Carrier tape

JP1817387SActive Publication Date: 2026-01-20SHIN ETSU POLYMER CO LTD
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Patent Information

Application Number
JP2025012456D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-06-24
Publication Date
2026-01-20
Estimated Expiration
2050-06-24

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Abstract

This product is a carrier tape formed into a tape shape using resin, and is used to store various parts such as semiconductors and electronic components in embossed pockets for transportation, conveyance, and storage.
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