Interconnection device, manufacturing process and associated aircraft

Abstract

An interconnection device (1) for interconnecting at least two electronic boards (50), the device comprising a body (10) made of at least one polymer material and a plurality of electrically conductive tracks (20) extending from a first face of said body (10) to a second face of the body (10). According to the invention, the interconnection device (1) comprises a first connector (41) fixedly mounted on the first face of the body (10) and a second connector (42) fixedly mounted on the second face of the body (10), the first connector (41) being in electrical contact with the electrically conductive tracks (20) and being intended to be connected to a first electronic board (51), and the second connector (42) being in electrical contact with the electrically conductive tracks (20) and being intended to be connected to a second electronic board (52). Method for manufacturing such an interconnection device (1). Associated aircraft. FIGURE FROM THE ABRIDGED: Fig. 1.

Description

Title of the invention: Interconnection device, manufacturing method and associated aircraft

[0001] The present invention relates to an interconnection device intended to interconnect at least two electronic boards.

[0002] The present invention also relates to a method for manufacturing such a device.

[0003] The present invention also relates to an aircraft comprising such a device. BACKGROUND OF THE INVENTION

[0004] In the aeronautical field, electronic enclosures are subjected to increasingly demanding environments. Consequently, the volume allocated to electronic components must be limited, and the heat emanating from these various components must be dissipated as much as possible. Furthermore, electronic enclosures may incorporate unconventional structures, requiring the electronic components within such an enclosure to adapt to the shapes of these structures.

[0005] Current techniques consist of using a housing and at least one backplane. By definition, a backplane is a card or frame on which several connectors are available for connecting other cards.

[0006] These backplanes are unfortunately of a large volume and, moreover, require the use of very specific flexible-rigid cards.

[0007] However, flexible-rigid cards occupy a significant volume, are complex to assemble and are easily subject to vibrations. SUBJECT OF THE INVENTION

[0008] The invention is notably aimed at facilitating the connection of electronic boards to each other. Summary of the invention

[0009] For this purpose, according to the invention, an interconnection device is provided for interconnecting at least two electronic boards, the device comprising a body based on at least one polymer material and a plurality of electrically conductive tracks extending from a first face of said body to a second face of the body.

[0010] According to the invention, the interconnection device comprises a first connector fixedly mounted on the first face of the body and a second connector fixedly mounted on the second face of the body, the first connector being at least in electrical contact with the electrically conductive tracks and being intended to be connected to a first electronic board and the second connector being at least in electrical contact with electrically conductive tracks and intended to be connected to a second electronic board.

[0011] Thus, the invention advantageously allows two electronic boards to be interconnected without the need for connecting wires and / or an additional dedicated electronic board.

[0012] In addition, the invention is compact.

[0013] Moreover, such an interconnection device can be adapted to locations of unconventional shapes.

[0014] Furthermore, such an interconnection device can be adapted so that it and / or at least one of the electronic boards carried by it accommodates one or more large electronic components.

[0015] According to optional features, used individually or in whole or in combination: - the body comprises a first side wall, a second side wall and a base which extends between the first side wall and the second side wall, the first connector being mounted on one face of the first side wall, forming the first face of the body, and the second connector being mounted on one face of the second side wall, forming the second face of the body; - the interconnection device includes at least one electronic component mounted on the base of the body, the electronic component being electrically connected to at least one electrically conductive track; - the base extends so as to form at least one cavity between the first side wall or the second side wall, the electronic component being arranged in the cavity; - the interconnection device comprising an electromagnetic shielding element arranged at least in part on a face of the base opposite that of the base bearing at least part of the electrically conductive tracks; - the face of the base bearing at least part of the electrically conductive tracks is arranged in the cavity; - the body forms a sector of a ring; - the body includes at least one fixing flange intended to fix the interconnection device to a support; - the body presents, in a section perpendicular to the first face and / or the second face, an alternation of crenellations open alternately in a first direction and a second direction, opposed to each other.

[0016] The invention also relates to a method for manufacturing an interconnection device comprising the following steps: - to form the body; - forming a plurality of electrically conductive tracks extending between the first face of the body and the second face of the body; - mount the first connector on the first side of the body and the second connector on the second side of the body.

[0017] The invention also relates to an aircraft comprising an interconnection device.

[0018] Other features and advantages of the invention will become apparent from the following description of particular, non-limiting embodiments of the invention. Brief description of the drawings

[0019] Reference will be made to the attached drawings, among which:

[0020] [Fig-1] [Fig.1] is a perspective view of an interconnection device, according to a first embodiment of the invention;

[0021] [Fig.2] [Fig.2] is a top view of the interconnection device illustrated in [Fig.1];

[0022] [Fig.3] [Fig.3] is a cross-section of the interconnection device illustrated in [Fig.1];

[0023] [Fig.4] [Fig.4] is a diagram of the interconnection device illustrated in [Fig.1], linking electronic boards;

[0024] [Fig.5] [Fig.5] is a side view of the interconnection device illustrated in [Fig.1];

[0025] [Fig.6] [Fig.6] is a perspective view of an interconnection device, according to a second embodiment of the invention;

[0026] [Fig.7] [Fig.7] is a perspective view from below of the interconnection device illustrated in [Fig.6];

[0027] [Fig.8] [Fig.8] is a perspective view of an electronic housing intended to carry an interconnection device illustrated in [Fig.1] or in [Fig.6];

[0028] [Fig. 9] [Fig. 9] is a cross-section of a part used in the manufacture of an interconnecting device illustrated in [Fig. 1] or [Fig. 6]. DETAILED DESCRIPTION OF THE INVENTION

[0029] With reference to figures 1 to 5, an interconnection device 1 according to a first embodiment of the invention will be described.

[0030] The interconnection device 1 comprises a body 10.

[0031] Said body 10 is curved here. More precisely here, the curvature of the body 10 is defined by a center O and a radius of curvature r.

[0032] The body 10 thus extends circumferentially along a direction a.

[0033] The body 10 extends over an angular sector only in its direction circumferential. The body 10 is globally shaped into a sector of a ring. The sector of the ring extends circumferentially between two longitudinal ends of the body 10.

[0034] Preferably, the body 10 comprises a base 22 extending along the circumferential direction a.

[0035] Preferably, the base 22 is not flat and thus has a raised portion 11 which extends radially outwards from the rest of the base 22. More precisely, the raised portion 11 extends radially outwards, along a radial axis [3, from the rest of the base 22. The raised portion 11 extends here over the entire length of the base 22 (length considered along the circumferential direction a).

[0036] Preferably, the raised portion 11 is a central raised portion 11. More precisely, said raised portion 11 is centered on the rest of the base 22 along an axial direction X.

[0037] The raised portion 11 is here generally shaped into a dome. The raised portion 11 thus comprises a first side 12, a second side 13 and a roof 14. The roof 14 and the sides 12 and 13 extend circumferentially over the entire length of the base.

[0038] The sides extend here orthogonally to the roof 14. The roof 14 comprises a first axial end 14.1 and a second axial end 14.2. The first side 12 is orthogonal to the roof 14 and adjoining said first end 14.1 of the roof 14. The second side 13 is itself orthogonal to the roof 14 and adjoining the second end 14.2 of the roof 14. Preferably, the first 12 and second 13 sides are parallel to each other. Preferably, the first side 12 and the second side 13 extend radially from the base 22.

[0039] The first side 12 comprises a first upper end 12.1 (along the radial direction) and a second lower end 12.2 (along the radial direction). The first upper end 12.1 is in contact with the first end 14.1 of the roof 14.

[0040] Similarly, the second side 13 comprises a first upper end 13.1 (along the radial direction) and a second lower end 13.2 (along the radial direction). The first upper end 13.1 is in contact with the second end 14.2 of the roof 14.

[0041] It is therefore understood that here the raised portion 11 has a cross-section (according to a cutting plane including the axial direction X and the radial direction |3) in a crenellated shape.

[0042] The base 22 forms on either side of the raised portion 11 a first floor 15 and a second floor 16.

[0043] The first floor 15 comprises a first axial end 15.1 and a second axial end 15.2, opposite the first end 15.1. The first end 15.1 is adjacent to the second lower end 12.2 of the first flank 12.

[0044] Similarly, the second floor 16 comprises a first axial end 16.1 and a second axial end 16.2, opposite the first end 16.1. The first end 16.1 is adjacent to the second lower end 13.2 of the second flank 13.

[0045] Furthermore, the body 10 comprises a first lateral wall and a second lateral wall. The first lateral wall and the second lateral wall extend, respectively, the first floor 15 and the second floor 16. The first lateral wall and the second lateral wall extend, for example, parallel to each other. Hereafter, the first lateral wall will be designated by the term "first border" 17 and the second lateral wall will be designated by the term "second border" 18. More precisely, the first floor 15 is connected by its second end 15.2 to a lower end 17.1 (in the radial direction) of said first border 17. Similarly, the second floor 16 is connected by its second distal end 16.2 to a lower end 18.1 (in the radial direction) of said second border 18.

[0046] Preferably, the first border 17 extends radially outwards from the first floor 15. Preferably, the first border 17 is parallel to said first side 12.

[0047] Similarly, the second border 18 extends radially outwards from the second floor 16. Preferably, the second border 18 is parallel to said second flank 13.

[0048] Thus, preferably, the first border 17 and the second border 18 are parallel to each other.

[0049] The first border 17 and the second border 18 here form the axial extremities of the base 22.

[0050] Moreover, the first border 17 and the second border 18 extend circumferentially here over the entire length of the base 22.

[0051] The first border 17 and the second border 18 are here of identical height (height considered according to the radial direction).

[0052] Preferably, the first border 17 and the second border 18 are of a height (along the radial direction) less than that of the raised portion 11 (along the radial direction).

[0053] The first rim 17 comprises a first inner face 17.1, opposite the first flank 12 and a second outer face 17.2, opposite said first inner face 17.1. The second rim 18 similarly comprises a first inner face 18.1 opposite the second flank 13 and a second outer face 18.2, opposite said first inner face 18.1. Said first 17.1, 18.1 and second 17.2, 18.2 faces extend along the entire length of the base 22 (considered in the circumferential direction a) and extend outwards from the base 22 in the radial direction [3. The two outer faces 17.2 and 18.2 are thus connected by the longitudinal ends of the ring sector forming the body 10.

[0054] The assembly formed by the first side 12, the first floor 15 and the first edge 17 forms a first cavity 81. The first cavity 81 extends here circumferentially over the entire length (considered along the circumferential direction a) of the base 22. The first cavity 81 has a cross-section (along a cutting plane comprising the axial direction X and the radial direction |3) in a crenellated shape.

[0055] Similarly, the assembly formed by the second side 13, the second floor 16 and the second vertical portion 18 constitutes a second cavity 82. The second cavity 82 extends circumferentially over the entire length (considered along the circumferential direction a) of the base 22. The second cavity 82 has a cross-section (along a cutting plane comprising the axial direction X and the radial direction |3) in a crenellated shape.

[0056] The first cavity 81 and the second cavity 82 are identical.

[0057] Body 10 thus creates a succession of hollows and bumps. Body 10 creates Therefore, a sinusoid with rounded or unrounded peaks and troughs. Here, body 10 draws a succession of crenellations.

[0058] For example, the body 10 draws a first slot formed by the first cavity 81 turned radially outwards successively followed by a second slot formed by the raised portion 11 turned radially inwards followed successively by a third slot formed by the second cavity 82 turned radially outwards.

[0059] Said body 10 therefore comprises successively (according to the axial direction X) the first edge 17, the first floor 15, the first side 12, the roof 14, the second side 13, the second floor 16 and the second edge 18.

[0060] The base 22 therefore comprises successively (along the axial direction X) the first floor 15, the first side 12, the roof 14, the second side 13, and the second floor 16. The body 10 is, for example, entirely made of a polymer material 30 or is, for example, made of a polymer material 30 combined with one or more non-polymer materials. For example, the body 10 is made of a material A polymer 30 containing at least one additive, such as an organometallic additive. Therefore, the first side 12, the second side 13, the roof 14, the first floor 15, the second floor 16, the first edge 17, and the second edge 18 are made of a polymer material 30. Preferably, the polymer material 30 is a thermoplastic. For example, polyetheretherketone, more commonly known as PEEK, is a thermoplastic. Other thermoplastic materials that could be considered include polyphenylene sulfide, more commonly known as PPS, polyphthalamide, more commonly known as PPA, or liquid crystal polymer, more commonly known as LCP.

[0061] The interconnecting device 1 further comprises a plurality of electrically conductive tracks (hereafter referred to as conductive tracks 20) arranged on the body 10. Preferably, the conductive tracks 20 are deposited on said body 10 by a laser structuring process. The laser structuring process may, for example, be a trademarked LDS (Laser Direct Structuring) process. The conductive tracks 20 are made of an electrically conductive material such as a metallic material. For example, the conductive tracks are made of copper. Preferably, the tracks are made of copper and coated with one or more additional layers. For example, the tracks are made of copper and coated with a layer of nickel (for example, on the order of a few micrometers (pm)), the nickel layer itself coated with a layer of gold (for example, on the order of a few tens of nanometers (nm)).The nickel layer protects the copper and acts as a diffusion barrier. The gold layer, meanwhile, prevents the nickel from oxidizing. Alternatively, or in addition, at least one of the tracks could be silver and / or silver ink-based and / or carbon ink and / or copper ink, etc.

[0062] Furthermore, each conductive track 20 here traces a line formed by a succession of straight segments. Preferably, and as more clearly seen in [Fig. 2], each conductive track 20 extends over the entire width of the body 10 (width considered along the axial direction X). Preferably, each conductive track 20 extends from the second outer face 17.2 of the first vertical edge 17 to the second outer face 18.2 of the second edge 18, while resting on all the aforementioned elements contained within the body 10. It is therefore understood that for a given conductive track 20, said track comprises at least successively a first segment extending along the second outer face 17.2, a second connecting segment extending along the first inner face 17.1, a third segment extending along the first floor 15, and a fourth segment extending along the first side 12, a fifth segment extending along the roof 14, a sixth segment extending along the second side 13, a seventh segment extending along the second floor 16, an eighth segment extending along the first inner face 18.1, a ninth segment extending along the second outer face 18.2.

[0063] The different conductive tracks are thus arranged next to each other so as to form successively a row of conductive tracks extending one after the other in the circumferential direction.

[0064] The different segments of the tracks thus extend parallel to each other for the same group of given segments.

[0065] Here, one of the conductive tracks 20 has a significant thickness. By "significant," we mean that the conductive track 20 has a thickness greater than 20 micrometers (µm), for example, greater than 40 µm and, for example, greater than 60 µm. The conductive track 20 may optionally have a thickness between 60 and 80 µm. More precisely, the conductive track 20 preferably has a thickness between 65 and 75 µm. Such a conductive track 20 can thus allow the transmission of a data signal through it, but also the transmission of a power signal through it. Indeed, such a track will be less prone to heating up during the transmission of a power signal.

[0066] Thus, the body 10 is made of polymer material 30 and conductive tracks 20 made of metal rest on its surface.

[0067] The interconnection device 1 also includes at least two connectors 40. The connectors 40 are mounted on the body 10 to interconnect, at least electrically, at least two electronic boards (printed circuit board type) with each other. The connectors 40 are, for example, soldered onto the body 10. For example, a SAC305 solder joint can be made (SAC305 being a lead-free alloy containing (by mass) 96.5% tin, 3% silver, and 0.5% copper) and / or a SAC105 solder joint (SAC105 being a low-temperature, lead-free alloy) and / or an Sn60Pb40 solder joint (Sn60Pb40 being a lead alloy containing (by mass) 60% tin and 40% lead). Preferably, each of the connectors 40 is formed into a strip comprising a plurality of connection elements.Each connecting element here forms a female insertion point for a male connecting element belonging either to the electronic board to be inserted into the associated connector, or to an additional connector mounted on the electronic board. Each connecting element thus forms an insertion hole for a pin of an electronic board or an additional connector. The connecting elements may be identical or different within the same 40 connector and / or from one 40 connector to another.

[0068] Preferably, the interconnection device 1 comprises a first connector 41 and a second connector 42. Here, the first 41 and second 42 connectors are identical. Preferably, the first 41 and second 42 connectors extend longitudinally in a straight line. Preferably, the first 41 and second 42 connectors extend longitudinally parallel to an axis C, which is orthogonal to the axial direction X. The connectors 40 are of a length (along the axis C) that is less than or equal to that of the body 10 (along the circumferential direction). The various connection elements of a given connector are arranged in one or more lines, preferably parallel to each other and / or parallel to the axis C.

[0069] The first connector 41 is carried here by the first border 17 and the second connector 42 is carried here by the second border 18.

[0070] The first connector 41 extends laterally from the first border 17 in the opposite direction to the second border 18. The first connector 41 extends laterally parallel to the axial direction X.

[0071] The second connector 42 extends laterally from the second border 18 in the opposite direction to the first border 17. The second connector 42 extends laterally parallel to the axial direction X.

[0072] The first connector 41 comprises a first inner face 41.1 and a second outer face 41.2. Similarly, the second connector 42 comprises a first inner face 42.1 and a second outer face 42.2.

[0073] Thus, the first inner face 41.1 of the first connector 41 is mounted on the second outer face 17.2 of the first rim 17. In the same way, the first inner face 42.1 is mounted on the second outer face 18.2 of the second rim 18.

[0074] It is thus understood that the two connectors 41 and 42 are arranged so as to extend transversely across the conductive tracks 20. Preferably, each connector 41 and 42 extends over a greater length than the succession of conductive tracks. All the conductive tracks are thus covered (at each of their axial ends) by one of the connectors 41 and 42 respectively.

[0075] More specifically, at least one of the connecting elements of the first connector 41 and at least one of the connecting elements of the second connector 42 are opposite at least one of the conductive tracks 20. More specifically, said connecting elements of the first 41 and second 42 connectors are each in contact with one of the conductive tracks 20. Preferably, each conductive track 20 is in contact, at one of its ends, with one of the connecting elements of the first connector 41 and, at the other of its ends, with one of the connecting elements of the second connector 42. Thus the said connection elements are electrically connected to each other via the said conductive track.

[0076] Preferably, all the connecting elements of the first connector 41 and all the connecting elements of the second connector 42 are opposite at least one of the conductive tracks 20 (as seen in [Fig. 5], Figures 1 and 4 being simplified for clarity). More precisely, all the connecting elements of the first 41 and second 42 connectors are in contact with at least one of the conductive tracks 20. Thus, all the connecting elements of the first connector 41 are at least electrically connected to one of the respective connecting elements of the second connector 42 via one of the conductive tracks, and vice versa.

[0077] Preferably, the width of a conductive track (along the circumferential direction) is related to at least one dimension of the connecting element it contacts. For example, said width is identical to at least said dimension. For example, said width is identical to the diameter of the hole forming said connecting element.

[0078] Preferably the width of a conductive track is defined according to the value of the electric current which must pass through said track.

[0079] As seen in [Fig.4], the device is arranged to interconnect at least two electronic boards 51, 52. The first connector 41 is thus connected to a first electronic board 51. In the same way, the second connector 42 is connected to a second electronic board 52. This connection is made, for example, by means of the cooperation of the male and female parts described above.

[0080] Thanks to the connectors 41, 42 and the conductive tracks 20 linking together the connection elements of said connectors 41, 42, the two electronic boards 51, 52 are thus interconnected with each other at least electrically.

[0081] When connected, the electronic cards 51, 52 preferably extend parallel to each other. When connected, the electronic cards 51, 52 preferably extend parallel to the sides 12 and 13. When connected, the electronic cards 51, 52 extend outside the body on either side of it.

[0082] Device 1 thus makes it possible to connect the electronic cards 51, 52 without encroaching excessively on their active working surface.

[0083] We have seen that the body 10 has a particular shape. The particular shape of said body 10 advantageously allows the two electronic boards 51, 52 to be interconnected (at least electrically) while providing spaces that can accommodate one or more other elements between them. Indeed, the body 10 has, in particular, two cavities that allow elements to be arranged between the electronic boards. Advantageously, said elements are arranged between the electronic boards 51 and 52 without being electrically connected to said electronic boards 51, 52.

[0084] By "element" is meant, for example, at least one electronic component, at least one mechanical part, at least one additional electronic board, or any other element arranged between the at least two electronic boards 51, 52. More precisely, an "element" can thus be housed in one of the first cavity 81 or the second cavity 82. In other words, an "element" can be housed in a slot formed by one of the first cavity 81 or the second cavity 82.

[0085] Device 1 thus makes it possible to connect the electronic cards 51, 52 while bypassing the other elements in order in particular not to encroach or very little on their active working surface.

[0086] Device 1 thus allows other elements to be arranged in the cavities 81, 82 which will not be connected to the electronic boards 51 and 52. Thus, optionally, an element arranged in the first cavity 81 and an element arranged in the second cavity 82 can be connected to each other via device 1 without being connected to the electronic boards 51 and 52.

[0087] In [Fig.4], it has thus been proposed, by way of non-limiting example, to install a first element which is housed at least partially in the first cavity 81 and a second element which is housed at least partially in the second cavity 82. The first element and the second element are for example electronic boards which extend for example parallel to the electronic boards 51 and 52 interconnected by the interconnection device 1.

[0088] Therefore, the interconnecting device 1 allows a third electronic card 53 and a fourth electronic card 54 to be interconnected. Here, the third electronic card 53 is housed in the first cavity 81 and the fourth electronic card 54 is housed in the second cavity 82. When connected, the electronic cards 53 and 54 preferably extend parallel to each other. When connected, the electronic cards 53 and 54 preferably extend parallel to the sides 12 and 13. When connected, the electronic cards 53 and 54 extend inside the body 10. For example, the interconnecting device 1 is arranged to allow:

[0089] - a first connection between the first 51 and the second 52 electronic cards, via connectors 41 and 42 and / or the first electrical tracks formed on the body 10, and a second connection between the third 53 and a fourth 54 electronic boards, via connectors arranged in cavities 81 and 82 and / or via second electrical tracks formed on the body 10, the second tracks being electrically independent of the first tracks. The first and second tracks are, for example, arranged on opposite surfaces of the body 10.

[0090] The interconnection device 1 thus described can therefore be called plastronic interconnection device 1 since it involves both plastics engineering and electronics.

[0091] An interconnection device 100 is now described according to a second embodiment of the invention.

[0092] With reference to Figures 6 and 7, the interconnecting device 100 comprises a body 110. Said body 110 comprises a base 111. Said base 111 is here planar. Said base optionally has a rectangular shape. On the one hand, said base 111 extends along its entire length along a first axis Y. On the other hand, said base 111 extends along its entire width along a second axis X, which is orthogonal to the first axis Y. Said base 111 comprises a top face 112, a bottom face 113 opposite the top face 112, and sides 114.1, 114.2, 114.3, and 114.4, collectively designated by reference numeral 114. The four sides 114 are orthogonal to said top face 112 and bottom face 113. Preferably, the four sides 114 are parallel in pairs. Preferably, the top face 112 is parallel to the bottom face 113.

[0093] Said body 110 also includes at least one border bordering the base 111. For example, the body 110 includes a first lower border 115, a second lower border 116, a first upper border 117, and a second upper border 118. Each of the aforementioned borders extends along a third Z-axis, orthogonal to the first Y and second X axes, in line with one of the four sides 114 of the base 111. More precisely, the first lower border 115 extends along the Z-axis in line with side 114.1. Furthermore, the second lower border 116 extends along the Z-axis in line with side 114.3. Preferably, said side 114.1 is parallel to said side 114.3. Consequently, the first lower border 115 is parallel to the second lower border 116.

[0094] The first upper edge 117 can also be referred to as the "first side wall". The second upper edge 118 can also be referred to as the "second side wall". The first side wall and the second side wall extend, for example, in two parallel planes.

[0095] The assembly formed by the base 111 and at least the first upper border 117 and the second upper border 118 thus form an internal cavity 180.

[0096] Similarly, the first upper edge 117 extends along the Z-axis in line with the flank 114.2, flank 114.2 being orthogonal to said flanks 114.1 and 114.3. Furthermore, the second upper edge 118 extends along the Z-axis in line with the flank 114.4, flank 114.4 being orthogonal to said flanks 114.1 and 114.3. Preferably, said flank 114.2 is parallel to said flank 114.4. Consequently, the first upper edge 117 is parallel to the second upper edge 118.

[0097] At least one of the sides 114 includes a fixing flange extending along the Y axis. Preferably, at least one of the sides 114.1, 114.3 includes a flange extending along the Y axis.

[0098] For example, the side 114.1 comprises a first flange 119.1 and a second flange 119.2, extending parallel to each other and / or to the first Y-axis. Similarly, the side 114.3 comprises a third flange 119.3 and a fourth flange 119.4, extending parallel to each other and / or to the first Y-axis. Preferably, each flange is drilled with a hole. Each flange will thus allow the subsequent attachment of the interconnecting device 100 to a support or other element.

[0099] It is noted that the body 110 can comprise at least two flanges. It is noted that at least one flange can be provided on a longitudinal end of the body 110.

[0100] Furthermore, flanges 119.1 and 119.3 extend in line with each other. These flanges are arranged on the same axis, parallel to the first Y axis. Similarly, flanges 119.2 and 119.4 extend in line with each other and are offset from flanges 119.1 and 119.3. These flanges are arranged on the same axis, parallel to the first Y axis.

[0101] The body 110 is, for example, entirely made of a polymer material 130 or is, for example, made of a polymer material 130 with the addition of one or more non-polymer materials. For example, the body 110 is made of a polymer material 130 with the addition of at least one additive such as an organometallic additive.

[0102] Accordingly, the base 111, the first lower edge 115, the second lower edge 116, the first upper edge 117, and the second upper edge 118 are made of or based on said polymer material 130. Preferably, the polymer material 130 is a thermoplastic material. Preferably, the polymer material 130 is a thermoplastic and, for example, Polyetheretherketone, more commonly known as PEEK. Other thermoplastic materials may be considered, such as Polyphenylene Sulfide, more commonly known as PPS, Polyphthalamide, more commonly known as PPA, or Liquid Crystal Polymer, more commonly known as LCP.

[0103] The interconnecting device 100 is also provided with a plurality of electrically conductive tracks (hereafter referred to as conductive tracks 120).

[0104] Preferably, the conductive tracks 120 are deposited on said body 110 by a laser structuring process. The laser structuring process may, for example, be a trademarked LDS ("Laser Direct Structuring") laser direct structuring process. The conductive tracks 120 are made of an electrically conductive material such as a metallic material. For example, the conductive tracks are made of copper. Preferably, the tracks are made of copper and coated of one or more additional layers. For example, the tracks are made of copper and coated with a layer of nickel (for example, on the order of a few micrometers (pm) thick), which is itself coated with a layer of gold (for example, on the order of a few tens of nanometers (nm) thick). The nickel layer protects the copper and acts as a diffusion barrier. The gold layer, in turn, prevents the nickel from oxidizing. Alternatively, or in addition, at least one of the tracks could be made of silver and / or use silver ink and / or carbon ink and / or copper ink, etc.

[0105] Moreover, each conductive track 120 here traces a line formed by a succession of straight segments.

[0106] Preferably each conductive track 120 extends over the entire width of the body 10 (width considered along the second axis X).

[0107] Preferably, the conductive tracks 120 extend at least from the first upper edge 117 to the second upper edge 118 on the inner side of the body. More precisely, the conductive tracks 120 extend from a first outer face 117.1 of the first upper edge 117 to a first outer face 118.1 of the second upper edge 118.

[0108] It is therefore understood that for a given conductive track 120, said track comprises at least successively a first segment extending along the first external face 117.1, a second junction segment extending along the second internal face of the first upper edge 117 (opposite to the first external face 117.1), a third segment extending along the upper face 112, a fourth segment extending along the second internal face of the second upper edge 118 (opposite to the second external face 118.1) and a fifth segment extending along the first external face 118.1.

[0109] The various conductive tracks 120 are thus arranged next to each other so as to form successively a row of conductive tracks extending one after the other along the first axis Y.

[0110] The different segments of the tracks thus extend parallel to each other for the same group of given segments.

[0111] Preferably, at least one of the conductive tracks 120 completely surrounds the body 110. This track then comprises at least a sixth segment extending between the first and fifth segments of the track along the lower face 113. This conductive track 120 is then completely closed. Preferably, the interconnecting device 100 comprises at least two such closed conductive tracks 120. These two tracks 120 form the two end tracks of the row of conductive tracks 120.

[0112] Thus, the body 110 is made of polymer material 130 and conductive tracks 120 made of metal rest on its surface.

[0113] The interconnection device 100 also includes at least two connectors 140. The connectors 140 are mounted on the body 110 to electrically interconnect at least two electronic boards (printed circuit board type) together. The connectors 140 are, for example, soldered onto the body 110. For example, a SAC305 solder joint can be made (SAC305 being a lead-free alloy containing (by mass) 96.5% tin, 3% silver, and 0.5% copper). Preferably, each of the connectors 140 is formed into a strip comprising a plurality of connection elements. For example, a SAC 105 brazing can be carried out (SAC 105 being a lead-free, low-temperature alloy) and / or an Sn60Pb40 brazing can be carried out (Sn60Pb40 being a lead alloy which contains (by mass) 60% tin and 40% lead).Each connecting element here forms a female insertion point for a male connecting element belonging either to the electronic board to be inserted into the associated connector, or to an additional connector mounted on the electronic board. Each connecting element thus forms an insertion hole for a pin of an electronic board or an additional connector. The connecting elements may be identical or different within the same 140 connector and / or from one 140 connector to another.

[0114] Preferably, the interconnection device 100 comprises a first connector 141 and a second connector 142. Preferably, the first 141 and second 142 connectors are identical. Preferably, the first 141 and second 142 connectors extend along their entire length along the first Y axis. Preferably, the first 141 and second 142 connectors extend along their entire width along a third Z axis (orthogonal to the first and second axes).

[0115] The connectors 140 here are of a length (along the first Y axis) that is less than or equal to that of the body 110 (along the first Y axis). The various connection elements of a given connector are arranged in one or more lines, preferably parallel to each other and / or parallel to the first Y axis.

[0116] The first connector 141 is carried here by the first upper border 117 and the second connector 142 is carried here by the second upper border 118 facing it.

[0117] The first connector 141 extends laterally from the first border 117 in the opposite direction to the second border 118. The first connector 141 extends laterally parallel to the second X axis.

[0118] The second connector 142 extends laterally from the second border 118 in the opposite direction to the first border 117. The second connector 142 extends laterally parallel to the second X axis.

[0119] The first connector 141 comprises a first inner face 141.1 and a second outer face 141.2. Similarly, the second connector 142 comprises a first inner face 142.1 and a second outer face 142.2.

[0120] Thus, the first inner face 141.1 of the first connector 141 is mounted on the first outer face 117.1 of the first upper rim 117. In the same way, the first inner face 142.1 is mounted on the first outer face 118.1 of the second upper rim 118.

[0121] It is thus understood that the two connectors 141 and 142 are arranged so as to extend transversely across the conductive tracks 120. Preferably, each connector 141 and 142 extends over a greater length than the succession of conductive tracks 120. All the conductive tracks 120 are thus covered (at each of their longitudinal ends) by respectively one of the connectors 141 and 142.

[0122] More specifically, at least one of the connecting elements of the first connector 141 and at least one of the connecting elements of the second connector 142 are opposite at least one of the conductive tracks 20. More specifically, said connecting elements of the first 141 and second 142 connectors are each in contact with one of the conductive tracks 120. Preferably, each conductive track 120 is in contact, at one of its ends, with one of the connecting elements of the first connector 141 and, at the other of its ends, with one of the connecting elements of the second connector 142. Thus said connecting elements are electrically connected to each other via said conductive track.

[0123] Preferably, all the connecting elements of the first connector 141 and all the connecting elements of the second connector 142 are opposite at least one of the conductive tracks 120 (Figures 6 and 7 are simplified for clarity). More precisely, all the connecting elements of the first 141 and second 142 connectors are in contact with at least one of the conductive tracks 120. Thus, all the connecting elements of the first connector 141 are electrically connected to one of the respective connecting elements of the second connector 142 via one of the conductive tracks, and vice versa.

[0124] Preferably the width of a conductive track (along the first Y axis) is related to at least one dimension of the connecting element that it touches.

[0125] For example, said width is identical to at least said dimension. For example, said width is identical to the diameter of the orifice forming said connecting element. Preferably, the width of a conductive track is defined according to the value of the electric current that must flow through said track.

[0126] The interconnection device 100 is arranged to interconnect at least two electronic boards (not shown here). The first connector 141 is thus intended to be connected to a first electronic board. Similarly, the second connector 142 is intended to be connected to a second electronic board. This connection is made, for example, using the male and female components described above.

[0127] Thanks to the connectors 141, 142 and the conductive tracks 120 linking together the connection elements of said connectors 141, 142, the two electronic boards are thus interconnected with each other at least electrically.

[0128] When connected, the electronic cards preferably extend parallel to each other. When connected, the electronic cards preferably extend parallel to the upper edges 117 and 118 to which they are attached. When connected, the electronic cards extend outside the body on both sides of it.

[0129] The interconnection device 100 thus makes it possible to connect the electronic cards without encroaching excessively on their active working area.

[0130] The upper face 112 of the base 111 also accommodates here at least one electronic component and preferably a plurality of electronic components 160. For example, one of the electronic components 160 may be a "lightning protection" type component, a power supply component, or any other electronic component, even a bulky one.

[0131] More specifically, the electronic components 160 are connected to the conductive tracks 120 of the base 111 of the body 110. The electronic components 160 are, for example, brazed to the conductive tracks 120. For example, a SAC305 braze can be made (SAC305 being a lead-free alloy containing (by mass) 96.5% tin, 3% silver, and 0.5% copper). For example, a SAC 105 braze can be made (SAC 105 being a lead-free, low-temperature alloy), and / or an Sn60Pb40 braze can be made (Sn60Pb40 being a lead alloy containing (by mass) 60% tin and 40% lead).

[0132] The interconnection device 100 thus makes it possible to relocate electronic components initially present on an electronic board to the conductive tracks 120. This makes it possible to free up space on said electronic board and to lighten it.

[0133] Optionally, the interconnection device includes an electromagnetic shielding element 190 which is integrated into said interconnection device 100.

[0134] The electromagnetic shielding element 190 is, for example, formed by a mesh of conductive tracks 120 arranged on an external surface of the body 110, this mesh being also connected to ground. Since the electronic components are housed on an internal surface of the body 110, they are thus protected by the electromagnetic shielding element 190. For example, the internal surface considered is the face upper 112 (internal because surrounded by the different borders) and thus forming a wall of the internal cavity 180. For example, the external surface considered is the lower face 113.

[0135] The interconnection device 100 thus described can therefore be called plastronic interconnection device 100 since it involves both plastics engineering and electronics.

[0136] Fig. 8 illustrates an electronic housing 2.

[0137] Said electronic housing 2 is shaped to be partly curved.

[0138] The electronic housing 2 is thus shaped to fit the shape of a circular body such as an aircraft engine nacelle.

[0139] The electronic housing 2 includes a 200 board.

[0140] The plate 200 is curved here. More precisely here, the plate 200 is defined by a center O' and a radius of curvature r'.

[0141] The plate 200 thus extends circumferentially in a direction a'.

[0142] The plate 200 extends over an angular sector only in its circumferential direction. The plate 200 is globally shaped into a sector of a ring.

[0143] As illustrated in [Fig. 8], a first compartment 201 and a second compartment 202 are provided in the plate. The first compartment 201 is separated from the second compartment 202 by a wall 203 forming an integral part of the plate 200. The two compartments 201 and 202 extend through the plate 200 in an axial direction X. The two compartments 201 and 202 open at their two axial ends on each side of the plate 200.

[0144] The 200 plate is here made of a composite material. The composite material is, for example, a carbon fiber composite material. The composite material has high thermal conductivity. By "high" is meant that the composite material has a thermal conductivity greater than 100 Watts per meter per Kelvin. For this purpose, the fibers of the composite material themselves have a thermal conductivity of between 300 and 800 Watts per meter per Kelvin.

[0145] The electronic housing 2 also includes at least one insert 270. Here, the electronic housing 2 comprises at least two inserts 270. Preferably, each insert 270 is arranged within a compartment. Each compartment can accommodate at least one insert. For example, two inserts are arranged within each compartment. The insert 270 generally forms a frame conforming to the shape of one of the two compartments 201 and 202. Preferably, the insert 270 at least partially surrounds one of the two compartments 201 and 202. For example, the electronic housing 2 includes at least a first insert 270 to at least partially surround the first compartment 201, the first insert here forming a first closed frame 401. Furthermore, the electronic housing includes at least a second insert 270 to at least partially surround the second compartment 202, the second insert here forming a second closed frame 402. Furthermore, at least one of the inserts 270 includes a separating wall 275 arranged to circumferentially divide the associated compartment into at least two sub-compartments (optionally of identical volume).

[0146] The inserts are preferably made of metallic material.

[0147] The electronic housing 2 is thus made up of a hybrid assembly: composite plate / metal inserts.

[0148] The electronic housing 2 also includes at least one of two interconnecting devices 1 or 100, which is attached to the electronic housing 2 by means of fasteners. Preferably, at least one of the two interconnecting devices 1 or 100 is screwed onto the electronic housing 2. For example, at least one of the two interconnecting devices 1 or 100 is attached to the first frame 401 or the second frame 402. The interconnecting device 100 can, in particular, be attached to the first or second frame 402 by means of its flanges 119.1, 119.2, 119.3 and 119.4.

[0149] Preferably, at least two interconnection devices (1 and / or 100) are positioned in one of the compartments 201, 202, said two devices being separated by the separating wall 275 of the insert framing the associated compartment. Preferably, at least two interconnecting devices (1 and / or 100) are positioned in the first compartment 201 and at least two other interconnecting devices (1 and / or 100) are positioned in the second compartment 202, said two devices being respectively separated by the separating wall 275 of the first insert 270 and by the separating wall 275 of the second insert 270. For example, each compartment includes an interconnecting device 1 and an interconnecting device 100. For example, in the circumferential direction, an interconnecting device 1 is followed by an interconnecting device 100 which is itself followed by an interconnecting device 1, etc.

[0150] The inserts 270 thus allow the said compartments to be reinforced. Furthermore, the interconnection devices 1, 100 described above are preferably fixed to the inserts so that they can be secured to the electronic housing 2. In addition, said inserts 270 facilitate the transfer of heat from the interconnection devices 1, 100 (heat from the electronic components carried by said interconnection devices 1, 100) to the plate 200 of the electronic housing 2.

[0151] At least one of the two interconnection devices 1 or 100 is arranged to interconnect a first electronic board to a second electronic board (not visible in [Fig.8]).

[0152] Such a case thus proves to be simple in structure and / or assembly.

[0153] In addition, such a housing exhibits good resistance to vibration and / or temperature and / or thermomechanical stresses.

[0154] One possible method for designing the interconnecting device 1 or 100 optionally includes the following steps: - Body 10 or 110 is made from at least one thermoplastic material. This step involves forming a "body" (or substrate) from or based on at least one polymer material. For example, the blank is made by injection molding, machining, or additive manufacturing (step 1). - The conductive tracks 20, 120 are then deposited on the body 10 or 110 (step 2). The tracks are for example manufactured using a catalytic or autocatalytic bath and for example a copper bath and then drawn for example by engraving. - A first connector is mounted on one face of body 10 or 110 and a second connector is mounted on a second face of body 10 or 110 (step 3). The interconnection device 1 or 100 is thus obtained at the end of this step 3.

[0155] With reference to [Fig. 9], and as already indicated, the thickness of one or more conductive tracks 20 or 120 can be increased to allow the passage of higher currents. Thus, some conductive tracks can be thickened during the manufacture of the interconnecting device 1 or 100.

[0156] To this end, the aforementioned process may include an additional step of reinforcing at least a portion of the conductive tracks 20 and 120 already manufactured. Such a step may include, for example, the following phases: - Body 10 or 110 is immersed in a bath containing metal ions (phase 1). The body 10 or 110 is connected to the negative terminal of a generator (phase 2) at the conductive tracks to be thickened. An electrode, composed of the metal to be deposited on the conductive tracks 20 or 120, is connected to the positive terminal of the generator. Preferably, a reinforcement strip 300 is used to reinforce all the conductive tracks 20 and 120 whose thickness is to be increased simultaneously. The reinforcement strip 300 is formed from an electrically conductive band connecting all the conductive tracks 20 and 120 together. The reinforcement strip is, for example, formed on one of the edges of the body 10 or 110. The reinforcement strip 300 is preferably formed concurrently with the conductive tracks. - The flow of current in the bath via the generator causes the migration of ions from the electrode metal from the anode to the cathode (phase 3) causing the simultaneous thickening of the targeted conductive tracks 20 or 120. - The 300 manifold is then removed (for example by machining) in order to make independent the different tracks which were connected to the tracks of the manifold.

[0157] Regardless of the embodiment and the manufacturing process, the interconnection device and / or the housing incorporating it may be carried by an aircraft. For example, the interconnection device and / or the housing may be arranged at the level of one of the aircraft's engines.

[0158] This application is of course not limiting and the interconnection device and / or the housing may be arranged in another location on the aircraft or on another vehicle or may be used in any other application.

[0159] Of course, the invention is not limited to the embodiments described but encompasses any variant falling within the scope of the invention as defined by the claims.

[0160] In particular, the shape of the body may differ from that illustrated in the figures. For example, the body of the first embodiment may have fewer or more hollows and / or peaks. The body of the second embodiment may have a different number of top and / or bottom edges or may have only edges of the same height. The connectors may be arranged on edges other than the top edges (the conductive tracks then being arranged accordingly).

[0161] Similarly, other forms of electronic housing can be envisaged.

[0162] In particular, instead of being brazed, the connectors and components can be glued using a conductive adhesive.

[0163] Furthermore, the LDS process has been mentioned, but other processes can be used, such as other laser structuring processes or other processes like the LSCA (Laser Structuring Chemical Activation) process, also called LMD (Laser Metal Deposition), or jet jetting, and for example, aerosol jet printing, etc. For example, the deposition of conductive tracks can be carried out via jet jetting, or with a technology combining the projection of conductive elements and adhesion to a surface using a laser, or with a technology that pre-forms the tracks during the injection step, or with machining, or with a post-injection laser depositing a metallic catalyst (for example, palladium) which then allows the conductive track to be depositioned by chemical metallization, etc.

[0164] Other manufacturing processes than those indicated may therefore be used.

[0165] The two embodiments may be combined. The device of the first embodiment may thus have at least one conductive track running around its body, as in the first embodiment. At least one of the tracks of the device according to the first embodiment may carry at least one electronic component, as in the second embodiment, and / or at least one additional element may be arranged between the two electronic boards carried by the device according to the second embodiment, as in the first embodiment.

[0166] Although here the interconnecting device is attached to and fixed on the electronic housing, the interconnecting device may be an integral part of the electronic housing and thus form a single piece with it. For example, the body of said device will be formed jointly with the plate 200 of the electronic housing 2. In this way, the body and the plate will form a single piece. The body will then preferably be made of the same material as the plate, and for example, a composite material.

[0167] For example, the manufacturing process will then include the following steps: - Manufacture the body and then position it in a preform of the casing, said preform being dry (step 1). - Inject a resin into and / or onto the preform (step 2). - Polymerize the resin (step 3).

[0168] A trace electrically interconnecting two cards may, at a minimum, allow the passage of signals from one card to another. By increasing its thickness and / or width, such a trace may also allow the passage of a power signal from one card to another.

[0169] Regardless of the embodiment considered, at least one of the conductive tracks may have a high thickness. Alternatively, regardless of the embodiment considered, the body may not have a high-thickness track.

[0170] Although here it has been proposed to fix an element A to an element B by screwing, other means of fixing may be considered such as fixing by gluing and for example by epoxy glue.

[0171] Optionally, the body of the interconnecting device made of a polymer material may also include an additive, in particular an organometallic compound when the tracks are formed by a direct laser structuring process.

[0172] Furthermore, it should be noted that the electrical component can be connected between two different tracks or between two different sections of the same track.

[0173] Here, the base of the interconnecting device extends transversely between two walls.

Claims

Demands

1. An interconnecting device (1, 100) for interconnecting at least two electronic boards (50), the device comprising a body (10, 110) made of at least one polymer material and a plurality of electrically conductive tracks (20, 120) extending from a first face of said body (10, 110) to a second face of the body (10, 110), characterized in that the interconnecting device (1, 100) comprises a first connector (41, 141) fixedly mounted on the first face of the body (10, 110) and a second connector (42, 142) fixedly mounted on the second face of the body (10, 110), the first connector (41, 141) being at least electrically in contact with the electrically conductive tracks (20, 120) and being intended to be connected to a first electronic board (51) and the second connector (42, 142) being at least in electrical contact with the electrically conductive tracks (20, 120) and being intended to be connected to a second electronic board (52).

2. Interconnection device (1, 100) according to claim 1, wherein the body (10, 110) comprises a first side wall, a second side wall and a base (22, 111) which extends between the first side wall and the second side wall, the first connector (41, 141) being mounted on one face of the first side wall, forming the first face of the body (10, 110), and the second connector (42, 142) being mounted on one face of the second side wall, forming the second face of the body (10, 110).

3. Interconnection device (1, 100) according to claim 2, wherein the interconnection device (1, 100) comprises at least one electronic component (160) mounted on the base (22, 111) of the body (10, 110), the electronic component (160) being electrically connected to at least one electrically conductive track (20, 120).

4. Interconnection device (1, 100) according to claim 3, wherein the base (22, 111) extends so as to form at least one cavity (81, 82, 180) between the first side wall and the second side wall, the electronic component being arranged in the cavity (81, 82, 180).

5. An interconnection device (100) according to any one of claims 2 to 4, comprising an electromagnetic shielding element (190) arranged at least partially on one face of the base (111) opposite to that of the base carrying at least part of the electrically conductive tracks (120).

6. Interconnection device (1, 100) according to claim 4 and claim 5, wherein the face of the base carrying at least a portion of the electrically conductive tracks (20, 120) is arranged in the cavity (81, 82, 180).

7. Interconnection device (1) according to any one of the preceding claims, wherein the body (10) forms a ring sector.

8. Interconnection device (1, 100) according to any one of the preceding claims, wherein the body (10, 110) includes at least one fixing flange for fixing the interconnection device (1, 100) to a support.

9. Interconnection device (1) according to any one of the claims, wherein the body (10) has, in a section perpendicular to the first face and / or the second face, an alternation of slots open alternately in a first direction and a second direction, opposite to each other.

10. A method for manufacturing an interconnection device (1, 100) according to any one of the preceding claims, comprising the following steps: - forming the body (10, 110); - forming a plurality of electrically conductive tracks (20, 120) extending between the first face of the body and the second face of the body; - mounting the first connector (41, 141) on the first face of the body (10, 110) and the second connector (42, 142) on the second face of the body (10, 110).

11. Aircraft comprising an interconnection device according to any one of claims 1 to 9.

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