Gas ejection plate for plasma processing equipment
JP1819079SActive Publication Date: 2026-02-13HITACHI HIGH TECH CORP
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Patent Information
- Application Number
- JP2025012923D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2050-06-27
Smart Images

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Abstract
This item is a gas ejection plate primarily used in plasma processing equipment for semiconductor manufacturing. This item is installed at the top of the plasma processing chamber, facing the lower electrode. Numerous fine holes (gas holes) are distributed throughout the item from the front to the back, and gas supplied from the gas supply line is released into the plasma processing chamber through the fine holes in this item. This item is usually positioned so that the side shown in the front view faces the wafer. The internal marking is an engraving created inside the item, for example, by processing with laser light, and may include a serial number for management purposes. The rectangular engraving on the far left may also be a two-dimensional barcode or the like.
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