Electronic module, display, photoelectric conversion device, and electronic apparatus

Abstract

To provide a technique advantageous for coupling of a light transmissive member and a frame member.SOLUTION: An electronic module includes an electronic device that includes a pixel region in which a plurality of pixels are arranged, a light transmissive member that includes a principal surface facing the pixel region; and a frame member that is coupled to the electronic device and the light transmissive member, and determines the positional relationship between the electronic device and the light transmissive member. The frame member includes a support part that is arranged to surround the light transmissive member and has a support surface for supporting the light transmissive member. The support surface includes a contact part that is in contact with the principal surface, and a concave part that is recessed compared to the contact part and has a coupling member arranged for coupling the light transmissive member and the frame member. The contact part includes a portion extending along an outer edge of the principal surface between the concave part and an inner edge of the support surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic module, a display device, a photoelectric conversion device, and an electronic apparatus.

Background Art

[0002] An electronic module including an electronic device provided with a photoelectric conversion element, a light-emitting element, etc., a translucent member for protecting the electronic device from moisture, foreign matter, etc., and a frame member for supporting the translucent member is known. In Patent Document 1, it is shown that a mold is provided on each side of a substrate on which an imaging element is mounted, and glass is adhered to the mold to protect the light-receiving surface of the imaging element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When an adhesive spreads over the glass when the glass is adhered to the mold, problems such as the adhesive being reflected in the image may occur. Further, in order to suppress the spread of the adhesive, it is necessary to devise the application amount, curing conditions, viscosity, etc. of the adhesive, which complicates the design and manufacture of the electronic module.

[0005] An object of the present invention is to provide a technique advantageous for the coupling of a translucent member and a frame member.

Means for Solving the Problems

[0006] In view of the above problems, an embodiment of the present invention provides an electronic module comprising: an electronic device including a pixel region in which a plurality of pixels are arranged; a translucent member having a main surface facing the pixel region; and a frame member coupled to the electronic device and the translucent member, respectively, and determining the positional relationship between the electronic device and the translucent member, wherein the frame member is arranged to surround the translucent member and includes a support portion having a support surface for supporting the translucent member, the support surface includes a contact portion in contact with the main surface and a recess that is recessed from the contact portion and in which a coupling member for connecting the translucent member and the frame member is disposed, and the contact portion includes a portion extending along the outer edge of the main surface between the recess and the inner edge of the support surface. [Effects of the Invention]

[0007] According to the present invention, a technology advantageous for joining a translucent member and a frame member can be provided. [Brief explanation of the drawing]

[0008] [Figure 1] A plan view, a cross-sectional view, and a cross-sectional view of the support part showing an example configuration of the light-emitting module according to this embodiment. [Figure 2] A cross-sectional view showing a modified example of the support portion of the light-emitting module in Figure 1. [Figure 3] A plan view and a cross-sectional view of the support section showing a modified example of the light-emitting module in Figure 1. [Figure 4] Cross-sectional view of the support section of the comparative example light-emitting module. [Figure 5] Figure 1 shows an example of the pixel configuration of the light-emitting module. [Figure 6] A diagram showing an example of an image forming apparatus using the light-emitting module of this embodiment. [Figure 7] A diagram showing an example of a display device using the light-emitting module of this embodiment. [Figure 8] A diagram showing an example of a photoelectric conversion device using the light-emitting module of this embodiment. [Figure 9] A diagram showing an example of an electronic device using the light-emitting module of this embodiment. [Figure 10] A diagram showing an example of a display device using the light-emitting module of this embodiment. [Figure 11] A diagram showing an example of a lighting device using the light-emitting module of this embodiment. [Figure 12] A diagram showing an example of a mobile body using the light-emitting module of this embodiment. [Figure 13] A diagram showing an example of a wearable device using the light-emitting module of this embodiment. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] A light-emitting module according to an embodiment of the present disclosure will be described with reference to Figures 1(a) to 1(c) to 4. Figures 1(a) to 1(c) are schematic diagrams illustrating an example of the configuration of an electronic module 100 according to the present invention. Figure 1(a) is a plan view of the electronic module 100 as seen from the side of the light-transmitting member 700. Figure 1(b) is a cross-sectional view between A and A' in Figure 1(a). Figure 1(c) is a cross-sectional view between B and B' in Figure 1(a), and is an enlarged view illustrating the details of the support portion 410 of the frame member 400.

[0011] First, the schematic configuration of the electronic module 100 according to this embodiment will be described using Figures 1(a) and 1(b). The electronic module 100 includes an electronic device 150, a frame member 400, and a light-transmitting member 900. The electronic device 150 includes substrates 151, 154, and 155. Substrate 151 can be made of silicon, glass, resin, or the like. The main surface of substrate 151 is divided into a pixel region 153 where multiple pixels are arranged, and a peripheral region outside the pixel region 153 where electrodes 152, which are external connection terminals, are arranged. The main surface of the substrate where the pixel region 153 is arranged is positioned to face the light-transmitting member 700, as shown in Figure 1(a).

[0012] Each pixel in the pixel region 153 may include a photoelectric conversion element. In this case, the electronic device 150 may also be called a photoelectric conversion device. Furthermore, each pixel in the pixel region 153 may include a light-emitting element. In this case, the electronic device 150 may also be called a light-emitting device. When a pixel in the pixel region 153 includes a light-emitting element, the light-emitting element may be a self-luminescent element using an organic light-emitting material or an inorganic light-emitting material. For example, the light-emitting element may be an organic electroluminescent (EL) element. Also, the pixel region 153 may contain both pixels with photoelectric conversion elements and pixels with light-emitting elements. In the following explanation, we will assume that each pixel in the pixel region 153 includes a light-emitting element such as an organic EL element, and that the electronic device 150 is a light-emitting device.

[0013] The substrate 154 is positioned opposite the main surface of the substrate 151 on which the pixel region 153 is located. A filler member 158 is placed between the substrate 151 and the substrate 154, bonding the two substrates together. A light-transmitting substrate such as glass or resin is used for the substrate 154. For example, if the pixels arranged in the pixel region 153 include a photoelectric conversion element, the substrate 154 transmits the light to which the photoelectric conversion element is sensitive. Also, for example, if the pixels arranged in the pixel region 153 include a light-emitting element, the substrate 154 transmits the light emitted by the light-emitting element. The substrate 154 is positioned to cover the pixel region 153 of the substrate 151 in order to protect the pixel region 153.

[0014] The filling member 158 may be a transparent epoxy resin, an acrylic resin, or the like. The filling member 158 is arranged so as not to protrude outside the substrate 151 or from the electrode 152. In the configuration shown in FIG. 1, the filling member 158 is depicted as being in full contact with the pixel region 153 of the substrate 151 and the main surface of the substrate 154 on the side of the substrate 151. However, it is not limited to this. For example, the filling member 158 does not necessarily have to be in contact with the entire surface of the pixel region 153 or the substrate 154, such as only at the four corners of the pixel region 153 or the substrate 154.

[0015] The substrate 155 is electrically connected to the electrode 152 of the substrate 151 via the bonding member 157. The substrate 155 may be, for example, a printed wiring board with a wiring pattern formed on a rigid substrate such as a glass epoxy substrate or a composite substrate. Also, the substrate 155 may be, for example, a flexible wiring board with a wiring pattern formed on a flexible film such as polyimide. Furthermore, the substrate 155 may be a rigid-flexible wiring board that is a composite of a flexible film and a rigid substrate. The substrate 155 can be used to supply power to the substrate 151 from outside the electronic device 150. Also, the substrate 155 can be used to input a signal from outside the electronic device 150 to the substrate 151 or to output a signal from the substrate 151 to the outside of the electronic device 150, etc.

[0016] For the bonding member 157, bumps, anisotropic conductive films, anisotropic conductive pastes, etc. can be used. When a bump is used as the bonding member 157, the electrode 152 of the substrate 151 and the wiring pattern arranged on the substrate 155 can be electrically connected by ultrasonic waves or heat and pressure. Also, when an anisotropic conductive film or an anisotropic conductive paste is used as the bonding member 157, the electrode 152 of the substrate 151 and the wiring pattern arranged on the substrate 155 can be electrically connected by heat and pressure.

[0017] UV-curing or thermosetting adhesives may be used for the reinforcing member 156. The reinforcing member 156 is positioned to be in contact with the main surface of the substrate 151 where the pixel region 153 is located, the main surface of the substrate 155 opposite to the substrate 151, and the periphery of the bonding member 157, in order to increase the bonding strength between the substrate 151 and the substrate 155.

[0018] An electronic module 100 is constructed by attaching a frame member 400 and a translucent member 700 to the electronic device 150 to protect it from external impacts and prevent the intrusion of particles and other external elements. The frame member 400 is coupled to the electronic device 150, which includes a pixel region 153 on a substrate 151 in which multiple pixels are arranged, and to the translucent member 700, respectively, determining the positional relationship between the electronic device 150 and the translucent member 700. For example, the main surface of the substrate 154 facing the translucent member 700 and the inner wall portion 401 of the frame member 400 are in continuous contact around the opening 404 for exposing the pixel region 153. Furthermore, the translucent member 700, which has a main surface 701 facing the pixel region 153, is coupled to the frame member 400 by a bonding member 600 such as an adhesive, thereby suppressing the intrusion of particles and other external elements. The coupling between the translucent member 700 and the frame member 400 will be described later. The electronic device 150 and the frame member 400 may be joined together, for example, using a bonding agent such as an adhesive, or by using a snap structure or the like.

[0019] The light-transmitting member 700 is made of a light-transmitting material such as glass or resin. For example, if the pixels arranged in the pixel region 153 include a photoelectric conversion element, the light-transmitting member 700 transmits the light to which the photoelectric conversion element is sensitive. Also, for example, if the pixels arranged in the pixel region 153 include a light-emitting element, the light-transmitting member 700 transmits the light emitted by the light-emitting element.

[0020] Next, the connection between the translucent member 700 and the frame member 400 will be explained using Figures 1(a) to 1(c).

[0021] The frame member 400 can be molded from a resin material such as modified PPE (polyphenylene ether), liquid crystal polymer (LCP), or polyamide. The frame member 400 is provided with an opening 404 that matches the pixel area 153. The frame member 400 also includes a wall portion 405 arranged to surround the light-transmitting member 700, and a support portion 410 having a support surface 409 that supports the light-transmitting member 700. The support surface 409 includes a contact portion 408 that contacts the main surface 701 of the light-transmitting member 700, and a recess 406 that is recessed from the contact portion 408 and has a connecting member 600 that connects the light-transmitting member 700 and the frame member 400. Here, the contact portion 408 includes a portion 418 that extends along the outer edge 702 of the main surface 701 of the light-transmitting member 700 between the recess 406 and the inner edge 411 of the support surface 409. Furthermore, as shown in Figure 1(c), a void 601 may be formed in the recess 406, surrounded by the wall surface of the recess 406, the connecting member 600, and the translucent member 700. Here, the wall surface of the recess 406 includes the side walls arranged along the depth direction of the recess 406 and the bottom surface arranged to face the translucent member 700 of the recess 406.

[0022] Figure 4 shows the support portion 410 of the comparative example. In the comparative example, the contact portion 408 that contacts the main surface 701 of the translucent member 700 does not include a portion 418 that extends along the outer edge 702 of the main surface 701 of the translucent member 700 between the recess 406 and the inner edge 411 of the support surface 409. In that case, as shown in Figure 4, when the translucent member 700 and the frame member 400 are joined via the connecting member 600, the connecting member 600, which may use an adhesive or the like, may wet and spread on the main surface 701 of the translucent member 700 to the area of ​​the opening 407 of the frame member 400. In this case, the light emitted by the pixels arranged in the pixel area 153 may be reflected or refracted by the connecting member 600, which may reduce the display quality of the image displayed in the pixel area 153.

[0023] On the other hand, in this embodiment, in the support portion 410, a contact portion 408 (part 418) is provided between the recess 406 and the inner edge 411 of the support surface 409, in contact with the main surface 701 of the translucent member 700. The gap 601 and part 418 of the contact portion 408 prevent the connecting member 600 from spreading inward (towards the inner edge 411) beyond the recess 406 when the translucent member 700 and the frame member 400 are connected via the connecting member 600. As a result, as shown in Figure 4, the deterioration of image quality caused by the wetting and spreading of the connecting member can be suppressed. Furthermore, even if there are variations in the amount of coating, curing conditions, viscosity, etc. of the connecting member 600, the wetting and spreading of the connecting member 600 is suppressed by the gap 601 and part 418 of the contact portion 408. In other words, the complexity of designing and manufacturing the electronic module 100 can be suppressed.

[0024] From the viewpoint of filling the bonding member 600, the recess 406 may have a depth of 50 μm or more from the contact portion 408. For example, an ultraviolet-curing adhesive such as epoxy resin or acrylic resin can be used for the bonding member 600.

[0025] For example, the translucent member 700 and the frame member 400 may be joined using the following process. The translucent member 700 is positioned on the support surface 409 of the support portion 410, with its position restricted by the wall portion 405 of the frame member 400. Then, an adhesive that will become the joining member 600 is applied to the recess 406 provided in the frame member 400. Therefore, as shown in Figure 1(a), if the translucent member 700 is positioned to cover a part of the recess 406 in an orthographic projection onto the support surface 409, the application of the adhesive that will become the joining member 600 can be easily carried out. After that, the adhesive is cured, and the translucent member 700 and the frame member 400 are joined via the joining member 600.

[0026] In the orthogonal projection onto the support surface 409, the entire recess 406 is separated from the inner edge 411 of the support surface 409. This allows a contact portion 408 (part 418) that contacts the main surface 701 of the translucent member 700 to be positioned between the recess 406 and the inner edge 411 of the support surface 409. Furthermore, as shown in Figures 1(a) to 1(c), in the orthogonal projection onto the support surface 409, the contact portion 408 may be continuously positioned to surround the inner edge 411 of the support surface 409. By continuously positioning the contact portion 408 to surround the inner edge 411 of the support surface 409, the translucent member 700 can be stably supported.

[0027] Furthermore, as shown in Figure 1(a), the support surface 409 has a plurality of recesses 406. The number of recesses 406 may be four, three or fewer, or five or more, depending on the weight of the translucent member 700 and the bonding force between the translucent member 700 and the frame member 400 via the connecting member 600, as shown in Figure 1. Also, the recesses 406 are not limited to being arranged intermittently. For example, one recess 406 may be arranged continuously to correspond to one side of the inner edge 411 of the support surface 409. Alternatively, for example, the recesses 406 may continuously surround the entire circumference of the inner edge 411 of the support surface 409.

[0028] In the configuration shown in Figures 1(b) and 1(c), the connecting member 600 is in contact with the main surface 701 of the translucent member 700 and the side surface 703 of the translucent member 700 that extends in a direction intersecting the main surface 701. However, the arrangement of the connecting member 600 is not limited to this. Modified arrangements of the connecting member 600 will be explained using Figures 2(a) and 2(b). As shown in Figure 2(a), the connecting member 600 may be in contact with the main surface 701 of the translucent member 700 but not with the side surface 703. Also, as shown in Figure 2(b), the connecting member 600 may be in contact with the side surface 703 of the translucent member 700 but not with the main surface 701. In cases where the translucent member 700 and the frame member 400 can be joined with a small amount of connecting member 600, the configurations shown in Figures 2(a) and 2(b) use less connecting member 600 than the configurations shown in Figures 1(b) and 1(c).

[0029] Figure 2(c) shows a modified example of the support portion 410 shown in Figure 1(c). In the configurations shown in Figures 1(a) to 1(c), in the orthogonal projection onto the support surface 409, the entire recess 406 is positioned away from the wall portion 405 of the frame member 400 that surrounds the translucent member 700. On the other hand, in the configuration shown in Figure 2(c), in the orthogonal projection onto the support surface 409, the recess 406 is in contact with the wall portion 405 of the frame member 400 that surrounds the translucent member 700. In other words, a part of the inner wall of the wall portion 405 of the frame member 400 constitutes a part of the side wall of the recess 406. Here, the inner wall of the wall portion 405 refers to the wall surface of the wall portion 405 that faces the translucent member 700. Also, the side wall of the recess 406 refers to the wall surface positioned along the depth direction of the recess 406, as described above.

[0030] The configuration shown in Figure 2(c) allows for a larger volume of the recess 406 than the configuration shown in Figure 1(c), provided that the size of the support portion 410 is the same. As a result, the configuration shown in Figure 2(c) uses a larger number of connecting members 600 to connect the translucent member 700 and the frame member 400 than the configuration shown in Figure 1(c), thereby improving the bonding strength. Furthermore, even when a large number of connecting members 600 are used, a gap 601 and a contact portion 408 (part 418) that contacts the main surface 701 of the translucent member 700 are arranged between the recess 406 and the inner edge 411 of the support surface 409. Therefore, it is possible to suppress the wetting and spreading of the connecting members 600 onto the main surface 701 of the translucent member 700.

[0031] Next, a modified example of the electronic module 100 described above will be explained using Figures 3(a) and 3(b). Figure 1(a) is a plan view of the electronic module 100 as seen from the side of the translucent member 700. Figure 3(b) is a cross-sectional view between C and C' in Figure 3(a), and is an enlarged view illustrating the details of the support portion 410 of the frame member 400. Compared to the embodiments described above, the shape of the wall portion 405 and the recess 406 of the frame member 400 is different. Other configurations may be the same as those of the embodiments described above, so here we will focus on explaining the different configurations, and explanations of configurations that may be the same will be omitted as appropriate.

[0032] In the electronic module 100 shown in Figures 3(a) and 3(b), in the orthogonal projection onto the support surface 409, the portion 415 of the wall portion 405 of the frame member 400 that surrounds the translucent member 700 and is in contact with the recess 406 is recessed towards the outer edge of the frame member 400 than the portion 425 of the wall portion 405 that is not in contact with the recess 406. In other words, the inner wall of the wall portion 405 is recessed in the portion 415 that constitutes part of the side wall of the recess 406 of the inner wall of the wall portion 405, compared to the other portion 425.

[0033] In the process of joining the translucent member 700 and the frame member 400 as described above, a tube called a needle is commonly used to supply the joining member 600. In this case, a needle with a larger diameter is used with the aim of increasing the supply amount per unit time in order to improve the production cycle time. However, if the diameter of the needle is simply increased, there is a high possibility that the needle will come into contact with the translucent member 700 or the frame member 400 and damage the translucent member 700 or the frame member 400. In the configuration shown in Figures 3(a) and 3(b), a portion 415 of the inner wall of the wall portion 405 that constitutes part of the side wall of the recess 406 is recessed more than the other portion 425. In other words, a distance can be made between the translucent member 700 and the wall portion 405 of the frame member 400 at the location where the recess 406 is located. As a result, even when the needle diameter is increased during the process of joining the translucent member 700 and the frame member 400, damage to the translucent member 700 and the frame member 400 is suppressed, enabling a process design that can improve production cycle time.

[0034] Here, application examples of the electronic module 100 of this embodiment applied to image forming apparatuses, display devices, photoelectric converters, electronic devices, lighting devices, mobile devices, and wearable devices will be described using Figures 5 to 13(a) and 13(b). As described above, it will be explained that the pixels arranged in the pixel region 153 of the substrate 151 of the electronic device 150 are equipped with light-emitting elements, particularly organic light-emitting elements such as organic EL elements. In other words, the case in which the electronic device 150 is a light-emitting device (which may also be called a light-emitting apparatus) will be described. First, the details of each configuration of the pixel region 153 arranged in the electronic device 150 of the electronic module 100 will be shown, and then the application examples will be described.

[0035] Structure of an organic light-emitting device An organic light-emitting element is provided on a substrate by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode. A protective layer, a color filter, a microlens, etc., may be provided on the cathode. If a color filter is provided, a planarization layer may be provided between it and the protective layer. The planarization layer can be made of acrylic resin or the like. The same applies when a planarization layer is provided between the color filter and the microlens.

[0036] substrate Examples of substrates include quartz, glass, silicon wafers, resins, and metals. The substrate may also be equipped with switching elements such as transistors and wiring, and an insulating layer may be provided on top of them. The insulating layer can be made of any material that allows for the formation of contact holes between it and the first electrode, while ensuring insulation from wiring that is not connected. For example, resins such as polyimide, silicon oxide, and silicon nitride can be used.

[0037] electrode A pair of electrodes can be used. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with the higher potential is the anode, and the other is the cathode. Alternatively, the electrode that supplies holes to the light-emitting layer can be the anode, and the electrode that supplies electrons can be the cathode.

[0038] For the anode, materials with the largest possible work function are preferable. For example, elemental metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, or mixtures containing these, or alloys combining them, as well as metal oxides such as tin oxide, zinc oxide, indium oxide, tin-indium oxide (ITO), and zinc-indium oxide can be used. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used.

[0039] These electrode materials may be used individually or in combination of two or more. Furthermore, the anode may consist of a single layer or multiple layers.

[0040] When used as a reflective electrode, materials such as chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys or laminates thereof can be used. It is also possible to use the above materials as a reflective film without serving as an electrode. Furthermore, when used as a transparent electrode, oxide transparent conductive layers such as indium tin oxide (ITO) or indium zinc oxide can be used, but are not limited to these. Photolithography can be used to form the electrodes.

[0041] On the other hand, materials with a small work function are preferred for the cathode. Examples include alkali metals such as lithium, alkaline earth metals such as calcium, and elemental metals or mixtures containing aluminum, titanium, manganese, silver, lead, and chromium. Alternatively, alloys combining these elemental metals can also be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials may be used individually or in combination of two or more. The cathode may also be a single-layer or multi-layer structure. Among these, silver is preferred, and a silver alloy is even more preferred to reduce silver aggregation. The alloy ratio is not important as long as silver aggregation is reduced. For example, the ratio of silver to other metals may be 1:1, 3:1, etc.

[0042] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but using DC and AC sputtering methods is more preferable because it provides good film coverage and makes it easier to reduce resistance.

[0043] Pixel separation layer The pixel separation layer is formed from a silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO) film, which is formed using chemical vapor deposition (CVD). To increase the in-plane resistance of the organic compound layer, it is preferable that the thickness of the organic compound layer, particularly the hole transport layer, be thinly deposited on the sidewalls of the pixel separation layer. Specifically, by increasing the taper angle of the sidewalls of the pixel separation layer and the thickness of the pixel separation layer, the vignetting during deposition can be increased, thereby thinning the film thickness on the sidewalls.

[0044] On the other hand, it is preferable to adjust the taper angle of the sidewalls of the pixel isolation layer and the thickness of the pixel isolation layer to such an extent that no voids are formed in the protective layer formed on top of it. Since no voids are formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, reliability degradation such as the occurrence of dark spots and poor conductivity of the second electrode can be reduced.

[0045] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel isolation layer is not steep. This study found that sufficient reduction is possible when the taper angle is in the range of 60 degrees to 90 degrees. The thickness of the pixel isolation layer is preferably between 10 nm and 150 nm. Similar effects can also be obtained even if the device consists only of pixel electrodes without a pixel isolation layer. However, in this case, it is preferable to make the thickness of the pixel electrode less than half the thickness of the organic layer, or to make the pixel electrode ends have a forward taper of less than 60°, as this reduces short circuits in the organic light-emitting element.

[0046] Furthermore, even when the first electrode is the cathode and the second electrode is the anode, a wide color gamut and low-voltage operation are possible by forming an electron-transporting material, a charge transport layer, and a light-emitting layer on the charge transport layer.

[0047] organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. If there are multiple layers, they may be called a hole injection layer, a hole transport layer, an electron blocking layer, an emissive layer, a hole blocking layer, an electron transport layer, or an electron injection layer, depending on their function. The organic compound layer is mainly composed of organic compounds, but may also contain inorganic atoms and inorganic compounds. For example, it may contain copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be placed between the first electrode and the second electrode, or it may be placed in contact with the first electrode and the second electrode.

[0048] protective layer A protective layer may be provided on the cathode. For example, by bonding glass with a desiccant to the cathode, the intrusion of water and other substances into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water and other substances into the organic compound layer. For example, after forming the cathode, it may be transported to another chamber without breaking the vacuum and a silicon nitride film with a thickness of 2 μm may be formed by the CVD method to serve as a protective layer. A protective layer may also be provided using atomic deposition (ALD) after the film formation by the CVD method. The material of the film formed by the ALD method is not limited, but may be silicon nitride, silicon oxide, aluminum oxide, etc. Silicon nitride may be further formed on the film formed by the ALD method by the CVD method. The film formed by the ALD method may have a thinner film thickness than the film formed by the CVD method. Specifically, it may be 50% or less, or even 10% or less.

[0049] Color filter A color filter may be provided on top of the protective layer. For example, a color filter that takes into account the size of the organic light-emitting element may be provided on a separate substrate and bonded to the substrate on which the organic light-emitting element is provided, or a color filter may be patterned on the protective layer as described above using photolithography technology. The color filter may be made of polymer.

[0050] planarization layer A planarizing layer may be provided between the color filter and the protective layer. The planarizing layer is provided to reduce the unevenness of the layer below. It may also be called a material resin layer without limiting its purpose. The planarizing layer may be composed of an organic compound, which may be low molecular weight or high molecular weight, but high molecular weight is preferred.

[0051] The planarization layer may be provided above or below the color filter, and its constituent materials may be the same or different. Specifically, examples include polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenolic resin, epoxy resin, silicone resin, urea resin, etc.

[0052] Microlens An organic light-emitting device may have optical elements such as microlenses on its light-emitting side. Microlenses may be made of acrylic resin, epoxy resin, or the like. Microlenses may be used to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. Microlenses may have a hemispherical shape. If they have a hemispherical shape, among the tangents tangent to the hemisphere, there is a tangent parallel to the insulating layer, and the point of contact between that tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be similarly determined in any cross-sectional view. That is, among the tangents tangent to the semicircle of the microlens in the cross-sectional view, there is a tangent parallel to the insulating layer, and the point of contact between that tangent and the semicircle is the vertex of the microlens.

[0053] Furthermore, the midpoint of a microlens can also be defined. In the cross-section of a microlens, a line segment can be imagined from the point where one arc ends to the point where another arc ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross-section used to determine the vertices and midpoints may be a cross-section perpendicular to the insulating layer.

[0054] A microlens has a first surface with a convex portion and a second surface opposite to the first surface. It is preferable that the second surface is positioned closer to the functional layer than the first surface. To adopt such a configuration, it is necessary to form the microlens on the light-emitting device. If the functional layer is an organic layer, it is preferable to avoid processes that involve high temperatures during the manufacturing process. Furthermore, when adopting a configuration in which the second surface is positioned closer to the functional layer than the first surface, it is preferable that the glass transition temperatures of all organic compounds constituting the organic layer are 100°C or higher, and more preferably 130°C or higher.

[0055] Opposing board A counter substrate may be provided on the planarized layer. The counter substrate is called a counter substrate because it is provided in a position corresponding to the aforementioned substrate. The constituent material of the counter substrate may be the same as that of the aforementioned substrate. The counter substrate may be the second substrate if the aforementioned substrate is referred to as the first substrate.

[0056] organic layer The organic compound layer (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to one embodiment of the present invention is formed by the method shown below.

[0057] The organic compound layer constituting the organic light-emitting element according to one embodiment of the present invention can be formed using a dry process such as vacuum deposition, ionization deposition, sputtering, or plasma deposition. Alternatively, instead of a dry process, a wet process can be used in which the layer is formed by dissolving the compound in a suitable solvent and applying a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0058] When layers are formed using methods such as vacuum deposition or solution coating, crystallization is less likely to occur, resulting in excellent stability over time. Furthermore, when forming films using coating methods, it is possible to combine the film with an appropriate binder resin.

[0059] Examples of the binder resins mentioned above include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenolic resin, epoxy resin, silicone resin, and urea resin.

[0060] Furthermore, these binder resins may be used individually as homopolymers or copolymers, or as a mixture of two or more types. Additionally, known additives such as plasticizers, antioxidants, and UV absorbers may be used in combination as needed.

[0061] Pixel circuit The light-emitting device may have a pixel circuit connected to a light-emitting element. The pixel circuit may be an active-matrix type that independently controls the light emission of a first light-emitting element and a second light-emitting element. The active-matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the light emission brightness of the light-emitting element, a transistor that controls the light emission timing, a capacitor that holds the gate voltage of the transistor that controls the light emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0062] The light-emitting device has a display area and a peripheral area arranged around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of the transistors constituting the pixel circuit may be smaller than the mobility of the transistors constituting the display control circuit.

[0063] The slope of the current-voltage characteristics of the transistors constituting the pixel circuit can be smaller than the slope of the current-voltage characteristics of the transistors constituting the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristic.

[0064] The transistors that make up the pixel circuit are transistors connected to light-emitting elements, such as the first light-emitting element.

[0065] pixels The organic light-emitting device has multiple pixels. Each pixel has subpixels that emit light of a different color from the others. The subpixels may each have, for example, RGB light-emitting colors.

[0066] A pixel emits light in a region also called the pixel aperture. This region is the same as the first region. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0067] The distance between subpixels may be 10 μm or less, specifically 8 μm, 7.4 μm, or 6.4 μm.

[0068] Pixels can take on known arrangements in a plan view. For example, they may be in a stripe arrangement, delta arrangement, pentile arrangement, or Bayer arrangement. The shape of subpixels in a plan view may be any known shape. For example, rectangles, rhombuses, hexagons, etc. Of course, even if it is not a precise shape, if it is close to a rectangle, it is included in the category of rectangles. The shape of subpixels and the pixel arrangement can be used in combination.

[0069] Applications of the organic light-emitting element according to one embodiment of the present invention An organic light-emitting element according to one embodiment of the present invention can be used as a component of a display device or lighting device. Other applications include exposure light sources for electrophotographic image forming apparatuses, backlights for liquid crystal display devices, and light-emitting devices with a color filter in a white light source.

[0070] The display device may also be an image information processing device that has an image input unit for receiving image information from an area CCD, linear CCD, memory card, etc., an information processing unit for processing the input information, and displays the input image on the display unit.

[0071] Furthermore, the display unit of the imaging device or inkjet printer may have a touch panel function. The driving method for this touch panel function may be infrared, capacitive, resistive, or electromagnetic induction, and is not particularly limited. The display device may also be used as the display unit of a multifunction printer.

[0072] Next, we will provide further explanation with reference to the drawings. Figure 5(a) is an example of a pixel, which is a component of the pixel region 153 described above. The pixel has sub-pixels 810. The sub-pixels are divided into 810R, 810G, and 810B based on their light emission. The emitted color may be distinguished by the wavelength emitted from the light-emitting layer, or the light emitted from the sub-pixel may be selectively transmitted or color-converted by a color filter or the like. Each sub-pixel has a reflective electrode 802 which is the first electrode, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 which is the second electrode, a protective layer 806, and a color filter 807 on an interlayer insulating layer 801.

[0073] The interlayer insulating layer 801 may have transistors, capacitive elements, etc., placed in the layer below or inside it. The transistor and the first electrode may be electrically connected via a contact hole or the like (not shown).

[0074] The insulating layer 803 is also called a bank or pixel isolation layer. It covers the edge of the first electrode and surrounds the first electrode. The portion without the insulating layer is in contact with the organic compound layer 804 and forms the light-emitting region.

[0075] The organic compound layer 804 includes a hole injection layer 841, a hole transport layer 842, a first light-emitting layer 843, a second light-emitting layer 844, and an electron transport layer 845.

[0076] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0077] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is shown as a single layer, it may consist of multiple layers. Each layer may contain an inorganic compound layer and an organic compound layer.

[0078] The color filter 807 is classified into 807R, 807G, and 807B depending on its color. The color filter may be formed on a planarization film (not shown). The color filter may also have a resin protective layer (not shown). Alternatively, the color filter may be formed on a protective layer 806. Or it may be bonded after being placed on an opposing substrate such as a glass substrate.

[0079] The display device 800 in Figure 5(b) (corresponding to the electronic device 150 described above) shows an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 made of glass, silicon, or the like is provided, with an insulating layer 812 on top of it. An active element such as the TFT 818 is placed on the insulating layer, and the gate electrode 813, gate insulating film 814, and semiconductor layer 815 of the active element are arranged therein. The TFT 818 is also composed of a semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on top of the TFT 818. The anode 821 and the source electrode 817 that constitute the organic light-emitting element 826 are connected via a contact hole 820 provided in the insulating film.

[0080] Note that the method of electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the configuration shown in Figure 5(b). In other words, it is sufficient for either the anode or cathode to be electrically connected to either the TFT source electrode or the drain electrode. TFT refers to a thin-film transistor.

[0081] In the display device 800 shown in Figure 5(b), the organic compound layer is depicted as a single layer, but the organic compound layer 822 may consist of multiple layers. A first protective layer 824 and a second protective layer 825 are provided on the cathode 823 to reduce the degradation of the organic light-emitting element.

[0082] In the display device 800 shown in Figure 5(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0083] Furthermore, the transistor used in the display device 800 in Figure 5(b) is not limited to a transistor using a single-crystal silicon wafer, but may also be a thin-film transistor having an active layer on an insulating surface of the substrate. Examples of active layers include non-single-crystal silicon such as single-crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Thin-film transistors are also called TFT elements.

[0084] The transistors included in the display device 800 in Figure 5(b) may be formed within a substrate such as a Si substrate. Here, "formed within a substrate" means that the transistors are manufactured by processing the substrate itself, such as a Si substrate. In other words, having transistors within a substrate can be seen as the substrate and transistors being formed as a single unit.

[0085] The organic light-emitting element according to this embodiment has its luminescence controlled by a TFT, which is an example of a switching element, and by providing multiple organic light-emitting elements on the surface, an image can be displayed using the luminescence of each element. The switching element according to this embodiment is not limited to a TFT, but may also be a transistor made of low-temperature polysilicon, or an active matrix driver formed on a substrate such as a Si substrate. "On the substrate" can also mean "within the substrate." Whether to provide a transistor within the substrate or to use a TFT is selected depending on the size of the display area; for example, if the size is about 0.5 inches, the organic light-emitting element may be provided on a Si substrate.

[0086] Figures 6(a) to 6(c) are schematic diagrams showing an example of an image forming apparatus using the electronic module 100 of this embodiment. The image forming apparatus 926 shown in Figure 6(a) includes a photoreceptor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transfer unit 932, a transport unit 933 (transport rollers in the configuration of Figure 6(a)), and a fuser 935.

[0087] Light 929 is shone from the exposure light source 928, forming an electrostatic latent image on the surface of the photoreceptor 927. An electronic module 100 can be applied to this exposure light source 928. The developing unit 931 contains toner or the like as a developer and can function as a developer that applies the developer to the exposed photoreceptor 927. The charging unit 930 charges the photoreceptor 927. The transfer unit 932 transfers the developed image to the recording medium 934. The transport unit 933 transports the recording medium 934. The recording medium 934 can be, for example, paper or film. The fuser unit 935 fixes the image formed on the recording medium.

[0088] Figures 6(b) and 6(c) are schematic diagrams showing how multiple light-emitting units 936 are arranged along the longitudinal direction on a long substrate in an exposure light source 928. An electronic module 100 can be applied to these light-emitting units 936. That is, multiple pixels arranged in the pixel area 153 are arranged along the longitudinal direction of the substrate 151. Direction 937 is parallel to the axis of the photoreceptor 927. This column direction is the same as the direction of the axis when the photoreceptor 927 rotates. This direction 937 can also be called the longitudinal axis direction of the photoreceptor 927.

[0089] Figure 6(b) shows a configuration in which the light-emitting units 936 are arranged along the long axis of the photoreceptor 927. Figure 6(c) is a modified example of the arrangement of the light-emitting units 936 shown in Figure 6(b), in which the light-emitting units 936 are arranged alternately in the column direction in the first and second columns. In the first and second columns, the light-emitting units 936 are arranged at different positions in the row direction. In the first column, multiple light-emitting units 936 are arranged at intervals, and in the second column, light-emitting units 936 are arranged at positions corresponding to the gaps between the light-emitting units 936 in the first column. Also, multiple light-emitting units 936 are arranged at intervals in the row direction. The arrangement of the light-emitting units 936 shown in Figure 6(c) can also be described as a grid arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0090] Figure 7 is a schematic diagram showing an example of a display device using the electronic module 100 of this embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. Active elements such as transistors are arranged on the circuit board 1007. The battery 1008 does not need to be provided if the display device 1000 is not a portable device, and even if it is a portable device, it does not need to be provided in this position. The electronic module 100 can be applied to the display panel 1005. The pixels arranged in the pixel area 153 of the electronic module 100 that functions as the display panel 1005 are connected to and operate with active elements such as transistors arranged on the circuit board 1007.

[0091] The display device 1000 shown in Figure 7 may be used as the display unit of a photoelectric conversion device (imaging device) having an optical unit with multiple lenses and an image sensor that receives light passing through the optical unit and converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the image sensor. Furthermore, the display unit may be an external display unit exposed to the outside of the photoelectric conversion device, or a display unit located inside the viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0092] Figure 8 is a schematic diagram showing an example of a photoelectric converter using the electronic module 100 of this embodiment. The photoelectric converter 1100 may have a viewfinder 1101, a rear display 1102, an operating unit 1103, and a housing 1104. The photoelectric converter 1100 may also be called an imaging device. The electronic module 100 of this embodiment can be applied to the display unit, which is the viewfinder 1101 or the rear display 1102. In this case, the pixel area 153 of the electronic module 100 may display not only the image to be captured, but also environmental information, imaging instructions, etc. Environmental information may include the intensity of ambient light, the direction of ambient light, the speed at which the subject is moving, and the possibility that the subject is obscured by an obstacle.

[0093] Since the optimal timing for imaging is often very short, it is desirable to display information as quickly as possible. Therefore, an electronic module 100 in which pixels containing light-emitting elements made of organic light-emitting materials such as organic EL elements are arranged in the pixel area 153 may be used in the viewfinder 1101 or the rear display 1102. This is because organic light-emitting materials have a fast response speed. An electronic module 100 using organic light-emitting materials is more suitable than a liquid crystal display for these devices where display speed is required.

[0094] The photoelectric converter 1100 has an optical section (not shown). The optical section has multiple lenses, and the light that passes through the optical section is imaged onto a photoelectric converter element (not shown) housed in a light-receiving housing 1104. The focus can be adjusted by adjusting the relative positions of the multiple lenses. This operation can also be performed automatically.

[0095] The electronic module 100 may be applied to the display section of an electronic device. In this case, it may have both a display function and an operating function. Examples of portable terminals include smartphones and other mobile phones, tablets, and head-mounted displays.

[0096] Figure 9 is a schematic diagram showing an example of an electronic device using the electronic module 100 of this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type response unit. The operation unit 1202 may also be a biometric recognition unit that recognizes fingerprints to unlock, etc. A portable device having a communication unit can also be called a communication device. The electronic module 100 of this embodiment can be applied to the display unit 1201.

[0097] Figures 10(a) and 10(b) are schematic diagrams showing an example of a display device using the electronic module 100 of this embodiment. Figure 10(a) is a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The electronic module 100 of this embodiment can be applied to the display unit 1302. The display device 1300 may also have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form shown in Figure 10(a). For example, the lower edge of the frame 1301 may also serve as the base 1303. Also, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0098] Figure 10(b) is a schematic diagram showing another example of a display device using the electronic module 100 of this embodiment. The display device 1310 in Figure 10(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The electronic module 100 of this embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single display device without seams. The first display unit 1311 and the second display unit 1312 can be separated by a bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or they may display a single image together.

[0099] Figure 11 is a schematic diagram showing an example of a lighting device using the electronic module 100 of this embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion section 1405. The electronic module 100 of this embodiment can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering of the light source. The light diffusion section 1405 can effectively diffuse the light from the light source, such as for lighting up, and deliver light over a wide area. A cover may be provided on the outermost part if necessary. The lighting device 1400 may have both the optical film 1404 and the light diffusion section 1405, or it may have only one of them.

[0100] The lighting device 1400 is, for example, a device for illuminating a room. The lighting device 1400 may emit white light, daylight white light, or any other color from blue to red. It may have a dimming circuit for adjusting the brightness of these colors. The lighting device 1400 may have a power supply circuit connected to the pixel area 153 of the electronic module 100, which functions as a light source 1402. The power supply circuit is a circuit that converts AC voltage to DC voltage. White light has a color temperature of 4200K, and daylight white light has a color temperature of 5000K. The lighting device 1400 may also have a color filter. The lighting device 1400 may also have a heat dissipation section. The heat dissipation section releases heat from inside the device to the outside, and examples include metals with high specific heat and liquid silicon.

[0101] Figure 12 is a schematic diagram of an automobile having a taillight, which is an example of a vehicle lighting device using the electronic module 100 of this embodiment. The automobile 1500 has a taillight 1501, and the taillight 1501 may be illuminated when the brakes are applied or otherwise. The electronic module 100 of this embodiment may also be used as a headlight as a vehicle lighting device. The automobile is an example of a mobile body, and the mobile body may be a ship, drone, aircraft, railway vehicle, industrial robot, etc. The mobile body may have a body and lighting devices installed thereon. The lighting devices may indicate the current position of the body.

[0102] The electronic module 100 of this embodiment can be applied to the taillight 1501. The taillight 1501 may have a protective member to protect the electronic module 100 that functions as a taillight 1501. The protective member can be made of any material as long as it has a reasonably high strength and is transparent, but it may be made of polycarbonate or the like. The protective member may also be made of polycarbonate mixed with a frangic acid derivative, an acrylonitrile derivative, or the like.

[0103] The automobile 1500 may have a body 1503 and windows 1502 attached thereto. The windows may be for checking the front and rear of the automobile, or they may be transparent displays. The electronic module 100 of this embodiment may be used in the transparent display. In this case, the constituent materials such as electrodes of the electronic module 100 are made of transparent materials.

[0104] Further application examples of the electronic module 100 of this embodiment will be described with reference to Figures 13(a) and 13(b). The electronic module 100 can be applied to systems that can be worn as wearable devices such as smart glasses, head-mounted displays (HMDs), and smart contact lenses. The imaging display device used in such applications includes an imaging device capable of photoelectric conversion of visible light and a light-emitting device capable of emitting visible light.

[0105] Figure 13(a) illustrates a pair of glasses 1600 (smart glasses) according to one application example. An imaging device 1602, such as a CMOS sensor or SPAD, is provided on the front surface of the lens 1601 of the glasses 1600. The electronic module 100 of this embodiment is provided on the back surface of the lens 1601.

[0106] The eyeglasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that provides power to the imaging device 1602 and the electronic module 100 according to each embodiment. The control device 1603 also controls the operation of the imaging device 1602 and the electronic module 100. The lens 1601 has an optical system formed therein for focusing light onto the imaging device 1602.

[0107] Figure 13(b) illustrates a pair of glasses 1610 (smart glasses) according to one application example. The glasses 1610 have a control device 1612, which is equipped with an imaging device equivalent to an imaging device 1602 and an electronic module 100. The lens 1611 has an optical system formed to project light emitted from the imaging device and the electronic module 100 within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply to provide power to the imaging device and the electronic module 100, and also controls the operation of the imaging device and the electronic module 100. The control device 1612 may have a gaze detection unit that detects the wearer's gaze. Gaze detection may use infrared light. The infrared light emitter emits infrared light towards the eyeball of the user who is gazing at the displayed image. The imaging unit, which has a photodetector, detects the reflected light from the eyeball of the emitted infrared light, thereby obtaining an image of the eyeball. By having a reduction mechanism that reduces the amount of light transmitted from the infrared light-emitting part to the display part in a planar view, the degradation of image quality is reduced.

[0108] The user's gaze towards a displayed image is detected from an image of the eyeball obtained by imaging with infrared light. Any known method can be applied to gaze detection using an image of the eyeball. As an example, a gaze detection method based on the Purkinje image obtained by the reflection of the irradiated light from the cornea can be used.

[0109] More specifically, gaze detection processing is performed based on the pupil-corneal reflection method. Using the pupil-corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the pupil image and Purkinje image contained in the captured image of the eyeball, thereby detecting the user's gaze.

[0110] An electronic module 100 according to one embodiment of the present invention has an imaging device having a light-receiving element, and may control the displayed image based on the user's gaze information from the imaging device.

[0111] Specifically, the electronic module 100 determines a first field of view area that the user is fixated on, and a second field of view area other than the first field of view area, based on gaze information. The first and second field of view areas may be determined by the control device of the electronic module 100, or they may be determined by an external control device and received by the electronic module 100. In the display area of ​​the electronic module 100, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0112] Furthermore, the display area has a first display area and a second display area different from the first display area, and based on gaze information, a higher priority area is determined from the first and second display areas. The first and second display areas may be determined by the control device of the electronic module 100, or they may be determined by an external control device and received. The resolution of the higher priority area may be controlled to be higher than the resolution of the areas other than the higher priority area. In other words, the resolution of areas with relatively lower priority may be set lower.

[0113] AI may be used to determine the first field of view area and high-priority areas. The AI ​​may be a model configured to estimate the angle of line of sight and the distance to the target object at the end of the line of sight from the image of the eye, using the image of the eye and the direction the eye was actually looking in that image as training data. The AI ​​program may be located in the electronic module 100, the imaging device, or an external device. If it is located in an external device, it is transmitted to the electronic module 100 via communication.

[0114] When display control is based on visual detection, this method is preferably applicable to smart glasses that further include an imaging device for capturing images of the surrounding environment. The smart glasses can display the captured external information in real time.

[0115] The disclosures herein include the following electronic modules, display devices, photoelectric converters, and electronic devices.

[0116] (Item 1) An electronic module comprising: an electronic device including a pixel region in which a plurality of pixels are arranged; a translucent member having a main surface facing the pixel region; and a frame member coupled to the electronic device and the translucent member, respectively, which determines the positional relationship between the electronic device and the translucent member, The frame member is arranged to surround the light-transmitting member and includes a support portion having a support surface for supporting the light-transmitting member. The support surface includes a contact portion that is in contact with the main surface, and a recess that is recessed from the contact portion and in which a connecting member for connecting the light-transmitting member and the frame member is disposed. The electronic module is characterized in that the contact portion includes a portion that extends along the outer edge of the main surface between the recess and the inner edge of the support surface.

[0117] (Item 2) The electronic module according to item 1, characterized in that, in the orthogonal projection onto the support surface, the contact portion is continuously arranged so as to surround the inner edge of the support surface.

[0118] (Item 3) The electronic module according to item 1 or 2, characterized in that, in the orthogonal projection onto the support surface, the entire recess is separated from the inner edge of the support surface.

[0119] (Item 4) The electronic module according to any one of items 1 to 3, characterized in that the connecting member is in contact with the main surface.

[0120] (Item 5) The electronic module according to item 4, characterized in that the connecting member is further in contact with a side surface of the light-transmitting member that extends in a direction intersecting the main surface.

[0121] (Item 6) The electronic module according to item 4, characterized in that the connecting member is not in contact with the side surface of the light-transmitting member that extends in a direction intersecting the main surface.

[0122] (Item 7) The electronic module according to any one of items 1 to 3, characterized in that the connecting member is in contact with a side surface of the light-transmitting member that extends in a direction intersecting the main surface.

[0123] (Item 8) The electronic module according to item 7, characterized in that the connecting member is not in contact with the main surface.

[0124] (Item 9) The electronic module according to any one of items 1 to 8, characterized in that, in the orthogonal projection onto the support surface, the entire recess is separated from the wall portion of the frame member that surrounds the translucent member.

[0125] (Item 10) The electronic module according to any one of items 1 to 8, characterized in that, in the orthogonal projection onto the support surface, the recess is in contact with a wall portion of the frame member that is arranged to surround the translucent member.

[0126] (Item 11) The electronic module according to item 10, characterized in that, in the orthogonal projection onto the support surface, the portion of the wall that is in contact with the recess is recessed towards the outer edge of the frame member more than the portion of the wall that is not in contact with the recess.

[0127] (Item 12) The electronic module according to any one of items 1 to 11, characterized in that, in the orthogonal projection onto the support surface, the translucent member covers a portion of the recess.

[0128] (Item 13) The electronic module according to any one of items 1 to 12, characterized in that a plurality of recesses are arranged on the support surface.

[0129] (Item 14) The electronic module according to any one of items 1 to 13, characterized in that the recess has a depth of 50 μm or more from the contact portion.

[0130] (Item 15) The electronic module according to any one of items 1 to 14, characterized in that the recess comprises a gap surrounded by the wall surface of the recess, the connecting member, and the light-transmitting member.

[0131] (Item 16) An electronic module according to any one of items 1 to 15, characterized in that each of the plurality of pixels includes a light-emitting element.

[0132] (Item 17) A display device characterized by having an electronic module as described in item 16 and an active element connected to the electronic module.

[0133] (Item 18) It comprises an optical unit having multiple lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image. The photoelectric conversion device is characterized in that the display unit is a display unit that displays an image captured by the image sensor, and has the electronic module described in item 16.

[0134] (Item 19) It comprises a housing on which a display unit is provided, and a communication unit provided in the housing for communicating with the outside, The display unit is an electronic device characterized by having the electronic module described in item 16.

[0135] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0136] 100: Electronic module, 150: Electronic device, 400: Frame member, 406: Recess, 408: Contact part, 409: Support surface, 410: Support part, 411: Inner edge, 418: Part, 700: Translucent member, 701: Main surface, 702: Outer edge

Claims

1. An electronic module including: an electronic device including a pixel region in which a plurality of pixels are arranged; a light-transmitting member having a main surface facing the pixel region; and a frame member coupled to the electronic device and the light-transmitting member, respectively, and determining a positional relationship between the electronic device and the light-transmitting member, the frame member includes a support portion that is disposed so as to surround the light-transmitting member and has a support surface that supports the light-transmitting member, the support surface includes a contact portion in contact with the main surface, and a recessed portion recessed further than the contact portion and in which a joining member that joins the light-transmitting member and the frame member is disposed, In an orthogonal projection onto the support surface, the entire recess is spaced apart from an inner edge of the support surface; the contact portion includes a portion extending along an outer edge of the main surface between the recess and an inner edge of the support surface, An electronic module, wherein the recess has a gap surrounded by a wall surface of the recess, the coupling member, and the light-transmitting member.

2. 2. The electronic module according to claim 1, wherein, in an orthogonal projection onto the support surface, the contact portions are arranged continuously so as to surround an inner edge of the support surface.

3. The electronic module of claim 1 , wherein the coupling member is in contact with the main surface.

4. 4. The electronic module according to claim 3, wherein the coupling member is in contact with a side surface of the light-transmitting member that extends in a direction intersecting the main surface.

5. 4. The electronic module according to claim 3, wherein the coupling member does not contact a side surface of the light-transmitting member that extends in a direction intersecting the main surface.

6. 2. The electronic module according to claim 1, wherein the coupling member is in contact with a side surface of the light-transmitting member that extends in a direction intersecting the main surface.

7. 7. The electronic module of claim 6, wherein the coupling member does not contact the main surface.

8. 2. The electronic module according to claim 1, wherein, in an orthogonal projection onto the support surface, the entire recess is spaced apart from a wall portion of the frame member that is disposed so as to surround the translucent member.

9. 2. The electronic module according to claim 1, wherein, in an orthogonal projection onto the support surface, the recess contacts a wall portion of the frame member that is disposed so as to surround the translucent member.

10. 10. The electronic module according to claim 9, wherein, in an orthogonal projection onto the support surface, the portion of the wall that is in contact with the recess is recessed toward the outer edge of the frame member more than the portion of the wall that is not in contact with the recess.

11. The electronic module according to claim 1 , wherein the light-transmitting member covers a part of the recess in an orthogonal projection onto the support surface.

12. The electronic module according to claim 1 , wherein a plurality of the recesses are arranged on the support surface.

13. 2. The electronic module according to claim 1, wherein the recess has a depth of 50 [mu]m or more from the contact portion.

14. 14. The electronic module of claim 1, wherein each of the plurality of pixels comprises a light-emitting element.

15. A display device comprising: the electronic module according to claim 14; and an active element connected to the electronic module.

16. an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; 15. A photoelectric conversion device, wherein the display section is a display section that displays an image captured by the imaging element, and further comprises the electronic module according to claim 14.

17. A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device.

15. An electronic device, wherein the display unit comprises the electronic module according to claim 14.

Images