Multicomponent system, and method for producing multicomponent system, especially for use in microelectronics

JP2024081742A5Pending Publication Date: 2025-12-19SPHERA TECH GMBH
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024053973
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2019-03-25
Filing Date
2024-03-28
Publication Date
2025-12-19

AI Technical Summary

Technical Problem

Existing multicomponent systems face inefficiencies in reactions and require improvements for precise electrical conduction, particularly in microelectronic applications, where conductive connections are needed with high durability and minimal short circuits.

Method used

A conductive multicomponent system is developed, comprising substances with functional groups and linkers that react to form defined connections, allowing for self-assembly and alignment of particles on substrates, such as circuit boards, enabling precise conductivity through interactions like thiol groups, magnetism, and electrostatic forces, using nanoparticles like silver, gold, and copper.

Benefits of technology

This system enables durable, high-conductivity connections with fewer short circuits, facilitating miniaturization and precise positioning of conductive paths, suitable for microelectronics and 3D integration.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

To provide a conductive multi-component system.SOLUTION: The present invention relates to a conductive multi-component system comprising at least one first substance S1 and at least one substrate B, wherein a) the first substance is present in one or more portions of the substance; b) the at least one first portion of the substance is formed with at least one first functional group R2 and provided with a first linker L1 and / or wherein the substrate B is formed with at least one second functional group R21 and provided with a second linker L2; c) the first functional group reacts via a predefined interaction with the second functional group and / or the substrate and binds them together and / or wherein the second functional group reacts via a predefined interaction with the first functional group and / or the first substance and binds them together; (d) a first portion of the substance is present as a particle or in particles and is at least partially conductive.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to multi-component systems and methods for producing multi-component systems, especially for microelectronic applications. [Background technology]

[0002] From the prior art, multi-component systems are already known.

[0003] From US Pat. No. 5,399,633 a capsule system is already known which reacts to pressure and releases liquid accordingly.

[0004] Further capsule systems are known, for example, from US Pat. No. 5,399,623, US Pat. No. 5,499,633, US Pat. No. 5,523,367, US Pat. No. 5,523,675, and US Pat. No. 5,523,675.

[0005] A method for the production of a conductive layer having a molecular moiety in which a plurality of conductive nanoparticles are linked together is known from US Pat. No. 5,399,633.

[0006] The functionalization of metal nanoparticles is known, for example, from US Pat. No. 5,399,623, US Pat. No. 5,499,633, US Pat. No. 5,523,367 and US Pat. No. 5,523,697.

[0007] Non-Patent Document 1 describes a method for using molecules in electronic applications, in which a self-assembled monolayer (SAM) sandwich structure is used.

[0008] Thiol functionalization is known, for example, from Non-Patent Document 2, further Non-Patent Document 3, further Non-Patent Document 4, and also Non-Patent Document 5 and Non-Patent Document 6.

[0009] Further solutions regarding selective conductivity are known from US Pat. No. 5,393,623, US Pat. No. 5,493,636, US Pat. No. 5,593,665, US Pat. No. 5,613,366, US Pat. No. 5,711,625, US Pat. No. 5,713 ... and US Pat. No. 5,713,625. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] US Patent Application Publication No. 2012 / 0107601 [Patent Document 2] International Publication No. 2017 / 192407 [Patent Document 3] U.S. Patent No. 8,747,999 [Patent Document 4] International Publication No. 2017 / 042709 [Patent Document 5] International Publication No. 2016 / 049308 [Patent Document 6] International Publication No. 2018 / 028058 [Patent Document 7] US Patent Application Publication No. 2018 / 0062076 [Patent Document 8] International Publication No. 2015 / 103028 [Patent Document 9] Canadian Patent No. 2712306 [Patent Document 10] U.S. Patent No. 8,790,552 [Patent Document 11] U.S. Patent No. 5,731,073 [Patent Document 12] U.S. Patent No. 5,498,467 [Patent Document 13] European Patent No. 0841698 [Patent Document 14] International Publication No. 2017 / 139654 [Patent Document 15] International Publication No. 2017 / 138483 [Patent Document 16] Korean Patent No. 101195732 [Patent Document 17] US Patent Application Publication No. 2010 / 0327237 [Non-patent literature]

[0011] [Non-Patent Document 1] Puebla-Hellmann G., et al. (2018), ("Metallic nanoparticle contacts for high-yield, ambient-stable molecular-monolayer devices", Nature, Vol. 559)

Wood 2

Table 3

Fashion 4

Wood 5

[0012] The object of the present invention is in particular to provide an electrically conductive multi-component system and a method for producing an electrically conductive multi-component system, with the aim of being able to control the dosage of the individual components of the multi-component system and their arrangement, on the one hand, improving the efficiency of the reaction of the multi-component system and, on the other hand, allowing a precise and precisely defined electrical conduction. [Means for solving the problem]

[0013] The above problem is solved according to the invention by a multi-component system having the features of claim 1. According to the invention, there is provided a conductive multi-component system comprising at least one first substance and at least one substrate, a) the first substance is present in one or more portions of the substance; b) at least one first material portion is provided with at least one first functional group and is provided with a first linker, and / or the substrate is provided with at least one second functional group and is provided with a second linker; c) the first functional group reacts with the second functional group and / or the substrate via a predefined interaction to connect them to each other, and / or the second functional group reacts with the first functional group and / or the first substance via a predefined interaction to connect them to each other; d) It is contemplated that a conductive multi-component system is provided, in which the material portion of the first material is present as or in particles and is at least partially conductive.

[0014] The invention is based on the basic idea that at least one first substance and at least one substrate are arranged in a defined manner with respect to one another by a defined spatial arrangement with the aid of connections by linkers and functional groups. It is therefore now possible to arrange the first substance and the substrate in a defined ratio and at a defined distance. By corresponding activation, specific conductivity can be enabled in the regions where the first substance is bonded to the substrate. With very small structures Even if there is a small amount of conductivity, it can occur in a very specific and defined way. In particular, it is considered here to create conductive connections in the micrometer or nanometer range or even smaller range, which are usually created by bonding or brazing or gluing, etc. The at least one particle can in particular be a microparticle or a nanoparticle.

[0015] In particular, the conductivity of the material part may be intended to be electrical and / or thermal and / or signal conductive.

[0016] It is believed that one or more particles can be self-organized or self-aligned, in which case the particles can autonomously align in a predeterminable or predefined direction on the substrate, for example, as a conductor track.

[0017] Self-assembly can be achieved, for example, by thiol groups (SAM surfaces, see also below), and / or Janus (nano)particles, and / or patch particles, and / or by magnetism (magnetic particles and surfaces), and / or via electrostatic interactions. Such interactions can be achieved, for example, by positively charged surfaces, negatively charged surfaces, and / or via weak interactions, and / or via chemical reaction(s) such as click chemistry (e.g. thiol-ene click chemistry), Michael reactions, etc.

[0018] Furthermore, it may be intended that the distance between the functional group and the substance moiety and the substrate is determined by the respective linkers.

[0019] The substrate can be, for example, a circuit board or printed circuit board or a conductor track in the field of semiconductor technology (wafers (e.g. silicon wafers or silicon wafers) or chips). Especially in the field of microelectronics, i.e. when connecting conductor tracks on circuit boards or chips or in the case of 3D integration etc., conductive connections in the correct position are very beneficial, which are more durable, have higher electrical conductivity, are less prone to short circuits and allow miniaturization. By means of a multi-component system, a conductive connection can be created on the substrate by first positioning the multi-component system. In this case, position corrections are also possible. The multi-component system is then activated (for example as described below) to create the conductive connection.

[0020] If a (single) particle is used, a conductive connection can be created, for example, between two conductor tracks by contacting the particle with both conductor tracks and then correspondingly immobilizing it there by activation.

[0021] If several particles are present, the particles come into contact with each other and create a "constant path" between the two conductor tracks, which in turn creates a correspondingly conductive connection.

[0022] Upon activation, the particles are released. They are then autonomously arranged (so-called self-assembled) at the intended location, for example by terminal thiol groups or conductive polymers, or by Janus (nano)particles. This process can also be assisted, for example, by magnetic and / or electric fields.

[0023] The substrate may also be intended to be a second material.

[0024] In particular, it may be intended that functional groups of the material moieties of the first material and functional groups of the substrate specifically interconnect.

[0025] In particular, functional groups of the substance moieties may be intended to selectively bind to metal surfaces, for example SAM surfaces (self-assembled monolayers).

[0026] The nanoparticles may consist at least in part of silver, gold and / or copper, and / or composites, and / or other metals or alloys thereof, and / or other materials.

[0027] Alternatively, it may be intended that the substrate is or has a surface. The surface may be, for example, a wafer, a (micro)chip, flexible electronics, or a printed circuit board, etc. Furthermore, it is conceivable that the surface is a conductive substrate. Furthermore, it is possible that the substrate is a substrate with conductor tracks. The conductor tracks may be, for example, evaporated, printed or etched. Furthermore, it is possible that the conductor tracks have been applied onto the substrate by thin film techniques or other techniques.

[0028] In particular, it may be intended that the size of the nanoparticles is smaller than the distance between the conductor tracks.

[0029] It is conceivable that the first linker is longer than the second linker or vice versa, which has the advantage that, for example, the first substances are at a greater or lesser distance from each other after corresponding binding than from the first substances to the substrate.

[0030] Alternatively, both linkers can be the same length.

[0031] The linker can be any form of connection between the agent moiety and the functional group.

[0032] The linker may also be any kind of direct connection between the substance moiety and / or capsule and / or substrate and the functional group.

[0033] Possible linkers include biopolymers, proteins, silk, polysaccharides, cellulose, starch, chitin, nucleic acids, synthetic polymers, homopolymers, DNA, halogens, polyethylene, polypropylene, polyvinyl chloride, polylactams, natural rubber, polyisoprene, copolymers, random copolymers, gradient copolymers, alternating copolymers, block copolymers, graft copolymers, acrylonitrile-butadiene-styrene (ABS), styrene-acrylonitrile (SAN), butyl rubber, polymer blends, polymer alloys, inorganic polymers, polysiloxanes, polyphosphazenes, polysilazanes, ceramics, basalt, isotactic polymers, syndiotactic polymers, atactic polymers, linear polymers, crosslinked polymers, elastomers, thermoplastic elastomers, thermosets, partially crystalline linkers, thermoplastics, cis-trans polymers, conducting polymers, supramolecular polymers.

[0034] It is also conceivable that the functional groups are formed of the same or different types. For example, it is conceivable that the substances and the associated functional groups are of different types, i.e. different functional groups can be used. For example, this is desirable when, for example, a specific linker is initially equipped with a protective group during production, in order to achieve that this linker is to be used for a specific bond, for example the bond between a first substance and a first substance, or even the bond between a first substance and a substrate (or even the bond between a substrate and a substrate). It is also conceivable that a first functional group allows the connection of two substance moieties, and a second, different functional group allows the bond of the first substance on the substrate. It is also conceivable that a first functional group allows the bond of a substance moiety, and a second, different functional group allows the modification of the properties of the capsule, for example the biocompatibility, solubility, aggregation, or similar properties. It is also conceivable that the heterogeneous functional groups allow the construction of more than three-component systems.

[0035] Alternatively, instead of a protecting group, there are two bonds, the first of which connects the capsules together. It may also be contemplated that a first bond may be attached to the capsule or material portion or substance, and a second bond may be attached to the capsule or material portion or substance to a substrate, surface, fiber, or the like.

[0036] However, it is also conceivable that all functional groups are homogenous, i.e. of identical configuration. In the case of heterogeneous configurations, this can be combined with differences in other properties or linker configurations (e.g. length, angle, type of linker, etc.).

[0037] It is further conceivable that the material parts of the first substance are arranged in capsules, in particular nanocapsules and / or microcapsules. Encapsulation easily makes it possible to provide a defined mass or a defined volume of the first substance for a conductive multi-component system. In a multi-capsule system or, for example, in a two-component capsule system (2K capsule system), where the capsules have the same contents, it is possible that the contents of the capsules are connected to each other in a defined number and / or a defined ratio or number and distance in separate spaces until the capsules are activated and the contents can react with each other or are forced to react with each other or are forced to mix with each other. In each capsule, one or more material parts of one substance are arranged or packaged. It is also conceivable that one capsule contains several material parts. The structure of the capsules with the first substance (or also with the second or third substance), which may also be called a capsule complex, functions almost like a (mini) reaction flask, where the reagents are mixed with each other at a defined time point after activation and the reaction of the substances with each other proceeds. A large number of these capsule complexes allow the mode of action to be concentrated, resulting in a greater effect or improved mixing and reaction of substances. Further advantages are provided by more thorough mixing of the individual substances or reaction components with each other, so that higher conversion rates can be achieved with the simultaneous use of less material compared to conventional systems.

[0038] Possible capsule types include, for example, double capsules, multicore capsules, capsules with cationic or anionic properties, capsules with different shell materials, Janus particles, patch particles, porous capsules, capsules with multiple shells, capsules with metal nanoparticles, matrix capsules and / or hollow capsules, capsules with multiple layers of shell material (so-called multi-layer microcapsules) and / or empty porous capsules (e.g. for encapsulating odors).

[0039] Furthermore, it may be intended that the capsules for the first substance have the same size, which allows for adjustment of the ratio of the volume of the first substance to the substrate (or vice versa) and / or adjustment of the activation behavior (if at least part of the multi-component system is activatable).

[0040] It is conceivable that at least a portion of the multi-component system is activatable, and that activation of the multi-component system is effected by a change in at least one of pressure, pH value, UV radiation, penetration, temperature, light intensity, moisture, etc. This has the advantage that the time of activation can be precisely controlled.

[0041] It is conceivable that more than one activation mechanism is intended. When multiple activation mechanisms are intended, redundant activation opportunities are provided, for example to ensure that activation is always possible.

[0042] It may further be provided that one or more nanoparticles are made of a metallic material and have a surface coating, in particular a metallic surface coating and / or a surface functionalization. In particular, it is possible that the nanoparticles may have electrical conductive and / or magnetic properties.

[0043] The metallic surface coating may comprise any metal and / or any metal alloy, in particular gold, silver, copper and / or bronze.

[0044] It is thus possible, in particular, to obtain magnetic conductive nanoparticles (coated with a conductive metal).

[0045] The metal surface of the nanoparticles can be functionalized with terminal reactive groups, in particular polymers having at least one thiol group, such as 11-mercaptoundecanoic acid, or with dithiols, in particular polymers having multiple thiol groups, such as 1,2-ethanedithiol, 1,3-propanedithiol, 1,4-butanedithiol, 1,5-pentanedithiol, benzene-1,4-dithiol, 2,2'-ethylenedioxydiethanethiol, 1,6-hexanedithiol, tetra(ethylene glycol)dithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,11-undecanedithiol, hexa(ethylene glycol)dithiol, 1,16-hexadecanedithiol, and the like.

[0046] Additionally, the nanoparticles may be, for example, round, elliptical, angular, rod-shaped, diamond-shaped, spherical, oval, rectangular, cylindrical, conical, or star-shaped, or may take any other common or uncommon shape.

[0047] Furthermore, it is possible that the surface coating and / or surface functionalization is at least partially, in particular completely, formed by terminal functional groups and / or linkers which selectively bind to the metal surface and / or by SAM surfaces and / or stabilizers.

[0048] In general, the stabilization of the nanoparticles can be carried out by steric, electrostatic and / or electrochemical stabilization and / or further stabilization methods.

[0049] In particular, it may be envisaged that the stabiliser is polyethylene glycol (PEG) and / or polyvinyl alcohol (PVA) and / or citrate and / or organic ligands and the like.

[0050] Additionally, the surface coating can be an electrically conductive surface coating, such as an electrically conductive polymer.

[0051] It is further contemplated that the nanoparticles are stabilized by a matrix, in particular the surrounding matrix.

[0052] Alternatively, it may be contemplated that the matrix consists of at least one polymer, adhesive, or other non-conductive material.

[0053] It is furthermore conceivable that the nanoparticles have at least one shell and at least one core, respectively, for example so-called core-shell nanoparticles or core-shell-shell nanoparticles.

[0054] It is further contemplated that the core may include a surrounding matrix.

[0055] It is further contemplated that the nanoparticles are contained within a particle having at least one core and at least one shell, where the core or at least one of the cores comprises at least one nanoparticle.

[0056] It is conceivable that the core consists of at least one magnetic metal, in particular iron, nickel, cobalt, gadolinium, terbium, dysprosium, holmium and / or erbium.

[0057] It is possible that the nanoparticles are magnetic nanoparticles and / or are not provided with functional groups.

[0058] It is believed that the surface coating is formed in a polar solvent with terminal functional groups and / or linkers and / or SAM surfaces and / or stabilizers that selectively bind to the metal surface.

[0059] It is further conceivable that at least a portion of the nanoparticles are disposed within a first capsule, and similarly that a second substance portion is disposed within at least one capsule, where each of the capsules is activatable.

[0060] The nanoparticles may have essentially the same size and / or the second material portion may have essentially the same size. Size may mean in particular spatial extent, but also mass or occupied volume. It is conceivable that the nanoparticles and the second material portion each have the same size or amount.

[0061] However, it is particularly conceivable that the nanoparticles and the second substance portion have different sizes.

[0062] For example, it is conceivable that the nanoparticles are in a first capsule and the adhesive, in particular an epoxy resin or a PU adhesive or an acrylate adhesive, is in a second capsule. In particular, it is conceivable to form a double microcapsule. Activation can result in the release of the nanoparticles in the first capsule and the release of the epoxy resin in the second capsule. This allows the formation of conductive adhesive points. Activation can be carried out as described above. In particular, this can allow a precisely (temporally and spatially) controlled electrical conductivity of the substrate.

[0063] All forms of one-component adhesives and / or resins in the sense of adhesives are contemplated.

[0064] Any form of multi-component adhesive is also conceivable, in particular resin and hardener. In the case of multi-component adhesive, the individual components can be present in different capsules and / or capsule clusters and / or capsule types. Two-component adhesives are also conceivable (wherein, for example, a capsule for particles, a capsule for a first adhesive component, and a second capsule for a second adhesive component).

[0065] It is contemplated that the capsules (or portions of material) may be activated simultaneously and emptied simultaneously.

[0066] It is contemplated that the capsules may be activated sequentially and emptied sequentially.

[0067] By the choice of size the respective (local) volume and / or the respective local concentration of the respective substance is also determined.

[0068] The multi-component system can have a network structure with interstices, where the network structure is formed from material portions of a first material, in which the surrounding medium and possibly at least one material portion, respectively, of a second material, are arranged at least partially.

[0069] The capsules are formed or functionalized with linkers and functional groups. The linkers should bridge the capsules to each other. It may be intended that the functional groups are still provided with protective groups. The distance between the capsules can be determined by the length of the linker. The length of the linker should be selected such that the radius of the expelled liquid content of a capsule slightly overlaps the content of an adjacent capsule to ensure bridging. In the case of a more viscous surrounding medium, the length of the linker should be chosen to be longer than in the case of a less viscous medium such as a paste or liquid. should be chosen shorter than the

[0070] In general, intramolecular crosslinking of capsules is possible. The capsules of the capsule population are cross-linked to each other.

[0071] In general, it is possible to crosslink capsules having the same contents via intramolecular crosslinking.

[0072] Generally, alternatively or additionally, inter-linking between capsules is possible. Here, capsules from at least two different capsule populations are cross-linked to each other.

[0073] In general, it is possible to crosslink capsules having different contents via intertypic crosslinking.

[0074] It is also possible to achieve selected release profiles via capsules of a multi-component capsule system, for example a two-component capsule system, e.g. a gradual and / or delayed release of any kind of substance is conceivable.

[0075] It is also conceivable that two capsule populations of a two-component capsule system with the same content but with different activation mechanisms can be interconnected by homogeneous crosslinking in a batch process on a carrier material, which may allow a longer sustained release compared to a one-component capsule system.

[0076] In general, capsules can be manufactured by physical, chemical, physicochemical, and / or similar methods.

[0077] In general, capsules can be produced by solvent evaporation, thermal gelation, gel formation, interfacial polycondensation, polymerization, spray drying, fluidized bed, droplet freezing, extrusion, supercritical fluids, coacervation, air suspension, pan coating, coextrusion, solvent extraction, molecular encapsulation, spray crystallization, phase separation, emulsification, in situ polymerization, insolubility, interfacial separation, emulsification with nano molecular sieves, ionotropic gelation methods, coacervation phase separation, matrix polymerization, interfacial crosslinking, solidification methods, centrifugal extrusion, and / or one or more further methods.

[0078] In general, the capsule shell can comprise at least one polymer, wax, resin, protein, polysaccharide, gum arabic, maltodextrin, inulin, metal, ceramic, acrylate, microgel, phase change material, and / or one or more additional substances.

[0079] In general, the capsule shell can be non-porous or completely non-porous. In general, the capsule shell can be nearly completely impermeable or completely impermeable.

[0080] In general, the capsule core can be solid, liquid, and / or gaseous.

[0081] In general, the capsules can be formed from linear polymers, polymers with multiple valencies, star-shaped polyethylene glycols, self-assembled monolayers (SAMs), carbon nanotubes, cyclic polymers, DNA, dendrimers, ladder polymers, and / or similar materials.

[0082] SAM surfaces include disulfites, phosphates, silanes, thiols, and polyelectrolytes. In particular, acetylcysteine, dimercaptosuccinic acid, dimercaptopropanesulfonic acid, ethanethiol (ethyl mercaptan), dithiothreitol (DTT), dithioerythritol (DTE), captopril, coenzyme A, cysteine, penicillamine, 1-propanethiol, 2-propanethiol, glutathione, homocysteine, mesna, mercaptoundecanoic acid, mercaptoundecanol, methanethiol (methyl mercaptan), and / or thiophenol may be used.

[0083] The present invention further provides a method for producing a conductive multi-component system comprising at least one first material and at least one substrate, the first material being present in one or more material portions, the method comprising the steps of: forming at least one first functional group and equipping at least one or more first material moieties with a first linker, and / or forming at least one second functional group and equipping at least one second linker on the substrate; Including, The present invention relates to a method in which a first functional group reacts with a second functional group and / or a substrate via a predefined interaction to create a conductive connection, and / or a second functional group reacts with a first functional group and / or a first material via a predefined interaction to create a conductive connection.

[0084] In particular, the method comprises providing an electrically conductive multi-component system comprising at least one first material and at least one second material, the first material being present in a plurality of material portions, the method comprising the steps of: forming at least one first functional group and equipping a first material portion with a first linker; forming at least one second functional group and equipping a second material with a second linker; Including, The first functional group reacts with the second functional group via a predefined interaction to connect them to each other; and It is contemplated that the distance between the functional group and each of the substance moieties is configured to be determined by each of the linkers.

[0085] In particular, the first material part is provided with at least one third functional group and equipped with a third linker, where the third functional group each has at least one protective group, so that only correspondingly functionalized material parts of the first material can be bonded to the material parts of the first material, and the method can be intended to include at least a further step in which the protective group is present initially and is removed only when the first material parts are to be connected to each other by the third functional group. This prevents the material parts of the first material, in particular the capsule (i.e. the first material part), from already being connected, preferably with further material parts of the first material. The protective group can be removed after introduction into the gas phase, low viscosity phase, liquid phase, high viscosity phase or solid phase, whereby intramorphic crosslinking occurs.

[0086] Furthermore, it may be intended that the multi-component system is a multi-component system according to any one of claims 1 to 12.

[0087] Possible protecting groups include acetyl, benzoyl, benzyl, β-methoxyethoxymethyl ether, methoxytriyl, (4-methoxyphenyl)diphenylmethyl, dimethoxytrityl, bis-(4-methoxyphenyl)phenylmethyl, methoxymethyl ether, p-methoxybenzyl ether, methylthiomethyl ether, pivaloyl, tetrahydrofuryl, tetrahydropyranyl, trityl, triphenylmethyl, silyl ether, t Examples include ert-butyldimethylsilyl, tri-isopropylsilyloxymethyl, triisopropylsilyl, methyl ether, ethoxyethyl ether, p-methoxybenzylcarbonyl, tert-butyloxycarbonyl, 9-fluorenylmethyloxycarbonyl, carbamate, p-methoxybenzyl, 3,4-dimethoxybenzyl, p-methoxyphenyl, one or more tosyl or nosyl groups, methyl ester, benzyl ester, tert-butyl ester, 2,6-disubstituted phenol ester (e.g., 2,6-dimethylphenol, 2,6-diisopropylphenol, 2,6-di-tert-butylphenol), silyl ester, ortho ester, and / or oxazoline.

[0088] Possible materials for capsule coating include albumin, gelatin, collagen, agarose, chitosan, starch, carrageenan, polystarch, polydextran, lactide, glycolide and copolymers, polyalkyl cyanoacrylates, polyanhydrides, polyethyl methacrylate, acrolein, glycidyl methacrylate, epoxy polymers, gum arabic, polyvinyl alcohol, methyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, arabinogalactan, polyacrylic acid, ethyl cellulose, polyethylene, polymethacrylates, polyamides (nylons), polyethylene vinyl acetate, cellulose nitrate, silicones, poly(lactide-co-glycolide), paraffin, carnauba wax, spermaceti, beeswax, stearic acid, stearyl alcohol, glycerin stearate, shellac, cellulose acetate phthalate, zein, hydrogels, and the like.

[0089] Possible functional groups include alkanes, cycloalkanes, alkenes, alkynes, phenyl substituents, benzyl substituents, vinyls, allyls, carbenes, alkyl halides, phenols, ethers, epoxides, ethers, peroxides, ozonides, aldehydes, hydrates, imines, oximes, hydrazones, semicarbazones, hemiacetals, hemiketals, lactols, acetals / ketals, aminals, carboxylic acids, carboxylic esters, lactones, orthoesters, anhydrides, imides, carboxylic acid halides, carboxylic acid derivatives, amides, lactams, peroxyacids, nitriles, carbamates, ureas, guanidines, carbodiimides, amines, anilines, hydroxylamines, hydrazines, hydrazones, azo compounds, nitro compounds, thiols, mercaptans, sulfides, phosphines, P-Ylene, Examples include P-Ylide, biotin, streptavidin, and metallocene.

[0090] Possible release mechanisms include diffusion, dissolution, controlled degradation, erosion, pressure, induction, ultrasound, and the like.

[0091] It is contemplated that a combination of release mechanisms may be used.

[0092] Possible fields of application of the method or system according to the invention include biotechnology, electrical engineering, mechanical engineering, medical technology and / or microtechnology.

[0093] In principle, other fields of application are also possible.

[0094] Further details and advantages of the invention will now be explained on the basis of exemplary embodiments which are illustrated in more detail in the drawings. [Brief description of the drawings]

[0095] [Figure 1] FIG. 1 illustrates an exemplary embodiment of a multi-component system according to the present invention comprising a first substance and a substrate. [Diagram 2]FIG. 2 shows a further exemplary embodiment of a multi-component system according to the invention comprising a first substance and a second substance. [Diagram 3] FIG. 2 shows a further exemplary embodiment of the multi-component system according to the invention according to FIG. [Figure 4] FIG. 4 shows a further exemplary embodiment of the multi-component system according to the invention according to FIG. 1 or FIG. 3. [Diagram 5] FIG. 1 shows an exemplary embodiment of the intertyponic crosslinking according to the present invention of two different material moieties. [Figure 6] FIG. 1 shows an exemplary embodiment of the present invention of intra-homogeneous cross-linking of two identical material parts. [Figure 7] 1 and 2 show further exemplary embodiments of a multi-component system 10, 110 (according to FIGS. 1 and 2) according to the invention. [Figure 8] FIG. 1 shows an exemplary embodiment of an intertypically crosslinked capsule system according to the present invention. [Figure 9] FIG. 8 shows an exemplary embodiment of an inter- and intra-crosslinked multi-component system according to the present invention according to FIG. [Figure 10] 1 is a flow diagram of a workflow for the manufacture of an electrically conductive multi-component system according to the present invention; [Figure 11] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 12] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 13] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 14] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 15] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 16] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 17] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 18]FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 19] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 20] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 21] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 22] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 23] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 24] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 25] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 26] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 27] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 28] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Figure 29] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 30] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 31] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 32] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 33] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 34] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. [Diagram 35] FIG. 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0096] 1 shows an exemplary embodiment of an electrically conductive multi-component system 10 according to the invention, comprising a first substance S1 and a substrate B. In principle, any kind of conductivity (electrical conductivity, thermal conductivity, signal conductivity, etc.) can thus be produced.

[0097] In this exemplary embodiment, the electrically conductive multi-component system 10 includes a first substance S1.

[0098] The first substance S1 is present in a plurality of substance portions.

[0099] The first substance portion has one functional group R (R2) formed thereon.

[0100] Alternatively, two or more functional groups R may be formed on the first substance portion.

[0101] The first substance portion comprises one first linker L (L1).

[0102] Alternatively, the electrically conductive multi-component system may include two or more first substances S1.

[0103] In this exemplary embodiment, the electrically conductive multi-component system 10 includes one substrate B.

[0104] Alternatively, the electrically conductive multi-component system 10 may include two or more substrates B.

[0105] In this exemplary embodiment, substrate B is formed with at least one second functional group R (R21).

[0106] In this exemplary embodiment, the substrate B is provided with a second linker L (L2).

[0107] Not shown in FIG. 1 is that the first functional group R (R2) reacts with the second functional group R (R21) through a predefined interaction to connect them to each other.

[0108] The distances between the functional groups R (R2, R21) and the substance moieties and the substrate B are determined by the respective linkers L (L1, L2), where the substance moieties of the first substance S1 are present as or in nanoparticles and are at least partially electrically conductive (not shown in FIG. 1).

[0109] Not shown in FIG. 1 is that the nanoparticles are ferromagnetic nanoparticles and are coated with a conductive metallic surface coating.

[0110] However, in general, other magnetic nanoparticles or conductive surfaces are also contemplated.

[0111] It is not shown in FIG. 1 that substrate B can be or is a surface.

[0112] Not shown in FIG. 1 is that the surface may be a wafer or a printed circuit board, etc.

[0113] Not shown in FIG. 1 is that the surface may be a conductive substrate B.

[0114] Alternatively, the surface may be provided with conductor tracks, which is not shown in FIG.

[0115] Furthermore, it is not shown in FIG. 1 that the first linker L (L1) may be longer than the second linker L (L2) or vice versa.

[0116] Furthermore, it is not shown in FIG. 1 that the functional groups R (R2, R21) may be formed of the same or different types.

[0117] Furthermore, it is not shown in FIG. 1 that the substance portions of the first substance S1 may be arranged in capsules K, in particular nanocapsules and / or microcapsules.

[0118] It is not explicitly shown in FIG. 1 that the capsules K1 for the first substance S1 can have the same dimensions.

[0119] Additionally, not shown in FIG. 1 is that at least a portion of the multi-component system 10 may be activatable, and activation of the multi-component system 10 may occur through at least one change in pressure, pH value, UV radiation, osmosis, temperature, light intensity, moisture, ultrasound, and the like.

[0120] That is, it is not shown in FIG. 1 that an electrically conductive system may be possible through activation of one or more portions of a multi-component system.

[0121] Furthermore, it is not shown in FIG. 1 that one or more of the nanoparticles may be made of a metallic material and have a surface coating, in particular a metallic surface coating and / or a surface functionalization.

[0122] Furthermore, it is not shown in FIG. 1 that the surface coating and / or surface functionalization is at least partially, in particular completely, formed by terminal functional groups R and / or linkers L which selectively bind to the metal surface and / or by SAM surfaces and / or stabilizers.

[0123] Not shown in FIG. 1 is that in general the nanoparticles may be stabilized by a matrix, in particular the surrounding matrix.

[0124] Furthermore, it is not shown in FIG. 1 that the nanoparticles each have at least one shell S and at least one core C.

[0125] Furthermore, it is not shown in FIG. 1 that nanoparticles are contained within a particle having at least one core C and at least one shell S, where the core C or at least one core C contains at least one nanoparticle.

[0126] Furthermore, it is contemplated that at least a portion of the nanoparticles are arranged in a first capsule K1 and also a second substance portion S3 which is arranged in at least one capsule K, where each capsule K can be activated, which is not shown in FIG. 1.

[0127] A corresponding method for producing an electrically conductive multi-component system comprising at least one first substance S1 and at least one substrate B, the first substance S1 being present in a plurality of substance portions, comprising the following steps: forming at least one first functional group R (R2) and equipping a first linker L (L1) on a first substance portion S1; forming at least one second functional group R (R21) and equipping a second linker L (L2) on a substrate B; Including, The first functional group R (R2) reacts with the second functional group R (R21) via a predefined interaction to connect them together; and The distance between the functional group R (R2, R21) and the respective substance moiety is determined by the respective linker L (L1, L2), in a manner not shown in FIG.

[0128] Furthermore, the first substance part is provided with at least one third functional group R (R1) and is equipped with a third linker L (L3), where the third functional groups R (R1) can each carry at least one protecting group, so that only correspondingly functionalized substance parts of the first substance S1 can be bonded to the substance parts of the first substance S1, and the method at least further comprises a step in which the protecting groups are initially present and are only removed when the first substance parts are to be connected to one another via the third functional group R (R1), which is not shown in FIG. 1 .

[0129] Moreover, it is not shown in FIG. 1 that the multi-component system is a multi-component system according to any one of claims 1-12.

[0130] It is not shown in FIG. 1 that the functional groups R1, R2, and R21 can each be replaced with another functional group R.

[0131] In general, all manner of functional groups R linking together are conceivable.

[0132] FIG. 2 shows a further exemplary embodiment of a multi-component system 10, 110 according to the invention comprising a first substance S1 and a second substance S3.

[0133] Multi-component system 110 includes all of the structural and functional features of multi-component system 10 shown in FIG.

[0134] In this exemplary embodiment, at least a portion of the nanoparticles are disposed within a first capsule K1.

[0135] Furthermore, in this exemplary embodiment a second substance portion S3 is provided which is likewise arranged in at least one capsule K2, whereby the capsules K1, K2 are each activatable.

[0136] In this exemplary embodiment, the capsules K1, K2 are activatable by a change in pressure.

[0137] Alternatively, activation of capsule K1 and / or capsule K2 may be performed by a change in pH value, UV radiation, osmosis, temperature, light intensity, ultrasound, induction, moisture, etc.

[0138] The functional groups of capsule K1 and capsule K2 are connected to each other.

[0139] Not shown in FIG. 2 is that the second material and / or the second material portion S3 is an adhesive, in particular an epoxy resin, a polyurethane, an acrylate, a silicone, a combination thereof, or the like.

[0140] That is, in this exemplary embodiment, a double microcapsule D is contemplated.

[0141] Generally, according to the same principle, any other form of multi-microcapsule is also possible.

[0142] Not shown in FIG. 2 is that activation leads to the release of nanoparticles in the first capsule K1 and to the release of adhesive, for example epoxy resin, in the second capsule K2.

[0143] This allows for the formation of conductive adhesive dots, which is not shown in FIG.

[0144] Not shown in FIG. 2 is the production of multiple microcapsules, e.g. double microcapsules, via microfluidics.

[0145] Not shown in FIG. 2 is that the free functional group R is blocked by a blocking agent.

[0146] The free functional group R is blocked by ethanolamine, as shown in FIG. do not have.

[0147] FIG. 3 shows a further exemplary embodiment of a multi-component system 10, 110 according to the invention according to FIG.

[0148] In this exemplary embodiment, at least a portion of the nanoparticles are disposed within a first capsule K1.

[0149] In this exemplary embodiment, a second substance portion S3 is also provided which is arranged in at least one capsule K2, whereby the capsules K1, K2 are each activatable.

[0150] The first capsule K1 and the second capsule K2 are connected to each other.

[0151] Capsules K1, K2 each comprise a shell S and a core C.

[0152] That is, as in the exemplary embodiment of FIG. 2, the multi-component system in this exemplary embodiment comprises two different substances S1, S3 and / or capsule populations K1, K2.

[0153] Not shown in FIG. 3 is that the first capsule K1 and / or the second capsule may be or can be bound to a substrate B (FIG. 1) (via the functional group R).

[0154] In this exemplary embodiment, the first material portion and the second material portion are different.

[0155] That is, in this exemplary embodiment, capsules K1 of the first capsule population and capsules K2 of the second capsule population are different.

[0156] In this exemplary embodiment, the first material portion is connected or connectable to a greater number of material portions than the second material portion.

[0157] That is, in this exemplary embodiment, capsule K1 is connected or connectable to a greater number of capsules K than capsule K2.

[0158] Alternatively, the second material portion may be connected or connectable to a greater number of material portions than the first material portion.

[0159] Alternatively, it is possible that the second capsule K2 is connected or connectable to as many capsules K as the first capsule K1.

[0160] That is, it is possible that capsule K2 is connected or connectable to a greater number of capsules K than capsule K1.

[0161] FIG. 4 shows a further exemplary embodiment of the multi-component system according to the invention according to FIG. 1 or FIG.

[0162] In this exemplary embodiment, the first material portion and the second material portion have disparate sizes.

[0163] In this exemplary embodiment, the first capsule K1 has an essentially larger size than the second capsule K2.

[0164] In general, the capsule K1 for the first substance S1 can have a different size than the capsule K2 for the second substance S3, in particular the capsule K1 for the first substance S1 is larger than the capsule K2 for the second substance S3.

[0165] Alternatively, the second portion of material can have a size that is substantially larger than the first portion of material.

[0166] Alternatively, the first material portion and the second material portion can have essentially the same size.

[0167] There is no indication that the first material portions may have essentially the same size and / or that the second material portions may have essentially the same size.

[0168] Capsules K1, K2 each comprise a shell S and a core C.

[0169] FIG. 5 shows an exemplary embodiment of the inter-linking according to the invention of two different material moieties.

[0170] In this exemplary embodiment, capsules K1 and K2 are intertypically crosslinked.

[0171] In this exemplary embodiment, capsule K1 and capsule K2 are inter-crosslinked via functional groups R2 and R21.

[0172] It is not shown in FIG. 5 that the functional groups R2 and R21 can each be replaced with another functional group R.

[0173] In general, all manner of functional groups R linking together are conceivable.

[0174] It is not shown in FIG. 5 that inter-type cross-linking between the first capsule K1 and the substrate B (instead of the second capsule K2) can also take place (see FIG. 1).

[0175] Capsules K1, K2 each comprise a shell S and a core C.

[0176] Alternatively, the capsules K1, K2 may not include a shell S and / or a core.

[0177] FIG. 6 shows an exemplary embodiment of the inventive intramolecular cross-linking of two identical material parts.

[0178] In this exemplary embodiment, the two capsules K1 are intramolecule crosslinked.

[0179] In this exemplary embodiment, two capsules K1 are intra-homogeneously cross-linked via the functional group R (R2).

[0180] Capsules K1, K2 each comprise a shell S and a core C.

[0181] Alternatively, the capsules K1, K2 may not include a shell S and / or a core.

[0182] FIG. 7 shows a further exemplary embodiment of a multi-component system 10, 110 (according to FIGS. 1 and 2) according to the invention.

[0183] In this exemplary embodiment, the multi-component system is a microcapsule system.

[0184] In particular, two different capsule populations K1 and K2 are shown, where a first substance is in a first capsule K1 and a second substance is in a second capsule K2.

[0185] The capsules K1 and K2 shown represent a number of capsules K1 and K2, for example referred to as a capsule population.

[0186] In this exemplary embodiment, the first substance S1 within the capsule K1 is a nanoparticle.

[0187] That is, the first material portion is present as nanoparticles.

[0188] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second ingredient.

[0189] In this exemplary embodiment, the second substance S3 is an adhesive.

[0190] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0191] In general, any form of adhesive is possible.

[0192] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0193] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0194] In general, it is possible that the two different capsule populations K1 and K2 have been produced in separate batch reactors.

[0195] Capsules K1 and K2 of both capsule populations are functionalized.

[0196] Two different linkers L1 and L3 of different lengths and different functional groups R1 and R2 were formed on the surface of a first capsule K1 (surface functionalization).

[0197] That is, the functional groups R are formed of different types.

[0198] In an alternative exemplary embodiment, the functional groups R can be formed homogeneously.

[0199] A linker L2 and a functional group R21 were formed on the second capsule K2.

[0200] The functional group R21 of the second capsule K2 reacts covalently with the functional group R2 of the first capsule K1.

[0201] It is not shown in FIG. 7 that the functional groups R1, R2, and R21 can each be replaced with another functional group R.

[0202] In general, all manner of functional groups R linking together are conceivable.

[0203] In this exemplary embodiment, the first capsules K1 are more numerous than the second capsules K2. It is possible that the capsule K is connected or connectable to the capsule K of the first embodiment.

[0204] In an alternative exemplary embodiment, it is possible that the second capsule K2 is connected or connectable to a larger number of capsules K than the first capsule K1.

[0205] The linker L3 should bridge the first capsules K1 to each other (intra-homotypic bridge).

[0206] Via linker L1 and linker L2, capsule K2 is covalently linked to the first capsule K1 (intertypic cross-linking).

[0207] Activation of both capsules K1 and K2 may release the contents of capsules K1 and K2.

[0208] In general, it is possible to determine the number of second capsules K2 bound to a first capsule K1 via the density of surface functionalization of the first capsule K1 or the number of functional groups R2.

[0209] Generally, the two substances S1, S3 are encapsulated separately from each other in capsules K1 and K2 and may be linked in a specific ratio, inter alia, by covalent bonds (e.g., click chemistry), via weak interactions, biochemically (e.g., biotin-streptavidin), covalently or in other ways and modes.

[0210] In general, three or more different capsules Kn can encapsulate three or more different substances, for example reactive substances.

[0211] In general, different capsules Kn can be functionalized with three or more linkers Ln and different functional groups Rn.

[0212] In general, the linker, L, can be any form of connection between the capsule and the functional group.

[0213] In general, in the case of heterogeneous functionalization, it is possible to use the functional group R for binding to surfaces, conductor tracks, fibers or textiles.

[0214] Activation of the multi-component system may be achieved by change in at least one of pressure, pH value, UV radiation, osmosis, temperature, light intensity, moisture, ultrasound, induction, and the like.

[0215] In general, the multi-component capsule system may be used in any desired medium.

[0216] It is not shown in FIG. 7 that the first capsule K1 and / or the second capsule may be or may be attached to the substrate B (FIG. 1).

[0217] Thus, a conductive structure, in particular a conductive substrate B, may be provided, which is not shown in FIG.

[0218] FIG. 8 shows an exemplary embodiment of an intra-homogeneous cross-linked capsule system according to the present invention.

[0219] In this exemplary embodiment, the homogeneous crosslinked capsule system according to the invention is an homogeneous crosslinked microcapsule system.

[0220] A one-component system is shown.

[0221] Capsule population K1 is shown.

[0222] The capsule K1 is filled with one substance.

[0223] That is to say, the capsule K1 should be regarded as a material part of the first material.

[0224] The material portion is present as nanoparticles.

[0225] In this exemplary embodiment, the nanoparticles are present as magnetic nanoparticles having an electrically conductive surface coating.

[0226] In this exemplary embodiment, the nanoparticles are present as ferromagnetic nanoparticles with an electrically conductive silver surface coating.

[0227] Alternatively, other conductive surface coatings and / or magnetic nanoparticles are contemplated.

[0228] Capsule K1 was functionalized.

[0229] A linker L3 was formed on the capsule K1.

[0230] It is not shown that capsule K1 is functionalized with functional group R1 (on linker L3).

[0231] The linker L3 bridges the capsules K1 to each other (intra-homogeneous bridge).

[0232] The distance between capsules K1 can be determined by the length of linker L3.

[0233] Depending on the density of the surface functionalization R1, the degree of intramolecular cross-linking between capsules K1 can be determined.

[0234] The length of the linker L3 should be selected so that the nanoparticles have a desired distance from each other.

[0235] FIG. 9 shows an exemplary embodiment of the inter- and intra-crosslinked multicomponent system according to the invention according to FIG.

[0236] The first capsule K1 and the second capsule K2 are filled with different substances.

[0237] In this exemplary embodiment, the capsules K1 have essentially the same size.

[0238] In this exemplary embodiment, the capsules K2 have essentially the same size.

[0239] In this exemplary embodiment, capsule K1 and capsule K2 have different sizes.

[0240] In an alternative exemplary embodiment, capsule K1 and capsule K2 can have essentially the same size.

[0241] The basic system corresponds to the diagram in FIG.

[0242] In this exemplary embodiment, the first substance S1 within the capsule K1 is a nanoparticle.

[0243] That is, the first material portion is present as nanoparticles.

[0244] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second ingredient.

[0245] In this exemplary embodiment, the second substance S3 is an adhesive.

[0246] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0247] In general, any form of adhesive is possible.

[0248] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0249] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0250] Furthermore, the first capsule K1 is functionalized with a heterologous linker L1.

[0251] To the linker L1 is attached a second capsule population K2 (see Figure 2, Figure 3, Figure 4 or Figure 7).

[0252] That is, the multi-component system has a network structure with gaps, in which the network structure is formed from first capsules K1 and in which at least one capsule K2 is respectively arranged at least partially in the gaps.

[0253] In general, it is possible to introduce capsules K1 and K2 having different contents into the gas phase.

[0254] The substrate B and / or surface may also be coated with this dispersion.

[0255] In general, it is possible to introduce capsules K1 and K2 with different contents into a pasty medium, the paste being inactive and easily processable until the capsules are activated and react with each other.

[0256] The advantages of the ideal composition of the capsule system can also be utilized in liquid systems: since both capsules K1 and K2 of a two-component capsule system are present in close proximity, capsules K1 and K2 are much more likely to react with each other more quickly and precisely than if they were dispersed separately.

[0257] FIG. 10 shows a flow diagram of the workflow for the manufacture of an electrically conductive multi-component system 10, 110 according to the present invention.

[0258] FIG. 10 is essentially based on a multi-component capsule system according to FIG.

[0259] In this exemplary embodiment, the first substance S1 within the capsule K1 is a nanoparticle.

[0260] That is, the first material portion is present as nanoparticles.

[0261] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second ingredient.

[0262] In this exemplary embodiment, the second substance S3 is an adhesive.

[0263] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0264] In general, any form of adhesive is possible.

[0265] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0266] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0267] Overall, the production of the electrically conductive multi-component system according to the invention is divided into four steps St1 to St4.

[0268] In a first step St1, a first capsule K1 and a second capsule K2 are functionalized (see FIG. 7).

[0269] In this multicomponent system, a first capsule K1 carrying two linkers L1 and L3 is heterogeneously functionalized with functional groups R1 and R2.

[0270] In a separate batch approach, a second population of capsules K2 bearing linker L2 is functionalized with functional group R21.

[0271] The functional group R21 should be selected such that it reacts (covalently) with the functional group R2 of the first capsule K1 in a separate reaction step.

[0272] In a second step St2, the functionalized second capsules K2 are added to the functionalized first capsules K1.

[0273] The functional group R2 and the functional group R21 are bonded to each other (covalently).

[0274] In general, it is also possible to add a third capsule population or any number of further capsule populations K3 to Kn to the first capsule population K1 and / or the second capsule population K2.

[0275] Each additional capsule population K3 through Kn may again be functionalized with at least one functional group.

[0276] In a third step St3, a predetermined (intra-molecule) cross-linking reaction takes place.

[0277] In a fourth step St4, the crosslinked multicomponent capsule population is applied to a substrate B.

[0278] Substrate B is similarly equipped with a linker L and a functional group R.

[0279] The capsule K1 and / or the capsule K2 are connected to the substrate B via a linker L having a functional group R. Not shown in FIG. 10 is that the functional group R may be attached to

[0280] It is not shown that in step St1, a protecting group may still be formed on the functional group R1 of the linker L3 so that the first capsules K1 do not crosslink with each other prematurely already during functionalization.

[0281] In step St3, the removal of the protecting group is not shown.

[0282] Thus, a conductive structure, in particular a conductive substrate B, may be provided, which is not shown in FIG.

[0283] In general, it is possible for the capsules K to be formed as nanocapsules or microcapsules.

[0284] In principle, nanoparticles may be used in all of the above and below exemplary embodiments.

[0285] Quantum dots, metal nanoparticles, metal salt nanoparticles, oxides, sulfides, core-shell particles, self-assembled particles, doped nanoparticles, magnetic semiconductor nanoparticles, doped nanoparticles such as TiO2 doped nanoparticles including cobalt, and multilayers such as Fe / Si, Cu / Ni, Co / Pt, semiconductor nanoparticles such as ZnS, CdS, ZnO.

[0286] The nanoparticle morphology includes essentially any conceivable nanoparticle morphology.

[0287] Homogeneous functionalization of the nanoparticles can be carried out with thiol or dithiol groups.

[0288] The exemplary embodiment shown in Figures 11-16 relates to an exemplary embodiment having one linker.

[0289] FIG. 11 illustrates a further exemplary embodiment of a multi-component system 210 according to the present invention.

[0290] Here, the functionalized substrate B is present together with the substance S1, which is here present directly as a particle.

[0291] Substrate B is functionalized with a functional group R1. The (nano)particles are attached to the functional group and thus to substrate B.

[0292] FIG. 12 illustrates a further exemplary embodiment of a multi-component system 310 according to the present invention.

[0293] The substance S1 is a functionalized (nano)particle and is associated with a substrate B.

[0294] In this case, the (nano)particle is functionalized with a functional group R1. The functionalized (nano)particle is bound to a substrate B.

[0295] FIG. 13 illustrates a further exemplary embodiment of a multi-component system 410 according to the present invention.

[0296] Here, it concerns a functionalized substrate B and (nano)particles in the substance portion S1, here in the form of microcapsules.

[0297] The substrate B is functionalized with a functional group R1. The (nano)particles are present in the substance portion S1. Upon activation of the substance portion the (nano)particles are released and bind to the functional group of the substrate B.

[0298] FIG. 14 illustrates a further exemplary embodiment of a multi-component system 510 according to the present invention.

[0299] Here, it concerns functionalized (nano)particles in a substance portion S1 (microcapsules) and a substrate B.

[0300] The (nano)particle is functionalized with a functional group R1 and is present in a substance moiety S1. Activation of the substance moiety results in the (nano)particle being attached to the substrate B.

[0301] FIG. 15 illustrates a further exemplary embodiment of a multi-component system 610 according to the present invention.

[0302] Here, it concerns a substrate B functionalized with a functional group R1 and (nano)particles within a substance portion S1 which also has (metal) particles on its surface.

[0303] The substrate B is functionalized with a functional group R1. The nanoparticles are present in the substance portion S1. Activation of the substance portion S1 results in the attachment of the (nano)particles to the substrate B.

[0304] FIG. 16 illustrates a further exemplary embodiment of a multi-component system 710 according to the present invention.

[0305] Here, it concerns a functionalized substance portion S1 which comprises (nano)particles and a substrate B.

[0306] The substance moiety S1, on which the (nano)particle resides, is functionalized with a functional group R1. Via the bonding of the functional group of the substance moiety S1 to the substrate B, the substance moiety S1 can be precisely positioned. Upon activation, the (nano)particle is bonded to the substrate B.

[0307] The exemplary embodiment shown in Figures 17-20 pertains to a variation having two linkers.

[0308] FIG. 17 illustrates a further exemplary embodiment of a multi-component system 810 according to the present invention.

[0309] Here, it concerns a functionalized substrate B and functionalized (nano)particles.

[0310] Substrate B is functionalized with functional group R1. The (nano)particle is functionalized with functional group R2. Through activation / reaction, it is bonded to substrate B by functional groups R1 and R2.

[0311] FIG. 18 illustrates a further exemplary embodiment of a multi-component system 910 according to the present invention.

[0312] Here, it concerns a functionalized substrate B and a functionalized part of matter S1 in which at least one (nano)particle resides.

[0313] Substrate B is functionalized with a functional group R1. Substance moiety S1 is functionalized with a functional group R3. Within substance moiety S1 at least one (nano)particle is present. Via the complementary functional groups R1 and R3 substance moiety S1 can be precisely positioned. Upon activation / reaction the (nano)particle is released and bound to substrate B.

[0314] FIG. 19 illustrates a further exemplary embodiment of a multi-component system 1010 according to the present invention.

[0315] Here, it concerns a functionalized substrate B and a functionalized (nano)particle present in the substance portion S1.

[0316] The substrate B is functionalized with a functional group R1. Within the substance portion S1 there is at least one (nano)particle functionalized with a functional group R2.

[0317] FIG. 20 illustrates a further exemplary embodiment of a multi-component system 1110 according to the present invention.

[0318] Here, it concerns a functionalized substrate B and a functionalized (nano)particle present in a substance moiety S1 which is also functionalized. Substrate B is functionalized with a functional group R1. The (nano)particle is functionalized with a functional group R2. Substance moiety S1 is functionalized with a functional group R3. Thus, the substance moiety can be precisely positioned via the functional groups R1 and R3. Through activation of substance moiety S1, the (nano)particle is released in a site-specific manner. The shell of substance moiety S1 can stabilize the (nano)particle.

[0319] FIG. 21 shows a further exemplary embodiment according to the invention of a multi-component system 1210, namely a system comprising double microcapsules with functionalization of the (nano)particles.

[0320] In this case, capsule K10 is filled with adhesive and capsule K20 is filled with (electrically) conductive particles (for example one or more rod-shaped nanoparticles).

[0321] In this embodiment, the adhesive is present in a first microcapsule and at least one (nano)particle and / or carbon nanotube is present in a second microcapsule.

[0322] An adhesive is encapsulated within the microcapsule K10. Within the microcapsule K20 there is at least one (nano)particle made of an (electrically) conductive material.

[0323] In this case, the surface of the (nano)particles may be functionalized with functional groups, such as terminal thiol groups or other functional groups R. The shell of microcapsule K10 may be of the same material and of the same thickness as the shell of microcapsule K20. Furthermore, microcapsule K10 may have the same dimensions as microcapsule K20. However, these parameters may differ from each other in at least one or more respects.

[0324] This mechanism can be a concurrent release mechanism:

[0325] These microcapsules are applied to a metal area / surface. A second metal surface is then placed parallel to the first. By a defined activation mechanism, both microcapsules are simultaneously opened and release their contents. In this case, the released nanoparticles functionalized with terminal functional groups, e.g. thiol groups, are bonded to both surfaces of the parallel mounted metal surfaces. The (nano)particles form a mutual network. This can occur by aggregation and / or by mutual bonding of functional groups, e.g. thiol groups (inter-type cross-linking). After activation of the microcapsules K10 filled with adhesive, the adhesive is expelled and stabilizes the connection of the (nano)particles in the (electrically) conductive connection. Furthermore, the adhesive bonds the upper and lower surfaces to each other.

[0326] A sequential release mechanism is also possible:

[0327] These microcapsules are applied to a metal area, where microcapsule K10 has a different opening mechanism than microcapsule K20. A second metal surface is then placed parallel to the first metal surface. By a defined activation mechanism, for example temperature, the microcapsules with the (nano)particles are first opened and release their contents. In this case, the released nanoparticles functionalized with terminal functional groups R2, for example thiol groups, are bound to both surfaces of the parallel mounted metal surfaces. The (nano)particles form a mutual network. This can occur by aggregation and / or by mutual bonding of functional groups such as thiol groups (inter- and intra-type crosslinking). By means of a second opening mechanism, this is advantageously achieved by microcapsule K10 having a different shell material than microcapsule K20 and / or a different shell material size and / or a different shell material thickness than microcapsule K10. Second activation mechanisms are conceivable, for example ultrasound, a change in pH value, induction, pressure, etc. Furthermore, by means of the first activation mechanism option, sequential activation can be achieved, for example by increasing the temperature. After activation of the microcapsules 1 filled with adhesive, the adhesive is expelled and the (nano)particle connections of the (electrically) conductive (nano)particles are stabilized. Furthermore, the adhesive bonds the upper and lower surfaces to each other.

[0328] FIG. 22 shows a further exemplary embodiment according to the invention of a multi-component system 1310, namely a variant with (electrically) conductive surface functionalization.

[0329] In this case, the adhesive is encapsulated in microcapsule K10. In microcapsule K20, (nano)particles made of (electrically) conductive material are present. In this case, the (electrically) conductive surface of the conductor track is functionalized with terminal thiol groups. The (nano)particles are not functionalized.

[0330] This mechanism can be a concurrent release mechanism:

[0331] These microcapsules are applied to a metal area. A second metal surface is then placed parallel to the first. By a defined activation mechanism, both microcapsules open simultaneously and release their contents. In this case, the released nanoparticles bind to both surfaces of the parallel mounted metal surfaces functionalized with terminal thiol groups. The (nano)particles form a network with each other. This occurs by mutual aggregation.

[0332] A sequential release mechanism is also possible:

[0333] The connection mechanism is identical to that described in the exemplary embodiment of FIG. 21, except that here it is the surfaces rather than the (nano)particles that are functionalized.

[0334] FIG. 23 shows a further exemplary embodiment according to the invention of a multi-component system 1410, namely a variant with functionalization of both the (nano)particles and the (electrically) conductive surface.

[0335] An adhesive is encapsulated in microcapsule K10. In microcapsule K20, (nano)particles made of (electrically) conductive material are present, where both the surface of the (nano)particles and the (electrically) conductive surface of the conductor track (i.e. substrate B) are functionalized with terminal thiol groups.

[0336] Again, both parallel and sequential opening mechanisms are contemplated (see above discussion in connection with the exemplary embodiments of Figures 21 and 22).

[0337] FIG. 24 shows a further exemplary embodiment of the multi-component system 1510 according to the present invention, namely a variant involving both homogeneous functionalization of the (nano)particles and functionalization of the (electrically)conductive surface with reactive functional groups other than thiols.

[0338] In this variant, microcapsule K10 is filled with adhesive. Microcapsule K20 with functionalized (nano)particles. The (electrically) conductive surface is functionalized with functional groups complementary to the functional groups of the (nano)particles.

[0339] The opening mechanisms may occur in parallel or sequentially (see above description in relation to the exemplary embodiments of Figures 21 and 22).

[0340] Figure 25 shows a further exemplary embodiment of the multi-component system 1610 according to the present invention, namely a variant involving both homogeneous functionalization of the (nano)particles (substance S1) and functionalization of the (electrically)conductive surface (substrate B) with reactive functional groups.

[0341] In this exemplary embodiment, the surfaces of both the (nano)particles and the (electrically) conductive surface of substrate B are (i.e.) "charged". In this case, the surface of the (nano)particles has a negative charge. The surface of the (electrically) conductive surface (of substrate B) has a positive charge. In a further variant, the surfaces may be oppositely charged, i.e. the (nano)particles are positively charged and the (electrically) conductive surface or substrate B is negatively charged.

[0342] FIG. 26 shows a further exemplary embodiment according to the invention of a multi-component system 1710, namely a variant involving both heterogeneous functionalization of (nano)particles (substance S1) for inter- and intra-type crosslinking and functionalization of an (electrically) conductive surface (substrate B).

[0343] In this exemplary embodiment, the (nano)particles are functionalized with two different functional groups. In this case, one functional group can be a terminal thiol R4 and the other a carboxyl group R2. The (electrically) conductive surface is functionalized with a functional group complementary to the (nano)particles, in this example a terminal primary amine R1. The (nano)particles are crosslinked to each other (by inter- and / or intra-type crosslinking) via the thiol groups.

[0344] FIG. 27 shows a further exemplary embodiment according to the invention of a multi-component system 1810, namely a variant with functionalization of the microcapsules (substance S1).

[0345] The double microcapsules are produced as described above. Further functional groups that are not involved in the bonding of the microcapsules to each other are bonded to the (electrically) conductive surface (substrate B). For this, in particular, terminal thiols should be used that selectively bond only to metal areas. In this way, the microcapsules can be placed only at the desired location (for example) on the metal surface, so that no conductivity in the x-direction occurs.

[0346] FIG. 28 shows a further exemplary embodiment according to the invention of a multi-component system 1910, namely a variant with functionalization of an (electrically) conductive surface (substrate B).

[0347] In this exemplary embodiment, the (electrically) conductive surface is functionalized with a terminal thiol group R1. At least one nanocapsule and / or microcapsule has metal (nano)particles on its surface. By applying the microcapsules onto the surface, the microcapsules with the metal (nano)particles selectively bind only to the surface with the terminal thiol group.

[0348] Instead of metal (nano)particles, microcapsules may be completely and / or partially covered by a metal surface.

[0349] FIG. 29 shows a further exemplary embodiment according to the invention of a multi-component system 2010, namely a variant involving functionalization of microcapsules (substance S1) with metals (nanoparticles) and a surface (substrate B).

[0350] In this case, the surface of the microcapsules is provided with metal nanoparticles. The (nano)capsules can be prepared by adding a chemical compound R3 having a terminal polymer, e.g. a thiol compound. The cells and / or the microcapsules can be functionalized. The second functional group of the polymer may be equipped with a further functional group R5. Thus, the thiol group R3 is bonded to the metal particle of the (nano)capsule and / or the microcapsule. The second functional group remains active and available for further reaction. Thus, the microcapsule has a defined number of defined functional groups.

[0351] Dithiols allow the functionalization of microcapsules and also the binding to (electrically) conductive surfaces.

[0352] 30 and 31 respectively show further exemplary embodiments of the multi-component system 2110 or the multi-component system 2210 according to the present invention, namely variations with respect to functionalization with thiol groups.

[0353] In order to bind the microcapsules K10, K20 to an (electrically) conductive surface (substrate B), the (nano)capsules and / or microcapsules K10, K20 are provided with functional groups R3 and the (electrically) conductive surface B is coated with complementary functional groups R1.

[0354] In this case, only one of the double microcapsules may be provided with a functional group (see FIG. 30) or both microcapsules of the double microcapsule may be provided with a functional group (see FIG. 31).

[0355] 32-34 show further exemplary embodiments 2310, 2410, 2510, and 2610 of multi-component systems comprising multiple microcapsules, respectively, suitable for connection to a substrate (not shown in FIGS. 32-34), in accordance with the present invention.

[0356] The exemplary embodiment shown in Figures 32-34 may be manufactured according to the manufacturing processes described above and below, and therefore may correspondingly have the corresponding features of the other systems.

[0357] The adhesive (glue) may be a one-component or two-component adhesive, where the adhesive may be present in the same and / or separate material parts. When referring to a multi-component adhesive, it is even conceivable that a corresponding number of components are intended.

[0358] Figure 32 shows a multi-component system 2310 with (viewed from left to right) adhesive 1 in a substance portion K10 (far left) of a first capsule, a single nanoparticle in a second capsule K20, and a further capsule K10 with adhesive 1. Embodiments with multiple nanoparticles in one capsule are also conceivable.

[0359] 33 shows a multi-component system 2410 having (from left to right) an adhesive 1 in a first capsule K10 (far left), a second adhesive 2 in a capsule K30, and a single nanoparticle in a third capsule. Adhesive 1 and adhesive 2 can be components of a one-component adhesive, a two-component adhesive, or a multi-component adhesive.

[0360] Figure 34 shows a multi-component system 2510 with (from left to right) adhesive 2 in a first capsule K10, a second adhesive 1 in a capsule K30, and a single nanoparticle in a third capsule K20. Adhesive 1 and adhesive 2 can be components of a two-component adhesive or a multi-component adhesive.

[0361] Figure 35 shows a multi-component system 2610 having (from left to right) an adhesive 2 in a first capsule K10 (far left), a single nanoparticle in a second capsule K20, and a second adhesive 1 in a third capsule K30. Adhesive 1 and adhesive 2 are one-component adhesives, It can be a two-part adhesive or a component of a multi-part adhesive.

[0362] In principle, in the above exemplary embodiments, (electrical) conductivity can be achieved in a specific predetermined or predeterminable direction as follows, where conductivity is not limited to electrical conductivity only, but can also relate to the transfer of electricity, heat, data, etc.

[0363] (Nano)particles functionalized with terminal thiol groups or magnetic particles or substrates and / or particles provided with functional groups are used. Electrostatic interactions can also be used.

[0364] In this case, the terminal functional group may be provided with a protecting group.

[0365] For example, nanoparticles and adhesives may be encapsulated within microcapsules.

[0366] In that case, you can do the following: 1. Microcapsules encapsulating (nanoparticles) are brought together in a surrounding medium (e.g., adhesive) as in (our first patent). 2. Through an activation mechanism (eg, temperature), the microcapsules open and release the particles. 3. The particles are made to self-align in the desired direction through chemical reaction, self-organization, magnetism, or other mechanisms. 4. Immobilization of the particles via a surrounding medium, which is also hardened by heat, for example.

[0367] In this case, the opening of the microcapsules, the alignment of the particles and the hardening of the surrounding medium can be carried out in parallel or sequentially.

[0368] In further exemplary embodiments, it may be composed of, for example, three layers: a surface (substrate), then a first layer (e.g., surrounding medium, e.g., adhesive, SAM coating, etc.), then a second layer comprising microcapsules in which the nanoparticles are encapsulated, and then a third layer (surrounding medium, e.g., adhesive).

[0369] In this case, first the surface or substrate is coated.

[0370] This is followed by coating with functionalized capsules containing nanoparticles that can be released via a defined activation mechanism.

[0371] In this case, the terminal functional group may be blocked with a protecting group.

[0372] The particles align in the X direction through chemical reactions such as self-organization, electrostatic interactions, magnetism, etc.

[0373] In all the above exemplary embodiments, it is possible in principle that multiple nanoparticles can be used within one capsule.

[0374] Isolation and placement of single nanoparticles within capsules can be achieved, for example, via Nanoporetech technology (see Venkatesan, Bala Murali, and Rhashid Bashir, Nanopore Sensors for nucleic acid analysis, Nature Nanotechnology 6.10 (2011): 615). This method involves: Allowing only a single DNA strand to pass through the isolation channel (Vereinzelungkanal), nanoparticles It may also be used to isolate. [Explanation of symbols]

[0375] 10 Multi-component system 110 Multi-component system 210 Multi-component system 310 Multi-component system 410 Multi-component system 510 Multi-component system 610 Multi-component system 710 Multi-component system 810 Multi-component system 910 Multi-component system 1010 Multi-component system 1110 Multi-component system 1210 Multi-component system 1310 Multi-component system 1410 Multi-component system 1510 Multi-component system 1610 Multi-component system 1710 Multi-component system 1810 Multi-component system 1910 Multi-component system 2010 Multi-component system 2110 Multi-component system 2210 Multi-component system 2310 Multi-component system 2410 Multi-component system 2510 Multi-component system 2610 Multi-component system B Base material C core D Double Microcapsule K Capsule / Capsule Group K1 Capsule 1 / Capsule Group 1 K2 Capsule 2 / Capsule Group 2 K10 Capsule 10 / Capsule Group 10 K20 Capsule 20 / Capsule Group 20 K30 Capsule 30 / Capsule Group 30 Kn Capsule n / Capsule group n L Linker L1 Linker L2 Linker L3 Linker R functional group R1 functional group R2 functional group R3 functional group R4 functional group R5 functional group R21 functional group Rn Functional group n S Capsule / Shell S1 Substance / Substance part S3 Substance / Substance part St1 process 1 St2 process 2 St3 process 3 St4 process 4

Claims

1. A conductive multi-component system (10, 110) comprising at least one first material (S1) and at least one substrate (B), a) said first substance (S1) is present in two or more substance portions, b) the first material portion of the first material (S1) is provided with at least one first functional group (R) and is equipped with a first linker (L), and / or the substrate (B) is provided with at least one second functional group (R) and is equipped with a second linker (L), c) the first functional group (R) reacts with the second functional group (R) and / or the substrate via a predefined interaction, thereby connecting them to each other, and / or the second functional group (R) reacts with the first functional group (R) and / or the first substance (S1) via a predefined interaction, thereby connecting them to each other; d) the first material portion of the first material (S1) is present as particles and is at least partially conductive; A conductive multi-component system in which the particles are stabilized by a matrix consisting solely of at least one polymer, adhesive, or other non-conductive material.

2. 2. A multi-component system (10, 110) according to claim 1, characterized in that the conductivity of the material parts is electrical and / or thermal and / or signal conductive.

3. 3. A multi-component system (10, 110) according to claim 1 or 2, characterized in that the distance between the functional group (R) and the substance moiety and the substrate (B) is determined by respective linkers (L).

4. A multi-component system (10, 110) according to any one of claims 1 to 3, characterized in that the substrate (B) is a circuit board or a printed circuit board or a conductor track.

5. A multi-component system (10, 110) according to any one of claims 1 to 3, characterized in that the substrate (B) is a second material.

6. 6. A multi-component system (10, 110) according to claim 5, characterized in that the second substance is present in one or more substance portions.

7. A multi-component system (10, 110) according to any one of claims 1 to 6, characterized in that the first linker (L) is longer than the second linker (L) or vice versa.

8. A multi-component system (10, 110) according to any one of claims 1 to 7, characterized in that the functional groups (R) are formed of the same or different types.

9. A multi-component system (10, 110) according to any one of claims 1 to 8, characterized in that the substance portion of the first substance (S1) is arranged in a capsule (K).

10. 10. A multi-component system (10, 110) according to claim 9, characterized in that the capsules (K) for the first substance (S1) have the same size.

11. A multi-component system (10, 110) according to any one of claims 1 to 10, characterized in that at least a part of the multi-component system is activatable and activation of the multi-component system is achieved by a change in at least one of pressure, pH value, UV radiation, penetration, temperature, light intensity, moisture, etc.

12. A multi-component system (10, 110) according to any one of the preceding claims, characterized in that the one or more nanoparticles are made of a metallic material and have a surface coating.

13. 13. A multi-component system (10, 110) according to claim 12, characterized in that the surface coating and / or surface functionalization is formed at least in part by terminal functional groups (R) and / or linkers (L) which selectively bind to the metal surface and / or by SAM surfaces and / or stabilizers.

14. A multi-component system (10, 110) according to any one of claims 1 to 13, characterized in that the nanoparticles each have at least one shell and at least one core.

15. A multicomponent system (10, 110) according to any one of claims 1 to 14, characterized in that the nanoparticles are contained within particles having at least one core and at least one shell, wherein the core or at least one core contains the at least one nanoparticle.

16. A multi-component system (10, 110) according to any one of claims 1 to 15, characterized in that at least a portion of the nanoparticles are arranged in first capsules (K) and likewise a second substance portion is arranged in at least one capsule (K), wherein each of the capsules (K) is activatable.

17. 17. A method for producing a conductive multi-component system (10, 110) according to any one of claims 1 to 16, comprising at least one first substance (S1) and at least one substrate (B), said first substance (S1) being present in one or more substance portions, comprising the following steps: forming at least one first functional group (R2) and equipping the at least one or more first material moieties with a first linker (L1), and / or forming at least one second functional group (R21) and equipping the substrate (B) with a second linker (L2); Including, wherein the first functional group (R) reacts with the second functional group (R) and / or the substrate via a predefined interaction to create a conductive connection, and / or the second functional group (R) reacts with the first functional group (R) and / or the first substance (S1) via a predefined interaction to create a conductive connection.