Gas ejection plate for plasma processing equipment

JP1819025SActive Publication Date: 2026-02-13HITACHI HIGH TECH CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2025012921D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2026-02-13
Estimated Expiration
2050-06-27

Smart Images

  • Figure 0001819025000001
    Figure 0001819025000001
  • Figure 0001819025000002
    Figure 0001819025000002
  • Figure 0001819025000003
    Figure 0001819025000003
Patent Text Reader

Abstract

This item is a gas ejection plate primarily used in plasma processing equipment for semiconductor manufacturing. This item is installed at the top of the plasma processing chamber, facing the lower electrode. Numerous fine holes (gas holes) are distributed throughout the item from the front to the back, and gas supplied from the gas supply line is released into the plasma processing chamber through the fine holes in this item. This item is usually positioned so that the side shown in the front view faces the wafer. The internal marking is an engraving created inside the item, for example, by processing with laser light, and may include a serial number for management purposes. The rectangular engraving on the far left may also be a two-dimensional barcode or the like.
Need to check novelty before this filing date? Find Prior Art