as a result of temperature gradients within the individual food products, wherein the conductive heating energy gradients are continually changing to even out as a function of time.

[0031] Using the programmed equilibration systems and methods disclosed herein, the standard deviations of the food product core temperatures are lowered through a more efficient distribution of energy. The lower standard deviation contributes to increasing both product throughput and yield. To illustrate this point, it can be assumed that a targeted regulatory minimum cook temperature for a food product is 160°F. To ensure that all food products exiting a thermal processing system (e.g., oven) are fully cooked (e.g., cooked to the targeted regulatory minimum cook temperature with no under processed food products), a processor would typically configure the cook process to cook the food products to final temperature having a safety margin exceeding the targeted regulatory minimum cook temperature, which is typically three standard deviations. In this example, if empirical evidence shows that the standard deviation of temperatures at the discharge of the oven is 5°F, the processor would effectively choose to cook the food products to 175°F.

[0032] A design improvement to either the process or the machine that reduces this standard deviation from 5°F down to 3°F (for food product temperatures across the belt width) would effectively translate to a reduction of 6°F in the targeted final food temperature (i.e., from 175°F to 169°F). Reducing the targeted final food temperature therefore proportionally reduces the dwell time to process the food products. In that regard, Figure 1 graphically illustrates the proportional reduction in dwell time resulting from the reduced targeted final food temperature.

[0033] Reducing the targeted final food temperature also has the potential to produce a significant yield and throughput increase of the food products, with the actual yield and throughput magnitudes typically dependent on the substrate type and thickness and the operating conditions being used. The programmed equilibration systems and methods disclosed herein can significantly increase yield and throughput independent of a thermal process used for the food product.

[0034] Consistent and accurate final work product core temperature prediction also enables real time yield determinations because yield is based on a target finished core temperature of the work product. If, after equilibration, the food products have a consistent, known final target core temperature, the yield for those equilibrated products may be determined.

[0035] Cooking yields describe changes in food weight due to moisture loss (e.g., evaporation or moisture drip), water absorption (e.g., boiling) or fat gains / losses during cooking. Data (such as from the USDA) is available to estimate cooking yields of various food products (e.g., various types of poultry, meat, and other food products) based on the cooking method used. For instance, “beef, bottom sirloin butt, tri -tip roast, separable lean only, trimmed to zero fat that is baked or roasted to a minimum internal temperature (e.g., 160°F) may have a minimum estimated yield of 77% and a maximum yield of 89% (assuming, for instance, a sample size of 20 with a standard deviation of 3.1).

[0036] Using the programmed equilibration systems and methods disclosed herein, an accurate yield percentage can be determined for each product recipe (wherein a product “recipe” may include all the steps associated with thermal processing to achieve a desired final end product). More specifically, after passing through the equilibration zone, an accurate final target core temperature that is consistently achieved throughout the food products can be determined. The consistent, known final target core temperature (rather than an estimated final temperature) allows for an actual yield determination for the equilibrated products.

[0037] Accurate yield data may be improved with weight measurements of the food product before thermal processing and after equilibration for accurate, real time yield data. Accordingly, in some examples, the programmed equilibration systems and methods disclosed herein include obtaining weight measurements of the food product before thermal processing and / or after equilibration for providing accurate, real time yield data.

[0038] Not only can yield be more accurately determined using the programmed equilibration systems and methods disclosed herein, but yield may also be maximized for a food product recipe. As noted above, over-cooking a food product to ensure food safety drives off moisture from the food product, resulting in a reduction in the weight of the processed food product, decreasing yield. The equilibration zone of the systems and methods disclosed herein is programmed to allow the food product to reach the final target core temperature without substantially exceeding the final target core temperature (i.e.,without overcooking the product). In that regard, the output of thermally processed work products is maximized for a given amount of input.

[0039] The equilibration zone parameters (e.g., time, temperature, velocity, and humidity) may be determined for each recipe through suitable algorithms, which may be based at least in part on a known core temperature and surface temperature of the work products before entering the equilibration zone and at the end of the equilibration zone (e.g., at the oven outlet). In that regard, an exemplary aspect of the programmed equilibration systems and methods disclosed herein includes using techniques for continuously and accurately capturing a surface temperature and core temperature of a test work product as a function of time. For instance, the surface temperature and core temperature may be captured for substantially an entire thermal treatment process of the test work product. If the test work product passes through multiple zones of an industrial oven, the surface and core temperature difference may be captured throughout the treatment in the multiple zones. The test work product may be an example of the work products to be processed using the programmed equilibration systems and methods disclosed herein.

[0040] The captured surface temperature and core temperature difference of a test work product as a function of time (independent of the thermal operating parameters used for cooking) can be used to define the temperature and humidity parameters for an equilibration zone of the thermal process for the work products. In disclosed examples, the equilibration zone is configured to allow for adiabatic equilibration of the work product. In that regard, the equilibration zone is controlled to a predetermined constant reference temperature (TR) to enable the temperature of the work product (food product) to equilibrate adiabatically.

[0041] The predetermined constant reference temperature (TR) of the equilibration zone is designed to produce food products having final core temperatures that consistently meet or exceed the prescribed food safe temperatures at a significantly lower standard deviation (e.g., across the belt width) compared to prior art, unequilibrated processing methods. At the same time, the predetermined constant reference temperature (TR) of the equilibration zone is designed to achieve the lowest potential temperature difference of the average surface and core temperatures of the food products. In that regard, a physical measurement to verify the core temperature of the food product is not necessary, and if done, location of the temperature probe is not crucial given the compressed difference between surface and core temperature.

[0042] In some examples, the pre-determined constant reference temperature (TR) may be defined at least initially by the maximum measured surface temperature of the test work product during the thermal process, which in many instances will be reached just before the work product enters the equilibration zone. In some examples, the predetermined constant reference temperature (TR) may be continuously adjusted to achieve the lowest potential temperature difference of the average surface and core temperatures of the work products when exiting the equilibration zone. The equilibration zone may also be controlled to a predetermined constant reference humidity level (HR) that is suitable for the product recipe.

[0043] The dwell time within the equilibration zone may be determined based on the work product thickness and thermal conductivity. In other words, the time in equilibration may generally be considered a function of the substrate thickness and its thermal conductivity (which in turn is function of the composition, ingredients, muscle structure, etc.). The thickness or overall size of the work product may be determined with one or more vision systems, load sensors, etc.

[0044] The equilibration time is sufficient to allow the core temperature of the work product to meet or exceed the prescribed food safe temperature at the outlet of the equilibration zone. In that regard, the dwell time within the equilibration zone may be based on the test work product core temperature before entering the equilibration zone. The dwell time within the equilibration zone may be calculated as the time needed to raise the core temperature of the work (food) product from the estimated core temperature before entering the equilibration zone to the prescribed food safe temperature, based on the product thickness and thermal conductivity.

[0045] As noted above, when using the programmed equilibration systems and methods disclosed herein, the equilibration time is sufficient to allow the core temperature to meet or exceed the prescribed food safe temperature. At the same time, only a minimum equilibration time is necessary to achieve the core temperature because overcooking is not necessary to ensure product safety.

[0046] In some examples, the equilibration zone is incorporated into a thermal processing system. For instance, the equilibration zone may be incorporated into a spiral conveyor-based thermal processing system (e.g., a spiral oven), with the equilibration zone defined by at least one tier of a spiral stack in the system. Such incorporation into a thermal processing system is possible at least in part because a lower final core temperature isneeded before entering the equilibration zone. In other words, less thermal processing time is needed in the thermal processing system, and as such, a portion of the thermal path of the thermal processing system (e.g., one or more tiers of the stack) may be consumed by the equilibration zone. The number of tiers needed for a sufficient dwell time in the equilibration zone may be based at least in part on the belt speed of the stack.

[0047] A control system and / or a computing device may be employed to manage and control operational aspects of the thermal processing system, including the equilibration zone. The control system receives input from various measurement devices or instruments that measure / monitor, among other parameters, the core and surface temperature of a test food product and the temperature and humidity of the equilibration zone. In response to the input signals, the control system outputs one or more signals to actuation devices, valves, etc., of the thermal processing system for controlling aspects of the thermal processing.

[0048] Using the programmed equilibration systems and methods disclosed herein leads to several advantages, including real time yield prediction and higher quality work products. As discussed above, overcooking of work (food) products is reduced, so more moisture is retained in the food product, thereby improving the quality (including moistness and tenderness) of the food product as well as its net weight. In addition, less energy may be expended in cooking the work product, because the work product is not heated to as high a temperature as conventionally would be the case. Further, if located inside the oven, the programmed equilibration system does not consume valuable plant space.

[0049] Yet a further advantage of using the programmed equilibration systems and methods disclosed herein includes benefiting next steps in the processing of the food product. For instance, with the work product not heated to as high a temperature as conventionally would be the case, less energy may be expended in subsequent processing steps, such as in freezing the food product after cooking. More specifically, a cooling load needed for cooling (e.g., freezing) the food products may be significantly reduced, thereby saving energy and utilities (e.g., refrigerants). Further, when delivering equilibrated cooler food products to the freezer, evaporative cooling losses from said food products are reduced. As a result, frost build up within the freezer is minimized, thereby extending run time between defrost cycles.

[0050] A detailed explanation of various examples of the programmed equilibration systems and methods will now be provided.

[0051] References to “work product”, “work piece”, “substrate”, “food item”, “food product”, “product”, or the like may be used synonymously. One example of a work product or workpiece is a food product, such as, for example, beef, pork, poultry, fish, vegetables, fruits, and nuts.

[0052] As noted above, in one example, the programmed equilibration systems and methods are incorporated into a thermal processing system. For instance, the programmed equilibration systems and methods may be incorporated into a spiral conveyor-based thermal processing system, with an equilibration zone defined by at least one tier of a spiral stack in the system.

[0053] Although exemplary aspects of the programmed equilibration systems and methods are described with reference to a spiral conveyor-based thermal processing system, it should be appreciated that the programmed equilibration systems and methods may instead be adapted for use with any suitable thermal processing system, such as a convection oven, a linear convection oven, and impingement oven, a linear impingement oven, a spiral oven, a spiral impingement oven, a microwave oven, a radio frequency oven, etc.

[0054] An exemplary spiral conveyor-based thermal processing system suitable for implementing aspects of the programmed equilibration systems and methods are described herein will now be described.

[0055] Spiral conveyor-based thermal processing systems include a heating surface or a cooling / freezing surface in the form of a pervious conveyor belt for conveying work pieces, including food, through a thermal processing chamber in spiral or helical paths. If the work piece is being cooked or otherwise heated, the heat source, such as steam, heated air, or mixtures thereof, is provided within or adjacent the cooking chamber for heating the work pieces.

[0056] An advantage of thermal processing systems utilizing spiral conveyor belts is that a relatively long processing path may be achieved with a small footprint. For example, a 300-foot-long thermal processing conveyor belt in a spiral configuration can be contained within about a 10-foot high, 20-foot wide, and 40-foot-long housing. The housing holds a first ascending spiral conveyor stack and a second descending spiral conveyor stack.

[0057] However, spiral conveyor thermal processing systems do have some inherent drawbacks relative to a linear oven or freezer of a comparable length. In a linearoven or freezer, the upper and lower surfaces are exposed to being impinged upon by the thermal processing medium traveling at very high speeds, resulting in fast and efficient thermal transfer to the work product. However, in a spiral oven, the work products are less directly accessible to the thermal processing medium since the work products are arranged in stacked layers or tiers, thus requiring a less direct thermal processing methods than direct impingement of the thermal processing medium onto the work product.

[0058] In spiral conveyor configurations, a fan system is used to direct the flow of thermal processing medium horizontally across multiple tiers of the spiral belt path. The fan system is used to draw the processing medium across the stacks and then typically up to a location above the spiral belt path and through a heat exchanger to either heat or cool the thermal treating medium. Once exiting the heat exchanger, the treated medium is directed to flow downwardly along an exterior portion of the belt path diametrically opposite to the location of the circulating fans to draw the heating medium laterally into the spiral stacks and then across a bridge to an adjacent spiral belt path.

[0059] FIGURE 2 depicts an exemplary thermal processing apparatus 20 suitable for use with the programmed equilibration systems and methods described herein. The exemplary thermal processing apparatus 20 generally includes a rectangularly shaped housing 22 having a top section or ceiling 24, longitudinal side sections or walls 26, and transverse end sections or walls 28, as well as a floor 30. The housing 22 is sized to contain first and second spiral or helical conveyor units 32 and 34.

[0060] A continuous powered conveyor belt 36 for carrying work products through the apparatus 20 is arranged in tiers forming an ascending spiral stack 38 in conveyor unit 32 and arranged in tiers forming a descending spiral stack 40 in conveyor unit 34. As shown in FIGURE 2, the conveyor belt 36 enters the spiral conveyor unit 32 at the bottom thereof at an inlet 41a in wall 28 and then travels in a spiral path until reaching the top of the spiral stack 38, and then extends tangentially from the top of stack 38 to the top stack 40 to descend along the spiral conveyor unit 34 to eventually exit the unit 34 from the bottom tier of the stack 40 through outlet 41b form in wall 28. The inlet 41a and outlet 41b can be substantially sealed from the ambient by steam knives or other means.

[0061] A center or mid wall 42 divides the two spiral conveyor units 32 and 34 into first and second separate chambers or compartments 46 and 48 wherein different process media conditions can be employed. For example, the temperature of the air, air / vapor mixture, steam, or other processing medium, the moisture content in the air, the mediumvelocity, etc., may be different in the first and second compartments created by the mid or cross wall 42 to support different cooking steps. A close fitting opening 49 is provided in wall 42 to allow passage of the conveyor belt 36 and the work products being carried thereon. If needed, a steam knife or similar / other sealing system can be used to provide a seal between the first and second compartments 46 and 48.

[0062] As shown in FIGURE 3, the center of the conveyor spirals 38 and 40 extend around a central drive system 50 that rotates the conveyor units 32 and 34 about a central axis 52. The drive system 50 includes a cylindrical drive drum 54 that frictionally and rotationally drives conveyor belt 36 over supports (not shown) that are fixed in place exterior to the drum, thereby to rotate the belt about axis 52. The belt 36 tightens around the drive drum 54, creating enough friction or engagement therebetween to drive the belt forward to slide over and upward over the drum supports.

[0063] A top panel structure 58 overlies the conveyor spirals 38 and 40. Circulation fans 60 and 62 are positioned at outward sides of the conveyor units 32 and 34 to draw processing medium, for example, air, across the interior of the conveyor spirals 38 and 40 (and around drum 54) so as to thermally treat the work products being carried on the conveyor belt 36 and then direct such processing medium upwardly along the end walls 28 of the housing 22 toward the ceiling 24 of the housing. Thereafter, the processing medium is directed through a heat exchanger 64 positioned on or above the top panel structure 58. The processing medium extends transversely across the top of each of the spirals 38 and 40. The heat exchanger 64 may be mounted on or just above the structure 58 by an appropriate mounting structure.

[0064] The thermal processing air / vapor mixture, steam alone or in combination with other thermal processing medium, being circulated by the fans 60 and 62, when passing through the heat exchanger 64, is heated as desired. The heated processing medium flows horizontally over the top structure 58 until reaching the cross wall 42, wherein the processing medium is deflected downwardly to flow along the exposed adjacent portion of the conveyor spirals 38 and 40 and enter into the spirals in a lateral direction, as depicted by arrows 70, thereby heating the work product primarily by condensation then followed by convection heat transfer.

[0065] The spatial arrangement of the fans 60 and 62, the heat exchanger 64, and optimally positioned mid wall 42 in relation to the respective spirals enables flowdistribution to be substantially uniform to each tier within the individual spirals to deliver air flow mixture to approach the surfaces of the food items on the conveyor diagonally.

[0066] The first and second compartments 46 and 48 may each be divided into various thermal processing zones. For instance, in the example shown, a first mezzanine 74 located in a lower portion of the first compartment 46 divides the first compartment 46 (and therefore the conveyor spiral 38) into a lower first processing zone 76 below the first mezzanine 74 and an upper second processing zone 78 above the first mezzanine 74. The first mezzanine 74 extends substantially horizontally from the mid wall 42 toward the conveyor spiral 38 and is shaped to fit around a side portion of the conveyor spiral 38. The first mezzanine 74 is shown as substantially planar in construction. Appropriate braces or reinforcements can be used to provide the needed structural integrity of the mezzanine.

[0067] Optionally, the first mezzanine 74 is adjustable in elevation by an appropriate actuating system. For instance, the actuation system may be communicatively coupled to a system computing device, discussed below, which outputs one or more signals to the actuation system to alter the height of the first mezzanine 74 as desired. FIGURE 2 shows the first mezzanine 74 as located at an elevation between the first and second lowest tiers of the conveyor spiral 38. However, the first mezzanine 74 can be positioned at a higher elevation, for example, at the level of the second lowest tier or at a level above the second lowest tier of the conveyor spiral 38.

[0068] A thermal processing medium delivery conduit or pipe 80 may be used to deliver thermal processing medium in the form of saturated or superheated steam that is under pressure at the point of discharge to the lower first processing zone 76 for enhanced thermal processing of the work product. The rate of steam flow from the pipe can be controlled by adjusting a valve 82, which is schematically shown as located near the outlet of the pipe 80. The steam supply pressure may be controlled using a pressure control set valve to a value between 0.1 to 150 PSIG.

[0069] In cooking, optionally a sensed control variable is the humidity level in the zone 76. Using the sensed humidity level, the rate of steam flow is adjusted to enable the steam to expand to atmospheric conditions to deliver an instantaneous dew point temperature of 212°F more readily for interacting with the incoming work product (food items) on the entering conveyor. This is due to the lesser amount of de-superheating required at lower steam pressures.

[0070] The steam flowing from pipe 80, which fills the lower volume of zone 76 and then eventually flowing into the fan 60, functions to advantageously heat the work product by condensation heat transfer, which is capable of transferring heat to the work product very quickly, and much more rapidly than by convection heat transfer. In this regard, the heat transfer coefficient for steam condensation heat transfer is 2700 Kcal / hr- M2-°C, whereas the heat transfer coefficient for forced convection heat transfer is 30 to 35 Kcal / hr-M2-°C. Of course, condensation heat transfer stops when the work products’ surfaces reach the dew point temperature of the surrounding atmosphere (for example, within the enclosure), and thereafter convection heat transfer is required.

[0071] The steam delivered by pipe 80 may be saturated steam at atmospheric pressure, so that the high heat transfer coefficient noted above can be utilized. The saturated steam used can be controlled to a desired temperature based on type of substrate being processed. For example, for products with high fat content such as pork, it may be desirable to employ a saturated steam temperature that is lower than 212°F early on in the process to control the product yield loss associated with surface fat, since fat starts to melt at lower temperatures in the range of 131-135°F.

[0072] Moreover, food items may be processed to optimize a combination of things, such as desired product attributes (e.g., color, texture, mouth feel etc.), product yields, and throughputs. Thus, the process conditions needed to achieve these objectives are necessarily path specific, requiring suitable operating parameters for the defined zones. For example, in zone 76, condensation conditions may be dictated by product specificity to advantageously heat the work product by condensation heat transfer, and in zone 78, convection conditions may be defined to compliment the condensation conditions employed in zone 76 for the work product.

[0073] The highest energy transfer onto the surfaces of food items occurs through condensation at or around the highest dew point temperature which is 212°F. This is true irrespective of the type of substrate being processed, as long as the surface temperature is below the actual dew point temperature being used for the process. In that regard, the adjustable first mezzanine 74 can be set so low such that entering gases (steam or other) can bypass the first zone 76 with the result of only mixing in the fan 60 and adding to overall mixture proportions with gas mixture in zone 78 unmodified by relevant exposure to food items. In the alternative, the efficient use of steam may be used to achieve condensation heat transfer in processing zone 76, and to at least some extent, the steam canalso mix with the heated air in processing zone 78 to boost the enthalpy level in processing zone 78 for enhanced heating of the work product (e.g., food product) while in the processing zone 78.

[0074] Further, if it is desired to have more steam in processing zone 78 than available from leakage from zone 76, steam can specifically be supplied to zone 78 by, for example, a steam delivery pipe or conduit 83, as schematically shown in FIGURE 2. In this case, since condensation heat transfer is not being relied upon, the steam can be supplied at a higher pressure than in zone 76, for example, from about 60 - 80 PSIG.

[0075] The second chamber or compartment 48 may also be divided into zones. For instance, a second mezzanine 84 may be located in a lower portion of the second chamber 48 to effectively divide the second chamber 48 (and therefore the conveyor spiral 40) into a third upper processing zone 86 and a fourth lower processing zone 88. In the example shown, the second mezzanine 84 extends substantially horizontally from the mid wall 42 toward the conveyor spiral 40 and is shaped to fit around a side portion of the conveyor spiral 40. The second mezzanine 84 is shown as substantially planar in construction. Appropriate braces or reinforcements can be used to provide the needed structural integrity of the mezzanine.

[0076] Optionally, the second mezzanine 84 is adjustable in elevation by an appropriate actuating system. For instance, the actuation system may be communicatively coupled to a system computing device, discussed below, which outputs one or more signals to the actuation system to alter the height of the second mezzanine 84 as desired.

[0077] FIGURE 2 shows the second mezzanine 84 located at an elevation between the first and second lowest tiers of the conveyor spiral 40. However, the second mezzanine 84 can be positioned at a higher elevation, for example, at a level above the second lowest tier or the third lowest tier of the conveyor spiral 40, depending on the dwell time needed for each processing zone 86 and 88.

[0078] In the system and methods described herein, the third upper processing zone 86 is generally used for convection finish cooking, and the fourth lower processing zone 88 is used for adiabatic equilibration (hereinafter sometimes called the “adiabatic equilibration zone 88”). The third upper processing zone 86 may support convection finish cooking when a thermal processing medium, for example, air / vapor mixture heated by heat exchanger 64, is drawn by fan 62 across the interior of the conveyor spiral 40, as described above.

[0079] If enhanced thermal processing of the work product in the third upper processing zone 86 is desired, a thermal processing medium delivery conduit or pipe 90 may also deliver thermal processing medium to the zone 86. For instance, the thermal processing medium may be in the form of steam. The rate of steam flow from pipe 90 can be controlled by adjusting a valve 92, which is schematically shown. If required, the steam from pipe 90 functions to advantageously heat the work product by condensation or enhanced convection heat transfer (in case the surface temperature of the food items is higher than the surrounding dew point).

[0080] The adiabatic equilibration zone 88 is controlled to a predetermined constant reference temperature (TR) to enable the temperature of the food product to equilibrate adiabatically. Moreover, the pre-determined constant reference temperature (TR) may be defined at least initially by the maximum measured surface temperature of the food product, which in many instances will be reached just before it enters the equilibration zone. In some examples, the pre-determined constant reference temperature (TR) may be continuously adjusted to achieve the lowest potential temperature difference of the average surface and core temperatures of the food products.

[0081] A thermal processing medium delivery conduit or pipe 94 may deliver thermal processing medium to zone 88 to achieve and maintain the pre-determined reference temperature (TR) and / or humidity level (HR). In most instances, zone 88 will require a lower temperature than the preceding zone 86 where the food products FP are in a final stage of cooking. In other words, the required reference temperature (TR) will be significantly lower than a temperature of zone 86. In that regard, the thermal processing medium may be cooler air, steam, air alone, or air in combination with steam. In some instances, a vent 98 may be used to egress hot air from the adiabatic equilibration zone 88. In instances where the required reference temperature (TR) needs to be increased relative to the temperature of zone 86, the thermal processing medium may be in the form of steam. The rate of thermal processing medium flow from pipe 94 can be controlled by adjusting a valve 96, which is diagrammatically shown.

[0082] As noted above, the equilibration zone may also be controlled to a predetermined constant reference humidity level (HR) that is suitable for the product recipe. The thermal processing medium flowing from pipe 94 may also include a suitable level of moisture (relative humidity percentage) to achieve and maintain the pre-determined reference humidity level (HR).

[0083] As shown in FIGURE 2, an annular shaped barrier 100 may optionally be positioned just below the second tier from the bottom in conveyor spiral 40. The barrier 100 functions to catch liquid drippings from the tiers located above the barrier. Such drippings typically consist of moisture and fat drippings from the interior of the work product which has not evaporated when reaching the exterior surface of the work product. If such drippings were allowed to fall on to the work products as the work products are leaving the housing 22, such adulteration of the work product may be unacceptable visually, as well from a sterilization point of view.

[0084] The barrier 100 can take various forms, for example, the barrier can be generally in the form of an annularly shaped sheet that is mounted relative to the conveyor spiral 40 by mounting brackets or other means. The barrier 100 can be positioned at a slope to direct the drippings to a collection location. The barrier is shown as sloped to match the slope of the tiers. However, the barrier can be at a different slope than the tiers so as to facilitate the flow of the liquid drippings to a collection location.

[0085] Alternatively, the barrier can be in the form of a shallow truncated cone, so that the drippings flow to the outer perimeter of the barrier for collection.

[0086] Although the barrier 100 is shown as located below the second lower most tier of conveyor spiral 40, the barrier can be at different elevation relative to the spiral 40. For example, the barrier may be located just below the third lower most tier of the conveyor spiral. In this case, the second mezzanine 84 could be located at the elevation of the barrier 100 or at a different elevation of the barrier 100. Ideally, the mezzanine 84 will be located at or below level of the barrier to prevent any form of adulteration to remain on the surfaces of the food items during equilibration.

[0087] A control system 110, shown diagrammatically in FIGURE 2, may be employed to control the operation of the apparatus 20 to help ensure that the work products (e.g., food products FP) are properly thermally processed, for example, are cooked to achieve desired product core temperature and qualities consisting of sensory attributes such as color, flavor, texture, mouthfeel, etc., via in-oven conveyor path thermal processing and temperature equilibration. The control system 110 (also sometimes generally referred to as a “computing device”, a “computing system,” or the like) receives input signals from various measurement devices or instruments of a monitoring system that monitors, among other process parameters, the temperature, air / vapor mixture velocity, and moisture content within the housing 22 at various locations, the temperature of the food product, the speedof the conveyor belt 36, and the level of loading of food products on the conveyor belt, as discussed more fully below. The control system 110 may also communicate (e.g., receive input signals from and output signals to) one or more computing devices in networked communication with the control system, such as computing system 200.

[0088] In the depicted example, the control system 110 includes a controller 150 for use in controlling the operation of apparatus 20. The control system also includes a processor 152 linked to the controller. An appropriate interface 154 is provided for connecting the various gauges, monitoring / measuring devices, and components of the apparatus 20 to the controller 150. A memory unit 156 is provided for storing information regarding the apparatus 20, and a keyboard or other input device 158 is provided to enable the operator to communicate with the processor and controller. Such information can include a recipe for the type of food product being processed and desired end parameters for the fully processed food product. Such recipes for achieving the end parameters can be stored in the memory unit 156. Also, a display or other output device 160 is provided to convey information from the processor or control system to the operator, including the functioning of the apparatus 20. An example of a processor-operated control system for controlling a cooking apparatus is disclosed by U.S. Patent No. 6,410,066, which is incorporated herein by reference.

[0089] The monitoring system also monitors / measures, and the control system 110 controls, the components of the apparatus 20 so as to operate within set point parameters, including the speed of the conveyor belt 36, the speed of the fans 62, the operation, including the thermal output, of the heat exchanges 64, and the quality and volume of steam from delivery pipes 80, 90, and / or 94. These components are in communication with the control system 110. This can be accomplished by wired connection or wirelessly.

[0090] The control system 110, and more specifically the processor 152 together with the controller 150, controls the various components and subsystems of apparatus 20, including the level of the loading of the food product onto the conveyor belt 36, by controlling the operation of a delivery conveyor that delivers the food product to the conveyor belt. The control system 110 also controls the speed of the conveyor belt 36 by controlling the conveyor drive system 50. The speed of the conveyor belt affects the dwell time of the work products in the various processing zones of the apparatus 20.

[0091] In addition, the control system controls the temperature and moisture level within the upper and lower processing zones by controlling quality and volume flow rateof the thermal processing medium (steam, air, air / vapor mixture etc.) introduced into these processing zones. The control system also controls temperature and flow rate of the convection thermal processing medium in the upper second and upper third processing zones by controlling the temperature, volume, and speed of the hot air / vapor mixture circulated through these processing zones.

[0092] The monitoring system may also be configured to measure operational parameters of the apparatus 20, including the loading frequency or density of the food product FP loaded onto the conveyor belt 36 from a delivery conveyor, not shown. The monitoring system may further be configured to measure the output load frequency or density of the food product FP unloaded from the conveyor belt 36 to an outfeed conveyor 37.

[0093] An input load monitor / sensor 112 and an output load monitor / sensor 113 are schematically shown in FIGURE 2. The load monitor / sensors 112 and 113 can take various forms, including a scale to weigh the food product FP. Alternatively, the load monitor can be in the form of an optical scanner capable of scanning the food product and determining the volume of the food product, then calculating the weight of the food product by using the known density of the food product. Such scanning systems are well known in the art. For example, see U.S. Patent No. 7,452,466. The disclosure of this patent is incorporated herein by reference in its entirety. The information from the load monitor / sensors 112 and 113 is transmitted to the control system 110 and / or the computing system 200.

[0094] The monitoring system may also be configured to measure the temperature and moisture level within the various processing zones 76, 78, 86, and 88 of the conveyor spirals 38 and 40, as well as the velocity of the air / vapor mixture flowing through the convection processing zones 78 and 86. These operational parameters can be measured by a temperature sensor 114 and a moisture sensor 116 in the lower first processing zone 76. A temperature sensor 118, a moisture sensor 120, and a fluid velocity sensor 122 can be utilized in upper second heating zone 78. Correspondingly, a temperature sensor 124, a moisture sensor 126, and a fluid velocity sensor 128 can be utilized in upper third processing zone 86. Also, correspondingly, temperature sensor 130 and moisture sensor 132 can be employed in the adiabatic equilibration zone 88. These sensors are in communication with the control system 110, which can be by hard wiring or wireless transmission. Of course, alternative and / or additional sensors can be employed.

[0095] One or more of the temperature sensors 114, 118, 124, and 130 may be configured to sense the dry bulb and wet bulb temperatures within their respective processing zones. The reason for also measuring the wet bulb temperature is that as the food product is carried through the apparatus 20, its surface temperature gradually increases. Eventually, this surface temperature will reach the dew point temperature of the moist, hot air in the processing zone. At that point, the moisture in the heating medium within the processing zone will not condense on the surface of the food products. Instead, the moisture on the surface of the food products will begin to evaporate, which tends to cool the food product somewhat. The temperature at which this transition occurs will be the wet bulb temperature. Nonetheless, the energy delivered to the surfaces of the food product must still be sufficient to cook the food product to the desired target temperature (such as in zones 76, 78, and 86) while achieving sensory attributes sought and also kill the desired level of pathogens on and / or in the food product FP. As an alternative, the monitoring system can measure the dry bulb temperature and humidity level in the processing zones. From this information it is possible to determine the wet bulb temperature, relative humidity, and dew point within the processing zones.

[0096] The monitoring system can also be configured to measure the initial temperature of the food products FP entering the first lower processing zone 76 by, for example, the use of a first temperature measuring device 140. Likewise, the monitoring system can also be configured to measure the final temperature of the food products after exiting the adiabatic equilibration zone 88 by, for example, the use of a second temperature measuring device 142. These sensors also are in communication with the control system 110.

[0097] The first and second temperature measuring devices 140 and 142 may be configured as a thermal imaging camera. If a thermal imaging camera is used, the thermal imaging camera can also be trained to measure the size of the food products FP, at least the two-dimensional area of the food products.

[0098] In some examples, the programmed equilibration system includes a temperature probe assembly 164 configured to measure a core temperature of food products FP after the food products exit the adiabatic equilibration zone 88 (e.g., at the outlet 41b of the oven). The measurement of the core temperature of food products FP is not necessary because of the accuracy of the core temperature prediction using the programmed equilibration system disclosed herein. However, the temperature probe assembly 164 isuseful in performing a core temperature verification when needed or required by current convention plant operations. In that regard, the core temperature of food products may be measured as a verification step to ensure that the required legal minimum core temperature for food safety is achieved.

[0099] Although not shown in detail, the temperature probe assembly 164 may include a travelling beam that extends across the width of an outfeed conveyor 37 that generally perpendicular to the direction of product flow. The beam may carry an array of sensors that are configured to monitor / measure various aspects of the food products FP, such as the core temperature of food products FP. For instance, the beam may carry an array of temperature probes that may be actuated into engagement with food products FP for measuring the core temperature of the food products. The beam may also carry one or more vision systems, scanners, etc., that are suitable for identifying the location of a food product to be probed. Components of the temperature probe assembly 164 (e.g., sensors, actuation devices, etc.) may be in communication with and controlled by the control system 110.

[0100] The temperature probes may be type K thermocouples or similar. Regardless of specific configuration, the temperature probes may be generally configured with a temperature sensor or measuring capacity at the tip of the probe. In this manner, the core temperature of the food product may be measured with minimal penetration. Moreover, the location of the temperature sensor within the food product is generally known.

[0101] As can be appreciated, the probe must remain within the food product FP for a minimum amount of time to obtain a core temperature. In that regard, the beam carrying the temperature probes may be configured to move with the outfeed conveyor 37 at the same rate as the product flow. In this manner, the probes may be inserted into the food products FP and may remain in the food products to obtain a core temperature measurement as they move with the outfeed conveyor 37.

[0102] The travelling beam may be moved with a suitable movement assembly, such as an assembly equipped with a variable speed drive to substantially match the travel speed of the conveyor belt 36. Using a variable speed drive to substantially match the travel speed of the conveyor belt 36 enables frequent, accurate and consistent measurements of the food product core temperatures and any other food productmeasurements. Moreover, no additional handling or disruption to the moving food product is required, other than the insertion of the small temperature probes.

[0103] If the food product core temperatures are measured at a high frequency (e.g., a minimum number of food products per minute), the measurements may be sent to the control system 110 and / or the computing system 200 such that real-time algorithmic computations may be performed to obtain core temperature standard deviations as a function of time or by batch of product. The real-time core temperature standard deviation data may be processed by one or more modules of the control system 110 and / or the computing system 200, which may output one or more signals to the central drive system 50 for automatically adjusting belt speed for optimized throughput. For instance, if the real-time core temperature data reveals a core temperature standard deviation below a certain threshold, the belt speed may be increased to reduce the processing time.

[0104] Further, the control system 110 and / or the computing system 200 may output one or more signals to actuating devices of the valves of the thermal processing medium supply sources in response to the real-time core temperature standard deviation data. For instance, if the real-time core temperature reveals a core temperature standard deviation above a certain threshold, the processing temperature, humidity, etc., may be adjusted in zones 76, 78, and / or 86 to target a higher or lower core temperature before reaching the adiabatic equilibration zone 88. In some instances, the height of the first mezzanine 74 and / or the second mezzanine 84 may be adjusted to increase or decrease the dwell time in one or more of the zones.

[0105] The temperature probes may be moved into and out of engagement with the food products FP through a suitable actuator assembly associated with the traveling beam (e.g., mounted on the traveling beam for movement therewith). The actuator assembly is configured to move the temperature probe vertically into engagement with moving food products FP to begin the core temperature measurement. After a predetermined amount of time, the actuator assembly may retract the temperature probe from the moving food products FP.

[0106] The predetermined amount of time needed for the core temperature measurement may be based upon the response time of the probe as well as the temperature difference between the probe and the food product core. In some examples, the programmed equilibration systems and methods include preheating the temperature probe to a predetermined reference temperature (TRP) to decrease the temperature differencebetween the probe and the food product core. As a result, the predetermined amount of time needed for the core temperature measurement is minimized (e.g., less than fifteen seconds).

[0107] The temperature probe may be preheated to a predetermined reference temperature (TRP) below a known prescribed legal minimum core temperature (TM) for food safety. In this manner, heat from the temperature probe does not transfer to the interior of the work product being measured. The known prescribed legal minimum core temperature (TM) may be based on, for instance, a computed average of empirical data collected for a clearly defined substrate that is processed using a given set of thermal processing operating parameters (such as per USDA data, FDA data, etc.). The temperature probe may be preheated to a predetermined reference temperature (TRP) in any suitable manner, such as with an induction heater, by applying an electrical current to thermocouple extension wires of the probe, etc.

[0108] The amount of time needed for the core temperature measurement may be determined by running computational algorithms of one or more modules of the control system 110 and / or the computing system 200. Generally, the predetermined amount of time needed for the core temperature measurement is the estimated response time for the temperature probe to reach the known prescribed legal minimum core temperature (TM) with a temperature probe having a predetermined reference temperature (TRP) and with the food product FP having an estimated core product temperature (Tc). The estimated core product temperature (Tc) may be based on core temperature measurements gathered during batch pre-production runs of a test work product having a specific thermal process for a specific recipe.

[0109] The predetermined amount of time needed for the core temperature measurement may be correlated to the speed of outfeed conveyor 37 to determine the travel distance of the traveling beam. For instance, the control system 110 and / or the computing system 200 may run computational algorithms of one or more modules to determine the length of belt travel needed by the beam to enable sufficient probe insertion time. After determining the belt travel length needed, the control system 110 and / or the computing system 200 may output a signal(s) to the drive system of the traveling beam to move the beam the required distance at the speed of the outfeed conveyor 37 for that production run / recipe. In some examples, the traveling beam moves a fixed distance from the oven outlet 41b for a production run / recipe. For instance, the traveling beam may move alongoutfeed conveyor 37 between about 5 to 7 feet from the oven outlet 41b. In some examples, the short travel distance of the traveling beam may be enclosed to extend the physical limits of machine enclosure for verification before the next step in the process.

[0110] The measured core temperature of the food product is sent to the control system 110 and / or the computing system 200 for processing. Thereafter, the measured core temperature of the food product is compared to the known prescribed legal minimum core temperature (TM) for food safety. In the event the measured core temperature does not reach the known prescribed legal minimum core temperature (TM), a signal(s) may be outputted to the control system 110 to divert the corresponding batch of food products offline for re-processing. Before re-processing, the probe may be thermally sanitized and / or chemically sanitized using known techniques.[OHl] As noted above, the estimated core product temperature (Tc) may be based on core temperature measurements gathered during batch production runs of a test work product having a specific thermal process for a specific recipe. In that regard, the programmed equilibration systems and methods disclosed herein include using techniques for continuously and accurately capturing a surface temperature and core temperature of a test work product as a function of time (e.g., for the duration of a thermal process). For instance, the surface temperature and core temperature may be captured for substantially an entire thermal treatment process of the test work product.

[0112] The programmed equilibration system includes a core and surface temperature measurement assembly configured for continuously and accurately capturing both the surface temperature and core temperature of a test work product as a function of time. In one example, the core and surface temperature measurement assembly include a plurality of miniature computer chips that can be implanted within a test work product to measure the temperature of the test work product at the chip location.

[0113] The core and surface temperature measurement assembly may use any suitable miniature computer chips designed to log the test work product temperatures as a function of time at a designated time interval (e.g., as the test work product traverses along the spiral path within the oven enclosure from inlet to outlet while being exposed to the predefined cooking conditions within the segregated zones). For instance, in one example, “Smart Button” chips from ACR Systems Inc. are used.

[0114] Referring to FIGURE 4, the miniature computer chips are surgically implanted into a predetermined sample size of test work products at a location within eachtest work product that will provide an accurate core temperature and a surface temperature measurement of the test work product during a thermal process. For the core temperature measurement, a first chip 170a is placed at the geometric center of mass (core) of the thickest portion of the test work product substrate, which represents the lowest temperature of the test work product. The center of mass of the thickest portion of the test work product substrate may be determined using known techniques. For instance, a caliper gauge may be used to determine the thickness of the food product at the thickest portion of the substrate, and then the chip may be located at the geometric center of the food product, which is at substantially one half of the measured thickness.

[0115] For the surface temperature measurement, the second chip 170b is placed slightly beneath the surface of the test work product that is exposed to thermal processing medium (e.g. the top surface of the work product). As can be appreciated by those skilled in the art, measuring the actual surface temperature of a substrate at the substrate to air / vapor mixture fluid boundary layer is extremely difficult given the ever-changing conditions at the boundary layer within a thermal processing system. With the second chip 170b located slightly beneath the test work product substrate surface, a surface temperature measurement that is not significantly influenced by conditions external to the boundary layer may be obtained.

[0116] In that regard, the temperature measurement of the second chip 170b may be referenced as a characteristic surface temperature not influenced by conditions external to the boundary layer (Tcs). The characteristic surface temperature (Tcs) is generally a reasonably constant temperature relative to the actual surface temperature of the test work product (if it was possible to measure said surface temperature at the boundary layer accurately).

[0117] The inventors found that placement of a second chip 170b at approximately l / 16”-l / 8” beneath the test work product substrate surface is optimal for obtaining a characteristic surface temperature (Tcs) of the test work product. The second chip 170b may also be offset vertically with respect to the first chip 170a to accurately determine a difference in temperature between the core and surface of the test work product. In other words, the difference in temperature between the core and surface of the test work product is measured with the central axis of the chips positioned substantially vertically offset such that their respective surface areas in horizontal planes do not significantly influence the heat transmitted vertically within the test work product. For instance, as shown inFIGURE 4, the first chip 170a may be located vertically offset from the second chip 170b (which may be located at substantially the geometric center of the food product). In this manner, the first chip 170a does not significantly overlap with the second chip 170b.

[0118] An average core product temperature of a predetermined number of test work products (e.g., batch pre-production runs of a product having a specific recipe or end product requirements) at various times during the thermal process may be used to optimize the thermal process, the equilibration process, and / or the temperature verification process for the “same” work products (product having the same specific recipe or end product requirements). For instance, an average of core product temperatures of test work products before equilibration (TCBE), such as at the end of the third upper processing zone 86, may be used to adjust thermal process parameters as needed to target a higher or lower core product temperatures of the same work products before equilibration (TCBE). The average of core product temperatures before equilibration (TCBE) may also be used to determine the dwell time in the adiabatic equilibration zone 88 for the same work products factoring in the product thickness and thermal conductivity.

[0119] An average of final core product temperatures (TCF), which is the core product temperature of the test work product after equilibration (such as when exiting the oven), may be used to determine the predetermined reference temperature (TRP) for the temperature probe of the temperature probe assembly 164. Further, knowing the average of final core product temperatures (TCF) after equilibration, real time yield may be determined for those work products.

[0120] An average characteristic surface temperature (Tcs) of a predetermined number of test work products (e.g., batch pre-production runs of a product having a specific thermal process for a specific recipe) at various times during the thermal process may be used to optimize the thermal process, the equilibration process, and / or the temperature verification process for the same work products. For instance, average maximum characteristic surface temperatures (TMCS), which would be the characteristic surface temperatures before equilibration, such as at the end of the third upper processing zone 86, may be used to define the predetermined constant reference temperature (TR) of the adiabatic equilibration zone 88 for the work products. As noted above, the predetermined constant reference temperature (TR) enables the temperature of the work product to equilibrate adiabatically.

[0121] Average maximum characteristic surface temperatures (TMCS) of test work products may also be used to adjust thermal process parameters as needed to target a higher or lower average maximum characteristic surface temperatures (TMCS) to kill a desired percentage of any pathogenic microorganisms which may be present on the surface of the work product. In some examples, machine learning algorithms (carried out on the computing system 200, for example) may be used to predict the core temperature of the work product by knowing the average characteristic surface temperature of test work products for a given recipe.

[0122] The maximum characteristic surface temperature (TMCS) of a test work product is lower than the actual surface temperature for most thermal processes. For all practical purposes, if the temperature of the air / vapor mixture that is adjacent to the surface of the substrate is no higher than the actual surface temperature itself, it can be concluded that equilibration of a work product takes place adiabatically in the adiabatic equilibration zone 88.

[0123] As noted above, the measured core and characteristic surface temperatures of a predetermined number of test work products (e.g., batch pre-production runs of a product having a specific recipe or end product requirements) at various times during the thermal process are used to define the parameters of the adiabatic equilibration zone 88 for the same work products. For instance, the average maximum characteristic surface temperatures (TMCS) of test work products, which may be the characteristic surface temperatures before equilibration, such as at the end of the third upper processing zone 86, may be used to define the predetermined constant reference temperature (TR) of the adiabatic equilibration zone 88 for the same work products.

[0124] The parameters of the adiabatic equilibration zone 88 (e.g., dwell time, temperature, and humidity) are designed to achieve the lowest potential temperature difference of the average surface and core temperatures of the work products as the work product exits the adiabatic equilibration zone 88. In that regard, a physical measurement to verify the core temperature of the work product is not necessary, and if done, location of the temperature probe is not crucial given the compressed surface and core temperature differences.

[0125] An example showing the difference between a work product processed without equilibration and a food product processed using the programmed equilibration systems and methods disclosed herein will now be discussed.EXAMPLE 1

[0126] A test was conducted to demonstrate compression of the temperature difference between the surface and core temperature of a first food product at the outlet of the oven enclosure when using the adiabatic equilibration step compared to a nonequilibrated case.Test Equipment• JBT Stein TwinDrum Spiral oven (specifically, the Stein TDO-600 Spiral Oven)• JBT Stein JSO-C Jet Stream® linear oven• Two one inch (1”) thick beef steaks• Miniature computer chips or “smart buttons”Non-Equilibrated Test

[0127] Computer chips (circular “Smart Buttons”) were surgically implanted into each of the beef steaks at substantially the geometric center (core) with respect to the thickness of the beef steak and at about l / 16”-l / 8” as practical below the outer surface of the beef steak. The computer chips were substantially offset to avoid vertical alignment. The vertical offset of the chips was around (r+1) inches, where r is the radius of the chip. Such an offset substantially prevents the thermal conductivity and specific heat of the chip material from influencing the characteristic surface temperature and the core temperature measurements. Moreover, by positioning the chip that logged the surface temperature slightly beneath the surface of the beef steak substrate, challenges associated with measuring the temperature at the boundary layer of the substrate surface and the surrounding fluid were avoided.

[0128] Each of the beef steaks were cooked at pre-defined conditions in the spiral oven. More specifically, the beef steaks were exposed to the predefined cooking conditions within segregated zones of the spiral oven. The chips logged the core and surface beef steak temperatures as a function of time at designated time intervals as the beef steaks traversed along the spiral path within the oven enclosure from inlet to outlet.

[0129] After exiting the oven, the beef steaks for the equilibrated case were transferred to the linear oven, which was used to represent an adiabatic equilibration zone. The linear oven was conditioned using steam at the maximum measured characteristic surface temperature (Tcs) of the non-equilibrated temperature profile, as determined from the computer chip located near the surface of the beef steak.

[0130] Normally, the maximum measured characteristic surface temperature (Tcs) used to set the conditioning (e.g., the predetermined constant reference temperature (TR)) of the adiabatic equilibration zone would be the maximum characteristic surface temperature (Tcs) of the food product reached during cooking, typically just before entering the adiabatic equilibration zone. Here, to accommodate the dual oven setup for the experiment, the conditioning of the adiabatic equilibrated zone was set to a pre-determined constant reference temperature (TR) of 155°F (rather than a pre-determined constant reference temperature (TR) that is the maximum measured characteristic surface temperature of 175°F reached during cooking). The lower conditioning temperature accounted for the beef steak surface cooling that occurred during the transfer of the beef steak from the discharge of the spiral oven to the linear oven. The conditioning of the adiabatic equilibrated zone was generated by steam only through the steam chamber and oven at around 20% fan speed.

[0131] The beef steak was transported on a carrier having approximately 95% open area for the surrounding media to interact with the beef steak during adiabatic equilibration (which substantially mimics the thermal processing medium exposure to the food product during cooking in the spiral oven).

[0132] FIGURE 5 graphically depicts the non-equilibrated surface and core temperature profiles of the beef steak at the discharge of the oven. As can be seen, the temperature difference between the measured characteristic surface and core temperatures (Tcs and Tc, respectively) of the non-equilibrated beef steak was around 21 ,6°F as it exited the oven enclosure. At the exit location, the core temperature of the non-equilibrated beef steak was 151.7°F.

[0133] FIGURE 6 graphically depicts the equilibrated characteristic surface temperature (Tcs) and core temperature (Tc) profiles of the beef steak at the discharge of the oven. As can be seen, the temperature difference between the characteristic surface temperature (Tcs) and core temperature (Tc) of the equilibrated beef steak was around 5.8°F as it exited the oven enclosure. At the exit location, the core temperature (Tc) of the equilibrated beef steak was 155.4°F (and thus the final core product temperature (TCF) was 155.4°F).

[0134] The temperature convergence shown in FIGURE 6 for the equilibrated beef steak demonstrates more efficient distribution of energy within the beef steak compared to the non-equilibrated beef steak. In that regard, less energy is required to deliver thetargeted core temperature (e.g., the known prescribed legal minimum core temperature (TM)) of the beef steak using adiabatic equilibration.EXAMPLE 2

[0135] A test was conducted to demonstrate compression of the temperature difference between the surface and core temperature of a second food product at the outlet of the oven enclosure when using the adiabatic equilibration step compared to a nonequilibrated case.Test Equipment• JBT Stein TwinDrum Spiral oven (specifically, the Stein TDO-600 Spiral Oven)• JBT Stein JSO-C Jet Stream® linear oven• Two skinless boneless chicken breasts (SBCB)• Miniature computer chips or “smart buttons”Non-Equilibrated Test

[0136] Computer chips (circular “Smart Buttons”) were surgically implanted into each SBCB at substantially the geometric center (core) with respect to the thickness of the SBCB and at about l / 16”-l / 8” as practical below the outer surface of the SBCB. The computer chips were substantially offset to avoid vertical alignment. Simar to the arrangement in EXAMPLE 1, the vertical offset of the chips was around (r+1) inches, where r is the radius of the chip.

[0137] Each SBCB was cooked at pre-defined conditions in the spiral oven. More specifically, each SBCB was exposed to the predefined cooking conditions within segregated zones of the spiral oven. The chips logged the SBCB core and characteristic surface temperatures as a function of time at designated time intervals as the SBCB traversed along the spiral path within the oven enclosure from inlet to outlet.

[0138] After exiting the oven, the SBCB for the equilibrated case was transferred to the linear oven, which was used to represent an adiabatic equilibration zone. The linear oven was conditioned using steam at the maximum measured characteristic surface temperature (Tcs) of the non-equilibrated temperature profile, as determined from the computer chip located near the surface of the SBCB.

[0139] As noted above, normally the maximum measured characteristic surface temperature (Tcs) used to set the conditioning (e.g., the predetermined constant reference temperature (TR)) of the adiabatic equilibration zone would be the maximum characteristic surface temperature (Tcs) of the food product reached during cooking, typically just beforeentering the adiabatic equilibration zone. In this example, as with EXAMPLE 1, to accommodate the dual oven setup for the experiment, the conditioning (e.g., the predetermined constant reference temperature (TR)) of the adiabatic equilibrated zone was set to 155°F (rather than the maximum measured characteristic surface temperature (Tcs) of 175°F reached during cooking). The lower conditioning temperature accounted for the SBCB surface cooling that occurred during the transfer of the SBCB from the discharge of the spiral oven to the linear oven. The conditioning of the adiabatic equilibrated zone was generated by steam only through the steam chamber and oven at around 20% fan speed.

[0140] The SBCB was transported on a carrier having approximately 95% open area for the surrounding media to interact with the SBCB during adiabatic equilibration (which substantially mimics the thermal processing medium exposure to the food product during cooking in the spiral oven).

[0141] FIGURE 7 graphically depicts the non-equilibrated characteristic surface temperature (Tcs) and core temperature (Tc) profile of the SBCB at the discharge of the oven. As can be seen, the temperature difference between the characteristic surface temperature (Tcs) and core temperatures (Tc) of the non-equilibrated SBCB was around 40.5°F as it exited the oven enclosure. At the exit location, the core temperature (Tc) of the non-equilibrated SBCB was about 144°F (and thus the final core product temperature (TCF) was 144°F) and the characteristic surface temperature (Tcs) was around 184.1°F.

[0142] FIGURE 8 graphically depicts the equilibrated characteristic surface temperature (Tcs) and core temperature (Tc) profiles of the SBCB at the discharge of the oven. As can bel963-P53 seen, the temperature difference between the characteristic surface temperature (Tcs) and core temperatures of the equilibrated SBCB was around 25.2°F as it exited the oven enclosure. At the exit location, the core temperature (Tc) of the equilibrated SBCB was about 158°F and the characteristic surface temperature (Tcs) was around 183.2°F.

[0143] The temperature convergence shown in FIGURE 8 for the equilibrated SBCB demonstrates more efficient distribution of energy within the SBCB compared to the non-equilibrated SBCB. In that regard, less energy is required to deliver the targeted core temperature (e.g., the known prescribed legal minimum core temperature (TM)) of the SBCB using adiabatic equilibration.

[0144] Moreover, it can be appreciated that the temperature difference between the characteristic surface temperature (Tcs) and the core temperature (Tc) of the equilibratedSBCB may be further compressed by increasing the dwell time of the adiabatic equilibration zone. As noted above, the time in equilibration may generally be considered a function of the substrate thickness and its thermal conductivity. Compared to the beef steak tested in EXAMPLE 1, the SBCB may require a longer dwell time within the equilibration zone due to its thickness and / or thermal conductivity. If the equilibration zone is incorporated into a thermal processing system such as a spiral oven with the equilibration zone defined by at least one tier of a spiral in the system, the dwell time of the equilibration zone may be increased by increasing the number of tiers used for equilibration.

[0145] The numerical data from EXAMPLE 2 indicates the potential benefit of using an increased dwell time for an extended equilibration of a work product to achieve a targeted core temperature (e.g., the known prescribed legal minimum core temperature (TM)). The core temperature (Tc) of the equilibrated SBCB (158°F), which was achieved using a dwell time representing only one tier, was significantly higher than the core temperature (Tc) of the non-equilibrated SBCB (144°F) using an identical total dwell time with almost identical characteristic surface temperatures (Tcs) (184.1°F & 183.2°F, respectively).

[0146] Now referring to FIGURE 9, a block diagram of an exemplary computing system 200 suitable for carrying out various aspects of the programmed equilibration systems and methods disclosed herein will be described. As noted above, the computing system 200 may be in communication with the control system 110 of the apparatus 20 for processing any monitoring and / measurement data received from the apparatus 20. In that regard, some or all functional aspects of the computing system 200 may be implemented into the control system 110, or some or all functional aspects of the control system 110 may be implemented into the computing system 200. Moreover, the computing system 200 (and / or the control system 110) may communicate (e.g., receive input signals from and output signals to) with one or more computing devices in networked communication therewith.

[0147] The computing system 200 is generally configured to store and retrieve product specification data (i.e., product recipes), as well as receiving signals from various sensors and other devices for controlling various actuators and other components in accordance with stored instructions and acquired data. In the depicted example, the computing system 200 includes a processor(s) 602, a communication interface(s) 604, andcomputer readable medium 606, and one or more data stores (e.g., a thermal processing sensor data store 608 and an adiabatic equilibrium conditioning parameters data store 610).

[0148] The computing system 200 may be implemented by any computing device or collection of computing devices, including but not limited to a programmable logic controller (PLC), a desktop computing device, a laptop computing device, a mobile computing device, a server computing device, a computing device of a cloud computing system, and / or combinations thereof. In some examples, the processor(s) 602 may include any suitable type of general-purpose computer processor. In some examples, the processor(s) 602 may include one or more special-purpose computer processors or Al accelerators optimized for specific computing tasks, including but not limited to graphical processing units (GPUs), vision processing units (VPTs), and tensor processing units (TPUs).

[0149] In some examples, the communication interface(s) 604 include one or more hardware and or software interfaces suitable for providing communication links between components. The communication interface(s) 604 may support one or more wired communication technologies (including but not limited to Ethernet, FireWire, and USB), one or more wireless communication technologies (including but not limited to Wi-Fi, WiMAX, Bluetooth, 2G, 3G, 4G, 5G, and LTE), and / or combinations thereof.

[0150] As used herein, “computer-readable medium” refers to a removable or nonremovable device that implements any technology capable of storing information in a volatile or non-volatile manner to be read by a processor of a computing device, including but not limited to: a hard drive; a flash memory; a solid state drive; random-access memory (RAM); read-only memory (ROM); a CD-ROM, a DVD, or other disk storage; a magnetic cassette; a magnetic tape; and a magnetic disk storage.

[0151] As used herein, “engine” refers to logic embodied in hardware or software instructions, which can be written in one or more programming languages, including but not limited to C, C++, C#, COBOL, JAVA™, PHP, Perl, HTML, CSS, JavaScript, VBScript, ASPX, Go, and Python. An engine may be compiled into executable programs or written in interpreted programming languages. Software engines may be callable from other engines or from themselves. Generally, the engines described herein refer to logical modules that can be merged with other engines or can be divided into sub-engines. The engines can be implemented by logic stored in any type of computer-readable medium or computer storage device and be stored on and executed by one or more general purposecomputers, thus creating a special purpose computer configured to provide the engine or the functionality thereof. The engines can be implemented by logic programmed into an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or another hardware device.

[0152] As used herein, “data store” refers to any suitable device configured to store data for access by a computing device. One example of a data store is a highly reliable, high-speed relational database management system (DBMS) executing on one or more computing devices and accessible over a high-speed network. Another example of a data store is a key-value store. However, any other suitable storage technique and / or device capable of quickly and reliably providing the stored data in response to queries may be used, and the computing device may be accessible locally instead of over a network or may be provided as a cloud-based service. A data store may also include data stored in an organized manner on a computer-readable storage medium, such as a hard disk drive, a flash memory, RAM, ROM, or any other type of computer-readable storage medium. One of ordinary skill in the art will recognize that separate data stores described herein may be combined into a single data store, and / or a single data store described herein may be separated into multiple data stores, without departing from the scope of the present disclosure.

[0153] As shown, the computer readable medium 606 has stored thereon logic that, in response to execution by the one or more processor(s) 602, may cause the computing system 200 to provide a core temperature prediction engine 612, an adiabatic equilibration zone conditioning engine 614, and a real time product yield engine 616.

[0154] The core temperature prediction engine 612, adiabatic equilibration zone conditioning engine 614, and real time product yield engine 616 of the computing system 200 are configured to receive input signals from sensors of the apparatus 20, such as the temperature sensors (e.g., first temperature measuring device 140, temperature sensor 114 / 118 / 124 / 130, second temperature measuring device 142, and / or the temperature probe assembly 164) load sensors (e.g., load sensors 112 / 113), vision systems, humidity / moisture sensors (e.g., moisture sensor 116 / 120 / 126 / 132), and fluid velocity sensors (e.g., fluid velocity sensor 122 / 128), etc.). The core temperature prediction engine 612, adiabatic equilibration zone conditioning engine 614, and real time product yield engine 616 of the computing system 200 may also receive automated instructions and / or user input received via a human machine interface (HMI) of the computing system 200, thecontrol system 110, or a computing device in communication with therewith. Further, the core temperature prediction engine 612, adiabatic equilibration zone conditioning engine 614, and real time product yield engine 616 of the computing system 200 may receive input signals from other devices of the apparatus 20 or devices associated therewith. The core temperature prediction engine 612, adiabatic equilibration zone conditioning engine 614, and real time product yield engine 616 of the computing system 200 may also retrieve any relevant data from one or more of the data stores 608 or 610.

[0155] The core temperature prediction engine 612 processes system input signals and outputs one or more signals for predicting a final core temperature (TCF) of a substrate for a first type of work products having a first work product recipe, etc. The core temperature prediction engine 612 may run a module / algorithm to predict the final core temperature (TCF) of a first type of work product by knowing the maximum characteristic surface temperature (TMCS) for test work products of the first type of work products for a first work product recipe. The maximum characteristic surface temperature (TMCS) for a given process may be determined from the temperature data gathered from a sensor located near a surface of a test work product (e.g., a first chip 170a). The maximum characteristic surface temperature (TMCS) may also be predicted based on the predetermined thermal conditions of the process for first work product recipe (e.g., steam, air temperature, moisture, dwell time in each zone, etc.).

[0156] In that regard, in some examples, machine learning algorithms may be carried out by the core temperature prediction engine 612 to predict the maximum characteristic surface temperature (TMCS) and / or the final core temperature (TCF) of a first type of work product having a first work product recipe. The machine learning algorithms may be trained using the core temperature and surface temperature measurements gathered from tests runs using implanted first and second chips 170a and 170b in test work products of the first type of work product having a first work product recipe.

[0157] The core temperature prediction engine 612 may also output one or more signals to the adiabatic equilibration zone conditioning engine 614 indicative of a characteristic surface temperature and / or a core temperature of a first type of work product for a first work product recipe (such as the maximum characteristic surface temperature (TMCS) and the core product temperature before equilibration (TCBE)). The adiabatic equilibration zone conditioning engine 614 may also retrieve product specific data, such as its thickness and thermal conductivity, from a data store on the control system110 / computing system 200 or another computing device. The adiabatic equilibration zone conditioning engine 614 may process the received / retrieved data and output one or more signals for activating actuators in communication with adiabatic equilibration zone valves, fans, vents, etc., for selectively allowing the flow of a thermal processing medium in the adiabatic equilibration zone 88 or for otherwise controlling the conditioning in the adiabatic equilibration zone 88.

[0158] Further, the adiabatic equilibration zone conditioning engine 614 may output one or more signals for activating actuators in communication with the second mezzanine 84 for adjusting its vertical location. When the second mezzanine 84 is moved up or down, the dwell time within the adiabatic equilibration zone 88 is correspondingly increases or decreases. For instance, to increase the dwell time within the adiabatic equilibration zone 88, the second mezzanine 84 may be moved upward from a location between the first and second tiers of the conveyor spiral 40 to a location between the second and third tiers.

[0159] Further, the adiabatic equilibration zone conditioning engine 614 may output one or more signals for activating the central drive system 50 to increase or decrease the thermal process dwell time within the oven. For instance, if the core temperature measurements of the temperature probe assembly 164 indicate a higher core temperature than needed, the dwell time may be reduced in at least one of the thermal processing zones.

[0160] In some examples, machine learning algorithms may be carried out by the adiabatic equilibration zone conditioning engine 614 to determine the conditioning of the adiabatic equilibration zone 88 (e.g., dwell time, temperature, and moisture) for a second type of work product similar to the first type of work product (such as having a similar work product recipe). The machine learning algorithms may be trained by correlating work product features (e.g. product recipe, product thickness, substrate makeup, product thermal conductivity, etc.) and test work product data to predetermining conditioning parameters of the adiabatic equilibration zone 88 for the first type of work product. The test work product core temperature data and surface temperature data may be gathered from the first chip 170a and second chip 170b used during various test runs, from temperature probes, and / or through the use of vision systems or other systems.

[0161] The real time product yield engine 616 of the computing system 200 processes the system input signals and outputs one or more signals indicative of real time product yield for a specific production run or work product. For instance, the real timeproduct yield engine 616 may receive / retrieve core temperature data (such as from the core temperature prediction engine 612, the temperature probe assembly 164, etc.) and weight measurements of the work product before thermal processing and / or after equilibration for providing accurate, real time yield data. In one example, the weight measurement data may be received / retrieved from the input and output load monitor / sensors 112 and 113 or the like.

[0162] In some examples, machine learning algorithms may be carried out by the real time product yield engine 616 to determine the real time yield for a specific production run. The machine learning algorithms may be trained, for instance, by correlating final core temperature data (TCF) for a work product processed with a predetermined adiabatic equilibration step, weight measurement data, and any data science (e.g., USDA or FDA yield data) for a specific food product / recipe.

[0163] Referring to FIGURE 10, an exemplary programmed equilibration method 700 will now be described. The exemplary method 700 may be used to predict a core temperature of a food product for a specific recipe / thermal process, generate parameters for an adiabatic equilibration zone for the thermal process, and / or generate real time yields for a production run or process.

[0164] For ease of description, the exemplary method 700 will be described as being carried out by the various components of the apparatus 20, the control system 110, and / or the computing system 200 described herein. In that regard, reference will be made to components of the apparatus 20, the control system 110, and / or the computing system 200 for illustrating aspects of the exemplary method 700. However, it should be appreciated that the exemplary method 700 may instead be carried out by any other component, such as another type of oven, an additional computing device or system in communication with the apparatus 20, etc.

[0165] From a start block, the method 700 proceeds to block 702, where the method includes obtaining characteristic surface temperature and core temperature data of a test work product of a first type of work product having a first work product recipe as a function of time. For instance, the method may include implanting miniature computer chips (such as first chip 170a and second chip 170b) within a test work product to measure the core and characteristic surface temperature of the test work product during a thermal process. In that regard, the method may include placing a first chip 170a at the geometric center of mass (core) of the thickest portion of the test work product substrate, which represents thelowest temperature of the test work product. The method may further include placing a second chip 170b slightly beneath the surface of the test work product, such as at about 1 / 16”- 1 / 8” below the surface. The method may further include separation of the center-to- center distance between first and second chips by a predetermined distance, such as (r+1) inches.

[0166] The method 700 may proceed to block 704, where the method includes optimizing the thermal process, the equilibration process, and / or the temperature verification process of the first type of work product using at least one of the obtained characteristic surface temperature and core temperature. In that regard, optimization may include determining an average core product temperature of a predetermined number of test work products at various times during the thermal process (e.g., using the chip data for the test work products). In some examples, optimization includes adjusting thermal process parameters to target a higher or lower core product temperature for the first type of work product before equilibration (TCBE) (such as at the end of the third upper processing zone 86).

[0167] Optimization may include determining an average characteristic surface temperature of a predetermined number of test work products at various times during the thermal process (e.g., using the chip temperature data for a batch of pre-production runs of the first type of work product). In some examples, optimization includes defining parameters of the adiabatic equilibration zone 88 for the first type of work product based on an average maximum characteristic surface temperature (TMCS) of the test work products. The average maximum characteristic surface temperature (TMCS) may be the average characteristic surface temperatures of the test work products before equilibration, such as at the end of the third upper processing zone 86.

[0168] The average maximum characteristic surface temperature (TMCS) of the test work products may be used to define the predetermined constant reference temperature (TR) of the adiabatic equilibration zone 88 of the first type of work product. As noted above, the predetermined constant reference temperature (TR) enables the temperature of the work product to equilibrate adiabatically. Measured characteristic surface temperatures may also be used to adjust thermal process parameters as needed to target a higher or lower average characteristic surface temperature before equilibration to kill a desired percentage of any pathogenic microorganisms which may be present on the surface of the food product.

[0169] The method may proceed to block 706, where the method includes predicting a core temperature of the first type of work product. For instance, the method may include processing system input signals (e.g., from one or more sensors) and outputting one or more signals for predicting a final core temperature (TCF) of the first type of work product.

[0170] In some examples, the core temperature prediction engine 612 may run a module / algorithm to predict the core temperature of the first type of work product by knowing the characteristic surface temperature for the test work product. As discussed above, the characteristic surface temperature for a test work product may be determined from the temperature data gathered from a sensor located near a surface of the test work product (e.g., a first chip 170a). The characteristic surface temperature may also be predicted based on the predetermined thermal conditions of the process (e.g., steam, air / vapor mixture temperature, fan speed, moisture by volume (%MV), dwell time in each zone, etc.).

[0171] In some examples, the method may include running machine learning algorithms to predict a characteristic surface temperature and / or a core temperature of a second type of work product similar to the first type of work product (such as having a similar work product recipe). The machine learning algorithms may be trained by correlating work product features (e.g., product recipe, product thickness, substrate makeup, product thermal conductivity, etc.) and work product temperature measurement data of the test work product.

[0172] The method may proceed to block 708, where the method includes determining real time yield, such as by using the first type of work product final core product temperatures (TCF) after equilibration and first type of work product weight measurements (such as from the input and output load monitor / sensors 112 and 113). For instance, the real time product yield engine 616 may receive / retrieve core temperature data for the first type of work product (such as from the core temperature prediction engine 612, the temperature probe assembly 164, etc.). The real time product yield engine 616 may also receive / retrieve weight measurements of the first type of work product before thermal processing and / or after equilibration for providing accurate, real time yield data for the first type of work product.

[0173] In some examples, machine learning algorithms may be carried out by the real time product yield engine 616 to determine the real time yield for the first type of workproduct. (e.g., for a specific production run). The machine learning algorithms may be trained by correlating core temperature data, weight measurement data, and any data science (e.g., USDA or FDA yield data) for the first type of work product processed with a predetermined adiabatic equilibration step.

[0174] At block 710, the method optionally includes obtaining a real-time core temperature of the first type of work product after the work products exit the adiabatic equilibration zone, such as with the temperature probe assembly 164. The method may further include increasing the belt speed to increase to reduce the processing time if the real-time core temperature data reveals a core temperature standard deviation below a certain threshold.

[0175] The method may further include preheating a temperature probe of the temperature probe assembly 164 to a predetermined reference temperature (TRP) to decrease the temperature difference between the probe and the work product core. In some examples, the temperature probe may be preheated to a predetermined reference temperature (TRP) below a known prescribed legal minimum core temperature (TM) of the first type of work product for food safety. In some examples, an average of final core product temperatures (TCF) after equilibration (such as when exiting the oven), may be used to determine the predetermined reference temperature (TRP) for the temperature probe of the temperature probe assembly 164. The final core product temperatures (TCF) may be determined with the data from second chip 170b and / or from one or more machine learning algorithms.

[0176] The method may further include determining the time needed for the core temperature measurement based upon the response time of the probe as well as the temperature difference between the probe and the work product core. Further, the method may include correlating the time needed for the core temperature measurement to the speed of an outfeed conveyor to determine the travel distance of a traveling beam carrying the temperature probes.

[0177] The method may further include sending the measured core temperature of the first type of work product to a computing system, and diverting the corresponding batch of the first type of work product off-line for re-processing if the measured core temperature does not reach the known prescribed legal minimum core temperature (TM).

[0178] The method 700 may end or be used for another food product recipe.

[0179] Although the example method 700 depicts a particular sequence of operations, the sequence may be altered without departing from the scope of the present disclosure. For example, some of the operations depicted may be performed in parallel or in a different sequence that does not materially affect the function of the method 700. In other examples, different components of an example device or system that implements the method 700 may perform functions at substantially the same time or in a specific sequence.

[0180] FIGURE 11 is a block diagram that illustrates aspects of an exemplary computing device 902 appropriate for use as a computing device of the present disclosure. While multiple different types of computing devices were discussed above, the exemplary computing device 902 describes various elements that are common to many different types of computing devices. While FIGURE 11 is described with reference to a computing device that is implemented as a device on a network, the description below is applicable to servers, personal computers, mobile phones, smart phones, tablet computers, embedded computing devices, and other devices that may be used to implement portions of embodiments of the present disclosure. Some embodiments of a computing device may be implemented in or may include an application-specific integrated circuit (ASIC), a field- programmable gate array (FPGA), or other customized device. Moreover, those of ordinary skill in the art and others will recognize that the computing device 902 may be any one of any number of currently available or yet to be developed devices.

[0181] In its most basic configuration, the computing device 902 includes at least one processor 904 and a system memory 912 connected by a communication bus 908. Depending on the exact configuration and type of device, the system memory 912 may be volatile or nonvolatile memory, such as read only memory (“ROM”), random access memory (“RAM”), EEPROM, flash memory, or similar memory technology. Those of ordinary skill in the art and others will recognize that system memory 912 typically stores data and / or program modules that are immediately accessible to and / or currently being operated on by the processor 904. In this regard, the processor 904 may serve as a computational center of the computing device 902 by supporting the execution of instructions.

[0182] As further illustrated in FIGURE 11, the computing device 902 may include a network interface 908 comprising one or more components for communicating with other devices over a network. Embodiments of the present disclosure may access basic services that utilize the network interface 908 to perform communications using common networkprotocols. The network interface 908 may also include a wireless network interface configured to communicate via one or more wireless communication protocols, such as Wi-Fi, 2G, 3G, LTE, WiMAX, Bluetooth, Bluetooth low energy, and / or the like. As will be appreciated by one of ordinary skill in the art, the network interface 908 illustrated in FIGURE 11 may represent one or more wireless interfaces or physical communication interfaces described and illustrated above with respect to particular components of the computing device 902.

[0183] In the exemplary embodiment depicted in FIGURE 11, the computing device 902 also includes a storage medium 906. However, services may be accessed using a computing device that does not include means for persisting data to a local storage medium. Therefore, the storage medium 906 depicted in FIGURE 11 is represented with a dashed line to indicate that the storage medium 906 is optional. In any event, the storage medium 906 may be volatile or nonvolatile, removable or nonremovable, implemented using any technology capable of storing information such as, but not limited to, a hard drive, solid state drive, CD ROM, DVD, or other disk storage, magnetic cassettes, magnetic tape, magnetic disk storage, and / or the like.

[0184] Suitable implementations of computing devices that include a processor 904, system memory 912, communication bus 908, storage medium 906, and network interface 908 are known and commercially available. For ease of illustration and because it is not important for an understanding of the claimed subject matter, FIGURE 11 does not show some of the typical components of many computing devices. In this regard, the computing device 902 may include input devices, such as a keyboard, keypad, mouse, microphone, touch input device, touch screen, tablet, and / or the like. Such input devices may be coupled to the computing device 902 by wired or wireless connections including RF, infrared, serial, parallel, Bluetooth, Bluetooth low energy, USB, or other suitable connections protocols using wireless or physical connections. Similarly, the computing device 902 may also include output devices such as a display, speakers, printer, etc. Since these devices are well known in the art, they are not illustrated or described further herein.

[0185] While the concepts of the present disclosure are susceptible to various modifications and alternative forms, specific examples thereof have been shown in the drawings and have been described herein in detail. It should be understood, however, that there is no intent to limit the concepts of the present disclosure to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, andalternatives consistent with the present disclosure and the appended claims. A person skilled in the relevant art will recognize that other components and configurations may be used without parting from the spirit and scope of the disclosure. Numerous specific details are described to provide a thorough understanding of the disclosure. However, in certain instances, well-known or conventional details are not described in order to avoid obscuring the description.

[0186] References in the specification to “one example,” “an example,” “an exemplary example,” etc., indicate that the example described may include a particular feature, structure, or characteristic, but every example may or may not necessarily include that particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same example. Further, when a particular feature, structure, or characteristic is described in connection with an example, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other examples whether or not explicitly described. Additionally, it should be appreciated that items included in a list in the form of “at least one A, B, and C” can mean (A); (B); (C); (A and B); (B and C); (A and C); or (A, B, and C). Similarly, items listed in the form of “at least one of A, B, or C” can mean (A); (B); (C); (A and B); (B and C); (A and C); or (A, B, and C).

[0187] Language such as “upstream”, “downstream”, “left”, “right”, “first”, “second”, etc., in the present disclosure is meant to provide orientation for the reader with reference to the drawings and is not intended to be the required orientation of the components or graphical images or to impart orientation limitations into the claims.

[0188] In the drawings, some structural or method features may be shown in specific arrangements and / or orderings. However, it should be appreciated that such specific arrangements and / or orderings may not be required. Rather, in some examples, such features may be arranged in a different manner and / or order than shown in the illustrative FIG. Additionally, the inclusion of a structural or method feature in a particular FIG. is not meant to imply that such feature is required in all examples, and, in some examples, it may not be included or may be combined with other features.

[0189] Methods according to the above-described examples can be implemented using computer-executable instructions that are stored or otherwise available from computer-readable media. Such instructions can comprise, for example, instructions and data which cause or otherwise configure a general-purpose computer, special purposecomputer, or special purpose processing device to perform a certain function or group of functions. Portions of computer resources used can be accessible over a network. The executable computer instructions may be, for example, binaries, intermediate format instructions such as assembly language, firmware, or source code. Examples of computer- readable media that may be used to store instructions, information used, and / or information created during methods according to described examples include magnetic or optical disks, solid-state memory devices, flash memory, USB devices provided with non-volatile memory, networked storage devices, and so on.

[0190] For clarity of explanation, in some instances the present technology may be presented as including individual functional blocks representing devices, device components, steps or routines in a method embodied in software, or combinations of hardware and software.

[0191] Systems implementing methods according to this disclosures can comprise hardware, firmware and / or software, and can take any of a variety of form factors. Typical examples of such form factors include servers, laptops, smartphones, small form factor personal computers, personal digital assistants, and so on. The functionality described herein also can be embodied in peripherals or add-in cards. Such functionality can also be implemented on a circuit board among different chips or different processes executing in a single device, by way of further example. The instructions, media for conveying such instructions, computing resources for executing them, and other structures for supporting such computing resources are means for providing the functions described in these disclosures.

[0192] Systems and methods disclosed herein may relate to killing or eliminating pathogenic microorganisms that may be present on and / or in food products. The application also describes the killing of “bacteria” in and / or on food products. Such references to bacteria and pathogenic microorganisms relate to food pathogens, including, among others, the following: E. coli, Salmonella spp., Clostridium botulinum, Staphylococcus aureus, Campylobacter jejuni, Yersinia enter ocolitica and Yersinia pseudotuberculosis, Listeria monocytogenes, Vibrio cholerae 01, Vibrio cholerae non-01, Vibrio parahaemolyticus and other vibrios, Vibrio vulnificus, Clostridium perfringens, Bacillus cereus, Aeromonas hydr ophila and other spp., Plesiomonas shigelloides, Shigella spp., miscellaneous enterics, and Streptococcus.

[0193] The terms used in this specification generally have their ordinary meanings in the art, within the context of the disclosure, and in the specific context where each term is used. Alternative language and synonyms may be used for any one or more of the terms discussed herein, and no special significance should be placed upon whether or not a term is elaborated or discussed herein. In some cases, synonyms for certain terms are provided. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms discussed herein is illustrative only and is not intended to further limit the scope and meaning of the disclosure or of any example term. Likewise, the disclosure is not limited to various examples given in this specification.

[0194] Titles or subtitles may be used in the examples for convenience of a reader, which in no way should limit the scope of the disclosure.

[0195] The present disclosure may also reference quantities and numbers. Unless specifically stated, such quantities and numbers are not to be considered restrictive, but exemplary of the possible quantities or numbers associated with the present disclosure. Also in this regard, the present disclosure may use the term “plurality” to reference a quantity or number. In this regard, the term “plurality” is meant to be any number that is more than one, for example, two, three, four, five, etc. As used herein, the terms “about”, “approximately,” etc., in reference to a number, is used herein to include numbers that fall within a range of 10%, 5%, or 1% in either direction (greater than or less than) the number unless otherwise stated or otherwise evident from the context (except where such number would exceed 100% of a possible value).

[0196] Where electronic or software components are described as being “configured to” perform certain operations, such configuration can be accomplished, for example, by designing electronic circuits or other hardware to perform the operation, by programming programmable electronic circuits (e.g., microprocessors, or other suitable electronic circuits) to perform the operation, or any combination thereof.

[0197] The phrase “coupled to” refers to any component that is physically connected to another component either directly or indirectly, and / or any component that is in communication with another component (e.g., connected to the other component over a wired or wireless connection, and / or other suitable communication interface) either directly or indirectly.

[0198] While illustrative examples have been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.

Claims

CLAIMSThe embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1. A system for thermal processing work products, comprising: a thermal processing apparatus for heating a first type of work products within an enclosure, the thermal processing apparatus having a first thermal processing zone operating under selected thermal operating parameters to heat the first type of work products to a predetermined maximum characteristic surface temperature not influenced by conditions external to a boundary of the first type of work products (TMCS); and a programmed equilibration system, comprising: a second adiabatic equilibration zone defined within the enclosure of the thermal processing apparatus; and a controller for substantially maintaining a temperature of the second adiabatic equilibration zone to a predetermined constant reference temperature (TR) that is substantially the same as the TMCS to enable the first type of work products to equilibrate adiabatically.

2. The system of Claim 1, wherein TR of the second adiabatic equilibration zone enables the first type of work products to equilibrate adiabatically after a predetermined dwell time within the second adiabatic equilibration zone to achieve a minimum required core temperature of the first type of work products.

3. The system of Claim 1 , wherein the predetermined dwell time is determined by the controller as a function of a thickness of the first type of work products and a thermal conductivity of the first type of work products.

4. The system of Claim 1, wherein the temperature TMCS of the first type of work products is reached just before entering the second adiabatic equilibration zone.

5. The system of Claim 1, further comprising a core and surface temperature measurement assembly configured for continuously capturing both a characteristic surface temperature and a core temperature of a test work product of the first type of work products as a function of time for a given thermal process.

6. The system of Claim 5, wherein the core and characteristic surface temperature measurement assembly includes a plurality of miniature computer chips configured to measure temperature that can be implanted within the test work product to measure the temperature of the test work product at a location of the chip.

7. The system of Claim 5, wherein TMCS is the temperature of the test work product beneath a surface of the test work product.

8. The system of Claim 5, further comprising non-transitory computer- readable storage medium having instructions stored thereon that, in response to execution by one or more processors of a computing system, cause the computing system to perform actions comprising: receiving measurement data indicating a characteristic surface temperature and a core temperature of the test work product as a function of time for a first work product recipe of the first type of work products; determining TMCS of the first type of work products as a maximum measurement of the characteristic surface temperature of the test work product as a function of time for the first work product recipe; and controlling thermal conditions of the second adiabatic equilibration zone for the first type of work products such that the second adiabatic equilibration zone is substantially maintained at the TR that is substantially the same as the TMCS.

9. The system of Claim 8, further comprising predicting a final core temperature (TCF) of the first type of work products based on the measurement data indicating a characteristic surface temperature and a core temperature of the test work product as a function of time for the first work product recipe.

10. The system of Claim 1, wherein the thermal processing apparatus comprises: a thermal processing conveyor belt for supporting the first type of work products during thermal processing, the thermal processing conveyor belt moving along a spiral path in a first direction arranged as a first tiered spiral and moving along a spiral path in a second direction arranged as a second tiered spiral;a circulation system to induce gaseous thermal processing medium through the tiers of the first and second spiral conveyor belt spirals, through a heat exchanger, and then back to the tiers of the spiral conveyor belt spirals; and a mezzanine that divides the second tiered spiral into the first thermal processing zone and the second adiabatic equilibration zone.

11. The system of Claim 10, wherein the mezzanine is adjustable in vertical height to increase or decrease the dwell time of the first type of work products conveyed through the first thermal processing zone and the second adiabatic equilibration zone.

12. A method for thermal processing a food product, comprising: obtaining for a first type of work product a maximum characteristic surface temperature not influenced by conditions external to a boundary of the first type of work product (TMCS) having a first work product recipe; thermally processing the first type of work product in at least a first thermal processing zone of an enclosure of a first thermal processing apparatus under selected thermal operating parameters to heat the first type of work products to the TMCS; controlling, with a computing device, thermal conditions of a second adiabatic equilibration zone of the first thermal processing apparatus such that the second adiabatic equilibration zone is substantially maintained at a predetermined constant reference temperature (TR) that is substantially the same as the TMCS; and allowing the first type of work product to transit in the second adiabatic equilibration zone for a predetermined amount of dwell time to enable the first type of work product to equilibrate adiabatically such that the first type of work product has a minimum final core temperature (TM).

13. The method of Claim 12, further comprising calculating, with a computing device, the predetermined amount of dwell time within the second adiabatic equilibration zone based on a thickness of the first type of work product and a thermal conductivity of the first type of work product.

14. The method of Claim 12, further comprising determining, with a computing device, an estimated final core temperature of the first type of work product based on theTMCS and the amount of dwell time within the second adiabatic equilibration zone for the first type of work product.

15. The method of Claim 14, further comprising determining, with a computing device, a real time yield of the first type of work product based on at least one of the estimated final core temperatures of the first type of work product and a weight of the first type of work product.

16. The method of Claim 12, further comprising: continuously capturing, with a core and surface temperature measurement assembly, a characteristic surface temperature and core temperature of a test work product of the first type of work product as a function of time for the first work product recipe, and determining TMCS of the first type of work product as a maximum measurement of the characteristic surface temperature of the test work product as a function of time for the first work product recipe.

17. The method of Claim 16, further comprising controlling thermal conditions of the second adiabatic equilibration zone for the first type of work product such that the second adiabatic equilibration zone is substantially maintained at the TR that is substantially the same as the TMCS.

18. The method of Claim 16, further comprising using one or more machine learning algorithms to determine at least one of dwell time and temperature and condition of the second adiabatic equilibration zone for a second type of work products having a second product recipe similar to the first product recipe.

19. The method of Claim 16, further comprising calculating, with a computing device, the predetermined amount of dwell time within the second adiabatic equilibration zone based on a time needed to raise the core temperature of the first type of work product from the core temperature of a test work product to a prescribed food safe temperature having a minimum final core temperature (TM) for the first type of work product, a thickness of the first type of work product, and a thermal conductivity of the first type of work product.

20. The method of Claim 12, further comprising continuously adjusting, with a computing device, the TR to achieve a lowest potential temperature difference of a surface temperature and a core temperature of the first type of work product at an outlet of the second adiabatic equilibration zone.

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