Thermal regulation device, and device comprising a thermal regulation device

Abstract

The invention relates to a fluid distribution device (1) forming a collector for a fluid / fluid cooling system (100) for electronic components, in particular for electronic components of at least one computer server, the device comprising: - A base plate (2), forming the base of the collector, - a cover plate (3) for the collector and comprising fluid distribution ports (30), - an intermediate plate (4) comprising at least two channel ports (40), said intermediate plate being interposed between said base plate and said cover plate so that each port (40) of the intermediate plate (4) is arranged opposite at least two fluid distribution ports so as to form with the base plate and the cover plate a fluid channel (5) configured to convey the fluid from one fluid distribution port to another,The device is characterized in that each plate is flat. Figure for the abbreviation: Fig. 1,

Description

Title of the invention: Thermal regulation device, and device comprising a thermal regulation device

[0001] The present invention relates to a thermal regulation device, and a device comprising a thermal regulation device for electrical and / or electronic components, particularly in the field of computer servers.

[0002] The components that may be relevant to the present invention may be computer server components.

[0003] The invention finds an advantageous application in the field of thermal regulation devices of a power electronics device or module, i.e. comprising power electronic components.

[0004] Computer hardware consists of equipment capable of receiving, transmitting, storing, or processing digital and / or analog information. This computer hardware is now used by a very large number of infrastructures to ensure, for example, data management. This computer hardware is housed in computer data centers that centralize information. These computer data centers are commonly referred to as server racks. Such server racks generally take the form of cabinets comprising a plurality of rails or drawers on which computer hardware is arranged parallel to one another.

[0005] During operation, computer equipment generates heat. The heat emitted by the various computer equipment in the data center must be dissipated to maintain optimal operation of the various data center devices. Indeed, insufficient heat dissipation can lead to overheating of the computer equipment. This overheating can cause irreversible damage to the computer equipment, for example, by causing the expansion of certain internal components. Furthermore, some computer equipment includes an integrated battery that can be damaged by the effects of heat.

[0006] In the field of computer servers, it is known to implement means of dissipating the heat generated by the computer equipment, for example, by means of an airflow circulating within each of the compartments of the server rack in which the computer equipment is located, the airflow exchanging heat directly with the computer equipment. Although this technique is used in a wide range of computer data centers, it does not However, it does not adequately cool installations that produce a large amount of heat. Furthermore, this technique is very energy-intensive.

[0007] It is also known to cool electrical or electronic components, and in particular computer servers, by means of a liquid cooling system such as water, for example glycol water, or a system in which a dielectric liquid is sprayed onto the computer equipment. The fluid directed onto the computer equipment is intended to recover heat produced by the computer equipment during operation; this fluid may be dielectric to prevent short circuits with the electrical or electronic components of the computer equipment.

[0008] A cooling device dedicated to cooling the fluid can then be integrated within the computer installation in order to cool it efficiently.

[0009] These known systems for cooling computer equipment using a liquid fluid directed towards the equipment involve components such as flexible hoses to guide the fluid to the equipment. Setting up such systems is complex and time-consuming, as each hose must be positioned relative to the computer equipment whose temperature needs to be regulated. This can result in unreliable positioning of the hoses guiding the dielectric fluid. Furthermore, these hoses can be damaged during installation or when the various components of the system are handled.

[0010] In addition, these installations have a large footprint which prevents in particular a good efficiency / size ratio.

[0011] The present invention aims to overcome at least partially one or more of the aforementioned drawbacks by proposing a compact and reliable fluid distribution device for a cooling system for electronic components.

[0012] This problem is solved by a fluid distribution device forming a collector for a fluid / fluid cooling system for electronic components, in particular for electronic components of at least one computer server, the device comprising: - A base plate, forming the bottom of the collector, - a plate forming a cover for the manifold and including fluid distribution ports, - an intermediate plate comprising at least two pipe ports, said intermediate plate being interposed between said base plate and said cover plate so that each port of the intermediate plate is arranged opposite at least two fluid distribution ports so as to form with the base plate and the cover plate a fluid channel configured to convey fluid from one fluid distribution orifice to another, the device being characterized in that each plate is flat.

[0013] Advantageously, this allows the various fluids of the cooling system to be distributed by a particularly compact and easy-to-produce device.

[0014] This device is particularly advantageously assembled by brazing.

[0015] This advantageously allows the device to be assembled in a particularly easy way.

[0016] The fluid distribution device may further include one or more of the following features described below, taken separately or in combination.

[0017] The two pipe orifices each form a channel configured to be traversed by a first fluid and by a second fluid.

[0018] The base plate and the cover plate each have a thickness between 0.5mm and 3mm, in particular 1mm.

[0019] The intermediate plate has a thickness between 2mm and 12mm, in particular 5mm.

[0020] The intermediate plate has walls around the orifices having a width of at least 3mm, preferably of at least 12mm.

[0021] This advantageously reduces the risk of leakage and improves pressure resistance, thus reducing the risk of deformation of the device.

[0022] The intermediate plate is fixed to the base plate and the cover plate by brazing.

[0023] The distribution device further includes for each pipe orifice (40) a fluid inlet connector and a fluid outlet connector communicating with fluid distribution orifices opposite the same pipe orifice.

[0024] The plate forming the collector cover includes a bypass orifice opposite and communicating with a pipe orifice, the device further including a bypass connector communicating with said bypass orifice and the pipe orifice.

[0025] Advantageously, the bypass orifice allows for better flow and pressure control. The use of a bypass valve, for example a solenoid valve that opens and closes according to the server's cooling requirements, improves the management of cooling parameters.

[0026] The distribution device includes a valve support interposed between the cover plate on one side, and at least one connector, preferably a fluid inlet / outlet connector and a bypass connector and / or a bypass valve, on the other side,

[0027] Advantageously, the bypass valve is notably connected to the bypass connector.

[0028] The intermediate plate includes at least one appendage which extends at least partially into at least one, preferably each channel orifice of the intermediate plate.

[0029] The appendage allows the pipe orifice to be separated at least partially into two channels, which advantageously greatly improves pressure resistance and thus reduces the risk of deformation of the device.

[0030] At least one appendage extends over the entire length of the pipe orifice. The same fluid flows through the two channels formed by the appendage, dividing said pipe orifice in two. Advantageously, this greatly improves pressure resistance.

[0031] At least one appendage extends only partially into the pipe orifice. Advantageously, one of the pipe orifices, particularly a pipe orifice connected with a bypass valve, has an appendage that extends only partially into said pipe orifice, thus providing good pressure resistance while maintaining a single-channel area, in which the valve is then connected rather than in the area where the channels are divided. It is indeed simpler and more reliable to draw fluid from the single-channel area than from the area comprising multiple channels.

[0032] The appendage is in contact with the base plate and the cover plate.

[0033] The appendage has a width of at least 0.5mm, preferably at least 7.5mm.

[0034] The appendage has a width that is at most 60% of the width of the orifice.

[0035] The invention relates in particular to a cooling system comprising a cooling device as described above.

[0036] The invention also proposes a method for assembling a manifold-forming distribution device as described above, which comprises the following steps: 1. Provide a base plate, a lid plate, and an intermediate plate. 2. Stack the different plates so that the intermediate plate is interposed between said base plate and said lid plate, and so that each orifice of the intermediate plate faces at least two fluid distribution orifices, thus forming with the base plate and the lid plate a fluid channel configured to carry the fluid from one fluid distribution orifice to another. 3. Fix the 3 plates irreversibly, the fixing being carried out preferably by brazing or by laser welding, again preferably by brazing.

[0037] Other advantages and features of the invention will become more apparent upon reading the following description, given by way of illustrative and non-limiting example, and the accompanying drawings, among which:

[0038] [Fig.1] schematically illustrates a fluid distribution device according to a first embodiment of the invention.

[0039] [Fig.2] schematically illustrates a detail of the fluid distribution device according to the first embodiment of the invention.

[0040] [Fig.3] schematically illustrates a detail of part of the device top-down fluid distribution according to the first embodiment of the invention.

[0041] [Fig.4] schematically illustrates another detail of part of the device fluid distribution according to a second embodiment of the invention.

[0042] [Fig.5] schematically illustrates in exploded view the distribution device of fluid according to the first embodiment of the invention.

[0043] [Fig.6] schematically illustrates a thermal regulation system comprising the fluid distribution device according to an embodiment of the invention.

[0044] In these figures, identical elements bear the same reference numbers.

[0045] The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference relates to the same embodiment, or that the features apply only to a single embodiment. Simple features from different embodiments can also be combined or interchanged to provide other embodiments.

[0046] In the description, certain elements can be indexed, for example, first element or second element. In this case, it is simply an indexing to differentiate and name similar but not identical elements. This indexing does not imply any priority of one element over another, and such designations can easily be interchanged without departing from the scope of the present invention. Nor does this indexing imply any chronological order.

[0047] Figure 1 schematically represents an embodiment of a distribution device (1) forming a collector for a fluid / fluid cooling system (100) for electronic components, in particular for electronic components of at least one computer server, the device comprising: - A base plate (2), forming the bottom of the collector, - a plate forming a cover (3) for the manifold and including fluid distribution ports (30), - an intermediate plate (4) comprising at least two channel orifices (40), said intermediate plate being interposed between said base plate and said cover plate so that each orifice (40) of the intermediate plate (4) is arranged opposite at least two fluid distribution orifices so as to form with the base plate and the cover plate a fluid channel (5) configured to convey the fluid from one fluid distribution orifice to another, the device being characterized in that each plate is flat.

[0048] In some embodiments, the two pipe orifices each form a channel configured to be traversed by a first fluid and by a second fluid.

[0049] In some embodiments, the base plate (2), and the cover plate (3) each have a thickness (el) between 0.5mm and 3mm, in particular 1mm.

[0050] In some embodiments, the intermediate plate (4) has a thickness (e2) between 2mm and 12mm, in particular 5mm.

[0051] In some embodiments, the intermediate plate (4) has walls around the orifices (40) having a width (Ll) of at least 3mm, preferably of at least 12mm.

[0052] In some embodiments, the intermediate plate (4) is fixed to the base plate (2) and to the cover plate (3) by brazing.

[0053] In certain embodiments, the distribution device (1) further comprises for each pipe orifice (40) a fluid inlet connector (6) and a fluid outlet connector (7) communicating with fluid distribution orifices (30) opposite the same pipe orifice.

[0054] In certain embodiments, the cover plate (3) of the collector includes a bypass orifice (31) opposite and communicating with a pipe orifice (40), the device further including a bypass connector (310) communicating with said bypass orifice (31) and the pipe orifice (40).

[0055] Advantageously, the bypass orifice allows for better flow and pressure control. The use of a bypass valve, for example a solenoid valve that opens and closes according to the server's cooling requirements, improves the management of cooling parameters.

[0056] In some embodiments, the distribution device (1) includes a valve support (8) interposed between the cover plate (3) on one side, and at least one connector, preferably a fluid inlet / outlet connector (6, 7) and a bypass connector (310) and / or a bypass valve, on the other side,

[0057] Advantageously, the bypass valve is in particular connected to the bypass connector (310).

[0058] In some embodiments, the intermediate plate includes at least one appendage (41) which extends at least partially into at least one, preferably each, channel orifice (40) of the intermediate plate (4).

[0059] In some embodiments, the appendage (41) is in contact with the base plate (2) and the lid plate (3).

[0060] In some embodiments, the appendage (41) has a width of at least 0.5mm, preferably at least 7.5mm.

[0061] In some embodiments, a cooling system (100) includes a cooling device as described above.

[0062] In certain embodiments, a method for assembling a distribution device (1) forming a collector as described above, comprises the following steps: - Provide a base plate (2), a lid plate (3) and an intermediate plate (4), - Superimpose the different plates so that the intermediate plate (4) is interposed between said base plate (2) and said lid plate (3) and so that each orifice (40) of the intermediate plate (4) faces at least two fluid distribution orifices (30) so as to form with the base plate (2) and the lid plate (3) a fluid channel (5) configured to convey the fluid from one fluid distribution orifice (30) to another, - Fix the 3 plates irreversibly, the fixing being carried out preferably by brazing or by laser welding, again preferably by brazing.

[0063] The distribution device has a through orifice (9) separating the piping orifices of the first and second fluid.

[0064] This advantageously reduces the weight of the device while facilitating the handling of the different plates and the complete device before, during and after assembly of said plates.

[0065] Another advantage of this orifice is that it ensures the two fluids do not mix. Thus, advantageously, if the device has a leak, it will cause fluid to leak outside the device, but the fluids will not mix. This advantageously allows for maintaining good thermal regulation despite the leak. Furthermore, when using a dielectric fluid, an external leak does not pose a safety problem because there can be no short circuit caused by contact between the fluid and an electronic component.

[0066] As shown by way of non-limiting example in [Fig. 1] and [Fig. 6] exploded view, the distribution device may include a number of connections allowing it to connect and distribute several fluid circuits. The various components of the distribution device can, for example, be fixed and assembled by brazing or laser welding, and can thus be easily assembled in a cooling device.

[0067] Figure 2 represents one embodiment of the intermediate plate 4, which is the A plate that allows the channels (5) to be defined by the shape of the pipe orifices (40). This plate can, for example, be machined, milled, or laser cut to form these orifices.

[0068] The plate is then assembled with the cover plate (3), as shown in [Fig.4], and with the base plate (2).

[0069] An embodiment of the intermediate plate 4 of the distribution device 1 is shown [Fig. 3] to illustrate the direction of the fluid within the device. Advantageously, in some embodiments, the fluids flowing in the channels have opposite directions.

[0070] In the embodiment shown in [Fig.3], an appendage 41 extends only partially into the pipe orifice 40 so as to form two channels 5 which join before the inlet (or outlet) connector.

[0071] A second appendage 41 extends totally into the channel orifice 40 so as to form two completely separate channels 5.

[0072] As illustrated by way of non-limiting example in [Fig. 6], the distribution device is preferably configured to be placed at the bottom of a housing containing the cooling device. Thus, even in cases where the fluid is not a dielectric fluid, a leak outside the device presents little risk because only the bottom of the housing will be affected by the fluid, unlike conventional situations where a distribution tube carries the fluid and is therefore necessarily more bulky in the vertical axis, with leaks potentially located higher up, and thus closer to the electronic components.

[0073] The device further includes guide pins and / or guide openings (10) configured to allow the alignment of the three plates together to allow their assembly.

[0074] Legend Fluid distribution device (1) base plate (2) cover plate (3) fluid distribution ports (30) bypass port (31) intermediate plate (4) piping ports (40) appendix (41) fluid channel (5) fluid inlet connector (6) fluid outlet connector (7) valve support (8) through orifice (9) guide pins and / or openings forming a guide (10) thickness of the base plate and the plate forming the lid (el) intermediate plate thickness (e2)

Claims

Demands

1. Fluid distribution device (1) forming a manifold for a fluid / fluid cooling system (100) for electronic components, in particular for electronic components of at least one computer server, the device comprising: - A base plate (2), forming the base of the manifold, - a cover plate (3) for the manifold and comprising fluid distribution ports (30), - an intermediate plate (4) comprising at least two channel ports (40), said intermediate plate being interposed between said base plate and said cover plate such that each port (40) of the intermediate plate (4) is arranged opposite at least two fluid distribution ports so as to form with the base plate and the cover plate a fluid channel (5) configured to convey the fluid from one fluid distribution port to another,the device being characterized in that each plate is flat, and in that the intermediate plate comprises at least one appendage (41) which extends at least partially into at least one, preferably each, channel opening (40) of the intermediate plate (4).

2. Device according to the preceding claim, wherein the two pipe orifices each form a channel configured to be traversed by a first fluid and by a second fluid.

3. Device according to any one of the preceding claims, wherein the base plate (2), and the cover plate (3) each have a thickness (el) between 0.5mm and 3mm, in particular 1mm.

4. Device according to any one of the preceding claims, wherein the intermediate plate (4) has a thickness (e2) between 2mm and 12mm, in particular 5mm.

5. Device according to any one of the preceding claims, wherein the intermediate plate (4) has walls around the orifices (40) having a width (Ll) of at least 3mm, preferably of at least 12mm.

6. Device according to any one of the preceding claims, wherein the intermediate plate (4) is fixed to the base plate (2) and to the cover plate (3) by brazing.

7. Device according to any one of the preceding claims, wherein the distribution device (1) further comprises for each pipe orifice (40) a fluid inlet connector (6) and a fluid outlet connector (7) communicating with fluid distribution orifices (30) opposite the same pipe orifice.

8. Device according to any one of the preceding claims, wherein the cover plate (3) of the collector includes a bypass orifice (31) facing and communicating with a pipe orifice (40), the device further comprising a bypass connector (310) communicating with said bypass orifice (31) and the pipe orifice (40).

9. Device according to the preceding claim, wherein the distribution device (1) comprises a valve support (8) interposed between the cover plate (3) on one side, and at least one connector, preferably a fluid outlet / inlet connector (6, 7) and a bypass connector (310) and / or a bypass valve, on the other side. Advantageously, the bypass valve is in particular connected to the bypass connector (310).

10. Device according to claim 1, wherein the appendage (41) is in contact with the base plate (2) and the cover plate (3).

11. Device according to any one of claims 1 to 10, wherein the appendage (41) has a width of at least 0.5mm, preferably at least 7.5mm.

12. Cooling system (100) comprising a cooling device according to any one of the preceding claims.

13. A method for assembling a manifold-forming distribution device (1) according to any one of claims 1 to 11, comprising the following steps:

1. Providing a base plate (2), a cover plate (3), and an intermediate plate (4), 2. Superimposing the various plates such that the intermediate plate (4) is interposed between said base plate (2) and said cover plate (3), and such that each orifice (40) of the intermediate plate (4) makes facing at least two fluid distribution ports (30) so as to form with the base plate (2) and the cover plate (3) a fluid channel (5) configured to convey the fluid from a fluid distribution port (30) to a other, 3. Fix the 3 plates irreversibly, the fixing being carried out preferably by brazing or by laser welding, again preferably by brazing.

Images