Temperature control device for semiconductor manufacturing apparatus

Abstract

To provide a temperature control device for a semiconductor manufacturing apparatus capable of achieving temperature control for a thermal load quickly with good responsiveness in a temperature range from a low temperature side to a high temperature side, and suppressing a load on the environment.SOLUTION: Refrigeration circuits 1A and 1B are composed of a compressor 2, a delivery flow passage 3 for delivering a refrigerant from the compressor, a return flow passage 4 for returning the refrigerant after the temperature control to the compressor, first and second circulation flow passages 5 and 6 for circularly supplying the refrigerant to a thermal load W, switching circuits 10A and 10B for switching the circulation flow passage for delivering the refrigerant to the thermal load and the circulation flow passage for receiving it from the thermal load mutually between the first and second circulation flow passages by changing a communication state between the circulation flow passages, the delivery flow passage, and the return flow passage, a first expansion valve 5c provided in the first circulation flow passage, and a heat exchanger 7 connected between the first circulation flow passage and the switching circuits.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention particularly relates to a temperature control device for controlling the heat load in semiconductor manufacturing equipment to a predetermined temperature. [Background technology]

[0002] A widely known temperature control device for adjusting the thermal load of semiconductor manufacturing equipment or the like to a predetermined temperature is one disclosed in Patent Document 1, for example, which controls the constant temperature liquid flowing in a constant temperature liquid circulation circuit to a set temperature by heat exchange with a refrigerant flowing in a refrigeration circuit, and cyclically supplies the temperature-controlled constant temperature liquid to the thermal load, thereby adjusting the thermal load to a predetermined temperature.

[0003] Recently, with the miniaturization of semiconductor processes, there has been an urgent need to improve the precision and production efficiency of semiconductor manufacturing equipment. However, in conventional constant-temperature fluid circulation systems such as those described above, the temperature of the constant-temperature fluid is controlled by heat exchange with the refrigerant in the refrigeration circuit. Therefore, when the set temperature of the constant-temperature fluid is changed, it takes some time for the constant-temperature fluid to be stably controlled at the changed set temperature. Therefore, there is a need for a temperature control system that can quickly and responsively adjust the temperature of the heat load.

[0004] Furthermore, in semiconductor manufacturing equipment, temperature control over a wider range from low to high temperatures is required, and therefore, in conventional temperature control devices, fluorinated liquids have been suitably used as constant temperature liquids. However, in consideration of the burden on the environment, it is desirable to minimize the use of fluorinated liquids. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4582473 Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, the technical object of the present invention is to provide a temperature control device for semiconductor manufacturing equipment that is not only capable of more responsively and quickly adjusting the temperature of the heat load over a wide temperature range from low to high, but also capable of reducing the burden on the environment. [Means for solving the problem]

[0007] In order to solve the above technical problems, the present invention provides a temperature control device for controlling a thermal load in a semiconductor manufacturing device to a predetermined temperature, the temperature control device comprising: a refrigeration compressor that generates a high-temperature, high-pressure refrigerant; a delivery flow path connected to the compressor for delivering the refrigerant from the compressor; a return flow path connected to the compressor for returning the refrigerant to the compressor; first and second circulation flow paths each having a connection port connected to a thermal load for circulatingly supplying the refrigerant to the thermal load; a switching circuit that switches between the first and second circulation flow paths as a circulation flow path for delivering the refrigerant to the thermal load and a circulation flow path for receiving the refrigerant from the thermal load by changing a communication state between the first and second circulation flow paths and the delivery flow path and the return flow path; and a heat exchanger that has a refrigerant heat exchange flow path connecting the first circulation flow path and the switching circuit. a facility water circuit having a facility water heat exchange passage through which facility water flows to exchange heat with the refrigerant in the refrigerant heat exchange passage in the heat exchanger, and a facility water supply / discharge passage through which facility water is supplied / discharged to / from the facility water heat exchange passage; and a control unit having a processor that controls the refrigeration circuit and the facility water circuit; wherein the first circulation passage has an expansion valve that adiabatically expands the refrigerant, and the processor controls the switching circuit so that, when regulating the temperature of a heat load by cooling, the refrigerant is sent to the heat load from the connection port of the first circulation passage and receives refrigerant from the heat load through the connection port of the second circulation passage, and conversely, when regulating the temperature of the heat load by heating, the refrigerant is sent to the heat load from the connection port of the second circulation passage and receives refrigerant from the heat load through the connection port of the first circulation passage.

[0008] In the present invention, preferably, the switching circuit includes a first connecting flow path having a first flow control valve and connecting between the delivery flow path and the heat exchanger, a second connecting flow path having a second flow control valve and connecting between the delivery flow path and the second circulation flow path, a third connecting flow path having a third flow control valve and connecting between the second circulation flow path and the return flow path, and a fourth connecting flow path having a fourth flow control valve and connecting between the heat exchanger and the return flow path, and the processor, when switching the temperature regulation of the heat load from heating to cooling, controls the second flow control valve. The first to fourth flow control valves are controlled so that the refrigerant is sent to the heat load from the connection port of the first circulation flow path by continuously decreasing the openings of the control valve and the fourth flow control valve and continuously increasing the openings of the first flow control valve and the third flow control valve, and conversely, when the temperature regulation of the heat load is switched from cooling to heating, the first to fourth flow control valves are controlled so that the refrigerant is sent to the heat load from the connection port of the second circulation flow path by continuously decreasing the openings of the first flow control valve and the third flow control valve and continuously increasing the openings of the second flow control valve and the fourth flow control valve.

[0009] In the present invention, preferably, the return flow path has a first temperature sensor and a first pressure sensor, and the facility water supply / discharge flow path has a facility water control valve, and the processor calculates the superheat degree of the refrigerant based on the refrigerant temperature detected by the first temperature sensor and the refrigerant pressure detected by the first pressure sensor, and controls the facility water control valve so that, when the heat load is being temperature-adjusted by heating, the superheat degree of the refrigerant is lower than a first set superheat degree, the opening of the facility water control valve is increased, and conversely, the opening of the facility water control valve is decreased when the superheat degree of the refrigerant is higher than a second set superheat degree that is the same as or higher than the first set superheat degree.

[0010] Preferably, the discharge flow path has a second pressure sensor, and the facility water supply / discharge flow path has a facility water control valve, and the processor controls the facility water control valve so that, when the heat load is being temperature-regulated by cooling, the pressure of the refrigerant detected by the second pressure sensor is higher than a first set pressure, the opening of the facility water control valve is increased, and conversely, when the pressure of the refrigerant is lower than a second set pressure that is the same as or smaller than the first set pressure, the opening of the facility water control valve is decreased.

[0011] Furthermore, in the present invention, it is preferable that a cooling flow path for supplying a refrigerant for cooling the compressor to the compressor is branched from the first circulation flow path and connected to the compressor. Here, more preferably, the cooling flow path has a first branch flow path branched from a position closer to the heat exchanger than the expansion valve and having a first on / off control valve, a second branch flow path branched from a position closer to the connection port of the first circulation flow path than the expansion valve and having a second on / off control valve, and an injection valve for adiabatically expanding the refrigerant, and these first branch flow path and second branch flow path are connected to the compressor through the injection valve, and the processor controls the first and second on / off control valves so that when the temperature of the heat load is being regulated by cooling, the first on / off control valve is opened and the second on / off control valve is closed, and conversely, when the temperature of the heat load is being regulated by heating, the processor controls the first and second on / off control valves so that when the temperature of the heat load is being regulated by cooling, the processor closes the first on / off control valve and opens the second on / off control valve. Furthermore, more preferably, the discharge flow path has a second temperature sensor that detects the temperature of the refrigerant discharged from the compressor, and the processor controls the injection valve so as to increase the opening of the injection valve when the temperature of the refrigerant detected by the second temperature sensor is higher than a first set temperature, and conversely, to decrease the opening of the injection valve when the temperature of the refrigerant is lower than a second set temperature that is the same as or lower than the first set temperature.

[0012] In the present invention, preferably, the first and second circulation flow paths each have an emergency shut-off valve that shuts off the refrigerant from entering or leaving the circulation flow paths through the connection ports in an emergency, and the emergency shut-off valve is a normally closed solenoid valve. Also preferably is the above The temperature control device has a third temperature sensor for detecting the temperature of the heat load, and the processor controls the expansion valve so that, when the temperature of the heat load detected by the third temperature sensor is higher than a first heat load set temperature, the opening of the expansion valve is increased, and conversely, when the temperature of the heat load is lower than a second heat load set temperature that is the same as or smaller than the first heat load set temperature, the opening of the expansion valve is decreased. Further, preferably, the return flow path has a first temperature sensor and a first pressure sensor, and the processor calculates a degree of superheat of the refrigerant based on the temperature of the refrigerant detected by the first temperature sensor and the pressure of the refrigerant detected by the first pressure sensor, and when the degree of superheat of the refrigerant is lower than a third set degree of superheat in a state in which the temperature of the heat load is adjusted by heating, the processor adjusts the opening degree of the expansion valve to decrease On the other hand, the degree of superheat of the refrigerant is set to a fourth set degree of superheat that is equal to or greater than the third set degree of superheat. degree of superheating If the opening of the expansion valve is higher than Increase The expansion valve is controlled so as to [Effects of the Invention]

[0013] According to the temperature control device for semiconductor manufacturing equipment of the present invention, a refrigerant whose temperature is controlled to a low or high temperature by a refrigeration circuit can be selectively supplied directly to the thermal load of the semiconductor manufacturing equipment to regulate the temperature of the thermal load.This not only makes it possible to regulate the temperature of the thermal load more responsively and quickly over a wide temperature range from low to high, but also makes it possible to minimize the burden on the environment. [Brief explanation of the drawings]

[0014] [Figure 1]1 is a circuit diagram of a temperature adjustment device for semiconductor manufacturing equipment according to a first embodiment of the present invention, showing a state in which the temperature of the semiconductor manufacturing equipment is adjusted by cooling the heat load. [Figure 2] 1 is a circuit diagram of a temperature adjustment device for semiconductor manufacturing equipment according to a first embodiment of the present invention, showing a state in which the temperature of the semiconductor manufacturing equipment is adjusted by heating the heat load. [Figure 3] FIG. 10 is a circuit diagram of a temperature adjustment device for semiconductor manufacturing equipment according to a second embodiment of the present invention, showing a state in which the temperature of the semiconductor manufacturing equipment is adjusted by cooling the heat load. [Figure 4] FIG. 10 is a circuit diagram of a temperature adjustment device for semiconductor manufacturing equipment according to a second embodiment of the present invention, showing a state in which the temperature of the thermal load of the semiconductor manufacturing equipment is adjusted by heating. DETAILED DESCRIPTION OF THE INVENTION

[0015] 1 and 2 show a first embodiment of a temperature control device for semiconductor manufacturing equipment according to the present invention. This temperature control device T1 is used to control the temperature (hereinafter simply referred to as "temperature control") of a heat load W, such as a semiconductor wafer mounting stage, in semiconductor manufacturing equipment S by cooling or heating. The temperature control device T1 has a refrigeration circuit 1A for circulatingly supplying a temperature-controlled refrigerant to the heat load W of the semiconductor manufacturing equipment S, which is the temperature control target, a facility water circuit 20 for supplying facility water to the heat exchanger 7 provided in the refrigeration circuit 1A for heat exchange with the refrigerant of the refrigeration circuit 1A, and a control unit 8 including a processor 8a for controlling the refrigeration circuit and the facility water circuit 20. is low A heater capable of controlling the temperature over a wide range from low to high temperatures is preferably used.

[0016] The refrigeration circuit 1A has a refrigeration compressor 2 that generates a gas-phase refrigerant at high temperature and pressure, a delivery flow path 3 that is connected to the compressor 2 at one end and sends out the refrigerant generated by the compressor 2 from the compressor 2, a return flow path 4 that is connected to the compressor 2 at one end and returns the temperature-adjusted refrigerant sent back from a heat load W to the compressor 2, and connection ports 5a and 6a at one end each for connection to the heat load W, 6a The heat exchanger 7 has a first circulation flow path 5 and a second circulation flow path 6 for circulatingly supplying a refrigerant to a heat load W through the first circulation flow path 5 and the second circulation flow path 6, a switching circuit 10A for switching between the first and second circulation flow paths 5 and 6 as a circulation flow path for sending the refrigerant to the heat load W and a circulation flow path for receiving the refrigerant from the heat load W by changing the communication state between the first and second circulation flow paths 5 and 6 and the delivery flow path 3 and the return flow path 4, and a refrigerant heat exchange flow path 7a connecting the first circulation flow path 5 and the switching circuit 10A.

[0017] And the first circulation A first expansion valve 5c that adiabatically expands the refrigerant flowing through the flow path 5 is provided in the flow path 5. This first expansion valve 5c is electrically connected to the control unit 8, and its opening degree can be controlled by the processor 8a of the control unit 8. The refrigeration circuit 1A is also provided with a cooling passage 15 for supplying a refrigerant for cooling to the compressor 2. The cooling passage 15 is connected to the first circulation passage 5 is branched from and connected to the compressor 2.

[0018] The facility water circuit 20 flows tap water at room temperature or the like as facility water, and has a facility water heat exchange passage 21 that exchanges heat between the refrigerant in the refrigerant heat exchange passage 7a and the facility water in the heat exchanger 7, and facility water supply and discharge passages 22, 23 that supply and discharge the facility water to and from the facility water heat exchange passage 21.

[0019] In the temperature adjustment device T1 having such a configuration, the processor 8a controls the switching circuit 10A to change the communication state between the first and second circulation paths 5, 6 and the delivery path 3 and return path 4, so that when cooling the heat load W, the refrigerant discharged from the compressor 2 is cooled in the heat exchanger 7 serving as a condenser through the delivery path 3, and is adiabatically expanded by the first expansion valve 5c, and is supplied as a cooling refrigerant to the heat load W through the connection port 5a of the first circulation path 5, as shown in Fig. 1. Then, the refrigerant after regulating the temperature of the heat load W can be received through the connection port 6a of the second circulation path 6 and returned to the compressor 2 through the return path 4.

[0020] Conversely, when heating a heat load W, as shown in Fig. 2, the refrigerant discharged from the compressor 2 is supplied as a heating refrigerant to the heat load W from the connection port 6a of the second circulation flow path 6 through the delivery flow path 3. Then, the refrigerant after adjusting the temperature of the heat load W is received from the connection port 5a of the first circulation flow path 5, adiabatically expanded by the first expansion valve 5c, heated by the heat exchanger 7 serving as an evaporator, and returned to the compressor 2 through the return flow path 4. In addition Such switching control of the switching circuit 10A may be performed by a switching signal from the semiconductor manufacturing equipment S, or may be performed based on the detection results of various temperature sensors and pressure sensors provided in the temperature adjustment equipment T1 and the heat load W.

[0021] More specifically, the switching circuit 10A includes a first connection flow path 11 that connects the other end of the delivery flow path 3 to one end of the refrigerant heat exchange flow path 7a in the heat exchanger 7, a second connection flow path 12 that connects the other end of the delivery flow path 3 to the other end of the second circulation flow path 6, and a second connection flow path 13 that connects the other end of the second circulation flow path 6 to the return flow path 7b. 4 a third connecting flow path connecting the other end of the 13 a fourth connecting passage connecting one end of the refrigerant heat exchange passage 7a in the heat exchanger 7 to the other end of the return passage 4; 14 The connecting flow path is formed by connecting these four connecting flow paths in a ring shape.

[0022] The delivery flow path 3 has a second temperature sensor 3a that detects the temperature of the refrigerant delivered from the compressor 2, a second pressure sensor 3b that detects the pressure of the refrigerant, and a high-pressure cutoff pressure switch 3c that detects when the pressure of the refrigerant reaches a high-pressure threshold and stops operation of the temperature adjustment device T1. The return flow path 4 has a first temperature sensor 4a that detects the temperature of the refrigerant returned to the compressor 2 after being used to adjust the temperature of the heat load W, and a first pressure sensor 4b that detects the pressure of the refrigerant. The first and second temperature sensors 4a, 3a, the first and second pressure sensors 4b, 3b, and the high-pressure cutoff pressure switch 3c are all electrically connected to the control unit. Furthermore, a third temperature sensor 30 for detecting the temperature of the thermal load W is attached to the thermal load W of the semiconductor manufacturing equipment S, and the detected temperature at the temperature sensor 30 is transmitted to the control unit 8 by electrically connecting the third temperature sensor 30 to the control unit 8.

[0023] The first connecting flow path 11 of the switching circuit 10A has a first flow control valve 11a, and the second connecting flow path 12 has a second flow control valve 12a. And before The third connecting flow path 13 has a third flow control valve 13a, and the fourth connecting flow path 14 has a fourth flow control valve 14a. These flow control valves 11a, 12a, 13a, and 14a are electrically connected to the control unit 8, and the processor 8a of the control unit 8 controls the opening degrees of the flow control valves 11a, 12a, 13a, and 14, thereby making it possible to individually and continuously change the flow rates of the refrigerant flowing through the connecting flow paths 11, 12, 13, and 14.

[0024] The cooling flow path 15 includes a first branch flow path 16 branched from the first circulation flow path 5 at a position closer to the heat exchanger 7 (closer to the other end) than the first expansion valve 5c, a second branch flow path 17 branched from the first circulation flow path 5 at a position closer to the connection port 5a of the circulation flow path 5 (closer to one end) than the first expansion valve 5c, and a main flow path 18 having one end connected to the first branch flow path 16 and the second branch flow path 17 and the other end connected to the compressor 2. The cooling flow path 15 includes an injection valve 18a in the main flow path 18, and a portion of the high-pressure refrigerant that has been condensed into a liquid phase by cooling in the heat exchanger 7 or heating by the heat load W is diverted from the first circulation flow path 5 and converted into a gas-liquid two-phase refrigerant at a lower temperature and pressure by adiabatic expansion in the injection valve 18a, and then supplied to the compressor 2.

[0025] Here, the first branch flow path 16 has a first opening / closing control valve 16a made of an electromagnetic valve or the like, and the second branch flow path 17 The first and second on-off control valves 16a and 17a and the injection valve 18a are electrically connected to the control unit 8. The processor 8 of the control unit 8 a This makes it possible to selectively block or open the first branch flow path 16 by opening or closing the first on-off control valve 16a, to selectively block or open the second branch flow path 17 by opening or closing the second on-off control valve 17a, and to control the opening degree of the injection valve 18a.

[0026] The other end of the first circulation flow path 5 is connected to the other end of the refrigerant heat exchange flow path 7a, and a first emergency shutoff valve 5b consisting of an on / off control valve such as a solenoid valve is provided near a connection port 5a provided at one end of the first circulation flow path 5 as a safety measure. Similarly, the second circulation flow path 6 also has a second emergency shutoff valve 6b consisting of an on / off switching valve such as a solenoid valve near a connection port 6a provided at one end of the second circulation flow path 6 as a safety measure. Here, these first and second emergency shutoff valves 5b ,6b is electrically connected to the control unit 8, and in an emergency such as when the high-pressure cutoff pressure switch 3c is activated, the high-pressure cutoff pressure switch 6b is turned off (closed) to cut off the flow of refrigerant in the first and second circulation flow paths 5 and 6 (i.e., cut off the flow of refrigerant in and out of the connection ports 5a and 6a), thereby preventing the temperature adjustment device T1 from being disconnected from the heat load W In this embodiment, the first and second emergency shutoff circuits are configured to stop the circulation of the refrigerant between the first and second emergency shutoff circuits. Valve 5 b, 6b use normally closed solenoid valves so that they automatically turn off in the event of a power outage, etc.

[0027] Furthermore, in the facility water circuit 20, the facility water heat exchange passage 21 is arranged along the refrigerant heat exchange passage 7a. The facility water supply / discharge passages 22, 23 are composed of a supply passage 22 connected to one end of the facility water heat exchange passage 21 to supply the facility water to the heat exchanger 7, and a discharge passage 23 connected to the other end to discharge the facility water after heat exchange from the heat exchanger 7. At this time, when the refrigerant flows through the refrigerant heat exchange passage 7a from the compressor 2 side to the first circulation passage 5 side to function as a condenser (i.e., when the refrigerant is cooling the heat load W), the facility water supply / discharge passages 22, 23 are arranged in the opposite direction to the facility water heat exchange passage 21. 21 The facility water heat exchange flow path is provided so that the facility water flows through the 21 is connected to

[0028] Here, the supply flow path 22 is a heat exchanger. vessel The exhaust flow path 23 has a fourth temperature sensor 22a for detecting the temperature of the facility water supplied to the heat exchanger 7. vessel The fourth temperature sensor 22a and the fifth flow control valve 23a are electrically connected to the control unit 8. The processor 8a of the control unit 8 controls the opening of the fifth flow control valve 23a, thereby adjusting the flow rate of the facility water flowing through the facility water circuit 20.

[0029] Next, the operation of the temperature adjusting device T1 will be specifically described with reference to FIGS. 1 and 2, the hatched flow control valves indicate a substantially closed state or a completely closed state (hereinafter, both states are collectively referred to as the "closed state"), and the unshaded flow control valves indicate a substantially open state or a completely open state (hereinafter, both states are collectively referred to as the "open state"). Furthermore, the hatched opening / closing control valves indicate an OFF state (closed state), and the unshaded opening / closing control valves indicate an ON state (open state).

[0030] 1 shows a state (cooling mode) in which the temperature of the heat load W is regulated by cooling. In this cooling mode, the processor 8a controls the switching circuit 10A so that the first flow control valve 11a of the first connection flow path 11 is in the "open state," the second flow control valve 12a of the second connection flow path 12 is in the "closed state," the third flow control valve 13a of the third connection flow path 13 is in the "open state," and the fourth flow control valve 14a of the fourth connection flow path 14 is in the "closed state." In addition, in the cooling flow path 15, the first opening / closing control valve 16a of the first branch flow path 16 is controlled to the ON state, and the second opening / closing control valve 17a of the second branch flow path 17 is controlled to the OFF state.

[0031] By controlling the switching circuit 10A in this manner, the high-temperature, high-pressure gas-phase refrigerant discharged from the compressor 2 passes through the delivery flow path 3 and the first connecting flow path 11 in sequence and is guided to the refrigerant heat exchange flow path 7a, and the refrigerant undergoes heat exchange. vessel The refrigerant is condensed by cooling in the cooling passage 7 and becomes a high-pressure liquid-phase refrigerant, and is then guided to the first circulation passage 5. Then, a part of the refrigerant guided to the first circulation passage 5 is diverted to the first branch passage 16 of the cooling passage 15 and guided to the main passage 18, where it becomes a gas-liquid two-phase refrigerant at a lower temperature and pressure due to adiabatic expansion in the injection valve 18a, and is used to cool the compressor 2. circulationThe remainder of the refrigerant introduced into flow path 5 is adiabatically expanded in first expansion valve 5c to become a gas-liquid two-phase refrigerant at a lower temperature and pressure, and is sent out through one connection port 5a to the thermal load W of semiconductor manufacturing equipment S to cool and regulate the temperature of the thermal load W. At that time, the refrigerant absorbs heat from the thermal load W and becomes a gas-phase refrigerant at a high temperature and low pressure.

[0032] After being used to regulate the temperature of the heat load W in this way, the refrigerant passes through the other connection port 6a, the second circulation flow path 6, and the third connection flow path in this order, and is guided to the return flow path 4 and returned to the compressor 2. Then, the gas phase refrigerant, which has been made higher in temperature and pressure by the compressor 2, is discharged again into the delivery flow path 3. By repeating this refrigerant reflux, a low-temperature refrigerant for cooling can be cyclically supplied to the heat load W.

[0033] 2 shows a state (heating mode) in which the temperature of the heat load W is adjusted by heating. In this heating mode, the processor 8a controls the switching circuit 10A so that the first flow control valve 11a of the first connection flow path 11 is in the "closed state," the second flow control valve 12a of the second connection flow path 12 is in the "open state," the third flow control valve 13a of the third connection flow path 13 is in the "closed state," and the fourth flow control valve 14a of the fourth connection flow path 14 is in the "open state." In addition, in the cooling flow path 15, the first opening / closing control valve 16a of the first branch flow path 16 is controlled to the OFF state, and the second opening / closing control valve 17a of the second branch flow path 17 is controlled to the ON state.

[0034] By controlling the switching circuit 10A in this manner, the high-temperature, high-pressure gas-phase refrigerant discharged from the compressor 2 passes sequentially through the delivery flow path 3 and the second connection flow path 12 and is guided to the second circulation flow path 6. The refrigerant guided to the second circulation flow path 6 is then sent out through the other connection port 6a to the heat load W of the semiconductor manufacturing equipment S and is used to heat and regulate the temperature of the heat load W. At this time, the refrigerant absorbs heat from the heat load W and is condensed, becoming a low-temperature, high-pressure liquid-phase refrigerant.

[0035] The refrigerant after being used to regulate the temperature of the heat load W in this way is introduced into the first circulation flow path 5 from the one connection port 5a. Then, a part of the refrigerant introduced into the first circulation flow path 5 is diverted to the second branch flow path 17 of the cooling flow path 15 and introduced into the main flow path 18, where it becomes a gas-liquid two-phase refrigerant at a lower temperature and pressure due to adiabatic expansion in the injection valve 18a, and is used to cool the compressor 2. On the other hand, the rest of the refrigerant introduced into the first flow path 5 is adiabatic expanded in the first expansion valve 5c, where it becomes a gas-liquid two-phase refrigerant at a lower temperature and pressure, and is introduced into the refrigerant heat exchange flow path 7a, where it vessel The refrigerant is heated in the fourth connecting flow path 14 and becomes a gas-phase refrigerant at a high temperature and low pressure, and is then guided to the return flow path 4 through the fourth connecting flow path 14 and returned to the compressor 2. The gas-phase refrigerant is then heated to a higher temperature and pressure in the compressor 2 and is discharged again into the delivery flow path 3. By repeating this reflux of the refrigerant, it is possible to cyclically supply the high-temperature refrigerant for heating to the heat load W.

[0036] In the refrigeration circuit 1A having such a switching circuit 10A, when switching from the heating mode shown in FIG. 2 to the cooling mode shown in FIG. 1, the openings of the second flow control valve 12a and the fourth flow control valve 14a are gradually and continuously decreased by the processor 8a. and Together, the first flow control valve 11a and the third flow control valve 13a are controlled so that the openings of these valves continuously and gradually increase. As a result, the pressure of the refrigerant in the first circulation flow path 5 gradually increases, and the flow rate of the heating refrigerant delivered from the connection port 6a of the second circulation flow path 6 to the heat load W gradually decreases. Then, when the second flow control valve 12a and the fourth flow control valve 14a are brought into the "closed state" and the first flow control valve 11a and the third flow control valve 13a are brought into the "open state," the flow direction of the refrigerant is reversed and the cooling refrigerant is delivered from the connection port 5a of the first circulation flow path 5 to the heat load W, thereby entering the cooling mode.

[0037] 1 to the heating mode shown in Fig. 2, the processor 8a controls the first flow control valve 11a and the third flow control valve 13a so that their apertures are continuously and gradually decreased, and the second flow control valve 12a and the fourth flow control valve 14a so that their apertures are continuously and gradually increased. This gradually increases the pressure of the refrigerant in the second circulation flow path 6, gradually decreasing the flow rate of the cooling refrigerant delivered to the heat load W from the connection port 5a of the first circulation flow path 5. When the first flow control valve 11a and the third flow control valve 13a are in the "closed state" and the second flow control valve 12a and the fourth flow control valve 14a are in the "open state," the flow direction of the refrigerant is reversed, and the heating refrigerant is delivered to the heat load W from the connection port 6a of the second circulation flow path 6, thereby entering the heating mode.

[0038] In this way, in the refrigeration circuit 1A, switching between the cooling mode and the heating mode is performed continuously and gradually by the four flow control valves, which makes it possible to suppress abrupt changes in the pressure and temperature of the refrigerant in the heat load W that occur when the mode is switched. As a result, it is possible to suppress abrupt expansion and contraction of the material that constitutes the heat load W, which would occur due to such abrupt changes in the pressure and temperature of the refrigerant, and it is possible to ensure processing precision in the semiconductor manufacturing equipment.

[0039] Furthermore, the temperature control device T1 for semiconductor manufacturing equipment according to this embodiment to In the above, the processor 8a of the control unit 8 controls the refrigeration circuit 1A of the temperature adjustment device T1 and the heat dissipation circuit 1B based on the output results of the various sensors and switches described above. water The circuit 20 is controlled as follows. First, the degree of superheat of the return refrigerant is calculated based on the temperature of the return refrigerant detected by the first temperature sensor 4a in the return flow path 4 and the pressure of the return refrigerant detected by the first pressure sensor 4b. In the heating mode, if the degree of superheat of the return refrigerant is lower than a first set degree of superheat, the fifth flow control valve 23a, which is the facility water control valve, is controlled to increase its opening, thereby increasing the degree of superheat of the return refrigerant returned to the compressor 2 through the return flow path 4. Conversely, if the degree of superheat of the refrigerant is higher than a second set degree of superheat, the fifth flow control valve 23a is controlled to decrease its opening, thereby decreasing the degree of superheat of the return refrigerant returned to the compressor 2 through the return flow path 4. Here, the second set degree of superheat is set to a value equal to or greater than the first set degree of superheat.

[0040] In the cooling mode, when the pressure of the refrigerant being sent out detected by the second pressure sensor 3b of the sending flow path 3 is higher than the first set pressure, the fifth flow control valve 23a is controlled to increase its opening, thereby decreasing the pressure of the refrigerant being discharged from the compressor 2. Conversely, when the pressure of the refrigerant being sent out is lower than the second set pressure, the fifth flow control valve 23a is controlled to decrease its opening, thereby increasing the pressure of the refrigerant discharged from the compressor 2. Here, the second set pressure is set to a value equal to or smaller than the first set pressure.

[0041] Furthermore, when the temperature of the refrigerant being delivered detected by the second temperature sensor 3a of the delivery flow path 3 is higher than the first set temperature, the injection valve 18a is controlled to increase its opening, thereby lowering the temperature of the compressor 2 and lowering the temperature of the refrigerant being discharged from the compressor 2. Conversely, when the temperature of the refrigerant being delivered is lower than the second set temperature, the injection valve 18a is controlled to decrease its opening, thereby increasing the temperature of the compressor 2 and increasing the temperature of the refrigerant discharged from the compressor 2. Here, the second set temperature is set to a value equal to or smaller than the first set temperature.

[0042] In the cooling mode, the third temperature sensor 30 When the temperature of the heat load W detected in is higher than the first heat load set temperature, the first expansion valve 5c is controlled to increase its opening, thereby decreasing the temperature of the heat load W. Conversely, when the temperature of the heat load W is lower than the second heat load set temperature, the first expansion valve 5c is controlled to decrease its opening, thereby increasing the temperature of the heat load W. Here, the second heat load set temperature is set to a value equal to or smaller than the first heat load set temperature.

[0043] Furthermore, in the heating mode, when the degree of superheat of the return refrigerant flowing through the return flow path 4 is lower than the third set degree of superheat, the first expansion valve 5c is controlled to decrease its opening degree, thereby increasing the degree of superheat of the return refrigerant returned to the compressor 2 through the return flow path 4. Conversely, when the degree of superheat of the return refrigerant in the return flow path 4 is lower than the fourth set degree of superheat, the first expansion valve 5c is controlled to decrease its opening degree. degree of superheating If the temperature is higher than the first set temperature, the first expansion valve 5c is controlled to increase its opening degree, thereby decreasing the superheat degree of the return refrigerant returned to the compressor 2 through the return flow path 4. Here, the fourth set superheat degree is set to a value equal to or greater than the third set superheat degree. Note that the third set superheat degree may be the same value as the first set superheat degree, and the fourth set superheat degree may be the same value as the second set superheat degree. Alternatively, the first to fourth set superheat degrees may all be the same value.

[0044] Next, a second embodiment of the temperature control device for semiconductor manufacturing equipment according to the present invention will be described with reference to Figures 3 and 4. However, here, the temperature control device of the first embodiment will be described. Place In order to avoid duplication, the same components as T1 and the associated effects will be given the same reference numerals in the figures and explanations will be omitted. The main difference between the temperature control device T2 of the second embodiment and the temperature control device T1 of the first embodiment is the switching circuit 10B and the presence or absence of a bypass flow path 9 that directly connects the switching circuit 10B and the first circulation flow path 5.

[0045] The switching circuit 10B in the temperature adjustment device T2 of the second embodiment has a four-way switching control valve 40 electrically connected to the control unit 8, a fifth connecting flow path 41 connecting the four-way switching control valve 40 and the heat exchanger 7, and a sixth connecting flow path 42 connecting the four-way switching control valve 40 and the return flow path 4. Here, the four-way switching control valve 40 has a first port 40a, a second port 40b, a third port 40c and a fourth port 40d The other end of the delivery flow path 3 is connected to the first port 40a, one end of the fifth connection flow path 41 is connected to the second port 40b and the other end is connected to the one end of the refrigerant heat exchange flow path 7a, one end of the sixth connection flow path 42 is connected to the third port 40c and the other end is connected to the other end of the return flow path 4, and the other end of the second circulation flow path 6 is connected to the fourth port 40d.

[0046] Furthermore, the four-way switching control valve 40 can be selectively switched by the processor 8a between a first switching state in which the first port 40a and the second port 40b and the third port 40c and the fourth port 40d are connected to each other, and a second switching state in which the first port 40a and the fourth port 40d and the second port 40b and the third port 40c are connected to each other.

[0047] Furthermore, one end of the bypass flow path 9 branches off from the fifth connection flow path 41, and the other end is connected to the first circulation flow path 5 at a position closer to the connection port 5a than the first expansion valve 5c and closer to the first expansion valve 5c than the first emergency shutoff valve 5b. The bypass flow path 9 is also provided with a second expansion valve 9a that adiabatically expands the refrigerant flowing through the flow path. The second expansion valve 9a is electrically connected to the control unit 8, and the opening degree of the second expansion valve 9a can be controlled by the processor 8a of the control unit 8.

[0048] In the temperature adjustment device T2 having such a configuration, the processor 8a controls the switching circuit 10B to change the communication state between the first and second circulation paths 5, 6 and the delivery path 3 and the return path 4, thereby selectively switching between a cooling mode (FIG. 3) in which the temperature of the heat load W is regulated by cooling, and a heating mode (FIG. 4) in which the temperature of the heat load W is regulated by heating. Specifically, the processor 8a selectively switches and controls the four-way switching control valve 40 of the switching circuit 10B to the first switching state or the second switching state, thereby selectively switching between the cooling mode in which the delivery path 3 and the first circulation path 5 are communicated with each other and the second circulation path 6 and the return path 4 are communicated with each other, and the heating mode in which the delivery path 3 and the second circulation path 6 are communicated with each other and the first circulation path 5 and the return path 4 are communicated with each other.

[0049] Next, the operation of the temperature adjusting device T2 will be specifically described with reference to FIGS. 3 and 4, the open / close control valves with diagonal lines indicate an OFF state (closed state), and the open / close control valves without diagonal lines indicate an ON state (open state).

[0050] 3 shows the operating state in the cooling mode in this embodiment. In this cooling mode, the processor 8a switches the four-way switching control valve 40 of the switching circuit 10B to the first switching state. In addition, in the cooling flow path 15, the first opening / closing control valve 16a of the first branch flow path 16 is controlled to the ON state, and the second opening / closing control valve 17a of the second branch flow path 17 is controlled to the OFF state.

[0051] By setting the four-way switching control valve 40 to the first switching state in this manner, the high-temperature, high-pressure gas-phase refrigerant discharged from the compressor 2 passes through the delivery flow path 3 and the fifth connecting flow path 41 in sequence and is led to the heat exchanger 7, and the heat exchange vesselThe refrigerant is condensed by cooling in the fifth connection passage 41 and guided to the first circulation passage 5. At this time, a portion of the refrigerant is diverted from the fifth connection passage 41 to the bypass passage 9, and is adiabatically expanded in the second expansion valve 9a to become a high-temperature, low-pressure gas-phase refrigerant, and is then directly introduced into the first circulation passage 5. On the other hand, as in the first embodiment, a portion of the refrigerant guided to the first circulation passage 5 through the heat exchanger 7 is used to cool the compressor 2 through the cooling passage 15. Then, the remaining refrigerant is adiabatically expanded in the first expansion valve 5c, and is sent to the heat load W through the one connection port 5a together with the refrigerant in the bypass passage 9, and is used to regulate the temperature of the heat load W by cooling.

[0052] After being used to regulate the temperature of the heat load W in this manner, the refrigerant passes through the other connection port 6a, the second circulation flow path 6, and the sixth connection flow path 42 in this order, and is then guided to the return flow path 4 and returned to the compressor 2. Then, the gas phase refrigerant, which has been made higher in temperature and pressure by the compressor 2, is discharged again into the delivery flow path 3. By repeating this return flow of the refrigerant, it is possible to cyclically supply the low-temperature refrigerant for cooling to the heat load W.

[0053] 4 shows the operating state in the heating mode in this embodiment. In this heating mode, the processor 8a switches the four-way switching control valve 40 of the switching circuit 10B to the second switching state. In the cooling flow path 15, the first opening / closing control valve 16a of the first branch flow path 16 is controlled to the OFF state, and the second opening / closing control valve 17a of the second branch flow path 17 is controlled to the ON state.

[0054] By setting the four-way switching control valve 40 to the second switching state in this manner, the high-temperature, high-pressure gas-phase refrigerant discharged from the compressor 2 flows through the delivery flow path 3. Through the aforementioned The refrigerant is then guided to the second circulation flow path 6. The refrigerant guided to the second circulation flow path 6 is then sent to the heat load W through the other connection port 6a, and is used to regulate the temperature of the heat load W by heating.

[0055] The refrigerant after being used to adjust the temperature of the heat load W in this way is introduced into the first circulation flow path 5 from the one connection port 5a. Then, a part of the refrigerant introduced into the first circulation flow path 5 is first diverted to the bypass flow path 9, and is converted into a gas-liquid two-phase refrigerant at low temperature and low pressure by adiabatic expansion in the second expansion valve 9a, and is then introduced directly into the fifth connection flow path 41. Next, a part of the remainder is used to cool the compressor 2 through the cooling flow path 15, as in the first embodiment. Meanwhile, the remaining part of the refrigerant introduced into the first flow path 5 is adiabatically expanded in the first expansion valve 5c, and is then introduced to the heat exchanger 7, and is then converted into a gas-liquid two-phase refrigerant at low temperature and low pressure by adiabatic expansion in the second expansion valve 9a, and is then introduced directly into the fifth connection flow path 41. vessel It evaporates when heated at 7.

[0056] The evaporated refrigerant is then guided to the return flow path 4 together with the refrigerant in the bypass flow path 9 through the fifth connecting flow path 41 and the sixth connecting flow path 42, and returned to the compressor 2. The refrigerant, which has been made higher in temperature and pressure by the compressor 2, is then discharged again to the delivery flow path 3. By repeating this return flow of the refrigerant, it is possible to cyclically supply high-temperature refrigerant for heating to the heat load W. Note that the refrigerant directly introduced into the fifth connecting flow path 41 through the bypass flow path 9 is in a gas-liquid two-phase state as described above, and contains liquid, but this liquid evaporates when mixed with the high-temperature, low-pressure gas-phase refrigerant that has been guided to the fifth connecting flow path 41 through the heat exchanger 7.

[0057] Here, in the cooling mode and the heating mode, when the pressure of the return refrigerant detected by the first pressure sensor 4b of the return flow path 4 is lower than a third set pressure, the second expansion valve 9a is controlled to increase its opening, thereby increasing the pressure of the refrigerant in the return flow path 4. Conversely, when the pressure of the return refrigerant is higher than a fourth set pressure, the second expansion valve 9a is controlled to decrease its opening, thereby decreasing the pressure of the refrigerant in the return flow path 4. Here, the fourth set pressure is The third set pressure is set to a value equal to or greater than

[0058] The third set pressure may be the same as the first set pressure, and the fourth set pressure may be the same as the second set pressure.Alternatively, the first to fourth set pressures may all have the same value. [Explanation of symbols]

[0059] T1, T2 Temperature control device for semiconductor manufacturing equipment 1A, 1B refrigeration circuit 2 Refrigeration compressor 3. Delivery channel 3a Second temperature sensor 3b Second pressure sensor 3c High-pressure shutoff switch 4 Return flow path 4a First temperature sensor 4b First pressure sensor 5. First circulation channel 5b First emergency shutoff valve 5c First expansion valve 6 Second circulation channel 6b Second emergency shutoff valve 5a, 6a connection port 7 Heat exchanger 7a Refrigerant heat exchange passage 8 Control Unit 8a processor 9 Bypass flow path 9a Second expansion valve 10A,10B switching circuit 11 First connecting channel 11a First flow control valve 12 Second connecting flow path 12a Second flow control valve 13 Third connecting channel 13a Third flow control valve 14 Fourth connecting channel 14a Fourth flow control valve 15 Cooling Channel 16 First branch channel 16a First opening / closing control valve 17 Second branch channel 17a Second opening / closing control valve 18 channels 18a Injection valve 20 Facility water circuit 21 Facility water heat exchange passage 22 supply channel 22a 4th temperature sensor 23 Discharge flow path 23a 5th flow control valve (facility water control valve) 30 Third temperature sensor 40 Four-way control valve 40a Port 1 40b Second port 40c 3rd port 40d 4th port 41 5th connecting channel 42 6th Connecting Channel W heat load S Semiconductor manufacturing equipment

Claims

1. A temperature control device for controlling a heat load in a semiconductor manufacturing device to a predetermined temperature, the temperature adjustment device includes a refrigeration circuit having a refrigeration compressor that generates a high-temperature, high-pressure refrigerant, a delivery flow path connected to the compressor for delivering the refrigerant from the compressor, a return flow path connected to the compressor for returning the refrigerant to the compressor, a first circulation flow path and a second circulation flow path each having a connection port connected to a heat load for circulatingly supplying the refrigerant to the heat load, a switching circuit that switches between the first and second circulation flow paths and the delivery flow path and the return flow path by changing a communication state between the first and second circulation flow paths and the delivery flow path and the return flow path, and a heat exchanger having a refrigerant heat exchange flow path connecting between the first circulation flow path and the switching circuit; a facility water circuit having a facility water heat exchange flow path through which facility water flows for heat exchange with the refrigerant in the refrigerant heat exchange flow path in the heat exchanger, and a facility water supply / discharge flow path that supplies / discharges facility water to / from the facility water heat exchange flow path; and a control unit having a processor that controls the refrigeration circuit and the facility water circuit; The first circulation flow path has an expansion valve that adiabatically expands the refrigerant, The processor controls the switching circuit so that, when adjusting the temperature of the heat load by cooling, the refrigerant is sent to the heat load from the connection port of the first circulation flow path and the refrigerant is received from the heat load through the connection port of the second circulation flow path, and conversely, when adjusting the temperature of the heat load by heating, the refrigerant is sent to the heat load from the connection port of the second circulation flow path and the refrigerant is received from the heat load through the connection port of the first circulation flow path. A temperature control device for semiconductor manufacturing equipment.

2. the switching circuit includes a first connection flow path having a first flow control valve and connecting between the delivery flow path and the heat exchanger, a second connection flow path having a second flow control valve and connecting between the delivery flow path and the second circulation flow path, a third connection flow path having a third flow control valve and connecting between the second circulation flow path and the return flow path, and a fourth connection flow path having a fourth flow control valve and connecting between the heat exchanger and the return flow path, The processor controls the first to fourth flow control valves so that, when the temperature regulation of the heat load is switched from heating to cooling, the openings of the second and fourth flow control valves are continuously decreased and the openings of the first and third flow control valves are continuously increased, thereby sending the refrigerant to the heat load from the connection port of the first circulation flow path, and conversely, when the temperature regulation of the heat load is switched from cooling to heating, the processor controls the first to fourth flow control valves so that the openings of the first and third flow control valves are continuously decreased and the openings of the second and fourth flow control valves are continuously increased, thereby sending the refrigerant to the heat load from the connection port of the second circulation flow path.

2. The temperature control device for semiconductor manufacturing equipment according to claim 1.

3. the return flow path has a first temperature sensor and a first pressure sensor, and the facility water supply / discharge flow path has a facility water control valve; the processor calculates a degree of superheat of the refrigerant based on the temperature of the refrigerant detected by the first temperature sensor and the pressure of the refrigerant detected by the first pressure sensor, and controls the facility water control valve so as to increase the opening degree of the facility water control valve when the degree of superheat of the refrigerant is lower than a first set degree of superheat in a state in which the temperature of the heat load is adjusted by heating, and conversely, to decrease the opening degree of the facility water control valve when the degree of superheat of the refrigerant is higher than a second set degree of superheat that is equal to or higher than the first set degree of superheat.

2. The temperature control device for semiconductor manufacturing equipment according to claim 1.

4. the outlet flow path has a second pressure sensor, and the facility water supply / discharge flow path has a facility water control valve; the processor controls the facility water control valve so as to increase the opening degree of the facility water control valve when the pressure of the refrigerant detected by the second pressure sensor is higher than a first set pressure while decreasing the opening degree of the facility water control valve when the pressure of the refrigerant is lower than a second set pressure that is equal to or lower than the first set pressure, in a state in which the temperature of the heat load is adjusted by cooling.

2. The temperature control device for semiconductor manufacturing equipment according to claim 1.

5. a cooling flow passage that supplies a refrigerant for cooling the compressor to the compressor is branched off from the first circulation flow passage and connected to the compressor; 5. The temperature control device for semiconductor manufacturing equipment according to claim 1.

6. the cooling flow path has a first branch flow path branched off at a position closer to the heat exchanger than the expansion valve and having a first on-off control valve, a second branch flow path branched off at a position closer to a connection port of the first circulation flow path than the expansion valve and having a second on-off control valve, and an injection valve for adiabatically expanding the refrigerant, and the first branch flow path and the second branch flow path are connected to the compressor through the injection valve, The processor controls the first and second on-off control valves so as to open the first on-off control valve and close the second on-off control valve when the temperature of the heat load is adjusted by cooling, and conversely, to close the first on-off control valve and open the second on-off control valve when the temperature of the heat load is adjusted by heating.

6. The temperature control device for semiconductor manufacturing equipment according to claim 5.

7. The delivery passage has a second temperature sensor that detects a temperature of the refrigerant delivered from the compressor, the processor controls the injection valve so as to increase the opening degree of the injection valve when the temperature of the refrigerant detected by the second temperature sensor is higher than a first set temperature, and conversely, to decrease the opening degree of the injection valve when the temperature of the refrigerant is lower than a second set temperature that is equal to or lower than the first set temperature.

7. The temperature control device for semiconductor manufacturing equipment according to claim 6.

8. the first and second circulation paths each have an emergency shutoff valve that shuts off the refrigerant from entering or leaving the circulation paths through the connection ports in an emergency, The emergency shutoff valve is a normally closed solenoid valve.

5. The temperature control device for semiconductor manufacturing equipment according to claim 1.

9. the temperature adjustment device has a third temperature sensor for detecting a temperature of a heat load; the processor controls the expansion valve so as to increase the opening degree of the expansion valve when the temperature of the heat load detected by the third temperature sensor is higher than a first heat load set temperature, and conversely, to decrease the opening degree of the expansion valve when the temperature of the heat load is lower than a second heat load set temperature that is equal to or lower than the first heat load set temperature, in a state in which the temperature of the heat load is adjusted by cooling.

5. The temperature control device for semiconductor manufacturing equipment according to claim 1.

10. the return flow path includes a first temperature sensor and a first pressure sensor; The processor calculates a degree of superheat of the refrigerant based on the temperature of the refrigerant detected by the first temperature sensor and the pressure of the refrigerant detected by the first pressure sensor, and controls the expansion valve so that, in a state in which the temperature of the heat load is adjusted by heating, the expansion valve is opened to a larger degree when the degree of superheat of the refrigerant is lower than a third set degree of superheat, and conversely, the expansion valve is opened to a larger degree when the degree of superheat of the refrigerant is higher than a fourth setting that is equal to or larger than the third set degree of superheat.

5. The temperature control device for semiconductor manufacturing equipment according to claim 1.

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