Display panel and driving substrate

Abstract

A display panel and a driving substrate, relating to the technical field of display. The display panel comprises a display area and a peripheral area located on at least one side of the display area. The display panel comprises: a driving substrate comprising a base substrate and a conductive ring embedded on the surface of one side of the base substrate, the conductive ring being located in the peripheral area; a light-emitting device located in the display area and provided on the side of the driving substrate close to the conductive ring; an isolation dam located in the peripheral area and provided on the side of the conductive ring facing away from the base substrate, the isolation dam and the conductive ring being in lap joint with each other; and a packaging layer provided on the side of the light-emitting device and the isolation dam facing away from the base substrate.

Description

Display panel and drive substrate Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a driving substrate. Background Art

[0002] Electroluminescent organic light-emitting diode displays have become the mainstream development trend of displays due to their advantages such as self-luminescence, low power consumption, wide viewing angle, fast response speed and high contrast.

[0003] Overview

[0004] The present disclosure provides a display panel, comprising a display area and a peripheral area located on at least one side of the display area, wherein the display panel comprises:

[0005] A driving substrate, comprising a base substrate and a conductive ring embedded in a surface of one side of the base substrate, wherein the conductive ring is located in the peripheral area;

[0006] a light emitting device, located in the display area and arranged on a side of the driving substrate close to the conductive ring;

[0007] an isolation dam located in the peripheral region and disposed on a side of the conductive ring facing away from the substrate, with the isolation dam and the conductive ring overlapping each other; and

[0008] The encapsulation layer is arranged on a side of the light emitting device and the isolation dam away from the substrate.

[0009] In some embodiments, an orthographic projection of the isolation dam on the base substrate covers an orthographic projection of the conductive ring on the base substrate.

[0010] In some embodiments, an outer edge of the orthographic projection of the isolation dam on the base substrate is located on a side of an outer edge of the orthographic projection of the conductive ring on the base substrate away from the display area;

[0011] The inner edge of the orthographic projection of the isolation dam on the base substrate is located on a side of the inner edge of the orthographic projection of the conductive ring on the base substrate close to the display area.

[0012] In some embodiments, an outer edge of an orthographic projection of the isolation dam on the base substrate is retracted toward the display area by a preset distance relative to an outer edge of the base substrate, and the preset distance is greater than 0.

[0013] In some embodiments, the predetermined distance is greater than or equal to 20 micrometers and less than or equal to 100 micrometers.

[0014] In some embodiments, in a first direction, a size of the isolation dam is greater than or equal to 0.1 times a size of the peripheral area and less than or equal to 0.2 times a size of the peripheral area, and the first direction is a direction in which the peripheral area is away from the display area.

[0015] In some embodiments, the isolation dam is a closed ring structure surrounding the display area.

[0016] In some embodiments, the orthographic projection edge of the isolation dam on the base substrate has at least one first inner angle, and the orthographic projection edge of the conductive ring on the base substrate has at least one second inner angle;

[0017] Wherein, the first inner angle and the second inner angle are both rounded.

[0018] In some embodiments, the isolation dam comprises:

[0019] The first isolation layer is a continuous integral structure in a first direction, and the first direction is a direction in which the peripheral area is away from the display area.

[0020] In some embodiments, the isolation dam further comprises:

[0021] The second isolation layer is located on a side of the first isolation layer close to the base substrate. The second isolation layer and the conductive ring are embedded in the same surface of the base substrate. The orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the second isolation layer on the base substrate.

[0022] In some embodiments, the second isolation layer includes a plurality of first isolation portions, and the plurality of first isolation portions are arranged at intervals along the first direction.

[0023] In some embodiments, the outer edge of the orthographic projection of the first isolation layer on the base substrate is approximately flush with the outer edge of the orthographic projection of the second isolation layer on the base substrate; the inner edge of the orthographic projection of the first isolation layer on the base substrate is approximately flush with the inner edge of the orthographic projection of the second isolation layer on the base substrate.

[0024] In some embodiments, the thickness of the second isolation layer is the same as the thickness of the conductive ring.

[0025] In some embodiments, the isolation dam further comprises:

[0026] The third isolation layer is located on a side of the first isolation layer away from the base substrate, and the orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the third isolation layer on the base substrate.

[0027] In some embodiments, the third isolation layer includes a plurality of second isolation portions, and the plurality of second isolation portions are arranged at intervals along the first direction.

[0028] In some embodiments, if the isolation dam further includes a second isolation layer, and the second isolation layer is located on the side of the first isolation layer close to the base substrate, the second isolation layer and the conductive ring are embedded in the same surface of the base substrate, and the orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the second isolation layer on the base substrate, then the orthographic projection of the third isolation layer on the base substrate does not overlap with the orthographic projection of the second isolation layer on the base substrate.

[0029] In some embodiments, in a direction away from the conductive ring, a size of the second isolation portion along the first direction gradually decreases.

[0030] In some embodiments, the light-emitting device includes: a stacked reflective electrode, a microcavity adjustment layer, a first electrode, a light-emitting layer, and a second electrode, wherein the reflective electrode is disposed close to the driving substrate;

[0031] The display panel further includes: a pixel definition layer, which is arranged on a side of the driving substrate close to the conductive ring and has a plurality of pixel openings, wherein the pixel openings are used to arrange the light emitting devices;

[0032] The isolation dam includes at least one isolation layer stacked together, and the isolation layer is provided on the same layer as the microcavity adjustment layer or the pixel definition layer and made of the same material.

[0033] In some embodiments, the isolation dam includes a plurality of stacked isolation layers, and the plurality of isolation layers are made of the same main material.

[0034] In some embodiments, the display panel further includes:

[0035] A plurality of packaging dams are arranged between the base substrate and the packaging layer, the plurality of packaging dams are located between the isolation dam and the display area, and the plurality of packaging dams are arranged at intervals along a first direction, which is a direction in which the peripheral area is away from the display area.

[0036] In some embodiments, in the first direction, a size of the isolation dam is greater than or equal to five times a size of the encapsulation dam.

[0037] In some embodiments, the base substrate is a silicon substrate, and the driving substrate further comprises:

[0038] The driving circuit is located in the display area and is at least partially embedded in the silicon substrate. The driving circuit is connected to the light-emitting device through a via hole and is used to drive the light-emitting device to emit light.

[0039] The present disclosure provides a driving substrate, which is applied to a display panel. The display panel includes a light-emitting device. The driving substrate includes a driving area and a functional area located on at least one side of the driving area. The driving substrate includes:

[0040] Silicon substrate;

[0041] A driving circuit is located in the driving region and is at least partially embedded in the silicon substrate, the driving circuit being used to drive the light-emitting device to emit light;

[0042] a conductive ring, located in the functional area and embedded in the first surface of the silicon substrate; and

[0043] The isolation layer is located in the functional area and is embedded in the first surface of the silicon substrate.

[0044] In some embodiments, the isolation layer includes a plurality of isolation portions, and the plurality of isolation portions are arranged at intervals along a second direction, where the second direction is a direction in which the functional region is away from the driving region.

[0045] In some embodiments, the conductive ring is located between two adjacent isolation portions.

[0046] In some embodiments, the conductive ring is a closed ring structure surrounding the driving area.

[0047] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below.

[0048] BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the description of the embodiments or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0050] FIG1 schematically shows a cross-sectional structure diagram of a display panel in the related art;

[0051] FIG2 schematically shows a planar structural diagram of a display panel provided by the present disclosure;

[0052] FIG3 schematically shows a cross-sectional structural diagram of a first display panel provided by the present disclosure;

[0053] FIG4 schematically shows a cross-sectional structural diagram of a second display panel provided by the present disclosure;

[0054] FIG5 schematically shows a cross-sectional structural diagram of a third display panel provided by the present disclosure;

[0055] FIG6 schematically shows a cross-sectional structural diagram of a fourth display panel provided by the present disclosure;

[0056] FIG7 schematically shows an enlarged structural diagram of position A in FIG2 ;

[0057] FIG8 schematically shows an enlarged structural diagram of position B in FIG5 or FIG6;

[0058] FIG9 schematically shows a planar structural diagram of a display motherboard;

[0059] FIG10 schematically shows a planar structural diagram of a driving substrate provided by the present disclosure;

[0060] FIG11 schematically shows a cross-sectional structural diagram of a driving substrate provided by the present disclosure.

[0061] Detailed description

[0062] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0063] In related art, after completing the light-emitting device fabrication and packaging processes on a wafer, the wafer is cut to produce a silicon-based display panel. As shown in Figure 1, a silicon-based display panel includes a silicon substrate 11, a light-emitting device 12 disposed on the silicon substrate 11, and an encapsulation layer 13 covering the silicon substrate 11 and the light-emitting device 12. During the cutting process, cracks may form on the silicon substrate 11 and the encapsulation layer 13 at the cut edges. During subsequent processing or use, these cracks may extend inward, damaging the electrical performance of the light-emitting device 12 and affecting the reliability of the display panel.

[0064] To solve the above problems, the present disclosure provides a display panel, as shown in FIG2 , which includes a display area AA and a peripheral area SA located on at least one side of the display area AA. The peripheral area SA can be located on one side, both sides, or all four sides of the display area AA (as shown in FIG2 ).

[0065] As shown in any one of Figures 3 to 6, the display panel includes: a driving substrate 30, including a base substrate 301 and a conductive ring 302 embedded in a surface of one side of the base substrate 301, and the conductive ring 302 is located in the peripheral area SA; a light-emitting device 31, located in the display area AA, is arranged on a side of the driving substrate 30 close to the conductive ring 302; an isolation dam 32, located in the peripheral area SA, is arranged on a side of the conductive ring 302 away from the base substrate 301, and the isolation dam 32 and the conductive ring 302 overlap with each other; and an encapsulation layer 33, arranged on a side of the light-emitting device 31 and the isolation dam 32 away from the base substrate 301.

[0066] The display panel provided by the present disclosure includes an isolation dam 32 disposed between the base substrate 301 and the encapsulation layer 33. The isolation dam 32 is located within the peripheral region SA between the cut edge (i.e., the edge of the peripheral region SA away from the display region AA) and the display region AA. This prevents cracks generated at the cut edge between the encapsulation layer 33 and the base substrate 301 from extending into the display region AA, significantly improving the electrical reliability and dependability of the display panel. Furthermore, by overlapping the isolation dam 32 and the conductive ring 302, cracks are prevented from extending into the display region AA through the gap between the two, further improving the electrical reliability and dependability of the display panel.

[0067] In some embodiments, the base substrate 301 is a silicon substrate. As shown in any one of Figures 3 to 6 , the driver substrate 30 further includes a driver circuit 303 located within the display area AA and at least partially embedded within the silicon substrate. The driver circuit 303 is connected to the light-emitting device 31 through a via VIA to drive the light-emitting device 31 to emit light.

[0068] Specifically, as shown in any one of Figures 3 to 6 , the driving circuit 303 may include a conductive layer 34. In the display area AA, the conductive layer 34 is connected to the light-emitting device 31 (as shown in the first electrode 313) through a via VIA; in the peripheral area SA, the conductive layer 34 is overlapped with the conductive ring 302.

[0069] The silicon substrate may be, for example, a low-temperature polysilicon substrate, which is not limited in the present disclosure.

[0070] In a specific implementation, the driving circuit 303 can be prepared using a complementary metal oxide semiconductor (CMOS) process on a low-temperature polysilicon substrate, which is conducive to realizing a small-volume, high-resolution display panel and can be applied to near-eye display devices such as virtual reality and augmented reality.

[0071] The conductive ring 302 may include conductive materials such as metal to release static electricity and also prevent edge cracks of the base substrate 301 from extending toward the display area AA.

[0072] In some embodiments, the light-emitting device 31 can be, for example, an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a sub-millimeter light-emitting diode (Mini LED) or a micro light-emitting diode (Micro LED), etc., which is not limited in the present disclosure.

[0073] In some embodiments, as shown in any one of FIG. 2 to FIG. 6 , the orthographic projection of the isolation dam 32 on the base substrate 301 covers the orthographic projection of the conductive ring 302 on the base substrate 301 , that is, the isolation dam 32 completely covers the conductive ring 302 .

[0074] In some embodiments, as shown in FIG2 , an orthographic outer edge s1 of the isolation dam 32 on the base substrate 301 is located on a side of an orthographic outer edge s2 of the conductive ring 302 on the base substrate 301 away from the display area AA; an orthographic inner edge s3 of the isolation dam 32 on the base substrate 301 is located on a side of an orthographic inner edge s4 of the conductive ring 302 on the base substrate 301 close to the display area AA.

[0075] It should be noted that the “orthographic projection outer edge” herein refers to the edge of the orthographic projection area away from the display area AA, and the “orthographic projection inner edge” refers to the edge of the orthographic projection area close to the display area AA.

[0076] As shown in Figure 2, by setting the orthographic outer edge s1 of the isolation dam 32 on the outside of the orthographic outer edge s2 of the conductive ring 302 (i.e., the side away from the display area AA), and setting the orthographic inner edge s3 of the isolation dam 32 on the inside of the orthographic inner edge s4 of the conductive ring 302 (i.e., the side close to the display area AA), it can be ensured that the isolation dam 32 completely covers the conductive ring 302, thereby fully blocking the edge cracks of the base substrate 301 from extending toward the encapsulation layer 33, and blocking the edge cracks of the encapsulation layer 33 from extending toward the base substrate 301.

[0077] In some embodiments, as shown in FIG. 2 , an orthographic outer edge s1 of the isolation dam 32 on the base substrate 301 is retracted by a preset distance d1 toward the side close to the display area AA relative to an outer edge s5 of the base substrate 301 , and the preset distance d1 is greater than 0.

[0078] In a specific implementation, the preset distance d1 can be determined based on the half-width of the cutting wheel and the alignment accuracy of the cutting process. This ensures that after the cutting process, the end surface of the isolation dam 32 facing away from the display area AA is still covered by the encapsulation layer 33. This prevents the isolation dam 32 from being exposed, which could affect the product's encapsulation performance. In a specific implementation, the preset distance d1 can be, for example, the sum of the half-width of the cutting wheel and the alignment accuracy of the cutting process.

[0079] In some embodiments, as shown in Figure 2, the preset distance d1 is greater than or equal to 20 micrometers and less than or equal to 100 micrometers. Further, the preset distance d1 may be greater than or equal to 50 micrometers and less than or equal to 100 micrometers.

[0080] As shown in any one of FIG. 2 to FIG. 6 , the first direction f1 is a direction in which the peripheral area SA moves away from the display area AA.

[0081] In some embodiments, as shown in FIG2 , in the first direction f1, the dimension d2 of the isolation dam 32 is greater than or equal to 0.1 times the peripheral region dimension d3 and less than or equal to 0.2 times the peripheral region dimension d3 , where the peripheral region dimension d3 is the dimension of the peripheral region SB in the first direction f1 .

[0082] Exemplarily, the peripheral area size d3 is 1 mm, and the size d2 of the isolation dam 32 may be greater than or equal to 100 micrometers and less than or equal to 150 micrometers or 200 micrometers.

[0083] In a specific implementation, as shown in FIG. 2 , the conductive ring 302 may be a closed ring structure surrounding the display area AA.

[0084] In some embodiments, as shown in FIG2 , the isolation dam 32 is a closed ring structure surrounding the display area AA, so that the isolation dam 32 can completely block edge cracks from extending toward the display area AA.

[0085] 7 , there is shown schematically an enlarged structural diagram of position A in FIG2 .

[0086] In some embodiments, as shown in FIG7 , the orthographic projection edge of the isolation dam 32 on the base substrate 301 has at least one first inner angle a1, and the orthographic projection edge of the conductive ring 302 on the base substrate 301 has at least one second inner angle a2. Both the first inner angle a1 and the second inner angle a2 are rounded.

[0087] The first inner angle a1 may be the inner angle of the orthographic outer edge s1 of the isolation dam 32 on the base substrate 301, or the inner angle of the orthographic inner edge s3 of the isolation dam 32 on the base substrate 301. The second inner angle a2 may be the inner angle of the orthographic outer edge s2 of the conductive ring 302 on the base substrate 301, or the inner angle of the orthographic inner edge s4 of the conductive ring 302 on the base substrate 301.

[0088] By setting the first inner angle a1 and the second inner angle a2 to be rounded, stress concentration at sharp inner angles can be avoided, thereby preventing the isolation dam 32 and the conductive ring 302 from blocking cracks and improving packaging reliability.

[0089] In some embodiments, as shown in any one of FIG. 3 to FIG. 6 , the isolation dam 32 includes a first isolation layer 321 , and the first isolation layer 321 is a continuous integral structure in the first direction f1 .

[0090] In some embodiments, as shown in FIG4 or FIG5 , the isolation dam 32 may further include a second isolation layer 322 located on a side of the first isolation layer 321 closer to the base substrate 301, with the second isolation layer 322 and the conductive ring 302 embedded on the same surface of the base substrate 301. As shown in FIG4 or FIG5 , the first isolation layer 321 is located on a side of the second isolation layer 322 and the conductive ring 302 facing away from the base substrate 301, and the first isolation layer 321 overlaps the second isolation layer 322 and the conductive ring 302, respectively.

[0091] The isolation dam 32 is formed by stacking the first isolation layer 321 and the second isolation layer 322 , which can further enhance the ability of the isolation dam 32 to prevent cracks from extending from the cutting edge to the display area AA.

[0092] In some embodiments, as shown in FIG4 or FIG5 , the orthographic projection of the first isolation layer 321 on the base substrate 301 covers the orthographic projection of the second isolation layer 322 on the base substrate 301. Accordingly, the orthographic projection area of ​​the first isolation layer 321 on the base substrate 301 is greater than or equal to the orthographic projection area of ​​the second isolation layer 322 on the base substrate 301.

[0093] In some embodiments, as shown in FIG. 4 or FIG. 5 , the second isolation layer 322 includes a plurality of first isolation portions 51 , and the plurality of first isolation portions 51 are arranged at intervals along the first direction f1 .

[0094] As shown in FIG. 4 or FIG. 5 , in the first direction f1 , a plurality of first isolation portions 51 are arranged in sequence with an interval therebetween, and the conductive ring 302 is located between two adjacent first isolation portions 51 .

[0095] As shown in FIG. 4 or FIG. 5 , the plurality of first isolation portions 51 spaced apart along the first direction f1 can form a multi-level barrier to cracks from the cut edge of the base substrate 301 , thereby enhancing the ability of the isolation dam 32 to prevent cracks from extending from the cut edge of the base substrate 301 to the display area AA.

[0096] In a specific implementation, the second isolation layer 322 may include at least two first isolation portions 51. In FIG4 and FIG5, the second isolation layer 322 includes five first isolation portions 51.

[0097] In some embodiments, the orthographic outer edge of the first isolation layer 321 on the base substrate 301 (the left edge of the first isolation layer 321 as shown in Figure 4 or Figure 5) is approximately flush with the orthographic outer edge of the second isolation layer 322 on the base substrate 301 (the left edge of the second isolation layer 322 as shown in Figure 4 or Figure 5); the orthographic inner edge of the first isolation layer 321 on the base substrate 301 (the right edge of the first isolation layer 321 as shown in Figure 4 or Figure 5) is approximately flush with the orthographic inner edge of the second isolation layer 322 on the base substrate 301 (the right edge of the second isolation layer 322 as shown in Figure 4 or Figure 5).

[0098] As shown in Figure 4 or 5, when the second isolation layer 322 includes multiple first isolation portions 51, the outer edge of the orthographic projection of the second isolation layer 322 on the base substrate 301 refers to the outer edge of the orthographic projection of the first isolation portion 51 farthest from the display area AA among the multiple first isolation portions 51 on the base substrate 301; the inner edge of the orthographic projection of the second isolation layer 322 on the base substrate 301 refers to the inner edge of the orthographic projection of the first isolation portion 51 closest to the display area AA among the multiple first isolation portions 51 on the base substrate 301.

[0099] By setting the orthographic projection edges of the first isolation layer 321 and the second isolation layer 322 on the base substrate 301 to be roughly flush, the end faces of the first isolation layer 321 and the second isolation layer 322 close to the display area AA and the end faces away from the display area AA can be smoothly transitioned without steps, thereby making the overall isolation dam 32 more stable and more capable of preventing crack extension.

[0100] In some embodiments, the thickness of the second isolation layer 322 is the same as the thickness of the conductive ring 302. As shown in FIG4 or FIG5 , the thickness of the second isolation layer 322 and the thickness of the conductive ring 302 are both H. In this way, the hole for the conductive ring 302 and the hole for the second isolation layer 322 can be formed simultaneously in one process, which simplifies the process flow and improves the stability of the second isolation layer 322 within the base substrate 301.

[0101] In some embodiments, the thickness of the first isolation portion 51 is the same as the thickness of the via hole VIA in the display area. As shown in FIG4 or FIG5 , the thickness of the first isolation portion 51 and the via hole VIA are both H. In this way, the first isolation portion 51 and the via hole VIA can be formed simultaneously in one step, thereby simplifying the process flow.

[0102] In some embodiments, as shown in FIG5 or FIG6 , the isolation dam 32 may further include a third isolation layer 323 located on a side of the first isolation layer 321 facing away from the base substrate 301, where the orthographic projection of the first isolation layer 321 on the base substrate 301 covers the orthographic projection of the third isolation layer 323 on the base substrate 301. Accordingly, the orthographic projection area of ​​the first isolation layer 321 on the base substrate 301 is greater than or equal to the orthographic projection area of ​​the third isolation layer 323 on the base substrate 301.

[0103] In FIG. 6 , the isolation dam 32 includes a first isolation layer 321 and a third isolation layer 323 that are stacked.

[0104] In FIG5 , the isolation dam 32 includes a second isolation layer 322 , a first isolation layer 321 and a third isolation layer 323 stacked in sequence. The stacking of the three isolation layers can further enhance the ability of the isolation dam 32 to prevent cracks from extending from the cutting edge to the display area AA.

[0105] In some embodiments, as shown in Figures 5 or 6 , the third isolation layer 323 includes a plurality of second isolation portions 61 , which are spaced apart and arranged in sequence along the first direction f1 . As shown in Figures 5 or 6 , the plurality of second isolation portions 61 are spaced apart and arranged in sequence along the first direction f1 .

[0106] As shown in FIG5 or FIG6, the plurality of second isolation portions 61 spaced apart along the first direction f1 can form a multi-level barrier to cracks from the cut edge of the encapsulation layer 33, thereby enhancing the ability of the isolation dam 32 to prevent cracks from extending from the cut edge of the encapsulation layer 33 to the display area AA.

[0107] In a specific implementation, the third isolation layer 323 may include at least two second isolation portions 61. In Figures 5 and 6, the third isolation layer 323 includes four second isolation portions 61.

[0108] In some embodiments, as shown in FIG5 , the isolation dam 32 includes a second isolation layer 322 , a first isolation layer 321 , and a third isolation layer 323 stacked in sequence. In this case, the orthographic projection of the third isolation layer 323 on the base substrate 301 does not overlap with the orthographic projection of the second isolation layer 322 on the base substrate 301 .

[0109] As shown in FIG5 , the second isolation layer 322 includes a plurality of first isolation portions 51, and the third isolation layer 323 includes a plurality of second isolation portions 61. In the first direction f1, the orthographic projections of the first isolation portions 51 on the base substrate 301 are alternately arranged with the orthographic projections of the second isolation portions 61 on the base substrate 301. This allows the crack stress to be evenly distributed within the isolation dam 32, allowing the isolation dam 32 to uniformly buffer the crack stress.

[0110] In a specific implementation, the outer edge of the orthographic projection of the first isolation layer 321 on the base substrate 301 may be flush (as shown in FIG. 6 ) or not flush (as shown in FIG. 5 ) with the outer edge of the orthographic projection of the third isolation layer 323 on the base substrate 301. The inner edge of the orthographic projection of the first isolation layer 321 on the base substrate 301 may be flush (as shown in FIG. 6 ) or not flush (as shown in FIG. 5 ) with the inner edge of the orthographic projection of the third isolation layer 323 on the base substrate 301.

[0111] As shown in Figure 4 or Figure 5, when the third isolation layer 323 includes multiple second isolation portions 61, the outer edge of the orthographic projection of the third isolation layer 323 on the base substrate 301 refers to the outer edge of the orthographic projection of the second isolation portion 61 farthest from the display area AA among the multiple second isolation portions 61 on the base substrate 301; the inner edge of the orthographic projection of the third isolation layer 323 on the base substrate 301 refers to the inner edge of the orthographic projection of the second isolation portion 61 closest to the display area AA among the multiple second isolation portions 61 on the base substrate 301.

[0112] In some embodiments, the dimension d5 of the second isolating portion 61 along the first direction f1 gradually decreases as it moves away from the conductive ring 302. As shown in FIG5 or FIG6 , as the distance between the second isolating portion 61 and the conductive ring 302 increases, the dimension d5 of the second isolating portion 61 gradually decreases. That is, the closer the second isolating portion 61 is to the conductive ring 302, the larger the dimension d5, and the farther the second isolating portion 61 is from the conductive ring 302, the smaller the dimension d5.

[0113] In FIG. 5 or FIG. 6 , the second isolation portion 61 , which overlaps with the orthographic projection of the conductive ring 302 on the base substrate 301 , has the largest size.

[0114] Since the conductive ring 302 can prevent the edge crack from extending toward the display area AA, the crack stress is greater at a position close to the conductive ring 302. By providing a larger second isolation portion 61 at a position close to the conductive ring 302, the crack stress can be effectively released, thereby improving the ability of the third isolation layer 323 to prevent crack extension.

[0115] 8 schematically shows an enlarged structural diagram of position B in FIG5 or 6. As shown in FIG8, the longitudinal section (a section perpendicular to the base substrate 301) of the second isolation portion 61 is trapezoidal in shape, and the inner corners of the trapezoid are rounded.

[0116] It should be noted that the second isolation layer 322 may also be a continuous integral structure in the first direction f1. The third isolation layer 323 may also be a continuous integral structure in the first direction f1.

[0117] It should be noted that the surface of the isolation dam 32 facing away from the base substrate 301 is covered by the encapsulation layer 33 to prevent the isolation dam 32 from being exposed and reducing the reliability of the display panel.

[0118] In some embodiments, as shown in any one of Figures 3 to 6, the light-emitting device 31 includes: a stacked reflective electrode 311, a microcavity adjustment layer 312, a first electrode 313, a light-emitting layer 314 and a second electrode 315, and the reflective electrode 311 is arranged close to the driving substrate 30.

[0119] As shown in any one of FIG. 3 to FIG. 6 , the display panel may further include: a pixel definition layer 316 , which is disposed on a side of the driving substrate 30 close to the conductive ring 302 and has a plurality of pixel openings for arranging the light-emitting devices 31 .

[0120] The microcavity adjustment layer 312 is used to adjust the color purity and intensity of the light emitted by the light-emitting device 31. The material of the microcavity adjustment layer 312 can include at least one of the following: inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride. The pixel definition layer 316 is used to separate two adjacent light-emitting devices 31. The material of the pixel definition layer 316 can include at least one of the following: inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride.

[0121] As shown in any one of Figures 3 to 6 , the isolation dam 32 includes at least one isolation layer, which is provided on the same layer and made of the same material as the microcavity adjustment layer 312 or the pixel definition layer 316. In this way, the isolation layer and the microcavity adjustment layer 312 or the pixel definition layer 316 can be formed simultaneously.

[0122] For example, in FIG. 3 , the isolation dam 32 includes an isolation layer, namely a first isolation layer 321 . The first isolation layer 321 can be formed simultaneously with the microcavity adjustment layer 312 (as shown in FIG. 3 ) and can also be formed simultaneously with the pixel definition layer 316 .

[0123] For example, in FIG4 , the isolation dam 32 includes two isolation layers, namely, a second isolation layer 322 and a first isolation layer 321 that are stacked, wherein the first isolation layer 321 can be formed simultaneously with the microcavity adjustment layer 312 (as shown in FIG4 ) and can also be formed simultaneously with the pixel definition layer 316 .

[0124] For example, in FIG5 , the isolation dam 32 includes three isolation layers, namely, a second isolation layer 322 , a first isolation layer 321 and a third isolation layer 323 that are stacked, wherein the first isolation layer 321 can be formed synchronously with the microcavity adjustment layer 312 , and the third isolation layer 323 can be formed synchronously with the pixel definition layer 316 .

[0125] For example, in FIG6 , the isolation dam 32 includes two isolation layers, namely a first isolation layer 321 and a third isolation layer 323 that are stacked, wherein the first isolation layer 321 can be formed simultaneously with the microcavity adjustment layer 312 , and the third isolation layer 323 can be formed simultaneously with the pixel definition layer 316 .

[0126] In some embodiments, the isolation dam 32 includes multiple stacked isolation layers made of the same material, which can reduce stress at the interface between the different isolation layers and prevent cracks caused by interfacial stress from extending into the display area AA.

[0127] For example, when the isolation dam 32 includes a second isolation layer 322, a first isolation layer 321 and a third isolation layer 323 that are stacked, the main materials of the first isolation layer 321, the second isolation layer 322 and the third isolation layer 323 can all be inorganic materials such as silicon oxide, silicon nitride or silicon oxynitride.

[0128] The inventors compared three materials: silicon oxide, silicon nitride, and silicon oxynitride. The experiment found that when the main materials of multiple isolation layers are all silicon oxide, the stress at the interface between different isolation layers is the smallest.

[0129] In a specific implementation, when the isolation dam 32 includes a second isolation layer 322, a first isolation layer 321 and a third isolation layer 323 that are stacked, the inner corner of the positive projection edge of any one of the first isolation layer 321, the second isolation layer 322 and the third isolation layer 323 on the base substrate 301 can be a rounded corner, so as to avoid stress concentration at sharp inner corners, avoid weakening the effect of the isolation dam 32 and the conductive ring 302 in blocking cracks, and help improve the packaging reliability.

[0130] In some embodiments, as shown in FIG3 , the display panel further includes: a plurality of encapsulation dams 35 , which are disposed between the base substrate 301 and the encapsulation layer 33 , the plurality of encapsulation dams 35 being located between the isolation dam 32 and the display area AA, and the plurality of encapsulation dams 35 being arranged at intervals along a first direction f1 , the first direction f1 being the direction in which the peripheral area SA is away from the display area AA.

[0131] By providing a plurality of packaging dams 35 , the transmission path of water and oxygen from the cutting edge into the display area AA can be extended, the probability of water and oxygen corroding the light-emitting device 31 can be reduced, and the packaging reliability can be improved.

[0132] To maximize the path for water and oxygen to enter the limited surrounding area SA, the dimension d4 of the encapsulation dam 35 can be smaller than the dimension d2 of the isolation dam 32 in the first direction f1, thereby allowing a greater number of encapsulation dams 35 to be provided within a limited space. In some embodiments, the dimension d2 of the isolation dam 32 in the first direction f1 is greater than or equal to five times the dimension d4 of the encapsulation dam 35.

[0133] In specific implementations, the size d2 of the isolation dam 32 and the size d4 of the encapsulation dam 35 can be designed according to actual needs and the size of the surrounding area SA. For example, in the first direction f1, the size d2 of the isolation dam 32 can be about ten times the size d4 of the encapsulation dam 35.

[0134] It should be noted that, in this article, "the orthographic projection of A is inside B," or "the orthographic projection of B covers A" can mean one of the following three situations: First, the entire boundary of the orthographic projection of A is inside the boundary of the orthographic projection of B. Second, part of the boundary of the orthographic projection of A coincides with the boundary of the orthographic projection of B, and the remaining part is inside the boundary of the orthographic projection of B. Third, the entire boundary of the orthographic projection of A coincides with the boundary of the orthographic projection of B.

[0135] In addition, the thickness herein refers to the dimension along the normal direction of the base substrate 301 .

[0136] The present disclosure further provides a display motherboard, as shown in FIG9 , which includes a plurality of display panels 91 provided in any embodiment. The display panels 91 can be obtained by cutting the display motherboard along cutting lines.

[0137] Those skilled in the art will appreciate that the display motherboard has the advantages of the front display panel 91 .

[0138] The present disclosure also provides a display device, including: a display panel as provided in any embodiment; an integrated circuit configured to provide a driving signal to the display panel; and a power supply circuit configured to provide power to the display panel.

[0139] Those skilled in the art will appreciate that the display device has the advantages of a front display panel.

[0140] Among them, the display device is a product with an image display function. For example, the display device can be: a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (PDA), a digital camera, a camcorder, a viewfinder, a navigator, a vehicle, a large-area wall, a home appliance, an information query device (such as business query equipment of e-government, banks, hospitals, power departments, etc.) and a monitor. The display device can also be a microdisplay or a product containing a microdisplay. The product containing a microdisplay can be any one of a smart watch, a smart bracelet, a helmet display, a stereo display mirror, an AR device (such as AR glasses) and a VR device (such as VR glasses). For example, a microdisplay can be a display with a display size ranging from about 0.2 inches to about 2.5 inches, but is not limited to this. It can be understood that the microdisplay can also be a display with a smaller display size, such as a display size less than or equal to 0.2 inches.

[0141] The present disclosure also provides a drive substrate for use in a display panel including a light-emitting device. As shown in FIG10 , the drive substrate includes a drive region BB and a functional region AB located on at least one side of the drive region BB. The functional region AB can be located on one side, both sides, or all four sides of the drive region BB (as shown in FIG10 ).

[0142] As shown in Figure 11, the driving substrate includes: a silicon substrate 81; a driving circuit 82, located in the driving area BB and at least partially embedded in the interior of the silicon substrate 81, and the driving circuit 82 is used to drive the light-emitting device to emit light; a conductive ring 83, located in the functional area AB and embedded in the first surface of the silicon substrate 81; and an isolation layer 84, located in the functional area AB and embedded in the first surface of the silicon substrate 81.

[0143] Those skilled in the art will appreciate that when the driving substrate provided by the present disclosure is applied to a display panel, the display panel has the advantages of the display panel provided by the aforementioned embodiments.

[0144] The drive substrate provided in the present disclosure can be used as the drive substrate 30 in the display panel provided in the aforementioned embodiment. In this case, the drive area BB of the drive substrate is located in the display area AA of the display panel, and the functional area AB of the drive substrate is located in the peripheral area SA of the display panel. The light-emitting device is located on the side of the drive substrate close to the first surface or the conductive ring 83. The isolation layer 84 embedded in the first surface of the silicon substrate 81 is equivalent to the second isolation layer 322 in the aforementioned embodiment. The isolation layer 84 has the same or similar features as the second isolation layer 322, and will not be repeated here.

[0145] In some embodiments, as shown in FIG. 10 or FIG. 11 , the isolation layer 84 includes a plurality of isolation portions 840 , and the plurality of isolation portions 840 are arranged at intervals along a second direction f2 , where the second direction f2 is a direction from the functional area AB to the driving area BB.

[0146] As shown in FIG. 10 or FIG. 11 , in the second direction f2 , a plurality of isolation portions 840 are arranged in sequence with intervals therebetween.

[0147] As shown in FIG. 10 or FIG. 11 , the plurality of isolation portions 840 spaced apart along the second direction f2 can form a multi-level barrier to cracks originating from the cut edge of the silicon substrate 81 , thereby enhancing the ability of the isolation layer 84 to prevent crack extension.

[0148] In a specific implementation, the isolation layer 84 may include at least two isolation portions 840 . In FIG10 and FIG11 , the isolation layer 84 includes five isolation portions 840 .

[0149] In some embodiments, as shown in FIG. 10 or FIG. 11 , the conductive ring 83 is located between two adjacent isolation portions 840 .

[0150] In some embodiments, the isolation layer 84 may also be a continuous integral structure in the second direction f2, which is not limited in the present disclosure.

[0151] In some embodiments, as shown in FIG. 10 , the conductive ring 83 is a closed ring structure surrounding the driving area BB.

[0152] In some embodiments, the thickness of the isolation layer 84 is the same as the thickness of the conductive ring 83. As shown in FIG11 , the thickness of the isolation layer 84 and the thickness of the conductive ring 83 are both H. In this way, the hole for the conductive ring 83 and the hole for the isolation layer 84 can be formed simultaneously in one process, simplifying the process flow while also improving the stability of the isolation layer 84 within the silicon substrate 81.

[0153] In some embodiments, the driving circuit 82 may include a conductive layer 85, which is connected to the light-emitting device via a via VIA. In a specific implementation, the via VIA connecting the conductive layer 85 and the light-emitting device, the hole for providing the conductive ring 83, and the hole for providing the isolation layer 84 can be simultaneously formed in a single step, thereby simplifying the process.

[0154] In the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0155] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure.

[0156] As used herein, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, product, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, commodity, or apparatus that includes the element.

[0157] References herein to "one embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "an example," "an example," "some examples," and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0158] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0159] When describing some embodiments, the expressions "coupled" and "connected" may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0160] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0161] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0162] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0163] The use of "for" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0164] The use of "based on" or "according to" in this document is intended to be open and inclusive. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values.

[0165] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0166] As used herein, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute equality and approximate flushness, wherein the acceptable deviation range of approximate flushness can be, for example, the distance between the two being flush is less than or equal to 5% of either one's size.

[0167] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0168] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A display panel comprising a display area and a peripheral area located on at least one side of the display area, the display panel comprising: A driving substrate, comprising a base substrate and a conductive ring embedded in a surface of one side of the base substrate, wherein the conductive ring is located in the peripheral area; a light emitting device, located in the display area and arranged on a side of the driving substrate close to the conductive ring; an isolation dam located in the peripheral region and disposed on a side of the conductive ring facing away from the substrate, with the isolation dam and the conductive ring overlapping each other; as well as The encapsulation layer is arranged on a side of the light emitting device and the isolation dam away from the substrate.

2. The display panel according to claim 1, wherein: The orthographic projection of the isolation dam on the base substrate covers the orthographic projection of the conductive ring on the base substrate.

3. The display panel according to claim 1 or 2, wherein: The outer edge of the orthographic projection of the isolation dam on the base substrate is located on a side of the outer edge of the orthographic projection of the conductive ring on the base substrate away from the display area; The inner edge of the orthographic projection of the isolation dam on the base substrate is located on a side of the inner edge of the orthographic projection of the conductive ring on the base substrate close to the display area.

4. The display panel according to any one of claims 1 to 3, wherein: An outer edge of the orthographic projection of the isolation dam on the base substrate is retracted toward the display area by a preset distance relative to the outer edge of the base substrate, and the preset distance is greater than 0.

5. The display panel according to claim 4, wherein: The preset distance is greater than or equal to 20 micrometers and less than or equal to 100 micrometers.

6. The display panel according to any one of claims 1 to 5, wherein: In a first direction, the size of the isolation dam is greater than or equal to 0.1 times the size of the peripheral area and less than or equal to 0.2 times the size of the peripheral area. The first direction is the direction in which the peripheral area is away from the display area.

7. The display panel according to any one of claims 1 to 6, wherein: The isolation dam is a closed ring structure surrounding the display area.

8. The display panel according to any one of claims 1 to 7, wherein: The orthographic projection edge of the isolation dam on the substrate has at least one first inner angle, and the orthographic projection edge of the conductive ring on the substrate has at least one second inner angle; Wherein, the first inner angle and the second inner angle are both rounded.

9. The display panel according to any one of claims 1 to 8, wherein: The isolation dam comprises: The first isolation layer is a continuous integral structure in a first direction, and the first direction is a direction in which the peripheral area is away from the display area.

10. The display panel according to claim 9, wherein: The isolation dam further comprises: The second isolation layer is located on a side of the first isolation layer close to the base substrate. The second isolation layer and the conductive ring are embedded in the same surface of the base substrate. The orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the second isolation layer on the base substrate.

11. The display panel according to claim 10, wherein: The second isolation layer includes a plurality of first isolation portions, and the plurality of first isolation portions are arranged at intervals along the first direction.

12. The display panel according to claim 10 or 11, wherein: The outer edge of the orthographic projection of the first isolation layer on the base substrate is roughly flush with the outer edge of the orthographic projection of the second isolation layer on the base substrate; the inner edge of the orthographic projection of the first isolation layer on the base substrate is roughly flush with the inner edge of the orthographic projection of the second isolation layer on the base substrate.

13. The display panel according to any one of claims 10 to 12, wherein: The thickness of the second isolation layer is the same as the thickness of the conductive ring.

14. The display panel according to any one of claims 9 to 13, wherein: The isolation dam further comprises: The third isolation layer is located on a side of the first isolation layer away from the base substrate, and the orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the third isolation layer on the base substrate.

15. The display panel according to claim 14, wherein: The third isolation layer includes a plurality of second isolation portions, and the plurality of second isolation portions are arranged at intervals along the first direction.

16. The display panel according to claim 14 or 15, wherein: If the isolation dam further includes a second isolation layer, and the second isolation layer is located on the side of the first isolation layer close to the base substrate, the second isolation layer and the conductive ring are embedded in the same surface of the base substrate, and the orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the second isolation layer on the base substrate, then the orthographic projection of the third isolation layer on the base substrate does not overlap with the orthographic projection of the second isolation layer on the base substrate.

17. The display panel according to claim 15 or 16, wherein: In a direction away from the conductive ring, a size of the second isolation portion along the first direction gradually decreases.

18. The display panel according to any one of claims 1 to 17, wherein: The light emitting device comprises: a stacked reflective electrode, a microcavity adjustment layer, a first electrode, a light emitting layer, and a second electrode, wherein the reflective electrode is arranged close to the driving substrate; The display panel further includes: a pixel definition layer, which is arranged on a side of the driving substrate close to the conductive ring and has a plurality of pixel openings, wherein the pixel openings are used to arrange the light emitting devices; The isolation dam includes at least one isolation layer stacked together, and the isolation layer is provided on the same layer as the microcavity adjustment layer or the pixel definition layer and made of the same material.

19. The display panel according to any one of claims 1 to 18, wherein: The isolation dam includes a plurality of isolation layers stacked together, and the main body materials of the plurality of isolation layers are the same.

20. The display panel according to any one of claims 1 to 19, wherein: The display panel further includes: A plurality of packaging dams are arranged between the base substrate and the packaging layer, the plurality of packaging dams are located between the isolation dam and the display area, and the plurality of packaging dams are arranged at intervals along a first direction, which is a direction in which the peripheral area is away from the display area.

21. The display panel according to claim 20, wherein: In the first direction, a size of the isolation dam is greater than or equal to five times a size of the encapsulation dam.

22. The display panel according to any one of claims 1 to 21, wherein: The base substrate is a silicon substrate, and the driving substrate further includes: The driving circuit is located in the display area and is at least partially embedded in the silicon substrate. The driving circuit is connected to the light-emitting device through a via hole and is used to drive the light-emitting device to emit light.

23. A drive substrate, applied to a display panel, the display panel including a light-emitting device, the drive substrate including a drive region and a functional region located on at least one side of the drive region, the drive substrate comprising: Silicon substrate; A driving circuit is located in the driving region and is at least partially embedded in the silicon substrate, the driving circuit being used to drive the light-emitting device to emit light; A conductive ring, located in the functional area and embedded in the first surface of the silicon substrate; as well as The isolation layer is located in the functional area and is embedded in the first surface of the silicon substrate.

24. The driving substrate according to claim 23, wherein: The isolation layer includes a plurality of isolation portions, and the plurality of isolation portions are arranged at intervals along a second direction, where the second direction is a direction in which the functional area is away from the driving area.

25. The driving substrate according to claim 24, wherein: The conductive ring is located between two adjacent isolation parts.

26. The driving substrate according to any one of claims 23 to 25, wherein: The conductive ring is a closed ring structure surrounding the driving area.