Imprint apparatus, imprint method, and article manufacturing method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-03-30
- Publication Date
- 2026-03-30
AI Technical Summary
Conventional imprint technologies face challenges in effectively removing foreign substances on substrates without damaging organic layers, especially when using physical force or chemical solutions, which can lead to improper pattern formation and mold or substrate damage.
An imprint apparatus that forms a removal film on the substrate to peel off foreign matter, utilizing a peeling section and a chamber maintained at a high cleanliness level to perform imprint processes, ensuring precise pattern formation and minimizing damage.
The apparatus effectively removes foreign substances, allowing for accurate pattern formation on substrates while protecting the mold and substrate from damage, enhancing the reliability of imprint processes.
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Abstract
Description
[Technical field]
[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article. [Background technology]
[0002] With the increasing demand for miniaturization of semiconductor devices and MEMS (Micro Electro Mechanical Systems), imprinting technology has been attracting attention in addition to conventional photolithography technology. Imprinting technology is a microfabrication technology in which an imprinting material pattern corresponding to the pattern of the mold is formed on a substrate by curing the imprinting material placed (supplied) on the substrate while the imprinting material is in contact with the mold. With imprinting technology, it is possible to form fine structures on the order of several nanometers on a substrate.
[0003] In an imprinting apparatus that uses imprinting technology, if the imprinting material on the substrate is brought into contact with the mold when foreign matter is attached (present) on the substrate, the imprinting material pattern (structure) cannot be formed in the desired shape. In addition, the mold and the substrate may be damaged if the foreign matter on the substrate comes into contact with the mold. Therefore, it is necessary to first clean the substrate to remove the foreign matter, and then perform the imprinting process in which the imprinting material on the substrate is brought into contact with the mold to form the imprinting material pattern on the substrate.
[0004] Techniques for removing foreign matter on a substrate have been proposed in the past (see Patent Documents 1 and 2). Patent Document 1 discloses a technique for removing foreign matter on a substrate by utilizing a physical force caused by a fluid force. Patent Document 2 discloses a technique for removing foreign matter on a substrate by lift-off using an etching effect (chemical action) of a chemical solution. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Japanese Patent Application Publication No. 8-318181 [Patent Document 2] JP 2007-258462 A Summary of the Invention [Problem to be solved by the invention]
[0006] In the imprint apparatus, the imprint process is performed on a substrate on which an organic layer has been formed (coated). Therefore, when forming an organic layer after cleaning the substrate, there is a possibility that foreign matter may adhere to the organic layer and the imprint process may be performed in a state in which the foreign matter is present on the substrate, and therefore it is preferable to clean the substrate on which the organic layer has been formed immediately before the imprint process.
[0007] However, in the conventional technology of removing foreign matter using physical force, it is necessary to increase the physical force in order to remove foreign matter having a small particle size, which may damage the organic layer formed on the substrate. Also, in the conventional technology of using the chemical action of a chemical solution, there is a possibility that the organic layer formed on the substrate may be damaged.
[0008] The present invention has been made in consideration of the problems with the conventional technology, and has an exemplified object to provide an imprint apparatus that is advantageous for removing foreign matter on a substrate. [Means for solving the problem]
[0009] In order to achieve the above-mentioned object, an imprint apparatus as one aspect of the present invention is an imprint apparatus that performs an imprint process using a mold on a substrate on which a removal film for removing an organic film and foreign matter has been formed, and includes a substrate stage for holding the substrate, a peeling unit for performing a peeling process to peel the removal film from the substrate held on the substrate stage, a dispenser for supplying the imprint material onto the organic film from which the removal film has been peeled off, and a mechanism for adjusting the distance between the substrate to which the imprint material has been supplied and the mold, and is characterized in that the imprint apparatus has a processing unit for performing the imprint process, and a chamber that accommodates the substrate stage, the peeling unit, and the processing unit, and the peeling process by the peeling unit and the imprint process by the processing unit are performed within the chamber.
[0010] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention
[0011] According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous for removing foreign matter on a substrate. [Brief description of the drawings]
[0012] [Figure 1] 1 is a schematic diagram showing a configuration of an imprint system having an imprint apparatus according to one aspect of the present invention. [Diagram 2] FIG. 2 is a schematic diagram showing a configuration of a processing unit of the imprint apparatus. [Diagram 3] 1 is a flowchart illustrating a process of forming a pattern of an imprint material on a substrate. [Figure 4] 1A to 1C are diagrams illustrating a process of forming a pattern of an imprint material. [Diagram 5] FIG. 2 is a diagram illustrating an example of the configuration of a peeling unit of an imprint apparatus. [Figure 6] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.
[0014] 1 is a schematic diagram showing the configuration of an imprint system IS having an imprint apparatus 1 according to one aspect of the present invention. The imprint system IS has the imprint apparatus 1, a mounting table 5, a connecting device 16, and a forming device 20.
[0015] The imprint apparatus 1 is a lithography apparatus that is employed in a lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media, and forms a pattern on a substrate. The imprint apparatus 1 brings uncured imprint material arranged (supplied) on the substrate into contact with a mold, and applies energy for curing to the imprint material, thereby forming a pattern in the cured material to which the pattern of the mold has been transferred.
[0016] The imprint material is a material (curable composition) that is cured by applying energy for curing. The energy for curing may be electromagnetic waves, heat, or the like. The electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared rays, visible rays, ultraviolet rays, and the like.
[0017] The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.
[0018] The imprint material may be applied in the form of a film on the substrate by a spin coater or a slit coater. The imprint material may also be applied in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets, by a liquid jet head. The viscosity of the imprint material (at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.
[0019] The substrate may be made of glass, ceramics, metal, semiconductor, resin, etc., and may have a member made of a material different from that of the substrate formed on its surface as required. Specifically, the substrate may be made of a silicon wafer, a compound semiconductor wafer, quartz glass, etc.
[0020] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction parallel to the surface on which the substrate is placed is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and rotation around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively.
[0021] 1, the imprint apparatus 1 includes a processing unit 2, a peeling unit 3, and a transport unit 4. Note that, although a plurality of processing units 2 and a plurality of peeling units 3 are provided in FIG 1, the present invention is not limited thereto, and it is sufficient that at least one processing unit 2 and at least one peeling unit 3 are provided.
[0022] The processing unit 2 is a unit for performing an imprint process that forms a pattern of an imprint material on a substrate using a mold. The peeling unit 3 is a unit for performing a peeling process that peels off an adjustment film and a removal film formed on the substrate by a forming device 20, which will be described later. The transport unit 4 transports the substrate W within the imprint apparatus, specifically, between the processing unit 2, the peeling unit 3, and the connecting device 16.
[0023] The mounting table 5 is a table on which a storage case F containing the substrate W is placed, and stores and manages the substrate W while it is stored in the storage case F. The connection device 16 in-line connects the imprint apparatus 1 and the forming apparatus 20, and transports the substrate W between the imprint apparatus 1 and the forming apparatus 20. The substrate W is carried in and out of the forming apparatus 20 via the storage case F placed on the mounting table 5.
[0024] The forming apparatus 20 functions as a forming section for performing a process of forming various films on a substrate, in this embodiment, a process of forming an organic film, an adjustment film, a removal film, etc. on a substrate. In this embodiment, the forming apparatus 20 is configured separately from the imprint apparatus 1, but may be configured as an element of the imprint apparatus 1 (i.e., as a part of the imprint apparatus 1). The organic film, adjustment film, and removal film formed on the substrate will be described later.
[0025] Furthermore, in the present embodiment, in the imprint system IS, the forming device 20 including the transport path of the substrate W, the connecting device 16, and the imprint apparatus 1, in particular the processing unit 2, peeling unit 3, and transport unit 4 of the imprint apparatus 1, are housed in a chamber CB. The internal space of the chamber CB that houses these, i.e., the inside of the chamber, is maintained (environmentally controlled) at a higher cleanliness level than that of a clean room, for example, at a cleanliness level of class 2 or higher. Therefore, in the imprint system IM (imprint apparatus 1), the possibility of foreign matter adhering to the substrate W while the substrate W is being transported or processed is reduced, and the adhesion of foreign matter to the substrate W is suppressed.
[0026] The details of the processing unit 2 of the imprint apparatus 1 will be described with reference to FIG. 2. FIG. 2 is a schematic diagram showing the configuration of the processing unit 2 of the imprint apparatus 1. In this embodiment, the processing unit 2 adopts a photocuring method for curing the imprint material by irradiating light such as ultraviolet light, but is not limited to this method. For example, the processing unit 2 can also adopt a thermal curing method for curing the imprint material by applying heat. The processing unit 2 includes an irradiation unit 6, a mold stage 7, a substrate stage 8, a distance measurement unit 9, an alignment optical system 10, a dispenser 15, and a control unit CU.
[0027] The irradiation unit 6 includes a light source unit 61 that emits light to harden the imprint material on the substrate, and an optical system 62 for guiding the light emitted from the light source unit 61 to the imprint material on the substrate, and irradiates the light onto the imprint material on the substrate via the mold 13. The optical system 62 includes optical elements and optical members for adjusting the light emitted from the light source unit 61 to light appropriate for the imprint process.
[0028] The mold stage 7 includes a mold holding unit 71 that holds the mold 13 by vacuum suction force or electrostatic force, and a mold driving unit 72 that changes (controls) the position and posture of the mold holding unit 71 (the mold 13 held by it) by driving the mold holding unit 71. The mold holding unit 71 and the mold driving unit 72 have openings in the center (inside) so that the light from the irradiation unit 6 is irradiated onto the imprint material on the substrate. The mold driving unit 72 drives the mold holding unit 71 in the Z direction to bring the mold 13 into contact with the imprint material on the substrate or to separate the mold 13 from the imprint material on the substrate.
[0029] The substrate stage 8 includes a substrate holding unit 81 that holds the substrate W, and a substrate driving unit 82 that drives the substrate holding unit 81 (the substrate W held by the substrate holding unit 81) in the X and Y directions. The substrate driving unit 82 may include, for example, a linear motor, and may be composed of a plurality of driving systems, such as a coarse motion driving system and a fine motion driving system. The substrate driving unit 82 may have a function of driving the substrate holding unit 81 not only in the X and Y directions, but also in the Z direction. The substrate driving unit 82 may also have a tilt function for changing (controlling) the attitude of the substrate holding unit 81.
[0030] The position of the substrate stage 8 is measured using, for example, an encoder system composed of a scale provided in the housing 14 and a head (optical device) provided in the substrate driving unit 82. However, the system that measures the position of the substrate stage 8 is not limited to an encoder system, and may be an interferometer system composed of a laser interferometer provided in the housing 14 and a reflecting mirror provided in the substrate driving unit 82.
[0031] The mold stage 7 and the substrate stage 8 constitute a relative drive mechanism that drives at least one of the mold 13 and the substrate W so that the relative position between the mold 13 and the substrate W is adjusted. The adjustment of the relative position between the mold 13 and the substrate W by the relative drive mechanism includes driving for contact between the imprint material on the substrate and the mold 13, and driving for separating the mold 13 from the hardened imprint material on the substrate. In this way, the mold stage 7 and the substrate stage 8 function as a mechanism that adjusts the distance between the mold 13 and the substrate W. In addition, the configuration of the relative position between the mold 13 and the substrate W by the relative drive mechanism includes alignment between the mold 13 and the substrate W.
[0032] The distance measurement unit 9 has a function of measuring the distance between the mold 13 and the substrate W, i.e., the interval between the mold 13 and the substrate W. The distance measurement unit 9 is composed of, for example, a measuring device 9a including a light emitter and a light receiver, and a laser interferometer including a reflecting mirror 9b. The distance measurement unit 9 can obtain the attitude of the mold 13 by measuring the interval between the mold 13 and the substrate W at multiple positions.
[0033] The alignment optical system 10 detects an alignment mark provided on the mold 13 and an alignment mark provided on the substrate W, and measures the positional deviation (relative position in the X and Y directions) between the mold 13 and the substrate W. Based on the positional deviation measured by the alignment optical system 10, the position of the substrate stage 8 is controlled so that the positional deviation falls within an allowable range.
[0034] The dispenser 15 has a function of supplying the imprint material to (a shot area of) the substrate W. When the substrate W is driven by the substrate driving unit 82, the dispenser 15 discharges (droplets of) the imprint material in synchronization with the driving of the substrate W, thereby placing the imprint material on the substrate.
[0035] The control unit CU is composed of, for example, a computer (information processing device) including a CPU, memory, etc., and performs overall control of each part of the imprint apparatus 1 in accordance with a program stored in a storage unit, etc. The control unit CU controls the operation and adjustment of each part of the imprint apparatus 1, thereby controlling the imprint process of forming a pattern of imprint material on a substrate using the mold 13. In this embodiment, the control unit CU also has a function of overall control of each device of the imprint system IS. However, a control device that performs overall control of each device of the imprint system IS may be provided separately from the control unit CU.
[0036] In the imprinting apparatus 1, if there is a foreign matter on the substrate when performing the imprinting process (contacting the mold 13 with the imprinting material on the substrate), the imprinting material pattern cannot be formed in the desired shape. Furthermore, contact between the foreign matter on the substrate and the mold 13 may damage the mold 13 or the substrate W.
[0037] Therefore, in this embodiment, a removal film for removing foreign matter is formed on the substrate W that is carried into the forming device 20 from the storage case F placed on the mounting table 5, and the removal film is peeled off (removed) from the substrate W by the peeling unit 3 immediately before the imprint process. As a result, when the imprint process is performed, the foreign matter has been removed from the substrate, so that the pattern of the imprint material can be formed in a desired shape, and damage to the mold 13 and the substrate W caused by the foreign matter on the substrate can be suppressed.
[0038] Hereinafter, the process in the imprint apparatus 1 (imprint system IS), i.e., the process (imprint method) of forming a pattern of imprint material on a substrate, will be described with reference to Fig. 3 and Fig. 4(a) to Fig. 4(h). Such process is performed by a control unit CU comprehensively controlling each device of the imprint system IS and each part of the imprint apparatus 1. Fig. 3 is a flowchart for explaining the process of forming a pattern of imprint material on a substrate. Fig. 4(a) to Fig. 4(h) are diagrams that diagrammatically show the process of forming a pattern of imprint material.
[0039] 4(a), foreign matter 50 may be attached to (the surface (processed surface)) of the substrate W on which the imprint material pattern is formed. The foreign matter 50 includes foreign matter that has been attached to the substrate W in a previous process and foreign matter that could not be removed in a cleaning process (a process for cleaning the substrate W) included in the previous process.
[0040] In S101, an organic film 51 for imprint processing is formed on (the surface of) a substrate W. Specifically, the substrate W is taken out of a storage case F placed on a mounting table 5 and carried into a forming apparatus 20, and a process of forming an organic film 51 on the substrate is performed in the forming apparatus 20.
[0041] 4(b) shows the state of the substrate W after S101, i.e., the state in which the organic film 51 has been formed on the substrate. As shown in FIG. 4(b), if the foreign matter 50 is larger than the thickness of the organic film 51 formed on the substrate, the foreign matter 50 on the substrate may come into contact with the mold 13, which may result in poor pattern formation or damage to the mold 13 and the substrate W.
[0042] The organic film 51 is made of an organic material used in a microfabrication process using an imprint technique, and is embodied, for example, as an adhesive film for imprint processing. In general, when the uncured imprint material on the substrate is brought into contact with the mold 13 in the imprint processing, it is preferable to form an adhesive film for imprint processing on the substrate as the organic film 51. By forming an adhesive film as the organic film 51, it is possible to increase the adhesion between the substrate W and the imprint material. The adhesive film for imprint processing is made of a material having, for example, a carboxyl group that bonds with the substrate W or an acrylic group that reacts with the imprint material. In addition, the adhesive film for imprint processing may contain a crosslinking agent, a thermal polymerization initiator, a surfactant, and the like as other components.
[0043] The forming apparatus 20 forms the organic film 51 on the substrate W by using a method capable of controlling the film thickness, such as an inkjet method, a dispenser method, a spin coat method, various printing methods such as screen printing, gravure printing, and offset printing, and a dipping method. In this embodiment, the forming apparatus 20 includes a spin coater, applies an organic material by a spin coat method, and hardens the organic material to form the organic film 51. When the organic material constituting the organic film 51 is hardened by heating, the forming apparatus 20 includes a heater, an infrared lamp, and the like. When the organic material constituting the organic film 51 is hardened by irradiation with ultraviolet rays, the forming apparatus 20 includes an ultraviolet lamp, and the like. When the organic material constituting the organic film 51 is hardened by drying, the forming apparatus 20 includes a pump for increasing the pressure in the sealed space, and the like.
[0044] In S102, an adjustment film 52 is formed on the organic film for imprint processing formed in S101. Specifically, in the forming apparatus 20, a process for forming the adjustment film 52 is performed following the process for forming the organic film 51. Fig. 4(c) shows the state of the substrate W after S102, that is, the state in which the adjustment film 52 has been formed on the organic film. In this way, by forming the organic film 51 and the adjustment film 52 in the same forming apparatus 20 (by applying and curing the material), the opportunity (possibility) of foreign matter adhering to the organic film can be reduced.
[0045] The adjustment film 52 has a function of adjusting the adhesion force acting between the adjustment film 52 and a film formed above or below it. In this embodiment, the adjustment film 52 is a film that adjusts the adhesion force between the adjustment film 52 and the organic film 51 to be smaller than the adhesion force between the adjustment film 52 and the removal film 53. This is to suppress poor peeling of the removal film 53 (such as residue of the removal film 53 or the adjustment film 52) in the step (S104) of peeling (removing) the removal film 53.
[0046] The adjustment film 52 is made of a thermosetting resin. The adjustment film 52 contains, for example, a resin having a siloxane bond or an epoxy resin. The adjustment film 52 may also contain a polar solvent that does not swell or dissolve the organic film 51 for imprint processing. This ensures the peelability of the adjustment film 52.
[0047] In S103, a removal film 53 is formed on the adjustment film formed in S103. Specifically, in the forming apparatus 20, a process of forming the removal film 53 is performed following a process of forming the organic film 51 and the adjustment film 52. In this manner, by forming the organic film 51, the adjustment film 52, and the removal film 53 in the same forming apparatus 20 (by applying and curing the materials), the opportunity (possibility) of foreign matter adhering to the adjustment film can be reduced.
[0048] Fig. 4(d) shows the state of the substrate W after S103, i.e., the state in which the removal film 53 has been formed on the adjustment film. As shown in Fig. 4(d), the removal film 53 is preferably formed to a thickness sufficient to encase (cover) the foreign matter 50 on the substrate. By covering the adjustment film 52, the removal film 53 prevents foreign matter other than the foreign matter 50 from directly adhering to the organic film 51 for imprint processing.
[0049] The removal film 53 is made of a thermosetting resin, for example, a resin having a siloxane bond, an epoxy resin, an acrylic resin, or a phenol resin.
[0050] In S104, the adjustment film 52 formed in S102 and the removal film 53 formed in S103 are peeled off (removed). Specifically, the substrate W on which the organic film 51, the adjustment film 52, and the removal film 53 are formed is carried into the imprint apparatus 1 from the forming apparatus 20 via the connecting device 16, and is transported to the peeling section 3 by the transport unit 4. The substrate W is transported between the forming apparatus 20 and the imprint apparatus 1 in a state in which the substrate stage 8 (substrate holding unit 81) holds the substrate W. In other words, the substrate stage 8 holding the substrate W is transferred between the forming apparatus 20 and the imprint apparatus 1. Then, in the peeling section 3, a peeling process is performed in which the removal film 53 is peeled off together with the adjustment film 52 from the substrate W held by the substrate stage 8. A specific configuration of the peeling section 3 will be described later.
[0051] Fig. 4(e) shows the state of the substrate W after S104, i.e., the state in which the adjustment film 52 and the removal film 53 have been peeled off from the substrate. As shown in Fig. 4(e), by peeling off the removal film 53, the foreign matter 50 encapsulated in the removal film 53 is separated from the organic film 51 for imprint processing and removed.
[0052] In S105, an imprint process is performed. Specifically, the substrate W from which the adjustment film 52 and the removal film 53 have been peeled off is transported by the transport unit 4 from the peeling unit 3 to the processing unit 2. Then, in the processing unit 2, an imprint process is performed to form a pattern of an imprint material 54 on the substrate.
[0053] In the imprint process, first, as shown in FIG. 4(f), the imprint material 54 is supplied from the dispenser 15 onto the substrate W, that is, onto the organic film formed on the substrate W. The imprint material 54 contains, for example, a radical polymerization type acrylic curing resin. Next, as shown in FIG. 4(g), the mold 13 is brought into contact with the imprint material 54 on the substrate. At this time, it is preferable to adjust the pressing force of the mold 13 against the imprint material 54 so that the imprint material 54 on the substrate is filled into the pattern (relief structure) of the mold 13. In addition, while the imprint material 54 on the substrate and the mold 13 are in contact with each other, the irradiation unit 6 irradiates the imprint material 54 with light to harden the imprint material 54. Then, as shown in FIG. 4(h), the mold 13 is separated from the hardened imprint material 54 on the substrate, thereby forming a pattern of the imprint material 54 on the substrate having a shape that is an inversion of the pattern (relief structure) of the mold 13.
[0054] In this manner, in this embodiment, the removal film 53 for removing the foreign matter 50 is formed on the substrate W, and the removal film 53 is peeled off (removed) immediately before the imprint process is performed, so that the foreign matter 50 is removed from the substrate when the imprint process is performed. Therefore, the pattern of the imprint material 54 can be formed in a desired shape, and damage to the mold 13 and the substrate W caused by the foreign matter on the substrate can be suppressed.
[0055] Moreover, the processes by the forming apparatus 20 (S101, S102, and S103), the peeling process by the peeling unit 3 (S104), and the imprint process by the processing unit 2 (S105) are performed in a chamber maintained at a higher degree of cleanliness than a clean room. This reduces the possibility of foreign matter adhering to the substrate during these processes, and can suppress the adhesion of foreign matter to the substrate W.
[0056] In this embodiment, the imprint apparatus 1 has a function (peeling unit 3) of peeling off the removal film 53 formed on the substrate, but the removal film 53 may be peeled off (removed) by an apparatus (a peeling device that peels off the removal film 53) separate from the imprint apparatus 1. In this case, in order to prevent other foreign matter from adhering to the substrate W after the removal film 53 has been peeled off, it is preferable to in-line connect the imprint apparatus 1 and the peeling device by the substrate transport unit.
[0057] Furthermore, the substrate stage 8 may be configured with two stages, i.e., a first stage and a second stage, and the first stage may be used in the forming apparatus 20, and the second stage may be used in the imprint apparatus 1. In this case, the processes of forming the organic film 51, the adjustment film 52, and the removal film 53 by the forming apparatus 20 are performed with the substrate W held on the first stage, and the peeling process by the peeling unit 3 and the imprint process by the processing unit 2 are performed with the substrate W held on the second stage.
[0058] Here, a specific configuration of the peeling unit 3 will be described. As shown in Figures 5(a), 5(b) and 5(c), the peeling unit 3 has a configuration capable of bringing an adhesive substance into contact with (the surface of) a removal film 53 formed on a substrate W and detaching the substance from the substrate W. Figures 5(a), 5(b) and 5(c) are diagrams showing an example of the configuration of the peeling unit 3.
[0059] For example, as shown in FIG. 5(a), the peeling unit 3 includes an adhesive tape 31, a pressure roller 32, a supply unit 33, a collection unit 34, and a static electricity remover 36. In the peeling unit 3, a substrate holding unit 81 holding a substrate W on which an organic film 51, an adjustment film 52, and a removal film 53 are formed is driven in the X direction to be conveyed under the pressure roller 32. When the substrate holding unit 81 (substrate W) is conveyed under the pressure roller 32, the adhesive tape 31 adheres to the removal film 53 formed on the substrate. When the substrate holding unit 81 is further driven in the X direction from under the pressure roller 32, the adhesive tape 31 adhering to the removal film 53 is collected in the collection unit 34 and separated from the substrate W. At this time, the removal film 53 formed on the substrate W is peeled off together with the adjustment film 52. The foreign matter 50 on the substrate is removed (collected) by the adhesive tape 31 together with the adjustment film 52 and the removal film 53. The static electricity remover 36 neutralizes the static electricity on the substrate W, that is, on the surface of the organic film 51, which has been charged by peeling off the adhesive tape 31.
[0060] 3, the peeling unit 3 and the transport unit 4 are illustrated separately, but the peeling unit 3 and the transport unit 4 may be configured integrally. Specifically, the adhesive tape 31 may be peeled off from the substrate W while (during) the substrate holding unit 81 holding the substrate W transports the substrate W from the connecting device 16 to the imprint apparatus 1 (processing unit 2).
[0061] In another configuration, the peeling unit 3 includes a removal roller 37, an adhesive roller 38, and a static electricity remover 36, as shown in FIG. 5(b). The removal roller 37, like the adhesive tape 31 shown in FIG. 5(a), adheres to a removal film 53 formed on a substrate, and has a function of removing (collecting) foreign matter 50 on the substrate together with the adjustment film 52 and the removal film 53. The adhesive roller 38 rotates in the opposite direction while in contact with the removal roller 37, thereby collecting the adjustment film 52 and the removal film 53 (foreign matter 50) attached to the removal roller 37. This allows the removal roller 37 (the surface thereof) to be constantly kept clean.
[0062] In another configuration, the peeling unit 3 includes a peeling template 41 and a template holding unit 42, as shown in FIG. 5(c). The template holding unit 42 holds the peeling template 41 having adhesiveness, and drives the peeling template 41 in a direction approaching the substrate W, thereby bringing the peeling template 41 into contact with the removal film 53 formed on the substrate. The template holding unit 42 drives the peeling template 41 in contact with the removal film 53 in a direction away from the substrate W, thereby peeling off the removal film 53 together with the adjustment film 52. As a result, the foreign matter 50 on the substrate is removed (recovered) by the peeling template 41 together with the adjustment film 52 and the removal film 53. In order to increase the adhesive force between the peeling template 41 and the removal film 53 formed on the substrate, the peeling template 41 (the surface thereof) may be processed in advance, or an adhesive material may be applied thereto. Furthermore, while the adhesive material applied to the peeling template 41 is in contact with the removal film 53, energy (such as light or heat) may be applied to the adhesive material to increase the adhesion between the adhesive material and the removal film 53.
[0063] The pattern of the cured product formed using the imprint system IS or the imprint apparatus 1 (imprint method) in this embodiment is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.
[0064] The pattern of the cured product may be used as it is as at least a part of the component of the above-mentioned article, or may be used temporarily as a resist mask, which is removed after etching or ion implantation is performed in a substrate processing step.
[0065] Next, a specific method for manufacturing the article will be described. As shown in Fig. 6(a), a substrate such as a silicon wafer with a workpiece such as an insulator formed on its surface is prepared, and then an imprint material is applied to the surface of the workpiece by an inkjet method or the like. Here, the state in which the imprint material in the form of multiple droplets is applied to the substrate is shown.
[0066] As shown in Fig. 6(b), the imprinting mold is placed with the side on which the concave-convex pattern is formed facing the imprinting material on the substrate. As shown in Fig. 6(c), the substrate on which the imprinting material has been applied is brought into contact with the mold, and pressure is applied. The imprinting material fills the gap between the mold and the workpiece. When light is irradiated through the mold in this state as hardening energy, the imprinting material hardens.
[0067] As shown in Fig. 6(d), when the imprint material is cured and then the mold and the substrate are separated, a pattern of the cured product of the imprint material is formed on the substrate. In this cured product pattern, the concave portions of the mold correspond to the convex portions of the cured product, and vice versa, i.e., the concave and convex patterns of the mold are transferred to the imprint material.
[0068] As shown in Fig. 6(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portions of the surface of the workpiece where there is no cured material or where only a thin portion remains are removed to form grooves. As shown in Fig. 6(f), when the pattern of the cured material is removed, an article having grooves formed on the surface of the workpiece can be obtained. Here, the pattern of the cured material is removed, but it may also be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing.
[0069] The disclosure of the present specification includes the following imprint apparatus, imprint method, and method for manufacturing an article.
[0070] (Item 1) An imprinting apparatus that performs an imprinting process to form a pattern of an imprinting material using a mold on a substrate on which a removal film for removing an organic film and foreign matter has been formed, a substrate stage for holding the substrate; a peeling unit for performing a peeling process to peel off the removal film from the substrate held by the substrate stage; a processing section for performing the imprint processing, the processing section including: a dispenser for supplying the imprint material onto the organic film from which the removal film has been peeled off; and a mechanism for adjusting a distance between the substrate to which the imprint material has been supplied and the mold; a chamber that accommodates the substrate stage, the peeling unit, and the processing unit; having the peeling process by the peeling unit and the imprint process by the processing unit are performed in the chamber. 1. An imprint apparatus comprising:
[0071] (Item 2) 2. The imprint apparatus according to item 1, wherein the inside of the chamber is maintained at a higher degree of cleanliness than a clean room.
[0072] (Item 3) 3. The imprint apparatus according to item 1 or 2, wherein the interior of the chamber is maintained at a cleanliness level of class 2 or higher.
[0073] (Item 4) The imprint apparatus described in any one of items 1 to 3, further comprising a formation unit for performing a process of forming the organic film on the substrate and a process of forming the removal film on the organic film.
[0074] (Item 5) an adjustment film is formed between the organic film and the removal film; the adjustment film is a film that adjusts the adhesion between the adjustment film and the organic film to be smaller than the adhesion between the adjustment film and the removal film; 4. The imprint apparatus according to claim 1, wherein the imprint apparatus further comprises:
[0075] (Item 6) 6. The imprint apparatus according to item 5, further comprising a formation unit for performing a process of forming the organic film on the substrate, a process of forming the adjustment film on the organic film, and a process of forming the removal film on the adjustment film.
[0076] (Item 7) 7. The imprint apparatus according to item 5 or 6, wherein the removal film and the adjustment film are made of a thermosetting resin.
[0077] (Item 8) The peeling portion is Includes adhesive tape, The adhesive tape is adhered to the removal film, and the removal process is performed by peeling off the adhesive tape adhered to the removal film. 8. The imprinting apparatus according to claim 1, wherein
[0078] (Item 9) The peeling portion is A template having adhesive properties is included, the removal process is performed by bringing the template into contact with the removal film and removing the template that has been brought into contact with the removal film; 8. The imprinting apparatus according to claim 1, wherein
[0079] (Item 10) the substrate stage includes a first stage and a second stage; the processing by the forming unit is performed in a state in which the substrate is held on the first stage, the peeling process by the peeling unit and the imprint process by the processing unit are performed in a state in which the substrate is held by the second stage. 5. The imprint apparatus according to item 4,
[0080] (Item 11) The chamber contains the forming portion, the processing by the formation unit, the peeling processing by the peeling unit, and the imprint processing by the processing unit are performed in the chamber; 11. The imprinting apparatus according to item 10,
[0081] (Item 12) An imprinting method for performing an imprinting process using a mold to form a pattern of an imprint material on a substrate on which a removal film for removing an organic film and foreign matter has been formed, the imprinting process comprising: a first step of performing a peeling process of peeling the removal film from the substrate by a peeling unit; a second step of performing the imprint processing by supplying the imprint material onto the organic film from which the removal film has been peeled off by a processing unit and adjusting a distance between the substrate to which the imprint material has been supplied and the mold; having the peeling process in the first step and the imprint process in the second step are performed in a chamber that houses the peeling unit and the processing unit. 1. An imprint method comprising:
[0082] (Item 13) Forming a pattern on a substrate using the imprint method according to item 12; processing the substrate on which the pattern has been formed in the process; producing an article from the processed substrate; A method for producing an article, comprising the steps of:
[0083] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]
[0084] 1: Imprinting device 2: Processing section 3: Peeling section 8: Substrate stage 13: Mold 51: Organic film 52: Adjustment film 53: Removal film 54: Imprinting material W: Substrate CB: Chamber
Claims
1. An imprint apparatus that performs an imprint process on a substrate on which an organic film and a removal film for removing foreign matter have been formed, by using a mold to form a pattern of imprint material, A substrate stage for holding the aforementioned substrate, A peeling unit for performing a peeling process to peel the removal film from the substrate held on the substrate stage, A processing unit for performing the imprinting process includes a dispenser that supplies the imprinting material onto the organic film from which the removal film has been peeled off, and a mechanism for adjusting the distance between the substrate to which the imprinting material is supplied and the mold, A chamber housing the substrate stage, the peeling section, and the processing section, It has, The peeling process by the peeling unit and the imprinting process by the processing unit are performed within the chamber. An imprinting device characterized by the following features.
2. The imprint apparatus according to claim 1, further comprising a forming unit for performing the process of forming the organic film on the substrate and the process of forming the removal film on the organic film.
3. A conditioning film is formed between the organic film and the removal film. The adjustment film is a film that adjusts the adhesion force between the adjustment film and the organic film to be less than the adhesion force between the adjustment film and the removal film. The imprint apparatus according to feature 1.
4. The imprint apparatus according to claim 3, further comprising a forming unit for performing the process of forming the organic film on the substrate, the process of forming the adjustment film on the organic film, and the process of forming the removal film on the adjustment film.
5. The imprint apparatus according to claim 3, characterized in that the removal film and the adjustment film are made of a thermosetting resin.
6. The peeled portion is, Includes adhesive tape, The peeling process is performed by adhering the adhesive tape to the removal film and then peeling off the adhesive tape that has been adhered to the removal film. The imprint apparatus according to feature 1.
7. The peeled portion is, Includes an adhesive template, The peeling process is performed by bringing the template into contact with the removal film and peeling off the template that has been in contact with the removal film. The imprint apparatus according to feature 1.
8. The substrate stage includes a first stage and a second stage, The processing by the forming unit is performed with the substrate held on the first stage. The peeling process by the peeling unit and the imprinting process by the processing unit are performed while the substrate is held on the second stage. The imprint apparatus according to feature 2.
9. The chamber houses the forming portion, The processing by the forming unit, the peeling process by the peeling unit, and the imprinting process by the processing unit are performed within the chamber. The imprint apparatus according to feature 8.
10. An imprinting method in which an imprinting process is performed to form a pattern of imprint material on a substrate on which an organic film and a removal film for removing foreign matter have been formed, using a mold, The first step involves performing a peeling process to remove the removal film from the substrate using a peeling section, The second step involves a processing unit supplying the imprint material onto the organic film from which the removal film has been peeled off, and adjusting the distance between the substrate to which the imprint material is supplied and the mold, thereby performing the imprint process. It has, The peeling process in the first step and the imprinting process in the second step are performed in a chamber housing the peeling unit and the processing unit. An imprinting method characterized by the following:
11. A step of forming a pattern on a substrate using the imprint method described in claim 10, A step of processing the substrate on which the pattern has been formed in the above step, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following: