Measurement method, transfer method, article manufacturing method, transfer device, and lithography device

Abstract

To provide a technique advantageous for accurately and efficiently measuring a height of a hand which holds a substrate.SOLUTION: A measurement method for measuring a height of a hand which has a suction hole connected to a vacuum line on a top face in starting a contact between the hand and a substrate in processing of causing the hand to hold the substrate by moving the hand upward from below the substrate, includes: a processing step of performing the processing while detecting a pressure of the vacuum line; an acquisition step of acquiring a height profile indicating a change in the height of the hand in the processing; and a determination step of determining, as the height of the hand in starting the contact, a height of the hand in second timing preceding, by a predetermined time, to first timing in which the pressure of the vacuum line is decreased and reaches a threshold, on the basis of the height profile.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a measurement method, a transport method, an article manufacturing method, a transport apparatus, and a lithography apparatus. [Background technology]

[0002] Semiconductor manufacturing equipment and the like may be provided with a transport device that transports substrates. In the transport device, moving parts such as bearings may wear out as the hand that holds the substrate is driven, and the position of the hand in the height direction (hereinafter, sometimes referred to as the hand height) may change over time. Such a change in the hand height over time may cause interference between the substrate and the placement part when the substrate is transferred between the hand and the placement part on which the substrate is placed. For this reason, the transport device is required to be provided with a function for measuring (monitoring) the hand height and to periodically measure the hand height.

[0003] Patent Document 1 describes a method for measuring the height (vertical position) of a hand (pick) that picks up a substrate (wafer). In the method described in Patent Document 1, a process is repeated in which a hand is inserted below a substrate, moved upward a predetermined distance (e.g., 0.1 mm), stopped, and judged whether the hand has picked up the substrate or not until the hand picks up the substrate. Then, the height of the hand when it is judged that the hand has picked up the substrate is determined as the height of the hand when the bottom surface of the substrate contacts the top surface of the hand (the vertical teaching position). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-129023 Summary of the Invention [Problem to be solved by the invention]

[0005] As described in Patent Document 1, in a hand connected to an exhaust device having a vacuum pump, a considerable delay may occur from when the hand comes into contact with the substrate until a suction pressure is reached at which it is possible to determine whether the hand has suctioned the substrate. Therefore, in the method described in Patent Document 1, it is necessary to wait for the time required for the delay or longer with the hand stopped before determining whether the hand has suctioned the substrate, which may be disadvantageous in terms of productivity.

[0006] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, an object of the present invention is to provide an advantageous technique for measuring the height of a hand that holds a substrate with high accuracy and efficiency. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a measurement method as one aspect of the present invention is a measurement method that measures the height of a hand at the start of contact between the hand and the substrate in a process of holding a substrate with a hand having a suction hole on its upper surface connected to a vacuum line by raising the hand from below the substrate, and is characterized in that it includes a processing step of performing the processing while detecting the pressure of the vacuum line, an acquisition step of acquiring a height profile showing a change in the height of the hand during the processing, and a determination step of determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure of the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. Effect of the Invention

[0009] According to the present invention, for example, it is possible to provide an advantageous technique for measuring the height of a hand that holds a substrate with high accuracy and efficiency. [Brief description of the drawings]

[0010] [Figure 1]FIG. 2 is a diagram showing a schematic configuration example of a transport device; [Diagram 2] FIG. 1 is a diagram illustrating a configuration example of a suction mechanism in a transport device according to a first embodiment; [Diagram 3] An example of a pressure profile and height profile for a receiving process. [Figure 4] 1 is a flowchart showing a calibration process according to a first embodiment; [Diagram 5] FIG. 1 is a diagram showing an example of a pressure profile and a height profile obtained by the calibration process of the first embodiment; [Figure 6] FIG. 13 is a diagram showing information obtained by superimposing a pressure profile and a height profile obtained by the calibration process of the first embodiment; [Figure 7] FIG. 11 is a diagram showing a first pressure profile and a first height profile when the hand is step-driven in the first receiving process; [Figure 8] 1 is a flowchart showing a conveying method according to a first embodiment. [Figure 9] FIG. 1 shows pressure and height profiles during a receiving process in the first embodiment. [Figure 10] Pressure profile when a leak is present [Figure 11] A diagram showing an example of the results of transporting a mixture of flat substrates and substrates for warpage measurement. [Figure 12] FIG. 13 is a diagram showing a configuration example of a suction mechanism in a transport device according to a second embodiment; [Figure 13] 11 is a flowchart showing a calibration process according to a second embodiment. [Figure 14] FIG. 13 is a diagram showing an example of a pressure profile and a height profile obtained by the calibration process of the second embodiment; [Figure 15] FIG. 13 is a diagram showing information obtained by superimposing a pressure profile and a height profile obtained by the calibration process of the second embodiment; [Figure 16] 11 is a flowchart showing a conveying method according to a second embodiment. [Figure 17]FIG. 13 shows pressure and height profiles during a handover process of the second embodiment. [Figure 18] Schematic diagram showing an example of the configuration of an exposure apparatus DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system with the vertical direction as the Z direction. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, the Y direction, and the Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control and drive (movement) regarding the X-axis, Y-axis, and Z-axis respectively mean control or drive (movement) regarding the direction parallel to the X-axis, the direction parallel to the Y axis, and the direction parallel to the Z axis. In addition, control or drive regarding the θX-axis, θY-axis, and θZ-axis respectively mean control or drive regarding the rotation around an axis parallel to the X-axis, the rotation around an axis parallel to the Y axis, and the rotation around an axis parallel to the Z axis.

[0013] First Embodiment A transfer device CVY according to a first embodiment of the present invention will be described. FIG. 1 is a diagram showing a schematic configuration example of the transfer device CVY according to this embodiment. The transfer device CVY according to this embodiment may include a hand 110 capable of holding a substrate 100, a driving unit 150 for driving the hand 110, and a control unit 160. The driving unit 150 may include a suction mechanism (exhaust mechanism) for sucking and holding the substrate 100 by the hand 110 in addition to a driving mechanism for driving the hand 110 in the XYZ directions. The control unit 160 is configured by a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, for example, and controls each unit of the transfer device CVY. In this embodiment, the control unit 160 controls the driving unit 150 to control the holding and transport of the substrate 100 by the hand 110.

[0014] Here, the transport device CVY of this embodiment may be understood to include a placement unit 120 on which the substrate 100 is placed. The placement unit 120 may be a destination (e.g., a stage) of the substrate 100 by the transport device CVY, or may be a stopover (e.g., a pre-alignment stage for pre-aligning the substrate 100) when the substrate 100 is transported to the destination. In the example shown in Fig. 1, the placement unit 120 is configured by three pins on which the substrate 100 is placed, but the configuration of the placement unit 120 is not limited to three pins.

[0015] 2 is a diagram showing a configuration example of a suction mechanism in the transfer device CVY of this embodiment. The hand 110 is provided with a suction pad 111 having a suction hole 111a on a surface (upper surface) that contacts the substrate 100. The suction hole 111a of the suction pad 111 is connected to a vacuum line 112 (piping) connected to a vacuum pump 170. The vacuum line 112 is provided with an electromagnetic valve 113 for controlling the opening and closing of the vacuum pump 170 and the vacuum line 112, and a pressure sensor 114 (detection unit) for detecting the pressure of the vacuum line 112. The electromagnetic valve 113 and the pressure sensor 114 are connected to a control unit 160, and the control unit 160 controls the opening and closing of the vacuum line 112 by the electromagnetic valve 113, and detects the pressure of the vacuum line 112 by the pressure sensor 114. The vacuum pump 170 may be configured as a component of the transfer device CVY, or may be configured as an external device of the transfer device CVY.

[0016] 2(a) to 2(c) show a process of lifting the substrate 100 from the placement unit 120 by lifting the hand 110 from below the substrate 100 placed on the placement unit 120, with the hand 110 holding the substrate 100. This process may be understood as a process in which the hand 110 receives (obtains) the substrate 100 from the placement unit 120, and may be referred to as a "receiving process" below. The receiving process is performed while detecting the pressure of the vacuum line 112 by the pressure sensor 114. FIG. 2(a) shows a state in which the hand 110 starts to rise below the substrate 100 placed on the placement unit 120. FIG. 2(b) shows a state in which the hand 110 starts to come into contact with the substrate 100 placed on the placement unit 120. FIG. 2(c) shows a state in which the hand 110 holds the substrate 100 and lifts the substrate 100 from the placement unit 120.

[0017] FIG. 3 shows an example of a pressure profile 201 and a height profile 202 obtained in the receiving process shown in FIGS. 2(a) to (c). In this embodiment, the pressure profile 201 is a profile (waveform) showing a change in the pressure value of the vacuum line 112 detected by the pressure sensor 114 in the receiving process. The vertical axis of the pressure profile 201 indicates the gauge pressure. The height profile 202 is a profile (waveform) showing a change in the height of the hand 110 in the receiving process. The height of the hand 110 may be a detection value of a sensor (height detection unit) provided in the transport device CVY to detect the height of the hand 110, or a value calculated from the drive amount of the hand 110 by a drive mechanism that drives the hand 110 in the Z direction. The drive mechanism that drives the hand 110 in the Z direction may be provided in the drive unit 150.

[0018] 2(a), time 203 is the timing when the solenoid valve 113 is opened to connect the vacuum line 112 to the vacuum pump 170 and the hand 110 starts to rise below the substrate 100 placed on the mounting part 120. At this timing, the hand 110 (suction pad 111) and the substrate 100 are not in contact with each other, and a leak (inflow of air) occurs from the suction hole 111a of the hand 110 (suction pad 111). Therefore, the pressure value of the vacuum line 112 detected by the pressure sensor 114 remains at a slight negative pressure.

[0019] 2(b), time 204 is the timing when the hand 110 rises and the hand 110 (suction pad 111) starts to come into contact with the substrate 100. At this timing, the pressure value of the vacuum line 112 detected by the pressure sensor 114 has hardly changed since time 203, but the suction pad 111 of the hand 110 comes into contact with the substrate 100, and the suction hole 111a of the suction pad 111 is blocked by the substrate 100. Therefore, the vacuum line 112 is sealed to prevent leakage (inflow of air) from the suction hole 111a, and the pressure value of the vacuum line 112 decreases after time 204 (it may be understood as increasing in the negative pressure direction).

[0020] In this way, at the timing (time 204) when the hand 110 starts to come into contact with the substrate 100, the pressure value of the vacuum line 112 hardly changes from the time 203. Therefore, conventionally, the control unit 160 can only identify (understand) the timing when the pressure value of the vacuum line 112 reaches the threshold value TH based on the detection result of the pressure sensor 114. However, the height H1 of the hand 110 at the timing (time 205) when the pressure value of the vacuum line 112 reaches the threshold value TH is deviated from the height H2 of the hand 110 at the start of contact between the hand 110 and the substrate 100. The deviation can be about 0 to 3 mm depending on the rising speed (driving speed) at which the hand 110 is raised and the state of the vacuum line 112. In addition, as described in Patent Document 1, the method of measuring the height of the hand at the start of contact by repeating the process of determining whether the pressure value of the vacuum line 112 reaches the threshold value while moving the hand 110 by a predetermined distance and stopping it is disadvantageous in terms of productivity. That is, conventionally, it has been difficult to accurately and efficiently measure the height H2 of the hand 110 at the time when the hand 110 starts to come into contact with the substrate 100.

[0021] Therefore, in this embodiment, a second timing, which is a predetermined time before a first timing (time 205) at which the pressure value of the vacuum line 112 decreases and reaches the threshold value TH, is specified as the contact start timing (time 204) between the hand 110 and the substrate 100. Then, the height of the hand 110 at the second timing is determined as the height H2 of the hand 110 at the start of contact between the hand 110 and the substrate 100. Here, the predetermined time represents a delay time from the start of contact between the hand 110 and the substrate 100 until the pressure value of the vacuum line 112 reaches the threshold value TH (hereinafter, may be simply referred to as delay time), and may be understood as a suction delay parameter. The delay time obtained as a transient response of the pressure value of the vacuum line 112 is uniquely determined by the exhaust capacity of the vacuum pump 170 and / or the pressure loss of the vacuum line 112. Therefore, by estimating (obtaining) this delay time in advance, it becomes possible to accurately and efficiently measure the height H2 of the hand 110 at the start of contact between the hand 110 and the substrate 100.

[0022] [Delay time estimation] 4 is a flowchart showing a calibration process (estimation step) for estimating (acquiring) the delay time. The flowchart in FIG. 4 can be executed in advance by the control unit 160 before a step of actually producing a semiconductor device or the like using the substrate 100.

[0023] In this embodiment, there are two indefinite parameters, namely, delay time and height of the hand 110. Therefore, the two indefinite parameters can be calculated by formulating simultaneous equations for the two indefinite parameters from information obtained by driving the hand 110 in at least two types of motion patterns. In the following, an example will be described in which a first receiving process (first process) and a second receiving process (second process) are performed, and the delay time is estimated based on the pressure profile and height profile obtained in each of the first receiving process and the second receiving process. Note that each of the first receiving process and the second receiving process imitates the receiving process described above.

[0024] Here, the first receiving process and the second receiving process have different lifting speeds (driving speeds) of the hand 110 when lifting the hand 110. In the following example, the lifting speed of the hand 110 in the first receiving process is slower than that in the second receiving process. For example, in the first receiving process, the hand 110 is lifted at a lifting speed (first lifting speed) slower than the lifting speed used in normal transport, and in the second receiving process, the hand 110 is lifted at a lifting speed (second lifting speed) equal to the lifting speed used in normal transport. However, the lifting speed of the hand 110 in the second receiving process may be slower than that in the first receiving process. Note that normal transport may be defined as an operation for transporting the substrate 100 to a target destination by driving the hand 110.

[0025] In step S301, the control unit 160 controls the driving of the hand 110 by the driving unit 150 so that the hand 110 takes out the substrate 100 from a carrier (storage unit) (not shown) and transports (places) it on the placement unit 120. Next, in step S302, the control unit 160 performs a first receiving process simulating the receiving process. In the first receiving process, the hand 110 is raised from below the substrate 100 placed on the placement unit 120 at a first rising speed to make the hand 110 hold the substrate 100. This makes it possible to obtain a pressure profile 211 and a height profile 212 in the first receiving process, as shown in FIG. 5(a). The pressure profile 211 is a profile showing a change in the pressure value of the vacuum line 112 detected by the pressure sensor 114 in the first receiving process, and may be referred to as a first pressure profile 211 below. Moreover, the height profile 212 is a profile showing a change in height of the hand 110 in the first receiving process, and may be hereinafter referred to as the first height profile 212. Note that the first rising speed can be set to a value slower than the second rising speed for raising the hand 110 in the second receiving process described later.

[0026] In step S303, the control unit 160 controls the driving unit 150 to drive the hand 110 so that the substrate 100 held by the hand 110 through step S302 is placed on the placement unit 120 again. Next, in step S304, the control unit 160 performs a second receiving process simulating the receiving process. In the second receiving process, the hand 110 is raised from below the substrate 100 placed on the placement unit 120 at a second rising speed to cause the hand 110 to hold the substrate 100. This makes it possible to obtain a pressure profile 221 and a height profile 222 in the second receiving process, as shown in FIG. 5(b). The pressure profile 221 is a profile showing a change in the pressure value of the vacuum line 112 detected by the pressure sensor 114 in the second receiving process, and may be referred to as the second pressure profile 221 below. The height profile 222 is a profile showing a change in the height of the hand 110 in the second receiving process, and may be referred to as the second height profile 222 below. The second ascending speed can be set to a value faster than the first ascending speed for driving the hand 110 in the first receiving process.

[0027] Here, steps S301 to S304 may be repeated multiple times. Generally, using the results of measurements multiple times improves the calibration accuracy. In this case, the first receiving process is performed multiple times, and representative values ​​(e.g., average value, median value) from the multiple first receiving processes may be used as the pressure profile 211 and height profile 212 of the first receiving process. Similarly, the second receiving process is performed multiple times, and representative values ​​(e.g., average value, median value) from the multiple second receiving processes may be used as the pressure profile 221 and height profile 222 of the second receiving process.

[0028] In step S305, the control unit 160 controls the driving of the hand 110 by the driving unit 150 so that the hand 110 transports the substrate 100 to a carrier (storage unit) (not shown) (i.e., so that the substrate 100 is retrieved). Next, in step S306, the control unit 160 estimates (calculates) a delay time from when the contact between the hand 110 and the substrate 100 starts until the pressure value of the vacuum line 112 reaches the threshold value THa. The control unit 160 estimates (calculates) the delay time based on the first pressure profile 211 and the first height profile 212 obtained in step S302 and the second pressure profile 211 and the second height profile 212 obtained in step S304. Details of the estimation method (calculation method) of the delay time will be described later. In addition, in step S307, the control unit 160 stores (saves) information indicating the delay time estimated in step S306 in the storage unit.

[0029] Next, the details of the method of estimating the delay time in step S306 will be described with reference to Figs. 5 and 6. Fig. 5(a) shows a first pressure profile 211 and a first height profile 212 obtained in the first receiving process. Fig. 5(a) shows the timing (time 214) when the hand 110 starts contacting the substrate 100 in the first receiving process, and the timing (time 215) when the pressure value of the vacuum line 112 connected to the hand 110 reaches the threshold value THa. Fig. 5(b) shows a second pressure profile 221 and a second height profile 222 obtained in the second receiving process. Fig. 5(b) shows the timing (time 224) when the hand 110 starts contacting the substrate 100 in the second receiving process, and the timing (time 225) when the pressure value of the vacuum line 112 connected to the hand 110 reaches the threshold value THa.

[0030] Here, the threshold value THa may be determined based on the pressure value PL1 of the vacuum line 112 detected by the pressure sensor 114 when the hand 110 and the substrate 100 are not in contact with each other, i.e., when leakage occurs from the suction hole 111a. The pressure value PL1 of the vacuum line 112 when leakage occurs is almost constant, and may be referred to as the leak state pressure PL1 below. Since the leak state pressure PL1 is almost the same value in the first receiving process and the second receiving process, the threshold value THa may be determined as a value commonly used in the first receiving process and the second receiving process. For example, the threshold value THa may be determined to be a value offset by a certain amount from the leak state pressure PL1, or may be determined to be a value obtained by multiplying the leak state pressure PL1 by a certain gain. Since the leak state pressure PL1 is affected by fluctuations in the capacity of the exhaust mechanism such as the vacuum pump 170 and the vacuum line 112, a pressure value on the source pressure side (for example, a pressure value generated by the vacuum pump 170) may be acquired, and the threshold value THa may be determined according to the pressure value on the source pressure side. The threshold value THa may be determined as close as possible to the leak state pressure PL1 in the portion of the pressure profile where the pressure value changes sharply. This makes it possible to reduce the influence of fluctuations in the capacity of the exhaust mechanism. Note that, when the pressure sensor 114 is a switch output, the pressure sensor 114 can be used only at a predetermined value preset in the pressure sensor 114, and therefore the predetermined value may be determined as the threshold value THa.

[0031] In each of the first receiving process and the second receiving process, it is difficult to identify the timing (time 214, time 224) when the hand 110 starts to come into contact with the substrate 100 based on the pressure value of the vacuum line 112 detected by the pressure sensor 114. Therefore, in this embodiment, the delay time is estimated based on information in which the first height profile 212 and the second height profile 222 are superimposed so that the arrival times (time 215, time 225) at which the pressure of the vacuum line 112 reaches the threshold value THa coincide. Specifically, the time of intersection of the first height profile 212 and the second height profile 222 in the information is obtained, and the difference between the time of the intersection and the arrival time is estimated as the delay time.

[0032] FIG. 6 shows information (waveforms) in which the pressure profiles (211, 221) and the height profiles (212, 222) in FIG. 5(a)-(b) are superimposed. The first pressure profile 211 and the second pressure profile 221 in the information are superimposed on each other so that the arrival times (times 215, 225) at which the pressure of the vacuum line 112 reaches the threshold value THa coincide. The first pressure profile 211 and the second pressure profile 221 at this time have approximately the same waveforms after the arrival times (times 215, 225) at which the pressure of the vacuum line 112 reaches the threshold value THa. Similarly, the first height profile 212 and the second height profile 222 in the information are superimposed on each other so that the arrival times (times 215, 225) at which the pressure of the vacuum line 112 reaches the threshold value THa coincide. At this time, an intersection 229 between the first height profile 212 and the second height profile 222 is the height Ha of the hand 110 when the hand 110 starts to come into contact with the substrate 100. Therefore, the difference between the time 228 of the intersection 229 and the arrival time (time 215, time 225) can be estimated (calculated) as the delay time ΔT.

[0033] Since the delay time ΔT is a value specific to the transport device CVY, the above calibration process needs to be performed once. However, if there is a possibility that the state of the transport device CVY has changed, such as an increase in leakage due to wear of the suction pad 111 accompanying the driving of the hand 110, the above calibration process may be performed periodically. Furthermore, if there is a time-dependent change in the delay time ΔT that is equal to or greater than a predetermined value in the periodically performed calibration process, it may be determined that some abnormality has occurred in the transport device CVY, and the user may be notified of the fact, or the operation of the transport device CVY may be stopped.

[0034] Here, in the calibration process, the hand 110 may be step-driven in at least one of the first receiving process and the second receiving process. FIG. 7 shows a first pressure profile 211 and a first height profile 212 when the hand 110 is step-driven in the first receiving process. Step driving means driving the hand 110 so that the height of the hand 110 changes in a step-like manner by a predetermined distance. Even when the hand 110 is step-driven, as described above, the intersection 229 of the first height profile 212 and the second height profile 222 is the height of the hand 110 when the hand 110 starts to contact the substrate 100. Therefore, even in this case, the difference between the time 228 of the intersection 229 and the arrival time (time 215, time 225) can be estimated (calculated) as the delay time ΔT.

[0035] As a method of estimating the delay time, in addition to the above-mentioned calibration process in this embodiment, a method of estimating the delay time from a differential waveform (differential value) of a pressure profile is considered. However, in the method using the differential waveform, after the hand 110 (suction pad 111) starts to contact the substrate 100, the substrate 100 repeats partial contact and non-contact with the suction pad 111, and there is a risk of erroneously detecting a pressure change that varies as a result. In addition, the differential waveform is easily affected by variations in exhaust capacity, and the variation in the calculated delay time may be larger than in this embodiment. Therefore, the delay time estimation method in this embodiment is superior to the method of estimating the delay time using the differential waveform in that it can estimate the delay time with higher accuracy.

[0036] [Method of transporting boards using hands] Next, a method (transport method) for performing normal transport of the substrate 100 by the hand 110 will be described. As described above, normal transport can be an operation for driving the hand 110 to transport the substrate 100 to a target destination. FIG. 8 is a flowchart showing a method for transporting the substrate 100 by the hand 110. The flowchart in FIG. 8 can be executed by the control unit 160. Here, steps S321 to S324 in the flowchart in FIG. 8 are a measurement process (measurement process) for measuring the height of the hand 110 at the start of contact between the hand 110 and the substrate 100 in the receiving process. Steps S325 to S327 are a monitoring process for monitoring the height of the hand 110 based on the measurement result in the measurement process. The flowchart in FIG. 8 may be understood as a process (step) performed during the execution of normal transport. In addition, a calibration process (estimation process) shown in the flowchart in FIG. 4 may be added to the measurement process.

[0037] In step S321, the control unit 160 performs a receiving process and acquires a pressure profile 231 and a height profile 232 in the receiving process. Fig. 9 shows the pressure profile 231 and the height profile 232 in the receiving process. The pressure profile 231 is a profile that indicates a change in the pressure value of the vacuum line 112 detected by the pressure sensor 114 in the receiving process. The height profile 232 is a profile that indicates a change in the height of the hand 110 in the receiving process.

[0038] In step S322, the control unit 160 obtains a first timing (time 235) at which the pressure value of the vacuum line 112 reaches the threshold value THb in the pressure profile 231 acquired in step S321. The threshold value THb used in this step S322 may be determined to be the same value as the threshold value THa used in the above calibration process. For example, the threshold value THb used in this step S322 may be determined to be a value offset by a certain amount from the leak state pressure PL1, as in the above calibration process, or may be determined to be a value obtained by multiplying the leak state pressure PL1 by a certain gain. Since the leak state pressure PL1 is constant unless the configuration of the drive unit 150 (suction mechanism) is changed, the threshold value THb calculated based on the leak state pressure PL1 may be the same value as the threshold value THa used in the calibration process.

[0039] In step S323, the control unit 160 specifies a second timing (time 234) that is a predetermined time before the first timing obtained in step S322 as the timing when contact between the hand 110 and the substrate 100 starts in the receiving process. As the predetermined time, the delay time ΔT estimated in the calibration process described above can be used. Next, in step S324, the control unit 160 determines the height Hb of the hand 110 at the second timing (time 234) in the height profile 232 as the height of the hand 110 at the start of contact between the hand 110 and the substrate 100 in the receiving process.

[0040] In step S325, the control unit 160 judges whether the information on the height of the hand 110 obtained in step S324 can be used to judge an abnormality in the height of the hand 110. Possible measurement error factors in normal transport include a case where the substrate 100 repeatedly makes partial contact and non-contact with the suction pad 111, taking a long time for suction, and a case where the substrate 100 is warped. By detecting such error factors, the accuracy of judging an abnormality in the height of the hand 110 can be improved. If it is judged that the information on the height of the hand 110 obtained in step S324 can be used to judge an abnormality in the height of the hand 110, the process proceeds to step S326, and if it is judged that the information on the height of the hand 110 cannot be used to judge an abnormality in the height of the hand 110, the process ends.

[0041] 10 shows a pressure profile 241 in a state where a minute leak (air inflow) occurs from the suction hole 111a to the vacuum line 112 after the hand 110 receives the substrate 100. The minute leak can occur when the suction hole 111a of the suction pad 111 is not completely blocked by the substrate 100 due to the influence of the attitude, warping, vibration, etc. of the substrate 100 after the hand 110 receives the substrate 100, and the vacuum line 112 is not sealed. In the pressure profile 241 in a state where a minute leak occurs, the pressure value of the vacuum line 112 does not decrease completely as compared with the pressure profile 242 in a normal state (i.e., a state where no leak occurs), as shown in FIG. 10. Therefore, in the pressure profile 241 in a state where a minute leak occurs, the height of the hand 110 cannot be accurately measured, and it may be difficult to accurately determine an abnormality in the height of the hand 110. Therefore, the control unit 160 determines whether the information on the height of the hand 110 obtained in step S324 can be used to determine whether the height of the hand 110 is abnormal, depending on whether the pressure value of the vacuum line 112 falls below a specified value in the receiving process. Specifically, if the pressure value of the vacuum line 112 falls below a specified value in the receiving process, it is determined that the information on the height of the hand 110 can be used. On the other hand, if the pressure value of the vacuum line 112 does not fall below the specified value in the receiving process, it is determined that the information on the height of the hand 110 cannot be used. The specified value can be set to a value lower than the threshold value THb, for example, a value that is not reached when a leak occurs and is achieved when no leak occurs.

[0042] In step S326, the control unit 160 determines whether the height of the hand 110 is abnormal based on the information on the height of the hand 110 obtained in step S324. For example, if the height Hb of the hand 110 obtained in step S324 is within the allowable range, the control unit 160 determines that the height of the hand 110 is normal and ends the process. On the other hand, if the height Hb of the hand 110 obtained in step S324 is not within the allowable range, the control unit 160 determines that the height of the hand 110 is abnormal and proceeds to step S327. In step S327, the control unit 160 notifies the user that the height of the hand 110 is abnormal. The notification can be made via a user interface provided in the transport device CVY.

[0043] Here, the determination of usability of the height information of the hand 110 with respect to the warpage of the substrate 100 (step S325) will be described. If the warpage of the substrate 100 is known, it is possible to remove the influence of the warpage of the substrate 100 by adopting only the height information of the hand 110 whose warpage is within a predetermined range. In addition, when the warpage of the substrate 100 is unknown, it is possible to statistically determine whether the result can be adopted for each substrate lot by comparing with past measurement results. FIG. 11 shows an example of the result of conveying a mixture of flat substrates and substrates for warpage measurement. The substrates that are approximately the same height as the reference height are flat substrates, and the rest are warped substrates. For example, in groups 401-402, the measurement results are offset from the flat substrates, so it is possible to determine that the substrates are warped substrates and unusable (unusable). In addition, in group 403, although the substrates are approximately the reference height on average, there is a large variation, so it is possible to determine that the substrates are unusable (unusable). In addition, in group 404, although there is a slight offset, the variation is small, so the influence of the substrate warpage is small, so it is possible to determine that the substrates are usable.

[0044] Next, the determination of abnormality in the height of the hand 110 (step S326) will be described. The determination of abnormality in the height of the hand 110 may be performed based on the measurement results for each time, but since the measurement results tend to fluctuate over a long span, the determination may be performed using a moving average or a median value from past measurement results as shown in Fig. 11. Furthermore, apart from the determination of abnormality in the height of the hand 110, if an abnormal value such as that of group 405 is detected, a notification to the user or a decision to stop the transport may be made since the warpage of the substrate 100 is excessive and there is a risk of interference during transport to the next step.

[0045] As described above, in this embodiment, the second timing is specified as a predetermined time before the first timing at which the pressure value of the vacuum line 112 connected to the suction hole 111a of the hand 110 decreases and reaches the threshold value THb. Then, based on the height profile of the hand 110 in the receiving process, the height Hb of the hand 110 at the second timing is determined as the height of the hand 110 at the start of contact between the hand 110 and the substrate 100. This makes it possible to accurately and efficiently measure the height of the hand 110 in normal transport without providing a separate process for only measuring the height of the hand 110.

[0046] <Second embodiment> A transfer device CVY according to a second embodiment of the present invention will be described. This embodiment basically follows the first embodiment, and may follow the first embodiment except for the matters described below.

[0047] 12 is a diagram showing an example of the configuration of the suction mechanism in the transfer device CVY of this embodiment. The hand 510 is controlled by a driving unit 550. The driving unit 550 may include a suction mechanism (exhaust mechanism) for sucking and holding the substrate 500 by the hand 510, in addition to a driving mechanism for driving the hand 510 in the XYZ directions. The hand 510 is provided with a suction pad 511 having suction holes 511a on a surface (upper surface) that contacts the substrate 500. A vacuum line 512 (piping) connected to a vacuum pump 571 is connected to the suction hole 511a of the suction pad 511. The vacuum line 512 is provided with an electromagnetic valve 513 for controlling opening and closing between the vacuum pump 571 and the vacuum line 512, and a pressure sensor 514 (detection unit) for detecting the pressure of the vacuum line 512. The solenoid valve 513 and the pressure sensor 514 are connected to a control unit 561, which controls opening and closing of the vacuum line 512 by the solenoid valve 513 and detects the pressure of the vacuum line 512 by the pressure sensor 514. The vacuum pump 571 may be configured as a component of the transfer device CVY, or may be configured as an external device of the transfer device CVY.

[0048] In addition, the placement unit 520 on which the substrate 500 is placed is configured to suction and hold the substrate 500 in this embodiment. A suction hole 520a is provided on the upper surface of the placement unit 520, and a vacuum line 522 (piping) connected to a vacuum pump 572 is connected to the suction hole 520a. The vacuum line 522 is provided with an electromagnetic valve 523 for controlling the opening and closing of the vacuum pump 572 and the vacuum line 522, and a pressure sensor 524 (detection unit) for detecting the pressure of the vacuum line 522. The electromagnetic valve 523 and the pressure sensor 524 are connected to a control unit 562, and the control unit 562 controls the opening and closing of the vacuum line 522 by the electromagnetic valve 523, and detects the pressure of the vacuum line 522 by the pressure sensor 524. The vacuum pump 572 may be configured as a component of the transfer device CVY, or may be configured as an external device of the transfer device CVY. The vacuum pumps 571 to 572 may be configured as a single unit.

[0049] The control units 561-562 are communicatively connected to a main control unit 560 (higher-level controller) via a communication line 563. The main control unit 560 controls the control units 561-562, transmits and receives data and information to and from the control units 561-562, and controls the holding and transport of the substrate 500 by the hand 110. Each of the main control unit 560 and the control units 561-562 can be configured by a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. The main control unit 560 and the control units 561-562 may be configured as a single control unit.

[0050] In the transfer device CVY of this embodiment, in a process of transferring the substrate 500 from the hand 510 to the placement unit 520, the height of the hand 510 at the start of contact between the placement unit 520 and the substrate 500 is measured. In this process, the hand 510 holding the substrate 500 is lowered from above the placement unit 520 while the vacuum line 522 connected to the suction hole 520a of the placement unit 520 is connected to the vacuum pump 572, so that the substrate 500 is placed on and held by the placement unit 520. Hereinafter, this process may be referred to as a "transfer process." The transfer process is performed while the pressure of the vacuum line 522 is detected by the pressure sensor 524.

[0051] [Delay time estimation] Next, a calibration process (estimation step) for estimating (obtaining) the delay time in this embodiment will be described. FIG. 13 is a flowchart showing the calibration process of this embodiment. The flowchart of FIG. 13 can be executed in advance by the main control unit 560 before the process of actually producing a semiconductor device or the like using the substrate 500. In the following, an example will be described in which a first delivery process (first process) and a second delivery process (second process) are performed, and the delay time is estimated based on the pressure profile and height profile obtained in each of the first delivery process and the second delivery process. The pressure profile of this embodiment is a profile showing the change in the pressure value of the vacuum line 522 connected to the suction hole 520a of the placement unit 520, and can be obtained based on the detection result of the pressure sensor 524. Moreover, the height profile of this embodiment is a profile showing the change in the height of the hand 510. Note that each of the first delivery process and the second delivery process is an imitation of the delivery process described above.

[0052] Here, the first and second transfer processes have different lowering speeds (driving speeds) of the hand 510 when lowering the hand 510. In the following example, the lowering speed of the hand 510 in the first transfer process is slower than that in the second transfer process. For example, in the first transfer process, the hand 510 is lowered at a lowering speed (first lowering speed) slower than the lowering speed used in normal transport, and in the second transfer process, the hand 510 is lowered at a lowering speed (second lowering speed) that is the same as the lowering speed used in normal transport. However, the lowering speed of the hand 510 in the second transfer process may be slower than that in the first transfer process. Note that normal transport may be defined as an operation for transporting the substrate 500 to a target destination by driving the hand 510.

[0053] In step S601, the main control unit 560 controls the driving of the hand 510 by the driving unit 550 so that the hand 510 takes out the substrate 100 from a carrier (storage unit) (not shown) and holds it. Next, in step S602, the main control unit 560 performs a first transfer process simulating a transfer process. In the first transfer process, the hand 510 holding the substrate 500 is lowered from above the placement unit 520 at a first lowering speed (first driving speed) to place and hold the substrate 500 on the placement unit 520. This makes it possible to obtain a pressure profile 711 and a height profile 712 in the first transfer process, as shown in FIG. 14(a). The pressure profile 711 is a profile showing a change in the pressure value of the vacuum line 522 detected by the pressure sensor 524 in the first transfer process, and may be referred to as a first pressure profile 711 below. Moreover, the height profile 712 is a profile showing a change in the height of the hand 510 in the first transfer process, and may be hereinafter referred to as the second height profile 712. Note that the first lowering speed can be set to a value slower than the second lowering speed for lowering the hand 510 in the second transfer process described later.

[0054] In step S603, the main control unit 560 controls the driving of the hand 510 by the driving unit 150 so that the hand 510 holds the substrate 500 held by the placement unit 520 after step S502 again. Next, in step S604, the main control unit 560 performs a second transfer process simulating the transfer process. In the second transfer process, the hand 510 holding the substrate 500 is lowered from above the placement unit 520 at a second lowering speed (second driving speed) to place and hold the substrate 500 on the placement unit 520. This makes it possible to obtain a pressure profile 721 and a height profile 722 in the second transfer process, as shown in FIG. 14(b). The pressure profile 721 is a profile showing a change in the pressure value of the vacuum line 522 detected by the pressure sensor 524 in the second transfer process, and may be referred to as a second pressure profile 721 below. Moreover, the height profile 722 is a profile showing a change in the height of the hand 510 in the second transfer process, and may be hereinafter referred to as the second height profile 722. Note that the second lowering speed can be set to a value faster than the first lowering speed for lowering the hand 510 in the first transfer process.

[0055] Here, steps S601 to S604 may be repeated multiple times. Generally, using the results of multiple measurements improves calibration accuracy. In this case, multiple first handover processes are performed, and representative values ​​(e.g., average value, median value) from multiple first handover processes may be used as pressure profile 711 and height profile 712 of the first handover process. Similarly, multiple second handover processes are performed, and representative values ​​(e.g., average value, median value) from multiple second handover processes may be used as pressure profile 721 and height profile 722 of the second handover process.

[0056] In step S605, the main control unit 560 controls the driving of the hand 510 by the driving unit 550 so that the hand 510 retrieves the substrate 500 from the placement unit 520 and transports it to a carrier (storage unit) (not shown). Next, in step S606, the main control unit 560 estimates (calculates) a delay time from when the placement unit 520 starts contacting the substrate 500 to when the pressure value of the vacuum line 522 reaches a threshold value THc. The main control unit 560 estimates (calculates) the delay time based on the first pressure profile 711 and the first height profile 712 obtained in step S602 and the second pressure profile 721 and the second height profile 722 obtained in step S604. The details of the estimation method (calculation method) of the delay time will be described later. In addition, in step S607, the main control unit 560 stores (saves) information indicating the delay time estimated in step S606 in the storage unit.

[0057] Next, the details of the method of estimating the delay time in step S606 will be described with reference to FIGS. 14 and 15. FIG. 14(a) shows a first pressure profile 711 and a first height profile 712 obtained in the first transfer process. FIG. 14(a) shows the timing (time 714) when the substrate 500 starts to come into contact with the placement part 520 in the first transfer process, and the timing (time 715) when the pressure value of the vacuum line 522 connected to the placement part 520 reaches the threshold value THc. FIG. 14(b) shows a second pressure profile 721 and a second height profile 722 obtained in the second transfer process. FIG. 14(b) shows the timing (time 724) when the substrate 100 starts to come into contact with the placement part 520 in the second transfer process, and the timing (time 725) when the pressure value of the vacuum line 522 connected to the placement part 520 reaches the threshold value THc.

[0058] Here, the threshold value THc may be determined based on the pressure value PL2 of the vacuum line 522 detected by the pressure sensor 524 in a state where the mounting part 520 and the substrate 500 are not in contact with each other, i.e., in a state where leakage occurs from the suction hole 520a. The pressure value PL2 of the vacuum line 112 in a state where leakage occurs is almost constant, and may be referred to as the leak state pressure PL2 below. Since the leak state pressure PL2 is almost the same value in the first transfer process and the second transfer process, the threshold value THc may be determined as a value commonly used in the first transfer process and the second transfer process. For example, the threshold value THc may be determined to be a value offset by a certain amount from the leak state pressure PL2, or may be determined to be a value obtained by multiplying the leak state pressure PL2 by a certain gain. Since the leak state pressure PL2 is affected by fluctuations in the capacity of the exhaust mechanism such as the vacuum pump 572 and the vacuum line 522, a pressure value on the source pressure side (for example, a pressure value generated by the vacuum pump 572) may be acquired, and the threshold value THc may be determined according to the pressure value on the source pressure side. Specifically, the threshold value THc may be determined as close as possible to the leak state pressure PL2 in a portion where the pressure value of the pressure profile changes sharply. This makes it possible to reduce the influence of fluctuations in the capacity of the exhaust mechanism. Note that, when the pressure sensor 524 is a switch output, the pressure sensor 524 can be used only at a predetermined value preset in the pressure sensor 524, and therefore the predetermined value may be determined as the threshold value THc.

[0059] In each of the first and second delivery processes, it is difficult to identify the timing (time 714, time 724) when the contact between the placement part 520 and the substrate 500 starts based on the pressure value of the vacuum line 522 detected by the pressure sensor 524. Therefore, in this embodiment, the delay time is estimated based on information in which the first height profile 712 and the second height profile 722 are superimposed so that the arrival times (time 715, time 725) at which the pressure of the vacuum line 522 reaches the threshold value THc coincide. Specifically, the time of intersection of the first height profile 712 and the second height profile 722 in the information is obtained, and the difference between the time of the intersection and the arrival time is estimated as the delay time.

[0060] FIG. 15 shows information (waveforms) in which the pressure profiles (711, 721) and the height profiles (712, 722) in FIG. 14(a)-(b) are superimposed. The first pressure profile 711 and the second pressure profile 721 in the information are superimposed on each other so that the arrival times (times 715, 725) at which the pressure of the vacuum line 522 reaches the threshold value THc match. The first pressure profile 711 and the second pressure profile 721 at this time have approximately the same waveforms after the arrival times (times 715, 725) at which the pressure of the vacuum line 522 reaches the threshold value THc. Similarly, the first height profile 712 and the second height profile 722 in the information are superimposed on each other so that the arrival times (times 715, 725) at which the pressure of the vacuum line 522 reaches the threshold value THc match. An intersection 729 between the first height profile 712 and the second height profile 722 at this time is the height Hc of the hand 510 when contact between the mounting part 520 and the substrate 500 starts. Therefore, the difference between the time 728 of the intersection 729 and the arrival time (time 715, time 725) can be estimated (calculated) as the delay time ΔT.

[0061] As described above, the second embodiment is different from the first embodiment in that the receiving process is changed to the handover process, and the detection of the suction pressure of the hand is changed to the detection of the suction pressure of the placement unit. However, the basic method of estimating the delay time ΔT is the same in the first and second embodiments.

[0062] [Method of transporting boards using hands] Next, a method (transport method) for performing normal transport of the substrate 500 by the hand 510 will be described. As described above, normal transport can be an operation for transporting the substrate 100 to a target destination by driving the hand 510. FIG. 16 is a flowchart showing a method for transporting the substrate 500 by the hand 510. The flowchart in FIG. 16 can be executed by the main control unit 560. Here, steps S621 to S624 in the flowchart in FIG. 16 are a measurement process (measurement process) for measuring the height of the hand 510 at the start of contact between the placement unit 520 and the substrate 500 in the delivery process. Steps S625 to S627 are a monitoring process for monitoring the height of the hand 510 based on the measurement result in the measurement process. The flowchart in FIG. 16 may be understood as a process (step) performed during execution of normal transport. In addition, a calibration process (estimation process) shown in the flowchart in FIG. 13 may be added to the measurement process.

[0063] In step S621, the main control unit 560 performs a handover process and acquires a pressure profile 731 and a height profile 732 in the handover process. Fig. 17 shows the pressure profile 731 and the height profile 732 in the handover process. The pressure profile 731 is a profile indicating a change in pressure value of the vacuum line 522 connected to the suction hole 520a of the mounting unit 520, and can be acquired based on the detection result of the pressure sensor 524 in the handover process. The height profile 732 is a profile indicating a change in height of the hand 510.

[0064] In step S622, the main control unit 560 determines the first timing (time 235) at which the pressure value of the vacuum line 522 reaches the threshold value THd in the pressure profile 731 acquired in step S621. The threshold value THd used in this step S622 can be determined to be the same value as the threshold value THc used in the above-mentioned calibration process.

[0065] In step S623, the main controller 560 specifies a second timing (time 734) that is a predetermined time before the first timing obtained in step S622, as the timing at which contact between the placement unit 520 and the substrate 500 starts in the transfer process. As the predetermined time, the delay time ΔT estimated in the calibration process described above can be used. Next, in step S624, the main controller 560 determines the height Hd of the hand 510 at the second timing (time 734) in the height profile 732 as the height of the hand 510 at the start of contact between the placement unit 520 and the substrate 500 in the transfer process.

[0066] In step S625, the main control unit 560 judges whether the information on the height of the hand 510 obtained in step S624 can be used to judge whether the height of the hand 510 is abnormal, based on the information on the height of the hand 510 obtained in step S624. Next, in step S626, the main control unit 560 judges whether the height of the hand 510 is abnormal, based on the information on the height of the hand 510 obtained in step S624. For example, if the height Hd of the hand 510 obtained in step S624 is within the allowable range, the main control unit 560 judges that the height of the hand 510 is normal and ends the process. On the other hand, if the height Hd of the hand 510 obtained in step S624 is not within the allowable range, the main control unit 560 judges that the height of the hand 510 is abnormal and proceeds to step S627. In step S627, the main control unit 560 notifies the user that the height of the hand 510 is abnormal. Note that steps S625 to S627 are similar to steps S325 to S327 in FIG. 8 described in the first embodiment, and therefore detailed description thereof will be omitted here.

[0067] As described above, in this embodiment, the second timing is specified as a predetermined time before the first timing at which the pressure value of the vacuum line 522 connected to the suction hole 520a of the placement unit 520 decreases and reaches the threshold value THd. Then, based on the height profile of the hand 510 in the delivery process, the height Hd of the hand 510 at the second timing is determined as the height of the hand 510 at the start of contact between the placement unit 520 and the substrate 500. This makes it possible to accurately and efficiently measure the height of the hand 510 in normal transport without providing a separate process for only measuring the height of the hand 510.

[0068] <Embodiments of the Lithography Apparatus> An embodiment of a lithography apparatus according to the present invention will be described. The lithography apparatus is an apparatus that is employed in a lithography process, which is a manufacturing process for semiconductor devices and liquid crystal display devices, and forms a pattern on a substrate. Examples of the lithography apparatus include an exposure apparatus that exposes the substrate through an original to transfer the pattern of the original onto the substrate, and an imprint apparatus that forms a pattern of an imprint material on the substrate using a mold. In the following, an exposure apparatus will be described as an example of the lithography apparatus.

[0069] 18 is a schematic diagram showing an example of the configuration of an exposure apparatus 800. The exposure apparatus 800 transfers a pattern formed on an original R onto a substrate S, for example, by a step-and-repeat method or a step-and-scan method. As shown in FIG. 18, the exposure apparatus 800 has an illumination optical system 801, an original stage 802, a projection optical system 803, a substrate stage 804, a transport device 805, and a control unit 806. In the exposure apparatus 800, the illumination optical system 801, the original stage 802, the projection optical system 803, and the substrate stage 804 function as a forming unit that forms a pattern on the substrate S.

[0070] The illumination optical system 801 illuminates the original R with light emitted from a light source (not shown). The original R is made of, for example, quartz glass, and has a pattern (for example, a circuit pattern) to be transferred to the substrate S. The original stage 802 holds the original R and moves in the X-axis and Y-axis directions. The projection optical system 803 projects the pattern of the original R illuminated by the illumination optical system 801 onto the substrate S at a predetermined magnification (for example, 1 / 2 times). The substrate S is made of, for example, single crystal silicon, and has a resist (photosensitive agent) applied to its surface. The substrate stage 804 holds the substrate S and moves in the X-axis and Y-axis directions. The control unit 806 is made of, for example, a computer including a CPU, a memory, etc., and controls each part of the exposure apparatus 800 in an integrated manner according to a program.

[0071] Furthermore, the exposure apparatus 800 is provided with a transport apparatus 805 that transports the substrate S relative to the substrate stage 804. The transport apparatus 805 can be the transport apparatus CVY described in the first or second embodiment. In this case, the control unit 806 of the exposure apparatus 800 may be configured to include a control unit for the transport apparatus CVY.

[0072] <Embodiment of the article manufacturing method> The above-mentioned lithography apparatus can be used to implement an article manufacturing method for manufacturing various articles (semiconductor IC elements, liquid crystal display elements, MEMS, etc.). The article manufacturing method in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.). This manufacturing method includes a transport step of transporting a substrate using the above-mentioned transport apparatus (transport method), a formation step of forming a pattern on the substrate transported in the transport step, a processing step of processing the substrate that has undergone the formation step, and a manufacturing step of manufacturing an article from the substrate that has undergone the processing step. In addition, this manufacturing method may include other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist peeling, dicing, bonding, packaging, etc.). The article manufacturing method in this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the conventional methods.

[0073] <Summary of the embodiment> The disclosure of this specification includes at least the following measurement method, transportation method, article manufacturing method, transportation apparatus, and lithography apparatus. (Item 1) 1. A method for measuring a height of a hand at a time when the hand starts to come into contact with a substrate, the method comprising the steps of: lifting a hand having an upper surface with a suction hole connected to a vacuum line from below the substrate to hold the substrate; A processing step of performing the processing while detecting the pressure in the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact; A measuring method comprising: (Item 2) the predetermined time represents a delay time from when the hand starts to come into contact with the substrate during the process until the pressure in the vacuum line reaches the threshold value; 2. The measurement method according to item 1, further comprising an estimation step of estimating the delay time. (Item 3) The estimation step includes: performing a first process and a second process simulating the process to obtain a first height profile indicating a change in height of the hand in the first process and a second height profile indicating a change in height of the hand in the second process; and estimating, as the delay time, a difference between a time of intersection of the first height profile and the second height profile and the arrival time based on information obtained by superimposing the first height profile and the second height profile on each other so that the arrival times at which the pressure in the vacuum line reaches the threshold value coincide with each other, 3. The measuring method according to item 2, wherein the driving speed of the hand is different between the first process and the second process. (Item 4) 4. The measurement method according to any one of items 1 to 3, wherein the processing includes lifting the substrate from a mounting part by raising the hand from below the substrate placed on a mounting part and causing the hand to hold the substrate. (Item 5) 5. The measuring method according to any one of items 1 to 4, wherein an upper surface of the hand having the suction holes is a surface that comes into contact with the substrate. (Item 6) A method for measuring a height of a hand at a time when contact between a substrate and a substrate holder starts in a process of placing and holding a substrate on a substrate holder by lowering a hand holding a substrate from above the substrate holder, the hand being lowered ... A processing step of performing the processing while detecting the pressure in the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact; A measuring method comprising: (Item 7) A transport method for transporting a substrate by a hand, comprising the steps of: A measuring step of measuring the height of the hand using the measurement method according to any one of items 1 to 6; a monitoring step of monitoring the height of the hand based on a measurement result in the measuring step; A conveying method comprising: (Item 8) The monitoring step includes: a determination step of determining whether the height of the hand is abnormal; a notification step of notifying the user when the hand height is determined to be abnormal in the determination step; 8. The method for transporting according to item 7, comprising: (Item 9) The determining step is executed when the pressure in the vacuum line falls below a specified value in the process, 9. The conveying method according to item 8, wherein the specified value is set to a value lower than the threshold value. (Item 10) A transport step of transporting a substrate using the transport method according to any one of items 7 to 9; a forming step of forming a pattern on the substrate transported in the transport step; a processing step of processing the substrate that has been subjected to the forming step; a manufacturing process for manufacturing an article from the substrate that has been subjected to the processing process; A method for manufacturing an article, comprising: (Item 11) A transport device for transporting a substrate, A hand having a suction hole on an upper surface thereof connected to a vacuum line; A detection unit that detects the pressure of the vacuum line; a control unit that controls holding and transporting of the substrate by the hand; Equipped with the control unit monitors a height of the hand based on a measurement result of measuring a height of the hand at a time when the hand starts to come into contact with the substrate in a process of causing the hand to hold the substrate by raising the hand from below the substrate; The measurement of the hand height is a processing step of performing the processing while causing the detection unit to detect the pressure of the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; and determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact. A conveying device characterized by the above. (Item 12) A transport device for transporting a substrate, A hand for holding the substrate; A placement section having a suction hole on an upper surface thereof connected to a vacuum line; A detection unit that detects the pressure of the vacuum line; A control unit that controls the transportation of the substrate by the hand; Equipped with the control unit, in a process of placing and holding the substrate on the substrate placement unit by lowering a hand holding the substrate from above the substrate placement unit, monitors a height of the hand based on a measurement result obtained by measuring a height of the hand at the start of contact between the substrate placement unit and the substrate; The measurement of the hand height is a processing step of performing the processing while causing the detection unit to detect the pressure of the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; and determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact. A conveying device characterized by the above. (Item 13) 1. A lithographic apparatus for forming a pattern on a substrate, comprising: A conveying apparatus according to item 11 or 12 for conveying the substrate; a formation unit for forming a pattern on the substrate transported by the transport device; 1. A lithographic apparatus comprising:

[0074] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0075] 100,500: substrate, 110,510: hand, 120,520: placement unit, 150,550: drive unit (suction mechanism), 160,560: control unit (main control unit)

Claims

1. 1. A method for measuring a height of a hand at a time when the hand starts to come into contact with a substrate, the method comprising the steps of: lifting a hand having an upper surface with a suction hole connected to a vacuum line from below the substrate to hold the substrate; A processing step of performing the processing while detecting the pressure in the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line has decreased and reached a threshold value, as the height of the hand at the start of the contact; A measuring method comprising:

2. the predetermined time represents a delay time from when the hand starts to come into contact with the substrate during the process until the pressure in the vacuum line reaches the threshold value; The measurement method according to claim 1 , further comprising an estimation step of estimating the delay time.

3. The estimation step includes: performing a first process and a second process simulating the process to obtain a first height profile indicating a change in height of the hand in the first process and a second height profile indicating a change in height of the hand in the second process; and estimating, as the delay time, a difference between a time of intersection of the first height profile and the second height profile and the arrival time based on information obtained by superimposing the first height profile and the second height profile on each other so that the arrival times at which the pressure in the vacuum line reaches the threshold value coincide with each other; 3. The measuring method according to claim 2, wherein the first process and the second process have different driving speeds of the hand.

4. 2. The measurement method according to claim 1, wherein the processing includes lifting the substrate from a mounting part by raising the hand from below the substrate placed on a mounting part and holding the substrate on the hand.

5. 2. The measuring method according to claim 1, wherein an upper surface of the hand having the suction holes is a surface that comes into contact with the substrate.

6. A method for measuring a height of a hand at a time when contact between a substrate and a substrate holder starts in a process of placing and holding a substrate on a substrate holder by lowering a hand holding a substrate from above the substrate holder, the hand being lowered ... A processing step of performing the processing while detecting the pressure in the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of contact; A measuring method comprising:

7. A transport method for transporting a substrate by a hand, comprising the steps of: a measuring step of measuring a height of the hand by using the measuring method according to any one of claims 1 to 6; a monitoring step of monitoring the height of the hand based on a measurement result in the measuring step; A conveying method comprising:

8. The monitoring step includes: a determination step of determining whether the height of the hand is abnormal; a notification step of notifying the user when the hand height is determined to be abnormal in the determination step; The method according to claim 7, further comprising:

9. The determining step is executed when the pressure in the vacuum line falls below a specified value in the process, The transport method according to claim 8 , wherein the specified value is set to a value lower than the threshold value.

10. A transport step of transporting a substrate by using the transport method according to claim 7; a forming step of forming a pattern on the substrate transported in the transport step; a processing step of processing the substrate that has been subjected to the forming step; a manufacturing process for manufacturing an article from the substrate that has been subjected to the processing process; A method for manufacturing an article, comprising:

11. A transport device for transporting a substrate, A hand having a suction hole on an upper surface thereof connected to a vacuum line; A detection unit that detects the pressure of the vacuum line; a control unit that controls holding and transporting of the substrate by the hand; Equipped with the control unit monitors a height of the hand based on a measurement result of measuring a height of the hand at a time when the hand starts to come into contact with the substrate in a process of causing the hand to hold the substrate by raising the hand from below the substrate; The measurement of the hand height is a processing step of performing the processing while causing the detection unit to detect the pressure of the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; and determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact. A conveying device characterized by the above.

12. A transport device for transporting a substrate, A hand for holding the substrate; A placement section having a suction hole on an upper surface thereof connected to a vacuum line; A detection unit that detects the pressure of the vacuum line; A control unit that controls the transportation of the substrate by the hand; Equipped with the control unit, in a process of placing and holding the substrate on the substrate placement unit by lowering a hand holding the substrate from above the substrate placement unit, monitors a height of the hand based on a measurement result obtained by measuring a height of the hand at the start of contact between the substrate placement unit and the substrate; The measurement of the hand height is a processing step of performing the processing while causing the detection unit to detect the pressure of the vacuum line; acquiring a height profile indicative of changes in height of the hand during the process; and determining, based on the height profile, the height of the hand at a second timing that is a predetermined time before a first timing at which the pressure in the vacuum line decreases and reaches a threshold value, as the height of the hand at the start of the contact. A conveying device characterized by the above.

13. 1. A lithographic apparatus for forming a pattern on a substrate, comprising: A transport device according to claim 11 or 12 for transporting the substrate; a formation unit for forming a pattern on the substrate transported by the transport device; 1. A lithographic apparatus comprising:

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