Water treatment system

Abstract

To provide an improved ultraviolet reactor for disinfecting water.SOLUTION: A UV reactor for disinfecting water and having a UV source printed circuit board assembly transfers heat to a heat sink in the form of a water-to-heat coupling. The UV source printed circuit board assembly may include a metal-coated printed circuit board having a thermal contact area in thermal communication with the heat sink.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a water treatment system, and more particularly to a point-of-use water treatment system for residential or commercial use.

Background Art

[0002] Conventional water treatment systems are often used for the treatment of water intended for human consumption. Such treatment systems can be configured to remove pathogens, chemical contaminants, and turbidity from water. Many conventional treatment methods can be broadly classified as either solid separation using physical and / or chemical processes, or sterilization using heating, irradiation, or chemical additives. For example, conventional water treatment systems often have carbon filtration, non-carbon filtration, distillation, ozone treatment, reverse osmosis, ion exchange components, chlorination components, aeration components, advanced oxidation process components, coagulation components, sedimentation components, or ultraviolet radiation components.

[0003] Conventional point-of-use water treatment systems are designed for use at a single water outlet, such as a faucet or a water dispenser. Conventional point-of-use water treatment systems are connected to a pressurized water source and treat the water in the water supply. Depending on the application, the water treatment system may be located on a countertop adjacent to a faucet. For countertop applications, the water treatment system is often connected to the end of a faucet, and thus the water from the faucet can be sent before being supplied through the water treatment system.

[0004] In some conventional water treatment systems, ultraviolet (UV) energy can be used to effectively disinfect fluids. Exposure to ultraviolet light is thought to harmfully alter the genetic material (DNA) within cells, thereby reducing populations of potentially pathogenic microorganisms such as bacteria, viruses, fungi, and algae. Typically, water flows through UV lamps in a UV disinfection system, thereby exposing the microorganisms in the water to a certain amount of UV energy sufficient to substantially neutralize them. Typical water disinfection systems and devices emit ultraviolet light at approximately 254 nm, which is thought to penetrate the outer cell membrane of microorganisms, pass through the cell body, reach the DNA, and alter the genetic material of the microorganisms.

[0005] In some cases, the ultraviolet light-emitting diodes (UV-LEDs) in conventional UV disinfection systems generate heat during operation. This heat can shorten the operating life of the UV-LEDs. To dissipate this heat, conventional UV disinfection systems utilize convection cooling with the surrounding air. A metal heatsink can be provided to facilitate heat transfer to the surrounding air. These types of cooling systems may not be effective in confined spaces with minimal airflow, such as when the system is installed in a cabinet under a sink.

[0006] Conventional UV reactors for water treatment systems rely on inefficient heat transfer methods. For example, conventional UV reactors utilize conventional FR4 printed circuit board assemblies along with a heat sink attached in one of two ways. 1) Heat sinks can be directly attached to the components to be cooled. This may involve mechanical support connections to a plate or chassis and thermal connections to the components, both of which increase costs. 2) If the component itself does not allow for direct attachment of a heatsink, an additional solder pad can be placed near the component on the outer layer of the printed circuit board to which the heatsink can be soldered. [Overview of the project]

[0007] An ultraviolet reactor is provided for disinfecting water. Generally, one innovative embodiment of the subject matter described herein can be embodied in an ultraviolet (UV) reactor for irradiating a stream of water with ultraviolet radiation. The ultraviolet reactor may have a processing assembly having a water inlet and a water outlet, the processing assembly may be operable to direct the water received through the water inlet toward a point of use downstream of the water outlet. The ultraviolet reactor may have a printed circuit board (PCB) having a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate. The first substrate may have a first surface having a circuit region.

[0008] In one embodiment, the ultraviolet reactor may have an ultraviolet light-emitting diode (UV-LED) operably connected to a PCB, which can be oriented to direct ultraviolet energy toward the processing assembly.

[0009] The thermal contact region of the thermally conductive substrate can be exposed such that the thermal contact region is missing from the dielectric and the first substrate, and the thermal contact region is in thermal communication with water flowing through the ultraviolet reactor.

[0010] The embodiments described above and other embodiments may each selectively, individually or in combination, have one or more of the following features. In particular, one embodiment includes all of the following combined features.

[0011] In some embodiments, the ultraviolet reactor may have a thermally conductive material having a fluid contact surface positioned to define at least a portion of the water flow path through the ultraviolet reactor. The thermally conductive material may be thermally coupled to the thermal contact region of a thermally conductive substrate to facilitate thermal communication between the water flowing through the ultraviolet reactor and the thermal contact region.

[0012] In some embodiments, the thermal contact area may be thermally connected to water flowing through an ultraviolet reactor via a thermally conductive material.

[0013] In some embodiments, a thermally conductive intermediate material can be provided between the thermally conductive material and the thermally conductive material to facilitate thermal communication between the water flowing through the ultraviolet reactor and the thermally conductive material.

[0014] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the processing assembly.

[0015] In some embodiments, the processing assembly may have a water treatment chamber having a first end, a second end, and a longitudinal axis extending between the first and second ends. The water treatment chamber may have a chamber inlet that is in fluid communication with a water inlet to receive water to be purified, and may have a plurality of chamber outlets that are operable to direct the water substantially non-parallel to the longitudinal axis of the water treatment chamber.

[0016] The UV-LED can be configured to supply ultraviolet energy to the water treatment chamber, and the ultraviolet energy can be directed substantially parallel to the longitudinal axis of the water treatment chamber.

[0017] The cooling chamber may be in fluid communication with multiple chamber outlets of the water treatment chamber. The cooling chamber may be in thermal communication with the UV-LED to facilitate the transfer of thermal energy from the UV-LED to the water in fluid communication with the water outlet. The cooling chamber may be operable to direct the water towards the water outlet.

[0018] In some embodiments, the fluid contact surface defines at least a portion of the fluid path in the cooling chamber.

[0019] In some embodiments, the ultraviolet reactor may have a reactor body having a reactor body inlet opening and a reactor body outlet opening. The ultraviolet reactor may have an upper cap positioned above the reactor body outlet opening and having a cooling chamber and UV-LEDs.

[0020] The upper cap may have an ultraviolet transmissive window disposed to facilitate the formation of a watertight seal between the UV-LED and the water treatment chamber. The ultraviolet transmissive window may have a water chamber side and an ultraviolet source side and may be disposed to facilitate the transmission of ultraviolet light from the UV-LED to the water treatment chamber.

[0021] The upper cap may have an internal support surface operable to support the water chamber side of the ultraviolet transmissive window positioned relative to the UV-LED.

[0022] The upper cap may have a plurality of outlet channels each forming at least a portion of each of the plurality of chamber outlets.

[0023] The cooling chamber may be disposed to be in direct fluid communication with each of the plurality of chamber outlets. The cooling chamber may be defined at least by an outlet collection trough, the ultraviolet transmissive window, and a thermally conductive material.

[0024] In some embodiments, the cooling chamber may at least partially surround the reactor body outlet opening.

[0025] In some embodiments, the PCB may be a metal-coated printed circuit board.

[0026] In some embodiments, the UV-LED may be disposed on the first surface of the first substrate.

[0027] In some embodiments, the solder resist may be disposed on the first surface of the first substrate.

[0028] In some embodiments, the upper and lower surfaces of the thermally conductive substrate may be completely devoid of solder resist.

[0029] In some embodiments, the thermally conductive substrate may have an upper surface defining a thermally contacting region.

[0030] In some embodiments, the stretched portion of the thermally conductive substrate may extend from the primary surface of the thermally conductive substrate on which the dielectric is arranged. The stretched portion may have an upper surface. The plane of the first substrate may intersect with the stretched portion.

[0031] In some embodiments, the first substrate and dielectric may define a first edge. The thermal conductive substrate may be positioned adjacent to the first edge and extend from both sides of the first edge such that a thermal contact area is positioned close to one side of the first edge and the thermal conductive substrate is bonded to the dielectric close to the other side of the first edge.

[0032] In general, one innovative aspect of the subject matter described herein can be embodied in a water treatment system for treating water. The water treatment system may have a treatment assembly inlet and a treatment assembly outlet, the treatment assembly inlet being operable to receive water and the treatment assembly outlet being operable to discharge water from the water treatment system.

[0033] The water treatment system may have a printed circuit board (PCB) having a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate. The first substrate may have a first surface having a circuit region. The thermal contact region of the thermally conductive substrate may be exposed such that the thermal contact region is missing the dielectric and the first substrate. An ultraviolet source may be operably connected to the circuit region of the printed circuit board, and the ultraviolet source may be configured to supply ultraviolet energy for disinfecting water.

[0034] A water treatment system may have a UV reactor configured to facilitate disinfection of water by applying ultraviolet energy to water flowing through the UV reactor. The UV reactor may have a water inlet operably connected to a treatment assembly inlet for receiving water, and a water outlet for discharging water from the UV reactor. The UV reactor may have a water treatment chamber having a first end, a second end, and a longitudinal axis extending between the first and second ends, the water treatment chamber may have a chamber inlet that is in fluid communication with the water inlet for receiving water to be purified. The water treatment chamber may have a plurality of chamber outlets operable to direct water in a direction substantially non-parallel to the longitudinal axis of the water treatment chamber, and the UV source is arranged to supply UV energy to the water treatment chamber in a direction substantially parallel to the longitudinal axis. The UV reactor may have a cooling chamber that is in fluid communication with the plurality of chamber outlets of the water treatment chamber, the cooling chamber may be in thermal communication with a thermal contact area of ​​a thermally conductive substrate to facilitate the transfer of thermal energy from the UV source to the water in fluid communication with the water outlet. The cooling chamber may be designed to operate in a way that directs water towards the water outlet.

[0035] The embodiments described above and other embodiments may each selectively, individually or in combination, have one or more of the following features. In particular, one embodiment includes all of the following combined features.

[0036] In some embodiments, the water treatment system may have a thermally conductive material having a fluid contact surface positioned to define at least a portion of the fluid path of water flowing through the water treatment system. The thermally conductive material may be thermally coupled to a thermal contact region of a thermally conductive substrate to facilitate thermal communication between the water flowing through the water treatment system and the thermal contact region.

[0037] In some embodiments, the thermal contact area may be thermally connected to water flowing through a water treatment system via a thermally conductive material.

[0038] In some embodiments, a thermally conductive intermediate material can be provided between the thermally conductive material and the thermally conductive material to facilitate thermal communication between the water flowing through the ultraviolet reactor and the thermally conductive material.

[0039] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the water treatment chamber.

[0040] In some embodiments, the water treatment system has a reactor body having a reactor body inlet opening and a reactor body outlet opening. The water treatment system has an upper cap positioned above the reactor body outlet opening and may have a cooling chamber and an ultraviolet source.

[0041] The upper cap may have an ultraviolet-transmitting window positioned to facilitate the formation of a watertight seal between the ultraviolet source and the water treatment chamber. The ultraviolet-transmitting window may have a water chamber side and an ultraviolet light source side. The ultraviolet-transmitting window may be positioned to facilitate the transmission of ultraviolet light from the ultraviolet source to the water treatment chamber. The upper cap may have an internal support surface that can be operated to support the water chamber side of the ultraviolet-transmitting window positioned relative to the ultraviolet source. The upper cap may have multiple outlet channels, each outlet channel forming at least a portion of one of the multiple chamber outlets.

[0042] The cooling chamber can be arranged to communicate directly with the fluid at each of the multiple chamber outlets, and the cooling chamber can be defined by at least an outlet collection trough, an ultraviolet-transmitting window, and a heat-conducting material.

[0043] In some embodiments, the cooling chamber may, at least partially, surround the outlet opening of the reactor body.

[0044] In some embodiments, the PCB can be a metal-clad printed circuit board.

[0045] In some embodiments, the ultraviolet source may be located on the first surface of the first substrate.

[0046] In some embodiments, the solder resist may be placed on a first surface of the first substrate.

[0047] In some embodiments, the top and bottom surfaces of the thermally conductive substrate may be completely devoid of solder resist.

[0048] In some embodiments, the thermally conductive substrate may have an upper surface that defines a thermal contact area.

[0049] In some embodiments, the thermally conductive substrate may have a lower surface that defines a thermal contact area. This thermal contact area may be thermally connected to a heat sink, such as a heat sink described herein, or to an alternative heat sink, such as a heat sink having a different geometry from one or more heat sinks shown in the illustrated embodiments (for example, a stainless steel heat sink in contact with the lower surface of the thermally conductive substrate, or with both the upper and lower surfaces of the thermally conductive substrate).

[0050] In some embodiments, the stretched portion of the thermally conductive substrate may extend from the primary surface of the thermally conductive substrate on which the dielectric is arranged. The stretched portion may have an upper surface. The plane of the first substrate may intersect with the stretched portion.

[0051] In some embodiments, the first substrate and dielectric can define a first edge, and the thermal conductive substrate can be positioned adjacent to the first edge and extend from both sides of the first edge, such that a thermal contact area is positioned close to one side of the first edge and the thermal conductive substrate is positioned close to the other side of the first edge and bonded to the dielectric.

[0052] In general, one innovative embodiment of the subject matter described herein can be embodied in a method for disinfecting water. The method may include the steps of providing a treatment assembly having a water inlet and a water outlet, and directing water passing through the treatment assembly from the water inlet toward the water outlet toward a point of use downstream of the water outlet. The method may include the step of providing an ultraviolet light source connected to a circuit region of a printed circuit board (PCB), wherein the PCB has a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate, and the first substrate has a first surface having a circuit region. The thermally conductive substrate may be exposed such that the thermally contacted region lacks the dielectric and the first substrate. The method may include the steps of conducting heat from the ultraviolet light source to the thermally contacted region of the PCB, and conducting heat to water flowing from the thermally contacted region of the PCB toward the water outlet.

[0053] The embodiments described above and other embodiments may each selectively, individually or in combination, have one or more of the following features. In particular, one embodiment includes all of the following combined features.

[0054] In some embodiments, the PCB can be a metal-clad printed circuit board.

[0055] In some embodiments, the method may include a step of supplying ultraviolet energy from an ultraviolet source to water flowing through a treatment assembly.

[0056] Before describing embodiments of the present invention in detail, it should be understood that the present invention is not limited to the details of the operation or configuration and arrangement of the components described below or illustrated in the drawings. The present invention may be carried out in various other embodiments and may be carried out or implemented in alternative ways not expressly disclosed herein. It should also be understood that the terms and technical terms used herein are for illustrative purposes only and should not be considered limiting. The use of “including” and “comprising” and their variations means that the items, their equivalents, additional items, and their equivalents listed thereafter are included. Furthermore, enumerations may be used in the description of various embodiments. Unless otherwise specified, the use of enumerations should not be construed as limiting the invention to any particular order or number of components. Nor should the use of enumerations be construed as excluding any further steps or components that can be combined with the enumerated steps or components from the scope of the present invention. [Brief explanation of the drawing]

[0057] [Figure 1] Figure 1 shows a printed circuit board assembly with a heatsink according to one embodiment. [Figure 2] Figure 2 shows a printed circuit board assembly with a heatsink according to another embodiment. [Figure 3] Figure 3 shows a printed circuit board assembly with a heatsink according to yet another embodiment. [Figure 4] Figure 4 shows a perspective view of a water treatment system according to one embodiment. [Figure 5] Figure 5 shows an exploded view of the water treatment system shown in Figure 1. [Figure 6] Figure 6 shows an exploded view of the water treatment system shown in Figure 1. [Figure 7] Figure 7 shows a perspective view of an ultraviolet reactor according to one embodiment. [Figure 8] Figure 8 shows a side view of the ultraviolet reactor shown in Figure 1. [Figure 9] Figure 9 shows another side view of the ultraviolet reactor shown in Figure 1. [Figure 10] Figure 10 is a partially exploded view of the ultraviolet reactor shown in Figure 1. [Figure 11] Figure 11 is an exploded view of the ultraviolet reactor shown in Figure 1. [Figure 12] Figure 12 shows a cross-sectional view of the ultraviolet reactor shown in Figure 1. [Figure 13] Figure 13 shows a cross-sectional view of the ultraviolet reactor shown in Figure 1. [Figure 14] Figure 14 shows a cross-sectional view of the ultraviolet reactor shown in Figure 1. [Figure 15] Figure 15 shows an enlarged cross-sectional view of Figure 14. [Figure 16] Figure 16 shows a printed circuit board assembly in one embodiment of the present disclosure. [Modes for carrying out the invention]

[0058] The ultraviolet reactor is provided for disinfecting water and has an ultraviolet source printed circuit board assembly configured to transfer heat to a heat sink in the form of a water-facing heat coupler. The ultraviolet source printed circuit board assembly may have a metal-coated printed circuit board having a thermal contact area that is in thermal communication with the heat sink.

[0059] In one embodiment, the connection may be provided between a metal-coated PCB, or a similar board having a thermally conductive inner layer, and a component mounted on the metal-coated PCB. This component may generate heat that the metal-coated PCB can conduct through one or more intermediate materials or layers to a heat-removing material (e.g., air or water).

[0060] In conventional FR4 PCBs, the core is made of glass fiber, which is not conductive and therefore not a good thermal conductor; as a result, most of the heat flux is supplied to the outer (thin) copper layer. For this reason, heat sinks are often thermally connected to the outer copper layer of the board to remove heat from the FR4 PCB.

[0061] In contrast to conventional FR4 PCBs, one embodiment of the present disclosure may have a metal-clad substrate PCB having three conductive layers: an upper copper layer, a lower copper layer, and a core layer (e.g., a copper or aluminum core). In the case of a metal-clad PCB, in one embodiment, a core can be provided because the core provides significantly greater thermal conductivity than the upper and lower layers, allowing the thermal pads of components (e.g., LEDs) to be soldered directly to the core layer rather than to the upper or lower layer. To enhance heat transfer to a heat sink mounted on the board, this heat sink can also be directly connected to the core layer.

[0062] In one embodiment, the components may be soldered to the outer layer (e.g., the top or bottom layer) of the metal-clad PCB. This configuration allows for one or more additional and potentially insulating layers between the heat sink and the primary heat carrier. While the configuration with components soldered to the top or bottom layer of the metal-clad PCB may be less efficient in terms of heat transfer compared to embodiments where the components are directly soldered to the core layer, in either case, the thermal conductivity is significantly greater than that of conventional FR4 PCB configurations.

[0063] A metal-clad PCB according to one embodiment may have a substrate having solder resist that is not present in the core layer, and a portion of the core layer is exposed according to one or more embodiments described herein. The outer conductive layer may or may not have solder resist. The outer conductive layer may be thermally coupled to the core layer via a dielectric layer having high thermal conductivity. The core layer may be a primary thermal support layer such that, in addition to the solder resist, the additional layers (e.g., the outer conductive layer and the dielectric) may be considered more insulating rather than facilitating heat transfer.

[0064] In one embodiment, the metal-clad PCB may be configured to eliminate (or, depending on the manufacturing process, not be present at all) any additional layer that would otherwise be between the heat sink and the core layer (e.g., a copper core layer).

[0065] In one embodiment, the core layer of a metal-clad PCB can be assigned to an electrical net that may be common to all electrical components intended to be actively cooled via a heat sink. This may be a grounding net, but the core layer can be assigned to some other net or an electrically unconnected floating net. Components intended for heat transfer can then be soldered directly to the core material. The heat sink may be connected to the same core material via mechanical contact, thermal compound, soldering or other methods.

[0066] In one embodiment, the LED provided as an ultraviolet source may have a thermal pad that can be connected to the core layer. The heatsink may be connected to the core layer either mechanically (metal-to-metal contact) or with a thermal compound.

[0067] In an alternative embodiment, the LED may not have a thermal pad, but instead utilize specific pins, pads, or nets connected to the die for heat transfer. In this case, the core layer may be connected to those specific pins, pads, or nets.

[0068] In one embodiment, if the heat sink is not connected to a net used as a thermal connection for the component, the dielectric layer for the metal cladding can be placed in a predetermined position, and the heat flux can flow from the net to the outer conductive layer and through the dielectric layer to the core layer.

[0069] In one embodiment, the cooling component and the heat sink connection may be located on the same side of the metal-clad PCB. Alternatively, the component and heat sink may be located on both sides of a double-sided PCB, and the PCB laminate may have two dielectric layers, two copper layers, and a silkscreen layer between the component's thermal pad and the heat sink. In one embodiment, by eliminating all layers except the core layer between the component and the heat sink, and by mounting the heat sink on either the component side or the opposite side of the core layer, no additional loss of heat flux is generated.

[0070] 1. Overview of the water treatment system A water treatment system 100 according to one embodiment of the present disclosure is shown in Figures 4 to 6 and is collectively referred to as reference numeral 100. The water treatment system 100 in the illustrated embodiment comprises a treatment assembly 130 and a base assembly 110. The water treatment system 100 may have a removable cover (not shown) configured to fit with the base assembly 110 in order to conceal one or more or all sides of the treatment assembly 130. In one embodiment, the removable cover can conceal the treatment assembly 130 and give the water treatment system 100 an aesthetic appeal in order to position the water treatment system 100 on a countertop or to position it so that it is visible during daily use.

[0071] The removable cover can provide the water treatment system 100 with a separable aesthetic shell structure that allows for updating or changing the form, material, and color of the treatment system 100. For example, a removable cover in one application can be replaced with another removable cover having one or more different embodiments relating to form, material, or color, or a combination thereof.

[0072] In one embodiment, the water treatment system 100 may have ultraviolet disinfection capabilities. The water treatment system 100 may have an ultraviolet disinfection assembly or ultraviolet reactor 200 as described herein that provides such ultraviolet disinfection capabilities. In one embodiment, the ultraviolet reactor 200 may have a long-life or permanent LED reactor assembly installed in a predetermined position within the base assembly 110.

[0073] In the embodiments illustrated in Figures 4 to 6, the processing assembly 130 may be detachable from the base assembly 110 in a manner that facilitates the storage or placement of the water treatment system 100 for operation in a space that restricts access to one or more sides or parts of the water treatment system 100, such as the upper section 102, rear section 103, side section 104, or base section 105, or a combination thereof. For example, the space between the upper section 102 and another object, such as a side cabinet, may be sufficiently small so as to restrict access to the upper section 102 or to restrict the vertical displacement of one or more components of the water treatment system 100 (e.g., the processing assembly 130). In one embodiment, the water treatment system 100 can be considered to incorporate a “flat” aspect ratio that preserves usable workspace in a countertop installation and substantially minimizes intrusion into storage space in an under-counter installation.

[0074] Examples of water treatment configurations are described in more detail in U.S. Patent Application No. 62 / 839,145, entitled "Water Treatment System," filed April 26, 2019, and U.S. Patent Application No. 16 / 857,253, entitled "Water Treatment System," filed April 24, 2020, and are incorporated herein by reference to the entirety of these disclosures.

[0075] In one embodiment, the removable cover can engage with and disengage from the base assembly 110 in a direction substantially parallel to the surface on which the base assembly 110 is located. In this way, the removable cover can facilitate access to the treatment assembly 130 while the water treatment system 100 is positioned in a spatially constrained location as described herein, which may restrict access to the water treatment system 100 along one or more sides or a portion thereof.

[0076] The water treatment system 100 is operable to receive untreated water from a supply source, such as a chilled water service line configured to supply water under pressure, via a water inlet pipe 112. The water treatment system 100 is also operable to treat the untreated water received from the water source and send the treated water to a water outlet pipe 114, which can be connected to a faucet to deliver the treated water to a point of use. In one embodiment, the water connections for the inlet and outlet piping or tubes are housed or provided in a space beneath the unit accessible to the installer. The connectors can provide a rotational function for aligning multiple components of the system during installation.

[0077] The processing assembly 130 may have a water inlet that is operable to receive water from the water inlet pipe 112 through the base assembly inlet passage. The water inlet of the processing assembly 130 may have a one-way valve or check valve connected to it (for example, arranged in series with the water inlet of the processing container 134) to substantially prevent leakage of stagnant water within the processing assembly 130 during transport to a maintenance location (for example, often a water collection container or more commonly a kitchen sink).

[0078] The processing assembly 130 may have a closing assembly 132 with a handle assembly 136 that is operable to secure the processing assembly 130 in a pocket provided by the base assembly 110. The movement of the handle assembly 136 from the disengaged position to the engaged position may form a watertight connection between the base assembly 110 and the processing assembly 130, causing them to resist the flow of water at the water connection.

[0079] In the illustrated embodiment, a pre-filter of the processing assembly 130, also described as a pre-stage filter, may provide filtration for particles in the untreated water received through the processing assembly inlet. The water flowing through the pre-filter may be connected to a downstream filter, such as a filter assembly, which can operate to further treat the water that has passed through the pre-filter. In one embodiment, the pre-filter may be configured to provide filtration for particulate matter that, if not removed upstream of the filter assembly, could significantly reduce the usable life of the filter assembly. For example, the filter assembly may be configured for filtering particulate matter that is considered fine or small for the target flow rate, while the pre-filter may be configured for filtering particulate matter that is considered larger (e.g., 30 to 500 microns) for the target flow rate. Without the pre-filter, such larger particles could clog the filter or reduce the effective filtration and effective life of the filter assembly.

[0080] The filter assembly's filtration medium may have a carbon block filter that operates to adsorb or filter (or both) parts and contaminants contained in the water so that the water discharged from the filtration medium is filtered and considered ready for disinfection downstream by the ultraviolet reactor 200.

[0081] A base assembly 110 according to one embodiment has an upper portion 102, a rear portion 103, a side portion 104, and a base portion 105, as described herein. The base assembly 110 is operable to be detachably connected to the processing assembly 130, for example, by facilitating the formation of watertight seals between the water source connector and the processing assembly connector and between the processing assembly outlet of the base assembly 110 and the processing assembly connector. In one embodiment, the base assembly 110 may have a body that provides a detachable structure for holding and connecting the processing assembly 130.

[0082] In the illustrated embodiment, the base assembly 110 has a cover 310 that can be removed from the frame assembly 313 of the base assembly 110 to expose internal components 312 of the base assembly 110, such as a sensor unit 316 (e.g., a flow sensor) and a control system 318. The frame assembly 313 can provide the structural core of the water treatment system 100 and can provide a platform for positioning a set of assemblies, which can be modularized and facilitate one or more modes of treating water for consumption. This configuration can allow for the continuous evolution of the water treatment system 100 (e.g., changes to components of the water treatment system such as a display unit or a control unit) while maintaining substantially the same shape factors. Thus, the water treatment system 100 can be updated to remain current in the future.

[0083] The base assembly 110 may have a display unit 314 having a display 315, which can provide the user with visual feedback regarding the operation of the water treatment system 100. In the illustrated embodiment, the cover 310 conceals the display 315 and the display unit 314. Alternatively, the display 315 and the cover 310 may be configured such that the display 315 is partially or completely concealed by the cover 310.

[0084] The lens 311 is optically connected between the display 315 of the water treatment system 100 and the external area, enabling optical communication with the display 315 and the external area.

[0085] The base assembly 110 may have a platform or base 105 that can be operated to stabilize the base assembly 110 on a horizontal surface such as a countertop or within a cabinet. The base 105 may be configured to support the frame assembly 313 at a distance from the horizontal plane, while having peripheral edges that contact the horizontal plane, so that the frame assembly 313 can remain spaced above water or other elements to the extent that water or other elements are present on the horizontal plane. The base 105 may have one or more access points that can be operated to receive a water inlet pipe 112 and a water outlet pipe 114 for connection to a water source inlet and a treated water outlet, respectively.

[0086] In the illustrated embodiment, the control system 318 may have a circuit configured to instruct the operation of the water treatment system 100, the steps of: instructing a display unit 314 to provide visual feedback to the user; and receiving sensor information obtained from a sensor unit 316. As described herein, the control system 318 may also be operable to instruct the operation of the ultraviolet reactor 200 to disinfect the water discharged from the treatment assembly 130 and discharge the treated water to the treated water outlet 360. The water discharged from the ultraviolet reactor 200 may flow through the sensor unit 316 to the treated water outlet 360, which is in fluid communication with the water outlet pipe 114.

[0087] In the illustrated embodiment, the internal components of the base assembly 110, such as wet and electrical unit assemblies, mounted on the frame assembly 313, may be covered by a rear cover assembly (e.g., cover 310) that provides an aesthetic appearance and aesthetic sense, potentially protects the internal components, and can accommodate a photoconductive structure that provides a system health indicator as an extension of the display unit 314.

[0088] The base 105 (e.g., a base component) can be fixed to the unit body assembly, providing aesthetic piping management, and offering stable, structural, or protective housing, and assisting in the desired positioning means.

[0089] The internal components of the base assembly 110 may include a display unit 314, a control system 318, a sensor unit 316, and an ultraviolet reactor 200, as described herein. In the illustrated embodiment, the ultraviolet reactor 200 has an ultraviolet reactor inlet 232 that is in fluid communication with a treated water outlet 360 to receive water discharged from the treatment assembly 130. The ultraviolet reactor 200 may be operable to supply ultraviolet energy to the water received through the ultraviolet reactor inlet 232 in order to disinfect the water. The disinfected water may be discharged or output through the ultraviolet reactor outlet 230, which is in fluid communication with a water inlet 385 of the sensor unit 316.

[0090] In the illustrated embodiment, the components include an RFID communicator or wireless communication circuit 390 that can wirelessly communicate with one or more components outside the base assembly 110. For example, the wireless communication circuit 390 can communicate with an RFID component (e.g., an RFID tag) provided inside the filter assembly.

[0091] In one embodiment, the wireless communication circuit 390 may have an RFID antenna mounted on the frame assembly 313 in close proximity to the processing assembly 130 at the installation location, and is connected to the control system 318 (or main electronic equipment) by a detachable tether.

[0092] It should be understood that the electrical and control systems are not limited to those described in relation to the illustrated embodiment of the water treatment system 100, and that the electrical control system may be updated, replaced, or substituted with other technical systems, as determined, independently of other system components.

[0093] The water channel components of the base assembly 110 (e.g., the sensor unit 316 and the ultraviolet reactor 200) may be arranged and fixed to the frame assembly 313. The sensor unit 316 can monitor and measure the water flow. Furthermore, the sensor unit 316 may measure the water temperature.

[0094] In one embodiment, the control system 318 may be directly plugged into or connected to the ultraviolet reactor 200 after connections to the control system 318 have been established between the wireless communication circuit 390, the display unit 314, and an optional sensor (e.g., sensor unit 316). The connection to the ultraviolet reactor 200 may be formed via a connection panel on the underside of the control system 318. The connection panel may also provide connectors for the wireless communication circuit 390, the display unit 314, and the optional sensor. The connection panel located on the underside of the control system 318 facilitates concealing the connections from normal view, improves the overall aesthetics of the assembly, and substantially shields the electronic connections from any accidental splashes of water.

[0095] 2. Ultraviolet reactor A UV reactor in one embodiment of the present disclosure is shown in Figures 7 to 15, and is generally denoted by reference numeral 200. The UV reactor 200 in the illustrated embodiment has a UV reactor inlet 232 and a UV reactor outlet 230. The ultraviolet reactor 200 may have one or more of the following components: Reactor body 201 End cap 202 having at least one outlet that is in fluid communication with the UV reactor outlet 230 UV-transmitting window 205 Water facing heat coupler 406 To substantially prevent leakage across the seal interface between the water-opposing heat connector 406 and the end cap 202, a first seal 210 is provided at least between the water-opposing heat connector 406 and the end cap 202. To substantially prevent leakage across the seal interface between the second seal 203 and the ultraviolet-transmitting window 205, the second seal 203 is positioned between the water-opposed heat connector 406 and the ultraviolet-transmitting window 205. A UV source assembly 400 having one or more UV sources 402 as described herein. A support cap 209 is positioned and configured to align with the end cap 202 and is operable to hold the ultraviolet source assembly 400, the first seal 210 and the second seal 203, the ultraviolet-transmitting window 205 and the water-facing heat connector 406 in place. A reactor body support 211 that can be operated to hold the reactor body 201 in order to facilitate the formation of the water treatment chamber 245. Disposable fluid elements 216 within the water treatment chamber 245 to influence the water flow depending on the application (for example, to generate laminar flow) To maintain a watertight seal within the water treatment chamber 245 from the UV reactor inlet 232 to the UV reactor outlet 230, a support cap 209, an end cap 202, and a fastener 214 that can operate to align with the reactor body support 211 are used.

[0096] In the illustrated embodiment, the reactor body support 211 and the end cap 202 are joined together in a substantially permanent and leak-free manner. As an example, the reactor body support 211 and the end cap 202 can be spin-welded together to form a seal 204. This type of connection between the reactor body support 211 and the end cap 202 can provide a leak-free connection without the use of a removable seal, although such a removable seal can be incorporated into an alternative embodiment of the ultraviolet reactor 200.

[0097] The ultraviolet reactor 200 can be configured to allow water to enter an ultraviolet reactor inlet 232, which is at least partially defined by the reactor body support 211. The ultraviolet reactor inlet 232 may have a hose barb connector 233 connected to the reactor body support 211 (e.g., via a spin weld) to define at least a portion of the ultraviolet reactor inlet 232, in order to facilitate the entry of water into the ultraviolet reactor 200 and through the water treatment chamber 245. The water may flow through one or more channels provided by the flow element 216 before entering the water treatment chamber 245. Water can be discharged from the ultraviolet reactor 200 through an ultraviolet reactor outlet 230, which may have a hose barb connector 237 connected to the end cap 202 (e.g., via a spin weld) to define at least a portion of the ultraviolet reactor outlet 230.

[0098] In the illustrated embodiment, the ultraviolet reactor inlet 232 and the ultraviolet reactor outlet 230 are configured to guide water transversely to the longitudinal axis 240 of the ultraviolet reactor 200. This configuration may allow for a reduction in the vertical profile of the ultraviolet reactor 200.

[0099] The water treatment chamber 245 may have an internal side surface 290 of the reactor body 201 that extends generally along a longitudinal axis 240 that runs between the two ends, from a first end 291 to a second end 292 of the water treatment chamber 245. The internal side surface 290 of the water treatment chamber 245 does not have to define the entire internal surface of the water treatment chamber. For example, one or more parts of the end cap 202, the reactor body support 211, and the fluid element 216 may define one or more parts of the internal surface of the water treatment chamber 245.

[0100] The reactor body 201 may have a first opening and a second opening located near the first end 291 and the second end 292 of the water treatment chamber 245, respectively. For example, the reactor body 201 may be provided in the form of a hollow cylinder having a first end and a second end corresponding to the bottom and top surfaces of the reactor body 201, as shown in Figures 12 to 14. However, the reactor body 201 can be any type of cylinder and is not limited to the cylindrical structure shown in the illustrated embodiments. For example, the cross-sectional shape of the reactor body 201 can vary depending on the application, for example, a hexagonal prism or an octagonal prism. As another example, the reactor body 201 may have multiple longitudinal axes such that the reactor body 201 has multiple segments with multiple non-collinear longitudinal axes.

[0101] The reactor body 201 can be constructed from one or more materials depending on the application. For example, the reactor body 201 may have a first material and a second material arranged concentrically, such as a first material forming a sleeve around a second inner material, and the surfaces of the first and second materials come into contact with water as water flows through the water treatment chamber 245. As another example, the reactor body 201 may be entirely made of an ultraviolet reflective material such as PTFE or ePTFE. The reflection of ultraviolet light from the reactor body 201 within the water treatment chamber 245 facilitates the maintenance of the intensity of ultraviolet light within the water treatment chamber 245 and can substantially block the leakage of ultraviolet light to the outside of the water treatment chamber 245.

[0102] In the illustrated embodiment, the ultraviolet source assembly 400 may be positioned near the second end 292 of the water treatment chamber 245. The ultraviolet source assembly 400 may have a printed circuit board (PCB) assembly 480 and may be configured to direct ultraviolet light toward the water treatment chamber 245 through an ultraviolet-transmitting window 205 which may be formed from quartz. As described herein, the ultraviolet source assembly 400 may have the PCB assembly 480 and an ultraviolet source device having a plurality of ultraviolet sources 402 which may be UV-LEDs. The ultraviolet source assembly 400 may have a connector 223 configured to allow power to be supplied to the circuit of the ultraviolet source assembly 400.

[0103] During use, the ultraviolet reactor 200 is positioned vertically within the water treatment chamber 245, as shown in Figures 7 to 15. Water rises toward the ultraviolet source 402 of the ultraviolet source assembly 400 toward the ultraviolet source 402 of the PCB assembly 480 and then flows out of the water treatment chamber 245 through at least one outlet path, at least partially defined by the end cap 202. The at least one outlet path may be fluidically coupled to the ultraviolet reactor outlet 230 to discharge treated water from the ultraviolet reactor 200. The at least one outlet path may have a plurality of chamber outlets 246, as shown in more detail in the illustrated embodiments of Figures 10 to 11. The plurality of chamber outlets 246 may be fluidly coupled to a heat exchange region 236, described herein as a trough or cooling chamber, which transfers thermal energy away from the water-opposing heat coupler 406 before the water exits through the ultraviolet reactor outlet 230, as shown in Figures 12 and 14, where the heat is indicated by dashed arrows.

[0104] Multiple chamber outlets 246 can be defined at least partially by multiple openings within the internal side surface 290 of the water treatment chamber 245, allowing for radial discharge of water relative to the longitudinal axis 240 of the water treatment chamber 245. More specifically, multiple chamber outlets 246 can be defined by channels provided in the end cap 202 and portions of the chamber-facing surfaces of the ultraviolet-transmitting window 205. Multiple chamber outlets 246 can be configured differently, as described in relation to multiple chamber outlets 246.

[0105] In the illustrated embodiment of the ultraviolet reactor 200, a flow path defined by a plurality of chamber outlets 246 may be formed adjacent to the second end 292 of the end cap 202. The plurality of chamber outlets 246 may lead to a collection trough or heat exchange region 236 that is in fluid communication with the ultraviolet reactor outlet 230 provided by the end cap 202. The collection trough or heat exchange region 236 may extend around part or all of the inner circumference of the end cap 202, as shown in the illustrated embodiments of Figures 10-11.

[0106] In the embodiments illustrated in Figures 1 and 7 to 15, the ultraviolet source assembly 400 is thermally connected to a water-opposed heat coupler 406, which may be made of a metal such as steel, aluminum, or copper. The water-opposed heat coupler 406 may act as a heat sink, drawing thermal energy from the ultraviolet source assembly 400 and facilitating the transfer of that energy to one or more other media, such as water, across the ultraviolet reactor outlet 230. The ultraviolet source assembly 400 may have a thermal contact area 440 that is thermally connected to or in direct thermal contact with the water-opposed heat coupler 406. In one embodiment, a thermally conductive intermediate material (e.g., thermal paste, thermal grease, or thermal compound) may be placed between the thermal contact area 440 and the water-opposed heat coupler 406.

[0107] The ultraviolet source assembly 400 may have an integrated source-based thermal coupler, which may be thermally coupled to a water-opposed thermal coupler 406. For example, the source-based thermal coupler and the water-opposed thermal coupler 406 can be brought into contact with each other so that water flowing through the heat exchange region 236 can absorb heat from the ultraviolet source assembly 400. This allows the water flowing through the collection trough or heat exchange region 236 to cool the water-opposed thermal coupler 406, thereby cooling the source-based thermal coupler and one or more ultraviolet sources 402 of the ultraviolet source assembly 400.

[0108] In the illustrated embodiment, the ultraviolet reactor 200 may have a flow element 216 positioned to form a first end of the water treatment chamber 245. In one embodiment, the flow element 216 may be a baffle that facilitates the formation of laminar flow from the first end 291 to the second end 292. The flow element 216 may have a plurality of fluid paths that connect the fluid received by the ultraviolet reactor inlet 232 to the water treatment chamber 245. The ultraviolet reactor 200 may have a flow direction regulator or deflector 266 selectively integrated with the flow element 216, which may facilitate the generation of turbulent water flow in proximity to the plurality of fluid paths of the flow element 216 on the opposite side of the water treatment chamber 245.

[0109] In the illustrated embodiment, the ultraviolet source assembly 400 is spaced apart from the ultraviolet-transmitting window 205. As described herein, the second seal 203 may be configured as a spacer that can operate to fill at least a portion or a substantial amount of the space between the ultraviolet source assembly 400 and the ultraviolet-transmitting window 205. By filling this space, which otherwise contains air or another gas, the second seal 203 can reduce the amount of air or other gas in the space.

[0110] As described herein, the second seal 203 may have a plurality of openings 213 corresponding to each of the plurality of ultraviolet sources (e.g., UV-LEDs) of the ultraviolet source assembly 400, allowing light from the ultraviolet sources to enter the water treatment chamber 245 through the ultraviolet-transmitting window 205. The second seal 203 may have an alignment mechanism that can be operated to angularly align the second seal 203 with respect to the ultraviolet source assembly 400 and the ultraviolet source 402 located on the ultraviolet source assembly 400, thereby directing and guiding light from the ultraviolet source assembly 400 to the ultraviolet-transmitting window 205 and into the water treatment chamber 245.

[0111] In the illustrated embodiment, the second seal 203 is made of a silicone-based material. However, it should be understood that this disclosure is not so limited. The second seal 203 can be made of any type of material or combination of materials. For example, the second seal 203 can be formed of the first material and a second material different from the first material.

[0112] The ultraviolet reactor 200 having a water treatment chamber 245 can be configured in various ways as described herein. Additional exemplary configurations are described in U.S. Patent Application Publication No. 2021 / 0032127, entitled “Water Treatment System,” published on 4 February 2021, which is incorporated herein by reference in its entirety.

[0113] 3. Materials for the water treatment room The water treatment chamber 245 in the embodiments illustrated in Figures 7 to 15 can be constructed in various ways using various materials. The material forming the water treatment chamber 245 can provide an ultraviolet reflective surface. The entire inner surface of the water treatment chamber 245 can be reflective to ultraviolet light, or a portion of the inner surface can be reflective to ultraviolet light.

[0114] The ultraviolet reflective surface can be positioned to reflect ultraviolet radiation toward the water to be purified in order to increase the level of ultraviolet radiation in the water sample or to make more efficient use of the ultraviolet radiation generated by the ultraviolet radiation source. Compositions can be utilized to provide a target level of ultraviolet reflectance for use in water treatment systems. In the illustrated embodiment, a composition suitable for direct contact with the water to be purified can be provided.

[0115] For example, as shown in the illustrated embodiment of Figure 10, the water treatment chamber 245 may have a reactor body 201 and a fluid element 216 made of a diffuse reflective material such as PTFE that provides at least 80% to 90% reflectivity. Diffuse reflective materials can facilitate the reflection of light or other waves or particles from a surface so that light rays incident on the surface are scattered at many angles (not just one angle, as in specular reflection).

[0116] As another example, the water treatment chamber 245 may consist of a quartz tube, potentially pure quartz, and a piece of stainless steel forming a sleeve around the quartz tube. Alternatively, the stainless steel sleeve may be replaced with a PTFE sleeve positioned around the quartz tube.

[0117] In alternative embodiments, one or both of the components defining the internal surface of the water treatment chamber 245 may be coated to facilitate the reflection of ultraviolet light within the water treatment chamber 245. For example, in the illustrated embodiment of Figure 9, the reactor body 201 may be metal-coated quartz (e.g., aluminum oxide-coated quartz). The coating on one or more of the components may be positioned to define the internal surface of the water treatment chamber 245. Furthermore, the coating on one or more of the components may be positioned on the surface of a component opposite to the surface of a component that defines part of the internal surface of the water treatment chamber 245. To provide an example, the metal-coated quartz used in the reactor body 201 in the illustrated embodiment may be coated on its outer surface so that the internal surface of the quartz tube is in direct contact with the water provided in the water treatment chamber 245. The coating applied to a component defining at least a portion of the internal surface of the water treatment chamber 245 may be on the interior of the component, such as when the component is formed of two or more laminated materials, and one or more of the two or more laminated materials may be used to coat one or both sides of the component.

[0118] In one embodiment, the flow element 216 may be formed of a reflective material or may be provided with a reflective material. For example, the reflective material may be placed on the substrate component of the flow element 216, or the reflective material may cover the substrate component.

[0119] In one embodiment, the ultraviolet-transmitting window 205, which forms at least a portion of the internal surface of the water treatment chamber 245, may be configured to allow ultraviolet light into the water treatment chamber 245 but to reflect light internally within the water treatment chamber 245.

[0120] The reflective components installed within the assembly of the water treatment chamber 245 allow for the efficient maintenance of ultraviolet light intensity within the water treatment chamber 245 at a significant level.

[0121] 4. Water flow path and ultraviolet light path As described herein, the ultraviolet reactor 200 can be configured to utilize the water flowing through the ultraviolet reactor 200 as a cooling medium for the ultraviolet source 402 that substantially disinfects the water. In the illustrated embodiments of Figures 7 to 16, the water channel 238 is shown together with the ultraviolet light path 239 in the water treatment chamber 245, from the ultraviolet reactor inlet 232 to the ultraviolet reactor outlet 230.

[0122] The flow element 216 is provided within the water flow path in the ultraviolet reactor 200 and guides the water flow downstream of the flow element 216 and within the water treatment chamber 245 in the ultraviolet light path 239. The ultraviolet light path 239 and its intensity can be a function of the number and arrangement of ultraviolet sources 402 relative to the ultraviolet-transmitting window 205 and the ultraviolet source assembly 400.

[0123] For example, the ultraviolet source 402 can be positioned near the center of the radius of the reactor body 201 (or within the middle 20% range). In other words, the ultraviolet source 402 can be substantially positioned at a radius 405 that is 0.5 times the radius of the reactor body 201.

[0124] In one embodiment, the ultraviolet sources 402 may be arranged uniformly around a radius 405 (for example, in an evenly spaced pattern). This configuration may provide an optimized disinfection configuration in one embodiment. In one embodiment, changing the position of the ultraviolet sources 402 relative to the radius 405 may affect performance. For example, the ultraviolet sources 402 may be positioned directly in the center of the ultraviolet source assembly 400.

[0125] In the illustrated embodiment, the ultraviolet reactor 200 has deflectors 266A, 266B located in the water channel 238 upstream of the water treatment chamber 245 so as to generate turbulence in a turbulent region 296 before the water flows through the flow element 216. In one embodiment as described herein, the deflectors 266A, 266B may have projections 263 that are operably positioned directly in the water channel passing through the ultraviolet reactor inlet 232 to facilitate changing the direction of flow in a turbulent manner, and one or more vents positioned around the projections 263 to facilitate directing the water toward the turbulent region 296 in a turbulent manner. The turbulent region 296 may be partially defined by a curved wall 294 to further enhance the turbulence within the turbulent region 296.

[0126] By providing turbulence in the turbulent region 296 directly upstream of the flow element 216, the water is distributed more evenly across the flow path of the flow element 216. As a result, the flow rate of water flowing within the water treatment chamber 245 can be distributed more evenly.

[0127] In one embodiment, the flow element 216 may be configured to substantially prevent high-velocity areas within the water treatment chamber 245, particularly near the ultraviolet-transmitting window 205. Such high-velocity areas may reduce the exposure time to any microorganisms present in the water flowing through them.

[0128] Moving to the embodiments illustrated in Figures 7 to 15, the water channel 238 has water that flows through a plurality of chamber outlets 246 into the heat exchange region 236 and then to the ultraviolet reactor outlet 230. The heat exchange region 236 can be annular and may surround the second end 292 of the water treatment chamber 245, as described herein.

[0129] The heat exchange region 236 can provide a water channel 238 that is in direct contact with the water-opposing heat coupler 406, which is then thermally coupled to the heat-contact region 440 of the ultraviolet source assembly 400. The ultraviolet source assembly 400 is configured as described herein to facilitate the flow of heat from the ultraviolet source 402 to the water-opposing heat coupler 406 and ultimately to the water flowing through the heat exchange region 236. This heat channel is indicated by dashed arrows in the illustrated embodiments of Figures 12 and 14, leading from the ultraviolet source 402 to the heat exchange region 236 and out of the ultraviolet reactor outlet 230.

[0130] In the illustrated embodiment, the heat flow path proceeds as follows: a water-facing heat coupler 406, also described as a water outlet collection trough, including a support ring for an ultraviolet-transmitting window 205, which may be stainless steel or "lead-free" brass for direct water contact (without substantial leaching of harmful substances into the water), the rear or back of the multiple ultraviolet sources 402, the thermal components of the ultraviolet source assembly 400 (e.g., metal cladding), and a water outlet collection trough.

[0131] In one embodiment, the heat flow path proceeds as follows: the rear or back side of multiple ultraviolet sources 402, the thermal components of the ultraviolet source assembly 400 (e.g., metal coating), thermal paste (or pad or adhesive), source-side thermal couplers (e.g., PCB assembly back support (e.g., aluminum or copper or thermal plastic)), water-facing thermal couplers 406, such as support rings for ultraviolet-transmitting windows 205, which may be stainless steel or "lead-free" brass for direct water contact (without substantial leaching of harmful substances into the water), and a heat exchange region 236, also described as a water outlet collection trough.

[0132] Selectively, heat can be dissipated from the multiple ultraviolet sources 402 via a convective cooling path. According to one embodiment, the convective cooling path for heating proceeds as follows: the rear or back side of each of the multiple ultraviolet sources 402, the thermal components of the ultraviolet source assembly 400 (e.g., metal coating), the heating paste (or pad or adhesive), the source-side thermal connector, and the air or environment through the thermal path.

[0133] In one embodiment, the ultraviolet source assembly 400 is configured such that a source-based thermal coupler is integrally provided within the ultraviolet source assembly 400. The source-based thermal coupler may have a copper layer that can act as a thermal conductive layer capable of conducting heat from a plurality of ultraviolet sources 402 to a water-opposed thermal coupler 406. It should be understood that the copper layer may be formed of any or a combination of materials capable of acting as a thermal conductive layer to facilitate the conduction of heat from the plurality of ultraviolet sources 402 to the water-opposed thermal coupler 406.

[0134] 5.UV source assembly An ultraviolet source assembly 400 in one embodiment of the present disclosure is shown in Figures 1 and 16. The ultraviolet source assembly 400 is shown together with a water-facing heat coupler 406, which is a heat sink in the illustrated embodiment, in thermal contact with the thermal contact area 440 of the ultraviolet source assembly 400. The water-facing heat coupler 406 has a water contact area 407 configured to be in contact with water flowing through the heat exchange area 236 of the ultraviolet reactor 200. In the illustrated embodiment, the water-facing heat coupler 406 can conduct thermal energy to water via the water contact area 407, which can form at least a portion of a water channel for the water flowing through the ultraviolet reactor 200.

[0135] The ultraviolet source assembly 400 in Figure 1 and the illustrated embodiment are shown with a single ultraviolet source 402 located on a printed circuit board assembly 480. However, it should be understood that the ultraviolet source assembly 400 may have multiple ultraviolet sources 402, as shown in the illustrated embodiment of Figure 16. The ultraviolet source 402 has an electrical terminal 403 that can be soldered to a circuit region 435 of the ultraviolet source assembly 400. The ultraviolet source 402 may have a thermal contact area that can be thermally connected to a conductive layer 414 or core layer 410 or any other conductive layer of the ultraviolet source assembly 400. This thermal contact area may be shared with an electrical contact area of ​​the ultraviolet source 402, for example, so that the electrical terminal 403 can provide an electrical connection to the circuit region 435 of the printed circuit board assembly 480 and a thermal connection to the conductive layer 414.

[0136] In the illustrated embodiment of Figure 1, the ultraviolet source 402 is shown to be electrically and thermally connected to the conductive layer 414, but it should be understood that the ultraviolet source 402 may be electrically and / or thermally connected to any conductive layer of the ultraviolet source assembly 400, including the core layer 410. For example, a pad of the ultraviolet source 402 may be directly soldered to the core layer 410 for heat conduction of heat flux, and another pad of the ultraviolet source 402 may be connected to the conductive layer 414 to receive electrical signals (e.g., power). The ultraviolet source 402 may be connected to the ultraviolet source assembly 400 in a variety of ways as described herein.

[0137] The printed circuit board assembly 480 may have multiple layers, some of which, in any combination thereof, may be electrically conductive or electrically insulating, and thermally conductive or thermally insulating. The printed circuit board assembly 480 may have circuit regions 435 made of conductive material that electrically connect components such as an ultraviolet source 402 to other circuits or components having external components such as control circuits or power supply circuits or combinations thereof.

[0138] The circuit region 435 of the ultraviolet source assembly 400 may have a conductive layer 414, such as a copper layer, which may be covered by a solder resist 416. The region of the solder resist 416 may not be present in order to expose the region of the conductive layer 414 in order to allow electrical connection of the components to the conductive layer 414, or thermal connection of the components to the conductive layer 414, or both. Although not shown, the ultraviolet source assembly 400 may have a silkscreen 417 placed on the solder resist 416 to provide information about the ultraviolet source assembly 400.

[0139] The printed circuit board assembly 480 may have a dielectric layer 412 and a thermal conductive layer 410, the dielectric layer 412 being positioned between the thermal conductive layer 410 and the conductive layer 414. The dielectric layer 412 may be configured as a thermal conductive layer capable of conducting thermal energy from the conductive layer 414 to the thermal conductive layer 410. In the illustrated embodiment, the thermal conductive layer 410 may be a core layer formed of copper or aluminum and having a thickness substantially greater than the thickness of the conductive layer 414. The thermal conductive layer 410, together with the dielectric layer 412 and the conductive layer 414, may define a metal-clad printed circuit board assembly.

[0140] The thermal conductive layer 410 may have a thermal contact region 440, which may be defined by the upper surface 436 of the thermal conductive layer 410 where the dielectric layer 412 and the conductive layer 414 are exposed or missing. With the water-opposed thermal coupler 406 in thermal contact with the thermal contact region 440, heat generated by the ultraviolet source 402 may transfer to the thermal conductive layer 410 through the conductive layer 414 and the dielectric layer 412, and then to the water-opposed thermal coupler 406 through the thermal contact region 440.

[0141] In the illustrated embodiment, the heat conductive layer 410 has an upper surface 436 and a lower surface 438 opposite to the upper surface 436.

[0142] The printed circuit board assembly 480 may have a lower dielectric layer 422, a lower conductive layer 424, and a lower solder resist 426. The lower dielectric layer 422 is in contact with at least a portion of the lower surface 438 of the thermal conductive layer 410, and the lower conductive layer 424 may be located on the lower dielectric layer 422 opposite to the thermal conductive layer 410. The lower solder resist 426 may be located on the lower conductive layer 424 opposite to the lower dielectric layer 422. It should be understood that this disclosure is not limited to this configuration. Further or fewer layers may be provided in connection with the stacking or configuration of the printed circuit board assembly 480. For example, the lower dielectric layer 422 and the lower conductive layer 424 may not be present.

[0143] The circuit region 435 of the printed circuit board assembly 480 is described primarily in relation to the conductive layer 414. However, the circuit region 435 may have one or more additional layers of the printed circuit board assembly 480, such as the lower conductive layer 424. Although not shown in the illustrated embodiment of Figure 1, the printed circuit board assembly 480 may have one or more vias that electrically connect one conductive layer of the printed circuit board assembly 480 to another conductive layer.

[0144] In the illustrated embodiment, the conductive layer 414 or the dielectric layer 412 or both may define an edge 430 adjacent to the upper surface 436 of the thermal conductive layer 410. The thermal conductive layer 410 may extend from below the edge 430 in both directions distal to the edge 430. The thermal contact region 440 may be located close to one side of the edge 430, and a portion of the thermal conductive layer 410 on the other side of the edge 430 may be bonded to the dielectric layer 412. In this configuration, at least a portion of the thermal conductive layer 410 having the thermal contact region 440 may expose or lack at least one of the dielectric layer 412, the conductive layer 414, and the solder resist 416 located on the conductive layer 414.

[0145] The thickness of the thermal conductive layer 410, corresponding to the thermal mass of the thermal conductive layer 410, can facilitate the provision of high thermal conductivity between the ultraviolet source 402 and the water-facing thermal coupler 406. The thermal conductivity of this configuration (e.g., having increased thermal mass relative to the conductive layer 414) can be substantially greater than that of an alternative configuration in which the heat sink is thermally connected to the conductive layer 414 directly (or via a thermal paste) through a thermal contact region defined by the absence of the solder resist 416 in the conductive layer 414. The dielectric layer 412 can be electrically insulating while having high thermal conductivity to facilitate efficient heat transfer from the conductive layer 414 to the thermal conductive layer 410.

[0146] In the illustrated embodiment, the conductive layer 414 may define a plane 432. This plane 432 may intersect with the water-opposed heat coupler 406 and the water-opposed heat coupler 406 thermally connected to the heat contact region 440. In this configuration, the plane 432 may intersect with the water-opposed heat coupler 406 simply because both the water-opposed heat coupler 406 and the conductive layer 414 are positioned above the upper surface 436 of the heat conductive layer 410 (as shown in the orientation shown in the illustrated embodiment of Figure 1).

[0147] An alternative embodiment of the ultraviolet source assembly is shown in Figure 2 and is generally referred to as reference number 500. The ultraviolet source assembly 500 is similar in many respects to the ultraviolet source assembly 400, with some exceptions. The ultraviolet source assembly 500 has a printed circuit board assembly 580 which is similar in many respects to the printed circuit board assembly 480, having a solder resist 516, a conductive layer 514, a dielectric layer 412, a thermal conductive layer 410, a lower dielectric layer 422, a lower conductive layer 424, and a lower solder resist 526, respectively.

[0148] As an example, the conductive layer 514 has a circuit region 535 similar to the circuit region 435, but is shown without an ultraviolet source for the purposes of disclosure. The conductive layer 514 in the illustrated embodiment may further define a plane 532 similar to the plane 432 described herein.

[0149] The thermal conductive layer 510, similar to the thermal conductive layer 410, has an upper surface 536 and a lower surface 538, as well as a thermal contact area 540. However, in the illustrated embodiment, unlike the thermal conductive layer 410, the thermal conductive layer 510 has an extended portion 550 that extends from the plane defined by the upper surface 536. The extended portion 550 may have an upper surface that defines the thermal contact area 540, and may extend from the upper surface 536 of the thermal conductive layer 510 such that the extended portion intersects with the plane 532 defined by the conductive layer 514. In one embodiment, the extended portion 550 can be considered a pillar extending from the upper surface 536 of the thermal conductive layer 510.

[0150] The extended portion 550 and the thermal contact region 540 may have the conductive layer 514 and dielectric layer 512 exposed or missing so that the water-opposed thermal coupler 506 can be thermally connected to the thermal contact region 540. The water-opposed thermal coupler 506 may be similar to the water-opposed thermal coupler 406, for example, having a water contact region 507 which is the same as the water contact region 407.

[0151] In the illustrated embodiment, the printed circuit board assembly 580 defines an edge 530 adjacent to the upper surface 536 of the thermal conductive layer 510. The thermal conductive layer 510 may extend laterally from below the edge 530 in both directions distal to the edge 530.

[0152] The extended portion 550 can be positioned close to one side of the edge 530, and a portion of the thermal conductive layer 510 on the other side of the edge 530 can be bonded to the dielectric layer 512. With this configuration, at least a portion of the thermal conductive layer 510 having the extended portion 550 and the thermal contact region 540 may expose or chip off at least one of the dielectric layer 512, the conductive layer 514, and the solder resist 516 located on the conductive layer 514.

[0153] The printed circuit board assembly 580 may have one or more layers arranged on both sides of the stretched portion 550. For example, in the illustrated embodiment, the conductive layer 514 and the dielectric layer 512 are arranged on both sides of the stretched portion 550. The stretched portion 550 may be selectively surrounded or partially surrounded by the conductive layer 514 and the dielectric layer 512.

[0154] Another alternative embodiment of the ultraviolet source assembly is shown in Figure 3 and is collectively referred to as reference number 600. The ultraviolet source assembly 600 is similar in many ways to the ultraviolet source assembly 500, with some exceptions. The ultraviolet source assembly 600 is similar in many ways to the printed circuit board assembly 680, having solder resist 616, conduction layer 614, dielectric layer 612, thermal conduction layer 610, lower dielectric layer 522, lower conduction layer 524, and lower solder resist 626, respectively.

[0155] As an example, the conductive layer 614 has a circuit region 635 similar to that of the circuit region 535. The conductive layer 614 of the illustrated embodiment may further define a plane 632 similar to that of the plane 532 described herein.

[0156] The thermal conductive layer 610, like the thermal conductive layer 510, has an upper surface 636 and a lower surface 638. However, in the illustrated embodiment, the thermal conductive layer 610, which is different from the thermal conductive layer 510, has a plurality of extended portions 650-1, 650-2, 650-3 extending from a plane defined by the upper surface 636. Each of the extended portions 650-1, 650-2, 650-3 may have an upper surface. These upper surfaces of the extended portions 650-1, 650-2, 650-3 may define thermal contact regions 640-1, 640-2, 640-2.

[0157] Multiple extensions 650-1, 650-2, 650-3 may extend from the plane defined by the upper surface 636 of the thermal conductive layer 610 such that the extensions intersect with the plane 632 defined by the conductive layer 614. Each of the multiple extensions 650-1, 650-2, 650-3 can be considered a pillar extending from the upper surface 636 of the thermal conductive layer 610. Multiple extensions 650-1, 650-2, 650-3, as well as the thermal contact regions 640-1, 640-2, 640-2, may expose or leave the conductive layer 614 and the dielectric layer 612, and as a result, the water-opposed thermal coupler 606 can be thermally connected to the thermal contact regions 640-1, 640-2, 640-3. The water-facing heat connector 606 may be similar to the water-facing heat connector 506, for example, having a water contact region 607 which is the same as the water contact region 507.

[0158] In the illustrated embodiment, the printed circuit board assembly 680 defines at least one edge 630 adjacent to the upper surface 636 of the thermal conductive layer 610. The thermal conductive layer 610 may extend in both directions distal to the edge 630 and laterally from below the edge 630. One or more of the extended portions 650-1, 650-2, and 650-3 may be located proximal to the edge defined by the conductive layer 614 and the dielectric layer 612, such as the edge 630 shown in the illustrated embodiment. A portion of the thermal conductive layer 610 on the other side of the edge may be bonded to the dielectric layer 612. This configuration allows at least a portion of the thermal conductive layer 610, which has multiple stretched portions 650-1, 650-2, 650-3 and thermal contact regions 640-1, 640-2, 640-3, to expose or leave missing at least one of the dielectric layer 612, the conductive layer 614, and the solder resist 616 disposed on the conductive layer 614.

[0159] The printed circuit board assembly 680 may have one or more layers positioned on both sides of the stretched portions 650-1, 650-2, and 650-3. For example, in the illustrated embodiment, the conductive layer 614 and the dielectric layer 612 are positioned on both sides of the stretched portions 650-1, 650-2, and 650-3. The stretched portions 650-1, 650-2, and 650-3 may be selectively surrounded or partially surrounded by the conductive layer 614 and the dielectric layer 612.

[0160] 6. Room outlet and heat exchange area An ultraviolet reactor 200 according to one embodiment has a plurality of chamber outlets 246 arranged according to a chamber outlet configuration 235, which may vary depending on the application. The chamber outlets 246 may be defined at least partially by openings in the inner side of the water treatment chamber 245. In one embodiment, the opening can be positioned directly adjacent to the second end 292 of the water treatment chamber 245, such that no portion of the inner side 290 is between the opening and the second end 292, which in the illustrated embodiments of Figures 7 to 15 corresponds to the water-facing side of the ultraviolet-transmitting window 205. In this way, the water channel 238 is provided so that water proceeds through the opening into the chamber outlet 246 in a radial path perpendicular to the longitudinal axis 240 of the ultraviolet reactor 200. This channel can be seen in the illustrated embodiment of Figure 15, and flows through the water treatment chamber 245, through one of the plurality of chamber outlets 246 to the heat exchange region 236, and through the ultraviolet reactor outlet 230.

[0161] The number and configuration of the chamber outlets 246 vary depending on the application. For example, in the embodiments shown in Figures 60-61, the chamber outlets 246 may be arranged adjacent to the second end 292 of the water treatment chamber 245 and evenly spaced around it according to the chamber outlet configuration 235. In one embodiment, multiple chamber outlets 246 may be uniformly distributed radially around the longitudinal axis 240. However, the disclosure is not limited thereto. Multiple chamber outlets 246 may be arranged in any manner, including non-uniform spacing patterns and cutoff or keep-out regions as described herein.

[0162] In one embodiment, the total cross-sectional area of ​​the multiple chamber outlets 246 is made larger than the cross-sectional area of ​​the ultraviolet reactor inlet 232, thereby avoiding a significant pressure drop, and in some cases minimizing it.

[0163] In one embodiment shown in Figure 10, a first keep-out region 249 for the chamber outlet 246 may be provided near the ultraviolet reactor outlet 230. In one embodiment, the first keep-out region 249 can facilitate control over the flow of water through the heat exchange region 236, thereby influencing the heat conduction performance of the ultraviolet reactor 200.

[0164] In one embodiment shown in Figure 10, a second keep-out region 248 for the chamber outlet may be provided distal to the ultraviolet reactor outlet 230. The second keep-out region 248, like the first keep-out region 249, can facilitate control of the water flow through the heat exchange region 236, thereby influencing the heat conduction performance of the ultraviolet reactor 200.

[0165] It should be noted that the second keep-out region 248 on the opposite side of the ultraviolet reactor outlet 230 may be provided for one or more chamber outlets 246 and heat exchange region 236. For example, in the illustrated embodiment of the second keep-out region 248, there is no chamber outlet within the second keep-out region 248, nor are there any available flow paths within the heat exchange region 236 relative to the second keep-out region 248. In other words, as shown in the illustrated embodiment of Figure 10, the collection trough or heat exchange region 236 does not have to completely enclose the water treatment chamber 245. The second keep-out region 248 may close off the heat exchange region 236 for enhanced performance.

[0166] It should be noted that, with respect to the heat exchange region 236, instead of a second keep-out region 248, a partial keep-out region may be defined in which the flow path of the heat exchange region 236 is restricted to the portion of the heat exchange region 236 outside the partial keep-out region.

[0167] In the illustrated embodiments of Figures 7 to 15, the multiple chamber outlets 246 are at least partially formed by openings on the inner side of the water treatment chamber 245, as described herein. The openings may be defined by channels in the end cap 202 and the surface of the ultraviolet-transmitting window 205. The channels in the end cap 202 are shown in the illustrated embodiments of Figures 10, 11 and 15. Alternatively, one or more of the multiple chamber outlets 246 may be at least partially defined by an opening located at the first end 291 of the water treatment chamber 245.

[0168] As shown in the illustrated embodiments in Figures 12 to 15, the heat exchange region 236 is defined by a trough within the end cap 202, an ultraviolet-transmitting window 205, and a water-opposing heat coupler 406. The heat exchange region 236 itself can be considered a collection trough from which water exiting multiple chamber outlets 246 is collected and flows toward the ultraviolet reactor outlet 230. The heat exchange region 236 can be configured to place water in direct contact with the water-opposing heat coupler 406 for the transfer of thermal energy. This thermal energy can escape with the water as it exits the ultraviolet reactor 200 through the ultraviolet reactor outlet 230.

[0169] In one embodiment, multiple chamber outlets 246 around the entire ultraviolet-transmitting window 205 guide the fluid toward a heat exchange region 236 (e.g., a collection trough) and distribute the fluid uniformly for uniform ultraviolet optical exposure. The water-contact surface of the ultraviolet-transmitting window 205 can act as a wall for each chamber outlet 246, such that the chamber outlet 246 is defined by the channel in the end cap 202 and the ultraviolet-transmitting window 205. Furthermore, or alternatively, a water-opposed heat coupler 406 may define at least a portion (e.g., a wall) of the chamber outlet 246.

[0170] In the illustrated embodiment, the water-opposed heat coupler 406 (e.g., a cooling ring made of stainless steel) functions as a wall of the heat exchange region 236 (e.g., the outlet trough of the reactor) of the ultraviolet reactor 200.

[0171] In the illustrated embodiment of Figure 15, a water channel 238 for water entering the room outlet 246 and then into the heat exchange region 236 is shown in more detail. In the illustrated embodiment, the room outlet 246 has a bottom surface 252 defining a plane that does not intersect with the heat exchange region 236, but it should be understood that the room outlet 246 may be configured differently. In the illustrated embodiment, the heat exchange region 236 has a bottom surface 251 defining a plane that is not coplanar with the bottom surface 252 of the room outlet 246, and the bottom surface 251 is positioned above the bottom surface 252 in the direction of the water channel 238. In the illustrated embodiment, the end cap 202 has a number of steps defining the wall of the room outlet 246 and a top surface 253 having a recessed area that can be operated to receive the ultraviolet-transmitting window 205. These steps, together with the top surface 253, may help to maintain the position of the ultraviolet-transmitting window 205.

[0172] The terms relating to direction, such as "vertical," "horizontal," "top," "bottom," "upper," "lower," "inner," "inwardly," "outer," and "outwardly," are used to assist in describing the invention based on the orientation of the embodiments shown in the figures. The use of the above terms relating to direction should not be construed as limiting the invention to any particular direction.

[0173] The above description describes current embodiments of the present invention. Various substitutions and modifications can be made to the invention without departing from the technical idea and broader aspects of the invention as set forth in the appended claims, and these should be interpreted in accordance with the principles of patent law, including equivalence. This disclosure is presented for illustrative purposes only and should not be interpreted as an exhaustive description of all embodiments of the invention, nor should the claims be interpreted as limiting to specific elements illustrated or described in relation to these embodiments. For example, but not limited to, any individual element of the invention described herein can be replaced by an alternative element that provides substantially similar functionality or otherwise provides appropriate operation. This includes, for example, currently known alternative elements, such as those now known to those skilled in the art, and potentially future alternative elements that may be developed that those skilled in the art may recognize as alternative elements during development. Furthermore, the disclosed embodiments have several features that are described simultaneously and can collectively provide many benefits. The invention is not limited to embodiments that have all of these features or provide all of some of the described benefits, except to the extent expressed in the published claims. For example, even if an element in a claim is referred to in the singular form using the article "a," "an," "the," or "said," it should not be interpreted as limiting that element to the singular. Even if an element in a claim is referred to as "at least one of X, Y and Z," it means that it includes any combination of X, Y and Z, such as X and Y and Z, X and Y, X and Z, or Y and Z.

Claims

1. 1. An ultraviolet (UV) reactor for irradiating a water stream with ultraviolet radiation, The ultraviolet (UV) reactor comprises: a treatment assembly having a water inlet and a water outlet, the treatment assembly operable to direct water received through the water inlet toward a point of use downstream of the water outlet; a printed circuit board (PCB) having a solder resist, a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate, the first substrate having a first surface with a circuit area, the solder resist disposed on the first surface of the first substrate; an ultraviolet light emitting diode (UV-LED) operably connected to the printed circuit board and oriented to direct ultraviolet energy into the processing assembly; a thermal contact area of ​​the thermally conductive substrate is exposed such that the thermal contact area is devoid of the dielectric, the solder resist, and the first substrate, the thermal contact area is in thermal communication with water flowing through the ultraviolet (UV) reactor, and at least a portion of the UV light emitting diode (UV-LED) is disposed on the first surface of the first substrate;

2. 2. The ultraviolet (UV) reactor of claim 1, wherein the ultraviolet (UV) reactor comprises a thermally conductive material having a fluid contact surface arranged to define at least a portion of a fluid path of the water flowing through the ultraviolet (UV) reactor, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to facilitate thermal communication between the water flowing through the ultraviolet (UV) reactor and the thermal contact area.

3. 3. The ultraviolet (UV) reactor of claim 2, wherein the thermal contact area is thermally coupled to water flowing through the ultraviolet (UV) reactor via the thermally conductive material.

4. 3. The ultraviolet (UV) reactor of claim 2, wherein a thermally conductive interface material is provided between the thermal contact area and the thermally conductive material to facilitate thermal communication between the water flowing through the UV reactor and the thermal contact area.

5. 3. The ultraviolet (UV) reactor of claim 2, wherein the fluid contacting surface of the thermally conductive material is located downstream of the processing assembly.

6. 10. The ultraviolet (UV) reactor of claim 1, wherein the printed circuit board (PCB) is a metal clad printed circuit board.

7. 10. The ultraviolet (UV) reactor of claim 1, wherein the top and bottom surfaces of the thermally conductive substrate are entirely devoid of solder resist.

8. 10. The ultraviolet (UV) reactor of claim 1, wherein the thermally conductive substrate has an upper surface that defines the thermal contact area.

9. 11. The ultraviolet (UV) reactor of claim 10, wherein an extended portion of the thermally conductive substrate extends from a primary surface of the thermally conductive substrate on which the dielectric is disposed, the extended portion having the top surface, and a plane of the first substrate intersects the extended portion.

10. the first substrate and the dielectric define a first edge; 2. The ultraviolet (UV) reactor of claim 1, wherein the thermally conductive substrate is positioned adjacent to the first edge and extends from both sides of the first edge such that the thermal contact area is positioned proximate one side of the first edge and the thermally conductive substrate is bonded to the dielectric proximate the other side of the first edge.

11. In a water treatment system for treating water, The water treatment system comprises: a treatment assembly inlet and a treatment assembly outlet, the treatment assembly inlet operable to receive water and the treatment assembly outlet operable to discharge water from the water treatment system; a printed circuit board (PCB) having a solder resist, a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate, the first substrate having a first surface with a circuit area, the solder resist disposed on the first surface of the first substrate, and a thermal contact area of ​​the thermally conductive substrate exposed such that the thermal contact area is devoid of the solder resist, the dielectric, and the first substrate; an ultraviolet light source operably connected to the circuit area of ​​the printed circuit board, at least a portion of the ultraviolet light source disposed on the first surface of the first substrate, and configured to provide ultraviolet light energy for disinfecting water; 1. An ultraviolet (UV) reactor configured to facilitate disinfection of water via application of ultraviolet energy to water flowing through the UV reactor, the ultraviolet (UV) reactor comprising: a water inlet operably connected to the treatment assembly inlet for receiving water; an ultraviolet (UV) reactor having a water outlet for discharging water from the UV reactor; a water treatment chamber having a first end and a second end, the water treatment chamber having a chamber inlet in fluid communication with the water inlet for receiving water to be purified, the water treatment chamber having a chamber outlet operable to direct the water toward the water outlet, the ultraviolet light source configured to provide ultraviolet energy to the water treatment chamber; a cooling chamber in fluid communication with water, the cooling chamber in thermal communication with the thermal contact area of ​​the thermally conductive substrate to facilitate transfer of thermal energy from the ultraviolet light source to the water.

12. 12. The water treatment system of claim 11, wherein the water treatment system comprises a thermally conductive material having a fluid contact surface arranged to define at least a portion of a fluid path of water flowing through the water treatment system, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to facilitate thermal communication between the water flowing through the water treatment system and the thermal contact area.

13. 13. The water treatment system of claim 12, wherein the thermal contact area is thermally coupled to water flowing through the water treatment system via the thermally conductive material.

14. 13. The water treatment system of claim 12, wherein a thermally conductive interface material is provided between the thermal contact area and the thermally conductive material to facilitate thermal communication between the water flowing through the ultraviolet (UV) reactor and the thermal contact area.

15. The water treatment system of claim 12 , wherein the fluid contact surface of the thermally conductive material is located downstream of the water treatment chamber.

16. 12. The water treatment system of claim 11, wherein the printed circuit board (PCB) is a metal clad printed circuit board.

17. 12. The water treatment system of claim 11, wherein the top and bottom surfaces of the thermally conductive substrate are entirely devoid of solder resist.

18. The water treatment system of claim 11 , wherein the thermally conductive substrate has an upper surface that defines the thermal contact area.

19. 20. The water treatment system of claim 18, wherein an extended portion of the thermally conductive substrate extends from a primary surface of the thermally conductive substrate on which the dielectric is disposed, the extended portion having the upper surface, and a plane of the first substrate intersects the extended portion.

20. the first substrate and the dielectric define a first edge; 12. The water treatment system of claim 11, wherein the thermally conductive substrate is positioned adjacent to the first edge and extends from both sides of the first edge such that the thermal contact area is positioned proximate one side of the first edge and the thermally conductive substrate is bonded to the dielectric proximate the other side of the first edge.

21. 1. A method for disinfecting water, comprising: The method comprises: providing a treatment assembly having a water inlet and a water outlet; directing water through the treatment assembly from the water inlet toward the water outlet toward a point of use downstream of the water outlet; providing an ultraviolet light source connected to a circuit area of ​​a printed circuit board (PCB), the printed circuit board (PCB) having a solder resist, a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate, the first substrate having a first surface with a circuit area, the solder resist disposed on the first surface of the first substrate, a thermal contact area of ​​the thermally conductive substrate being exposed such that the thermal contact area is devoid of the solder resist, the dielectric, and the first substrate, and at least a portion of the ultraviolet light source being disposed on the first surface of the first substrate; conducting heat from the ultraviolet light source to the thermal contact area of ​​the printed circuit board (PCB); and further conducting heat from the thermal contact area of ​​the printed circuit board (PCB) to water flowing toward the water outlet.

22. 22. The method of claim 21, wherein the printed circuit board (PCB) is a metal clad printed circuit board.

23. 23. The method of claim 22, wherein the method comprises providing ultraviolet energy from the ultraviolet light source to water flowing through the treatment assembly.

24. An ultraviolet (UV) reactor as described in claim 1, wherein at least a portion of the UV light emitting diode (UV-LED) arranged on the first surface of the first substrate corresponds to a terminal of the UV light emitting diode (UV-LED), and at least a portion of the solder resist is provided between the UV light emitting diode (UV-LED) and the first surface of the first substrate.

25. A water treatment system as described in Claim 11, wherein at least a portion of the ultraviolet light source disposed on the first surface of the first substrate corresponds to a terminal of the ultraviolet light source, and at least a portion of the solder resist is provided between the ultraviolet light source and the first surface of the first substrate.

26. The method described in claim 21, wherein at least a portion of the ultraviolet light source disposed on the first surface of the first substrate corresponds to a terminal of the ultraviolet light source, and at least a portion of the solder resist is provided between the ultraviolet light source and the first surface of the first substrate.

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