Electronic cut-off protection device with heat sink

Abstract

Electronic cut-off protection device with heat sink The invention relates to an electronic cut-off protection device comprising: a housing (1), a phase current line (P) between a first phase connection terminal (2) and a second phase connection terminal (3), the first / second phase connection terminal (2, 3) comprising a conductive part (4) comprising a contact portion (5), an electronic cut-off unit (6) comprising at least one electronic power cut-off component (7), a heat sink (8), characterized in that: - the conductive part (4) of the first phase connection terminal (2) is extended by a phase conductive portion (9) forming on the one hand a first part of the phase current line (P) and on the other hand a heat sink (8), the conductive part (4) and the phase conductive portion (9) forming a single-piece conductive part (10),- the phase conductive portion (9) being electrically and thermally connected to said electronic cut-off unit (6) so as to dissipate the heat coming from said at least one electronic power cut-off component (7) by thermal conduction and to conduct the current coming from said electronic cut-off unit (6) and / or to said electronic cut-off unit (6). Figure to be published with the abstract: Fig. 3,

Description

Title of the invention: Electronic cut-off protection device with heat sink

[0001] The invention relates to the field of electronic cut-off protection devices with a heat sink.

[0002] Electronic cut-off protection devices with a heat sink are known, for example, from publication WO2022106527A1 or publication WO22243456A1. These documents particularly concern finding a solution for efficiently removing the heat released by the electronic power cut-off components, such as power transistors.

[0003] More particularly in document WO2022106527A1, it is proposed to arrange said electronic cut-off unit in the housing opposite the rear side face made of metallic material and which preferably comprises a heat sink, for example with a plurality of fins. This configuration makes it possible to optimize the dissipation of joule losses, to optimize thermal conduction between the electronic power cut-off components with a DIN rail, and to optimize thermal convection with the ambient air. However, this solution requires modifying the material of the rear side face of the housing, which is usually made of plastic and therefore has an impact on the material of the housing.

[0004] More particularly in document WO22243456A1, it is proposed to house the cut-off block comprising the power switches of a phase line between several conductive plates and the walls of the housing of the device, which has the advantage of allowing the dissipation of thermal energy and therefore of reducing the number of semiconductor cut-off components. This document further discloses that the thermal energy released by the switches is here dissipated towards the outside of the device by conduction along the electrical phase conductors. For example, the thermal energy is mainly dissipated by conduction and by radiation by the conductive parts towards the outside of the device.For the dissipation of thermal energy by conduction, the entire phase current flow chain inside the circuit breaker is concerned, i.e. all the electrical conductors, power supply cables and electrical conduction lines which allow the flow of phase current from upstream to downstream of the device. However, in this solution the power supply cables or electrical braids used on the phase electrical conduction lines do not have optimal thermal conduction properties and also involve tedious and meticulous assembly operations, particularly with the conductive plates. This . document does not indicate how the interface between the connection terminals and the conductive plates is made and seems to require tedious assembly operations which degrade the performance in thermal extraction by conduction.

[0005] The present invention aims to overcome at least one of these drawbacks and aims to propose an alternative solution to the known prior art having a limited impact on the material of the housing and making it possible to facilitate the assembly of the electronic cut-off protection device and thus to optimize the overall impedance of the protection device.

[0006] To this end, the invention relates to an electronic cut-off protection device comprising at least:

[0007] - a case,

[0008] - a phase current line between a first phase connection terminal and a second phase connection terminal, the first / second phase connection terminal comprising a conductive part comprising at least one contact portion configured to come into contact with a supply conductor of the network or of a load,

[0009] - an electronic cut-off unit comprising at least one electronic component power cut-off device arranged on said phase current line,

[0010] - an electronic protection trigger comprising at least one unit of control coupled to said electronic cut-off unit configured to control the opening of said at least one electronic power cut-off component in the event of a fault occurring,

[0011] - at least one heat sink made of conductive material,

[0012] the electronic cut-off protection device is characterized in that:

[0013] - the conductive part of the first phase connection terminal is extended by a phase conductive portion forming on the one hand a first part of the phase current line and on the other hand a heat sink, the conductive part and the phase conductive portion forming a single-piece conductive part,

[0014] - the phase conductive portion being electrically and thermally connected to said electronic cut-off unit so as to dissipate the heat coming from said at least one electronic power cut-off component at least by thermal conduction and to conduct the current coming from said electronic cut-off unit and / or to said electronic cut-off unit.

[0015] The invention will be better understood from the following description, which relates to several preferred embodiments, given as non-limiting examples, and explained with reference to the appended schematic drawings, in which:

[0016] [Fig-1] [Fig.l] represents a perspective and partial view of an apparatus of electronic cut-off protection according to the invention in a first embodiment lization,

[0017] [Fig.2] [Fig.2] represents a front and partial view of the electronic cut-off protection device according to the invention in the first embodiment illustrated in [Fig.l],

[0018] [Fig.3] [Fig.3] represents a perspective, exploded and partial view of the electronic cut-off protection device according to the invention in the first embodiment,

[0019] [Fig.4] [Fig.4] represents a perspective and exploded view of the single-piece conductive part and the electronic cut-off unit of the electronic cut-off protection device according to the invention in the first embodiment,

[0020] [Fig.5] [Fig.5] represents a perspective and partial view of an electronic cut-off protection device according to the invention in a second embodiment

[0021] [Fig.6] [Fig.6] represents a perspective, exploded and partial view of the electronic cut-off protection device according to the invention in the second embodiment illustrated in [Fig.5], and

[0022] [Fig.7] [Fig.7] represents a perspective and exploded view of the single-piece conductive part and the electronic cut-off unit of the electronic cut-off protection device according to the invention in the second embodiment.

[0023] An electronic cut-off protection device comprises at least:

[0024] - a housing 1,

[0025] - a phase current line P between a first phase connection terminal 2 and a second phase connection terminal 3, the first / second phase connection terminal 2, 3 comprising a conductive part 4 comprising at least one contact portion 5 configured to come into contact with a supply conductor of the network or of a load,

[0026] - an electronic cut-off unit 6 comprising at least one electronic component power cut-off electronics 7 arranged on said phase current line P,

[0027] - an electronic protection trip unit comprising at least one unit of control coupled to said electronic cut-off unit 6 configured to control the opening of said at least one electronic power cut-off component 7 in the event of the occurrence of a fault,

[0028] - at least one heat sink 8 made of conductive material.

[0029] According to the invention, the electronic cut-off protection device is characterized in that:

[0030] - the conductive part 4 of the first phase 2 connection terminal is extended by a phase conductive portion 9 forming on the one hand a first part of the phase current line P and on the other hand a heat sink 8, the conductive part 4 and the phase conductive portion 9 forming a single-piece conductive part 10,

[0031] - the phase conductive portion 9 being electrically and thermally connected to said electronic cut-off unit 6 so as to dissipate the heat coming from said at least one electronic power cut-off component 7 at least by thermal conduction and to conduct the current coming from said electronic cut-off unit 6 and / or to said electronic cut-off unit 6.

[0032] Advantageously, the conductive part 4 of the first phase 2 connection terminal incorporates a phase conductive portion 9 which is electrically and thermally interfaced with the electronic cut-off unit 6 comprising said at least one electronic power cut-off component 7 of the phase P current line. No connection by means of an electrical cable or electrical braid is used to connect the first phase 2 connection terminal to the heat sink 8 formed by the phase conductive portion 9. The conductive part 4 and the phase conductive portion 9 are in fact in the form of a single-piece conductive part 10.This results in a reduction in the number of parts and therefore a simplification of the assembly operations of the electronic cut-off protection device as well as an improvement in thermal conduction along the phase P current line and a limitation of the number of electrical junctions between the constituent parts of the phase P current line and consequently an optimization of the overall impedance of the protection device.

[0033] It will be noted that the phase conductive portion 9 can allow the flow of electric current in the direction from the second phase connection terminal 3 to the first phase connection terminal 2 or in the direction from the first phase connection terminal 2 to the second phase connection terminal 3.

[0034] It will also be noted that the phase conductive portion 9 makes it possible to evacuate the heat coming from said at least one electronic power cut-off component 7 towards the first phase connection terminal 2 by thermal conduction. In summary, in this configuration according to the invention, the evacuation of the heat is carried out at least by thermal conduction in the single-piece conductive part 10 towards the first phase connection terminal 2.

[0035] Preferably, the phase conductive portion 9 is electrically and thermally connected to said electronic cut-off unit 6 without conductive braid or conductive cable.

[0036] Advantageously, the thermal conduction of the heat coming from said unit of electronic cut-off 6 to the phase conductive portion 9 is carried out without an intermediary and is therefore improved. The assembly operations of the electronic cut-off protection device are also simplified and the overall impedance of the protection device is further improved.

[0037] Preferably, according to a possibility not illustrated, the phase conductive portion 9 is electrically and thermally connected to said electronic cut-off unit 6 by forming at least one direct electrical and thermal contact with said at least one electronic power cut-off component 7.

[0038] This configuration makes it possible to minimize the thermal resistance between the electronic power cut-off component 7 and the phase conductive portion 9.

[0039] For example, in this case, if the electronic power cut-off component 7 comprises a dissipating element, then the latter will be in direct contact with the phase conductive portion 9 to thus form a direct electrical and thermal contact.

[0040] Preferably and as illustrated in particular in figures 3, 4, 6 and 7, the phase conductive portion 9 is electrically and thermally connected to said electronic cut-off unit 6 without direct electrical and thermal contact with said at least one electronic power cut-off component 7.

[0041] Advantageously, this preferred configuration has the advantage of not requiring direct contact between the phase conductive portion 9 and said at least one electronic power cut-off component 7, this results in greater freedom of design of the electronic cut-off unit 6, since the phase conductive portion 9 does not necessarily have to be in the immediate vicinity of the electronic power cut-off component 7. Furthermore, this configuration makes it possible to use electronic power cut-off components 7 which comprise a dissipating element configured to be towards the second face 14 of the electronic card 12 to be electrically connected thereto.

[0042] For example, in this case, if the electronic power cut-off component 7 comprises a dissipating element, then the latter will not be in direct contact with the phase conductive portion 9, thus forming an indirect electrical and thermal contact; on the contrary, the phase conductive portion 9 will be electrically and thermally connected to the electronic power cut-off component 7 via an intermediate element preferably forming part of said electronic cut-off unit 6, connected both to the phase conductive portion 9 and to the electronic power cut-off component 7.

[0043] Preferably and as illustrated in the figures, said electronic cut-off unit 6 comprises at least one electronic card 12 comprising a first face 13 and a second face 14 opposite the first face 13 and said electronic cut-off unit 6 comprises a first assembly E1 of at least one electronic component of power cut-off 7 on said phase current line P mounted on the first face 13 or the second face 14 and a second assembly E2 of at least one electronic power cut-off component 7 on said phase current line P mounted on the first face 13 or the second face 14 and electrically connected head-to-tail to said at least one electronic power cut-off component 7 of the first assembly E1.

[0044] Advantageously, thanks to this arrangement of the present invention it is possible to place said at least one electronic power cut-off component 7 of the first assembly E1 and said at least one electronic power cut-off component 7 of the second assembly E2 either on the same face 13, 14 of the electronic card 12 (figures 1 to 4), or on the opposite faces 13, 14 of the electronic card 12 (figures 5 to 7).

[0045] Preferably and as shown in particular in figures 3, 4, 6 and 7, said at least one electronic power cut-off component 7 of the first assembly El is mounted on the second face 14 and comprises a dissipating element oriented against the second face 14, the phase conductive portion 9 comprises a contact interface 15 which is arranged opposite the first face 13, against the latter and being aligned with said at least one electronic power cut-off component 7 of the first assembly El and is electrically and thermally connected to the electronic card 12 without direct electrical and thermal contact with said at least one electronic power cut-off component 7 of the first assembly El.

[0046] Advantageously, in this configuration it is not necessary for the phase conductive portion 9 to be mounted on the same face of the electronic card 12 as said at least one electronic power cut-off component 7 of the first assembly E1 to establish the electrical and thermal connection between the phase conductive portion 9 and said at least one electronic power cut-off component 7 of the first assembly E1.

[0047] Preferably and as shown in particular in Figures 1 to 4, said at least one electronic power cut-off component 7 of the second assembly E2 is mounted on the second face 14 while being adjacent to said at least one electronic power cut-off component 7 of the first assembly E1 and comprises a dissipating element oriented against the second face 14.

[0048] Advantageously, in this case said at least one electronic power cut-off component 7 of the first assembly E1 and said at least one electronic power cut-off component 7 of the second assembly E2 are mounted on the same face, namely the second face 14.

[0049] Preferably and as shown in particular in Figures 5 to 7, the electronic cut-off protection device comprises an additional phase conductive plate additional 11 forming on the one hand a second part of the phase current line P and on the other hand a heat sink 8, the additional phase conductive plate 11 being electrically and thermally connected to said electronic cut-off unit 6 so as to dissipate the heat coming from said at least one electronic power cut-off component 7 of the second assembly E2 at least by thermal conduction and to conduct the current to said electronic cut-off unit 6 coming from the second phase connection terminal 3, if the phase conductive portion 9 is electrically connected to said electronic cut-off unit 6 so as to conduct the current coming from said electronic cut-off unit 6.

[0050] In this configuration, the electronic cut-off protection apparatus is configured to allow the flow of electric current in the direction from the second phase connection terminal 3 to the first phase connection terminal 2 via the additional phase conductive plate 11 which is configured to conduct the electric current coming from the second phase connection terminal 3 to the electronic cut-off unit 6 and via the phase conductive portion 9 which is configured to conduct the electric current coming from the electronic cut-off unit 6 to the conductive part 4 of the first phase connection terminal 2.Furthermore, the phase conductive portion 9 makes it possible to evacuate the heat coming from said at least one electronic power cut-off component 7 of the first assembly E1 to the first phase connection terminal 2 by thermal conduction and the additional phase conductive plate 11 makes it possible to evacuate the heat coming from said at least one electronic power cut-off component 7 of the second assembly E2 to the second phase connection terminal 3 by thermal conduction. In summary, in this configuration, the heat is evacuated by thermal conduction in the single-piece conductive part 10 to the first phase connection terminal 2 and in the additional phase conductive plate 11 to the second phase connection terminal 3.Furthermore, it is not necessary for the additional phase conductive plate 11 to be mounted on the same face of the electronic card 12 as said at least one electronic power cut-off component 7 of the second set E2 to establish the electrical and thermal connection between the additional phase conductive plate 11 and said at least one electronic power cut-off component 7 of the second set E2.

[0051] Alternatively, the electronic cut-off protection device comprises an additional phase conductive plate 11 forming on the one hand a second part of the phase current line P and on the other hand a heat sink 8, the additional phase conductive plate 11 being electrically and thermally connected only to said electronic cut-off unit 6 so as to dissipate the heat coming from said at least one electronic power cut-off component 7 of the second assembly E2 at least by thermal conduction and to conduct the current coming from said electronic cut-off unit 6, if the phase conductive portion 9 is electrically connected to said electronic cut-off unit 6 so as to conduct the current coming from the first phase connection terminal 2.

[0052] In this alternative configuration, not shown, the electronic cut-off protection apparatus is configured to allow the flow of electric current in the direction from the first phase connection terminal 2 to the second phase connection terminal 3 via the phase conductive portion 9 which is configured to conduct the electric current coming from the conductive part 4 of the first phase connection terminal 2 to the electronic cut-off unit 6 and via the additional phase conductive plate 11 which is configured to conduct the electric current coming from the electronic cut-off unit 6 to the second phase connection terminal 3.Furthermore, as in the previously described variant, the phase conductive portion 9 makes it possible to evacuate the heat coming from said at least one electronic power cut-off component 7 of the first assembly E1 to the first phase connection terminal 2 by thermal conduction and the additional phase conductive plate 11 makes it possible to evacuate the heat coming from said at least one electronic power cut-off component 7 of the second assembly E2 to the second phase connection terminal 3 by thermal conduction. Furthermore, it is not necessary for the additional phase conductive plate 11 to be mounted on the same face of the electronic card 12 as said at least one electronic power cut-off component 7 of the second assembly E2 to establish the electrical and thermal connection between the additional phase conductive plate 11 and said at least one electronic power cut-off component 7 of the second assembly E2.

[0053] Preferably and as shown in particular in Figures 5 to 7, said at least one electronic power cut-off component 7 of the second assembly E2 is mounted on the first face 13 and comprises a dissipating element oriented against the first face 13, the additional phase conductive plate 11 comprises an additional contact interface 16 which is arranged opposite the second face 14, against the latter and being aligned with said at least one electronic power cut-off component 7 of the second assembly E2 and is electrically connected to the electronic card 12 without direct electrical and thermal contact with said at least one electronic power cut-off component 7 of the second assembly E2.

[0054] Advantageously, in this case, said at least one electronic power cut-off component 7 of the first assembly E1 and said at least one electronic component of power cut-off 7 of the second set E2 are mounted in opposition, respectively on the second face 14 and on the first face 13.

[0055] Preferably and as shown in particular in figures 3, 4, 6 and 7, the first face 13 is conductive and is electrically and thermally connected to the second conductive face 14, the first conductive face 13 being in direct electrical and thermal contact with the contact interface 15 of the phase conductive portion 9 so as to indirectly connect it electrically and thermally to said at least one electronic power cut-off component 7 of the first assembly E1 mounted on the second face 14.

[0056] Advantageously, in this way, it is possible to avoid having to resort to a connection by means of an electric cable or electric braid to establish the electrical and thermal connection between the phase conductive portion 9 and said at least one electronic power cut-off component 7 of the first assembly E1.

[0057] Preferably and as shown in particular in figures 6 and 7, the second face 14 is conductive and is electrically and thermally connected to the first conductive face 13, the second conductive face 14 being in direct electrical and thermal contact with the additional contact interface 16 of the additional phase conductive plate 11 so as to indirectly connect it electrically and thermally to said at least one electronic power cut-off component 7 of the second assembly E2 mounted on the first face 13.

[0058] Advantageously, this avoids having to resort to a connection by means of an electric cable or electric braid to establish the electrical and thermal connection between the additional phase conductive plate 11 and said at least one electronic power cut-off component 7 of the second assembly E2.

[0059] Preferably and as shown in particular in figures 1 to 3 and 5 and 6, the electronic cut-off protection apparatus further comprises a galvanic isolation mechanism comprising a first set of contacts with a first fixed contact 17 and a first movable contact 18 arranged on the phase current line in series with said at least one electronic power cut-off component 7 upstream or downstream of the phase conductive portion 9.

[0060] The galvanic isolation mechanism makes it possible to isolate the electronic cut-off protection apparatus, in particular after the opening of said at least one electronic power cut-off component 7 following the appearance of a fault, by interrupting the flow of current on the phase current line P.

[0061] Preferably, the single-piece conductive part 10 is made of metal and preferably copper or aluminum.

[0062] Preferably, said at least one electronic power cut-off component 7 comprises at least one power transistor and preferably at least one MOSFET and / or a JFET and / or an IGBT.

[0063] The housing 1 preferably has a generally parallelepiped shape with a first main face 19 and a second main face (not visible), and lateral faces, respectively rear 20, upper 21, lower 22, front 23 extending from one to the other of the first and second main faces 19 and with a width, that is to say the gap between the first and second main faces, equal to an integer number of times a predetermined distance, called module generally worth approximately 18 millimeters.

[0064] Thanks to this advantageous arrangement, the format of the housing 1 is modular and this results in a modular electronic cut-off protection device.

[0065] The electronic cut-off protection device shown in Figures 1 to 3 has a width of one module, while that shown in Figures 5 and 6 has a width of two modules. These examples are not limiting.

[0066] The electronic cut-off protection device may comprise a phase P current line, in which case it is said to be unipolar, or several phase P current lines, in which case it is said to be multipolar.

[0067] Figures 1 to 3 illustrate a single-pole electronic cut-off protection device.

[0068] The electronic cut-off protection device may further comprise a neutral current line. Figures 5 and 6 illustrate an electronic cut-off protection device with a phase P current line and a neutral current line.

[0069] The electronic cut-off protection device can be a circuit breaker or perform a differential circuit breaker protection function, but also other functionalities, for example current and voltage measurement, protection against electric arc faults in the installation.

[0070] When the electronic cut-off protection device performs a differential circuit breaker protection function, it preferably comprises a differential current sensor for detecting differential fault type faults and which is connected to the control unit. The differential current sensor is capable and intended at least to measure the differential current flowing between said at least one phase P current line and the neutral current line and to emit an acquisition signal representative of the image of the differential current between the phase P current line and the neutral current line. The differential current sensor makes it possible to detect differential faults.

[0071] The first phase 2 connection terminal may be a screw cage terminal or a self-clamping cage terminal or the like. In the examples illustrated in the figures the first phase 2 connection terminal is a screw clamp terminal. automatic spring type and is arranged inside the housing 1 near the upper side face 21.

[0072] The second phase connection terminal 3 may be a screw cage terminal or a self-tightening terminal or the like. In the examples illustrated in the figures, the second phase connection terminal 3 is a mixed self-tightening cage and screw type terminal and is arranged inside the housing 1 near the lower side face 22.

[0073] In the case of a first self-tightening connection terminal 2 illustrated in the figures, the conductive part 4 comprises an elastically deformable metal part which makes it possible to clamp at least one supply conductor of the network or of a load at the contact portion 5. In the examples illustrated in the figures, this elastically deformable metal part comprises two elastic branches joining together. The conductive part 4 is arranged inside the housing 1 near the upper lateral face 21.

[0074] The control unit (not shown) of the electronic protection trip device is electrically connected to the electronic cut-off unit 6. The control unit and the electronic cut-off unit 6 are arranged inside the housing 1. For example, the control unit may comprise at least one microcontroller and at least one power driver.

[0075] The control unit and the electronic cut-off unit 6 may respectively comprise one or more electronic cards. The control unit and the electronic cut-off unit 6 could alternatively comprise a single electronic card comprising said microcontroller and said power driver and said at least one electronic power cut-off component 7. In the examples illustrated in the figures, the electronic cut-off unit 6 and the control unit are not grouped on the same electronic card, but on two separate electronic cards electrically and mechanically connected to each other, only the electronic card 12 is shown.

[0076] In this case, the electronic cut-off unit 6 comprises the electronic card 12 on which said at least one electronic power cut-off component 7 is mounted and preferably integrated. The electronic card 12 is preferably parallel to the first and second main faces 19 of the housing 1 and extends in the length direction between the first and second connection terminals 2, 3 and in the width direction between the rear lateral face 20 and the front lateral face 23. In the examples illustrated in the figures, the electronic card 12 is preferably arranged at least partly opposite the second main face.

[0077] The first set E1 of electronic power cut-off component 7 and the second set E2 of electronic power cut-off component 7 are preferably connected in series, for example head to tail, on the phase P current line.

[0078] In the illustrated examples, the first assembly E1 and the second assembly E2 each comprise two electronic power cut-off components 7. These examples are not limiting. The first assembly E1 comprises at least two electronic power cut-off components 7 in the same direction and mounted in parallel. The second assembly E2 comprises at least two electronic power cut-off components 7 in the same direction and mounted in parallel.

[0079] The dissipating element of the electronic power cut-off component 7 is generally made of metal and is connected to an electrode of the electronic power cut-off component 7 and is fixed on a preferably molded ceramic or plastic body of the electronic power cut-off component 7.

[0080] The dissipating element (not shown) of the electronic power cut-off component 7 is generally made of metal, for example anodized aluminum.

[0081] It can be fixed on a ceramic or plastic body, preferably molded, of the electronic power cut-off component 7.

[0082] In this case, the dissipating element may be in the form of a metal plate, corresponding to the drain of the electronic power cut-off component 7, which is arranged opposite an insulated face. Depending on the types of electronic power cut-off components 7, the drain may also perform an electrical connection function with an attached dissipating element described below. This may for example be the case when the drain is located at the face of the electronic power cut-off component 7, which may be the upper face, not resting against one of the faces 13, 14 of the electronic card 12. However, when the drain is located on the face of the electronic power cut-off component 7, which may be the lower face, which rests on one of the faces 13, 14 of the electronic card 12, the drain does not perform an electrical connection function with an attached dissipating element.

[0083] Alternatively, the dissipating element may be a separate part and attached to the electronic power cut-off component 7 and in particular not corresponding to the drain. The dissipating element may in this case be in the form of a part provided with a plurality of fins. Either this dissipating element is not in electrical contact with the drain of the electronic power cut-off component 7 and is mounted on the insulated face, or this dissipating element may be in electrical contact with the drain of the electronic power cut-off component 7. As a result, in this variant, the drain must be located at the face of the electronic power cut-off component 7 not resting against one of the faces 13, 14 of the electronic card 12.

[0084] The phase conductive portion 9 forming a heat sink 8 can be preferably present in the form of a flat part or flat plate. Preferably, the flat part or flat plate is arranged in the housing 1 parallel to the first and second main faces 19 and to the electronic card 12. In addition, the flat part or flat plate is arranged opposite one of the first and second faces 13, 14 of the electronic card 12 and opposite one of the first and second main faces 19 of the housing 1. In the examples illustrated, the flat plate is arranged in the housing 1 opposite the first face 13 of the electronic card 12 and opposite the first main face 19 of the housing 1.

[0085] The phase conductive portion 9 is located in the extension of the contact portion 5 of the first connection terminal 2.

[0086] A single-piece conductive part 10 is understood to mean a part formed in one piece, for example by folding or stamping, for example, a preferably metallic conductive part. In other words, the preferably conductive contact portion 5 and the phase conductive portion 9 are not two distinct and separate parts, there is no junction by mechanical connection between two distinct parts and which would be formed between the contact portion 5 and the phase conductive portion 9.

[0087] The additional phase conductive plate 11 forming a heat sink 8 may preferably be in the form of an additional flat part or flat plate. Preferably, the additional flat part or flat plate is arranged in the housing 1 parallel to the first and second main faces 19 and to the electronic card 12. Furthermore, the additional flat part or flat plate is arranged opposite one of the first and second faces 13, 14 of the electronic card 12 and opposite one of the first and second main faces 19 of the housing 1. In the examples illustrated, the additional flat plate is arranged in the housing 1 opposite the second face 14 of the electronic card 12 and opposite the first main face 19 of the housing 1.

[0088] The first face 13 of the electronic card 12 may comprise a conductive layer (not shown) which is in direct contact on the one hand with the contact interface 15 and on the other hand with said at least one electronic power cut-off component 7 of the first EL assembly. This conductive layer may consist of a solder material.

[0089] The second face 14 of the electronic card 12 may comprise an additional conductive layer (not shown) which is in direct contact on the one hand with the additional contact interface 16 and on the other hand with said at least one electronic power cut-off component 7 of the second assembly E2. This conductive layer may consist of a solder material.

[0090] The first fixed contact 17 is preferably mounted on the electronic card 12. As illustrated in FIGS. 1 to 4, the first fixed contact 17 is mounted protruding from the second face 14. The first fixed contact 17 may consist of a 90-degree curved metal plate having a general L shape, the longer portion of which is mounted on the second face 14 and the shorter portion of which is orthogonal to the second face 14.

[0091] Alternatively, the first fixed contact 17 is preferably part of the additional phase conductive plate 11, as illustrated in Figures 5 to 7.

[0092] The first movable contact 18 can be actuated by a control member of the lever type 24. This lever 24 preferably projects from the front lateral face 23.

[0093] Figures 1 to 7 illustrate two examples in which the phase conductive portion 9 is electrically and thermally connected to said electronic cut-off unit 6 without direct electrical and thermal contact with said at least one electronic power cut-off component 7.

[0094] Figures 1 to 4 illustrate a first embodiment according to the invention in which the modular electronic cut-off protection device has a width of one module and is single-pole. The flow of the electric current is in the direction going from the second phase connection terminal 3 to the first phase connection terminal 2 and the modular electronic cut-off protection device comprises a galvanic isolation mechanism comprising the first set of contacts with the first fixed contact 17 and the first movable contact 18 arranged on the phase current line in series with the electronic power cut-off components 7 upstream of the phase conductive portion 9.

[0095] Figures 1 to 4 show that the electronic cut-off unit 6 comprises a single electronic card 12 with the first assembly E1 having two electronic power cut-off components 7 on said phase current line P mounted on the second face 14 and the second assembly E2 having two electronic power cut-off components 7 on said phase current line P mounted on the second face 14. The two electronic power cut-off components 7 of the second assembly E2 are electrically connected in series in a head-to-tail manner with the two electronic power cut-off components 7 of the first assembly E1 and are next to the latter. The two electronic power cut-off components 7 of the first assembly E1 and of the second assembly E2 each comprise a dissipating element (not visible) oriented against the second face 14.The first fixed contact 17 is mounted on the electronic card 12 while protruding from the second face 14.

[0096] Figures 3 and 4 show that the contact interface 15 of the phase conductive portion 9 is arranged opposite the first face 13, against the latter and being aligned with the two electronic power cut-off components 7 of the first assembly El and is electrically and thermally connected to the electronic card 12 without direct electrical and thermal contact with the two electronic power cut-off components 7 of the first assembly El.

[0097] Figures 5 to 7 illustrate a second embodiment according to the invention in which the modular electronic cut-off protection device has a width of two modules and comprises a phase current line and a neutral current line. The flow of the electric current is in the direction going from the second phase connection terminal 3 to the first phase connection terminal 2 and the modular electronic cut-off protection device comprises a galvanic isolation mechanism comprising the first set of contacts with the first fixed contact 17 and the first movable contact 18 arranged on the phase current line in series with the electronic power cut-off components 7 upstream of the phase conductive portion 9.

[0098] Figures 5 to 7 show that the electronic cut-off unit 6 comprises a single electronic card 12 with the first assembly E1 having two electronic power cut-off components 7 on said phase current line P mounted on the second face 14 and the second assembly E2 having two electronic power cut-off components 7 on said phase current line P mounted on the first face 13. The two electronic power cut-off components 7 of the second assembly E2 are electrically connected in series in a head-to-tail manner with the two electronic power cut-off components 7 of the first assembly E1. The two electronic power cut-off components 7 of the first assembly E1 and of the second assembly E2 each comprise a dissipating element (not visible) oriented respectively against the second face 14 and the first face 13.The modular electronic cut-off protection device comprises the additional phase conductive plate 11 forming on the one hand the second part of the phase current line P and on the other hand another heat sink 8. The additional phase conductive plate 11 is on the one hand downstream of the first set of contacts of the galvanic isolation mechanism and on the other hand upstream of the electronic cut-off unit 6. The first fixed contact 17 is part of the additional phase conductive plate 11, .

[0099] Figures 6 and 7 show that the contact interface 15 of the phase conductive portion 9 is arranged opposite the first face 13, against it and being aligned with the two electronic power cut-off components 7 of the first assembly E1 and is electrically and thermally connected to the electronic card 12 without direct electrical and thermal contact with the two electronic power cut-off components 7 of the first assembly E1. The additional contact interface 16 of the additional phase conductive plate 11 is arranged in facing the second face 14, against it and being aligned with the two electronic power cut-off components 7 of the second set E2 and is electrically connected to the electronic card 12 without direct electrical and thermal contact with the two electronic power cut-off components 7 of the second set E2.

[0100] Of course, the invention is not limited to the embodiments described and shown in the attached drawings. Modifications remain possible, in particular from the point of view of the constitution of the various elements or by substitution of technical equivalents, without departing from the scope of protection of the invention.

Claims

Claims

1. Electronic cut-off protection apparatus comprising at least: - a housing (1), - a phase current line (P) between a first phase connection terminal (2) and a second phase connection terminal (3), the first / second phase connection terminal (2, 3) comprising a conductive part (4) comprising at least one contact portion (5) configured to come into contact with a supply conductor of the network or of a load, - an electronic cut-off unit (6) comprising at least one electronic power cut-off component (7) arranged on said phase current line (P), - an electronic protection trip unit comprising at least one control unit coupled to said electronic cut-off unit (6) configured to control the opening of said at least one electronic power cut-off component (7) in the event of a fault occurring, - at least one heat sink (8) made of conductive material,the electronic cut-off protection apparatus is characterized in that: - the conductive part (4) of the first phase connection terminal (2) is extended by a phase conductive portion (9) forming on the one hand a first part of the phase current line (P) and on the other hand a heat sink (8), the conductive part (4) and the phase conductive portion (9) forming a single-piece conductive part (10), - the phase conductive portion (9) being electrically and thermally connected to said electronic cut-off unit (6) so as to dissipate the heat coming from said at least one electronic power cut-off component (7) at least by thermal conduction and to conduct the current coming from said electronic cut-off unit (6) and / or to said electronic cut-off unit (6).,

2. Electronic cut-off protection apparatus according to claim 1, characterized in that the phase conductive portion (9) is electrically and thermally connected to said electronic cut-off unit (6) without conductive braid or conductive cable.

3. Electronic cut-off protection apparatus according to claim 1 or claim 2, characterized in that the phase conductive portion (9) is electrically and thermally connected to said electronic cut-off unit (6) by forming at least one direct electrical and thermal contact with said at least one electronic power cut-off component (7).

4. Electronic cut-off protection apparatus according to claim 1 or claim 2, characterized in that the phase conductive portion (9) is electrically and thermally connected to said electronic cut-off unit (6) without direct electrical and thermal contact with said at least one electronic power cut-off component (7).

5. Electronic cut-off protection apparatus according to any one of claims 1 to 4, characterized in that said electronic cut-off unit (6) comprises at least one electronic card (12) comprising a first face (13) and a second face (14) opposite the first face (13) and in that said electronic cut-off unit (6) comprises a first assembly (El) of at least one electronic power cut-off component (7) on said phase current line (P) mounted on the first face (13) or the second face (14) and a second assembly (E2) of at least one electronic power cut-off component (7) on said phase current line (P) mounted on the first face (13) or the second face (14) and electrically connected head-to-tail to said at least one electronic power cut-off component (7) of the first assembly (El).

6. Electronic cut-off protection apparatus according to claims 4 and 5, characterized in that said at least one electronic power cut-off component (7) of the first assembly (El) is mounted on the second face (14) and comprises a dissipating element oriented against the second face (14), the phase conductive portion (9) comprises a contact interface (15) which is arranged opposite the first face (13), against the latter and being aligned with said at least one electronic power cut-off component (7) of the first assembly (El) and is electrically and thermally connected to the electronic card (12) without direct electrical and thermal contact with said at least one electronic power cut-off component (7) of the first assembly (El).

7. Electronic cut-off protection apparatus according to claim 6, characterized in that said at least one electronic component of power cut-off (7) of the second assembly (E2) is mounted on the second face (14) adjacent to said at least one electronic power cut-off component (7) of the first assembly (El) and comprises a dissipating element oriented against the second face (14).

8. Electronic cut-off protection apparatus according to claim 6, characterized in that it comprises an additional phase conductive plate (11) forming on the one hand a second part of the phase current line (P) and on the other hand a heat sink (8), the additional phase conductive plate (11) being electrically and thermally connected to said electronic cut-off unit (6) so as to dissipate the heat coming from said at least one electronic power cut-off component (7) of the second assembly (E2) at least by thermal conduction and to conduct the current to said electronic cut-off unit (6) coming from the second phase connection terminal (3), if the phase conductive portion (9) is electrically connected to said electronic cut-off unit (6) so as to conduct the current coming from said electronic cut-off unit (6).

9. Electronic cut-off protection apparatus according to claim 6, characterized in that it comprises an additional phase conductive plate (11) forming on the one hand a second part of the phase current line (P) and on the other hand a heat sink (8), the additional phase conductive plate (11) being electrically and thermally connected to said electronic cut-off unit (6) so as to dissipate the heat coming from said at least one electronic power cut-off component (7) of the second assembly (E2) at least by thermal conduction and to conduct the current coming from said electronic cut-off unit (6), if the phase conductive portion (9) is electrically connected to said electronic cut-off unit (6) so as to conduct the current coming from the first phase connection terminal (2).

10. Electronic cut-off protection apparatus according to claim 8 or claim 9, characterized in that said at least one electronic power cut-off component (7) of the second assembly (E2) is mounted on the first face (13) and comprises a dissipating element oriented against the first face (13), the additional phase conductive plate (11) comprises an additional contact interface (16) which is arranged opposite the second face (14), against the latter and being aligned with said at least one electronic power cut-off component (7) of the second assembly (E2) and is electrically connected to the electronic card (12) without direct electrical and thermal contact with said at least one electronic power cut-off component (7) of the second assembly (E2).

11. Electronic cut-off protection apparatus according to any one of claims 6 to 10, characterized in that the first face (13) is conductive and is electrically and thermally connected to the second conductive face (14), the first conductive face (13) being in direct electrical and thermal contact with the contact interface (15) of the phase conductive portion (9) so as to indirectly connect it electrically and thermally to said at least one electronic power cut-off component (7) of the first assembly (El) mounted on the second face (14).

12. Electronic cut-off protection apparatus according to any one of claims 10 to 11, characterized in that the second face (14) is conductive and is electrically and thermally connected to the first conductive face (13), the second conductive face (14) being in direct electrical and thermal contact with the additional contact interface (16) of the additional phase conductive plate (11) so as to indirectly connect it electrically and thermally to said at least one electronic power cut-off component (7) of the second assembly (E2) mounted on the first face (13).

13. Electronic cut-off protection apparatus according to any one of claims 1 to 12, characterized in that it further comprises a galvanic isolation mechanism comprising a first set of contacts with a first fixed contact (17) and a first movable contact (18) arranged on the phase current line in series with said at least one electronic power cut-off component (7) upstream or downstream of the phase conductive portion (9).

14. Electronic cut-off protection device according to any one of claims 1 to 13, characterized in that the single-piece conductive part (10) is made of metal and preferably copper or aluminum.

15. Electronic cut-off protection apparatus according to any one of claims 1 to 14, characterized in that said at least one electronic power cut-off component (7) comprises at least one power transistor and preferably at least one MOSFET and / or one JFET and / or one IGBT.

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