Multilayer electronic component

Abstract

To provide a multilayer electronic component with improved reliability, which is capable of improving capacitance per unit volume and minimizing a mounting space.SOLUTION: A multilayer electronic component 1000 includes: a body 110 including a dielectric layer 111 and first and second internal electrodes 131 and 132 alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second band electrodes 123 and 124 disposed to be spaced apart from each other; a first external electrode 131 disposed on the third surface and connected to the first internal electrode and the first band electrode; a second external electrode 132 disposed on the fourth surface and connected to the second internal electrode and the second band electrode; a first plating layer 141 disposed on the first external electrode and the first band electrode; and a second plating layer 142 disposed on the second external electrode and the second band electrode.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to implement. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, with the recent increase in industry interest in automotive electronic components, multilayer ceramic capacitors are also being used in automobiles and infotainment systems, and therefore high reliability characteristics are required.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the required capacitance.

[0006] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space. [Overview of the project] [Problems that the invention aims to solve]

[0007] One of the several objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0008] One of the several objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0009] One of the several objectives of the present invention is to provide a stacked electronic component with improved reliability.

[0010] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, and includes first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, wherein the first surface includes a body including first and second band electrodes arranged spaced apart from each other, a first external electrode arranged on the third surface and connected to the first internal electrode and the first band electrode, a second external electrode arranged on the fourth surface and connected to the second internal electrode and the second band electrode, a first plating layer arranged on the first external electrode and the first band electrode, and a second plating layer arranged on the second external electrode and the second band electrode.

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, and includes first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, wherein the first surface includes a body including first and second band electrodes arranged spaced apart from each other, a first external electrode arranged on the third surface and connected to the first internal electrode and the first band electrode, a second external electrode arranged on the fourth surface and connected to the second internal electrode and the second band electrode, a first insulating layer arranged on the first external electrode, a second insulating layer arranged on the second external electrode, a first plating layer arranged on the first band electrode, and a second plating layer arranged on the second band electrode. [Effects of the Invention]

[0013] One of the various effects of this invention is that by including the band electrode on one surface of the main body, the mounting space for the stacked electronic component is minimized.

[0014] One of the various effects of the present invention is that by placing an insulating layer on the external electrode and a plating layer on the band electrode, the reliability of the multilayer electronic component is improved while increasing the capacitance per unit volume.

[0015] However, the diverse yet significant advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0016] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] Figure 1 is a schematic perspective view showing the main body of the stacked electronic component. [Figure 3] This is a cross-sectional view along the line I-I' in Figure 1. [Figure 4]It is an exploded perspective view schematically showing the disassembled main body of FIG. 2. [Figure 5] It is a drawing showing a dielectric layer in which band electrodes are embedded. [Figure 6] It is an enlarged view showing an enlarged upper part of FIG. 3. [Figure 7] It is a perspective view schematically showing a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 8] It is a drawing showing a modified example of FIG. 3. [Figure 9] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 10] It is a cross-sectional view taken along line II-II' of FIG. 9. [Figure 11] It is a drawing showing a modified example of FIG. 9. [Figure 12] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 13] It is a cross-sectional view taken along line III-III' of FIG. 12. [Figure 14] It is a drawing showing a modified example of FIG. 13. [Figure 15] It is a drawing showing a modified example of FIG. 12. [Figure 16] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 17] It is a cross-sectional view taken along line IV-IV' of FIG. 16. [Figure 18] It is a drawing showing a modified example of FIG. 16. [Figure 19] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 20] It is a cross-sectional view taken along line V-V' of FIG. 19. [Figure 21] It is a drawing showing a modified example of FIG. 19. [Figure 22] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 23] It is a cross-sectional view taken along line VI-VI' of FIG. 22. [Figure 24] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 25] This is a cross-sectional view along the line VII-VII' in Figure 24. [Figure 26] This is a diagram showing a modified example of Figure 24. [Figure 27] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 28] This is a cross-sectional view along the line VIII-VIII' in Figure 27. [Modes for carrying out the invention]

[0017] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0018] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components that have the same function within the scope of the same idea are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0019] In drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0020] Figure 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention; Figure 2 is a schematic perspective view of the main body of the multilayer electronic component in Figure 1; Figure 3 is a cross-sectional view along the line I-I' in Figure 1; Figure 4 is an exploded perspective view of the main body in Figure 2; Figure 5 is a diagram showing the dielectric layer in which the band electrodes are embedded; Figure 6 is an enlarged view of the upper part of Figure 3; and Figure 7 is a schematic perspective view of a substrate on which the multilayer electronic component in Figure 1 is mounted.

[0021] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 7.

[0022] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and includes first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction, and the first surface includes a body 110 including first and second band electrodes 123 and 124 arranged spaced apart from each other, a first external electrode 131 arranged on the third surface and connected to the first internal electrode and the first band electrode, a second external electrode 132 arranged on the fourth surface and connected to the second internal electrode and the second band electrode, a first plating layer 141 arranged on the first band electrode, and a second plating layer 142 arranged on the second band electrode.

[0023] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0024] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not be a perfectly straight hexahedron, but may be substantially hexahedral.

[0025] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0026] In one embodiment, the main body 110 includes a first-third corner C1-3 connecting the first and third surfaces, a first-fourth corner C1-4 connecting the first and fourth surfaces, a second-third corner C2-3 connecting the second and third surfaces, and a second-fourth corner C2-4 connecting the second and fourth surfaces, wherein the first-third corner C1-3 and the second-third corner C2-3 have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-fourth corner C1-4 and the second-fourth corner C2-4 can have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0027] As margin regions where internal electrodes 121 and 122 are not placed overlap on the dielectric layer 111, steps are generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the second surface with the third to fifth surfaces may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center of the body 110 in the first direction with respect to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces.

[0028] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can be generally flat, and any non-flat areas can be considered corners. Hereinafter, the extension of each face may mean a line extended from the flat portion of each face.

[0029] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0030] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portion connecting the first surface with the fifth and sixth surfaces, and the portion connecting the second surface with the fifth and sixth surfaces, may not have a contracted form.

[0031] On the other hand, the first to sixth surfaces of the main body 110 can be generally flat, and any non-flat areas can be considered as corners.

[0032] From this perspective, the third and fourth corner portions 131c and 132c can be positioned below the extension line E2 of the second surface, and the third and fourth corner portions 131c and 132c can be positioned at a distance from the second surface. That is, by not positioning the external electrodes 131 and 132 on the second surface, the volume occupied by the external electrodes 131 and 132 can be further minimized, thereby further increasing the capacity per unit volume of the stacked electronic component 1000. In addition, the third corner portion 131c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the fourth corner portion 132c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0033] The extension line E2 of the second surface can be defined as follows: In the length-thickness cross section (LT cross section) obtained by cutting the stacked electronic component 1000 in the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal intervals in the length direction from the third surface to the fourth surface. The straight line passing through the point where P2 meets the second surface and the point where P4 meets the second surface can be defined as the extension line E2 of the second surface.

[0034] In one embodiment, the first surface 1 may include first and second band electrodes 123 and 124 arranged spaced apart from each other.

[0035] To improve the capacitance per unit volume of multilayer electronic components and minimize the mounting space, MLCCs have been developed that either have external electrodes placed only on the mounting surface or with external electrodes arranged in an L-shape. Additional effective volume is secured by omitting external electrodes in areas deemed unnecessary for achieving the desired capacitance and characteristics.

[0036] Conventionally, band electrodes placed on the mounting surface have been formed in two main ways. The first method involves forming the band electrodes on the main body after heat treatment (firing), which requires a separate electrode firing process. The second method involves printing the band electrodes onto the main body before firing, or printing the band electrodes onto a ceramic green sheet and heat-treating the band electrodes simultaneously with the main body firing. In both methods, since the band electrodes are formed with the main body's framework already in place, it was difficult to maximize the capacity per unit volume by increasing the volume due to the band electrodes.

[0037] In this invention, since the band electrodes 123 and 124 are included in the first surface 1 of the main body 110, the volume increase due to the band electrodes can be suppressed and the volume per unit volume can be maximized.

[0038] The method for forming the band electrodes 123 and 124 is not particularly limited. For example, the band electrodes 123 and 124 can be formed by removing the portion of the ceramic green sheet in which the band electrodes are to be formed, printing a band electrode forming paste onto the removed portion, and then placing it at the bottom of the laminate and firing it together with the main body.

[0039] In one embodiment, the first band electrode 123 can be connected to the third surface 3 of the main body 110, and the second band electrode 124 can be connected to the fourth surface 3 of the main body 110. This improves connectivity with external electrodes 131 and 132. The first band electrode 123 can also be placed at the first to third corner C1-3, and the second band electrode 124 can also be placed at the first to fourth corner C1-4. The first and second band electrodes 123 and 124 can be placed at a distance from the fifth and sixth surfaces.

[0040] Furthermore, the average size of the first and second band electrodes 123 and 124 in the third direction is not particularly limited. For example, the average size of the first and second band electrodes 123 and 124 in the third direction can be substantially the same as the average size of the first and second internal electrodes 121 and 122 in the third direction, as shown in Figures 2, 4, and 5. However, it is not limited to this, and the average size of the first and second band electrodes 123 and 124 in the third direction can be determined by considering the average size of the main body 110 in the third direction, the average size of the external electrodes 131 and 132 in the third direction, and the connectivity with the external electrodes 131 and 132.

[0041] In one embodiment, the first and second band electrodes 123 and 124 can be embedded in the first surface. Referring to Figure 5, the dielectric layer 111a containing the band electrodes 123 and 124 forms the first surface, so the first and second band electrodes 123 and 124 can be embedded in the first surface.

[0042] Furthermore, the first and second band electrodes 123 and 124 can be substantially coplanar with the first surface. That is, the first and second band electrodes 123 and 124 can be exposed on the first surface of the main body 110 and embedded inside the main body.

[0043] In one embodiment, the average thickness tp of the band electrodes 123 and 124 can be 0.1 μm or more. The thickness of the band electrodes can be defined as the depth to which the band electrodes 123 and 124 are embedded inside the main body, and the average thickness tp of the band electrodes 123 and 124 can represent the average size in the first direction.

[0044] If the average thickness tp of the band electrodes 123 and 124 is less than 0.1 μm, sufficient electrical connectivity with the external electrodes 131 and 132 may not be ensured, or the electrical connectivity with the plating layer may be insufficient. There is no particular need to limit the upper limit of the average thickness tp of the band electrodes 123 and 124; the upper limit can be determined by considering the internal electrodes 121 and 122 located in the outermost layer and the short circuit.

[0045] The average thickness tp of the band electrodes 123 and 124 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification, and can be the average value of the first-direction size of the band electrodes 123 and 124 measured at five equally spaced points on the first surface.

[0046] In one embodiment, the first and second band electrodes 123 and 124 may contain one or more of Ni, Cr, Pd, and Pt. This prevents excessive shrinkage and oxidation during firing along with the main body.

[0047] In one embodiment, the first and second band electrodes 123 and 124 may contain one or more ceramic additives selected from BaTiO3, TiO2, and SiO2. This improves the bonding strength with the dielectric layer and reduces the difference in sintering behavior with the dielectric layer, thereby suppressing aggregation and breakage of the band electrodes 123 and 124.

[0048] In one embodiment, when D1 is the average size in the second direction from the extension line E3 of the third surface to the end of the first band electrode, D2 is the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band electrode, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then D1≧G1 and D2≧G2 can be satisfied. This makes it possible to improve the adhesion strength to the substrate.

[0049] D1 and D2 can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0050] G1 and G2 can be defined as follows: G1 is the average value of the second-direction size measured for any five second internal electrodes located in the center of the first direction, separated to the third surface, in a cross-section obtained by cutting the main body from the center in the third direction in the first and second directions; and G2 is the average value of the second-direction size measured for any five first internal electrodes located in the center of the first direction, separated to the fourth surface.

[0051] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values.

[0052] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line E3 of the third surface to the end of the first band electrode is D1, and the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band electrode is D2, the conditions 0.2 ≤ D1 / L ≤ 0.4 and 0.2 ≤ D2 / L ≤ 0.4 can be satisfied.

[0053] If D1 / L and D2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if D2 / L exceeds 0.4, leakage current may occur between the first band electrode 123 and the second band electrode 124 under high voltage current, and the first band electrode 123 and the second band electrode 124 may become electrically connected during the plating process due to plating diffusion, etc.

[0054] D1, D2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0055] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0056] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0057] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention.

[0058] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0059] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness td of the dielectric layer 111 can be 0.35 μm or less.

[0060] Also, when an insulating layer is disposed on the external electrode according to one embodiment of the present invention, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, excellent reliability can also be ensured when the average thickness td of the dielectric layer 111 is 0.35 μm or less. Thus, when the average thickness td of the dielectric layer 111 is 0.35 μm or less, the effect of improving reliability according to the present invention can become more remarkable.

[0061] The average thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 that is placed between the first and second internal electrodes 121 and 122.

[0062] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one dielectric layer can be measured at 30 equally spaced points along its length from the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance formation section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average values, the average thickness of the dielectric layers can be further generalized.

[0063] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged facing each other with a dielectric layer 111 in between to form a capacitance, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in the first direction.

[0064] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0065] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the capacitance forming portion Ac in the first direction and a lower cover portion 113 positioned below the capacitance forming portion Ac in the first direction. The lower cover portion 113 may include first and second band electrodes 123 and 124. The upper cover portion 112 may include third and fourth band electrodes 125 and 126.

[0066] Referring to Figure 4, the upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and stacking one or more dielectric layers 111a containing band electrodes 123 and 124 as the outermost layer. The cover portions 112 and 113 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0067] The upper cover portion 112 and the lower cover portion 113 may include band electrodes 123 and 124, but may not include internal electrodes 121 and 122, and may contain the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 may contain ceramic material, for example, barium titanate (BaTiO3) based ceramic material.

[0068] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be 15 μm or less. Furthermore, when an insulating layer is placed on the external electrode according to one embodiment of the present invention, it is possible to improve reliability by preventing the penetration of moisture from the outside, the penetration of plating solution, etc., so excellent reliability can be ensured even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less.

[0069] The average thickness tc of the cover portions 112 and 113 can represent the average size in the first direction, and can be the average value of the first-direction sizes of the cover portions 112 and 113 measured at five equally spaced points on the upper or lower part of the volume-forming portion Ac.

[0070] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0071] The margin portions 114 and 115 may include the margin portion 114 located on the fifth surface 5 and the margin portion 115 located on the sixth surface 6 of the main body 110. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the main body 110.

[0072] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section of the main body 110 cut in the width-thickness (WT) direction.

[0073] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0074] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet and forming internal electrodes, except where the margin portions are formed.

[0075] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0076] On the other hand, the average width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the average width of the margin portions 114 and 115 can be 15 μm or less. Furthermore, when an insulating layer is placed on an external electrode according to one embodiment of the present invention, it is possible to prevent the penetration of moisture from the outside, the penetration of plating solution, etc., and thereby improve reliability. Therefore, even when the average width of the margin portions 114 and 115 is 0.35 μm or less, excellent reliability can be ensured.

[0077] The average width of the margin portions 114 and 115 can represent the average size in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0078] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111.

[0079] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0080] Referring to Figure 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0081] In other words, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0082] In this case, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0083] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0084] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0085] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for internal electrodes can be screen printing or gravure printing, and the present invention is not limited to these methods.

[0086] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0087] To more easily achieve miniaturization and increased capacitance of multilayer electronic components, the average thickness te of the internal electrodes 121 and 122 can be 0.35 μm or less.

[0088] Furthermore, when an insulating layer is placed on the external electrode according to one embodiment of the present invention, it is possible to prevent the penetration of moisture from the outside, the penetration of plating solution, etc., thereby improving reliability. Therefore, even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured. Accordingly, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and miniaturization and high capacity of the multilayer electronic component can be achieved more easily.

[0089] The average thickness of the internal electrodes 121 and 122 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction from the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes and measuring the average value, the average thickness of the internal electrodes can be further generalized.

[0090] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 can include first and second external electrodes 131 and 132, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively. In addition, the first and second external electrodes 131 and 132 can be connected to first and second band electrodes 123 and 124, respectively.

[0091] In one embodiment, the first and second external electrodes 131 and 132 can be arranged at a distance from the first and second surfaces. In another embodiment, the first and second external electrodes 131 and 132 can be arranged at a distance from the fifth and sixth surfaces. Furthermore, the first and second external electrodes 131 and 132 can be arranged at a distance from the first, second, fifth, and sixth surfaces. That is, the first and second external electrodes 131 and 132 can not be arranged on the first, second, fifth, and sixth surfaces. This minimizes the volume occupied by the external electrodes 131 and 132 and increases the capacity per unit volume of the stacked electronic component 1000.

[0092] The external electrodes 131 and 132 may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first external electrode 131 may include a first connecting portion 131a positioned on the third surface, a first corner portion 131b that extends from the first connecting portion 131a to the corner connecting the first surface and the third surface, and a third corner portion 131c that extends from the first connecting portion 131a to the corner connecting the second surface and the third surface. This makes it possible to maximize the capacity per unit volume while improving the connectivity between the external electrode and the band electrode. The first and second corner portions 131b and 132b may be positioned so as not to meet the extension line E1 of the first surface, and the third and fourth corner portions 131c and 132c may be positioned below the extension line E2 of the second surface. In other words, the first and second corner sections 131b and 132b may not be placed on the first surface, and the third and fourth corner sections 131c and 132c may not be placed on the second surface.

[0093] In this case, if we let B1 be the average size in the second direction from the extension line E3 of the third surface to the end of the first corner portion 131b, B2 be the average size in the second direction from the extension line E4 of the fourth surface to the end of the second corner portion 132b, B3 be the average size in the second direction from the extension line of the third surface to the end of the third corner portion 131c, B4 be the average size in the second direction from the extension line of the fourth surface to the end of the fourth corner portion 132c, G1 be the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 be the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then we can satisfy B1≦G1, B3≦G1, B2≦G2, and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes 131 and 132 and increase the capacity per unit volume of the stacked electronic component 1000.

[0094] B1, B2, B3, and B4 can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0095] G1 and G2 can be defined as follows: G1 is the average value of the second-direction size measured for any five second internal electrodes located in the center of the first direction, separated to the third surface, in a cross-section obtained by cutting the main body from the center in the third direction in the first and second directions; and G2 is the average value of the second-direction size measured for any five first internal electrodes located in the center of the first direction, separated to the fourth surface.

[0096] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​as G1 and G2.

[0097] However, it is not limited thereto, and as will be described later, the external electrodes 131 and 132 may include band portions extending to parts of the first and second surfaces. Furthermore, the first external electrode 131 may include a side band portion extending from the first connection portion 131a to parts of the fifth and sixth surfaces, and the second external electrode 132 may include a side band portion extending from the second connection portion 132a to parts of the fifth and sixth surfaces.

[0098] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0099] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0100] The external electrodes 131 and 132 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0101] Furthermore, the external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0102] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 can include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 which contain Ni.

[0103] Furthermore, the external electrodes 131 and 132 can contain Cu, which improves the bonding strength with the band electrodes 123 and 124, and also improves the electrical connectivity with the internal electrodes 121 and 122.

[0104] The first and second plating layers 141 and 142 can be placed on the first and second band electrodes 123 and 124, respectively. The first and second plating layers 141 and 142 can be placed in direct contact with the first and second band electrodes 123 and 124, respectively. The plating layers 141 and 142 can play a role in improving mounting characteristics.

[0105] Furthermore, the first plating layer 141 can be placed on the first band electrode 123 and the first external electrode 131, and the second plating layer 142 can be placed on the second band electrode 124 and the second external electrode 132. Also, the first plating layer 141 can be placed so as to cover the first band electrode 123 and the first external electrode 131, and the second plating layer 142 can be placed so as to cover the second band electrode 124 and the second external electrode 132.

[0106] The types of plating layers 141 and 142 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0107] To give a more specific example for the plating layers 141 and 142, the plating layers 141 and 142 can be in a configuration in which Ni plating layers 141a and 142a and Sn plating layers 141b and 142b are arranged in sequence.

[0108] Referring to Figure 7, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined by electrode pads 181 and 182 and solder 191 and 192 placed on the substrate 180.

[0109] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0110] There is no particular limit to the size of the stacked electronic component 1000.

[0111] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the effects of the present invention on improving reliability and capacity per unit volume can be more pronounced in a stacked electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0112] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 refers to the second-direction size of the stacked electronic component 1000, and the width of the stacked electronic component 1000 refers to the third-direction size of the stacked electronic component 1000.

[0113] Figure 8 is a diagram showing a modified version of Figure 3.

[0114] Referring to Figure 8, the stacked electronic component 1001 may include a first external electrode 131-1 including a first band portion 131b-1 and a second external electrode 132-1 including a second band portion 132b-1.

[0115] The first external electrode 131-1 includes a first connecting portion 131a-1 located on the third surface, a first band portion 131b-1 extending from the first connecting portion to a part of the first surface, and a third corner portion 131c-1 extending from the first connecting portion to the corner connecting the second and third surfaces. The second external electrode 132-1 may include a second connecting portion 132a-1 located on the fourth surface, a second band portion 132b-1 extending from the second connecting portion to a part of the first surface, and a fourth corner portion 132c-1 extending from the second connecting portion to the corner connecting the second and fourth surfaces.

[0116] In one embodiment, when B1 is the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion 131b-1, B2 is the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band portion 132b-1, B3 is the average size in the second direction from the extension line of the third surface to the end of the third corner portion 131c-1, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth corner portion 132c-1, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. By satisfying B1≧G1 and B2≧G2, the electrical connectivity between the band electrodes 123 and 124 and the external electrodes 131-1 and 132-1 can be further improved, and by satisfying B3≦G1 and B4≦G2, the volume occupied by the external electrodes 131-1 and 132-1 can be reduced.

[0117] B1, B2, B3, and B4 can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0118] G1 and G2 can be defined as follows: G1 is the average value of the second-direction size measured for any five second internal electrodes located in the center of the first direction, separated to the third surface, in a cross-section obtained by cutting the main body from the center in the third direction in the first and second directions; and G2 is the average value of the second-direction size measured for any five first internal electrodes located in the center of the first direction, separated to the fourth surface.

[0119] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​as G1 and G2.

[0120] Furthermore, the end of the first band portion 131b-1 can be positioned to cover the end of the first band electrode 123, and the end of the second band portion 132b-1 can be positioned to cover the end of the first band electrode 124. That is, when D1 is the average size in the second direction from the extension line E3 of the third surface to the end of the first band electrode, and D2 is the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band electrode, then B1≧D1 and B2≧D2 can be satisfied.

[0121] D1 and D2 can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0122] Figure 9 is a schematic perspective view of a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 10 is a cross-sectional view along the line II-II' in Figure 9.

[0123] A stacked electronic component 1002 according to one embodiment of the present invention may include insulating layers 151 and 152 disposed on external electrodes 131 and 132.

[0124] The first and second insulating layers 151 and 152 can be placed on the first and second external electrodes 131 and 132, respectively.

[0125] Since the first and second external electrodes 131 and 132 are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of the plating solution during the plating process or for moisture penetration during actual use. In one embodiment of the present invention, insulating layers 151 and 152 are arranged on the external electrodes 131 and 132, so that the penetration of moisture from the outside or the penetration of the plating solution can be prevented, and the plating layers 141-2 and 142-2 can be prevented from being arranged in the regions of the external electrodes 131 and 132 where the insulating layers 151 and 152 are arranged.

[0126] The materials forming the first and second insulating layers 151 and 152 are not particularly limited. For example, the first and second insulating layers 151 and 152 may include glass or a polymer resin. The type of polymer resin is not particularly limited. For example, the polymer resin may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc.

[0127] In one embodiment, when insulating layers 151 and 152 contain a polymer resin, one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. can be included. This can improve the bonding strength with the main body or external electrodes.

[0128] The method for forming the insulating layers 151 and 152 is not particularly limited, but for example, they can be formed by applying a paste onto the external electrodes 131 and 132 or by transferring a sheet onto the external electrodes 131 and 132.

[0129] The average thickness of the insulating layers 151 and 152 is not particularly limited, but can be, for example, 3 to 30 μm. Here, the average thickness of the insulating layers 151 and 152 can mean the average value of the second size of the insulating layers 151 and 152 measured at five equally spaced points on the connection parts 131a and 132a.

[0130] The first and second plating layers 141-2 and 142-2 can be placed on the first and second band electrodes 123 and 124. The first and second plating layers 141-2 and 142-2 play a role in improving mounting characteristics. The types of the first and second plating layers 141-2 and 142-2 are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd and their alloys, and can be formed in multiple layers.

[0131] To give a more specific example for the first and second plating layers 141-2 and 142-2, the first and second plating layers 141-2 and 142-2 can be in a form in which a Ni plating layer 141-2a and a Sn plating layer 141-2b are sequentially formed on the first and second band electrodes 123 and 124.

[0132] In one embodiment, the first and second plating layers 141-2 and 142-2 can be arranged to extend and partially cover the first and second external electrodes 131 and 132, respectively.

[0133] When H1 is the average size in the first direction from the first surface 1 to the first and second internal electrodes 121 and 122 that are closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the edges of the first and second plating layers 141-2 and 142-2 placed on the first and second external electrodes 131 and 132, the condition H1 > H2 (or H1 ≥ H2) can be satisfied. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0134] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point in each cross-section where the internal electrode closest to the first surface 1 is connected to the external electrode, and H2 can be the average of values ​​measured in each cross-section with respect to the edge of the plating layer in contact with the external electrode, and the extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0135] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second external electrodes 131 and 132, respectively, and the first and second external electrodes 131 and 132 may include conductive metal and glass. As a result, the plating layers 141-2 and 142-2 may not be placed in the areas of the outer surface of the first and second external electrodes 131 and 132 where the insulating layers 251 and 252 are located, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0136] In one embodiment, the first plating layer 141-2 can be positioned to cover the end of the first insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142-2 can be positioned to cover the end of the second insulating layer 152 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layers 151, 152 and the plating layers 141-2, 142-2, thereby improving the reliability of the multilayer electronic component 1002. Furthermore, by forming the first and second insulating layers 151, 152 before forming the plating layers 141-2, 142-2 on the external electrodes 131, 132, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 141-2, 142-2 can have a configuration that covers the ends of the insulating layers 151, 152.

[0137] In one embodiment, the first insulating layer 151 can be positioned to cover the edge of the first plating layer 141-2 that is positioned on the first external electrode 231, and the second insulating layer 152 can be positioned to cover the edge of the second plating layer 141-2 that is positioned on the second external electrode 132. This strengthens the bonding between the insulating layers 151, 152 and the plating layers 141-2, 142-2, thereby improving the reliability of the multilayer electronic component 1002.

[0138] Figure 11 shows a modified example of Figure 9. Referring to Figure 11, in a modified example 1003 of the stacked electronic component 1002 according to one embodiment of the present invention, the first and second insulating layers 151-3 and 152-3 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby being connected to a single insulating layer 153-3. In this case, the connected first and second insulating layers 153-3 can be arranged to cover a portion of the fifth and sixth surfaces.

[0139] Figure 12 is a schematic perspective view of a stacked electronic component 1004 according to one embodiment of the present invention, and Figure 13 is a cross-sectional view along the line III-III' in Figure 12.

[0140] Referring to Figures 12 and 13, in the stacked electronic component 1004 according to one embodiment of the present invention, the first and second plating layers 141-4 and 142-4 can be positioned below the extension line E1 of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting section. In this case, the external electrodes 131 and 132 and the plating layers 141-4 and 141-5 may not be in direct contact.

[0141] Furthermore, the first and second insulating layers 151-4 and 152-4 can be arranged to extend below the extension line of the first surface and in contact with the first and second plating layers 141-4 and 142-4.

[0142] Figure 14 is a diagram showing a modified version of Figure 13. Referring to Figure 14, in the modified version of Figure 13, the multilayer electronic component 1005 can have the plating layers 141-5 and 142-5 arranged in a single layer configuration instead of a two-layer configuration. This further improves the effect of increasing the capacity per unit volume. In this case, the plating layers 141-5 and 142-5 can be Sn plating layers.

[0143] Figure 15 shows a modified example of Figure 12. Referring to Figure 12, in a modified example 1006 of the stacked electronic component 1004 according to one embodiment of the present invention, the first and second insulating layers 151-6 and 152-6 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby being connected to a single insulating layer 153-6. In this case, the connected first and second insulating layers 153-6 can be arranged to cover the entirety of the fifth and sixth surfaces.

[0144] Figure 16 is a schematic perspective view of a stacked electronic component 1007 according to one embodiment of the present invention, and Figure 17 is a cross-sectional view along the line IV-IV' in Figure 16.

[0145] Referring to Figures 16 and 17, the stacked electronic component 1007 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first plating layer 141-4 and the second plating layer 142-4. This prevents leakage currents that may occur between the first band electrode 123 and the second band electrode 124 under high voltage current.

[0146] The type of additional insulating layer 161 is not particularly limited. For example, the additional insulating layer 161 may contain glass or a polymer resin. The type of polymer resin is not particularly limited. For example, the polymer resin may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc. In one embodiment, if the additional insulating layer 161 contains a polymer resin, it may contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. This can improve the bonding strength with the main body or external electrodes.

[0147] On the other hand, the additional insulating layer 161 and the insulating layers 151-7 and 152-7 do not need to be formed from the same material, and can be formed from different materials.

[0148] FIG. 18 shows a modified example of FIG. 16. Referring to FIG. 18, a modified example 1008 of the stacked electronic component 1007 according to an embodiment of the present invention can be connected to a single insulating layer 153-8 by the first and second insulating layers 151-8 and 152-8 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0149] FIG. 19 is a perspective view schematically showing a stacked electronic component 1009 according to an embodiment of the present invention, and FIG. 20 is a cross-sectional view taken along the line V-V' of FIG. 19.

[0150] Referring to FIGS. 19 and 20, a stacked electronic component 1009 according to an embodiment includes a first insulating layer 151-9 disposed on the first external electrode 131 and a second insulating layer 152-9 disposed on the second external electrode 132. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-9 and 142-9 disposed on the first and second external electrodes 131 and 132 is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0151] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is equal to or greater than T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0152] H1, H2, and T can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode in each cross-section, and the extension line of the first surface used as a reference when measuring H1 and H2 can be the same. In addition, T can be the average value after measuring the maximum size of the main body 110 in the first direction in each cross-section.

[0153] Figure 21 shows a modified example of Figure 19. Referring to Figure 21, in a modified example 1010 of the stacked electronic component 1009 according to one embodiment of the present invention, the first and second insulating layers 151-10 and 152-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby connecting to a single insulating layer 153-10.

[0154] Figure 22 is a schematic perspective view of a stacked electronic component 1011 according to one embodiment of the present invention, and Figure 23 is a cross-sectional view along the line VI-VI' in Figure 22.

[0155] Referring to Figures 22 and 23, in one embodiment of the present invention, the stacked electronic component 1011 can be connected to a single insulating layer 153-11 by having the first and second insulating layers 151-11 and 152-11 extend to the second, fifth, and sixth surfaces 2, 5, and 6 and be connected to each other. As shown in Figure 22, the insulating layer 253-8 can be configured to completely cover the second surface, or to partially cover the fifth and sixth surfaces.

[0156] Figure 24 is a schematic perspective view of a stacked electronic component 1012 according to one embodiment of the present invention, and Figure 25 is a cross-sectional view along the line VII-VII' in Figure 24.

[0157] Referring to Figures 24 and 25, the average thickness t1 of the first and second plating layers 141-12 and 142-12 of the stacked electronic component 1012 according to one embodiment of the present invention can be thinner than the average thickness t2 of the first and second insulating layers 151-12 and 152-12.

[0158] According to one embodiment of the present invention, the average thickness t1 of the first and second plating layers 141-12 and 142-12 can be made thinner than the average thickness t2 of the first and second insulating layers 151-12 and 152-12, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 1012 to the substrate 180.

[0159] The average thickness t1 of the first and second plating layers 141-12 and 142-12 can be the average of the thicknesses measured at five equally spaced points on the first and second external electrodes 131 and 132 or the first and second band electrodes 123 and 124, and the average thickness t2 of the insulating layers 151-12 and 152-12 can be the average of the thicknesses measured at five equally spaced points on the first and second external electrodes 131 and 132.

[0160] Figure 26 is a drawing showing a modified example of Figure 24. Referring to Figure 26, in a modified example 1013 of the stacked electronic component 1012 according to one embodiment of the present invention, the first and second insulating layers 151-13 and 152-13 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby connecting to a single insulating layer 153-13.

[0161] Figure 27 is a schematic perspective view of a stacked electronic component 1014 according to one embodiment of the present invention, and Figure 28 is a cross-sectional view along the line VIII-VIII' in Figure 27.

[0162] Referring to Figures 27 and 28, according to one embodiment of the present invention, the second surface of the main body 110 includes a third band electrode 125 and a fourth band electrode 126 arranged spaced apart from each other, the third band electrode 125 can be connected to a first external electrode 131, and the fourth band electrode 126 can be connected to a second external electrode 132. If only the first and second band electrodes 123 and 124 are provided, mounting convenience and taping efficiency may decrease, and additional processes are required to improve productivity and efficiency. On the other hand, if the third and fourth band electrodes 125 and 126 are included according to one embodiment of the present invention, mounting convenience and taping efficiency can be improved by a factor of two compared to the case where only the first and second band electrodes 123 and 124 are provided.

[0163] In this case, the first plating layer 141-14 can be further arranged on the third band electrode 125, and the second plating layer 142-14 can be further arranged on the fourth band electrode 126.

[0164] Furthermore, the third and fourth band electrodes 125 and 126 can have the characteristics of the first and second band electrodes 123 and 124 described above, the third band electrode 125 can be symmetrical to the first band electrode 123 in the first direction, and the fourth band electrode 126 can be symmetrical to the second band electrode 124 in the first direction.

[0165] On the other hand, when insulating layers 151 and 152 are placed on the first and second external electrodes 131 and 132, the plating layer formed on the first band electrode 123 and the plating layer formed on the third band electrode 125 can be separated from each other by the first insulating layer 151, and the plating layer formed on the second band electrode 124 and the plating layer formed on the fourth band electrode 126 can be separated from each other by the second insulating layer 152.

[0166] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0167] Furthermore, the expression "one embodiment" used in this disclosure does not mean that each embodiment is identical to another, but is provided to highlight the distinct and unique features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is inconsistent with that matter.

[0168] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise clearly, singular expressions include plural expressions. [Explanation of Symbols]

[0169] 1000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 123, 124, 125, 126 band electrodes 111a Dielectric layer containing band electrodes 131 1st external electrode 132 2nd external electrode 141, 142 Plating layer 151, 152, 153 Insulating layer 161 Additional insulating layer 180 circuit boards 181, 182 Electrode Pads 191, 192 solder

Claims

1. A multilayer electronic component including a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, wherein the first surface includes a main body having first and second band electrodes disposed apart from each other, a first external electrode disposed on the third surface and connected to the first internal electrode and the first band electrode, a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second band electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode.

2. The multilayer electronic component according to claim 1, wherein the first band electrode is connected to the third surface, and the second band electrode is connected to the fourth surface.

3. The multilayer electronic component according to claim 1, wherein an average thickness of the first and second band electrodes is 0.1 μm or more.

4. The multilayer electronic component according to claim 1, wherein the first and second band electrodes are substantially coplanar with the first surface.

5. The multilayer electronic component according to claim 1, wherein the first and second band electrodes are embedded in the first surface.

6. The multilayer electronic component according to claim 1, wherein the first and second band electrodes include one or more of Ni, Cr, Pd, and Pt.

7. The multilayer electronic component according to claim 1, wherein the first and second band electrodes include one or more of BaTiO3, TiO2, and SiO2.

8. When an average size in the second direction from an extension line of the third surface to an end of the first band electrode is D1, an average size in the second direction from an extension line of the fourth surface to an end of the second band electrode is D2, an average size in the second direction of a region where the third surface and the second internal electrode are separated is G1, and an average size in the second direction of a region where the fourth surface and the first internal electrode are separated is G2, the multilayer electronic component according to claim 1, satisfying D1≧G1 and D2≧G2.

9. When an average size of the main body in the second direction is L, an average size in the second direction from an extension line of the third surface to an end of the first band electrode is D1, and an average size in the second direction from an extension line of the fourth surface to an end of the second band electrode is D2, The multilayer electronic component according to claim 1, satisfying 0.2 ≦ D1 / L ≦ 0.4 and 0.2 ≦ D2 / L ≦ 0.

4.

10. The first external electrode includes a first connection portion disposed on the third surface, a first corner portion extending and disposed from the first connection portion to a corner connecting the first surface and the third surface, and a third corner portion extending and disposed from the first connection portion to a corner connecting the second surface and the third surface. The second external electrode includes a second connection portion disposed on the fourth surface, a second corner portion extending and disposed from the second connection portion to a corner connecting the first surface and the third surface, and a fourth corner portion extending and disposed from the second connection portion to a corner connecting the second surface and the fourth surface. When the average magnitude in the second direction from the extension line of the third surface to the end of the first corner portion is B1, the average magnitude in the second direction from the extension line of the fourth surface to the end of the second corner portion is B2, the average magnitude in the second direction from the extension line of the third surface to the end of the third corner portion is B3, the average magnitude in the second direction from the extension line of the fourth surface to the end of the fourth corner portion is B4, the average magnitude in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average magnitude in the second direction of the region where the fourth surface and the first internal electrode are separated is G2. The multilayer electronic component according to claim 1, satisfying B1 ≦ G1, B3 ≦ G1, B2 ≦ G2, and B4 ≦ G2.

11. The first external electrode includes a first connection portion disposed on the third surface, a first band portion extending from the first connection portion to a part of the first surface, and a third corner portion extending and disposed from the first connection portion to a corner connecting the second surface and the third surface. The second external electrode includes a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a part of the first surface, and a fourth corner portion extending and disposed from the second connection portion to a corner connecting the second surface and the fourth surface. When the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the average size in the second direction from the extension line of the third surface to the end of the third corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the fourth corner portion is B4, and the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 1, which satisfies B1≥G1, B3≤G1, B2≥G2, and B4≤G2.

12. The second surface includes third and fourth band electrodes that are arranged separately from each other. The multilayer electronic component according to claim 1, wherein the third band electrode is connected to the first external electrode, and the fourth band electrode is connected to the second external electrode.

13. The first plating layer is further disposed on the third band electrode, and the second plating layer is further disposed on the fourth band electrode. The multilayer electronic component according to claim 12.

14. The maximum size in the second direction of the multilayer electronic component is 1.1 mm or less, and the maximum size in the third direction is 0.55 mm or less. The multilayer electronic component according to claim 1.

15. The average thickness of the dielectric layer is 0.35 μm or less. The multilayer electronic component according to claim 1.

16. The average thickness of the first and second internal electrodes is 0.35 μm or less. The multilayer electronic component according to claim 1.

17. It includes a capacitance forming portion including first and second internal electrodes that are alternately arranged with the dielectric layer interposed therebetween, and a cover portion that is disposed on both end faces of the capacitance forming portion in the first direction. The average size in the first direction of the cover portion is 15 μm or less. The multilayer electronic component according to claim 1.

18. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface. The first to third corners and the second to third corners have a form that contracts toward the center of the main body in the first direction as they approach the third surface, and the first to fourth corners and the second to fourth corners have a form that contracts toward the center of the main body in the first direction as they approach the fourth surface. The laminated electronic component according to claim 1, wherein the first external electrode includes a corner portion disposed on the first to third corners and the second to third corners, and the second external electrode includes a corner portion disposed on the first to fourth corners and the second to fourth corners.

19. The laminated electronic component according to claim 1, wherein the first and second external electrodes are disposed at a distance from the fifth and sixth surfaces.

20. The laminated electronic component according to claim 1, wherein the first and second external electrodes are disposed at a distance from the first and second surfaces.

21. The laminated electronic component according to claim 1, wherein the first and second external electrodes include one or more of Ni and Ni alloys.

22. The first plating layer is further disposed on the first external electrode. The laminated electronic component according to claim 1, wherein the second plating layer is further disposed on the second external electrode.

23. The laminated electronic component according to claim 1, further comprising a first insulating layer disposed on the first external electrode and a second insulating layer disposed on the second external electrode.

24. When the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the ends of the first and second plating layers disposed on the first and second external electrodes is H2, the laminated electronic component according to claim 23, wherein H1 > H2 is satisfied.

25. When the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and the average size in the first direction from the extension line of the first surface to the ends of the first and second plating layers disposed on the first and second external electrodes is H2, the laminated electronic component according to claim 23, wherein H1 < H2 is satisfied.

26. When the average size of the main body in the first direction is T. The laminated electronic component according to claim 25, wherein H2 and T satisfy H2 < T / 2.

27. The laminated electronic component according to claim 23, wherein the first and second plating layers are disposed below the extension line of the first surface.

28. The stacked electronic component according to claim 23, further comprising an additional insulating layer disposed on the first surface and disposed between the first plating layer and the second plating layer.

29. The stacked electronic component according to claim 23, wherein an average thickness of the first and second plating layers is thinner than an average thickness of the first and second insulating layers.

30. The first plating layer is disposed so as to cover an end portion disposed on the first external electrode of the first insulating layer, and the second plating layer is disposed so as to cover an end portion disposed on the second external electrode of the second insulating layer. The stacked electronic component according to claim 23.

31. The first insulating layer is disposed so as to cover an end portion disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed so as to cover an end portion disposed on the second external electrode of the second plating layer. The stacked electronic component according to claim 23.

32. The first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other, and are disposed so as to cover a part of the fifth and sixth surfaces. The stacked electronic component according to claim 23.

33. The first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other, and are disposed so as to cover all of the fifth and sixth surfaces. The stacked electronic component according to claim 23.

34. The first and second insulating layers extend to the second surface and are connected to each other. The stacked electronic component according to claim 23.

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