INTEGRATED CIRCUIT AND METHOD FOR DIAGNOSING SUCH AN INTEGRATED CIRCUIT
The integration of electronic control circuits with emissive components in integrated circuits enables efficient and economical fault diagnosis by using light radiation to identify faulty modules, addressing the complexities of existing diagnostic methods.
Patent Information
- Application Number
- FR2020007423
- Authority / Receiving Office
- FR · FR
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2020-07-15
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2040-07-15
AI Technical Summary
Existing methods for diagnosing faulty electronic modules in integrated circuits are complex, time-consuming, and costly, particularly when upstream modules do not emit light radiation or emit incorrect signals, making it difficult to identify failures accurately.
Incorporating electronic control circuits with emissive components that emit light radiation based on the output voltage of connected modules, allowing easy identification of faulty modules by observing light radiation from the circuit's external face, reducing the need for invasive probing and image comparisons.
Facilitates quick and cost-effective diagnosis of faulty modules by simplifying the identification process, reducing energy consumption, and minimizing space occupation within the integrated circuit.
Smart Images
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Abstract
Description
Title of the invention: INTEGRATED CIRCUIT AND METHOD FOR DIAGNOSING SUCH AN INTEGRATED CIRCUIT
[0001] Embodiments and implementations relate to integrated circuits and methods for diagnosing such integrated circuits.
[0002] An integrated circuit generally comprises several electronic modules, each electronic module being configured to perform a given electronic function.
[0003] These electronic modules may suffer failures which may result in particular from the manufacture of the integrated circuit or from their wear over time.
[0004] In order to correct these failures, it is first essential to identify each faulty electronic module of the integrated circuit.
[0005] In this respect, emission microscopy is a known method for identifying faulty electronic modules of an integrated circuit by analyzing the light radiation emitted by the electronic modules of this integrated circuit.
[0006] Indeed, the electronic modules comprise electronic components that can emit light radiation, in particular during their operation, when they are crossed by an electric current. The light radiation can be visible or infrared. In particular, these light radiations can have a wavelength between 400nm (visible) and 1400nm (near infrared).
[0007] The electronic components capable of emitting such light radiation can be MOS transistors or diodes for example.
[0008] These light rays produced by the electronic components of the different electronic modules propagate to an external face of the integrated circuit which can be observed from outside the integrated circuit.
[0009] It is thus possible to acquire an image of the light radiation produced by the electronic components of the electronic modules in order to analyze the integrated circuit.
[0010] To identify faulty electronic modules, it is possible to compare images of the light radiation produced by the faulty integrated circuit analyzed with images of the light radiation produced by a functional integrated circuit identical to the integrated circuit analyzed.
[0011] Images of the failed integrated circuit may differ from images of the functioning integrated circuit because the failed electronic modules of the failed integrated circuit may not produce light radiation.
[0012] Analysis of the differences between the images of the faulty integrated circuit and those of the functional integrated circuit can then make it possible to identify the faulty electronic modules.
[0013] However, this method has certain limitations. Indeed, it is possible that a failure of an electronic module means that other electronic modules, although functional taken in isolation, cannot operate because the electronic module is placed upstream of these functional electronic modules. These functional electronic modules may then not produce light radiation. It is then difficult to identify the faulty electronic module solely from images of light radiation.
[0014] It is then possible to probe the faulty integrated circuit so as to analyze each potentially faulty electronic module to identify the faulty electronic module.
[0015] In order to probe the integrated circuit, it may be necessary to drill through the integrated circuit to reach some potentially faulty electronic modules. Probing the integrated circuit to detect the faulty electronic module is therefore complex and can be time-consuming.
[0016] Furthermore, faulty electronic modules may also sometimes emit light radiation while the signals generated by these electronic modules are incorrect.
[0017] Another solution for identifying a faulty electronic module is to include a test system in the integrated circuit, such as a BIST (built-in-self-test) system. Such a test system is configured to diagnose the integrated circuit itself.
[0018] Such a test system has the disadvantage of being expensive in terms of space occupation in the integrated circuit and requires the use of a dedicated output to transmit diagnostic information outside the integrated circuit.
[0019] It is therefore appropriate to propose a solution making it possible to quickly and inexpensively identify faulty electronic modules of an integrated circuit.
[0020] According to one aspect, there is provided an integrated circuit comprising: - electronic modules, each electronic module being configured to generate an output voltage, called operating voltage, which is specific to it during normal operation of this electronic module, - at least one electronic control circuit comprising an emissive electronic component, each electronic control circuit being arranged at the output of an electronic module, said at least one electronic control circuit and its emissive electronic component being configured so as to allow the emissive electronic component to emit light radiation as a function of the voltage value at the output of this electronic module in relation to the value of said operating voltage, the integrated circuit being configured so that the light radiation which can be emitted by said emissive electronic component can diffuse to an external face of the integrated circuit.
[0021] The light radiation that can be produced by the emissive electronic component can therefore be observed from outside the integrated circuit on said external face of the integrated circuit.
[0022] Said at least one electronic control circuit therefore makes it possible to signal, by means of the light radiation that can be produced by said emissive electronic component, whether an electronic module placed upstream of this electronic control circuit in the integrated circuit is faulty or not. Indeed, the light radiation is produced as a function of the value of the output voltage of the electronic module to which the electronic control circuit is connected relative to an output voltage expected during normal operation of this electronic module (i.e. said operating voltage).
[0023] The use of said at least one electronic control circuit therefore makes it possible to facilitate a diagnosis of such an integrated circuit following a failure of an electronic module. Indeed, the identification of faulty electronic modules is facilitated by said at least one electronic control circuit.
[0024] In particular, to diagnose such an integrated circuit following a failure of an electronic module, it is possible to identify the faulty electronic module by analyzing the light radiation that can be produced by said emissive electronic component.
[0025] The analysis of the light radiation that can be produced by said emissive electronic component can be carried out from an acquisition of at least one image of the light radiation produced by the integrated circuit from said external face of the integrated circuit.
[0026] Now, it is possible to easily know the location of said at least one electronic control circuit in the integrated circuit by studying its architecture. Thus, it is then easy to study an emission state of the emissive electronic component of said at least one electronic control circuit from said at least one acquired image of the light radiation produced by the integrated circuit at the locations of said at least one electronic control circuit.
[0027] The analysis of the emission state of the emissive electronic component of said at least one electronic control circuit makes it possible to know whether an electronic module placed upstream of this electronic control circuit is faulty or not.
[0028] This analysis therefore simplifies the identification of faulty electronic modules by making it possible to check the operation of the electronic modules placed upstream of this point at at least one point of the integrated circuit.
[0029] Furthermore, the use of said at least one electronic control circuit makes it possible to dispense with a comparison between images of the light radiation from the faulty integrated circuit and images of the light radiation from an identical but functional integrated circuit.
[0030] Furthermore, said at least one electronic control circuit has the advantage of occupying a restricted space of the integrated circuit.
[0031] Furthermore, said at least one electronic control circuit also has the advantage of not impacting the operation of the integrated circuit.
[0032] In an advantageous embodiment, said at least one electronic control circuit and its emissive electronic component are configured so as to allow the emissive electronic component to emit light radiation when the value of the output voltage of this electronic module reaches the value of said operating voltage. The emissive electronic component of an electronic control circuit then emits light radiation only when the electronic module to which this electronic control circuit is connected is functioning correctly.
[0033] As a variant, said at least one electronic control circuit and its emissive electronic component are configured so as to allow the emissive electronic component to emit light radiation when the value of the output voltage of this electronic module is lower than the value of said operating voltage.
[0034] In the latter case, the emissive electronic component of an electronic control circuit then emits light radiation only when the electronic module to which this electronic control circuit is connected is not functioning correctly.
[0035] The energy consumption of the electronic control circuit is thus reduced. Indeed, the emissive electronic component of said at least one electronic control circuit does not consume energy when each electronic module placed upstream of this electronic control circuit in the integrated circuit is functioning correctly.
[0036] In an advantageous embodiment, no metal line (or track) capable of obstructing the light radiation of the emissive electronic component is arranged between the emissive electronic component and said outer face of the integrated circuit.
[0037] The light radiation that can be produced by the emissive electronic component of said at least one electronic control circuit can then be easily observed from said outer face of the integrated circuit. Said outer face of the integrated circuit can be a front face of the integrated circuit or a back face of the integrated circuit.
[0038] In an advantageous embodiment, the light radiation is visible or infrared. In particular, this light radiation may have a wavelength between 400nm (visible) and 1400nm (near infrared).
[0039] In an advantageous embodiment, the emissive electronic component is a diode, for example an NWell diode.
[0040] In particular, the diode produces light radiation when it is on.
[0041] Preferably, the electronic circuit then comprises a resistor arranged in series relative to the diode and connected to a ground. This resistor is configured to define the current flowing through the diode.
[0042] Alternatively, the emissive electronic component may be a transistor, in particular a MOS transistor.
[0043] In particular, the transistor produces light radiation when it is on. The transistor can thus be controlled by the output voltage of the electronic module to which the electronic control circuit comprising this transistor is connected.
[0044] In an advantageous embodiment, the integrated circuit comprises means for switching off said at least one electronic control circuit.
[0045] Such power-down means make it possible to reduce the power consumption of the integrated circuit.
[0046] According to another aspect, a method for diagnosing an integrated circuit as described above is proposed, in which the integrated circuit is powered up and then at least one faulty electronic module is identified using the emissive electronic component of said at least one electronic control circuit.
[0047] Such a diagnostic method is simple and inexpensive to implement.
[0048] Preferably, at least one image of said face is acquired. external surface of the integrated circuit, the acquisition being adapted to capture the light radiation produced by the integrated circuit on said external surface of the integrated circuit, the identification of at least one faulty electronic module being carried out from said at least one image acquired by analyzing an emission state of the emissive electronic component of said at least one electronic control circuit.
[0049] Other advantages and characteristics of the invention will appear on examining the detailed description of modes of implementation and embodiment, which are in no way limiting, and the appended drawings in which:
[0050] [Fig.l]
[0051] [Fig.2]
[0052] [Fig.3]
[0053] [Fig.4] schematically illustrate embodiments and implementations of the invention.
[0054] [Fig.l] illustrates an integrated circuit CI according to one embodiment of the invention.
[0055] The integrated circuit CI comes in the form of a wafer (better known by the English term "die"). The integrated circuit CI thus has a front face and a rear face, not shown.
[0056] The integrated circuit CI comprises electronic modules MEi, ME2, ME3, ME4. Each electronic module MEb ME2, ME3, ME4 is configured to perform a given electronic function of the integrated circuit.
[0057] Each electronic module can be analog or digital. For example, each electronic module MEb ME2, ME3, ME4 can be chosen from an amplifier, a potential regulating device, an oscillator and an analog-digital converter.
[0058] Each electronic module MEb ME2, ME3, ME4 is configured to generate at the output of this electronic module a voltage, called operating voltage, which is specific to it when this electronic module is functioning correctly.
[0059] Nevertheless, it is possible that electronic modules MEb ME2, ME3, ME4 of the integrated circuit may experience failures. These failures may in particular result from the manufacture of the integrated circuit CI or from their wear over time. Thus, as soon as an electronic module MEb ME2, ME3, ME4 is faulty, this electronic module can no longer produce said operating voltage. The output voltage of this electronic module MEb ME2, ME3, ME4 is then zero.
[0060] The integrated circuit CI also comprises at least one electronic control circuit CG, CC2, CC3.
[0061] Each electronic control circuit CCi, CC2, CC3 is arranged at the output of an electronic module MEB ME2, ME4 different from the integrated circuit. In particular, the electronic control circuit CCi is connected to the output of the electronic module MEh the electronic control circuit CC2 is connected to the output of the electronic module ME2, the electronic control circuit CC3 is connected to the output of the electronic module ME4.
[0062] Each electronic control circuit CCi, CC2, CC3 makes it possible to check the correct operation of the electronic module to which it is connected.
[0063] Each electronic control circuit CC comprises an emissive electronic component EEC, as shown in [Fig.2]. This emissive electronic component EEC is connected to the output of the electronic module ME to which the electronic control circuit CC comprising this emissive electronic component EEC is connected.
[0064] Each CC control electronic circuit and its EEC emissive electronic component are configured so that the EEC emissive electronic component can produce light radiation depending on the value of the output voltage of the electronic module ME to which this electronic component is connected in relation to the value of the operating voltage of this electronic module ME.
[0065] The EEC emissive electronic component of each CC control electronic circuit can thus have two possible emission states. In a first emission state, this EEC emissive electronic component emits light radiation. In the other emission state, the EEC emissive electronic component does not emit any light radiation.
[0066] More particularly, in one embodiment, each electronic control circuit CC and its emissive electronic component EEC are configured so as to allow the emissive electronic component EEC to emit light radiation when the output voltage of this electronic module ME reaches said operating voltage of this electronic module ME. The emissive electronic component EEC of the electronic control circuit CC then emits light radiation only when the electronic module ME to which this electronic control circuit CC is connected is operating correctly.
[0067] As a variant, said at least one electronic control circuit CC and its emissive electronic component EEC are configured so as to allow the emissive electronic component EEC to emit light radiation when the output voltage of this electronic module ME is lower than said operating voltage.
[0068] In this case, the emissive electronic component EEC of the electronic control circuit CC then emits light radiation only when the electronic module ME to which this electronic control circuit CC is connected is not functioning correctly.
[0069] The energy consumption of the electronic control circuit is thus reduced. Indeed, the emissive electronic component of said at least one electronic control circuit does not consume energy when each electronic module placed upstream of this electronic control circuit in the integrated circuit is functioning correctly.
[0070] The light radiation that can be emitted by the EEC emissive electronic component can be visible or infrared. In particular, this light radiation can have a wavelength between 400nm (visible) and 1400nm (near infrared).
[0071] As illustrated in [Fig.2], the EEC emissive electronic component may be a diode, for example an NWell diode.
[0072] The electronic control circuit CC then comprises a resistor RES arranged in series with the diode EEC and connected to a ground GND. This resistor is configured to define the current flowing through the diode EEC.
[0073] In particular, the diode produces light radiation when it is on.
[0074] Furthermore, the integrated circuit CI comprises metal lines (or metal tracks), not shown, used to connect different electronic components of the integrated circuit CI.
[0075] Nevertheless, preferably, no metal line capable of obstructing the light radiation of the EEC emissive electronic component is arranged in the integrated circuit CI between the EEC emissive electronic component and an external face of the integrated circuit, in particular the front face or the rear face of the integrated circuit.
[0076] The light radiation that can be produced by the EEC emissive electronic component can then be easily observed from this external face of the integrated circuit CI.
[0077] Furthermore, preferably, the integrated circuit CI comprises MHT power-off means for each electronic control circuit. The MHT power-off means are configured to power-off the electronic circuit to which they are connected.
[0078] In particular, as shown in [Fig.2], the MHT power-off means may comprise a logic gate ANDG making it possible to perform an AND logic function. This logic gate ANDG receives as input the signal VME at the output of the electronic module ME to which the electronic control circuit CC is connected as well as a power-off signal IDDQ inverted by an inverting gate INV. The logic gate AND has an output connected to the electronic control circuit CC. Thus, when the power-off signal is in a high state to power off the electronic control circuit CC, the logic gate AND generates a signal in the low state regardless of the signal at the output of the electronic module ME. The voltage at the input of the electronic control circuit CC is therefore zero.
[0079] Such MHT power-off means therefore make it possible to reduce the energy consumption of the integrated circuit by powering down the electronic CC control circuit to which they are connected.
[0080] Each electronic control circuit CC makes it possible to signal, thanks to the light radiation which can be produced by its emissive electronic component EEC, whether an electronic module ME placed upstream of this electronic control circuit CC in the integrated circuit CI is faulty or not.
[0081] In fact, the light radiation is produced as a function of the value of the output voltage of the electronic module to which the electronic control circuit is connected relative to an output voltage value expected during normal operation of this electronic module (i.e. said operating voltage).
[0082] The use of said at least one electronic control circuit CC makes it possible to facilitate a diagnosis of such an integrated circuit CI following a failure of a module. electronic ME. Indeed, the identification of faulty electronic modules is facilitated by said at least one electronic control circuit.
[0083] In particular, to diagnose such an integrated circuit CI following a failure of an electronic module ME, it is possible to identify the faulty electronic module ME by analyzing the light radiation that can be produced by said emissive electronic component EEC of each electronic control circuit CC.
[0084] In particular, [Fig.3] illustrates a diagnostic device DD making it possible to diagnose an integrated circuit CI such as that described previously comprising at least one faulty electronic module.
[0085] The diagnostic device DD comprises an input configured to receive a simulation file comprising in particular a sequence of instructions to be carried out to test the device as well as the states of the signals of the integrated circuit expected in response to these instructions.
[0086] The diagnostic device DD comprises a test unit UT configured to be able to control the integrated circuit CI from the instructions of a simulation file received by the input IN and to acquire the state of the signals of the integrated circuit in response to the instructions.
[0087] The test unit UT is also configured to receive the states of the signals of the integrated circuit acquired by the test unit and the states of the expected signals indicated by the simulation file. The analysis unit UT is also configured to compare the states of the acquired signals with the states of the expected signals indicated by the simulation file. The analysis unit is also configured to report the states of the acquired signals which differ from those expected from the results of the comparisons.
[0088] Furthermore, the diagnostic device DD comprises ACM image acquisition means configured to capture the light radiation produced by the integrated circuit CI visible from an external face of the integrated circuit CI. The ACM image acquisition means may be a camera configured to capture light radiation having a wavelength between 400nm (visible) and 1400nm (near infrared).
[0089] Preferably, the image acquisition means ACM are arranged so as to be able to acquire an image of the light radiation visible from the rear face of the integrated circuit CL
[0090] [Fig.4] represents a diagnostic method that can be implemented by the diagnostic device described above.
[0091] In order to carry out this diagnostic method, information is recovered on the locations of the emissive electronic components in the integrated circuit so as to facilitate the identification of these emissive electronic components.
[0092] Furthermore, information is recovered on an expected emission state of the emissive electronic component of each electronic control circuit of the integrated circuit CI when the electronic module placed upstream of this electronic control circuit is functional or faulty.
[0093] A simulation file as described previously received at the IN input of the diagnostic device DD is also used.
[0094] The method firstly comprises a step 40 of powering up the integrated circuit CI. This powering up step 40 makes it possible to initiate a start-up phase of the integrated circuit CI. This powering up can be controlled by the test unit UT from the simulation file.
[0095] During this start-up phase, the faulty electronic modules do not deliver a correct output voltage, i.e. their operating voltage.
[0096] Then, during a step 41, the test unit UT controls the integrated circuit CI according to the instructions of the simulation file.
[0097] The method further comprises an acquisition step 42 in which the image acquisition means ACM carry out an acquisition of an image of the light radiation of the faulty integrated circuit CI while the test unit controls the integrated circuit according to the instructions of the simulation file.
[0098] Preferably, several images of the light radiation are acquired at different times when the test unit UT controls the integrated circuit so as to obtain a sequence of emission states of the emissive components.
[0099] The method then comprises an analysis step 42 in which the acquired images are analyzed so as to identify the emission state of the emissive electronic component of each electronic control circuit.
[0100] The analysis of the emission state of the emissive electronic component of each electronic control circuit makes it possible to know whether the electronic module placed upstream of this electronic control circuit is functional or whether one of the electronic modules placed upstream of this emissive electronic component is faulty.
[0101] Thus, once the emission states of the emissive electronic components have been identified, the method comprises a step 43 of identifying the faulty electronic modules.
[0102] In particular, the identified emission states of the emissive electronic components are compared with the expected emission states of the emissive electronic components.
[0103] This comparison makes it possible to know whether the identified emission states of the emissive electronic components are different from the expected emission states of the emissive electronic components.
[0104] The electronic modules are then identified from the results of these comparisons. In particular, if the identified emission state of an emissive electronic component is different from the expected emission state for this emissive electronic component, then an electronic module placed upstream of this emissive electronic component is faulty.
[0105] Steps 42 and 43 of analyzing and identifying faulty modules can be carried out by a person or automatically by a processing unit.
[0106] Furthermore, in order to simplify the identification of faulty modules, the test unit of the diagnostic device can be used to identify the electronic module from which signals may be faulty. This makes it possible to reduce the number of electronic modules to be analyzed from said at least one acquired image to identify the faulty electronic module(s).
[0107] Such a diagnostic method therefore simplifies the identification of faulty electronic modules by making it possible to check the operation of the electronic modules placed upstream of this point at least at one point of the integrated circuit.
[0108] Furthermore, the use of said at least one electronic control circuit makes it possible to dispense with a comparison between images of the light radiation of the faulty integrated circuit and images of the light radiation of an identical but functional integrated circuit, as is carried out in known diagnostic methods. Indeed, it is sufficient to know the emission states of the emissive components of a functional integrated circuit following the instructions of the simulation file to identify the faulty modules of a faulty integrated circuit.
[0109] Furthermore, said at least one electronic control circuit has the advantage of occupying a restricted space of the integrated circuit.
[0110] Furthermore, said at least one electronic control circuit also has the advantage of not impacting the operation of the integrated circuit.
[0111] Of course, the present invention is susceptible to various variants and modifications which will appear to those skilled in the art. For example, as a variant of a diode, the emissive electronic component may be a transistor, for example a MOS transistor. The transistor then produces light radiation when it is on. The transistor can thus be controlled by the output voltage of the electronic module to which the electronic control circuit comprising this transistor is connected.
Claims
Claims
1. Integrated circuit comprising: - electronic modules (ME, MEb ME2, ME3, ME4), each electronic module being configured to generate at its output a voltage, called operating voltage, which is specific to it during normal operation of this electronic module, - at least one electronic control circuit (CC, CCi, CC2, CC3) comprising an emissive electronic component (EEC), each electronic control circuit (CC, CCi, CC2, CC3) being arranged at the output of an electronic module (ME, MEb ME2, ME3, ME4), said at least one electronic control circuit (CC, CCi, CC2, CC3) and its emissive electronic component (EEC) being configured so as to allow the emissive electronic component (EEC) to emit light radiation as a function of the value of the voltage at the output of this electronic module (ME, MEb ME2, ME3, ME4) relative to the value of said operating voltage,the integrated circuit being configured so that the light radiation that can be emitted by said emissive electronic component (EEC) can diffuse to an outer face of the integrated circuit, and in which said at least one electronic control circuit (CC, CCi, CC2, CC3) and its emissive electronic component (EEC) are configured so as to allow the emissive electronic component (EEC) to emit light radiation when the value of the output voltage of this electronic module (ME, MEb ME2, ME3, ME4) is lower than the value of said operating voltage.,
2. Integrated circuit according to claim 1, wherein said at least one electronic control circuit (CC, CCi, CC2, CC3) and its emissive electronic component (EEC) are configured so as to allow the emissive electronic component (EEC) to emit light radiation when the value of the output voltage of this electronic module (ME, MEb ME2, ME3, ME4) reaches the value of said operating voltage.
3. An integrated circuit according to any one of claims 1 or 2, wherein no metal line capable of obstructing the light radiation of the emissive electronic component (EEC) is provided. between the emissive electronic component (EEC) and said outer face of the integrated circuit.
4. Integrated circuit according to one of claims 1 to 3, in which the light radiation has a wavelength between 400nm and 1400nm.
5. Integrated circuit according to one of claims 1 to 4, in which the emissive electronic component (EEC) is a diode.
6. An integrated circuit according to claim 6, wherein the diode is an NWell diode.
7. Integrated circuit according to one of claims 1 to 4, in which the emissive electronic component (EEC) is a transistor.
8. Integrated circuit according to one of claims 1 to 7, comprising means for switching off said at least one electronic control circuit (CC, CC^ CC2, CC3).
9. Method for diagnosing an integrated circuit (IC) according to one of claims 1 to 8, in which the integrated circuit (IC) is powered up (40) and then at least one faulty electronic module is identified (43) using the emissive electronic component (EEC) of said at least one electronic control circuit (CC, CCi, CC2, CC3).
10. Method according to claim 9, in which an acquisition (42) of at least one image of said external face of the integrated circuit (CI) is carried out, the acquisition being adapted to capture the light radiation produced by the integrated circuit (CI) on said external face of the integrated circuit (CI), the identification (43) of at least one faulty electronic module being carried out from said at least one acquired image by analyzing an emission state of the emissive electronic component (EEC) of said at least one electronic control circuit (CC, CCi, CC2, CC3).