Adhesive tape materials for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding of semiconductor chips obtained by dicing. To use the tape, the PET separator is peeled off and the semiconductor wafer is attached to the adhesive layer. This product is characterized by a notch in the PET separator only along the edge of the substrate. The adhesive layer of this product is not formed by cutting a circle on the PET separator as in conventional adhesive tape, but rather by placing a pre-formed circle on the PET separator. This reduces the amount of adhesive layer waste. Furthermore, this product improves production efficiency by eliminating the process of cutting out the adhesive layer on the PET separator and then removing the unnecessary adhesive layer from the PET separator.

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