Laminate type electronic component

Abstract

To provide a laminate type electronic component which has improved capacity per unit volume.SOLUTION: A laminate type electronic component 1000 includes: a body 110 having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction, and a fifth surface and a six surface facing each other in a third direction; a first external electrode 131 and a second external electrode 132 which include a first connection part 131a, a second connection part 132a, a first band part 131b, a second band part 132b, a third band part 131c, and a fourth band part 132c; an insulation layer 151 which is arranged so as to extend to parts on the first connection part and the second connection part; and a first plating layer 141 and a second plating layer 142 which are arranged on the first band part and the second part so as to extend while contacting the insulation layer. Average thickness t1 of each of the plating layers is thinner than average thickness t2 of the insulation layer.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small, yet having high capacitance, and being easy to mount, and can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller and have higher capacitance.

[0004] Furthermore, in recent years, as the industry has become increasingly interested in automotive electrical components, multilayer ceramic capacitors are being used in automobiles and infotainment systems, and therefore high reliability characteristics are being required.

[0005] In order to reduce the size and increase the capacitance of multilayer ceramic capacitors, it is necessary to increase the number of layers by forming the internal electrodes and dielectric layers thin, and to increase the effective volume fraction required to realize capacitance by minimizing the volume of parts that do not affect the formation of capacitance.

[0006] Furthermore, in order to mount as many components as possible within a limited area of ​​the board, it is necessary to minimize the mounting space.

[0007] Furthermore, as the thickness of the margins becomes thinner due to the miniaturization and increased capacitance of multilayer ceramic capacitors, the penetration of moisture and plating solution from the outside becomes easier, which may weaken reliability. Therefore, a method for protecting multilayer ceramic capacitors from the penetration of moisture and plating solution from the outside is required. Summary of the Invention [Problem to be solved by the invention]

[0008] One of the various objects of the present invention is to provide a multilayer electronic component with improved capacitance per unit volume.

[0009] One of the various objects of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] One of the various objects of the present invention is to provide a laminated electronic component that can minimize packaging space.

[0011] However, the object of the present invention is not limited to the above content, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer, and first internal electrodes and second internal electrodes alternately arranged with the dielectric layer sandwiched therebetween, the multilayer electronic component including a main body having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in the third direction; a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a portion of the first surface, and a third band portion extending from the first connecting portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the second surface, a second band portion extending from the second connection portion to a portion of the first surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the second surface and extending to a portion above the first connection portion and the second connection portion; a first plating layer disposed on the first band portion and extending to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and extending to be in contact with the insulating layer, wherein an average thickness of the first plating layer and the second plating layer is thinner than an average thickness of the insulating layer.

[0013] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer, and first internal electrodes and second internal electrodes alternately arranged with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in the third direction; a first external electrode including a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first surface; a second connecting portion arranged on the fourth surface; The external electrode may include a second external electrode including a second band portion extending from the connection portion to a portion of the first surface; an insulating layer arranged so as to cover the entire second surface and extend to a portion of the first connection portion and the second connection portion; a first plating layer arranged on the first band portion and extending to contact the insulating layer; and a second plating layer arranged on the second band portion and extending to contact the insulating layer, wherein t1 is the average thickness of the first plating layer or the second plating layer and t2 is the average thickness of the insulating layer, and t1 / t2 may be 0.67 or less.

[0014] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer, and first internal electrodes and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in the third direction; a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a part of the first surface; a second connecting portion disposed on the fourth surface and a fifth external electrode extending from the second connecting portion to a part of the first surface; the first external electrode and the second external electrode may be arranged below an extension of the second surface, and ... second external electrode and the second external electrode may be arranged below an extension of the second surface, and the first external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the first external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the first external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the first external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the first external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the first external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the first external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the first external electrode may be arranged below an extension of the second surface, and the second external electrode and the second external electrode may be arranged below an extension of the second surface, and the second external electrode and the second [Effects of the Invention]

[0015] One of the various effects of the present invention is that by providing an insulating layer on the connection portions of the external electrodes and a plating layer on the band portions of the external electrodes, the capacity per unit volume of the multilayer electronic component is improved, as well as its reliability.

[0016] One of the many advantages of the present invention is that it minimizes the packaging space required for stacked electronic components.

[0017] One of the various effects of the present invention is that the average thickness of the plating layer is made thinner than the average thickness of the insulating layer, thereby preventing delamination and improving bonding strength.

[0018] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically showing a main body of the multilayer electronic component of FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 3 is an exploded perspective view schematically showing the main body of FIG. 2 in an exploded state. [Figure 5] FIG. 2 is a perspective view schematically showing a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view taken along line II-II' in FIG. [Figure 8] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view taken along line III-III' in FIG. 8. [Figure 10] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view taken along line IV-IV′ in FIG. [Figure 12] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 13] FIG. 13 is a cross-sectional view taken along line VV' in FIG. [Figure 14] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 15] FIG. 15 is a cross-sectional view taken along line VI-VI' in FIG. [Figure 16] FIG. 15 is a diagram showing a modification of FIG. 14. [Figure 17] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 18] FIG. 18 is a cross-sectional view taken along line VII-VII′ in FIG. [Figure 19] FIG. 18 is a diagram showing a modification of FIG. 17. [Figure 20] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 21] FIG. 21 is a cross-sectional view taken along line VIII-VIII′ in FIG. 20. [Figure 22] FIG. 21 is a diagram showing a modification of FIG. 20. [Figure 23] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 24] FIG. 24 is a cross-sectional view taken along line IX-IX' in FIG. 23. [Figure 25] FIG. 24 is a diagram showing a modification of FIG. 23. [Figure 26] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 27] FIG. 27 is a cross-sectional view taken along line XX′ of FIG. 26. [Figure 28] FIG. 27 is a diagram showing a modification of FIG. 26. [Figure 29] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 30] FIG. 30 is a cross-sectional view taken along line XI-XI' in FIG. 29. [Figure 31] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 32] FIG. 32 is a cross-sectional view taken along line XII-XII′ in FIG. 31. [Figure 33] FIG. 33 is an enlarged view of the K1 region in FIG. 32. [Figure 34] FIG. 16 is an enlarged view of area P of FIG. 15 according to one embodiment. [Figure 35] FIG. 16 is an enlarged view of region P in FIG. 15 according to another embodiment. [Figure 36] FIG. 15 is a diagram showing another modified example of FIG. [Figure 37] FIG. 15 is a diagram showing yet another modified example of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements designated by the same reference numerals in the drawings are the same elements.

[0021] In the drawings, parts not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown. Furthermore, components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, it does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified.

[0022] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0023] FIG. 1 is a perspective view schematically showing a multilayer electronic component according to one embodiment of the present invention.

[0024] FIG. 2 is a perspective view schematically showing the main body of the multilayer electronic component of FIG.

[0025] FIG. 3 is a cross-sectional view taken along line II' in FIG.

[0026] FIG. 4 is an exploded perspective view schematically showing the main body of FIG. 2 in an exploded state.

[0027] FIG. 5 is a perspective view schematically showing a substrate on which the multilayer electronic component of FIG. 1 is mounted.

[0028] A multilayer electronic component 1000 according to one embodiment of the present invention will now be described with reference to FIGS.

[0029] A multilayer electronic component 1000 according to one embodiment of the present invention includes a main body 110 including a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer sandwiched therebetween, the main body 110 including a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first to fourth surfaces and facing each other in the third direction; a first external electrode 131 including a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion to a portion of the first surface, and a third band portion 131c extending from the first connecting portion to a portion of the second surface; a second external electrode 132 including a second connection portion 132a disposed on the second surface, a second band portion 132b extending from the second connection portion to a portion of the first surface, and a fourth band portion 132c extending from the second connection portion to a portion of the second surface; an insulating layer 151 disposed on the second surface and extending to a portion on the first connection portion and the second connection portion; a first plating layer 141 disposed on the first band portion 131b and extending to be in contact with the insulating layer 151; and a second plating layer 142 disposed on the second band portion 132b and extending to be in contact with the insulating layer 151, wherein an average thickness t1 of the first plating layer and the second plating layer may be thinner than an average thickness t2 of the insulating layer.

[0030] The body 110 is formed by alternately laminating dielectric layers 111 and internal electrodes 121 and 122 .

[0031] The specific shape of the body 110 is not particularly limited, but as shown, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape consisting of perfectly straight lines.

[0032] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in the third direction.

[0033] In one embodiment, the main body 110 includes a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface, and the 1-3 corner and the 2-3 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the third surface, and the 1-4 corner and the 2-4 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the fourth surface.

[0034] Since a marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 may be rounded in a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0035] The corners may include a 1-3 corner connecting the first and third surfaces, a 1-4 corner connecting the first and fourth surfaces, a 2-3 corner connecting the second and third surfaces, and a 2-4 corner connecting the second and fourth surfaces. The corners may also include a 1-5 corner connecting the first and fifth surfaces, a 1-6 corner connecting the first and sixth surfaces, a 2-5 corner connecting the second and fifth surfaces, and a 2-6 corner connecting the second and sixth surfaces. The first to sixth surfaces of the main body 110 are substantially flat surfaces, and non-flat areas may be considered corners. Hereinafter, the extension line of each surface may refer to a line extending from the flat portion of each surface.

[0036] Here, of the external electrodes 131 and 132, the areas arranged on the corners of the main body 110 can be referred to as corner portions, the areas arranged on the third and fourth surfaces of the main body 110 can be referred to as connection portions, and the areas arranged on the first and second surfaces of the main body 110 can be referred to as band portions.

[0037] On the other hand, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes are cut so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth surface and the sixth surface, and the portions connecting the second surface to the fifth surface and the sixth surface do not need to have a contracted form.

[0038] The multiple dielectric layers 111 that form the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to see without using a scanning electron microscope (SEM).

[0039] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. can be used. The barium titanate-based material may contain BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0040] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention.

[0041] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0042] However, generally, when the dielectric layer is formed thinly with a thickness less than 0.6 μm, especially when the average thickness of the dielectric layer is 0.35 μm or less, the reliability may decrease.

[0043] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, etc., and improve the reliability. Therefore, even when the average thickness td of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0044] Therefore, when the average thickness td of the dielectric layer 111 is 0.35 μm or less, the effect of improving reliability according to the present invention becomes more significant.

[0045] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0046] The average thickness td of the dielectric layer 111 can be measured by scanning a cross section of the body 110 in the length and thickness direction LT using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, an average value can be calculated by measuring the thickness of one dielectric layer at 30 equally spaced points in the length direction in the scanned image. The 30 equally spaced points can be designated by the capacitance forming portion Ac. Furthermore, if this average value measurement is expanded to 10 dielectric layers, the average thickness of the dielectric layer can be further generalized.

[0047] The main body 110 may include a capacitance forming portion Ac that is arranged inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are arranged opposite each other across a dielectric layer 111 to form a capacitance, and cover portions 112 and 113 that are formed at the top and bottom of the capacitance forming portion Ac in a first direction.

[0048] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 sandwiched therebetween.

[0049] The cover parts 112, 113 may include an upper cover part 112 disposed on an upper part of the capacitance forming part Ac in the first direction, and a lower cover part 113 disposed on a lower part of the capacitance forming part Ac in the first direction.

[0050] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0051] The upper cover portion 112 and the lower cover portion 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0052] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0053] Meanwhile, the average thickness tc of the covers 112, 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112, 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average thickness tc of the covers 112, 113 is 15 μm or less.

[0054] The average thickness tc of the cover portions 112, 113 means the size in the first direction, and may be the average value of the size in the first direction of the cover portions 112, 113 measured at five equally spaced points on the top or bottom of the capacitance forming portion Ac.

[0055] Moreover, margin portions 114 and 115 can be arranged on the side surfaces of the capacitance forming portion Ac.

[0056] The margin portions 114, 115 may include a margin portion 114 disposed on the fifth surface 5 of the main body 110 and a margin portion 115 disposed on the sixth surface 6 of the main body 110. That is, the margin portions 114, 115 may be disposed on both end surfaces of the main body 110 in the width direction.

[0057] The margin portions 114 and 115 may refer to the regions between both ends of the first internal electrode 121 and the second internal electrode 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness WT direction, as shown in FIG. 3.

[0058] The margins 114 and 115 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0059] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheets except for the portions where the margin portions are to be formed, thereby forming internal electrodes.

[0060] In addition, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes can be cut so that they are exposed from the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0061] Meanwhile, the width of the margin portions 114, 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114, 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even when the average width of the margin portions 114, 115 is 15 μm or less.

[0062] The average width of the margin portions 114, 115 means the average size in the third direction, and can be the average value of the sizes in the third direction of the margin portions 114, 115 measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0063] The internal electrodes 121 and 122 are stacked alternately with the dielectric layers 111 .

[0064] The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to face each other across the dielectric layer 111 constituting the main body 110, and may be exposed from a third surface 3 and a fourth surface 4 of the main body 110, respectively.

[0065] 3, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed from the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed from the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0066] That is, the first internal electrode 121 is connected to the first external electrode 131 rather than the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 rather than the first external electrode 131. Therefore, the first internal electrode 121 may be formed at a predetermined distance from the fourth surface 4, and the second internal electrode 122 may be formed at a predetermined distance from the third surface 3.

[0067] Here, the first internal electrode 121 and the second internal electrode 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0068] The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets.

[0069] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0070] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The conductive paste for internal electrodes may be printed by screen printing, gravure printing, or the like, but the present invention is not limited thereto.

[0071] On the other hand, the average thickness te of the internal electrodes 121, 122 does not need to be particularly limited.

[0072] However, in general, when the internal electrodes are formed thin, with a thickness of less than 0.6 μm, there is a risk of reliability decreasing, especially when the average thickness of the internal electrodes is 0.35 μm or less.

[0073] According to one embodiment of the present invention, an insulating layer is placed on the connection portion of the external electrode and a plating layer is placed on the band portion of the external electrode, thereby preventing the penetration of moisture and plating solution from the outside and improving reliability, and therefore excellent reliability can be ensured even when the average thickness te of the internal electrodes 121, 122 is 0.35 μm or less.

[0074] Therefore, when the average thickness te of the internal electrodes 121, 122 is 0.35 μm or less, the effect of the present invention becomes more pronounced, and it is possible to more easily achieve a multilayer electronic component with a smaller size and a higher capacity.

[0075] The average thickness te of the internal electrodes 121, 122 may refer to the average thickness of one internal electrode 121, 122.

[0076] The average thickness te of the internal electrodes 121, 122 can be measured by scanning a cross section of the body 110 in the length and thickness direction LT using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average value can be calculated by measuring the thickness of each internal electrode at 30 equally spaced points in the length direction in the scanned image. The 30 equally spaced points can be designated by the capacitance forming portion Ac. Furthermore, if this average value measurement is extended to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0077] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132 disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0078] The external electrodes 131, 132 may include a first external electrode 131 including a first connection portion 131a disposed on the third surface and a first band portion 131b extending from the first connection portion to a portion of the first surface, and a second external electrode 132 including a second connection portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connection portion to a portion of the first surface. The first connection portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0079] The first external electrode 131 may include a third band portion 131c extending from the first connecting portion 131a to a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connecting portion 132a to a portion of the second surface. The first external electrode 131 may include a side band portion extending from the first connecting portion 131a to a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a side band portion extending from the second connecting portion 132a to a portion of the fifth and sixth surfaces.

[0080] However, the third band portion, the fourth band portion, and the side band portion do not have to be essential components of the present invention. The first external electrode 131 and the second external electrode 132 do not have to be arranged on the second surface, and they do not have to be arranged on the fifth and sixth surfaces either. Furthermore, the first connecting portion 131a and the second connecting portion 132a may be arranged away from the fifth and sixth surfaces, and the first connecting portion 131a and the second connecting portion 132a may be arranged away from the second surface.

[0081] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132 disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0082] The external electrodes 131, 132 may include a first external electrode 131 including a first connection portion 131a disposed on the third surface and a first band portion 131b extending from the first connection portion to a portion of the first surface, and a second external electrode 132 including a second connection portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connection portion to a portion of the first surface. The first connection portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0083] The first external electrode 131 may include a third band portion 131c extending from the first connecting portion 131a to a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connecting portion 132a to a portion of the second surface. The first external electrode 131 may include a first side band portion extending from the first connecting portion 131a to a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connecting portion 132a to a portion of the fifth and sixth surfaces.

[0084] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion may not be essential components of the present invention. The first external electrode 131 and the second external electrode 132 do not have to be arranged on the second surface, nor on the fifth and sixth surfaces. By not arranging the first external electrode 131 and the second external electrode 132 on the second surface, the first external electrode 131 and the second external electrode 132 can be arranged below an extension of the second surface of the main body. Also, referring to FIGS. 36 and 37, the first connecting portion 131a-5′ and the second connecting portion 132a-5′ may be arranged away from the fifth and sixth surfaces, and the first connecting portion 131a-5″ and the second connecting portion 132a-5″ may be arranged away from the second surface. Furthermore, the first band portion 131b and the second band portion 132b may also be arranged away from the fifth and sixth surfaces.

[0085] Meanwhile, when the first external electrode 131 and the second external electrode 132 include the third band portion 131c and the fourth band portion 132c, an insulating layer is disposed on the third band portion 131c and the fourth band portion 132c, but this is not limited thereto, and a plating layer may be disposed on the third band portion 131c and the fourth band portion 131c, 132c to improve mounting convenience. Also, the first external electrode 131 and the second external electrode 132 may include the third band portion 131c and the fourth band portion 131c, 132c but not the side band portion, in which case the first connecting portion 131a and the second connecting portion 132a, and the first band portion 131c, the second band portion 132b, the third band portion 131c, and the fourth band portion 132c may be separated from the fifth and sixth surfaces.

[0086] In this embodiment, the multilayer electronic component 1000 is described as having two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 can be changed depending on the shape of the internal electrodes 121 and 122 and other purposes.

[0087] On the other hand, the external electrodes 131 and 132 may be formed using any electrically conductive material such as a metal, and the specific material may be determined taking into consideration electrical properties and structural stability, and may even have a multi-layer structure.

[0088] The external electrodes 131 and 132 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0089] The external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Furthermore, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0090] The conductive metal contained in the external electrodes 131, 132 can be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 131, 132 contain one or more of Ni and Ni alloys. This can further improve continuity with the internal electrodes 121, 122 containing Ni.

[0091] The insulating layer 151 may be disposed on the second surface and extend to a portion above the first connecting portion 131a and the second connecting portion 132a.

[0092] The first connecting portion 131a and the second connecting portion 132a are portions that are connected to the internal electrodes 121, 122, and therefore can serve as a path for the penetration of plating solution during the plating process or moisture during actual use. In the present invention, the insulating layer 151 is disposed on the connecting portions 131a, 132a, and therefore it is possible to prevent the penetration of moisture or plating solution from the outside.

[0093] The insulating layer 151 may be disposed so as to be in contact with the first plating layer 141 and the second plating layer 142. Here, the insulating layer 151 may be in contact with the first plating layer 141 and the second plating layer 142 in a manner that covers a portion of the end of the first plating layer 141 and the second plating layer 142, or the first plating layer 141 and the second plating layer 142 may be in contact with the insulating layer 151 in a manner that covers a portion of the end of the first plating layer 141.

[0094] Meanwhile, when the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer 151 may be disposed so as to cover the entire second surface. Also, the insulating layer 151 does not necessarily have to be disposed on the second surface, and the insulating layer 151 may not be disposed on part or the entire second surface, but may be separated and disposed on the first connecting portion and the second connecting portion, respectively.

[0095] In one embodiment, an insulating layer 151 may be disposed on the first connecting portion 131a and the second connecting portion 132a.

[0096] The first connecting portion 131a and the second connecting portion 132a are portions that are connected to the internal electrodes 121, 122, and therefore can serve as a path for the penetration of plating solution during the plating process or moisture during actual use. In the present invention, the insulating layer 151 is disposed on the connecting portions 131a, 132a, and therefore it is possible to prevent the penetration of moisture or plating solution from the outside.

[0097] The insulating layer 151 may be disposed so as to be in contact with the first plating layer 141 and the second plating layer 142. Here, the insulating layer 151 may be in contact with the first plating layer 141 and the second plating layer 142 in a manner that covers a portion of the end of the first plating layer 141 and the second plating layer 142, or the first plating layer 141 and the second plating layer 142 may be in contact with the insulating layer 151 in a manner that covers a portion of the end of the first plating layer 141.

[0098] The insulating layer 151 may be disposed on the first connecting portion 131a and the second connecting portion 132a, and may be disposed to cover the second surface, the third band portion 131c, and the fourth band portion 132c. Here, the insulating layer 151 may be disposed to cover an area of ​​the second surface where the third band portion 131c and the fourth band portion 132c are not disposed, and the third band portion 131c and the fourth band portion 132c. Therefore, the insulating layer 151 covers the area where the ends of the third band portion 131c and the fourth band portion 132c contact the main body 110, blocking a moisture penetration path and further improving moisture resistance reliability.

[0099] The insulating layer 151 may be disposed on the second surface and extend to the first connecting portion 131a and the second connecting portion 132a. Furthermore, if the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 151 does not necessarily have to be disposed on the second surface. The insulating layer may be separated into two parts, one on the first connecting portion 131a and the other on the second connecting portion 132a. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. Furthermore, the insulating layer may not be disposed on the second surface, but may extend from the first connecting portion 131a and the second connecting portion 132a to the fifth and sixth surfaces to form a single insulating layer.

[0100] Furthermore, the insulating layer 151 may be disposed to cover the first and second side band portions and portions of the fifth and sixth surfaces, whereby portions of the fifth and sixth surfaces not covered by the insulating layer 151 may be exposed to the outside.

[0101] Furthermore, insulating layer 151 may be arranged to cover the entire first and second side band portions and the fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby improving moisture resistance reliability, and connecting portions 131a and 132a are not directly exposed to the outside, thereby improving the reliability of multilayer electronic component 1000. More specifically, the insulating layer covers the entire first and second side band portions, and can cover all of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0102] The insulating layer 151 serves to prevent the formation of plating layers 141, 142 on the external electrodes 131, 132 on which the insulating layer 151 is disposed, and also serves to improve sealing properties and minimize the penetration of moisture, plating solution, etc. from the outside.

[0103] The material constituting insulating layer 151 is not particularly limited, and insulating layer 151 may contain an insulating material and have electrical insulating properties. For example, the insulating material contained in insulating layer 151 may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or may be glass. More specifically, the material constituting insulating layer 151 is preferably a glass material that has excellent resistance to plating solutions and has a molar fraction of Si of 20 mol % or more and 65 mol % or less.

[0104] On the other hand, when the insulating layer 151 contains glass, the likelihood of delamination occurring in the plating layer increases because glass has lower connectivity with the plating layer than other insulating materials. According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the area of ​​physical contact between the plating layer and the insulating layer can be reduced, thereby effectively suppressing delamination even when the insulating layer 151 contains glass. Therefore, when the insulating layer 151 contains glass, the effect of the present invention in suppressing delamination of the plating layers 141 and 142 becomes more pronounced.

[0105] There is no particular limitation on the method for forming the insulating layer 151. For example, after the external electrodes 131 and 132 are formed on the main body 100, the insulating layer 151 may be formed by applying a paste containing glass powder or by dipping the main body 100 in a paste containing glass and then performing a heat treatment.

[0106] The first plating layer 141 and the second plating layer 142 may be disposed on the first band portion 131b and the second band portion 132b, respectively. The plating layers 141 and 142 serve to improve mounting characteristics, and by disposing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. The first plating layer 141 and the second plating layer 142 may have one end in contact with the first surface and the other end in contact with the insulating layer 151.

[0107] The plating layers 141, 142 are not particularly limited in type, and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, or may be formed of multiple layers.

[0108] As a more specific example of the plating layers 141, 142, the plating layers 141, 142 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first band portion 131b and the second band portion 132b.

[0109] The average thickness t 1 of the first plating layer 141 and the second plating layer 142 may be smaller than the average thickness t 2 of the insulating layer 151 .

[0110] The insulating layer 151 serves to prevent the penetration of moisture and plating solution from the outside, but due to weak connectivity with the plating layers 141 and 142, it may cause delamination of the plating layers 141 and 142. If delamination occurs in the plating layers, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141 and 142 refers to partial peeling of the plating layers or physical separation from the external electrodes 131 and 132. Because the connectivity between the plating layers and the insulating layer is weak, gaps may occur at the interface between the insulating layer and the plating layer, increasing the possibility of penetration of foreign matter and making the insulating layer vulnerable to external impacts, increasing the possibility of delamination.

[0111] As a result of research by the present inventors, it has been confirmed that the possibility of delamination occurring in the plating layer is proportional to the area where the insulating layer and the plating layer contact each other. According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the area where the plating layer and the insulating layer contact each other can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 1000 and the substrate 180.

[0112] The average thickness t1 of the first plating layer 141 and the second plating layer 142 may be the average value of thicknesses measured at five equally spaced points on the first connecting portion 131a and the second connecting portion 132a or the first band portion 131b and the second band portion 132b, and the average thickness t2 of the insulating layer 151 may be the average value of thicknesses measured at five equally spaced points on the first connecting portion 131a and the second connecting portion 132a.

[0113] In one embodiment, when the average thickness of the first plating layer 141 or the second plating layer 142 is t1 and the average thickness of the insulating layer 151 is t2, t1 / t2 may be 0.67 or less.

[0114] Table 1 below shows whether or not delamination occurs while changing the average thickness t1 of the first plating layer 141 or the second plating layer 142 and the average thickness t2 of the insulating layer 151.

[0115] To check for the occurrence of delamination, 400 samples per test number were prepared and subjected to a tape test. If the plating layer fell off, it was determined that delamination had occurred, and the number of cases is shown in Table 1 below.

[0116] [Table 1]

[0117] Test No. 1 is the case where the average thickness t1 of the plating layer is greater than the average thickness t2 of the insulating layer, and it can be confirmed that delamination occurs most frequently.

[0118] With reference to test numbers 1 to 12, it can be seen that the smaller t1 / t2 is, the less delamination occurs.

[0119] In test numbers 3 to 9, in which the average thickness t1 of the plating layer was thinner than the average thickness t2 of the insulating layer, the number of samples in which delamination occurred was 100 or less, and the incidence of delamination was less than 25%. This confirms that it is preferable that the average thickness t1 of the plating layer is thinner than the average thickness t2 of the insulating layer.

[0120] It can also be seen that test number 6, in which t1 / t2 is 0.67, shows a significant reduction in the occurrence of delamination compared to test number 5, in which t1 / t2 is 0.7. Therefore, it is more preferable that t1 / t2 is 0.67 or less.

[0121] In particular, in test numbers 8 and 9, where t1 / t2 was 0.5 or less, not a single sample out of 400 samples showed delamination. Therefore, it is even more preferable that t1 / t2 is 0.5 or less.

[0122] On the other hand, the lower limit of t1 / t2 does not need to be particularly set, but if the thickness of the plating layer is too thin, unplated areas may occur, reducing the bonding strength, and if the thickness of the insulating layer is too thick, the capacity per unit volume may decrease, so t1 / t2 may be 0.025 or more.

[0123] In one embodiment, the average thickness t1 of the first plating layer or the second plating layer may be 0.5 μm or more and 15 μm or less.

[0124] If the average thickness t1 of the first plating layer or the second plating layer is less than 0.5 μm, unplated areas may occur and the bonding strength may decrease. If it exceeds 15 μm, the stress within the plating layer may increase, causing peeling from the substrate and decreasing the bonding strength.

[0125] In one embodiment, the average thickness t2 of the insulating layer 151 may be 1 μm or more and 20 μm or less.

[0126] If the average thickness t2 of the insulating layer 151 is less than 1 μm, the insulating layer will not be effective in preventing the penetration of moisture and plating solution, and if it exceeds 20 μm, the capacitance per unit volume may decrease.

[0127] In one embodiment, the first plating layer 141 and the second plating layer 142 may be disposed so as to extend and cover a portion of the first connecting portion 131a and the second connecting portion 132a, respectively. When the average size in the first direction from the first internal electrode 121 to the internal electrode closest to the first surface 1, which is one of the first internal electrode 121 and the second internal electrode 122, is defined as H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first plating layer 1 and the second plating layer 142 disposed on the first connecting portion 131a and the second connecting portion 132a, respectively, is defined as H2, the relationship H1>H2 can be satisfied. This can suppress penetration of a plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0128] H1 and H2 may be average values ​​obtained by measuring cross sections (LT cross sections) obtained by cutting the body 110 in the first and second directions at five points equally spaced in the third direction. H1 may be an average value obtained by measuring at a point where the internal electrode disposed closest to the first surface 1 is connected to the external electrode in each cross section, and H2 may be an average value obtained by measuring at an end of the plating layer that contacts the external electrode in each cross section, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0129] In one embodiment, when the average size in the second direction of the main body 110 is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the relationships 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 can be satisfied.

[0130] If B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient bonding strength. On the other hand, if B2 / L is more than 0.4, leakage current may occur between the first band portion 131b and the second band portion 132b under high voltage, and the first band portion 131b and the second band portion 132b may be electrically connected due to bleeding of the plating during the plating process.

[0131] B1, B2, and L may be average values ​​measured on a cross section (LT cross section) obtained by cutting the body 110 in the first and second directions at five points equally spaced in the third direction.

[0132] Referring to FIG. 5 which shows a mounting substrate 1100 on which the laminated electronic component 1000 is mounted, the plating layers 141, 142 of the laminated electronic component 1000 may be joined to electrode pads 181, 182 arranged on a substrate 180 by solders 171, 172.

[0133] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0134] The size of the multilayer electronic component 1000 does not need to be particularly limited.

[0135] However, in order to simultaneously achieve miniaturization and high capacity, it is necessary to reduce the thickness of the dielectric layers and internal electrodes and increase the number of layers stacked. Therefore, the effect of improving reliability and capacity per unit volume according to the present invention becomes more pronounced in a multilayer electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0136] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect of the present invention is more significant when the length of the multilayer electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 1000 may refer to the maximum size of the multilayer electronic component 1000 in the third direction.

[0137] FIG. 6 is a perspective view that schematically shows a multilayer electronic component 1001 according to one embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line II-II' in FIG.

[0138] 6 and 7, in a multilayer electronic component 1001 according to an embodiment of the present invention, the first plating layer 141-1 and the second plating layer 142-1 may be disposed below an extension of the first surface, thereby minimizing the height of the solder during mounting and minimizing the mounting space.

[0139] In addition, the insulating layer 151-5 may be disposed so as to extend to an extension line of the first surface or less and contact the first plating layer 141-1 and the second plating layer 142-1.

[0140] FIG. 8 is a perspective view that schematically shows a multilayer electronic component 1002 according to one embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along line III-III' in FIG.

[0141] 8 and 9, a multilayer electronic component 1002 according to an embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and between the first band portion 131b and the second band portion 132b. This can prevent leakage current that may occur between the first band portion 131b and the second band portion 132b under high voltage.

[0142] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may contain glass. Further, the additional insulating layer 161 may contain one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as additives. By doing so, the bonding force with the main body or the external electrode can be improved. On the other hand, the additional insulating layer 161 and the insulating layer 151 do not need to be formed of the same material and may be formed of different materials.

[0143] FIG. 10 is a perspective view schematically showing a multilayer electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. 10.

[0144] Referring to FIGS. 10 and 11, for the multilayer electronic component 1003 according to an embodiment of the present invention, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first internal electrode 121 and the second internal electrode 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first connection portion 131a and the second connection portion 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0145] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0146] H1, H2, and T can be the average values of the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions. H1 can be the average value of the values measured at the points where the internal electrode closest to the first surface 1 in each cross-section is connected to the external electrode. H2 can be the average value of the values measured based on the end of the plating layer in contact with the external electrode in each cross-section. The extension lines of the first surface serving as the reference during the measurement of H1 and H2 can be the same. Also, T can be the average value after measuring the maximum size of the main body 110 in the first direction in each cross-section.

[0147] FIG. 12 is a perspective view schematically showing a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12.

[0148] Referring to FIGS. 12 and 13, in the multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0149] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0150] Here, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0151] B1, B2, B3, B4 and L may be average values ​​measured on a cross section (LT cross section) of the body 110 cut in the first and second directions at five points equally spaced in the third direction.

[0152] The first external electrode 131-4 may include a first side band portion extending from the first connection portion 131a-4 to portions of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132a-4 to portions of the fifth and sixth surfaces. Here, the sizes of the first and second side band portions in the second direction may gradually increase toward the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0153] Furthermore, when the average size in the second direction from an extension of the third surface to the end of the third band portion 131c-4 is B3, the average size in the second direction from an extension of the fourth surface to the end of the fourth band portion 132c-4 is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacitance per unit volume of the multilayer electronic component 1004.

[0154] The above G1 and G2 can be defined as the average value of the second-direction size of the area separated up to the third surface measured for any five second internal electrodes located in the center of the first direction in a cross section of the body cut in the first and second directions at the center of the third direction, with G1 being the average value of the second-direction size of the area separated up to the fourth surface measured for any five first internal electrodes located in the center of the first direction.

[0155] Furthermore, it can be further generalized by determining G1 and G2 in a cross section (LT cross section) obtained by cutting the main body 110 in the first and second directions at five points equally spaced in the third direction, and averaging these values ​​to determine G1 and G2.

[0156] However, it is not intended to limit the present invention to B3≦G1 and B4≦G2, and cases where B3≧G1 and B4≧G2 are satisfied can also be included in one embodiment of the present invention. Thus, in one embodiment, when the average size in the second direction from an extension of the third surface to an end of the third band portion is B3, the average size in the second direction from an extension of the fourth surface to an end of the fourth band portion is B4, the average size in the second direction of a region where the third surface and the second internal electrode are separated from each other is G1, and the average size in the second direction of a region where the fourth surface and the first internal electrode are separated from each other is G2, B3≧G1 and B4≧G2 can be satisfied.

[0157] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1 and the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band portion is B2, B1 ≧ G1 and B2 ≧ G2 can be satisfied, thereby improving the bonding strength between the multilayer electronic component 1004 and the substrate 180.

[0158] FIG. 14 is a perspective view that schematically shows a multilayer electronic component 1005 according to one embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along line VI-VI' in FIG.

[0159] 14 and 15, the first external electrode 131-5 and the second external electrode 132-5 of the multilayer electronic component 1005 according to an embodiment of the present invention may be arranged on the third, fourth, and first surfaces, rather than on the second surface, to form an L-shape. That is, the first external electrode 131-5 and the second external electrode 132-5 may be arranged below an extension of the second surface.

[0160] The first external electrode 131-5 includes a first connecting portion 131a-5 arranged on the third surface 3 and a first band portion 131b-5 extending from the first connecting portion 131a-5 to a portion of the first surface 1, and the second external electrode 132-5 includes a second connecting portion 132a-5 arranged on the fourth surface 4 and a second band portion 132b-5 extending from the second connecting portion 132a-5 to a portion of the first surface 1. The external electrodes 131-5 and 132-5 may not be arranged on the second surface 2, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby further improving the capacitance per unit volume of the laminated electronic component 1005. However, the insulating layer 151-5 does not need to be limited to covering the entire second surface 2, and may have a form in which the insulating layer does not cover part or all of the second surface 2, but is separated to cover the first connection portion 131a-5 and the second connection portion 132a-5 respectively.

[0161] Furthermore, the reliability can be further improved by disposing the insulating layer 151-5 so as to cover a portion of the fifth and sixth surfaces, whereby the portions of the fifth and sixth surfaces that are not covered by the insulating layer 151-5 can be exposed to the outside.

[0162] Furthermore, the insulating layer 151-5 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving the moisture resistance reliability.

[0163] A first plating layer 141-5 is disposed on the first band portion 131b-5, and a second plating layer 142-5 is disposed on the second band portion 132b-5, and the first plating layer 141-5 and the second plating layer 142-5 can be disposed extending to a portion of the first connecting portion 132a-5 and the second connecting portion 132b-5.

[0164] Here, the external electrodes 131-5 and 132-5 do not have to be arranged on the fifth surface 5 and the sixth surface 6. That is, the external electrodes 131-5 and 132-5 may be arranged only on the third surface, the fourth surface, and the first surface.

[0165] Let the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first internal electrode 121 and the second internal electrode 122 be H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first connection portion 131a-5 and the second connection portion 132a-5 be H2. Then, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength, and the increase in the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be increased to suppress the increase in ESR (Equivalent Series Resistance).

[0166] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0167] Also, the first plating layer 141-5 and the second plating layer 142-5 can be arranged to cover a part of the insulating layer 151-5 on the third surface and the fourth surface. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third surface and the fourth surface. For example, referring to FIG. 34, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0168] Also, the insulating layer 151-5 can be arranged to cover a part of the first plating layer 141-5 and the second plating layer 142-5 on the third surface and the fourth surface. For example, referring to FIG. 35, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third surface and the fourth surface. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0169] Fig. 16 is a diagram showing a modified example of Fig. 14. Referring to Fig. 16, in a modified example (1006) of a multilayer electronic component 1005 according to an embodiment of the present invention, the first external electrode 131-6 and the second external electrode 132-6 may have an L-shape in which the first external electrode and the second external electrode are not disposed on the second surface.

[0170] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the third surface 3 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a portion of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the fourth surface 4 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a portion of the first surface 1. The external electrodes 131-6 and 132-6 may not be disposed on the second surface 2, and the insulating layer 151-5 may cover the entire second surface 2. Here, the external electrodes 131-6 and 132-6 may not be disposed on the fifth surface 5 and the sixth surface 6. That is, the external electrodes 131-6 and 132-6 may be disposed only on the third surface, the fourth surface, and the first surface.

[0171] A first additional electrode layer 134 may be disposed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 may be disposed between the second connection portion 132a-6 and the fourth surface. The first connection portion 131a-6 may be disposed within a range not deviating from the third surface, and the second connection portion 132a-6 may be disposed within a range not deviating from the fourth surface.

[0172] FIG. 16 is a diagram illustrating a modification of FIG. 14. Referring to FIG. 16, in a modification (1006) of the multilayer electronic component 1005 according to an embodiment of the present invention, a first additional electrode layer 134 may be disposed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 may be disposed between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 may be disposed within the third surface, and the second additional electrode layer 135 may be disposed within the fourth surface. The first additional electrode layer 134 and the second additional electrode layer 135 may improve electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6 and may have excellent bonding strength with the external electrodes 131-6 and 132-6, thereby further improving the mechanical bonding strength of the external electrodes 131-6 and 132-6.

[0173] The first external electrode 131-6 and the second external electrode 132-6 may have an L-shape in which the first external electrode and the second external electrode are not disposed on the second surface.

[0174] The first external electrode 131-6 may include a first connection portion 131a-6 arranged on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connection portion 131a-6 to a portion of the first surface 1, and the second external electrode 132-6 may include a second connection portion 132a-6 arranged on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connection portion 132a-6 to a portion of the first surface 1.

[0175] Meanwhile, the first additional electrode layer 131-6 and the second additional electrode layer 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc. Also, the first additional electrode layer 131-6 and the second additional electrode layer 132-6 may be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin. Furthermore, the first additional electrode layer 131-6 and the second additional electrode layer 132-6 may be formed by transferring a sheet including conductive metal onto the main body.

[0176] The conductive metal contained in the first additional electrode layer 131-6 and the second additional electrode layer 132-6 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. The first additional electrode layer 131-6 and the second additional electrode layer 132-6 preferably contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 containing Ni.

[0177] Fig. 17 is a perspective view schematically showing a multilayer electronic component 2000 according to one embodiment of the present invention, and Fig. 18 is a cross-sectional view taken along line VII-VII' in Fig. 17.

[0178] 17 and 18, a multilayer electronic component 2000 according to an embodiment of the present invention includes a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 alternately disposed with the dielectric layer sandwiched therebetween. The multilayer electronic component 2000 includes a body 110 including a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first to fourth surfaces and facing each other in the third direction; a first connecting electrode 231a disposed on the third surface; and a first band electrode 232 disposed on the first surface and connected to the first connecting electrode. 1b, a second external electrode 232 including a second linking electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second linking electrode, a first insulating layer 251 disposed on the first linking electrode, a second insulating layer 252 disposed on the second linking electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, and an average thickness t1' of the first plating layer or the second plating layer may be thinner than an average thickness t2' of the first insulating layer or the second insulating layer.

[0179] The first linking electrode 231a may be disposed on the third surface 3 and connected to the first internal electrode 121, and the second linking electrode 231b may be disposed on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 may be disposed on the first linking electrode 231a, and a second insulating layer 252 may be disposed on the second linking electrode 232a.

[0180] Conventionally, external electrodes have been formed by dipping the exposed surface of the main body into a paste containing a conductive metal. However, external electrodes formed using this dipping method often have a thickness that is too thick at the center of the thickness direction. Furthermore, even without the problem of uneven external electrode thickness caused by the dipping method, the external electrodes on the third and fourth sides of the main body are exposed, so to prevent moisture and plating solution from penetrating through the external electrodes, the external electrodes on the third and fourth sides have been formed to a predetermined thickness or greater.

[0181] In contrast, in the present invention, insulating layers 251 and 252 are disposed on connecting electrodes 231a and 232a, so that sufficient reliability can be ensured even if the thickness of connecting electrodes 231a and 232a is reduced on the third and fourth surfaces where the internal electrodes are exposed.

[0182] The first and second connecting electrodes 231a and 232a may have shapes corresponding to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the body 110 may have the same areas as the third and fourth surfaces of the body 110, respectively. The first and second connecting electrodes 231a and 232a may be arranged so as not to deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a may be arranged so as not to extend to the first, second, fifth, and sixth surfaces 1, 5, and 6 of the body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a may be arranged to be spaced apart from the fifth and sixth surfaces. As a result, the capacity per unit volume of the multilayer electronic component 2000 can be increased by minimizing the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232 .

[0183] From this perspective, the first connecting electrode 231a and the second connecting electrode 232a can be disposed apart from the second surface 2. That is, by not disposing the external electrodes 231 and 232 on the second surface 2, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacitance per unit volume of the multilayer electronic component 2000 can be further increased.

[0184] However, the connecting electrodes 231a and 232a may include corner portions extending to and disposed on the corners of the main body 110. That is, in one embodiment, the first connecting electrode may include corner portions extending to and disposed on the 1-3 corner and the 2-3 corner, and the second connecting electrode may include corner portions extending to and disposed on the 1-4 corner and the 2-4 corner.

[0185] Furthermore, the connecting electrodes 231a and 232a can have a uniform and thin thickness compared to external electrodes formed by a conventional dipping method.

[0186] The method for forming the connecting electrodes 231a and 232a is not particularly limited, but for example, they may be formed by transferring a sheet containing a conductive metal, an organic material such as a binder, etc. onto the third and fourth surfaces.

[0187] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a refers to the maximum thickness, and may refer to the size of the connecting electrodes 231a and 232a in the second direction.

[0188] In one embodiment, the first connecting electrode 231a and the second connecting electrode 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By containing the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity between the first connecting electrode 231a and the second connecting electrode 232a and the internal electrodes 121 and 122 may be improved, and by containing glass, the bonding strength between the first connecting electrode 231a and the second connecting electrode 232a and the body 110 and / or the insulating layers 251 and 252 may be improved. Here, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0189] The first insulating layer 251 and the second insulating layer 252 are disposed on the first connecting electrode 231a and the second connecting electrode 232a, respectively, and serve to prevent a plating layer from being formed on the first connecting electrode 231a and the second connecting electrode 232a. In addition, the first insulating layer 251 and the second insulating layer 252 improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside.

[0190] The material constituting the insulating layers 251, 252 is not particularly limited, and the insulating layers 251, 252 may contain an insulating material and have electrical insulating properties. For example, the insulating material contained in the insulating layers 251, 252 may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or may be glass. More specifically, the material constituting the insulating layers 251, 252 is preferably a glass material that has excellent resistance to plating solutions and has a molar fraction of Si of 20 mol% or more and 65 mol% or less.

[0191] On the other hand, when the insulating layers 251 and 252 contain glass, the likelihood of delamination occurring in the plating layer increases because glass has lower connectivity with the plating layer than other insulating materials. According to one embodiment of the present invention, by making the average thickness t1' of the plating layer thinner than the average thickness t2' of the insulating layer, the area of ​​physical contact between the plating layer and the insulating layer can be reduced, thereby effectively suppressing delamination even when the insulating layers 251 and 252 contain glass. Therefore, when the insulating layers 251 and 252 contain glass, the effect of the present invention in suppressing delamination of the plating layers 241 and 242 becomes more pronounced.

[0192] The method for forming the insulating layers 251 and 252 is not particularly limited, but may be, for example, by applying a paste containing glass powder or by transferring a sheet containing glass powder to the connecting electrodes 231a and 232a.

[0193] In one embodiment, when the average thickness of the first plating layer or the second plating layer is t1' and the average thickness of the first insulating layer or the second insulating layer is t2', t1' / t2' may be 0.67 or less.

[0194] The first band electrode 231b and the second band electrode 232b may be disposed on the first surface 1 of the body 110. The first band electrode 231b and the second band electrode 232b may be electrically connected to the first internal electrode 121 and the second internal electrode 122 by contacting the first connecting electrode 231a and the second connecting electrode 231a, respectively.

[0195] External electrodes formed by the conventional dipping method are formed thickly on the third and fourth surfaces and extend partially onto the first, second, fifth, and sixth surfaces, making it difficult to ensure a high effective volume ratio.

[0196] In contrast, according to one embodiment of the present invention, a first connecting electrode 231a and a second connecting electrode 232a are arranged on the surface where the internal electrodes are exposed, and a first band electrode 231b and a second band electrode 232b are arranged on the surface that is mounted on the substrate, thereby ensuring a high effective volume ratio.

[0197] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component may be vertically mounted on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0198] The first band electrode 231b and the second band electrode 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc. For example, the first band electrode 231b and the second band electrode 232b may be fired electrodes including conductive metal and glass, or may be formed by applying a paste including conductive metal and glass to the first surface of the main body, but are not limited thereto, and may be a plating layer formed by plating a conductive metal on the first surface of the main body.

[0199] The conductive metal contained in the first band electrode 231b and the second band electrode 232b may be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may include the same metal as the metal contained in the internal electrodes 121 and 122.

[0200] The first band electrode 231b and the second band electrode 232b may be formed using any electrically conductive material such as metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc. For example, the first band electrode 231b and the second band electrode 232b may be fired electrodes including conductive metal and glass, or may be formed by applying a paste including conductive metal and glass to the first surface of the main body.

[0201] The conductive metal contained in the first band electrode 231b and the second band electrode 232b may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0202] Meanwhile, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0203] In one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B3, the distance from the extension line E4 of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, the following relations can be satisfied: B1 ≧ G1, B3 ≦ G1, B2 ≧ G2, and B4 ≦ G2. This minimizes the volume occupied by the external electrodes, thereby increasing the capacitance per unit volume of the multilayer electronic component 2000, and also increases the area in contact with solder during mounting, thereby improving bonding strength.

[0204] However, it is not intended to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and cases where B1≧G1, B3≧G1, B2≧G2, and B4≧G2 are satisfied can also be included as one embodiment of the present invention. Therefore, in one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line E4 of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, the following relations can be satisfied. As a result, either the first surface or the second surface can be used as a mounting surface, thereby improving convenience in mounting.

[0205] The first plating layer 241 and the second plating layer 242 may be disposed on the first band electrode 231b and the second band electrode 232b. The first plating layer 241 and the second plating layer 242 serve to improve mounting characteristics. The first plating layer 241 and the second plating layer 242 are not particularly limited in type, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, or may be formed of multiple layers.

[0206] As a more specific example of the first plating layer 241 and the second plating layer 242, the first plating layer 241 and the second plating layer 242 may be a Ni plating layer or a Sn plating layer, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first band electrode 231b and the second band electrode 232b.

[0207] In one embodiment, the first plating layer 241 and the second plating layer 242 may be disposed to extend and cover a portion of the first connecting electrode 231a and the second connecting electrode 232a, respectively.

[0208] When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 out of the first internal electrode 121 and the second internal electrode 122 is H1, and the average size in the first direction from an extension of the first surface 1 to the ends of the first plating layer 241 and the second plating layer 242 arranged on the first connecting electrode 231a and the second connecting electrode 232a is H2, it is possible to satisfy H1>H2. This makes it possible to suppress penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0209] In one embodiment, the first insulating layer 251 and the second insulating layer 252 are disposed so as to be in direct contact with the first linking electrode 231a1 and the second linking electrode 232a, respectively, and the first linking electrode 231a and the second linking electrode 232a may include a conductive metal and glass. This prevents the plating layers 241 and 242 from being disposed in the areas of the outer surfaces of the first linking electrode 231a and the second linking electrode 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0210] In one embodiment, the first insulating layer 251 and the second insulating layer 252 are disposed so as to be in direct contact with the first linking electrode 231a and the second linking electrode 232a, respectively, and the first linking electrode 231a and the second linking electrode 232a may contain a conductive metal and a resin. This prevents the plating layers 241 and 242 from being disposed in the areas of the outer surfaces of the first linking electrode 231a and the second linking electrode 232a where the insulating layers 251 and 252 are disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0211] In one embodiment, the first plating layer 241 may be disposed so as to cover an end of the first insulating layer 251 disposed on the first external electrode 231, and the second plating layer 242 may be disposed so as to cover an end of the second insulating layer 252 disposed on the second external electrode 232. This may strengthen the bonding strength between the insulating layers 251, 252 and the plating layers 241, 242, improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first insulating layer 251 and the second insulating layer 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, it is possible to more reliably suppress the penetration of the plating solution during the plating layer formation process. By forming the insulating layers before the plating layers, the plating layers 241, 242 may have a configuration in which the plating layers 241, 242 cover the ends of the insulating layers 251, 252.

[0212] In one embodiment, the first insulating layer 251 may be arranged to cover an end of the first plating layer 241 arranged on the first external electrode 231, and the second insulating layer 252 may be arranged to cover an end of the second plating layer 242 arranged on the second external electrode 232. This may strengthen the bonding strength between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000.

[0213] Fig. 19 is a diagram showing a modification of Fig. 17. Referring to Fig. 19, in a modification (2001) of a multilayer electronic component 2000 according to an embodiment of the present invention, the first insulating layer 251-1 and the second insulating layer 252-1 may extend to the fifth surface 5 and the sixth surface 6 and be connected to each other, thereby being connected to one insulating layer 253-1. Here, the connected first insulating layer and second insulating layer 253-1 may be arranged to cover a portion of the fifth surface and the sixth surface.

[0214] Fig. 20 is a perspective view schematically showing a multilayer electronic component 2002 according to one embodiment of the present invention, and Fig. 21 is a cross-sectional view taken along line VIII-VIII' in Fig. 20.

[0215] 20 and 21, in a multilayer electronic component 2002 according to an embodiment of the present invention, the first plating layer 241-2 and the second plating layer 242-2 may be disposed below an extension of the first surface, thereby minimizing the height of the solder during mounting and minimizing the mounting space.

[0216] Furthermore, the first insulating layer 251-2 and the second insulating layer 252-2 may be disposed so as to extend to an extension line of the first surface or less and come into contact with the first plating layer 241-2 and the second plating layer 242-2.

[0217] Fig. 22 is a diagram showing a modification of Fig. 20. Referring to Fig. 22, in a modification (2003) of the multilayer electronic component 2002 according to an embodiment of the present invention, the first insulating layer 251-3 and the second insulating layer 252-3 may be connected to each other by extending to the fifth surface 5 and the sixth surface 6, thereby being connected to one insulating layer 253-3. Here, the connected first insulating layer and second insulating layer 253-3 may be arranged to cover the entire fifth surface and the sixth surface.

[0218] Fig. 23 is a perspective view schematically showing a multilayer electronic component 2004 according to one embodiment of the present invention, and Fig. 24 is a cross-sectional view taken along line IX-IX' in Fig. 23.

[0219] 23 and 24, a multilayer electronic component 2004 according to an embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and between the first band electrode 231b and the second band electrode 232b, thereby preventing leakage current that may occur between the first band electrode 231b and the second band electrode 232b under high voltage.

[0220] The type of additional insulating layer 261 does not need to be particularly limited. For example, additional insulating layer 261 may contain one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or may contain glass. Additionally, additional insulating layer 261 may contain one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as an additive. This can improve the bonding strength with the main body or external electrodes. Meanwhile, additional insulating layer 261 and insulating layers 251-2 and 252-2 do not need to be made of the same material, and may be made of different materials.

[0221] Fig. 25 is a diagram showing a modification of Fig. 23. Referring to Fig. 25, in a modification (2005) of the multilayer electronic component 2004 according to an embodiment of the present invention, the first insulating layer 251-5 and the second insulating layer 252-5 extend to the fifth surface 5 and the sixth surface 6 and are connected to each other, so that they can be connected to one insulating layer 253-5.

[0222] FIG. 26 is a perspective view schematically showing a multilayer electronic component 2006 according to an embodiment of the present invention. FIG. 27 is a cross-sectional view taken along the line X-X' of FIG. 26.

[0223] Referring to FIGS. 26 and 27, a multilayer electronic component 2006 according to an embodiment of the present invention includes a first insulating layer 251-6 disposed on the first connecting electrode 231a and a second insulating layer 252-6 disposed on the second connecting electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first internal electrode 121 and the second internal electrode 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first plating layer 241-6 and the second plating layer 242-6 disposed on the first connecting electrode 231a and the second connecting electrode 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0224] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0225] FIG. 28 is a view showing a modified example of FIG. 26. Referring to FIG. 28, a modified example (2007) of the multilayer electronic component 2006 according to an embodiment of the present invention can be connected to a single insulating layer 253-7 by the first insulating layer 251-7 and the second insulating layer 252-7 extending to the fifth surface 5 and the sixth surface 6 and being connected to each other.

[0226] FIG. 29 is a perspective view schematically showing a multilayer electronic component 2008 according to an embodiment of the present invention. FIG. 30 is a cross-sectional view taken along the line XI-XI' of FIG. 29.

[0227] 29 and 30, in a multilayer electronic component 2008 according to an embodiment of the present invention, a first insulating layer 251-8 and a second insulating layer 252-8 may be connected to one insulating layer 253-8 by extending to the second, fifth, and sixth sides 2, 5, and 6 and being connected to each other. As shown in Fig. 30, the insulating layer 253-8 may be configured to entirely cover the second side, or may be configured to only partially cover the fifth and sixth sides.

[0228] Fig. 31 is a perspective view schematically showing a multilayer electronic component 3000 according to one embodiment of the present invention. Fig. 32 is a cross-sectional view taken along line XII-XII' in Fig. 31. Fig. 33 is an enlarged view of region K1 in Fig. 32.

[0229] 31 to 33, a multilayer electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 alternately disposed with the dielectric layer sandwiched therebetween, and includes a main body 110 including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in the third direction, and a first connecting portion 331a disposed on the third surface of the main body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface of the main body. a second external electrode 332 including a first external electrode 331, a second connection portion 332a arranged on the fourth surface of the main body, a second band portion 332b extending from the second connection portion to a part of the first surface, and a second corner portion 332c extending from the second connection portion to a corner connecting the second surface and the fourth surface of the main body; an insulating layer 351 arranged on the first connection portion 331a and the second connection portion 332a and arranged to cover the second surface and the first corner portion and the second corner portion; a first plating layer 341 arranged on the first band portion; and a second plating layer 342 arranged on the second band portion, wherein the average thickness of the first plating layer or the second plating layer may be thinner than the average thickness of the insulating layer.

[0230] In one embodiment, when the average size in the second direction from an extension of the third surface to an end of the first corner portion 331c is B3, the average size in the second direction from an extension of the fourth surface to an end of the second corner portion 332c is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes 331, 332 and increase the capacitance per unit volume of the multilayer electronic component 3000.

[0231] Here, when the average size in the second direction from an extension of the third surface to the end of the first band portion 331b is B1 and the average size in the second direction from an extension of the fourth surface to the end of the second band portion 332b is B2, it is possible to satisfy B1 ≧ G1 and B3 ≧ G2, thereby increasing the area in contact with solder during mounting and improving bonding strength.

[0232] A multilayer electronic component 3000 according to one embodiment may include a body 110 including a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 alternately arranged with the dielectric layer sandwiched therebetween, the body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction. The body 110 of the multilayer electronic component 3000 may have a similar configuration to the body 110 of the multilayer electronic component 1000, except that an end portion of the first or second surface of the body 110 has a contracted shape, as will be described later.

[0233] The external electrodes 331, 332 may be disposed on the third and fourth surfaces 4 of the body 110. The external electrodes 331, 332 may include a first external electrode 331 disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121, and a second external electrode 332 disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122.

[0234] The external electrodes 331, 332 may include a first external electrode 331 including a first connecting portion 331a disposed on the third surface, a first band portion 331b extending from the first connecting portion to a portion of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface, and a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface, a second band portion 332b extending from the second connecting portion to a portion of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 at the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 at the fourth surface.

[0235] In one embodiment, the first connecting portion 331a and the second connecting portion 332a may be disposed apart from the fifth and sixth surfaces, thereby minimizing the specific gravity of the external electrodes 331 and 332 and further reducing the size of the multilayer electronic component 3000.

[0236] Since marginal regions where the internal electrodes 121, 122 are not disposed overlap the dielectric layer 111, steps are generated due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, etc., the corners connecting each surface of the main body 110 may be rounded in a separate process, so that the corners connecting the first surface with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a rounded shape.

[0237] The corners may include a 1-3 corner C1-3 connecting the first and third faces, a 1-4 corner C1-4 connecting the first and fourth faces, a 2-3 corner C2-3 connecting the second and third faces, and a 2-4 corner C2-4 connecting the second and fourth faces. The corners may also include a 1-5 corner connecting the first and fifth faces, a 1-6 corner connecting the first and sixth faces, a 2-5 corner connecting the second and fifth faces, and a 2-6 corner connecting the second and sixth faces. However, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes are cut so as to be exposed from the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth surface and the sixth surface, and the portions connecting the second surface to the fifth surface and the sixth surface may not have a contracted shape.

[0238] On the other hand, the first to sixth surfaces of the main body 110 are substantially flat, and the non-flat areas can be regarded as corners. Also, the areas of the external electrodes 331 and 332 that are arranged on the corners can be regarded as corner portions.

[0239] From this perspective, the first corner portion 331c and the second corner portion 332c may be disposed below an extension line E2 of the second surface, and the first corner portion 331c and the second corner portion 332c may be disposed apart from the second surface. That is, since the external electrodes 331 and 332 are not disposed on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, thereby further increasing the capacitance per unit volume of the multilayer electronic component 3000. Furthermore, the first corner portion 331c may be disposed in a portion of the 2-3 corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be disposed in a portion of the 2-4 corner C2-4 connecting the fourth surface and the second surface.

[0240] The extension line E2 of the second surface can be defined as follows:

[0241] In a length-thickness cross section (LT cross section) of the laminated electronic component 3000 taken at the center in the width direction, when seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction at equal intervals in the length direction from the third surface to the fourth surface, the line passing through the point where P2 intersects with the second surface and the point where P4 intersects with the second surface can be defined as an extension line E2 of the second surface.

[0242] On the other hand, the external electrodes 331 and 332 may be formed using any electrically conductive material such as a metal, and the specific material may be determined taking into consideration electrical properties and structural stability, and may even have a multi-layer structure.

[0243] The external electrodes 331 and 332 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0244] The external electrodes 331, 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Furthermore, the external electrodes 331, 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0245] The conductive metal contained in the external electrodes 331, 332 may be, but is not limited to, a material with excellent electrical conductivity. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. The external electrodes 331, 332 preferably contain one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121, 122 containing Ni.

[0246] An insulating layer 351 may be disposed on the first connecting portion 331a and the second connecting portion 332a.

[0247] The first connecting portion 331a and the second connecting portion 332a are portions that are connected to the internal electrodes 121, 122, and therefore can serve as a path for the penetration of plating solution during the plating process or moisture during actual use. In the present invention, an insulating layer 351 is disposed on the connecting portions 331a, 332a, and therefore it is possible to prevent the penetration of moisture or plating solution from the outside.

[0248] The insulating layer 351 may be disposed so as to be in contact with the first plating layer 341 and the second plating layer 342. Here, the insulating layer 351 may be in contact with the first plating layer 341 and the second plating layer 342 in a manner that covers a portion of the end of the first plating layer 341 and the second plating layer 342, or the first plating layer 341 and the second plating layer 342 may be in contact with the insulating layer 351 in a manner that covers a portion of the end of the first plating layer 341.

[0249] The insulating layer 351 may be disposed on the first connecting portion 331a and the second connecting portion 332a, and may be disposed to cover the second surface, the first corner portion 331c, and the second corner portion 332c. In addition, the insulating layer 351 covers the areas where the ends of the first corner portion 331c and the second corner portion 332c contact the main body 110, thereby blocking a moisture penetration path, thereby further improving moisture resistance reliability.

[0250] The insulating layer 351 may be disposed on the second surface and extend to the first connecting portion 331a and the second connecting portion 332a. If the external electrodes 331 and 332 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 351 does not necessarily have to be disposed on the second surface. The insulating layer may be separated into two portions, one on the first connecting portion 331a and the other on the second connecting portion 332a. Even in this case, the insulating layer may be disposed to cover the entire first corner portion 331c and the second corner portion 332c. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. Alternatively, the insulating layer may not be disposed on the second surface, but may extend from the first connecting portion 331a and the second connecting portion 332a to the fifth and sixth surfaces to form a single insulating layer.

[0251] In one embodiment, the insulating layer 351 is disposed to cover a portion of the fifth and sixth surfaces, thereby improving reliability. Here, the portions of the fifth and sixth surfaces that are not covered by the insulating layer may be exposed to the outside.

[0252] Furthermore, the insulating layer 351 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving the moisture resistance reliability.

[0253] The insulating layer 351 serves to prevent plating layers 341, 342 from being formed on the external electrodes 331, 332 on which the insulating layer 351 is disposed, and also serves to improve sealing properties to minimize penetration of moisture, plating solution, etc. from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are similar to those of the insulating layers 151, 251, 252, 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, and therefore, description thereof will be omitted.

[0254] The first plating layer 341 and the second plating layer 342 may be disposed on the first band portion 331b and the second band portion 332b, respectively. The plating layers 341 and 342 serve to improve mounting characteristics, and by disposing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first plating layer 341 and the second plating layer 342 may contact the first surface and the other end may contact the insulating layer 351.

[0255] The plating layers 341, 342 are not particularly limited in type, and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, or may be formed of multiple layers.

[0256] As a more specific example of the plating layers 341, 342, the plating layers 341, 342 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first band portion 331b and the second band portion 332b.

[0257] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first external electrode 331 and the second external electrode 332, and the first external electrode 331 and the second external electrode 332 may include a conductive metal and glass. In this manner, the plating layers 341, 342 are not disposed in the areas of the outer surfaces of the first external electrode 331 and the second external electrode 332 where the insulating layer 351 is disposed, thereby effectively preventing the external electrodes from being corroded by the plating solution.

[0258] In one embodiment, the insulating layer 351 is disposed so as to be in direct contact with the first external electrode 331 and the second external electrode 332, and the first external electrode 331 and the second external electrode 332 may contain a conductive metal and a resin. In this manner, the plating layers 341, 342 are not disposed in the areas of the outer surfaces of the first external electrode 331 and the second external electrode 332 where the insulating layer 351 is disposed, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0259] In one embodiment, the first plating layer 341 may be disposed so as to cover an end of the insulating layer 351 disposed on the first external electrode 331, and the second plating layer 342 may be disposed so as to cover an end of the insulating layer 351 disposed on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, it is possible to more reliably suppress penetration of the plating solution during the plating layer formation process. By forming the insulating layer before the plating layer, the plating layers 341 and 342 may have a configuration in which they cover the end of the insulating layer 351.

[0260] In one embodiment, the insulating layer 351 is disposed so as to cover the end portions of the first plating layer 341 disposed on the first external electrode 331, and the insulating layer 351 can be disposed so as to cover the end portions of the second plating layer 342 disposed on the second external electrode 332. Thereby, the bonding force between the insulating layer 351 and the plating layers 341 and 342 can be strengthened, and the reliability of the stacked electronic component 3000 can be improved.

[0261] In one embodiment, the first plating layer 341 and the second plating layer 342 can be extended and disposed so as to cover a part of the first connection portion 331a and the second connection portion 332a, respectively. When the average size in the first direction from the first internal electrode 121 and the second internal electrode 122 to the internal electrode disposed closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the end portions of the first plating layer 341 and the second plating layer 342 disposed on the first connection portion 331a and the second connection portion 332a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0262] In one embodiment, when the average size in the first direction from the first surface to the internal electrode disposed closest to the first surface among the first internal electrode 121 and the second internal electrode 122 is H1, and the average size in the first direction from the extension line of the first surface to the end portions of the plating layers 341 and 342 disposed on the first connection portion 331a and the second connection portion 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is equal to or greater than T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0263] In one embodiment, the first plating layer 341 and the second plating layer 342 may be disposed below an extension of the first surface. This minimizes the height of the solder during mounting, thereby minimizing the mounting space. Furthermore, the insulating layer 351 may be disposed so as to extend below an extension of the first surface and contact the first plating layer 341 and the second plating layer 342.

[0264] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension of the fourth surface to the end of the second band portion is B2, the relationships 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 can be satisfied.

[0265] If B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient bonding strength. On the other hand, if B2 / L is more than 0.4, leakage current may occur between the first band portion 331b and the second band portion 332b under high voltage, and the first band portion 331b and the second band portion 332b may be electrically connected due to bleeding of the plating during the plating process.

[0266] In one embodiment, the semiconductor device may further include an additional insulating layer disposed on the first surface between the first band portion 331b and the second band portion 332b, thereby preventing leakage current that may occur between the first band portion 331b and the second band portion 332b under high voltage.

[0267] The type of the additional insulating layer is not particularly limited, and may include, for example, one or more selected from the group consisting of epoxy resin, acrylic resin, and ethyl cellulose, or may include glass.

[0268] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length B2 of the second band portion 332b can be longer than the average length B4 of the second corner portion 332c. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0269] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0270] In one embodiment, when the average thickness of the first plating layer 341 and the second plating layer 342 is t1, and the average thickness of the insulating layer 351 is t2, t1 / t2 may be 0.67 or less.

[0271] The insulating layer 351 plays a role in preventing the penetration of moisture from the outside and the penetration of the plating solution. However, since the connectivity with the plating layers 341 and 342 is weak, it can cause delamination of the plating layer. When delamination occurs in the plating layer, the fixing strength with the substrate may decrease. Here, delamination of the plating layer means that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, there is a high possibility that gaps will occur at the interface between the insulating layer and the plating layer or foreign substances will penetrate, and it will be vulnerable to external impacts such as delamination may occur.

[0272] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the area where the plating layer and the insulating layer contact each other can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 3000 and the substrate.

[0273] The size of the multilayer electronic component 3000 does not need to be particularly limited.

[0274] However, in order to simultaneously achieve miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layers and internal electrodes and increase the number of layers stacked. Therefore, the effects of improving reliability and capacitance per unit volume according to the present invention become more pronounced in multilayer electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0275] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect of the present invention is more pronounced when the length of the multilayer electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the second direction, and the width of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the third direction.

[0276] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments and the accompanying drawings, but is limited by the scope of the appended claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical idea of ​​the present invention as defined in the claims, and these also fall within the scope of the present invention.

[0277] It should be noted that the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, it does not exclude that one embodiment presented above can be realized in combination with features of another embodiment. For example, even if a feature described in one embodiment is not described in another embodiment, it can be understood as a description of another embodiment unless there is a contrary or contradictory description of that feature in the other embodiment.

[0278] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. Here, singular expressions include plural expressions unless otherwise clearly indicated in the context. [Explanation of symbols]

[0279] 1000, 2000, 3000 Multilayer electronic components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover 114, 115 Margin 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 plating layer 151, 251, 252, 253, 351 Insulation layer 161, 261 Additional insulating layer 171, 172 Handa 180 boards 181, 182 Electrode pads

Claims

1. A main body including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; A first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a part of the first surface; A second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a part of the first surface; An insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion; A plating layer including a first plating layer disposed on the first band portion and a second plating layer disposed on the second band portion; wherein One end portion of the first plating layer extends so as to abut on one end portion of the first insulating layer, and one end portion of the second plating layer extends so as to abut on one end portion of the second insulating layer; There are steps in a region where one end portion of the first plating layer abuts on one end portion of the first insulating layer and in a region where one end portion of the second plating layer abuts on one end portion of the second insulating layer; A multilayer electronic component in which an average thickness of the plating layer is smaller than an average thickness of the insulating layer.

2. The multilayer electronic component according to claim 1, wherein when an average thickness of the plating layer is t1 and an average thickness of the insulating layer is t2, t1 / t2 is 0.67 or less.

3. The multilayer electronic component according to claim 2, wherein t1 / t2 is 0.5 or less.

4. The multilayer electronic component according to claim 1, wherein the average thickness of the plating layer is 0.5 μm or more and 15 μm or less.

5. The multilayer electronic component according to claim 1, wherein the average thickness of the insulating layer is 1 μm or more and 20 μm or less.

6. The multilayer electronic component according to claim 1, wherein the insulating layer contains glass.

7. The multilayer electronic component according to claim 1, wherein when an average size in a first direction from the first surface to an internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end portion of the plating layer disposed on the first and second connection portions is H2, H1 > H2 is satisfied.

8. When the average size in the first direction from the first surface to the internal electrode among the first and second internal electrodes that is closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first and second connection portions is H2, the multilayer electronic component according to claim 1, wherein H1 < H2 is satisfied.

9. When the average size in the first direction of the main body is T, The multilayer electronic component according to claim 8, wherein H2 < T / 2 is satisfied.

10. The multilayer electronic component according to claim 1, wherein the first and second plating layers are disposed below the extension line of the first surface.

11. When the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The multilayer electronic component according to claim 1, wherein 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 are satisfied.

12. The multilayer electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

13. The multilayer electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

14. The multilayer electronic component according to claim 1, wherein the average thicknesses of the first and second internal electrodes are each 0.35 μm or less.

15. Including a capacitance forming portion including first and second internal electrodes disposed alternately with the dielectric layer therebetween, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction, The multilayer electronic component according to claim 1, wherein the average size in the first direction of the cover portion is 15 μm or less.

16. The multilayer electronic component according to claim 1, wherein the first plating layer is disposed so as to cover the end portion of the first insulating layer close to the first surface, and the second plating layer is disposed so as to cover the end portion of the second insulating layer close to the first surface.

17. The multilayer electronic component according to claim 1, wherein the first insulating layer is disposed so as to cover the end portion disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover the end portion disposed on the second external electrode of the second plating layer.

18. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces, The second external electrode includes a second side band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The stacked electronic component according to claim 1, wherein the sizes of the first and second side band portions in the second direction increase as they approach the first surface.

19. The stacked electronic component according to claim 1, wherein the first and second external electrodes are arranged spaced apart from the fifth and sixth surfaces.

20. The stacked electronic component according to claim 1, wherein the first and second external electrodes are arranged spaced apart from the second surface.

21. The stacked electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

22. The stacked electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

23. The stacked electronic component according to claim 1, wherein the insulating layer is not disposed on the second, fifth, and sixth surfaces.

24. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface. The stacked electronic component according to claim 1, wherein the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface.

25. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface. The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface. The stacked electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending and disposed on the first - 3 corner and the second - 3 corner at the first connection portion, and the second external electrode includes a second corner portion extending and disposed on the first - 4 corner and the second - 4 corner from the second connection portion.

26. When the average magnitude in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average magnitude in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average magnitude in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average magnitude in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 25, satisfying B3 ≤ G1 and B4 ≤ G2.

27. The first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode.

28. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The multilayer electronic component according to claim 27, wherein the second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode.

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