Assemblies for measuring the strength of an electric current, devices for measuring the strength of an electric current, and method for producing such devices

Abstract

The invention relates to an assembly (1) for tapping at least one electrical signal from a resistor arrangement (4), comprising an at least partially flat carrier element (2) for holding electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22) and, at least on the top side (21) thereof, has conduit elements for conducting electrical signals, and at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has a top side (33) and a bottom side (34) and, on the bottom side (34) thereof, a first region (35) and a second region (36) physically separated from said first region, wherein the contact element (3, 31, 32) is connected in the first region (35) thereof in a materially bonded manner over the entire area to the top side (21) of the carrier element (2) and wherein the contact element (3, 31, 32) is configured so that the second region (36) of the contact element (3, 31, 32) is able to be connected to a resistor arrangement (4) by means of at least one welded connection (5) such that the contact element (3, 31, 32) is able to tap at least one electrical signal from a resistor arrangement (4) when the resistor arrangement (4) is connected. The invention furthermore relates to an alternative assembly (10), to devices (11, 12) for measuring the strength of an electric current and to methods for producing such devices.

Description

[0001] Description

[0002] Assemblies for measuring the intensity of an electric current, devices for measuring the intensity of an electric current and methods for producing such devices

[0003] The invention relates to an assembly for tapping at least one electrical signal from a resistor arrangement, an assembly for magnetic-field-based measurement of the strength of a current in an electrical conductor through which current flows, devices for measuring the strength of an electrical current, and methods for manufacturing such devices. In particular, the invention relates to the mounting of a circuit board on an electrical conductor or on a shunt resistor, as well as the electrical contacting of the shunt resistor for tapping an electrical signal.

[0004] Current measurements in electronic circuits are carried out using measuring resistors connected in series with the component to be monitored. The current is determined according to Ohm's law from the voltage drop across the shunt resistor. The resistance value is assumed to be known. Accurate and reliable current measurement is particularly important, for example, in the battery management system of an electric or hybrid vehicle. A resistor array used as a shunt resistor to measure currents comprises at least one resistance element and two terminals for connecting the resistor array to an electrical circuit. The resistance element and the terminals are made of different materials, usually metallic.The specific electrical resistance of the resistance element material can be at least a factor of 10 greater than the specific electrical resistance of the connection element material. On the other hand, the temperature coefficient of resistance of the connection element material is much greater, typically at least a factor of 50 greater than the temperature coefficient of resistance of the resistance element material. In particular, the temperature coefficient of resistance of the resistance element material can be less than 5 10'. 5 1 / K, while the resistance temperature coefficient of the material of the connecting elements is approximately 4-10 -31 / K. The connection elements of the resistor arrangement can in particular consist of copper, a preferably low-alloy copper alloy, of aluminum or a preferably low-alloy aluminum alloy, or can comprise at least one of these materials. The resistance element can in particular be made of a copper alloy that is commonly used as a resistance alloy. The connection elements and the resistance element of a resistor arrangement are in many cases each designed as plate- or strip-shaped elements and arranged next to one another in a row in a planar manner. The resistance element is mechanically and electrically conductively connected to a connection element on two opposite sides via a joining seam.

[0005] The voltage drop across a resistance element can be tapped, for example, via contact pins, wires, or similar elements, which are usually arranged on the connection elements on both sides of the resistance element. Such contact pins can be soldered, pressed, or welded onto the connection elements of the resistance arrangement. The voltage is recorded and further processed by measurement and evaluation electronics. Electronic components are provided for this purpose, which can be arranged on a circuit board. The circuit board can be located in the immediate vicinity of the resistance arrangement.

[0006] Alternatively, magnetic field-based sensors are also used for current measurement. Examples include Hall sensors and magneto-resistive sensors. These sensors use the magnetic field surrounding an electrical conductor through which current flows to generate a signal that is a measure of the strength of the electrical current. Although a magnetic field-based sensor does not require electrical contact between the sensor and the electrical conductor, the sensor must be positioned at a certain distance close to the electrical conductor. Furthermore, the sensor must be connected to measuring and evaluation electronics. Typically, the sensor and the measuring and evaluation electronics are mounted on a circuit board that is located in close proximity to the electrical conductor. Devices with magneto-resistive sensors are described, for example, in the documents EP 1 882 953 A1 and WO 2023 / 079 386 A1.

[0007] Both current measurement with shunt resistors and current measurement using magnetic field-based sensors require positioning a circuit board at a certain distance close to the measurement object and establishing at least a mechanical contact between the circuit board and the measurement object.

[0008] A resistor arrangement with a low-ohm current measuring resistor is known from DE 10 2009 031 408 A1. This resistor arrangement features connecting contacts for tapping the voltage. These contacts are formed by embossing and threading in the plate-shaped sections used to connect the resistor arrangement to the external circuit. The measuring leads for voltage measurement are connected to the connecting contacts using cable lugs and fastening screws.

[0009] Furthermore, the document US 10 163 553 B2 discloses a

[0010] A resistor assembly with two plate-shaped elements for connecting the resistor assembly to an external circuit and a strip-shaped resistor element is known. On either side of the resistor element, each of the two connecting elements has a hole into which a contact pin is inserted. The contact pins are separate components that must be specially manufactured and added to the resistor assembly.

[0011] These prior art devices require additional components to measure the voltage drop across the measuring resistor. This requires additional effort and expense. Furthermore, contact voltages can occur at the contact points of the individual components, which can distort the voltage signal.

[0012] Furthermore, the document DE 11 2021 002 813 T5 contains a

[0013] A shunt resistor for current sensing and, in particular, a voltage sensing connection for the shunt resistor, as well as a manufacturing process for such a shunt resistor, are known. The connection between the measuring resistor and the circuit board is established by a melting material, i.e., the connection is made by soldering. Soldering a circuit board onto the measuring resistor requires special soldering equipment and particular process control knowledge. The large thermal mass of the measuring resistor plays a key role here. Vapor-phase soldering systems are preferred today as an alternative to reflow convection soldering systems. However, the process in vapor-phase soldering systems is expensive and difficult to integrate into the other steps of the manufacturing process. Furthermore, substances whose use is controversial are used in vapor-phase soldering systems, which is why a ban on these substances is threatened.

[0014] In view of the disadvantages of currently established manufacturing methods, there is a need to modify devices for measuring the strength of an electric current so that they can be manufactured using alternative methods. The invention is therefore based on the object of specifying an assembly by means of which a resistor arrangement can be mechanically and electrically contacted cost-effectively. Furthermore, the invention is based on the object of specifying an assembly by means of which a magnetic field-based current sensor can be positioned cost-effectively near an electrical conductor. Furthermore, the invention is based on the object of specifying devices for measuring the strength of an electric current and methods for manufacturing such devices.

[0015] The invention is represented with respect to a first assembly by the features of claim 1, with respect to a second assembly by the features of claim 2, with respect to a first device by the features of claim 9, with respect to a second device by the features of claim 10, with respect to a first method by the features of claim 12 and with respect to a second method by the features of claim 13. The further dependent claims relate to advantageous embodiments and developments of the invention.

[0016] A first aspect of the invention relates to an assembly, i.e. an arrangement of components, for tapping at least one electrical signal from a resistor arrangement. The assembly comprises, as a first component, an at least partially planar carrier element for accommodating electronic components for measuring an electrical signal. The carrier element has a top side and a bottom side. Conductive elements, in particular conductor tracks, for conducting electrical signals are present at least on the top side of the carrier element. Furthermore, the assembly comprises, as a second component, at least one contact element made of electrically conductive material, preferably copper. The contact element has a top side and a bottom side. On its bottom side, the contact element has a first, preferably planar region and a second, preferably planar region spatially separated therefrom.The contact element is integrally and flatly connected to the top side of the carrier element in its first region. The connection is preferably a soldered connection. The contact element is configured so that its second region can be connected to a resistor assembly by means of at least one welded connection. Thus, when the assembly is connected to a resistor assembly, at least one electrical signal can be picked up from the resistor assembly through the contact element.

[0017] In order to tap an electrical signal, in particular a voltage signal, from a resistor arrangement, a carrier element, for example a circuit board, can be positioned on the resistor arrangement and electrically connected to the resistor arrangement. The carrier element serves to accommodate electronic components with which at least the upper side of the carrier element can be equipped. The upper side of the carrier element is the side of the carrier element which faces away from the resistor arrangement after the carrier element has been positioned on the resistor arrangement. It is also possible for both the upper side and the lower side of the carrier element to be equipped with electronic components. The electrical signal to be tapped can be fed to the electronic components by means of conduction elements which are located at least on the upper side of the carrier element.Optionally, the carrier element can also have conductive elements on its underside. Using these electronic components, the signal can be measured, digitized, and further processed. An AD converter, for example, could be such a component. The upper side of the carrier element, equipped with conductive elements, has a distance, i.e., a height offset, from the surface of the resistor array.

[0018] The invention is based on the consideration of how a mechanical and electrical connection can be established between a resistor arrangement and a carrier element that is to be positioned on the resistor arrangement by means of one or more surface-mountable components. One or more contact elements made of a highly electrically conductive material, for example copper or aluminum, are used as surface-mountable components. The side of a contact element that is to face the resistor arrangement is referred to as the underside. The contact elements are shaped such that they have two spaced-apart, i.e. spatially separate, regions on their underside. One of these two regions is connected to the top side of the carrier element, for example by a soldered connection.The other region can be connected to the surface of a resistor array by a weld, particularly by laser welding. Such a contact element is shaped so that the height offset between the resistor array and the top side of the support element can be overcome by the contact element. Thus, the conductive elements on the top side of the support element can be contacted.

[0019] A second aspect of the invention relates to an assembly for magnetic-field-based measurement of the strength of a current in an electrical conductor through which current flows. The assembly comprises an at least partially flat carrier element for accommodating electronic components for measuring an electrical signal. The carrier element has a top side and a bottom side. The top side of the carrier element is the side of the carrier element that faces away from the electrical conductor after the carrier element has been positioned on the electrical conductor. The assembly further comprises at least one sensor mounted on the carrier element. The sensor is configured and set up to generate an electrical signal, which is a measure of the strength of the electrical current, from the strength of the magnetic field that surrounds an electrical conductor when current flows. The sensor can, in particular, be a Hall sensor or a magnetoresistive current sensor.The assembly further comprises at least one contact element that is weldable and is preferably made of electrically conductive material. The contact element has a top side and a bottom side. The side of the contact element that is to face the electrical conductor is referred to as the bottom side. On its bottom side, the contact element has a first, preferably flat region and a spatially separated, second, preferably flat region. In its first region, the contact element is connected in a materially bonded and flat manner, preferably by a soldered connection, to the top side of the carrier element. The contact element is configured such that the second region of the contact element can be connected to an electrical conductor by means of at least one welded connection. Furthermore, the contact element is shaped such that the height offset between the electrical conductor and the top side of the carrier element can be overcome by the contact element.With regard to further features of the contact element, reference is made to the above explanations in connection with the assembly for tapping at least one electrical signal from a resistor arrangement.

[0020] The contacting technology implemented in both assemblies described above enables one-sided and thus cost-optimized assembly of all electrical and electronic components. Furthermore, the welding process, especially laser welding, is a highly reproducible process. The quality of the welded joint can be easily and reliably checked using optical inspection. This reduces rejects and better ensures product quality. The shape of the contact elements is subject to only a few specifications and can be selected relatively freely. This makes it possible to design the contact elements so that they are optimally adapted to the geometry and materials of the measurement object, i.e., the resistor arrangement or the electrical conductor.Negative influences on the measurement signal, such as the influence of the weld seam in a resistor arrangement, thermoelectric voltages and the temperature dependence of the specific resistance (TCR), can thus be minimized.

[0021] The particular advantage of the proposed contacting technology (SMT) is that, thanks to the welded connection between the contact element and the measurement object, the measurement object itself, i.e., the resistor array or the electrical conductor, does not require any soldering. Material changes in the measurement object or its coating, which can be caused by the high temperatures during the soldering process, are thus eliminated. Furthermore, energy consumption is reduced because the entire measurement object does not need to be heated. Replacing the technically complex soldering process with a simpler and more controllable welding process also expands the circle of suppliers who can reliably master such a process, which ultimately also contributes to cost reduction.

[0022] Within the scope of one embodiment, the contact element can essentially have a step shape or a staircase shape, wherein the first region of the contact element and the second region of the contact element lie in mutually non-coplanar planes due to the step shape or staircase shape. In the context of this invention, a step shape or staircase shape is understood to mean a shape which mediates a transition from a first plane to a second plane at a different level. The step shape or staircase shape of the contact element thus enables the upper side of the carrier element and the surface of the measurement object to be contacted simultaneously by the underside of the contact element, even though the upper side of the carrier element and the surface of the measurement object facing the carrier element are at a distance, i.e., a height offset. Particularly preferably, the non-coplanar planes can be parallel to one another.This takes into account the generally parallel arrangement of the measuring object and the support element.

[0023] In another embodiment, the contact element can be a stamped and bent component. Stamping and bending processes are particularly well suited for the production of suitable contact elements. However, it is also possible for the contact element to be manufactured using another non-cutting process or a machining process.

[0024] In another embodiment, the contact element can be designed to have spring properties. The spring action of the contact element improves the mechanical and electrical connection.

[0025] Within the scope of a further embodiment, the contact element can have a plurality of sections in its second region for contacting a measurement object, i.e., a resistor arrangement or an electrical conductor. Multiple contacts improve the mechanical connection. Furthermore, multiple electrical contacts allow multiple electrical signals to be tapped in parallel from a resistor arrangement. The redundancy of the measurement can thus be improved. Alternatively, an average value can be calculated from signals tapped in parallel, which represents the actual conditions, in particular the electrical potential profile, better than a single measured value. A contact element with a plurality of defined sections for contacting a resistor arrangement enables a precisely predictable positioning of multiple voltage taps.

[0026] Within the scope of a further embodiment, the contact element can have at least one recess for positioning a temperature sensor on the carrier element. To improve the accuracy of the current measurement, it is necessary to know the temperature of the resistor arrangement so that the temperature dependence of the specific resistance can be taken into account. Therefore, it is common practice to attach a temperature sensor to the carrier element, with which the temperature of the resistor arrangement can be detected. The contact element is made of highly conductive material and is in good thermal contact with the resistor arrangement. Therefore, the contact element has, to a very good approximation, the same temperature as the resistor arrangement, in particular the same temperature as the resistor element.Positioning a temperature sensor in a recess of the contact element results in a very good thermal connection between the temperature sensor and the resistor array. This improves the determination of the temperature of the resistor array. For further optimization, especially of the thermal response time, highly thermally conductive materials can be used between the contact element and the temperature sensor.

[0027] Within the scope of a further embodiment, the assembly can have first contact elements, which serve only for the mechanical connection of the assembly to a resistor arrangement, and second contact elements, which serve at least for the electrical contacting of this resistor arrangement. This structurally separates the functions of "mechanical connection" and "electrical contacting." This separation enables optimization of the respective contact elements for the respective function. In particular, the contact elements for the electrical contacting can be made significantly smaller than the contact elements for the mechanical connection. This makes it possible to position the electrical contacts very close to the resistor element of the resistor arrangement, even when space is limited. This reduces the influence of temperature on the resistance of the actual measuring section.

[0028] A further aspect of the invention relates to a device for measuring the strength of an electric current. The device comprises a subassembly as described above for tapping at least one electrical signal from a resistor arrangement, and a resistor arrangement mechanically and electrically connected to the subassembly. The subassembly itself comprises at least one contact element as described above. The resistor arrangement is mechanically and electrically connected to the second region of the contact element by means of at least one welded connection. Thus, at least one electrical signal can be tapped from a resistor arrangement.

[0029] A further aspect of the invention relates to a device for magnetic field-based measurement of the strength of an electric current. The device comprises an electrical conductor and an assembly at least mechanically connected to the electrical conductor, as described above. The assembly has an at least partially flat carrier element for receiving electronic components for measuring an electrical signal. The carrier element has a top side and a bottom side. The top side of the carrier element is the side of the carrier element facing away from the electrical conductor. Furthermore, the assembly has at least one sensor attached to the carrier element. The sensor is configured and set up to generate an electrical signal, which is a measure of the strength of the electric current, from the strength of the magnetic field surrounding the electrical conductor when current flows.The device further comprises at least one contact element, which is preferably made of electrically conductive material. The contact element has a top side and a bottom side. On its bottom side, the contact element has a first region and a spatially separated second region. In the first region of its bottom side, the contact element is integrally and flatly connected to the top side of the support element. The electrical conductor is connected to the second region of the bottom side of the contact element by means of at least one welded connection.

[0030] The particular advantage of the proposed devices is that, thanks to the welded connection between the contact element and the measuring element, i.e., the resistor array or the electrical conductor, the measuring element itself does not require any soldering. Material changes in the measuring element or its coating, which can be caused by the high temperatures during the soldering process, are thus eliminated. Furthermore, energy consumption is reduced because the entire measuring element does not have to be heated. Replacing the technically complex soldering process with a simpler and more controllable welding process also expands the circle of suppliers who can reliably master such a process, ultimately contributing to cost reduction.

[0031] Within the scope of one embodiment, the device can have at least one temperature sensor positioned near the contact element. In particular, the temperature sensor can be positioned in a recess of the contact element. As already explained above, positioning a temperature sensor near the contact element, in particular in a recess of the contact element, results in a very good thermal connection between the temperature sensor and the resistor arrangement. The determination of the temperature of the resistor arrangement is thus improved. With regard to further technical features and advantages of the devices according to the invention, explicit reference is hereby made to the explanations in connection with the assemblies according to the invention, to the methods according to the invention for producing such devices, as well as to the figures, the description of the figures, and the exemplary embodiments.

[0032] A further aspect of the invention relates to a method for producing a device for resistance-based measurement of the strength of an electric current. The method comprises the following steps: a) Providing an at least partially planar support element with a top side and a bottom side, wherein the support element has conducting elements for conducting electrical signals at least on its top side, b) Providing at least one contact element made of electrically conductive material, wherein the contact element has a top side and a bottom side and has on its bottom side a first, preferably planar region and a spatially separated, second, preferably planar region, c) Flatly and materially connecting the top side of the support element to the first region of the contact element, such that the contact element is in electrical contact with at least one conducting element on the top side of the support element,d) connecting a resistor arrangement to the second region of the contact element by means of at least one welded connection, wherein step d) takes place after step c).

[0033] A further aspect of the invention relates to a method for producing a device for magnetic-field-based measurement of the strength of an electric current. The method comprises the following steps: a) Providing an at least partially planar carrier element having a top side and a bottom side and having at least one sensor mounted on the carrier element and configured and set up to generate an electrical signal from the strength of the magnetic field surrounding an electrical conductor during current flow, said signal being a measure of the strength of the electric current; b) Providing at least one contact element, preferably made of electrically conductive material, wherein the contact element has a top side and a bottom side and has on its bottom side a first, preferably planar region and a second, preferably planar region spatially separated therefrom;c) Surface and materially bonding the upper side of the carrier element to the first region of the contact element, d) Connecting an electrical conductor to the second region of the contact element by means of at least one welded connection, wherein step d) takes place after step c).

[0034] The proposed methods can be used to manufacture the devices described above. Reference is made to the relevant explanations in connection with the devices.

[0035] The particular advantage of the proposed method is that the welded connection between the contact element and the measuring element, i.e., the resistor arrangement or the electrical conductor, is only made after the carrier element has been connected to the contact element. Even if the carrier element is connected to the contact element by soldering, the measuring element itself does not require any soldering.

[0036] With regard to further technical features and advantages of the methods according to the invention, reference is hereby explicitly made to the explanations in connection with the assemblies according to the invention, to the explanations in connection with the devices according to the invention as well as to the figures, the description of the figures and the exemplary embodiments.

[0037] Embodiments of the invention are explained in more detail with reference to the schematic drawings, in which:

[0038] Fig. 1 a first contact element

[0039] Fig. 2 a second contact element

[0040] Fig. 3 a perspective view of a first assembly

[0041] Fig. 4 in oblique view the underside of an assembly according to Fig. 3

[0042] Fig. 5 is a perspective view of a first device

[0043] Fig. 6 is a plan view of a device according to Fig. 5

[0044] Fig. 7 a perspective view of a second assembly

[0045] Fig. 8 is a perspective view of a second device

[0046] Fig. 9 shows a schematic sequence of a manufacturing method for a first device

[0047] Fig. 10 shows a schematic sequence of a manufacturing process for a second device

[0048] Corresponding parts are provided with the same reference numerals in all figures.

[0049] Fig. 1 shows a first contact element 3, 31. The contact element 3, 31 has a step or staircase shape. The view is selected such that the top side 33 of the contact element 3, 31 is visible, while the underside 34 of the contact element 3, 31 is not visible. The contact element 3, 31 has a first planar region 35 on its underside 34, in which it can be connected in a material-to-material manner, for example by a soldered connection, to the top side of a carrier element (not shown in Fig. 1). The contact element 3, 31 also has a recess 38. In the region of this recess 38, a temperature sensor can be positioned on the carrier element, which measures the temperature of the contact element 3, 31. The contact element 3, 31 also has a second planar region 36 on its underside 34, which is spatially separated from the first planar region 35.In the illustrated embodiment of the contact element 3, 31, the second region 36 lies in a plane that is parallel to the plane in which the first region 35 lies. However, the two planes are not coplanar, but offset from one another due to the step shape. The first region 35 and the second region 36 are thus at different levels. In the second region 36, the contact element 3, 31 can be connected to the surface of an electrical conductor (not shown in Fig. 1) or to the surface of a resistor arrangement (not shown in Fig. 1) by one or more welded joints. The level difference between the first region 35 and the second region 36 can bridge the distance between the top side of the carrier element and the surface of the resistor arrangement. In its second region 36, the contact element 3, 31 has four sections 37 that are separated from one another by incisions.Sections 37 are used to attach multiple welded joints next to each other. The contact element 3, 31 can be designed as a stamped and bent component. To manufacture it, a flat component is first stamped from a strip-shaped material. The step or stair shape is then formed through two bending processes.

[0050] Fig. 2 shows a second contact element 3, 32. The contact element 3, 32 has a step or staircase shape. In the case shown, the transition from the lower step to the upper step is not rectangular, but rather an inclined section. The view is selected such that the upper side 33 of the contact element 3, 32 is visible, while the underside 34 of the contact element 3, 32 is not visible. The contact element 3, 32 has a first flat region 35 on its underside 34, in which it can be connected in a material-to-material manner, for example by a soldered connection, to the upper side of a carrier element (not shown in Fig. 2). The contact element 3, 32 also has a recess 38. In the region of this recess 38, a temperature sensor can be positioned on the carrier element, which measures the temperature of the contact element 3, 32.The contact element 3, 32 further has a second planar region 36 on its underside 34, which is spatially separated from the first planar region 35. In the illustrated embodiment of the contact element 3, 32, the second region 36 lies in a plane that is parallel to the plane in which the first region 35 lies. However, the two planes are not coplanar, but offset from one another due to the step shape. The first region 35 and the second region 36 are therefore at different levels. In the second region 36, the contact element 3, 32 can be connected to the surface of a resistor arrangement (not shown in Fig. 2) or to one or more welded joints. The level difference between the first region 35 and the second region 36 can bridge the distance between the top side of the carrier element and the surface of the resistor arrangement.In its second region 36, the contact element 3, 32 has two sections 37 separated from each other by a notch. The sections 37 serve to attach several welded connections next to each other. The contact element 32 shown in Fig. 2 is narrower than the contact element 31 shown in Fig. 1. The contact element 31 shown in Fig. 2.

[0051] Contact element 32 can thus preferably be used for electrically contacting a resistor arrangement, while the contact element shown in Fig. 1 can preferably be used to ensure the mechanical connection between the carrier element and the resistor arrangement or an electrical conductor. The contact element 3, 32 can be designed as a stamped and bent component. To produce it, a flat component is first stamped from a strip-shaped or band-shaped material. The step or stair shape is then formed through two bending processes.

[0052] Fig. 3 shows a perspective view of a first assembly 1. The assembly 1 comprises a carrier element 2 in the form of a printed circuit board, two first contact elements 31 according to Fig. 1 and two second contact elements 32 according to Fig. 2. The upper side 21 of the carrier element 2 is equipped with an electronic component 6. For simplicity, this is shown as a cuboid. Furthermore, the carrier element 2 has conductor tracks on its upper side 21, which are not shown for reasons of clarity. The electronic component 6 is in electrical contact with the conductor tracks. The two first contact elements 31 are each attached opposite one another on the outer edge of the carrier element 2. They are each soldered in their first region 35 to the upper side 21 of the carrier element 2. For further details of these first contact elements 31, reference is made to the description of Fig. 1.The carrier element 2 has, in addition to the electronic component 6, a recess 23 in the form of an opening. The two second contact elements 32 are mounted such that they protrude into this recess 23. Preferably, the second contact elements 32 can even protrude through the recess 23. The second contact elements 32 are each soldered in their first region 35 to the upper side 21 of the carrier element 2 such that electrical contact is established with the conductor tracks. For further details of these second contact elements 32, reference is made to the description of Fig. 2.

[0053] Fig. 4 shows an oblique view of the underside 22 of the assembly 1 shown in Fig. 3. Due to the oblique view, the electronic component 6, with which the carrier element 2 is equipped on its upper side, can still be seen. On the outer edge of the carrier element 2, first contact elements 31 and in particular their respective second region 36 on the underside 34 of the contact element 31 can be seen. Due to the stepped shape of the contact elements 31, their respective second region 36 is located at least at the level of the underside 22 of the carrier element 2 and can thus contact the surface of a resistor arrangement (not shown in Fig. 4). Preferably, the second regions 36 can even have a projection beyond the underside 22 of the carrier element 2. The recess 23 already mentioned in connection with Fig. 3 is located approximately in the middle of the carrier element 2.Two second contact elements 32 and, in particular, their respective second region 36 can be seen in this recess 23. Due to the stepped shape of the contact elements 32, their respective second region 36 is located at least at the level of the underside 22 of the carrier element 2 and can thus contact the surface of a resistor arrangement (not shown in Fig. 4). Preferably, the second contact elements 32 can even protrude through the recess 23 with their respective second region 36.

[0054] Fig. 5 shows a perspective view of a first device 11 for measuring the strength of an electric current. The device comprises an assembly 1 as shown in Fig. 3 and Fig. 4 and a resistor arrangement 4. The resistor arrangement 4 consists of two connection elements 41 and a resistor element 42, which is arranged between the two connection elements 41 and connected to them via a joint seam (not shown in detail). The two connection elements 41 each have a bore 43, by means of which the resistor arrangement 4 can be connected to an external circuit (not shown). The assembly 1 is positioned on the resistor arrangement 4 such that the upper side 21 of the carrier element 2 faces away from the resistor arrangement 4.The assembly 1 is at least mechanically connected to the connection elements 41 of the resistor arrangement 4 via the two first contact elements 31, which are each arranged on the edge of the carrier element 2. For this purpose, the second region 36 of a contact element 31 is welded to one of the connection elements 41. Furthermore, the assembly 1 is electrically connected to the connection elements 41 of the resistor arrangement 4 via the two second contact elements 32. For this purpose, the second region 36 of a second contact element 32 is welded to one of the connection elements 41, with the connection element 41 being contacted in the immediate vicinity of the resistor element 42. This essentially makes it possible to tap off the voltage that drops across the resistor element 42 when current flows.The proximity of the voltage taps to the resistance element 42 minimizes the proportion of the connection elements 41, whose electrical resistance is highly dependent on temperature. This improves the TCR behavior of the entire measuring section.

[0055] Fig. 6 shows a plan view of a device according to Fig. 5. Fig. 6 has been supplemented compared to Fig. 5 in that in the case of both first contact elements 31 and both second contact elements 32 the welded connections 5 with the resistor arrangement 4 are indicated by circles.

[0056] Fig. 7 shows a perspective view of a second assembly 10. The assembly 10 comprises a carrier element 2 in the form of a printed circuit board and two contact elements 31 according to Fig. 1. The upper side 21 of the carrier element 2 is equipped with a sensor 8 for magnetic field-based measurement of the current intensity and with an electronic component 6. Furthermore, the carrier element 2 has conductor tracks on its upper side 21, which are not shown for reasons of clarity. The sensor 8 and the electronic component 6 are in electrical contact with the conductor tracks. The two contact elements 31 are attached opposite one another on the outer edge of the carrier element 2. They are each soldered in their first region 35 to the upper side 21 of the carrier element 2. For further details of these contact elements 31, reference is made to the description of Fig. 1.

[0057] Fig. 8 shows a perspective view of a second device 12 for measuring the strength of an electric current using a magnetic field-based measuring method. The device comprises an assembly 10 as shown in Fig. 7 and an electrical conductor 7. The electrical conductor 7 consists of a metallic material in the form of a strip. The electrical conductor 7 has a bore 73 at each of its two ends, by means of which bore the electrical conductor 7 can be connected to an external circuit (not shown). The assembly 10 is positioned on the conductor 7 such that the upper side 21 of the carrier element 2 faces away from the electrical conductor 7. The assembly 10 is mechanically connected to the electrical conductor 7 via the two contact elements 31, which are each arranged on the edge of the carrier element 2. For this purpose, the second region 36 of a contact element 31 is welded to the electrical conductor 7.The sensor 8 mounted on the carrier element 2 is designed and configured to generate an electrical signal from the strength of the magnetic field surrounding the electrical conductor 7 when current flows. This electrical signal is a measure of the strength of the electrical current flowing in the conductor 7. The sensor 8 can, in particular, be a Hall sensor or a magnetoresistive current sensor.

[0058] Fig. 9 shows a schematic sequence of a method for producing a device 11 according to Figs. 5 and 6. In step a), a carrier element 2 in the form of a printed circuit board is provided, which can optionally be equipped with electronic components 6 for measuring an electrical signal. In step b), contact elements 31, 32 are provided. In step c), these are connected to the printed circuit board 2 by a soldering process such that the contact elements 31, 32 are connected on their underside 34 in their respective first region 35 to the top side 21 of the printed circuit board. In this way, an assembly 1 is formed. The soldering of the electronic components 6 to the printed circuit board 2 can take place either simultaneously in step c) or before or after step c). The assembly 1 is positioned on a resistor arrangement 4. The production of such a resistor arrangement 4 is generally known.In process step d), the assembly 1 is connected to the resistor arrangement 4 via the contact elements 31, 32 by one or more welded joints. This forms a device 11 for measuring the strength of an electric current.

[0059] Fig. 10 shows a schematic sequence of a method for producing a device 12 according to Figs. 7 and 8. In step a), a carrier element 2 in the form of a printed circuit board is provided, which is equipped with a sensor 8 and optionally with electronic components 6 for measuring an electrical signal. In step b), contact elements 31 are provided. In step c), these are connected to the printed circuit board 2 by a soldering process such that the contact elements 31 are connected on their underside 34 in their respective first region 35 to the top side 21 of the printed circuit board. In this way, an assembly 10 is formed. The soldering of the electronic components 6 to the printed circuit board 2 can take place either simultaneously in step c) or before or after step c). The assembly 10 is positioned on an electrical conductor 7.In process step d), the assembly 10 is connected to the electrical conductor 7 via the contact elements 31 by one or more welded joints. This forms a device 12 for measuring the strength of an electrical current.

[0060] List of reference symbols

[0061] module

[0062] module

[0063] device

[0064] device

[0065] Support element

[0066] Top of the support element

[0067] Underside of the support element

[0068] recess

[0069] Contact element first contact element second contact element

[0070] Top of a contact element

[0071] Underside of a contact element first area second area

[0072] Section

[0073] recess

[0074] Resistor arrangement

[0075] connecting element

[0076] resistance element

[0077] drilling

[0078] Welded joint

[0079] Component electrical conductor

[0080] drilling

[0081] sensor

Claims

Patent claims 1. An assembly (1) for tapping at least one electrical signal from a resistor arrangement (4), comprising an at least partially planar carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22) and at least on its top side (21) has conducting elements for conducting electrical signals, and at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has a top side (33) and a bottom side (34) and on its bottom side (34) has a first region (35) and a spatially separated second region (36), wherein the contact element (3, 31, 32) is connected in its first region (35) in a materially bonded and planar manner to the top side (21) of the carrier element (2), and wherein the contact element (3, 31, 32) is configured tothat the second region (36) of the contact element (3, 31, 32) can be connected to a resistor arrangement (4) by means of at least one welded connection (5), so that when connected to a resistor arrangement (4), at least one electrical signal can be tapped from the resistor arrangement (4) through the contact element (3, 32).

2. Assembly (10) for magnetic field-based measurement of the strength of a current in an electrical conductor (7) through which current flows, comprising an at least partially planar carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22), at least one sensor (8) which is mounted on the carrier element (2) and which is configured and set up to generate an electrical signal from the strength of the magnetic field surrounding an electrical conductor (7) when current flows, said electrical signal being a measure of the strength of the electrical current, and at least one contact element (3, 31), preferably made of electrically conductive material, wherein the contact element (3, 31) has an upper side (33) and a lower side (34) and has on its lower side (34) a first region (35) and a second region (36) spatially separated therefrom, wherein the contact element (3, 31) is connected in its first region (35) in a materially bonded and planar manner to the upper side (21) of the carrier element (2), and wherein the contact element (3, 31) is configured such that the second region (36) of the contact element (3, 31) can be connected to an electrical conductor (7) by means of at least one welded connection (5).

3. Assembly (1, 10) according to claim 1 or 2, characterized in that the contact element (3, 31, 32) has substantially a step shape or a staircase shape, so that the first region (35) of the contact element (3, 31, 32) and the second region (36) of the contact element (3, 31, 32) lie in mutually non-coplanar planes.

4. Assembly (1, 10) according to one of the preceding claims, characterized in that the contact element (3, 31, 32) is a stamped and bent component.

5. Assembly (1, 10) according to one or more of the preceding claims, characterized in that the contact element (3, 31, 32) has spring properties.

6. Assembly (1, 10) according to one or more of the preceding Claims, characterized in that the contact element (3, 31, 32) has in its second region (36) a plurality of sections (37) for contacting a resistor arrangement (4) or an electrical conductor (7).

7. Assembly (1, 10) according to one or more of the preceding claims, characterized in that the contact element (3, 31, 32) has at least one recess (38) for positioning a temperature sensor on the carrier element (2).

8. Assembly (1) according to claim 1 or according to one or more of claims 3 to 7, characterized in that the assembly (1) has first contact elements (31) which serve for the mechanical connection of the assembly (1) to a resistor arrangement (4), and second contact elements (32) which serve for the electrical contacting of this resistor arrangement (4).

9. Device (11) for measuring the strength of an electric current, comprising: an assembly (1) according to one or more of the preceding claims, a resistance arrangement (4) mechanically and electrically connected to the assembly (1), characterized in that the resistance arrangement (4) is mechanically and electrically connected to the second region (36) of the contact element (3, 31, 32) by means of at least one welded connection (5), so that at least one electrical signal can be tapped from the resistance arrangement (4).

10. Device (12) for magnetic field-based measurement of the strength of a electric current, comprising an electrical conductor (7) and an assembly (10) at least mechanically connected to the electrical conductor (7) according to one of claims 2 to 7, with an at least partially planar carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22), with at least one sensor (8) which is mounted on the carrier element (2) and which is configured and set up to generate an electrical signal from the strength of the magnetic field surrounding the electrical conductor (7) when current flows, which electrical signal is a measure of the strength of the electric current, and with at least one contact element (3, 31), preferably made of electrically conductive material, wherein the contact element (3, 31) has a top side (33) and a bottom side (34) and on its bottom side (34) a first region (35) and a spatially separate,second region (36), wherein the contact element (3, 31) is connected in its first region (35) in a materially bonded and planar manner to the upper side (21) of the carrier element (2), characterized in that the electrical conductor (7) is connected to the second region (36) of the contact element (3, 31) by means of at least one welded connection (5).

11. Device (11, 12) according to claim 9 or 10, characterized in that it comprises at least one temperature sensor positioned near the contact element (3, 31, 32).

12. A method for producing a device (11) for measuring the strength of an electric current, the method comprising the following steps: a) providing an at least partially planar carrier element (2) having an upper side (21) and a lower side (22), the carrier element (2) having conducting elements for conducting electrical signals at least on its upper side (21), b) providing at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has an upper side (33) and a lower side (34) and has on its lower side (34) a first region (35) and a spatially separated second region (36), c) surface-to-surface and material-to-material connection of the upper side (21) of the carrier element (2) to the first region (35) of the contact element (3, 31, 32) such that the contact element (3, 31, 32) is in electrical contact with at least one conducting element on the upper side (21) of the carrier element (2), d) connecting a resistor arrangement (4) to the second region (36) of the contact element (3, 31, 32) by means of at least one welded connection (5), wherein step d) takes place chronologically after step c).

13. A method for producing a device (12) for magnetic field-based measurement of the strength of an electric current, the method comprising the following steps: a) providing an at least partially planar carrier element (2) having a top side (21) and a bottom side (22) and having at least one sensor (8) mounted on the carrier element (2) and configured and set up to generate an electrical signal from the strength of the magnetic field surrounding an electrical conductor (7) when current flows, said signal being a measure of the strength of the electric current, b) providing at least one contact element (3, 31), preferably made of electrically conductive material, the contact element (3, 31) having a top side (33) and a bottom side (34) and having on its bottom side (34) a first region (35) and a second region (36) spatially separated therefrom, c) surface and materially bonding the upper side (21) of the carrier element (2) to the first region (35) of the contact element (3, 31), d) connecting an electrical conductor (7) to the second Area (36) of the contact element (3, 31) by means of at least one welded connection (5), wherein step d) takes place after step c).

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