Ceiling material

JP1828262SActive Publication Date: 2026-06-01DAIKEN CORP
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
DAIKEN CORP
Filing Date
2026-02-17
Publication Date
2026-06-01

Smart Images

  • Figure 0001828262000001
    Figure 0001828262000001
  • Figure 0001828262000002
    Figure 0001828262000002
  • Figure 0001828262000003
    Figure 0001828262000003
Patent Text Reader

Abstract

This product is designed to be installed in ceiling substrates such as system ceilings. It is a wire mesh type ceiling material, and while the grid consists of round bars, only the part that rests on the ceiling substrate is made of square bars, making it resistant to movement due to vibrations such as earthquakes.
Need to check novelty before this filing date? Find Prior Art