Cooling device
The cooling device addresses uneven cooling in data center servers by using separate heat transfer fluid paths and heat exchangers to ensure each server is efficiently cooled, reducing temperature disparities and enhancing thermal performance.
Patent Information
- Authority / Receiving Office
- FR · FR
- Patent Type
- Patents
- Current Assignee / Owner
- VALEO SYST THERMIQUES SAS
- Filing Date
- 2024-07-22
- Publication Date
- 2026-06-19
Smart Images
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Abstract
Description
Title of the invention: Cooling device
[0001] The present invention relates to a cooling device for at least two electronic devices, in particular two data center servers.
[0002] It is known to cool electronic devices, particularly data center servers, by immersing them in a dielectric fluid. When cooling two electronic devices, the overall cooling is limited by the electronic device that is less well cooled and therefore the one that heats up the most.
[0003] The present invention aims in particular to allow relatively homogeneous cooling of the two electronic devices by reducing the temperature differences within the dielectric fluid in which the servers are immersed.
[0004] To this end, the present invention relates to a cooling device for at least two electronic devices, in particular two data center servers, the cooling device comprising: - a watertight receptacle comprising at least two separate electronic device slots, each configured to receive one of the electronic devices, and configured to receive dielectric fluid intended to immerse the electronic devices, at least partially; - at least one first plate-type heat exchanger configured to define a sealed receptacle bottom, the first heat exchanger comprising a channel network configured to circulate a heat transfer fluid so as to cool the dielectric fluid contained in the sealed receptacle, the channel network comprising at least a first heat transfer fluid path and a second heat transfer fluid path, the first heat transfer fluid path being dedicated to circulation of the heat transfer fluid in relation to the first electronic device location, and the second heat transfer fluid path being dedicated to circulation of the heat transfer fluid in relation to the second electronic device location, - in particular at least one second heat exchanger connected to at least one of the first heat transfer fluid paths and the second heat transfer fluid paths of the first heat exchanger, in particular downstream of it, and configured to cool a component of one of the electronic devices, for example by direct contact between the second heat exchanger and that component.
[0005] The terms "the first or second heat transfer fluid path being dedicated to circulating the heat transfer fluid in relation to the first or second electronic device location" mean, in particular, that at least 70%, or even at least 80% or at least 90%, of the heat transfer fluid path passes in relation to the associated electronic device location, and at most a minimal portion, preferably no portion, of this heat transfer fluid path passes in relation to the other electronic device location. In other words, the first heat transfer fluid path serves primarily to cool the dielectric fluid in the first electronic device location, and the second heat transfer fluid path serves primarily to cool the dielectric fluid in the second electronic device location.
[0006] In the invention, the dielectric fluid is the thermal intermediary between the electronic device, which is a heat source, and the first plate-type heat exchanger.
[0007] According to one aspect of the invention, the first and second heat transfer fluid paths are separate, so that these paths can cool the electronic devices independently. Thus, the paths serve to cool only the associated electronic device, and not the other electronic device. These paths are not arranged in series, one after the other in the direction of the heat transfer fluid flow, which would be detrimental because the heat transfer fluid path would then be already heated in the first location before reaching the second location.
[0008] The invention thus enables relatively homogeneous cooling of the two electronic devices by reducing temperature differences within the dielectric fluid in which the servers are immersed. The invention allows these fluid paths to operate thermally at their maximum cooling capacity.
[0009] For example, in the case where the electronic devices are servers, the dielectric fluid cools the server as a whole and the second heat exchanger is used to cool, for example, the central processor (or CPU) of the server's motherboard, for example by direct contact between the second heat exchanger and the central processor.
[0010] According to one aspect of the invention, the second heat exchanger is of the plate type.
[0011] According to one aspect of the invention, the channel network comprises at least one bifurcation from which the first heat transfer fluid path and the second heat transfer fluid path originate.
[0012] Advantageously the first heat transfer fluid path and the second heat transfer fluid path are arranged in parallel from the bifurcation.
[0013] According to one aspect of the invention, the first heat transfer fluid path and the second heat transfer fluid path have separate fluid outlets.
[0014] Alternatively, the first heat transfer fluid path and the second heat transfer fluid path join at an outlet junction point, in particular connected to a common fluid outlet.
[0015] Advantageously the first heat transfer fluid path and the second heat transfer fluid path are arranged in parallel between the bifurcation and an outlet junction point, in particular connected to a fluid outlet of the enclosure.
[0016] Thus the first heat transfer fluid path and the second heat transfer fluid path form parallel, and distinct, fluid paths between the bifurcation and the outlet junction point.
[0017] According to one aspect of the invention, the channel network comprises a fluid inlet and two fluid outlets.
[0018] According to one aspect of the invention, the first heat transfer fluid path and the second heat transfer fluid path are each connected to at least one second heat exchanger.
[0019] According to one aspect of the invention, the first heat transfer fluid path and the second heat transfer fluid path both connect to a fluidic connection element which brings the heat transfer fluid to the respective second heat exchangers.
[0020] According to one aspect of the invention, the second heat exchanger comprises two coolers, in particular of the plate type, configured to cool, for example, two central processors (or CPUs) of the server motherboard, for example by direct contact between these coolers and the central processors.
[0021] According to one aspect of the invention, these coolers are in particular arranged in series.
[0022] According to one aspect of the invention, the first heat transfer fluid path and the second heat transfer fluid path have a mirror symmetry with respect to a plane of symmetry passing through a median line of the first heat exchanger.
[0023] According to one aspect of the invention, the cooling device is configured for mounting the electronic devices in the sealed receptacle, with a space between the first heat exchanger and these electronic devices. Thus, the space can be filled with dielectric fluid.
[0024] According to one aspect of the invention, the cooling device comprises elements for raising the electronic devices configured to fix the electronic devices in the sealed receptacle in an elevated manner. This creates the space between the electronic devices and the bottom of the receptacle.
[0025] According to another aspect of the invention, at least one of the first heat transfer fluid path and the second heat transfer fluid path is formed by a channel of the channel network, a channel which is serpentine in shape.
[0026] According to one aspect of the invention, the first heat transfer fluid path and the second heat transfer fluid path are each formed by a serpentine-shaped channel.
[0027] According to one aspect of the invention, the coil may include one, two, three, or more bends, in particular 180-degree bends.
[0028] According to one aspect of the invention, at least one of the first heat transfer fluid path and the second heat transfer fluid path is formed by a single channel.
[0029] According to one aspect of the invention, the channel network comprises a conveying channel configured to convey heat transfer fluid from a fluid inlet to the second heat transfer fluid path, this conveying channel preferably extending outside of the first location and the second location with electronic device.
[0030] According to one aspect of the invention, the conveying channel is upstream of the second heat transfer fluid path and is configured to bring heat transfer fluid to the second heat transfer fluid path without passing through the first electronic device location.
[0031] According to one aspect of the invention, the serpentine heat transfer fluid path leads to a fluidic connection element to which the second heat exchanger is connected.
[0032] Thus, the heat transfer fluid path of the first heat exchanger is in series with the second heat exchanger. In other words, the heat transfer fluid, after traveling through the heat transfer fluid path in the first heat exchanger, passes into the second heat exchanger via this fluid connection element.
[0033] According to another aspect of the invention, the channel network comprises a first group of channels which defines the first heat transfer fluid path and a second other group of channels which defines the second heat transfer fluid path.
[0034] According to one aspect of the invention, the first group of channels and the second group of channels are connected to each other by a fluid conveying channel.
[0035] According to one aspect of the invention, the fluid delivery channel extends on at least one side of the sealed receptacle.
[0036] According to one aspect of the invention, the conveying channel extends over at least a portion of a perimeter of the sealed receptacle.
[0037] According to one aspect of the invention, the fluid conveying channel comprises a first section, in particular straight, configured to supply the first group of channels with heat transfer fluid.
[0038] According to one aspect of the invention, the first section connects to a second section which extends in particular transversely to the first section.
[0039] According to one aspect of the invention, the second section connects to a third section which is notably parallel to the first section, and which is configured to distribute heat transfer fluid in the second group of channels.
[0040] According to one aspect of the invention, the first group of channels and / or the second group of channels comprise channels parallel to each other.
[0041] According to one aspect of the invention, in the channel group, the parallel channels may be regularly spaced or have an irregular pitch between these parallel channels.
[0042] According to one aspect of the invention, the first group of channels and the second group of channels join an evacuation channel, in particular one which extends in the middle of the sealed receptacle.
[0043] According to one aspect of the invention, the drainage channel is present between the first group of channels and the second group of channels, so that the first group of channels and the second group of channels join this drainage channel on two opposite sides of this drainage channel.
[0044] According to one aspect of the invention, the drainage channel is a central drainage channel.
[0045] According to one aspect of the invention, the discharge channel opens onto a fluidic connection element configured for the connection of one or more second heat exchangers.
[0046] According to another aspect of the invention, the channels in one of the channel groups can be closer together in an area where one of the components of the electronic device that heats up the most is located, for example in an area where the central processor of the server is located.
[0047] This allows for a higher channel density where heat is dissipated most effectively within the electronic device. In other words, the channel spacing within the channel group is reduced at the location of the components that generate the most heat, for example, the central processing units of motherboards.
[0048] According to one aspect of the invention, the channel network comprises a plurality of channels which connect to a fluid conveying channel, in particular of rectilinear or straight shape.
[0049] According to another aspect of the invention, the plurality of channels comprises channels which define the first heat transfer fluid path and other channels which define the second heat transfer fluid path.
[0050] According to one aspect of the invention, the channels which leave from the fluid conveying channel can be parallel to each other, and extend parallel to the locations with electronic device.
[0051] In other words, these parallel channels pass under a single location with an electronic device, and these channels are not transverse to these locations so that they do not cross these two locations one after the other.
[0052] Thus each channel which comes from the routing channel cools a single location with electronic device.
[0053] According to one aspect of the invention, the channels originating from the supply channel join a common discharge channel. The supply channel and the common discharge channel are, in particular, parallel to each other.
[0054] According to one aspect of the invention, the discharge channel is connected to a fluidic connection element configured to conduct the heat transfer fluid to the second heat exchanger(s).
[0055] According to one aspect of the invention, the second heat exchanger is connected to at least one of the first heat transfer fluid path and the second heat transfer fluid path of the first heat exchanger, downstream of it, so that the second heat exchanger is in series with the associated heat transfer fluid path.
[0056] Alternatively, the second heat exchanger is fluidly connected to a connection flange configured to supply the second heat exchanger with heat transfer fluid, without passing through the first heat exchanger.
[0057] According to one aspect of the invention, the heat transfer fluid is a single-phase fluid such as glycol water or a dielectric oil, or a two-phase fluid such as a refrigerant like Novec 7000, R1234yf for example.
[0058] The invention further relates to an assembly comprising servers placed in a cooling device as described above.
[0059] According to one aspect of the invention, the assembly includes at least one server cabinet shelf for holding the cooling device with the servers placed inside.
[0060] Other advantages and features will become apparent from the description of several illustrative but not limiting examples of the present invention, as well as from the accompanying drawings in which: - [Fig.1] Fig.1 is a schematic representation, in side view, of a cooling device according to the invention; - [Fig.2] The [Fig.2] is a schematic representation, in side view, of a variant of a cooling device according to the invention; - [Fig.3] The [Fig.3] is a schematic representation of fluid paths of a cooling device according to an embodiment of the invention; - [Fig.4] The [Fig.4] is a schematic representation of fluid paths of a cooling device according to another embodiment of the invention; - [Fig.5] The [Fig.5] is a schematic representation of fluid paths of a cooling device according to yet another embodiment of the invention; - [Fig.6] The [Fig.6] is a schematic representation of fluid paths of a cooling device according to another embodiment of the invention.
[0061] Fig. 1 shows, in side view, an assembly 200 which includes a server cabinet shelf 201 for holding a cooling device 100 which receives servers 1 and 2.
[0062] Servers 1 and 2 include central processors (CPUs) 11 and 12 for server 1 and two central processors 21, 22 for server 2, which are to be cooled.
[0063] As shown in Figures 1 and 3, the cooling device 100 consists of a sealed receptacle 110 comprising two separate compartments. A first compartment 121 receives server 1, and a second compartment 122 receives server 2. Dielectric fluid 30 is present in the enclosure 110 to immerse servers 1 and 2.
[0064] The cooling device 100 includes a first heat exchanger 4 which defines a bottom 112 of the sealed receptacle 110 and allows the servers 1 and 2 to be cooled at their respective locations 121 and 122. The first heat exchanger 4 includes a network of channels 14 which circulates a heat transfer fluid 35 to cool the dielectric fluid 30 contained in the sealed receptacle 110, as will be explained below.
[0065] The heat transfer fluid 35 is a single-phase fluid such as glycol water or a dielectric oil, or a two-phase fluid such as a refrigerant like Novec 7000, R1234yf for example.
[0066] The cooling device 100 includes raising elements 105 for servers 1 and 2, which fix them in the sealed receptacle 110 in an elevated position. This creates a space 123 between servers 1 and 2 and the bottom 112 of the receptacle 110. This space 123 is filled with dielectric fluid 30.
[0067] The cooling device 100 includes a second heat exchanger 5 which comprises, on the one hand, two coolers 51 and 52 which allow the two central processors 11 and 12 of the server 1 to be cooled by direct contact between the coolers 51 and 52 and the central processors 11 and 12, and on the other hand, two coolers 53 and 54 which allow the central processors 21 and 22 of the server 2 to be cooled, also by direct contact. The two coolers 51 and 52 for server 1 are arranged in series, as are the two coolers 53 and 54 for server 2. Moreover, the coolers 51 and 53 are each fluidically connected in series with the first exchanger 4 so that the heat transfer fluid travels from the first exchanger 4 to the second exchanger 5 and then exits the enclosure through a common outlet 70, as explained below.
[0068] Regarding the heat exchanger 4, the channel network 14 defines a first heat transfer fluid path 41 and a second heat transfer fluid path 42. The first path 41 allows circulation of the heat transfer fluid 35 from the first location 121, while the second path 42 allows circulation of the heat transfer fluid 35 from the second location 122.
[0069] The first path 41 and the second path 42 are separate and cool servers 1 and 2 independently.
[0070] The terms "the first or second heat transfer fluid path being dedicated to circulating the heat transfer fluid in relation to the first or second electronic device location" mean, in particular, that at least 70%, or even at least 80% or at least 90%, of the heat transfer fluid path passes in relation to the associated electronic device location, and at most a minimal portion, preferably no portion, of this heat transfer fluid path passes in relation to the other electronic device location. In other words, the first heat transfer fluid path serves primarily to cool the dielectric fluid in the first electronic device location, and the second heat transfer fluid path serves primarily to cool the dielectric fluid in the second electronic device location.
[0071] The channel network 14 includes a bifurcation 40 from which the first path 41 and the second path 42 originate. The first path 41 and the second path 42 are arranged in parallel from the bifurcation 40 and are each formed by a single channel which includes a serpentine which has three bends at 180 degrees.
[0072] The channel network 14 includes a fluid inlet 45 and two outlets 47 relating to the first path 41 and the second path 42. The first path 41 and the second path 42 are mirror-image with respect to a plane of symmetry that passes through a midline 90 of the first heat exchanger 4. The channel network 14 also includes a conveying channel 43 that conveys heat transfer fluid 35 from fluid inlet 45 to the second path 42. The routing channel 43 is configured to bring heat transfer fluid 35 to the second path 42 without passing through locations 121 and 122 of servers 1 and 2.
[0073] The heat transfer fluid 35, after having traveled through the first fluid path 41 or the second fluid path 42 in the first heat exchanger 4, passes into the second heat exchanger 5 via fluid connection elements 61 and 62 which define the outlets 47 of the first path 41 and the second path 42.
[0074] Then the heat transfer fluid 35 is transported from the cooler 51 to the cooler 52 in order to allow the heat transfer fluid 35 to cool the processor 11 and then the processor 12 of the server 1. Similarly, the heat transfer fluid 35 is transported from the cooler 53 to the cooler 54 in order to cool the processor 21 and then the processor 22 of the server 2.
[0075] Finally, the coolers 52 and 54 are fluidly connected to the common outlet 70 of the cooling device 100.
[0076] In an embodiment of the invention illustrated in [Fig.2], the second heat exchanger 5 (which includes the coolers 51, 52, 53 and 54) is fluidly connected to a connecting flange 19 configured to supply / discharge the second heat exchanger 5 with heat transfer fluid, without passing through the first heat exchanger 4. This connecting flange 19 is further configured to supply the first heat exchanger 4, and discharge the heat transfer fluid that has circulated in this first heat exchanger 4. The first heat exchanger 4 and the second heat exchanger 5 are thus in parallel.
[0077] Figure 4 describes another embodiment of the invention in which the channel network comprises a first group of channels 410 which defines the first path 41 and a second group of channels 420 which defines the second path 42. The first group of channels 410 and the second group of channels 420 comprise channels 411 and 421 respectively parallel to each other.
[0078] The first group of channels 410 and the second group of channels 420 exhibit mirror symmetry with respect to a plane of symmetry which passes through the median line 90.
[0079] The channel groups 410 and 420 are connected to each other by a fluid delivery channel 413. This fluid delivery channel 413 extends along the sides of the sealed receptacle 114. Thus, the fluid delivery channel 413 has a first straight section 431 that supplies the first group of channels 410. This first section 431 connects to a second section 432; these first and second sections 431 and 432 are transverse to each other. The second section 432 connects to a third section 433, which is parallel to the first section 431. The third section 433 distributes heat transfer fluid 35 into the second group of channels 420.
[0080] The first group of channels 410 and the second group of channels 420 join a central drainage channel 416 which extends in the middle of the sealed receptacle 110. This central drainage channel 416 (which is here straight) is present between the first group of channels 410 and the second group of channels 420.
[0081] In particular, the first group of channels 410 and the second group of channels 420 join the central discharge channel 416 on two opposite sides of this discharge channel 416. The central discharge channel 416 opens onto a fluidic connection element 63 for connection with the coolers 51 and 53. The cooler 53 is fluidically connected to the cooler 54, and the cooler 51 is fluidly connected to the cooler 52.
[0082] Finally, the coolers 52 and 54 are connected to the common fluid outlet 70 to convey the heat transfer fluid 35 out of the cooling device 100.
[0083] In this example of an embodiment of [Fig.4], in the group of channels 410 and 420, the parallel channels 411 and 421 are spaced regularly (with a regular pitch).
[0084] Alternatively, in the example of [Fig. 5], the respective channels 411 and 421 of the channel groups 410 and 420 are closer together in an area where the processors 11, 12, 21 and 22 are located. Thus, the spacing between the channels 411 and 421 in the channel groups 410 and 420 is reduced at the location of the processors 11, 12, 21 and 22. This allows for a greater density of channels 411 and 421 where the most heat is dissipated within the electronic device.
[0085] Figure 6 describes another embodiment of the invention in which the channel network comprises two parallel channels 4101 and 4102 which define the first path 41 and two other parallel channels 4201 and 4202 which define the second path 42.
[0086] These channels 4101, 4102, 4201 and 4202, all parallel to each other, originate from a common fluid conveying channel 453, which is straight.
[0087] These channels 4101, 4102, 4201, and 4202 extend into the slots of the processors 11, 12, 21, and 22, at the level of the heat sinks 51, 52, 53, and 54, respectively. The channels 4101, 4102, 4201, and 4202 originating from the routing channel 453 join a common exhaust channel 458. The routing channel 453 and the common exhaust channel 458 are parallel to each other.
[0088] Thus, channels 4101 and 4102 cool location 121 and channels 4201 and 4202 cool location 122.
[0089] The discharge channel 458 is connected to a fluidic connection element 68 which conducts the heat transfer fluid 35 to the coolers 52 and 54. The cooler 52 is fluidically connected in series with the cooler 51, while the cooler 54 is fluidically connected in series with the cooler 53. The heat transfer fluid 35 is therefore transported from the first exchanger 4 to the second exchanger 5, via the fluidic connection element 68, to finally reach the fluidic outlet of the enclosure 70.
Claims
Demands
1. Cooling device (100) for at least two electronic devices (1,2), in particular two data center servers, the cooling device (100) comprising: - a sealed receptacle (110) comprising at least first and second separate electronic device (121, 122) slots (1,2) configured to each receive one of the electronic devices (1, 2), and configured to receive dielectric fluid (30) for immersing, at least partially, the electronic devices (1,2), - at least one first plate-type heat exchanger (4) configured to define a bottom (112) of the sealed receptacle (110), the first heat exchanger (4) comprising a network of channels (14) configured to circulate a heat transfer fluid (35) so as to cool the dielectric fluid (30) contained in the sealed receptacle (110),the channel network (14) comprising at least one first heat transfer fluid path (41) and a second heat transfer fluid path (42), the first heat transfer fluid path (41) being dedicated to circulation of the heat transfer fluid (35) opposite the first location (121) with electronic device (1), and the second heat transfer fluid path (42) being dedicated to circulation of the heat transfer fluid (35) opposite the second location (122) with electronic device (2), - in particular at least one second heat exchanger (5) connected, in particular downstream of the first heat exchanger (4), and configured to cool a component (11, 12, 21, 22) of one of the electronic devices (1, 2), for example by direct contact between the second heat exchanger (5) and this component (11, 12, 21, 22). 21, 22).,
2. Cooling device (100) according to claim 1, wherein the channel network (14) comprises at least one bifurcation (40) from which the first heat transfer fluid path (41) originates and the second heat transfer fluid path (42), and the first heat transfer fluid path (41) and the second heat transfer fluid path (42) are in particular arranged in parallel from the bifurcation (40).
3. Cooling device (100) according to any one of the preceding claims, wherein the first heat transfer fluid path (41) and the second heat transfer fluid path (42) are each connected to at least one second heat exchanger (5), the second heat exchanger (5) comprising in particular two coolers (51, 52, 53, 54), in particular of the plate type, configured to cool, for example, two central processors (or CPUs) of a server motherboard, for example, by direct contact between these coolers (51, 52, 53, 54) and the central processors.
4. Cooling device (100) according to any one of the preceding claims, wherein at least one of the first heat transfer fluid path (41) and the second heat transfer fluid path (42) is formed by a single channel, and in particular at least one of the first fluid path (41) and the second fluid path (42) is formed by a channel of the channel network (14), a channel which is serpentine in shape.
5. Cooling device (100) according to any one of claims 1 to 3, wherein the channel network (14) comprises a first group of channels (410) which defines the first heat transfer fluid path (41) and a second other group of channels (420) which defines the second heat transfer fluid path (42), and the channel groups (410, 420) comprise in particular parallel channels (411, 421).
6. Cooling device (100) according to the preceding claim, wherein the channel groups (410, 420) have an irregular pitch between these parallel channels (411, 421), and the channels (411, 421) in one of the channel groups (410, 420) can be brought closer together in an area where the component (11, 12, 21, 22) of the electronic device (1, 2) that heats up the most is located.
7. Cooling device (100) according to the preceding claim, wherein the first group of channels (410) and the second group of channels (420) join an evacuation channel (416), in particular which extends in the middle of the sealed receptacle (110).
8.
9.
10. Cooling device (100) according to any one of claims 1 to 3, in which the channel network (14) comprises a plurality of channels (4101, 4102, 4201, 4202) which connect to a fluid conveying channel (453), in particular of a straight or upright shape. Cooling device (100) according to the preceding claim, in which the channels (4101, 4102, 4201, 4202) which originate from the fluid path channel (453) are parallel to each other, extend parallel to the locations (121, 122) with electronic device (1, 2), and the channels (4101, 4102, 4201, 4202) originating from the path channel (453) join a common discharge channel (458), the path channel (453) and the common discharge channel (458) being in particular parallel to each other. Assembly (200) comprising servers (1,2) placed in a cooling device (100) according to any one of the preceding claims.