Packing structure and packing method
Patent Information
- Application Number
- JP2023030407
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-02-28
- Publication Date
- 2025-10-14
AI Technical Summary
Existing packaging structures face challenges in improving packaging workability and ensuring reliable packaging efficiency.
A packaging structure comprising a pair of packaging materials with contact surfaces and a connecting portion that allows the materials to change posture from a non-contact to a contact position around the packaged object, utilizing a lever principle to securely hold the object using round portions as fulcrums.
Enhances packaging efficiency and reliability by allowing easy and automated packaging of various shapes and sizes, including electronic devices and vases, while providing effective protection during transport.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a packaging structure, a navigation system, and a packaging method. [Background technology]
[0002] 2. Description of the Related Art Various structures and methods are known for packaging electronic devices for transport.
[0003] Patent Document 1 discloses a cushioning material for packaging, in which a pair of cushioning materials are attached to opposing sides of a package so as to sandwich the package, and are connected by a strap. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Patent No. 4414671 Summary of the Invention [Problem to be solved by the invention]
[0005] As described above, various packaging structures are known, but in recent years, there has been a demand for improved packaging workability and reliable packaging in order to achieve high efficiency.
[0006] An object of the present invention is to provide a packaging structure, a navigation system, and a packaging method that improve workability and enable reliable packaging. [Means for solving the problem]
[0007] In order to achieve the above-mentioned object, a packaging structure of one embodiment of the present invention comprises a pair of packaging materials having abutment surfaces capable of abutting multiple surfaces of an object to be packaged, a connecting portion connecting the pair of packaging materials, and round portions provided on the outer sides of the pair of packaging materials, which contact the upper surface when placed on the upper surface of a workbench, are located below the connecting portion, and are positioned apart on both sides of the connecting portion, and when placed on the upper surface, the object to be packaged changes its position from a first position in which the abutment surfaces do not abut the multiple surfaces of the object to be packaged to a second position in which the abutment surfaces abut the multiple surfaces so as to sandwich the object to be packaged.
[0008] In order to achieve the above-mentioned object, a navigation system of one embodiment of the present invention includes a navigation device and a packaging body for packaging the navigation device, wherein the packaging body is equipped with a pair of packaging materials capable of abutting multiple surfaces of the navigation device, a connecting portion connecting the pair of packaging materials, and round portions provided on the outer sides of the pair of packaging materials, which contact the upper surface when placed on the upper surface of a workbench, are located below the connecting portion, and are positioned apart on both sides of the connecting portion, and when placed on the upper surface, the navigation device changes its posture from a first posture in which the abutment surfaces are not abutting the multiple surfaces of the navigation device to a second posture in which the abutment surfaces abut the multiple surfaces so as to sandwich the navigation device.
[0009] In order to achieve the above-mentioned object, a packaging method of one embodiment of the present invention uses a packaging body including a pair of packaging materials having abutment surfaces capable of abutting multiple surfaces of an object to be packaged, a connecting portion connecting the pair of packaging materials, and round portions provided on the outer sides of the pair of packaging materials, which contact the upper surface when placed on the upper surface of a workbench, and which are located below the connecting portion and spaced apart on both sides of the connecting portion, and includes the steps of placing the pair of packaging materials on the upper surface of the object to be packaged in a first position in which the abutment surfaces do not abut the multiple surfaces of the object to be packaged, pressing the object to be packaged against the connecting portion from the first position, and changing the position to a second position in which the abutment surfaces abut the multiple surfaces so that the pair of packaging materials sandwich the object to be packaged by pressing the connecting portion by the object to be packaged. Effect of the Invention
[0010] According to the present invention, workability is improved and packaging can be performed reliably. [Brief description of the drawings]
[0011] [Figure 1] FIG. 1 is a perspective view of a package in a packaging structure according to an embodiment. [Diagram 2] FIG. 2 is a process diagram of the packaging method according to the embodiment. [Diagram 3] FIG. 3 is a process diagram of the packaging method according to the embodiment. [Figure 4] FIG. 4 is a process diagram of the packaging method according to the embodiment. [Diagram 5] FIG. 5 is a process diagram of the packaging method according to the embodiment. [Figure 6] FIG. 6 is a process diagram of the packaging method according to the embodiment. [Figure 7] FIG. 7 is a flowchart of the packing method according to the embodiment. [Figure 8] FIG. 8 is a perspective view of a modified example of the package in the packaging structure according to the embodiment. [Figure 9] FIG. 9 is a perspective view of another form of the packaging body in the packaging structure according to the embodiment. [Figure 10] FIG. 10 is a process diagram of a packaging method using a packaging body according to another embodiment of the present invention. [Figure 11] FIG. 11 is a process diagram of a packaging method using a packaging body according to another embodiment of the present invention. [Figure 12] FIG. 12 is a side view of another form of the packaging body in the packaging structure according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Hereinafter, a mode for carrying out the invention (hereinafter, referred to as an embodiment) will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiment. Furthermore, the components in the following embodiment include those that a person skilled in the art can easily imagine, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the components disclosed in the following embodiment can be appropriately combined.
[0013] In the following description, three mutually intersecting directions, a first direction X, a second direction Y, and a third direction Z, are shown in the figures. The first direction X and the second direction Y are two directions that indicate a horizontal plane, and the third direction Z indicates the up-down direction. The directions X, Y, and Z are mutually perpendicular.
[0014] FIG. 1 is a perspective view of a package in a packaging structure according to an embodiment.
[0015] The packaging body 1 is formed by pulp molding and includes a pair of packaging materials 2, 3 having an abutment surface structure (abutment surfaces 2A, 2B, 2C, 2D) and an outer structure (peripheral surfaces 21, 22, 23, 24, protrusion 25), and a connecting portion 4 connecting the pair of packaging materials 2, 3. As shown in FIG. 1, the packaging body 1 of the embodiment is formed to have symmetrical shapes in the first direction X and the second direction Y. That is, the pair of packaging materials 2, 3 are formed to have symmetrical shapes with the connecting portion 4 as a boundary.
[0016] The contact surface structure has a first contact surface 2A, a second contact surface 2B, a third contact surface 2C, and a fourth contact surface 2D that are aligned in different directions. In FIG. 1, these contact surfaces 2A, 2B, 2C, and 2D are shown by shading. In FIG. 1, the first contact surface 2A and the second contact surface 2B are parallel to the first direction X and inclined with respect to the second direction Y and the third direction Z. The third contact surface 2C and the fourth contact surface 2D are aligned along a vertical plane formed by the second direction Y and the third direction Z and are opposed to each other in the first direction X. The packaging material 2 is formed with a recess 20 that is surrounded by the first contact surface 2A, the second contact surface 2B, the third contact surface 2C, and the fourth contact surface 2D and opens toward one side of the third direction Z (upward in FIG. 1).
[0017] The structure of the first abutment surface 2A is maintained by a first peripheral surface 21 that constitutes an outer structure, and protrusions 25. The first peripheral surface 21 is provided along the first abutment surface 2A, is parallel to the first direction X, and is inclined with respect to the second direction Y and the third direction Z. The first peripheral surface 21 is formed with a plurality of protrusions 25 that protrude in a direction where the second direction Y and the third direction Z join. The plurality of protrusions 25 constitute the first abutment surface 2A, whose tip portions are inclined at approximately 45° with respect to the second direction Y and the third direction Z along the first direction X and facing the opening direction of the recess 20.
[0018] The structure of the second abutment surface 2B is maintained by a second peripheral surface 22 constituting an outer structure, and protrusions 25. The second peripheral surface 22 is provided along the second abutment surface 2B, is parallel to the first direction X, and is inclined with respect to the second direction Y and the third direction Z. The second peripheral surface 22 is formed with a plurality of protrusions 25 that protrude in the direction where the second direction Y and the third direction Z join. The plurality of protrusions 25 have their tips inclined at approximately 45° with respect to the second direction Y and the third direction Z along the first direction X to constitute the second abutment surface 2B.
[0019] The structure of the third abutment surface 2C is maintained by a third peripheral surface 23 that constitutes an outer structure, and by protrusions 25. The third peripheral surface 23 is provided along the third abutment surface 2C, and is oriented along a vertical plane formed by the second direction Y and the third direction Z. The third peripheral surface 23 is formed with a plurality of protrusions 25 that protrude horizontally toward the first direction X. The plurality of protrusions 25 constitute the third abutment surface 2C, with their tips facing the first direction X along the second direction Y and the third direction Z.
[0020] The structure of the fourth abutment surface 2D is maintained by a fourth peripheral surface 24 constituting an outer structure, and by protrusions 25. The fourth peripheral surface 24 is provided along the fourth abutment surface 2D, and is oriented along a vertical plane formed by the second direction Y and the third direction Z. The fourth peripheral surface 24 is formed with a plurality of protrusions 25 that protrude horizontally toward the first direction X. The plurality of protrusions 25 constitute the fourth abutment surface 2D, with their tips facing the first direction X along the second direction Y and the third direction Z.
[0021] In the packaging material 2, the portion where the first contact surface 2A and the second contact surface 2B intersect within the recess 20 is formed as an inside corner portion 2AB. In addition, in the packaging material 2, the portion where the first contact surface 2A and the third contact surface 2C intersect within the recess 20 is formed as an inside corner portion 2AC. In addition, in the packaging material 2, the portion where the first contact surface 2A and the fourth contact surface 2D intersect within the recess 20 is formed as an inside corner portion 2AD. In addition, in the packaging material 2, the portion where the second contact surface 2B and the third contact surface 2C intersect within the recess 20 is formed as an inside corner portion 2BC. In addition, in the packaging material 2, the portion where the second contact surface 2B and the fourth contact surface 2D intersect within the recess 20 is formed as an inside corner portion 2BD.
[0022] The packaging material 3 is obtained by inverting the above-mentioned packaging material 2 in the second direction Y, and has a symmetrical structure to the packaging material 2. Therefore, the same parts as those in the packaging material 2 are given the same reference numerals, and the description of the packaging material 3 is omitted.
[0023] The connecting portion 4 connects the packaging material 2 and the packaging material 3. The connecting portion 4 connects an end of the first circumferential surface 21 forming the opening end of the recess 20 in the packaging material 2 and an end of the first circumferential surface 21 forming the opening end of the recess 20 in the packaging material 3 in the second direction Y, and is formed continuously along the first direction X. The connecting portion 4 has a linear fold line 4a formed by a groove formed along the first direction X. The connecting portion 4 can be deformed based on the linear fold line 4a. In the packaging body 1, the packaging material 2 and the packaging material 3 change into a first position and a second position described later due to the deformation of the connecting portion 4.
[0024] 2 to 6 are process diagrams of the packing method according to the embodiment, and Fig. 7 is a flow chart of the packing method according to the embodiment.
[0025] In the packaging structure of the embodiment, an electronic device 6 is applied as a packaged object to be packaged in the above-mentioned package 1. The electronic device 6 shown in Figs. 2 to 6 is a navigation device. The electronic device 6, which is a navigation device, has a housing 7 and a panel 8. The housing 7 houses electronic components that operate the navigation device and is formed in a rectangular parallelepiped shape. As shown in Fig. 2, the housing 7 has an upper surface 71 facing one side of the third direction Z, a front surface 72 facing one side of the first direction X, a back surface 73 facing the other side of the first direction X, a left side surface 74 facing one side of the second direction Y, a right side surface 75 facing the other side of the second direction Y, and a lower surface 76 facing the other side of the third direction Z, according to the packaging state. As shown in Fig. 2, the panel 8 is attached to the upper surface 71 of the housing 7 and provided facing one side of the third direction Z, according to the packaging state. The panel 8 is used as a display panel or an operation panel. When the electronic device 6 is normally used as a navigation device, it is attached to the vehicle so that the top surface 71 of the housing 7 on which the panel 8 is provided faces the front, which is used.
[0026] In a packaging method for packaging an object to be packaged, such as electronic device 6, with packaging body 1, packaging body 1 is placed in a first position on a flat upper surface G of a workbench, as shown in Fig. 2. The first position of packaging body 1 is the form shown in Fig. 1 in which packaging material 2 and packaging material 3 are separated at connecting portion 4 so as to open up, and the opening of recess 20 is opened toward one side of third direction Z.
[0027] Here, as shown in FIG. 2, the package 1 has a rounded portion 2E formed at a corner portion where the first peripheral surface 21 and the second peripheral surface 22 intersect on the outside of the package 2. As shown in FIG. 2, the package 1 has a rounded portion 2E formed at a corner portion where the first peripheral surface 21 and the second peripheral surface 22 intersect on the outside of the package 3. Each rounded portion 2E is a portion that contacts the flat upper surface G of the workbench, and is a portion that is configured in such a shape that the frictional resistance with the upper surface G is small. As shown in FIG. 2 to FIG. 4, when viewed from the first direction X1, the connecting portion 4 is on one side of the third direction Z1, and each rounded portion 2E is located on the other side of the third direction Z1 with respect to the position of this connecting portion 4. The package 1 has a structure in which the connecting portion 4 is on the top and each rounded portion 2E is on the bottom, which is the third direction Z1, and only each rounded portion 2E contacts the upper surface G of the workbench. 2 to 4, the packaging body 1 has a structure in which the round portions 2E are located separately on both sides of the connecting portion 4 in the second direction Y1 when viewed from the first direction X1. Also, as shown in Figs. 2 to 4, the packaging body 1 has a structure in which the outer structure (periphery surfaces 21, 22, 23, 24) of each of the packaging materials 2 and 3 does not exist on the other side of the connecting portion 4 in the third direction Z1 when viewed from the first direction X1.
[0028] Thus, in the packing method according to the embodiment, first, the packaging body 1 is placed in a first position on the flat upper surface G of a workbench. In this first position, in the packaging body 1, the opening of the recess 20 of the packaging material 2 faces one side of the third direction Z1, the opening of the recess 20 of the packaging material 3 faces one side of the third direction Z1, and the connecting portion 4 is located at the opening end of the recess 20 of each of the packaging materials 2 and 3. On the other hand, in the packing method according to the embodiment, the electronic device 6 is placed with the panel 8 facing upward and the bottom surface 76 of the housing 7 located furthest on the other side of the third direction Z1.
[0029] When the electronic device 6 is brought close to the packaging body 1 in the first position, as shown in FIG. 2, the lower surface 76 of the housing 7 may come into contact with the connecting portion 4 of the packaging body 1, but the pair of packaging materials 2, 3 are in positions where the contact surfaces 2A, 2B, 2C, 2D do not come into contact with the multiple surfaces (upper surface 71, front surface 72, rear surface 73, left side surface 74, right side surface 75, and lower surface 76) of the housing 7. That is, the first position is a position where the pair of packaging bodies 2, 3 do not come into contact with the multiple surfaces (upper surface 71, front surface 72, rear surface 73, left side surface 74, right side surface 75, and lower surface 76) of the electronic device 6 at the contact surfaces 2A, 2B, 2C, 2D. Therefore, in the packaging method, the packaging body 1 is first put into such a first position (step S1 in FIG. 7). In this first position, as described above, the packaging body 1 has the connecting portion 4 on top, each round portion 2E on the bottom, and only each round portion 2E comes into contact with the upper surface G of the work table. In addition, in the first position, when the packaging body 1 is viewed from the first direction X1, the round portions 2E are located apart on both sides of the connecting portion 4 in the second direction Y1. In addition, in the first position, when the packaging body 1 is viewed from the first direction X1, the outer structures (peripheral surfaces 21, 22, 23, 24) of the packaging materials 2 and 3 are not present below the connecting portion 4.
[0030] Thereafter, in the packing method according to the embodiment, as shown in step S2 in FIGS. 2, 3, and 7, the electronic device 6 is pressed against the connecting portion 4 from the first position of the packaging body 1.
[0031] Thereafter, in the packaging method according to the embodiment, as shown in step S3 in Fig. 3, Fig. 4, Fig. 5 and Fig. 7, the connecting portion 4 is pushed by the weight of the electronic device 6 or an external load, and the connecting portion 4 in the first position becomes a force point, each round portion 2E moves to both sides of the connecting portion 4 in the second direction Y1 and becomes a fulcrum, and the contact surfaces 2A, 2B, 2C, 2D become a point of action (surface). In this second position, the packaging body 1 is changed to a second position in which the contact surfaces 2A, 2B, 2C, 2D abut against a plurality of surfaces (here, the front surface 72, the back surface 73, the left side surface 74, the right side surface 75, and the bottom surface 76) so as to sandwich the housing 7 of the electronic device 6 between the pair of packaging materials 2, 3, as described above. Even in this second position, the connecting portion 4 of the packaging body 1 is on the top, each round portion 2E is on the bottom, and each round portion 2E is in contact with the top surface G of the work table. Also in the first position, when the packaging body 1 is viewed from the first direction X1, the round portions 2E are located apart on both sides of the connecting portion 4 in the second direction Y1. Also in the first position, when the packaging body 1 is viewed from the first direction X1, the outer structures (peripheral surfaces 21, 22, 23, 24) of the packaging materials 2 and 3 are not present below the connecting portion 4.
[0032] Specifically, in step S3, the connecting portion 4 of the packaging body 1 is pushed in the other direction (downward) in the third direction Z1 by the underside 76 of the housing 7 of the electronic device 6, so that the pair of packaging materials 2, 3 rise up with the connecting portion 4 as a base point, as shown in Fig. 3. Furthermore, in the packaging body 1, the connecting portion 4 is pushed in the other direction in the third direction Z1 by the underside 76 of the housing 7 of the electronic device 6, so that the corner formed by the front surface 72, left side surface 74, and underside 76 of the housing 7 and the corner formed by the back surface 73, left side surface 74, and underside 76 of the housing 7 fit into the recess 20 of the packaging material 2, as shown in Figs. 4 and 5. Similarly, in the packaging body 1, the connecting portion 4 is pushed in the other direction in the third direction Z1 by the underside 76 of the housing 7 of the electronic device 6, so that the corner formed by the front side 72, right side 75, and underside 76 of the housing 7 and the corner formed by the back side 73, right side 75, and underside 76 of the housing 7 enter the recess 20 of the packaging material 3 as shown in Figures 4 and 5. Then, finally, in the packaging body 1, the connecting portion 4 is pushed in the other direction in the third direction Z1 by the underside 76 of the housing 7 of the electronic device 6, so that the pair of packaging materials 2, 3 sandwich the housing 7 of the electronic device 6, and the abutment surfaces 2A, 2B, 2C, 2D change position to a position where they abut against multiple surfaces (the front side 72, the back side 73, the left side side 74, the right side 75, and the underside 76). Specifically, the packaging body 1 changes its posture to the second posture in the packaging material 2 such that the third abutment surface 2C and the fourth abutment surface 2D facing each other among the abutment surfaces are aligned along the front surface 72 and rear surface 73 of the housing 7, while the first abutment surface 2A and the second abutment surface 2B facing the combined direction of the second direction Y1 and the third direction Z1 in the first posture are aligned along the left side surface 74 and bottom surface 76 of the housing 7. Also, the packaging body 1 changes its posture to the second posture in the packaging material 3 such that the third abutment surface 2C and the fourth abutment surface 2D facing each other among the abutment surfaces are aligned along the front surface 72 and rear surface 73 of the housing 7, while the first abutment surface 2A and the second abutment surface 2B facing the combined direction of the second direction Y1 and the third direction Z1 in the first posture are aligned along the right side surface 75 and bottom surface 76 of the housing 7. When changing from the first position to the second position, the round portions 2E of the pair of packaging materials 2, 3 come into contact with the upper surface G of the work table, so that the position change is smooth.In the second position of the package 1, the connecting portion 4 is always pushed toward the other side (downward) of the third direction Z1 by the action of the gravity of the electronic device 6, so that the force of the pair of packaging materials 2, 3 to sandwich the electronic device 6 always acts by the action of the gravity of the electronic device 6. In other words, the package 1 can always generate the force of the pair of packaging materials 2, 3 to sandwich the electronic device 6 as long as there is the gravity of the electronic device 6. In the state in which the electronic device 6 is sandwiched, each round portion 2E is in a fully open state, but each round portion 2E is away from the connecting portion 4 and the connecting portion 4 is not in contact with the flat upper surface G of the workbench, so that the clamping force based on the principle of leverage is always applied. In this way, the package 1 has a structure in which the connecting portion 4 is pushed by the weight of the electronic device 6 or an external load, and the connecting portion 4 moves to the other side (downward) of the third direction Z1, so that each round portion 2E becomes a fulcrum, and a rotational moment is always likely to be generated in each of the packaging materials 2, 3 around the connecting portion 4.
[0033] Thereafter, as shown in FIG. 6 and step S4 in FIG.
[0034] The packaging box 10 is a box in which the package 1 sandwiched between a pair of packaging materials 2 and 3 together with the electronic device 6 is housed, and is made of corrugated cardboard. The packaging box 10 in the embodiment mainly has a square tube-shaped tubular portion 10A extending in the third direction Z1 so as to surround the electronic device 6 and the package 1 on all four sides in the first direction X1 and the second direction Y1, and a bottom portion 10B that closes the lower opening 10Ab of the tubular portion 10A. The electronic device 6 and the package 1 are inserted from the upper opening 10Aa of the tubular portion 10A toward the bottom portion 10B with the package 1 facing down. The electronic device 6 is surrounded by a square tube-shaped interference portion 10G extending in the third direction Z1 so as to surround the panel surface 8 of the panel on all four sides in the first direction X1 and the second direction Y1.
[0035] The packaging box 10 also has an outer lid portion 10C extending from one side of the upper opening 10Aa of the tube portion 10A. The outer lid portion 10C is bent 90° from one side of the upper opening 10Aa to cover the entire upper opening 10Aa of the tube portion 10A with the outer lid main body piece 10Ca, and the insertion piece 10Cb at the tip bent 90° is inserted into the inside of the tube portion 10A to match the other side of the upper opening 10Aa on the opposite side to close the upper opening 10Aa of the tube portion 10A. Although not shown in the figure, the outer lid portion 10C has a bent edge on each side of the upper opening 10Aa of the tube portion 10A other than one side and the other side, and this bent edge also covers the entire upper opening 10Aa of the tube portion 10A.
[0036] The packaging box 10 also has an inner lid portion 10D extending from the other side of the upper opening 10Aa of the tube portion 10A. The inner lid portion 10D has a folded back piece 10Da folded back from the other side of the upper opening 10Aa, and an inner lid body piece 10Db folded 90° at the end of the folded back piece 10Da to cover one side of the third direction Z1 of the interference portion 10G. The inner lid portion 10D forms a main storage section 10E in which the electronic device 6 and the package 1 are stored on the other side of the third direction Z1 where the inner lid body piece 10Db abuts against the upper part of the interference portion 10G and stays there, and forms an auxiliary storage section 10F in which accessories of the electronic device 6 are stored between the inner lid body piece 10Db and the outer lid body piece 10Ca on one side of the third direction Z1 where the inner lid body piece 10Db abuts against the upper part of the interference portion 10G and stays there.
[0037] The electronic device 6 and the package 1 are housed in the packaging box 10. The package 1 acts as a buffer to protect the electronic device 6 housed in the packaging box 10 when the electronic device 6 is transported.
[0038] When the package 1 is housed in the packaging box 10 together with the electronic device 6, it is lifted from the upper surface G of the workbench. At this time, it is preferable that the package 1 is configured so that it does not easily come off from the electronic device 6. In this case, for example, the package 1 is configured so that the contact surfaces 2A, 2B, 2C, and 2D of the pair of packaging materials 2 and 3 come into contact with multiple surfaces (front surface 72, rear surface 73, left side surface 74, right side surface 75, and bottom surface 76) of the housing 7 of the electronic device 6 so as to generate friction. On the other hand, it is preferable that the package 1 is configured so that when the electronic device 6 is taken out of the packaging box 10, it remains in the packaging box 10 and easily comes off from the electronic device 6. In this case, for example, the package 1 is configured so that the contact surfaces 2A, 2B, 2C, and 2D of the pair of packaging materials 2 and 3 come into contact with multiple surfaces (front surface 72, rear surface 73, left side surface 74, right side surface 75, and bottom surface 76) of the housing 7 of the electronic device 6 so as not to generate friction.
[0039] FIG. 8 is a perspective view of a modified example of the package in the packaging structure according to the embodiment.
[0040] As shown in FIG. 8, the packaging body 1 may further include a locking portion 5 in addition to the above-mentioned configuration. The locking portion 5 forms, for example, a protrusion 5A protruding from the opening of the recess 20 in the packaging material 3 in the first position in the vicinity of the connecting portion 4 in one of the third directions Z1. On the other hand, the locking portion 5 forms a hole 5B recessed from the opening of the recess 20 in the packaging material 2 in the first position. Then, when the packaging body 1 reaches the second position, the protrusion 5A enters the hole 5B, so that the pair of packaging materials 2, 3 engage with each other. Therefore, the packaging body 1 is maintained in the second position. Therefore, by including the locking portion 5, the packaging body 1 can maintain a form that protects the electronic device 6.
[0041] Fig. 9 is a perspective view of another embodiment of the packaging body in the packaging structure according to the embodiment. Fig. 10 is a process diagram of a packaging method using the packaging body of the other embodiment according to the embodiment. Fig. 11 is a process diagram of a packaging method using the packaging body of the other embodiment according to the embodiment.
[0042] 9 differs from the above-described packaging body 1 in that the fourth circumferential surface 24 is not provided on the pair of packaging materials 2, 3. That is, the packaging body 11 does not have a fourth abutment surface 2D on the packaging material 2. Moreover, the packaging body 11 does not have a fourth abutment surface 2D on the packaging material 3. Since the other configurations of the packaging body 11 are the same as those of the packaging body 1, the same reference numerals as those of the packaging body 1 are used for equivalent parts and the description thereof will be omitted.
[0043] This packaging body 11 can be applied to an electronic device 6' to be packaged as shown in Figs. 10 and 11. In the electronic device 6', the panel 8 of the electronic device 6 is omitted from the illustration, and the housing 7 formed in a rectangular parallelepiped shape has an upper surface 71 facing one side of the third direction Z1, a front surface 72 facing one side of the first direction X1, a back surface 73 facing the other side of the first direction X1, a left side surface 74 facing one side of the second direction Y1, a right side surface 75 facing the other side of the second direction Y1, and a bottom surface 76 facing the other side of the third direction Z1. The housing 7 of this electronic device 6' is larger than that of the electronic device 6 described above. The packaging body 1 for packaging the electronic device 6 described above was configured to abut five surfaces (the front surface 72, the back surface 73, the left side surface 74, the right side surface 75, and the bottom surface 76) of the housing 7 by itself, but this may be difficult in the case of a relatively large housing 7 such as the electronic device 6'.
[0044] Therefore, as shown in Figure 9, a pair of packaging materials 2, 3 have three surfaces, a first abutment surface 2A, a second abutment surface 2B, and a third abutment surface 2C, and one packaging body 11 is configured to abut against four surfaces of the housing 7 (the back surface 73, the left side surface 74, the right side surface 75, and the bottom surface 76), while the other packaging body 11 is configured to abut against four surfaces of the housing 7 (the front surface 72, the left side surface 74, the right side surface 75, and the bottom surface 76), thereby abutting a total of five surfaces of the housing 7 (the front surface 72, the back surface 73, the left side surface 74, the right side surface 75, and the bottom surface 76).
[0045] With this configuration, even relatively large objects can be packaged using the same structure.
[0046] FIG. 12 is a side view of another form of the packaging body in the packaging structure according to the embodiment.
[0047] The object to be packed shown in Figure 12 is, for example, a vase 6". The vase 6" has an outer shape that is roughly cylindrical, and its outer peripheral surface 77 forms a curved surface that faces in multiple directions of 360° around the vase 6" in the horizontal direction including the first direction X1 and the second direction Y1, and also has a bottom surface 78 that faces the other side of the third direction Z1 (downward in Figure 12).
[0048] For such a vase 6", the packaging body 12 of this packaging structure comprises a pair of packaging materials 2, 3 that can abut against multiple surfaces 77, 78 of the vase 6" to be packaged, and a connecting portion 4 that connects the pair of packaging materials 2, 3. When the vase 6" is pressed against the connecting portion 4, the pair of packaging materials 2, 3 change their position from a first position (not shown) in which the abutment surfaces 2F that run along the multiple surfaces 77, 78 of the vase 6" are not abutting, to a second position in which the abutment surfaces 2F abut against the multiple surfaces 77, 78 so as to sandwich the vase 6", as shown in Figure 12.
[0049] The packaging structure of the above-described embodiment includes a pair of packaging materials 2, 3 each having abutment surfaces 2A, 2B, 2C, 2D, 2F that can abut against a plurality of surfaces 72, 73, 74, 75, 76, 77, 78 of an electronic device 6, 6′ or a vase 6″ to be packaged, a connecting portion 4 that connects the pair of packaging materials 2, 3, and a round portion 2E that is provided on the outside of the pair of packaging materials 2, 3, contacts the upper surface G when placed on an upper surface G of a workbench, is below the connecting portion 4, and is positioned apart on both sides of the connecting portion 4. When the electronic device 6, 6' or the vase 6" is pressed against the connecting portion 4, the connecting portion 4 becomes the force point, each round portion 2E becomes the fulcrum, and the pair of packaging materials 2, 3 become the point of action, and the position is changed from a first position in which the abutting surfaces 2A, 2B, 2C, 2D, 2F do not abut against the multiple surfaces 72, 73, 74, 75, 76, 77, 78 of the electronic device 6, 6' or the vase 6" to a second position in which the abutting surfaces 2A, 2B, 2C, 2D, 2F abut against the multiple surfaces 72, 73, 74, 75, 76, 77, 78 so as to sandwich the electronic device 6, 6' or the vase 6".
[0050] According to this packaging structure, by pressing the electronic device 6, 6' or the vase 6" against the connecting portion 4, the pair of packaging materials 2, 3 change their position to sandwich the electronic device 6, 6' or the vase 6", making it possible to perform the packaging work easily and reliably and improving workability. Moreover, according to this packaging structure, it is possible to automate the packaging work.
[0051] In addition, in the packaging structure of the embodiment, the object to be packaged consists of electronic devices 6, 6' and has a rectangular parallelepiped housing 7, and the pair of packaging materials 2, 3 have abutment surfaces 2A, 2B, 2C, 2D formed in each recess 20 that receives the corners of the housing 7, and in the first position, the pair of packaging materials 2, 3 have each abutment surface 2A, 2B, 2C, 2D inclined relative to each surface 72, 73, 74, 75, 76 of the housing 7, and in the second position, each abutment surface 2A, 2B, 2C, 2D changes to a position along each surface 72, 73, 74, 75, 76 of the housing 7.
[0052] According to this packaging structure, the pair of packaging materials 2, 3 are configured to change from a first position in which the contact surfaces 2A, 2B, 2C, 2D are not in contact with the surfaces 72, 73, 74, 75, 76 to a second position in which the contact surfaces 2A, 2B, 2C, 2D are aligned with the surfaces 72, 73, 74, 75, 76, for the rectangular parallelepiped housing 7 of the electronic device 6, 6'. Therefore, this packaging structure can improve the workability of packaging the rectangular parallelepiped housing 7 of the electronic device 6, 6'.
[0053] In addition, in the packaging structure of the embodiment, the connecting portion 4 is formed in a linear shape so as to be deformable so as to change the pair of packaging materials 2, 3 between a first position and a second position, and is arranged perpendicular to at least one of the abutment surfaces 2A, 2B, 2C, 2D.
[0054] According to this packaging structure, the connecting portion 4 against which the rectangular parallelepiped housing 7 of the electronic device 6, 6' is pressed is positioned perpendicular to at least one of the contact surfaces 2A, 2B, 2C, 2D, making it easier to align the pressing position of the housing 7 with the connecting portion 4, thereby further improving the workability of packaging the rectangular parallelepiped housing 7 of the electronic device 6, 6'.
[0055] Moreover, the navigation system of the embodiment includes a navigation device (electronic device 6, 6') and the above-mentioned package 1, 11 for packaging the navigation device.
[0056] According to this navigation system, the workability of packing the navigation device (electronic device 6, 6') is improved, and the navigation device can be packed reliably.
[0057] In addition, the packaging method of the embodiment uses a pair of packaging materials 2, 3 having contact surfaces 2A, 2B, 2C, 2D, 2F that can contact multiple surfaces 72, 73, 74, 75, 76, 77, 78 of an electronic device 6, 6' or a vase 6" to be packaged, a connecting portion 4 that connects the pair of packaging materials 2, 3, and a round portion 2E that is provided on the outside of the pair of packaging materials 2, 3, contacts the upper surface G when placed on an upper surface G of a workbench, and is located below the connecting portion 4 and spaced apart on both sides of the connecting portion 4, and packs the pair of packaging materials 2, 3 into the electronic device 6, 6' or the vase 6" the steps of placing the packaging body 1, 11, 12 on the upper surface G in a first position in which the abutting surfaces 2A, 2B, 2C, 2D, 2F are not abutting the multiple surfaces 72, 73, 74, 75, 76, 77, 78 of the packaging material 1, 11, 12; pressing the electronic device 6, 6' or the vase 6" against the connecting portion 4 from the first position; and changing the position to a second position in which the abutting surfaces 2A, 2B, 2C, 2D, 2F abut against the multiple surfaces 72, 73, 74, 75, 76, 77, 78 so that the electronic device 6, 6' or the vase 6" sandwiches the electronic device 6, 6' or the vase 6" between the pair of packaging materials 2, 3.
[0058] According to this packing method, by pressing the electronic device 6, 6' or the vase 6" against the connecting portion 4, the pair of packing materials 2, 3 changes its position so as to sandwich the electronic device 6, 6' or the vase 6", making the packing work easier and improving workability. Moreover, according to this packing method, it is possible to automate the packing work.
[0059] The connecting portion 4 of the packaging structure of the embodiment may be formed so that the pair of packaging materials 2, 3 can rotate about the X-axis along the first direction X as the rotation axis, and may have a hinge structure or may be formed so that the pair of packaging materials are connected to each other by magnetic force and can rotate. [Explanation of symbols]
[0060] 1,11,12 Packaging 2 Packaging materials 2A,2B,2C,2D,2F Contact surface 2E Round section 20 Recess 3 Packaging materials 4 Connecting part 6,6' Electronic equipment (packaging subject) (navigation device) 6” Vase (packaging included) 7. Cabinet 72,73,74,75,76 sides 77,78 sides
Claims
1. a pair of packaging materials including a first packaging material and a second packaging material each having a contact surface capable of contacting a plurality of surfaces of an object to be packaged; a connecting portion that connects one end of the first packaging material and one end of the second packaging material and is deformable based on a fold line formed at a boundary between the first packaging material and the second packaging material; a pair of rounded portions provided on the outer sides of the packaging materials, which contact the upper surface of a flat work table when the packaging materials are placed on the upper surface, and which are located below the connecting portions and spaced apart on both sides of the connecting portions; Equipped with When the object to be packaged is pressed against the connecting portion while placed on the upper surface, the connecting portion changes its position from a first position in which the contact surfaces are not in contact with the multiple surfaces of the object to a second position in which the contact surfaces are in contact with the multiple surfaces so as to sandwich the object to be packaged, and in the first position and the second position, only the rounded portion comes into contact with the upper surface of the flat work table.
2. The object to be packed is an electronic device having a rectangular parallelepiped housing, The pair of packaging materials each have the contact surfaces formed in recesses that receive corners of the housing, 2. The packaging structure of claim 1, wherein in the first position, each of the abutment surfaces of the pair of packaging materials is inclined relative to each of the surfaces of the housing, and in the second position, each of the abutment surfaces changes to a position in which it is aligned with each of the surfaces of the corners of the housing.
3. 2. The packaging structure according to claim 1, wherein the connecting portion is formed linearly so as to be deformable so as to change the pair of packaging materials between the first position and the second position, and is arranged perpendicular to at least one of the abutment surfaces.
4. A packaging structure as described in claim 1, wherein the connecting portion is above the round portion even in the second position, and the connecting portion continues to be pressed by the object to be packaged, so that a clamping force is constantly applied to the object to be packaged by the pair of packaging materials.
5. A packaging structure as described in claim 1, wherein in the second position, the contact surface does not contact the upper surface of the object to be packaged, and when the object to be packaged is placed in a packaging box in the second position, only the object to be packaged can be pulled out of the packaging box.
6. an electronic device having a housing and a panel; a packaging body for packaging the housing of the electronic device; a packaging box that accommodates the electronic device and the package; Including, The packaging body is a pair of packaging materials including a first packaging material and a second packaging material, each having a contact surface that can contact a plurality of surfaces of the housing of the electronic device; a connecting portion that connects one end of the first packaging material and one end of the second packaging material and is deformable based on a fold line formed at a boundary between the first packaging material and the second packaging material; a pair of rounded portions provided on the outer sides of the packaging materials, which contact the upper surface of a flat work table when the packaging materials are placed on the upper surface, and which are located below the connecting portions and spaced apart on both sides of the connecting portions; Equipped with When the housing of the electronic device is pressed against the connecting portion in a state where the electronic device is placed on the upper surface, the connecting portion changes its position from a first position in which the contact surfaces are not in contact with the multiple surfaces of the housing of the electronic device to a second position in which the contact surfaces are in contact with the multiple surfaces so as to sandwich the housing of the electronic device, and in the first position and the second position, only the rounded portion contacts the upper surface of the flat work table, The packaging box houses the electronic device with the panel on top and the packaging body on the bottom.
7. a pair of packaging materials including a first packaging material and a second packaging material each having a contact surface capable of contacting a plurality of surfaces of an object to be packaged; a connecting portion that connects one end of the first packaging material and one end of the second packaging material and is deformable based on a fold line formed at a boundary between the first packaging material and the second packaging material; a pair of rounded portions provided on the outer sides of the packaging materials, which contact the upper surface of a flat work table when the packaging materials are placed on the upper surface, and which are located below the connecting portions and spaced apart on both sides of the connecting portions; Using a packaging body comprising: placing the pair of packaging materials on the upper surface of the packaging target in a first position in which the contact surfaces are not in contact with the plurality of surfaces of the packaging target; pressing the object to be packaged to the connecting portion from the first position; changing the posture to a second posture in which the abutting surfaces abut against the plurality of surfaces so that the pair of packaging materials sandwich the packaging object by the connecting portions being pushed and deformed by the packaging object, and in the first posture and the second posture, only the rounded portions abut against an upper surface of the flat work table; Including, packaging method.