Probe

Abstract

To suppress diffusion of a component included in solder to a probe.SOLUTION: A probe includes 40 to 95 mass% Pt, 0.5 to 50 mass% Cu, and 3 to 50 mass% Ni.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a probe. [Background technology]

[0002] In order to test an object such as an integrated circuit, the object may be electrically connected to a test board via a probe attached to a socket. The probe may contain an alloy of Ag, Pd, and Cu. Hereinafter, the alloy of Ag, Pd, and Cu will be referred to as AgPdCu alloy, as necessary.

[0003] An example of an AgPdCu alloy is described in Patent Document 1. The AgPdCu alloy described in Patent Document 1 contains 4% or more of Ag, approximately 35% to approximately 59% of Pd, and 16% or more and 50% or less of Cu. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Patent No. 1,935,897 Summary of the Invention [Problem to be solved by the invention]

[0005] AgPdCu alloys are sometimes used as materials for constructing probes. However, when the tip of a probe containing an AgPdCu alloy is repeatedly brought into contact with the solder of an object to be inspected to form an electrical connection, there is a tendency for the components contained in the solder, such as Sn, and the components contained in the probe to diffuse into each other due to factors such as Joule heat. When the components contained in the solder diffuse, the tip of the probe may be worn out. Therefore, when a probe containing an AgPdCu alloy is used, the tip of the probe must be cleaned or replaced relatively frequently, which may reduce the operating rate of the inspection process.

[0006] One example of an object of the present invention is to suppress the diffusion of components contained in the solder into the probe. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0007] One aspect of the present invention is 40% by mass or more and 95% by mass or less of Pt; 0.5% by mass or more and 50% by mass or less of Cu; 3% by mass or more and 50% by mass or less of Ni; A probe comprising:

[0008] According to the above aspect of the present invention, it is possible to suppress the diffusion of components contained in the solder into the probe. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a cross-sectional view of a socket according to an embodiment. [Diagram 2] FIG. 11 is a cross-sectional view of a socket according to a first modified example. [Diagram 3] FIG. 11 is a cross-sectional view of a probe according to a second modified example. [Figure 4] 1 is a triangular graph showing the relationship between the mass ratio of Pt, the mass ratio of Cu, and the mass ratio of Ni contained in the test materials according to Examples 1 to 14. [Diagram 5] FIG. 13 is a diagram showing a scanning electron microscope (SEM) image of the tip of the contact portion of the first test pin before an electrical durability test. [Figure 6] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the first test pin after an electrical durability test. [Figure 7] 1 is an enlarged SEM image of one of the sharp tips of the contact portion of the first test pin after a current endurance test. [Figure 8] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the second test pin before the current endurance test. [Figure 9] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the second test pin after an electrical durability test. [Figure 10]1 is an enlarged SEM image of one of the sharp tips of the contact portion of the second test pin after the electrical durability test. [Figure 11] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the third test pin before the current endurance test. [Figure 12] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the third test pin after an electrical durability test. [Figure 13] 1 is an enlarged SEM image of the pointed tip of one of the contact portions of the third test pin after a current endurance test. [Figure 14] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the fourth test pin before the current endurance test. [Figure 15] FIG. 13 is a diagram showing an SEM image of the tip of the contact portion of the fourth test pin after an electrical durability test. [Figure 16] 1 is an enlarged SEM image of one of the sharp tips of the contact portion of the fourth test pin after the electrical durability test. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments and modifications of the present invention will be described with reference to the drawings. In all the drawings, similar components are given similar reference numerals and descriptions thereof will be omitted as appropriate.

[0011] In this specification, ordinal numbers such as "first," "second," "third," etc., unless otherwise specified, are used merely to distinguish between similarly named configurations and do not imply any particular characteristics (e.g., order or importance) of the configurations.

[0012] FIG. 1 is a cross-sectional view of a socket 10 according to an embodiment.

[0013] 1, the arrow indicated by "+Z" indicates the vertical upward direction, and the arrow indicated by "-Z" indicates the vertical downward direction. Hereinafter, the direction perpendicular to the vertical direction will be referred to as the horizontal direction, as necessary.

[0014] The socket 10 includes a probe 100 and an insulating support 200. The probe 100 is provided in a through hole formed in the insulating support 200. The probe 100 includes a first plunger 110, a second plunger 120, a tube 130, and a spring 140. FIG. 1 shows a state in which an inspection target 20 is inspected by an inspection board 30 using the probe 100. Specifically, in the state shown in FIG. 1, a solder ball 22 of the inspection target 20 and a pad 32 of the inspection board 30 are electrically connected via the probe 100.

[0015] The tube 130 extends in the vertical direction. The spring 140 is located inside the tube 130. The probe 100 does not necessarily have to have the tube 130. The spring 140 is wound in a spiral shape around an imaginary axis that passes vertically through the center of the tube 130.

[0016] The first plunger 110 is located on the upper end side of the spring 140. The first plunger 110 is biased upward, i.e., in a direction away from the second plunger 120, by the spring 140. When the test object 20 is being tested by the test board 30, the first plunger 110 is connected to the test object 20 located above the probe 100. In this state, the tip, i.e., the upper end, of the first plunger 110 is in contact with the solder ball 22 of the test object 20. In the example shown in FIG. 1, the tip of the first plunger 110 has a plurality of peaks arranged at equal intervals around a virtual axis that passes vertically through the center of the first plunger 110. The shape of the tip of the first plunger 110 is not limited to the example shown in FIG. 1.

[0017] The second plunger 120 is located on the lower end side of the spring 140. The second plunger 120 is biased downward, i.e., in a direction away from the first plunger 110, by the spring 140. When the test object 20 is being tested by the test board 30, the second plunger 120 is connected to the test board 30 located below the probe 100. In this state, the tip, i.e., the lower end, of the second plunger 120 is in contact with the pad 32 of the test board 30. The tip of the second plunger 120 has a hemispherical shape. The shape of the tip of the second plunger 120 is not limited to the example shown in FIG. 1.

[0018] The first plunger 110 includes a material (A). The material (A) includes 40% by mass or more and 95% by mass or less of Pt, 0.5% by mass or more and 50% by mass or less of Cu, and 3% by mass or more and 50% by mass or less of Ni. For example, at least the surface of the first plunger 110 is made of the material (A). In this example, for example, the entire first plunger 110 may be made of the material (A). Alternatively, the material (A) may cover the surface of the first plunger 110 by a process such as plating. When the material (A) covers the surface of the first plunger 110, the part of the first plunger 110 covered by the material (A) may be made of a material different from the material (A). Also, for example, at least the part of the first plunger 110 that contacts the solder ball 22 may be made of the material (A). In this example, for example, the material (A) may cover only the surface of the portion of the first plunger 110 that comes into contact with the solder ball 22 by a process such as plating.

[0019] The lower limit of the mass ratio of Pt contained in the material (A) is determined from the viewpoint of the corrosion resistance of the material (A). If the mass ratio of Pt contained in the material (A) is less than 40 mass%, the corrosion resistance of the material (A) may be insufficient. For this reason, the mass ratio of Pt contained in the material (A) can be 40 mass% or more. The mass ratio of Pt contained in the material (A) may be 45 mass% or more or 50 mass% or more.

[0020] The upper limit of the mass ratio of Pt contained in the material (A) is determined from the viewpoint of the hardness of the material (A) hardened by strong working. If the mass ratio of Pt contained in the material (A) exceeds 95 mass%, the hardness of the material (A) hardened by strong working may not reach 300 HV. In this case, the hardness of the material (A) hardened by strong working may not reach the hardness required for the first plunger 110. For this reason, the mass ratio of Pt contained in the material (A) can be 95 mass% or less. The mass ratio of Pt contained in the material (A) may be 90 mass% or less or 83 mass% or less.

[0021] The mass ratio of Pt contained in the material (A) can be, for example, 45 mass% or more and 90 mass% or less, or, for example, 50 mass% or more and 83 mass% or less.

[0022] The lower limit of the mass ratio of Cu contained in the material (A) is determined from the viewpoint of the hardness of the material (A). By adding Cu to Pt, the hardness of the material (A) can be improved while maintaining good workability of the material (A). However, if the mass ratio of Cu contained in the material (A) is less than 0.5 mass%, the hardness of the material (A) may be insufficient. For this reason, the mass ratio of Cu contained in the material (A) can be 0.5 mass% or more. The mass ratio of Cu contained in the material (A) may be 2 mass% or more or 5 mass% or more. The mass ratio of Cu contained in the material (A) may be 9 mass% or more.

[0023] The upper limit of the mass ratio of Cu contained in the material (A) is determined from the viewpoint of the corrosion resistance of the material (A). If the mass ratio of Cu contained in the material (A) exceeds 50 mass%, the corrosion resistance of the material (A) may be insufficient. Therefore, the mass ratio of Cu contained in the material (A) can be set to 50 mass% or less. The mass ratio of Cu contained in the material (A) may be set to 40 mass% or less or 30 mass% or less.

[0024] The mass ratio of Cu contained in the material (A) can be, for example, 2 mass% or more and 40 mass% or less, or, for example, 5 mass% or more and 30 mass% or less.

[0025] The lower limit of the mass ratio of Ni contained in the material (A) is determined from the viewpoint of the hardness of the work-hardened material (A). When the material (A) contains Ni, the hardness of the work-hardened material (A) can be improved without reducing the inhibition of diffusion between the components contained in the material (A) and the components contained in the solder such as the solder balls 22. However, if the mass ratio of Ni contained in the material (A) is less than 3 mass%, the hardness of the work-hardened material (A) may be insufficient. For this reason, the mass ratio of Ni contained in the material (A) can be 3 mass% or more. The mass ratio of Ni contained in the material (A) may be 5 mass% or more or 10 mass% or more.

[0026] The upper limit of the mass ratio of Ni contained in the material (A) is determined from the viewpoint of, for example, plastic processing such as cold rolling or wire drawing of the material (A). If the mass ratio of Ni contained in the material (A) exceeds 50 mass%, plastic processing such as cold rolling or wire drawing of the material (A) may become difficult. For this reason, the mass ratio of Ni contained in the material (A) can be set to 50 mass% or less. The mass ratio of Ni contained in the material (A) may be, for example, 40 mass% or less or 35 mass% or less.

[0027] The mass ratio of Ni contained in the material (A) can be, for example, 5 mass% or more and 40 mass% or less, or, for example, 10 mass% or more and 35 mass% or less.

[0028] In the embodiment, compared to when the first plunger 110 contains an AgPdCu alloy, it is possible to suppress the diffusion of the components contained in the solder ball 22 into the first plunger 110 at the interface between the tip of the first plunger 110 and the surface of the solder ball 22. Also, in the embodiment, compared to when the first plunger 110 contains an AgPdCu alloy, it is possible to suppress the wear of the tip of the first plunger 110 by suppressing the diffusion of the components contained in the solder ball 22 into the first plunger 110.

[0029] The reason why the diffusion of the components contained in the solder into the material (A) is suppressed when the material (A) is used is presumed to be as follows, compared to when the AgPdCu alloy is used. That is, when the material (A) and the solder come into contact with each other, a dense thin film containing a metal compound such as Sn-Ni is formed at the interface between the material (A) and the solder due to Ni contained in the material (A). When this metal compound exists at the interface between the material (A) and the solder, the diffusion of the components contained in the material (A) and the solder is suppressed by this metal compound, compared to when this metal compound does not exist at the interface between the material (A) and the solder. In contrast, when the AgPdCu alloy is used, the above metal compound is difficult to form. Therefore, in the embodiment, compared to when the first plunger 110 contains the AgPdCu alloy, the diffusion of the components contained in the solder ball 22 into the first plunger 110 can be suppressed between the tip of the first plunger 110 and the solder ball 22.

[0030] The material (A) is not required to be as hard as the existing AgPdCu alloy. However, as the number of inspections increases, the contact surface of the first plunger 110 may be mechanically crushed. For this reason, it is desirable that the material (A) is relatively hard. For example, the first plunger 110 can be used with a hardness of 200 HV or more. The hardness of the material (A) may be required to be 250 HV or more, preferably 300 HV. The hardness of the material (A) may be improved by work hardening.

[0031] The material (A) may be required to have a relatively low resistivity. For example, the resistivity of the material (A) may be set to 90 μΩ·cm or less. By lowering the resistivity of the material (A), it is possible to suppress Joule heat generated from the material (A) during an inspection using the probe 100.

[0032] 2 is a cross-sectional view of a socket 10A according to a first modified example. The socket 10A according to this modified example is similar to the probe 100 according to the embodiment, except for the following points.

[0033] The lower end of the first plunger 110A is provided with an extension 112A that extends downward from the first plunger 110A. The first plunger 110A and the extension 112A are integral. Therefore, both the first plunger 110A and the extension 112A contain material (A). The lower end of the extension 112A is provided with a tip head 114A. The tip head 114A may or may not contain material (A).

[0034] The upper end of the second plunger 120A is provided with a base end 122A. A hole 124A that opens toward the upper side of the base end 122A is formed on the upper surface of the base end 122A. A locking portion 126A is provided on a part of the inner wall that defines the hole 124A in the base end 122A. The horizontal diameter of the locking portion 126A of the hole 124A is narrower than the horizontal diameter of the portion of the hole 124A located below the locking portion 126A. The tip head 114A is inserted below the locking portion 126A of the hole 124A. The tip head 114A is movable in the vertical direction below the locking portion 126A of the hole 124A. The horizontal diameter of the tip head 114A is larger than the horizontal diameter of the locking portion 126A of the hole 124A. Therefore, the end head 114A is prevented from slipping out upward of the hole 124A by the locking portion 126A.

[0035] The probe 100A according to this modification does not have a tube corresponding to the tube 130 of the probe 100 according to the embodiment. The spring 140A is located between the lower end of the first plunger 110A and the upper end of the base end 122A. The spring 140A is spirally wound around the extension 112A. The first plunger 110A, the extension 112A, and the tip head 114A are biased upward by the spring 140A. The second plunger 120A and the base end 122A are biased downward by the spring 140A.

[0036] 3 is a cross-sectional view of a probe 100B according to a second modified example. The probe 100B according to this modified example is similar to the probe 100 according to the embodiment, except for the following points.

[0037] In the example shown in FIG. 3, the first plunger 110B and the tube 130B are integrated. Therefore, both the first plunger 110B and the tube 130B contain the material (A). The first plunger 110B and the tube 130B are biased upward, i.e., in a direction away from the second plunger 120B, by the spring 140B. The second plunger 120B is biased downward, i.e., in a direction away from the first plunger 110B, by the spring 140B.

[0038] Although the embodiment and modified examples of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted. EXAMPLES

[0039] One embodiment of the present invention will be described based on examples and comparative examples, but the present invention is not limited to each of the following examples.

[0040] Table 1 shows the composition of each of the test materials of Examples 1 to 14 and Comparative Examples 1 and 2. In Examples 1 to 14 and Comparative Example 2 in Table 1, the notation "αPtβCuγNi" means that the test material contains α% by mass of Pt, β% by mass of Cu, and γ% by mass of Ni. In Comparative Example 1, the notation "24.5Ag45Pd25Cu0.5In" means that the test material contains 24.5% by mass of Ag, 45% by mass of Pd, 25% by mass of Cu, and 0.5% by mass of In. [Table 1]

[0041] The test materials of Examples 1 to 14 and Comparative Examples 1 and 2 were prepared as follows.

[0042] For Example 1, a blend was obtained by blending 95 mass % Pt, 2 mass % Cu, and 3 mass % Ni as shown in Table 1. For each of Examples 2 to 14 and Comparative Example 2, a blend was obtained by blending Pt, Cu, and Ni to obtain the composition of Examples 2 to 14 and Comparative Example 2 shown in Table 1. For Comparative Example 1, a blend was obtained by blending Ag, Pd, Cu, and In to obtain the composition of Comparative Example 1 shown in Table 1.

[0043] Next, for each of Examples 1 to 14 and Comparative Examples 1 and 2, the above-mentioned compositions were melted by arc melting in an argon atmosphere to prepare alloy ingots.

[0044] Next, for each of Examples 1 to 14 and Comparative Examples 1 and 2, the rolling and heat treatment of the above alloy ingots were repeated to produce plate materials with a rolling ratio of 80%. The rolling ratio RR was determined according to the following formula (1), where t1 is the thickness of the alloy ingot before rolling and t2 is the thickness of the alloy ingot after rolling. RR = {(t1-t2) / t1} × 100 (1)

[0045] Plate materials with a rolling ratio of 80% could be produced in Examples 1 to 14 and Comparative Example 1. In contrast, plate materials with a rolling ratio of 80% could not be produced in Comparative Example 2. For Comparative Example 2, the measurements described below using Table 2 were not performed.

[0046] Table 2 shows the measurement results for each of Examples 1 to 14 and Comparative Example 1, including the resistivity (unit: μΩ cm) of the test material, the processed hardness (unit: HV) of the test material, and the thickness (unit: μm) of the diffusion layer between the test material and the solder. [Table 2]

[0047] For each of Examples 1 to 20 and Comparative Example 1, the resistivity of the test material was measured by measuring the electrical resistance R of the test material at room temperature and calculating the resistivity ρ according to the following formula (2). ρ=RS / l (2) Here, l is the measurement length in the direction in which the current flows in the test material, and S is the cross-sectional area perpendicular to the direction in which the current flows in the test material. In measuring the resistivity, a plate material with a rolling ratio of 90% was used as the test material.

[0048] As shown in Table 2, the resistivity was less than 90 μΩ·cm in Examples 1 to 14. Therefore, it can be said that the resistivity required for the probe was obtained in Examples 1 to 14.

[0049] For each of Examples 1 to 14 and Comparative Example 1, the hardness of the worked test material was measured with a micro Vickers hardness tester by holding the center of the cross section of the test material under a load of 200 gf for 10 seconds.

[0050] As shown in Table 2, the hardness of the processed material was 300 HV or more in Examples 1 to 14. Therefore, it can be said that the hardness required for the probe was obtained in Examples 1 to 14.

[0051] For each of Examples 1 to 14 and Comparative Example 1, the thickness of the diffusion layer between the test material and the solder was measured as follows. First, the Sn-Bi solder was placed on a test material measuring 10 mm x 10 mm x 0.5 mm thick. Next, the test material and the Si-Bi solder were heat-treated in an N2 atmosphere at 250°C for 1 hour while the Sn-Bi solder was placed on the test material, and the solder was melted on the test material. Next, the test material was embedded in resin to expose a cross section including both the test material and the solder. Next, an EPMA (Electron Probe Micro Analyzer) was used to perform a line analysis of the interface between the test material and the solder in a direction perpendicular to the interface. In Examples 1 to 14, the diffusion layer was a layer in which both Sn diffused from the solder and Pt, the main element diffused from the test material, were present in the line analysis. In Comparative Example 1, the diffusion layer was a layer in which both Sn diffused from the solder and Pd, the main element diffused from the test material, were present in the line analysis.

[0052] As shown in Table 2, the thickness of the diffusion layer was 600 μm or more in Comparative Example 1. In contrast, the thickness of the diffusion layer was less than 100 μm in Examples 1 to 14. Therefore, it can be said that, compared to Comparative Example 1, Examples 1 to 14 were able to suppress the diffusion of the components contained in the solder into the test material.

[0053] From the results shown in Table 2, it can be said that the test materials of Examples 1 to 14 were able to suppress the diffusion of components contained in the solder into the test material while achieving the resistivity and processed material hardness required for the probe, compared to the test material of Comparative Example 1.

[0054] FIG. 4 is a triangular graph showing the relationship between the mass ratio of Pt, the mass ratio of Cu, and the mass ratio of Ni contained in the test materials according to Examples 1 to 14.

[0055] The side from the lower right vertex to the upper center vertex of the triangular graph represents the mass ratio (unit: mass%) of Pt contained in the test material. The side from the upper center vertex to the lower left vertex of the triangular graph represents the mass ratio (unit: mass%) of Cu contained in the test material. The side from the lower left vertex to the lower right vertex of the triangular graph represents the mass ratio (unit: mass%) of Ni contained in the test material.

[0056] The hatched area in the triangular graph of Fig. 4 indicates the range of Pt mass ratio from 40 mass% to 95 mass%, Cu mass ratio from 0.5 mass% to 50 mass%, and Ni mass ratio from 3 mass% to 50 mass%. The plots of Examples 1 to 14 are located within the hatched area. From the tendency of the plots of Examples 1 to 14, it can be said that in any of the hatched areas, the diffusion of components contained in the solder into the test material can be suppressed compared to the case where the test material is an AgPdCu alloy.

[0057] Fig. 5 is a scanning electron microscope (SEM) image of the tip of the contact portion of the first test pin before the current endurance test, Fig. 6 is a SEM image of the tip of the contact portion of the first test pin after the current endurance test, and Fig. 7 is an enlarged SEM image of one pointed tip of the contact portion of the first test pin after the current endurance test.

[0058] The first test pin contains the test material of Example 2. As shown in Figures 5 and 6, the tip of the contact portion of the first test pin has four prongs that are equally spaced around the central axis of the test pin.

[0059] In the current endurance test, a flying probe tester was used to contact the tip of the contact portion of the first test pin with Sn-40Bi solder at a temperature of 125° C., and a current of 1 A was passed for 20 ms, which was repeated 10,000 times.

[0060] The length of the first test pin before the current endurance test was compared with the length of the first test pin after the current endurance test to calculate the amount of wear of the first test pin. The amount of wear of the first test pin was 0 μm.

[0061] Fig. 8 is a SEM image of the tip of the contact portion of the second test pin before the current endurance test, Fig. 9 is a SEM image of the tip of the contact portion of the second test pin after the current endurance test, and Fig. 10 is an enlarged SEM image of one pointed tip of the contact portion of the second test pin after the current endurance test.

[0062] The second test pin was similar to the first test pin, except that the second test pin included the test material of Example 3. The conditions for the electrical durability test on the second test pin were similar to the conditions for the electrical durability test on the first test pin.

[0063] The length of the second test pin before the current endurance test was compared with the length of the second test pin after the current endurance test to calculate the amount of wear of the first test pin. The amount of wear of the second test pin was 0 μm.

[0064] Fig. 11 is a SEM image of the tip of the contact portion of the third test pin before the current endurance test, Fig. 12 is a SEM image of the tip of the contact portion of the third test pin after the current endurance test, and Fig. 13 is an enlarged SEM image of one pointed tip of the contact portion of the third test pin after the current endurance test.

[0065] The third test pin was similar to the first test pin, except that the third test pin included the test material of Example 8. The conditions for the electrical durability test on the third test pin were similar to the conditions for the electrical durability test on the first test pin.

[0066] The length of the third test pin before the current endurance test was compared with the length of the third test pin after the current endurance test to calculate the wear amount of the first test pin. The wear amount of the third test pin was 1 μm.

[0067] Fig. 14 is a SEM image of the tip of the contact portion of the fourth test pin before the current endurance test, Fig. 15 is a SEM image of the tip of the contact portion of the fourth test pin after the current endurance test, and Fig. 16 is an enlarged SEM image of one pointed tip of the contact portion of the fourth test pin after the current endurance test.

[0068] The fourth test pin was similar to the first test pin, except that the fourth test pin included the test material of Comparative Example 1. The conditions for the electrical durability test on the fourth test pin were similar to the conditions for the electrical durability test on the first test pin.

[0069] The length of the fourth test pin before the current endurance test was compared with the length of the fourth test pin after the current endurance test to calculate the amount of wear of the first test pin. The amount of wear of the fourth test pin was 4 μm.

[0070] From the results of the amount of wear of the first test pin, the second test pin, the third test pin, and the fourth test pin, it can be said that when the test pin contains 40% by mass or more and 95% by mass or less of Pt, 0.5% by mass or more and 50% by mass or less of Cu, and 3% by mass or more and 50% by mass or less of Ni, wear of the tip of the test pin can be suppressed compared to when the test pin contains an AgPdCu alloy.

[0071] According to the present specification, there are provided probes having the following aspects. (Aspect 1) In the first aspect, the probe contains 40% by mass or more and 95% by mass or less of Pt, 0.5% by mass or more and 50% by mass or less of Cu, and 3% by mass or more and 50% by mass or less of Ni.

[0072] According to the above-described embodiment, compared to an AgPdCu alloy, it is possible to suppress the diffusion of components contained in the solder into the probe at the interface between the probe and the solder. [Explanation of symbols]

[0073] 10,10A socket 20 Inspection object 22 Ball 30 Test board 32 Pad 100, 100A, 100B Probes 110, 110A, 110B First plunger 112A Extension part 114A Tip Head 120, 120A, 120B Second plunger 122A Proximal end 124A Hole 126A Locking part 130,130B Tube 140, 140A, 140B Spring 200 Insulating support

Claims

[Claim 1] 40% by mass or more and 95% by mass or less of Pt; 0.5% by mass or more and 50% by mass or less of Cu; 3% by mass or more and 50% by mass or less of Ni; A probe comprising:

Images