Thermal regulation device
The thermal regulation device addresses the issue of non-homogeneous temperature profiles in electronic components by using a stack of brazed plates with a heat transfer fluid circuit, achieving improved thermal management and component reliability.
Patent Information
- Application Number
- FR2023011680
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-10-26
- Publication Date
- 2025-05-02
AI Technical Summary
Existing thermal management systems for electronic components in high-power applications suffer from non-homogeneous temperature profiles, leading to inefficiencies and potential system failures due to temperature imbalances.
A thermal regulation device featuring a stack of brazed plates with a heat transfer fluid circuit, where the fluid circulates through multiple stages with different flow paths, ensuring a homogeneous temperature profile across electronic components.
The device achieves better thermal management by ensuring a homogeneous temperature profile across electronic components, optimizing their operation and reducing the risk of system failures.
Smart Images

Figure 00000000_0000_ABST
Abstract
Description
Title of the invention: Thermal regulation device
[0001] The present invention relates to a thermal regulation device for the cooling and / or heating of at least one component whose operation is sensitive to temperature, this component being in particular a power electronic module of an inverter or a battery cell.
[0002] In the context of automotive electrification, many electronic components are being developed or improved for higher power output. Generally speaking, the electronics used are impacted by the quality of thermal management, as electronic components have a maximum operating temperature. In particular, there is a strong correlation between maximum temperature and component price. Alternatives that withstand higher temperatures often exist, but at a higher cost. Consequently, there is a significant need to optimize the cooling of these electronic components in order to improve durability or reduce their associated costs. Examples of electronic components include components of a vehicle's electric motor, components of a DC-DC converter, an on-board charger, an inverter, etc.
[0003] For some of these components, the heat flux they produce is high due to their small surface areas (very small components). Furthermore, homogeneity of maximum temperatures is required among the various heat sources, namely the components. Indeed, certain quantities are affected by temperature (for example, resistance), and the power is distributed in parallel among several power modules. If one branch is too different from the others, this can lead to an imbalance that may cause system failures.
[0004] In certain configurations, the liquid cooling circuits of electrical / electronic components are arranged in series to optimize compactness (or packaging) but this arrangement generates constraints on temperature and minimum flow rate of a heat transfer fluid used to cool these components.
[0005] The components to be cooled are, for example, switching cell modules of an inverter. This type of component is temperature-sensitive and requires precise thermal management. To date, a thermal device with a copper base plate and machined pin-shaped cooling elements immersed in a flow of coolant has provided this thermal management. In this thermal device, the temperature is not homogeneous because the arrangement of the pins is the same along the entire length of the plate, imposing a constant heat transfer coefficient. Due to natural heating of the fluid along the plate, the temperature difference decreases between the fluid and the switching cells, which generates a non-homogeneous temperature profile at the component level.
[0006] The present invention aims in particular to further improve the thermal regulation of components, in particular for cooling them, by proposing thermally efficient solutions with a simpler design and / or less expensive to manufacture.
[0007] The invention thus relates to a thermal regulation device for the cooling and / or heating of at least one temperature-sensitive component, this component being in particular a power electronic module of an inverter or a battery cell, this thermal regulation device comprising a stack of plates, in particular brazed together, within which a heat transfer fluid circuit is arranged, this thermal regulation device having an external face on which one or more components can be placed, for example a power electronic module, the heat transfer fluid circuit comprising at least a first heat transfer fluid circulation stage and a second heat transfer fluid circulation stage which are contiguous,These first and second heat transfer fluid circulation stages are also substantially parallel to the external face and have different heat transfer fluid paths, with the first heat transfer fluid circulation stage being located between this external face and the second heat transfer fluid circulation stage.
[0008] According to one aspect of the invention, the device is configured so that the heat transfer fluid circuit is traversed by only one heat transfer fluid.
[0009] The first and second floors are said to be contiguous in the sense that there is no intermediate floor between these contiguous floors, and in particular there is no intermediate floor through which a heat transfer fluid other than that which circulates in the contiguous floors would circulate.
[0010] Advantageously, each stage is formed by a pair of plates. Preferably, the adjacent stages are configured to allow, within these stages, circulation of the heat transfer fluid in a plane parallel to the plates. Preferably, the heat transfer fluid circulation between adjacent stages is parallel. In the invention, the heat transfer fluid is distributed among the various adjacent stages. Preferably, the adjacent stages are configured so that the heat transfer fluid circulates in the same direction within the stages. Advantageously, temperature equalization is achieved along a transverse axis (Y-axis) perpendicular to the principal axis (X-axis) of fluid circulation, along the plates.
[0011] The present invention is advantageous insofar as the first fluid circulation stage and the second fluid circulation stage allow for the homogeneous cooling of the external face of the thermal regulation device thanks to in particular to temperature balancing across floors.
[0012] In the case where several electronic components are placed on this external surface, in dedicated receiving areas, the invention makes it possible to have a homogeneous temperature profile across the different electronic components. The invention thus optimizes the operation of these electronic components through improved thermal management. Furthermore, the stages are, in a way, thermally linked to each other, which allows heat to transfer from the electronic component in contact with the first stage to the subsequent stages.
[0013] In particular, the fluid paths in the first fluid circulation stage and second fluid circulation stage are, in a way, combined with each other so that the different electronic components are cooled homogeneously, as will be explained in detail below.
[0014] According to one aspect of the invention, the fluid paths in the first fluid circulation stage and second fluid circulation stage each comprise, in particular between a fluid inlet of the stage and a fluid outlet of that stage, several fluid passes.
[0015] In other words, in each stage, the fluid makes several passes so that the fluid path passes successively two or three times, or even more, over each receiving area of an electronic component.
[0016] The fluid path in each of the stages is thus of the meandering type due to the passes that the fluid must make in that stage.
[0017] For example, between a fluid inlet of the stage and a fluid outlet of that stage, the fluid makes at least two U-turns.
[0018] In a preferred embodiment of the invention, each stage includes a fluid inlet and a fluid outlet and defines a single-branch fluid path between the fluid inlet and the fluid outlet.
[0019] In other words, all the fluid entering through the fluid inlet of this stage travels the path along this single branch without being split along this path.
[0020] According to one aspect of the invention, all contiguous floors have a single-branch path.
[0021] According to one aspect of the invention, the paths of two contiguous stages are symmetrical to each other with respect to a plane of symmetry perpendicular to the plates and which passes through the fluid inlet and the fluid outlet.
[0022] Thus for one of the stages, the fluid begins the path in that stage by moving towards the right side of the plates while for a contiguous stage, the fluid begins the path in that stage by moving towards the left side of the plates.
[0023] Thus, these two contiguous stages allow each placement zone receiving a component to be cooled to be cooled, by two "colder" fluid paths ("more cold” because it comes from the fluid inlet) which pass over two opposite sides of the placement area concerned.
[0024] This allows for good temperature balancing for each component placement area to be cooled.
[0025] According to one aspect of the invention, each stage comprises a single fluid inlet and a single fluid outlet.
[0026] In a variant of the invention, in each stage between the fluid inlet and outlet, at least two fluid flow branches are provided, in particular arranged symmetrically to each other with respect to a longitudinal axis of symmetry of that stage.
[0027] According to one aspect of the invention, the branches thus allow parallel flows in this stage.
[0028] According to one aspect of the invention, each flow branch receives, for example, half of the flow from that stage.
[0029] According to one aspect of the invention, each branch of this stage has at least two U-shaped turns.
[0030] According to one aspect of the invention, the two branches join at the center of the stage to form a single common outlet channel which leads to the fluid outlet of this stage.
[0031] In another of the stages, between the fluid inlet and outlet, the fluid inlet opens onto a common inlet channel which subdivides into two fluid flow branches which then join the fluid outlet after making one or two U-shaped turns.
[0032] According to one aspect of the invention, the branches can be symmetrical to each other with respect to a longitudinal axis of symmetry of this stage.
[0033] According to one aspect of the invention, the respective fluid paths of the first stage and the second stage exhibit symmetry by a rotation of 180° in a plane parallel to the stages.
[0034] Thus, for example, for one of the stages, the common channel starts from the fluid inlet of the stage while, for the other contiguous stage, the common channel opens onto the fluid outlet of the stage.
[0035] The same applies to the meandering sections of the respective paths of the two floors which are arranged symmetrically with respect to each other by a rotation of 180°.
[0036] According to one aspect of the invention, two contiguous stages comprise the inlets on the same side and the outlets on the same other side. Heating compensation is achieved by temperature balancing along a transverse axis (Y-axis) perpendicular to the main axis (X-axis) of fluid circulation, along the plates.
[0037] The invention thus allows the heat transfer fluid to circulate over both floors in such a way that the fluid, which is still cold, coming from the respective inlets of each stage cools different parcels of the receiving areas of the electronic components.
[0038] The invention thus makes it possible to achieve better temperature homogeneity during cooling.
[0039] According to one aspect of the invention, in each stage, the fluid path comprises one or more straight sections connected to each other by U-shaped bends.
[0040] According to one aspect of the invention, these straight sections extend along a longitudinal direction of the stacked plates.
[0041] According to one aspect of the invention, each stage is formed by the assembly of two plates between which one or more fluid circulation channels are formed, defining the fluid flow path in that stage.
[0042] According to one aspect of the invention, at least one of the plates of the pair of plates that form a stage has stamped shapes to make this or these channels.
[0043] According to one aspect of the invention, the plates of a pair are assembled together, in particular by being brazed together.
[0044] According to one aspect of the invention, the floors are formed by pairs of plates distinct from one floor to the other.
[0045] Alternatively, neighboring floors share a common plate, in particular a common plate which is flat.
[0046] In at least some of the fluid circulation stages, the fluid path passes through a channel section equipped with fluid flow disturbance elements. This improves the exchange capacity through the presence of turbulence in the fluid.
[0047] The disturbance elements are, for example, bumps or studs present in the flow channel.
[0048] The disturbance elements can be made by stamping one of the plates forming the circulation floor.
[0049] According to one aspect of the invention, at least one of the plates may include perforated louvers to increase the heat exchange capacity, or convolution fins or sinusoidal fins or any other intercalated element.
[0050] According to one aspect of the invention, the openwork louvers are formed on an additional piece added and assembled with the plates.
[0051] According to one aspect of the invention, for at least one of the stages, the fluid disturbance elements are arranged closer to the fluid outlet than to the fluid inlet.
[0052] According to one aspect of the invention, for at least one of the stages, the fluid disturbance elements are arranged closer to the fluid inlet than to the outlet of fluid.
[0053] According to one aspect of the invention, for at least one of the stages, the meandering path includes a partial bypass path configured to allow, passively, the flow of fluid by bypass between a first point and a second point of the meandering path by taking a shortcut so as to relieve a section of this meandering path.
[0054] This section can advantageously be relieved in the event of a large flow that would pass through this section in the absence of such a diversion.
[0055] The partial bypass path can be formed by an orifice allowing the shortcut.
[0056] This partial bypass path is particularly interesting in the case where the liquid flow rate is high enough that a slight reduction is acceptable for heat exchange and the gain on the pressure drop is necessary.
[0057] The plates used to form the stages in the present invention can be produced in a relatively simple manner, for example at a higher production rate, one of them being a flat plate and the other a stamped plate. It is thus possible to do without complex plates with raised shapes.
[0058] The fact of staggering the flow can potentially also allow, for each stage, a flow in two dimensions, that is to say essentially in a plane, which makes it possible to minimize pressure drops which would occur if the flow took place in the three dimensions of space.
[0059] The invention also allows for a thermal regulation device that has a lower thickness.
[0060] According to one aspect of the invention, the different fluid circulation stages are supplied by a fluid distribution column connected to the inlet of each stage.
[0061] Similarly, the fluid outlet from the different stages connects to a heat transfer fluid collection column which allows the heat transfer fluid to be evacuated.
[0062] This configuration simplifies the construction of the thermal regulation device.
[0063] According to one aspect of the invention, the thermal regulation device comprises more than two stages of fluid circulation.
[0064] In the case where three floors are planned, the third floor is chosen with the same path geometry as the second floor, and the first floor is in this case, in particular in symmetry at 180° with respect to the second and third floors.
[0065] In the case of a four-stage configuration, the first and fourth stages have the same path geometry, while the second and third stages have the same fluid path geometry, notably in 180° symmetry with respect to the first and fourth. floors.
[0066] The invention further relates to an assembly comprising a thermal regulation device as mentioned above, and at least one electronic component placed on the external face of this thermal regulation device to be cooled by the fluid paths in the thermal regulation device.
[0067] According to one aspect of the invention, the assembly includes a thermal link between the thermal regulation device and the component (for example a power module), formed for example by a thermal paste, a compressed flexible interface material or a weld.
[0068] The invention further relates to a method for manufacturing a thermal regulation device for cooling and / or heating at least one component whose operation is sensitive to temperature, this component being in particular a power electronic module of an inverter or a battery cell, this method comprising the following step: - to create a stack of plates, in particular brazed together, within which a heat transfer fluid circuit is arranged, this thermal regulation device having an external face on which one or more components can be placed, for example a power electronic module, the heat transfer fluid circuit comprising at least a first heat transfer fluid circulation stage and a second heat transfer fluid circulation stage, these first and second heat transfer fluid circulation stages being substantially parallel to the external face and having different heat transfer fluid paths from one stage to the other, and the first heat transfer fluid circulation stage being disposed between this external face and the second heat transfer fluid circulation stage.
[0069] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:
[0070] [Fig-1] The [Fig. 1] is a perspective representation of a thermal regulation device according to an example of an embodiment of the invention;
[0071] [Fig.2] Fig.2 is a cross-sectional representation of the regulating device thermal of the [Fig.l];
[0072] [Fig.3] Fig.3 is a perspective representation of the regulatory device thermal image of [Fig.1], showing one of the fluid circulation stages;
[0073] [Fig.4] The [Fig.4] is a flat representation of the floor of the [Fig.3];
[0074] [Fig.5] Fig.5 is a perspective representation of the regulatory device thermal of the [Fig.1], showing another of the fluid circulation stages;
[0075] [Fig.6] The [Fig.6] is a flat representation of the floor of the [Fig.4];
[0076] [Fig.7] The [Fig.7] is a representation of a fluid path in a stage of a device according to another embodiment of the invention;
[0077] [Fig.8] The [Fig.8] is a representation of another stage of the device of the [Fig.7].
[0078] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.
[0079] Figures 1 and 2 show a thermal regulation device 1 for the cooling and / or heating of components 2 whose operation is sensitive to temperature.
[0080] As illustrated in Fig. 2, this thermal regulation device 1 is part of an assembly 100 which includes electronic components 2 placed on an external face 10 of the thermal regulation device 1 to be cooled by the fluid paths in the thermal regulation device 1. These components 2 are in particular electronic power modules of an inverter or battery cells.
[0081] This thermal regulation device 1 comprises a collector base 4 forming a base of the thermal regulation device 1, this collector base 4 having a longitudinal shape along the X direction. This collector base 4 has a fluid inlet port 5 and a fluid outlet port 6 configured to be connected respectively to an external fluid inlet pipe and a fluid outlet pipe. This fluid inlet port 5 and this fluid outlet port 6 are arranged at two opposite ends along the X axis of the collector base 4.
[0082] In the example described, the thermal regulation device 1 comprises a stack of plates 14, here brazed together, within which a heat transfer fluid circuit 15 is arranged.
[0083] The stack of plates 14 also includes the collector base 4 which therefore forms the lower plate of the stack, the lower plate through which the fluid connections are made.
[0084] A cover plate 40 closes the stack of plates and defines the external face 10.
[0085] The plates 14, the cover plate 40 and the collector base 14 are for example made of metal, for example of aluminum.
[0086] The heat transfer fluid circuit 15 comprises a first stage El for circulating heat transfer fluid (see [Fig.3]) and a second stage E2 for circulating heat transfer fluid. The heat transfer fluid (see [Fig. 4]) is contiguous, with the first and second stages El and E2 of the heat transfer fluid circulation being substantially parallel to the external face 10 and exhibiting different heat transfer fluid paths. The first stage El of the heat transfer fluid circulation is located between this external face 10 and the second stage E2 of the heat transfer fluid circulation. The fluid paths are illustrated by arrows Fl and F2 in Figures 4 and 6.
[0087] The first and second stages El and E2 are said to be contiguous in the sense that there is no intermediate stage between these contiguous stages, and in particular there is no intermediate stage in which a heat transfer fluid other than that which circulates in the contiguous stages would circulate.
[0088] We describe in the following the case of two floors but it is of course possible to provide for more than two floors, by 3 or 4 or more.
[0089] In the example described, each stage El and E2 is formed by a pair of plates 14. The contiguous stages El and E2 are configured to allow, in these stages, circulations of heat transfer fluid globally in a plane parallel to the plates 14, namely in a plane defined by the X axis and a Y axis perpendicular to the X axis.
[0090] The fluid paths in the first fluid circulation stage and second fluid circulation stage El and E2 each comprise, between the fluid inlet 5 of the stage and the fluid outlet 6 of that stage, several fluid passes.
[0091] In other words, in each stage El and E2, the fluid makes several passes so that the fluid path passes successively two or three times, or even more, over each receiving area 110 of the electronic component.
[0092] The fluid path in each of the El and E2 stages is thus of the meandering type due to the round trips that the fluid must make in this El and E2 stage.
[0093] To obtain this path, the plates 14 define channels 18 which extend between the fluid inlet 5 and the fluid outlet 6, in the plane defined by the X and Y axes. Each stage E1 and E2 comprises a single fluid inlet 5 and a single fluid outlet 6.
[0094] In the example described, the different fluid circulation stages El and E2 are supplied by a fluid distribution column 37 connected to the inlet 5 of each stage.
[0095] Similarly, the fluid outlet 6 of the different stages connects to a heat transfer fluid collection column 38 which allows the heat transfer fluid to be evacuated.
[0096] These columns 37 and 38 extend along a Z axis perpendicular to the X and Y axes, namely in the direction of the stacking of plates.
[0097] In each stage between the fluid inlet 5 and outlet 6, two fluid flow branches are provided, arranged symmetrically with respect to a longitudinal axis of symmetry of that stage. This axis of symmetry is parallel to the Y-axis and passes through the middle of the plates.
[0098] At the El stage (see figures 3 and 4), the fluid inlet 5 opens onto a common inlet channel 19 which subdivides into two fluid flow branches 20 which then join the fluid outlet 6 after making two U-shaped turns between the inlet 5 and the fluid outlet 6.
[0099] The branches 20 thus allow parallel flows in this stage.
[0100] Each flow branch 20 receives, for example, half of the flow from this floor.
[0101] Each branch 20 comprises two parallel straight sections 22, connected to each other by a U-shaped bend 23. Another U-shaped bend 23 is provided between the common inlet channel 19 and the beginning of the branches 20.
[0102] These straight sections 22 extend along the longitudinal direction X of the stacked plates 14.
[0103] The respective fluid paths of the first stage El and the second stage E2 exhibit symmetry by a rotation of 180° in the plane parallel to the stages, a plane defined by the X and Y axes. This can be seen in figures 5 and 6.
[0104] For stage E2, the two branches 25 which start at the inlet 5, join at the center of stage E2 to form only one common outlet channel 26 which leads to the fluid outlet 6 of this stage E2.
[0105] Each branch 25 comprises straight sections and forms U-shaped curves, as with branches 20 of the EL floor
[0106] The direction of fluid circulation is the same for the two contiguous stages El and E2. The heating compensation is done by a temperature balancing along the transverse axis Y perpendicular to the main axis X (longitudinal axis) of fluid circulation, along the plates 14.
[0107] The invention thus allows the heat transfer fluid to circulate over the two stages in such a way that the fluid, which is still cold, coming from the respective inlets of each stage cools different portions of the receiving areas 110 of the electronic components. Thus, for each receiving area 110, the common inlet channel 19 of stage E1 preferentially cools the center of the receiving area 110, while the branches 25 of stage E2 preferentially cool the sides of this receiving area 110.
[0108] The invention thus makes it possible to achieve better temperature homogeneity during cooling.
[0109] Thus a temperature balancing is achieved along the transverse axis Y.
[0110] Some at least of the plates 14 which define the floors have stamped shapes 30 to make the channels 18. These stamped shapes 30 define partitions which delimit the channels 18.
[0111] The plates 14 are brazed together. For example, the plates used to form the floors in the present invention can be made in a relatively simple way, for example with a higher production rate, one of them being a flat plate and the other a stamped plate.
[0112] In at least some of the fluid circulation stages, the fluid path passes through a channel section 31 provided with fluid flow disturbance elements 32.
[0113] The perturbation elements 32 are here bosses in the flow channel 18.
[0114] The disturbance elements 32 can be produced by stamping one of the 14 plates forming the circulation level.
[0115] In an example not shown, at least one of the plates 14 may include perforated louvers to increase heat exchange capacity, or convolution fins, sinusoidal fins, or any other intercalated element. The perforated louvers are formed on an additional piece added and assembled with the plates.
[0116] For the El stage, the fluid disturbance elements 32 are arranged closer to the fluid outlet 6 than to the fluid inlet 5.
[0117] For stage E2, the fluid disturbance elements 32 are arranged closer to the fluid inlet 5 than to the fluid outlet 6.
[0118] For at least one of the floors, in particular for all the floors, the meandering path includes a partial bypass path 35 configured to passively allow fluid flow by bypass between a first point and a second point of the meandering path by taking a shortcut so as to relieve a segment 36 of this meandering path. This relieved segment 36 here comprises the two straight segments 22 on each side of the common inlet segment 19.
[0119] This diverted section 36 can advantageously be diverted in the event of a significant flow that would otherwise pass through this section in the absence of such a diverter. This allows for a reduction in pressure loss. The diverter can, where appropriate, be of varying widths to obtain a greater or lesser degree of diverted flow, depending on the acceptable level of pressure loss.
[0120] The partial bypass path 35 can be formed by an orifice allowing the shortcut.
[0121] In the case where three floors are planned, the third floor is chosen with the same path geometry as the second floor, and the first floor is in this case, in particular in symmetry at 180° with respect to the second and third floors.
[0122] In the case of four stages, the first and fourth stages have the same path geometry, while the second and third stages have the same fluid path geometry, in particular 180° symmetry with respect to the first and fourth. floors.
[0123] In another embodiment of the invention illustrated in Figures 7 and 8, each stage El, E2 comprises a single-branch fluid path F50 between the fluid inlet 5 and the fluid outlet 6. Each branch comprises three straight flow segments and, between these segments, U-shaped bends.
[0124] In other words, all the fluid entering through the fluid inlet 5 of this stage travels the path F50 along this single branch without being split on this path.
[0125] For example, all contiguous floors have a single-branch path.
[0126] The respective paths of the two contiguous stages El and E2 are symmetrical to each other with respect to a plane of symmetry perpendicular to the plates and which passes through the fluid inlet 5 and the fluid outlet 6.
[0127] Thus for the El stage (see [Fig.7]), the fluid begins the path in this stage by moving towards the right side of the plate 14 while for a contiguous stage E2 (see [Fig.8]), the fluid begins the path in this stage by moving towards the left side of the plate 14.
[0128] Thus these two contiguous stages El and E2 make it possible to cool each placement zone 110 receiving a component to be cooled, by two paths of "colder" fluid ("colder" because coming from the fluid inlet 5) which pass on two opposite sides (right and left) of the placement zone 110 concerned.
[0129] This allows for good temperature balancing for each component placement area 110 to be cooled.
Claims
Claims
1. Thermal regulation device (1) for cooling and / or heating at least one component (2) whose operation is temperature-sensitive, this component (2) being in particular an electronic power module of an inverter or a battery cell, this thermal regulation device (1) comprising a stack of plates (14), in particular brazed together, within which a heat transfer fluid circuit is arranged, this thermal regulation device (1) having an external face (10) on which one or more components (2) can be placed, for example an electronic power module, the heat transfer fluid circuit comprising at least a first stage (El) for circulating heat transfer fluid and a second stage (E2) for circulating heat transfer fluid which are contiguous,these first and second stages of heat transfer fluid circulation being furthermore substantially parallel to the external face (10) and having different heat transfer fluid paths, and the first stage (El) of heat transfer fluid circulation being arranged between this external face (10) and the second stage (E2) of heat transfer fluid circulation.,
2. Thermal regulation device (1) according to the preceding claim, in which the fluid paths in the first fluid circulation stage (El) and second fluid circulation stage (E2) each comprise, in particular between a fluid inlet (5) of the stage and a fluid outlet (6) of this stage, several fluid passes, the fluid path in each of the stages being of the meandering type due to the passes that the fluid must make in this stage.
3. Thermal regulation device (1) according to the preceding claim, in which, for at least one of the stages, the meandering path comprises a partial bypass path configured to allow, passively, the flow of fluid by bypass between a first point and a second point of the meandering path by taking a shortcut so as to relieve a section of this meandering path.
4. Thermal regulation device (1) according to one of the preceding claims, in which the paths of two contiguous stages are symmetrical to each other with respect to a plane of symmetry perpendicular to the plates (14) and which passes through the fluid inlet (5) and the fluid outlet.
5. Thermal regulation device (1) according to one of the claims previous, in which, in each stage between the fluid inlet and outlet, at least two fluid flow branches (20) are provided, in particular arranged symmetrically to each other with respect to a longitudinal axis of symmetry of this stage.
6. Thermal regulation device (1) according to the preceding claim, in which the two branches (20) join at the center of the stage to form only one common outlet channel which opens towards the fluid outlet of this stage, and in another of the stages, between the fluid inlet and outlet, the fluid inlet (5) opens onto a common inlet channel which is subdivided into two fluid flow branches (20) which then join the fluid outlet after having completed one or two U-shaped turns.
7. Thermal regulation device (1) according to one of the preceding claims, in which, in each stage, the fluid path comprises one or more rectilinear sections (22) connected to each other by U-shaped turns.
8. Thermal regulation device (1) according to the preceding claim, in which these rectilinear sections (22) extend in a longitudinal direction of the stacked plates (14).
9. Thermal regulation device (1) according to one of the preceding claims, in which for one of the stages, the fluid begins the path in this stage by heading towards the right side of the plates (14) while for an adjoining stage, the fluid begins the path in this stage by heading towards the left side of the plates (14).
10. Thermal regulation device (1) according to one of claims 1 to 8, in which two contiguous stages comprise the inlets on the same side and the outlets on the same other side.
11. Thermal regulation device (1) according to one of the preceding claims, in which each stage is formed by the assembly of two plates (14) between which are formed one or more fluid circulation channels (18) defining the fluid flow path in this stage.
12. Thermal regulation device (1) according to the preceding claim, in which at least one of the plates (14) of the pair of plates (14) which forms a stage comprises stamped shapes to produce this or these channels.
13. Thermal regulation device (1) according to one of the preceding claims, wherein, in at least some of the cir- fluid flow, the fluid path passes through a channel section provided with fluid flow disturbance elements.
14. Assembly (100) comprising a thermal regulation device (1) according to one of the preceding claims and at least one electronic component (2) placed on the external face (10) of this thermal regulation device (1) to be cooled by the fluid paths in the thermal regulation device (1).
15. Method for manufacturing a thermal regulation device (1) for cooling and / or heating at least one component (2) whose operation is sensitive to temperature, this component (2) being in particular an electronic power module of an inverter or a battery cell, this method comprising the following step: - producing a stack of plates (14), in particular brazed together, within which a heat transfer fluid circuit is arranged, this thermal regulation device (1) having an external face (10) on which one or more components can be placed, for example an electronic power module, the heat transfer fluid circuit comprising at least a first stage (El) for circulating heat transfer fluid and a second stage (E2) for circulating heat transfer fluid, these first and second stages for circulating heat transfer fluid being substantially parallel to the external face (10) and having different paths for the heat transfer fluid from one stage to the other, and the first stage (El) for circulating heat transfer fluid being arranged between this external face (10) and the second stage (E2) for circulating heat transfer fluid.
Citation Information
Patent Citations
Liquid cooling plate capable of reducing flow resistance
CN215527810U
Cooling device and cooling unit
JP2012164874A
Heat exchanger
JP2016207897A
Liquid-cooled heat sink
JP2019160849A
Cooling apparatus
JP2019169614A