Adhesive tape material for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding of semiconductor chips obtained by dicing. To use it, the PET separator portion is peeled off, the wafer ring is attached to the adhesive layer, and the semiconductor wafer is attached to the adhesive layer. The adhesive layer of this product is covered by a base material portion and an adhesive layer portion, and has an uneven surface on its outer periphery. The uneven surface on the adhesive layer of this product allows for smooth peeling of the PET separator portion from the adhesive layer portion because the force applied to the outer periphery of the adhesive layer portion is distributed. Furthermore, when the semiconductor wafer is attached to the adhesive layer and then diced while cooled, the outer periphery of the adhesive layer portion breaks along the uneven surface, preventing it from scattering into tiny fragments.

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