Method for manufacturing or determining a multilayer substrate for an elastic wave device
FR3162098A1Pending Publication Date: 2025-11-14SOITEC SA
5 Cites 0 Cited by
Patent Information
- Application Number
- FR2024004856
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-11-14
Abstract
The invention relates to a method for manufacturing or determining a multilayer substrate for an elastic wave device comprising at least one transducer (19) and operating with an elastic wave having a shear wavelength λ and preferably with a frequency below 1 GHz, in particular with a frequency between 500 MHz and 1 GHz, the multilayer substrate comprising a piezoelectric layer (3), a dielectric layer (5), and a base substrate (7), the piezoelectric layer (3) in particular being lithium tantalate LiTaO3 (LTO), the dielectric layer (5) being silicon dioxide (SiO2), and the base substrate (7) being a silicon substrate, in particular silicon Si(100) or Si(111), comprising steps for determining, for a predetermined operating wavelength, the thickness hLTO of the piezoelectric layer (3) and / or hSiO2 of the dielectric layer (5). Fig. 1
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Process for transferring a thin layer to a support substrate that have different thermal expansion coefficients
WO2019002080A1
Method for transferring a piezoelectric layer onto a support substrate
WO2019186032A1
Elastic wave device
CN117674759A
Acoustic wave device
US20240007081A1
Method for manufacturing an elastic surface wave device
WO2023232562A1