Component mounting device and imaging apparatus

Abstract

To provide a component mounting device which can be reduced in size and is capable of increasing a mounting speed of an electronic component.SOLUTION: In a component mounting device, a component is taken out of a component supply part by a mounting head, and the component is mounted on a first substrate which is conveyed in a substrate conveying direction along a substrate conveying path. The component mounting device comprises a component imaging camera which is disposed between the component supply part and the substrate conveying path in an orthogonal direction orthogonal with the substrate conveying direction and images the component which is taken out by the mounting head from a lower side, and the component imaging camera includes a lighting unit which lights the component taken out by the mounting head. The lighting unit includes at least one second substrate which is disposed in an annular shape enclosing an optical axis of the component imaging camera, a plurality of light-emitting elements mounted in an annular shape on the at least one second substrate and a wiring component, which is attached only in a portion of the second substrate in the orthogonal direction, for supplying a power source to the plurality of light-emitting elements.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and an imaging apparatus. [Background technology]

[0002] Conventionally, there is known a component mounting device (component mounting device) that mounts (mounts) electronic components on a board. Also, a component recognition method is known that recognizes electronic components when mounting components using the component mounting device. As a component recognition method, in a component recognition method for an electronic component mounting device, in which the electronic component is attracted and held on the suction surface of a nozzle, light is irradiated onto the electronic component to capture an image, and the image of the electronic component is subjected to image recognition processing for mounting, the electronic component is imaged several times while the electronic component crosses the field of view of an imaging unit of the component recognition device, the image data is input to the component recognition device, the multiple image data are position-corrected and combined, and the image data obtained by the combination is subjected to image recognition processing (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-108563 A Summary of the Invention [Problem to be solved by the invention]

[0004] The component mounting device of Patent Document 1 has an illumination means for emitting light, and an imaging unit below the illumination means. This component mounting device captures an image of the electronic component illuminated with light while the electronic component crosses the field of view of the imaging unit of the component recognition device, i.e., while the electronic component crosses the illumination means, and mounts the electronic component at a predetermined mounting position after the electronic component crosses. Therefore, if the length of the illumination means in the direction in which the electronic component crosses can be shortened, the component mounting device itself can be made smaller, and electronic components can be recognized and mounted at high speed.

[0005] The present disclosure has been made in consideration of the above circumstances, and has an object to provide a component mounting device and an imaging device that can be miniaturized and can increase the speed at which electronic components are mounted. [Means for solving the problem]

[0006] One aspect of the present disclosure is a component mounting device in which a mounting head takes out components from a component supply unit and mounts the components on a first board transported on a board transport path in a board transport direction, the component mounting device having a component imaging camera that is arranged between the component supply unit and the board transport path along an orthogonal direction perpendicular to the board transport direction and captures images of the components taken out by the mounting head from below, the component imaging camera having a lighting unit that illuminates the components taken out by the mounting head, the lighting unit having at least one second board arranged in a ring shape surrounding an optical axis of the component imaging camera, a plurality of light-emitting elements mounted in the ring shape on the at least one second board, and wiring components for supplying power to the plurality of light-emitting elements that are attached only to a portion of the second board along the orthogonal direction. Effect of the Invention

[0007] According to the present disclosure, miniaturization is possible and the mounting speed of electronic components can be increased. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a top view illustrating a mechanical configuration of a component mounting apparatus according to an embodiment of the present disclosure; [Diagram 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device; [Diagram 3] FIG. 11 is a perspective view illustrating the operation of the moving head and the component holding nozzle; [Figure 4] FIG. 1 is a side view illustrating a mechanical configuration of a component recognition camera and a head unit; [Diagram 5] FIG. 1 is a top view illustrating a schematic example of a mechanical configuration in the vicinity of a side illumination unit of a part recognition camera; [Figure 6] FIG. 1 is a diagram for explaining the wide directivity angle characteristics of a light-emitting element. [Figure 7] FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device. [Figure 8] Flowchart showing an example of operation of a component mounting device DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed description of already well-known matters and duplicated description of substantially the same configuration may be omitted. This is to avoid the following description becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0010] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0011] (Embodiment 1) <Mechanical configuration of component mounting equipment> First, the mechanical configuration of the component mounting apparatus 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting apparatus 1 according to embodiment 1. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in Fig. 1.

[0012] For ease of explanation, the axis extending in the height direction from the floor surface on which the component mounting device 1 is installed is defined as the Z axis. The axis perpendicular to the Z axis (i.e., horizontal, parallel to the floor surface) and extending from the front side of the component mounting device 1 (the lower side of the paper in FIG. 1) to the rear side of the component mounting device 1 (the upper side of the paper in FIG. 1) is defined as the Y axis. The axis perpendicular to the Y axis and the Z axis is defined as the X axis. For ease of explanation, the positive direction of the Z axis may be referred to as "up", the negative direction of the Z axis as "down", the negative direction of the Y axis as "front", and the positive direction of the Y axis as "rear". These expressions relating to directions are used for ease of explanation and are not intended to limit the position of the structure during actual use.

[0013] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W, and attach (mount) the components P in a predetermined position and attitude onto the board W transported from upstream of the mounting board manufacturing line.

[0014] As shown in Figs. 1 and 2, the component mounting apparatus 1 includes a main body mechanism 10 that mounts components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, and capacitors, lead components, chip components, or BGA (Ball Grid Array) components) on a substrate W mainly through the operation of each mechanism, and a control unit 40 that controls the operation of the main body mechanism 10. The main body mechanism 10 includes a mounting machine main body 11 including a base 12, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0015] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position. The conveyor units 14 form a board conveying path.

[0016] A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

[0017] The component mounting apparatus 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its lower side, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20. A reel 21 is accommodated in each of the plurality of reel stock units. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where the component P is picked up by a moving head 26 of a head unit 23 described below.

[0018] Head unit 23 is disposed above base 12, and configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is capable of linear movement along the X and Y directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0019] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0020] A component recognition camera 28 is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to moving head 26 picks up and holds a component P from component supply mechanism 15 and moves and passes above component recognition camera 28. At this time, component recognition camera 28 illuminates component P sucked and held by component holding nozzle 27 as it passes by at a predetermined timing and captures an image of component P at least once. The captured image is subjected to a recognition process, whereby identification and position detection of component P are performed with high accuracy.

[0021] Furthermore, a nozzle holder 38 and a waste box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P and the like determined to be defective as a result of image capture by the component recognition camera 28 are discarded.

[0022] <About the configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0023] The moving head 26 is a multiple head having one moving head or multiple moving heads, and multiple component holding nozzles 27 are arranged side by side at the lower end of each moving head 26. For example, the moving head 26 may have multiple component holding nozzles 27 (e.g., eight nozzles) arranged in multiple rows (e.g., two rows). The moving head 26 may have multiple component holding nozzles 27 (e.g., eight nozzles) arranged in a single row. A reflector (not shown) is fixed to the moving head 26 for reflecting illumination light emitted from the transmitted illumination unit 34 (see below). The reflector is disposed above the held components P.

[0024] Each of the component holding nozzles 27 vacuum-sucks and holds a component P from the tape feeder 18 of the component supply mechanism 15, for example, by using air pressure, and moves up and down individually. The moving head 26 further includes a Z-axis lifting mechanism (not shown) for individually lifting and lowering each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) for individually rotating each of the component holding nozzles 27 about the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). By this movement, the moving head 26 sucks up the component P with the component holding nozzle 27 from the take-out position of the tape feeder 18 of the component supply mechanism 15 and takes it out.

[0025] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image capture result (image capture information) is similarly subjected to recognition processing to detect the position and posture of the board W.

[0026] As a result of detecting the position of the board W, the moving head 26 places the components P at their respective mounting points (e.g., the mounting positions and mounting orientations on the board W where the components P are to be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This mounting of the components P at one time is continued until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

[0027] The component mounting apparatus 1 repeatedly executes a series of operations of removing and mounting a plurality of components P by the component holding nozzle 27 of the moving head 26, and then moving the moving head 26 back to the removal position, until mounting is completed at all of the mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in cooperation with each other, and this cooperative operation is executed in accordance with instructions from the control unit 40.

[0028] In the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position and the subsequent return movement to the removal position is also referred to as a work unit of "one turn." The forward movement from the removal position to the mounting work position in one turn is also referred to simply as "forward movement in one turn" below.

[0029] <Component recognition camera configuration> Next, the configuration of the component recognition camera 28 will be described with reference to Fig. 4 to Fig. 6. Fig. 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 and the head unit 23 shown in Fig. 2. Fig. 5 is a top view illustrating a schematic example of the mechanical configuration in the vicinity of the side illumination unit 35 of the component recognition camera 28. Fig. 6 is a diagram for explaining the wide directivity angle characteristics of the light-emitting element.

[0030] As shown in Fig. 4, the component recognition camera 28 includes an image pickup sensor section 29 and an illumination unit section 31. In Fig. 4, the inside of the illumination unit section 31 of the component recognition camera 28 is shown in a see-through manner.

[0031] The imaging sensor unit 29 is disposed so that its optical axis OC is aligned along the vertical direction (Z direction) and captures an image of the component P moving above the component recognition camera 28 from below. The imaging sensor unit 29 includes a substantially cylindrical housing 30, and a lens 71 and an imaging element 72 built into the housing 30. The lens 71 may be one or more. The imaging element 72 may be configured of a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging sensor unit 29 has a shutter function and exposes and captures an image at a predetermined timing in accordance with a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the result of imaging by the imaging element 72 (captured image) to the control unit 40.

[0032] Component recognition camera 28 is capable of capturing images according to a scan imaging method, and may have an ROI (Region Of Interest) function using an area sensor. With the ROI function, component recognition camera 28 can set a plurality of ROI ranges for imaging sensor unit 29, and capture images by continuously switching between these ROI ranges. The ROI range corresponds to imaging range CA by imaging sensor unit 29. The set ROI ranges may differ in position, size, etc.

[0033] The lighting unit section 31 includes a box-shaped housing 32, a plurality of reflective illumination sections 33, a plurality of transmitted illumination sections 34, a plurality of side illumination sections 35, and a coaxial illumination section 39. The reflective illumination section 33 may be referred to as an oblique illumination section, a component illumination section, or a first illumination section. The reflective illumination section 33, the transmitted illumination section 34, the side illumination section 35, and the coaxial illumination section 39 are disposed inside the housing 32. The housing 32 of the lighting unit section 31 is disposed on the upper side of the housing 30 of the image sensor section 29 in a stacked and connected state.

[0034] Note that, although the term "plurality of illumination sections (e.g., the reflective illumination section 33, the plural transmissive illumination sections 34, and the plural lateral illumination sections 35)" indicates that, for example, each illumination section has plural illumination boards and an illumination section is constituted for each illumination board, this is not limited thereto. When there are plural illumination boards in the illumination section, it may be treated as constituting one illumination section for each illumination board (it has plural illumination sections as a whole), or it may be treated as constituting one illumination section for the plural illumination boards as a whole.

[0035] Here, the side illumination unit 35 will be described in detail.

[0036] As shown in Fig. 5, the side illumination unit 35 is arranged in a ring shape along the horizontal direction (XY plane). The side illumination unit 35 has at least one illumination board 35K arranged in a ring shape surrounding the optical axis OC of the component recognition camera 28. The side illumination unit 35 has a plurality of light-emitting elements 355 mounted in a ring shape similar to that described above on the at least one illumination board 35K. The side illumination unit 35 has wiring components 353 attached to a portion of the illumination board 35K along the Y direction for supplying power to the plurality of light-emitting elements 355. The at least one illumination board 35K arranged in a ring shape has its outer periphery supported by a support member 356.

[0037] The illumination board 35K is disposed approximately parallel to the side wall of the housing 32 of the illumination unit 31, that is, disposed along the Z direction. The illumination board 35K is provided, for example, such that the direction of irradiation of light by the light emitting element 355 is perpendicular to the optical axis OC of the image sensor section 29. In addition, the side illumination section 35 is disposed above the reflective illumination section 33 and the transmitted illumination section 34.

[0038] The light emitting element 355 has, for example, a built-in lens and has a wide directional angle (for example, 120°) as a directional characteristic. In addition, the amount of light emitted by the light emitting element 355 is larger than that of the conventional light emitting element, and the imaging target (for example, the component P) can be brightly illuminated even if the optical axis of the light emitting element 355 is not directed toward the imaging target. The light emitting element 355 is, for example, an LED, but may be another light emitting element. The wiring component 353 may include, for example, a terminal, a lead, a wire, or a cable that can be electrically connected to the outside. The light emitting element 355 is mounted on at least one illumination board 35K, so that the multiple light emitting elements 355 are arranged in a ring shape. In addition, the multiple light emitting elements 355 are arranged in a ring shape from a portion along the X direction to a portion along the Y direction of the illumination board 35K.

[0039] 5, a plurality of (e.g., eight) illumination boards 35K are arranged in a polygonal (e.g., octagonal) ring shape in top view. On the illumination board 35K, a plurality of light emitting elements 355 are arranged in one or more rows in the Z direction, aligned in a predetermined direction on the XY plane. In other words, the side illumination unit 35 is a surface-mounted type illumination unit.

[0040] The illumination substrate 35K may be formed of a rigid-flexible substrate 350. The rigid-flexible substrate 350 includes a flexible substrate 351 (i.e., a flexible portion) and a rigid substrate 352 (i.e., a rigid portion). When a plurality of rigid-flexible substrates 350 are provided, the flexible substrates 351 (flexible portions) of adjacent rigid-flexible substrates 350 are electrically connected. Since the flexible substrate 351 has flexibility, adjacent flexible substrates 351 can be easily connected to each other. In addition, the flexible substrate 351 may be formed of one ring-shaped flexible substrate 351 as shown in FIG. 5, or a plurality of flexible substrates 351 may be electrically connected to form a ring-shaped structure.

[0041] A plurality of light emitting elements 355 and wiring components 353 are mounted on a rigid substrate 352 (rigid portion) of the rigid-flexible substrate 350. The rigid substrate 352 is not flexible, so the position and shape of the illumination substrate 35K are fixed (do not change). Therefore, the positions and shapes of the light emitting elements 355 and wiring components 353 mounted on the rigid substrate 352 are fixed (do not change). Therefore, the illumination position and illumination direction of the light emitting elements 355 are stable, and the component P can be suitably illuminated. Note that the light emitting elements 355 and wiring components 353 are mounted on the rigid substrate 352, but are electrically connected to a flexible substrate 351 included in the rigid-flexible substrate 350 including the rigid substrate 352.

[0042] The wiring components 353 are disposed on at least one of the illumination boards 35K facing each other in the X direction, in other words, the illumination boards 35K aligned along the Y direction. In the example of FIG. 5, two illumination boards 35K1 and 35K5 of the eight illumination boards 35K (35K1 to 35K8) are disposed facing each other in the X direction. In FIG. 5, the two illumination boards 35K1 and 35K5 are provided with the wiring components 353 for supplying power to the electronic components (e.g., the light-emitting elements 355) on each illumination board 35K. Therefore, it is necessary to secure a long installation space for the wiring components 353 in the X direction in the side illumination unit 35. On the other hand, the wiring components 353 are not attached to the illumination boards 35K (illumination boards 35K2 to 35K4, 35K5 to 35K7) other than the illumination boards 35K1 and 35K5. Therefore, since there is no need to secure installation space for the wiring components 353 in the side illumination section 35 in any direction other than the X direction (for example, the Y direction), the length of the side illumination section 35 in the Y direction can be shortened.

[0043] The side lighting section 35 receives power from the outside through the wiring component 353, and supplies power from the lighting boards 35K1 and 35K5 to the other lighting boards 35K through the flexible boards 351 of the lighting boards 35K. Therefore, the length of the side lighting section 35 in the Y direction can be shortened, the side lighting section 35 and the lighting unit section 31 can be miniaturized, and the light emitting element 355 of each lighting board 35K of the side lighting section 35 can emit light. In addition, since the length of the side lighting section 35 in the Y direction can be shortened, the component mounting device 1 can shorten the length between the component supply mechanism 15 and the board transport mechanism 13 along the Y direction. Therefore, the component mounting device 1 can shorten the distance between the take-out position and the mounting operation position of the component P, and can shorten the forward movement distance in one turn, so that the mounting speed of the component P on the board W can be improved and the productivity can be improved.

[0044] The side illumination unit 35 emits light at timing t3 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the side of the component P held by the component holding nozzle 27 is illuminated by the light emitted from the side illumination unit 35. Corresponding to this timing t3, the imaging sensor unit 29 captures an image of the component P.

[0045] The side illumination unit 35 may configure a side illumination channel. The control unit 40 may perform light emission control for each side illumination channel. Also, a different channel may be formed for each row in the Z direction of the multiple light emitting elements 355 mounted on the illumination board 35K.

[0046] Note that the illumination board 35K may be formed of, for example, a flexible board 351 and may not include the rigid board 352. In this case, the illumination board 35K may be configured such that adjacent flexible boards 351 are electrically connected to each other, wiring components 353 are attached to at least one flexible board 351 facing each other in the X direction, and power can be supplied from the wiring components 353 to each light-emitting element 355 mounted on each flexible board 351.

[0047] As shown in FIG. 6, the light emitting element 355 has a wide directivity angle (wide directivity) that can irradiate light wider than the direction of the optical axis of the light emitting element 355. Therefore, even if the illumination board 35K is arranged along the Z direction and the direction of the optical axis of the light emitting element 355 is along the XY plane, the light can be irradiated to the board W and the component P that may be located above the light emitting element 355. Therefore, the illumination unit section 31 can shorten the length of the illumination board 35K along the XY plane, and the illumination board 35K can be made thinner in the direction of the XY plane. In other words, the component mounting device 1 can be vertically arranged (arranged along the Z direction) by surface mounting, and the space required in the X and Y directions including wiring materials and structures for fixing can be reduced, and the side illumination section 35 and the illumination unit section 31 can be made smaller.

[0048] Furthermore, the light-emitting element 355 may be a light-emitting element that emits more light than conventional light-emitting elements. In this case, the component mounting device 1 can appropriately image and recognize the component P even when the component recognition camera 28 images the component P while it is moving and the exposure time of the component recognition camera 28 cannot be long.

[0049] 5, the multiple illumination boards 35K are arranged in an octagonal shape in top view, but this is not limited thereto. For example, the multiple illumination boards 35K may be arranged in a polygonal ring shape that approaches a circle in top view. In this case, the amount of illumination to each position above the side illumination unit 35 is likely to be uniform. For example, the multiple illumination boards 35K may be arranged in a square ring shape in top view.

[0050] Next, each of the illumination sections in the illumination unit section 31 other than the side illumination section 35 will be described.

[0051] The multiple reflective illumination units 33 are disposed below the side illumination unit 35 and surrounding the center inside the ring formed by the multiple side illumination units 35 so that a space is formed in the center. The multiple transmitted illumination units 34 are disposed between the reflective illumination unit 33 and the side illumination unit 35. The coaxial illumination unit 39 and the reflector C are disposed below the reflective illumination unit 33.

[0052] The reflective illumination section 33 is disposed approximately parallel to the bottom wall (i.e., the XY plane, horizontal plane) of the housing 32 of the illumination unit section 31. The reflective illumination section 33 is provided so that the direction of light irradiation is along the optical axis of the imaging sensor section 29. When emitting light, the reflective illumination section 33 irradiates light in an approximately vertical direction (Z direction). A transparent glass (not shown) may be disposed in the horizontal direction between the component P held by the component holding nozzle 27 and the reflective illumination section 33.

[0053] The reflective illumination unit 33 emits light at a timing t1 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the bottom surface of the component P held by the component holding nozzle 27 is illuminated by the light irradiated from the reflective illumination unit 33 and transmitted through the transmission glass. Corresponding to this timing t1, the imaging sensor unit 29 captures an image of the component P.

[0054] The plurality of reflective illumination units 33 may configure a reflective illumination channel. The control unit 40 may perform light emission control for each reflective illumination channel.

[0055] The transillumination unit 34 is disposed obliquely with respect to the bottom wall and side wall (i.e., Z direction) of the housing 32. The transillumination unit 34 is provided so that the direction of light irradiation is oblique with respect to the optical axis of the image sensor unit 29. A shielding plate B is disposed between the reflective illumination unit 33 and the transillumination unit 34. Similar to the transillumination unit 34, the shielding plate B is disposed so as to be oblique with respect to both the bottom wall and side wall of the housing 32.

[0056] When the transillumination unit 34 emits light, it irradiates the light obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). The transillumination unit 34 emits light at a timing t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the component P held by the component holding nozzle 27 is illuminated by the light irradiated from the transillumination unit 34 and reflected by the reflector of the moving head 26. In response to this timing t2, the imaging sensor unit 29 captures an image of the component P.

[0057] The multiple transillumination units 34 may configure a transillumination channel. The control unit 40 may perform light emission control for each transillumination channel.

[0058] The coaxial illumination section 39 is disposed approximately parallel to the side wall of the housing 32 of the illumination unit section 31. The coaxial illumination section 39 is provided so that the direction of light irradiation is perpendicular to the optical axis of the imaging sensor section 29. The coaxial illumination section 39 is disposed below the reflective illumination section 33. When the coaxial illumination section 39 emits light, it irradiates light along a horizontal plane. In addition, a reflector C (e.g., a mirror) included in the component recognition camera 28 is disposed at a position spaced apart from the coaxial illumination section 39 in the direction along the XY plane. The light irradiated from the coaxial illumination section 39 is reflected upward by the reflector C and illuminates the area above the reflector C.

[0059] The coaxial illumination unit 39 emits light at timing t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the lower part of the component P held by the component holding nozzle 27 is illuminated by light that is irradiated from the coaxial illumination unit 39, reflected upward by the reflector C, and passed through the central space surrounded by the multiple reflective illumination units 33 and the transmissive glass. Corresponding to this timing t4, the imaging sensor unit 29 captures an image of the component P.

[0060] The coaxial illumination unit 39 may configure a coaxial illumination channel. The control unit 40 may perform light emission control on a coaxial illumination channel basis.

[0061] The light emission timings t1 to t4 of each of the illumination units 33, 34, 35, and 39 may be any of a plurality of image capture timings within the time of the forward movement in one turn. The light emission timings of the illumination units 33, 34, 35, and 39 may overlap. For example, at least two of the illumination units 33, 34, 35, and 39 may emit light simultaneously to illuminate the component P.

[0062] Next, the imaging range CA captured by the component recognition camera 28 will be described.

[0063] The imaging range CA may be, for example, large enough to accommodate the entire component P, or may be large enough so that only a portion of the component P is included in the imaging range CA, rather than the entire component P being accommodated therein. If the entire component P fits within the imaging range CA, the component mounting device 1 can recognize the component P based on the captured image. Even if the entire component P does not fit within the imaging range CA, the component mounting device 1 can grasp the entire component P by, for example, capturing multiple images of the component P moving in one turn and combining the multiple captured images.

[0064] While the head unit 23 moves along the X direction, the imaging range CA is imaged by the component recognition camera 28. Therefore, a different component P or a different part of the same component P is reflected in each imaging range CA that is imaged sequentially.

[0065] <Software configuration of component mounting device> Next, the software configuration (functional configuration) of the control unit 40 of the component mounting apparatus 1 will be described with reference to Fig. 7. Fig. 7 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting apparatus 1.

[0066] The control unit 40 of the component mounting apparatus 1 may be configured by a general-purpose computer including a storage device represented by a ROM (Read Only Memory) and a RAM (Random Access Memory), and an arithmetic device represented by a CPU (Central Processing Unit). The arithmetic device realizes the software configuration (functional configuration) shown in FIG. 7 by reading and executing a computer program stored in the storage device. That is, each block shown in the control unit 40 in FIG. 7 represents a function realized by software. However, at least a part of the functions expressed as blocks is not limited to software, and may be realized by the physical configuration (hardware) of the "apparatus".

[0067] The control unit 40 includes a storage unit 41, a mechanism driving unit 46, and an image processing unit 47. The mechanism driving unit 46 controls the driving of the main body mechanism unit 10. For example, the mechanism driving unit 46 controls the driving of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23, and causes the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 to operate in a coordinated manner.

[0068] The storage unit 41 holds at least mounting information 42, component information 43, and imaging timing information 45. The mounting information 42 includes information such as the type of component P to be mounted on each board W, the mounting position and mounting attitude (e.g., orientation) of the component P on the board W, the mounting order of the components P, and the mounting timing of the components P. The component information 43 may include information such as the outer shape and size of each type of component P, and the presence or absence of electrodes or the number of electrodes.

[0069] The imaging timing information 45 may include information indicating the light emission timing of the lighting channel and information indicating the imaging timing of the component P. The number of imaging timings may be one or more. The imaging timing may be interpreted as shutter timing. Also, the number of light emission timings may be one or more. For example, the imaging timing information 45 may include information indicating the light emission timing of the lighting channel during the forward movement in one turn and information indicating the imaging timing of the imaging sensor unit 29.

[0070] The imaging processing unit 47 includes a camera control unit 48 and a part recognition unit 50 .

[0071] The camera control unit 48 controls the imaging of the imaging sensor unit 29 and the light emission at the imaging timing of the lighting unit 31. For example, the camera control unit 48 reads the imaging timing information 45 from the storage unit 41, and causes the lighting channel to emit light at each imaging timing indicated by the imaging timing information 45, and causes the imaging sensor unit 29 to capture an image showing the component P.

[0072] The component recognition unit 50 recognizes the characteristics of the component P contained in the captured image based on the captured image captured by the image capture sensor unit 29. The characteristics of the component P may include at least one of the position of the component P, the attitude of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, and characters added to the component P. The moving head 26 and the component holding nozzle 27 mount the component P at the mounting point on the board W based on the recognition result by the component recognition unit 50.

[0073] The imaging information of the board recognition camera 36 may also be transmitted to the imaging processing unit 47. The imaging processing unit 47, like the component recognition unit 50, may recognize the position and posture of the board W from the imaging information (image) and transmit the recognition result to the mechanism driving unit 46.

[0074] <Operation of component mounting equipment> Fig. 11 is a flowchart showing an example of the operation of the component mounting apparatus 1. When an instruction to start production is received, the component mounting apparatus 1 starts the following process. Note that in Fig. 11, the head unit 23 is also simply referred to as a head. Also, the component holding nozzle 27 is also simply referred to as a nozzle.

[0075] The mechanism driving unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism driving unit 46 starts the forward movement (head movement) in one turn from the time of transmission of step S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12).

[0076] Based on information (e.g., mounting information 42, component information 43, imaging timing information 45) stored in the storage unit 41, the camera control unit 48 controls the head unit 23 to illuminate and image the component P held by the component holding nozzle 27 to be imaged under predetermined illumination conditions (predetermined illumination timing and predetermined illumination intensity) while the head unit 23 is moving (S13). Then, under the control of the camera control unit 48, the illumination unit 31 (at least one illumination channel) illuminates the component P held by the predetermined component holding nozzle 27 at a light emission timing corresponding to the imaging timing of the component P. Then, under the control of the camera control unit 48, the component recognition camera 28 images the component P passing above at the imaging timing (S14).

[0077] The processes of steps S13 and S14 are repeated while the head unit 23 is moving. That is, the illumination and imaging are repeated while the part P to be illuminated and imaged is changed sequentially.

[0078] The component recognition unit 50 performs image recognition on the captured image (S15). In this case, the component recognition unit 50 recognizes one or more components P included in the captured image, and acquires recognition information related to the components P. The recognition information related to the components P here may include, for example, position information and orientation information of the components P, discrimination information on the polarity of the components P, information on the measurement results of the 3D measurement of the components P, information on the recognition results of the external shape of the components P, information on the recognition results of the characters added to the components P, or information on the recognition results of the alignment of the components P. The component recognition unit 50 sends the recognition results of the image recognition to the mechanism driving unit 46.

[0079] Shortly after each component holding nozzle 27 passes above the component recognition camera 28, head unit 23 reaches the vicinity of the mounting position of each component P. Then, mechanism driving unit 46 ends the movement of moving head 26 above the component recognition camera 28 (S16). Based on the recognition result by component recognition unit 50, mechanism driving unit 46 commands moving head 26 of head unit 23 to mount each component P at a predetermined position and attitude on board W. Following the command from mechanism driving unit 46, head unit 23 mounts each component P on board W with moving head 26 (S17).

[0080] In this way, according to the component mounting device 1 of the present embodiment, the side lighting section 35, the lighting unit section 31, and the component recognition camera 28 can be made smaller by arranging the lighting board 35K of the side lighting section 35 to be parallel to the direction of the optical axis OC of the component recognition camera 28. Therefore, the component mounting device 1 can improve the mounting speed of the component P and improve productivity. In addition, since the light emitting element 355 has a wide directivity angle characteristic, it is possible to illuminate the workpiece (for example, the component P) without directing the optical axis of the light emitting element to the workpiece. In addition, the wiring components 353 of the lighting board 35K are arranged along the X direction, in other words, they are arranged only on at least one of the lighting boards 35K facing each other in the X direction, and the wiring components 353 are not arranged on the other lighting boards 35K. As a result, the component mounting device 1 can shorten the length of the side lighting section 35 in the Y direction, that is, the side lighting section 35 can be made thinner. Even in this case, the illumination boards 35K are electrically connected via the flexible portion of the illumination board 35K, so that the light emitting elements 355 mounted on the illumination boards 35K can receive power and can irradiate the component P. Furthermore, by using a rigid-flexible board 350 as the illumination board 35K, the ease of assembly of the side illumination unit 35 can be improved. Furthermore, the component mounting device 1 can proceed with each process such as imaging and recognition of the component P while the head unit 23 is moving, so that real-time performance can be improved and the time required for component recognition can be shortened.

[0081] (Outline of the embodiment) As a result, the present disclosure includes at least the following items. Note that in parentheses, examples of components corresponding to the above-described embodiment are given, but the present disclosure is not limited to these.

[0082] [Item 1] A component mounting device (component mounting device) in which a mounting head (moving head 26) takes out a component P from a component supply unit (component supply mechanism 15) and mounts the component on a first board (board W) transported in a board transport direction (X direction) on a board transport path, a component imaging camera (component recognition camera 28) that is disposed between the component supply unit and the board transport path along an orthogonal direction (Y direction) perpendicular to the board transport direction and captures an image of the component taken out by the mounting head from below; The component imaging camera has an illumination unit (illumination unit section 31) that illuminates the component taken out by the mounting head, The lighting unit includes: At least one second substrate (illumination substrate 35K) arranged in a ring shape surrounding the optical axis OC of the component imaging camera; A plurality of light-emitting elements (light-emitting elements 355) mounted in the ring shape on at least one of the second substrates; and a wiring component (wiring component 353) for supplying power to the plurality of light-emitting elements, the wiring component (wiring component 353) being attached only to a portion of the second substrate along the orthogonal direction. Component mounting equipment.

[0083] As a result, the component mounting device can shorten the length of the lighting unit in the orthogonal direction by attaching the wiring member only to the portion of the second board along the orthogonal direction. Therefore, the component mounting device can shorten the length of movement in one turn and improve the component mounting speed. In addition, the component mounting device can illuminate from each direction centered on the optical axis of the component imaging camera, and can illuminate the area below the component from each direction. Therefore, the component mounting device can prevent insufficient illumination of some areas of the component and can stably recognize the component based on the captured image.

[0084] [Item 2] The second substrate is a flexible substrate (flexible substrate 351), Component mounting equipment for item 1.

[0085] This allows the component mounting device to easily deform the shape of the second substrate and arrange the second substrate in a ring shape. The component mounting device can also supply power to each light emitting element via the second substrate.

[0086] [Item 3] The second substrate is a rigid-flexible substrate (rigid-flexible substrate 350) having a rigid portion (rigid substrate 352) and a flexible portion (flexible substrate 351), The plurality of light-emitting elements are mounted on the rigid portion of the rigid-flexible substrate. Component mounting equipment for item 1.

[0087] This allows the component mounting device to supply power to each light-emitting element via the flexible portion. Also, since the position of each light-emitting element is stabilized by the rigid portion of the component mounting device, the direction of light emitted by each light-emitting element is also stabilized, allowing the component to be stably illuminated.

[0088] [Item 4] the second substrate is a rigid-flexible substrate having a rigid portion and a flexible portion; the wiring component is attached to the rigid portion of the rigid-flexible substrate; Component mounting equipment according to item 1 or 3.

[0089] In this way, the component mounting device can supply power to each light emitting element via the flexible portion. Also, since the position of the wiring member is stabilized by the rigid portion of the component mounting device, the length of the lighting unit in the orthogonal direction can be reliably shortened.

[0090] [Item 5] The second substrate is disposed approximately parallel to the optical axis of the component imaging camera. Item 1, 3, or 4. A component mounting apparatus according to any one of items 1, 3, and 4.

[0091] As a result, the second board is arranged perpendicular to a plane (XY plane) defined by the board transport direction and the direction perpendicular to the board transport direction, and the length of the second board along the plane (i.e., the length of the second board in the thickness direction) is shortened. This makes it possible to further shorten the length of the lighting unit in the perpendicular direction, shorten the moving distance in one turn, and improve the component mounting speed. In addition, the lighting unit can be made smaller.

[0092] [Item 6] The lighting unit has a length along the orthogonal direction that is shorter than a length along the substrate transport direction. Item 1. A component mounting apparatus according to any one of items 1, 3, 4, and 5.

[0093] This allows the component mounting device to shorten the movement distance in one turn and increase the component mounting speed, while ensuring the necessary space in the board transport direction (for example, space for arranging wiring components).

[0094] [Item 7] an imaging device (component recognition camera 28) that images a component to be mounted on a first board that is taken out from the component supply unit by the mounting head and transported in the board transport direction on the board transport path, a component supply unit disposed between the component supply section and the board transport path along a direction perpendicular to the board transport direction; taking an image of the component removed by the mounting head from below; an illumination unit that illuminates the component picked up by the mounting head; The lighting unit includes: At least one second substrate arranged in an annular shape surrounding an optical axis of the imaging device; A plurality of light emitting elements mounted in the annular shape on at least one of the second substrates; and a wiring component for supplying power to the plurality of light-emitting elements, the wiring component being attached only to a portion of the second substrate along the orthogonal direction. Imaging device.

[0095] As a result, the imaging device can shorten the length of the lighting unit in the orthogonal direction by attaching the wiring member only to the portion of the second board along the orthogonal direction. Therefore, the imaging device can shorten the length of movement in one turn and improve the component mounting speed. In addition, the imaging device can illuminate from each direction centered on the optical axis of the component imaging camera, and can illuminate the area below the component P from each direction. Therefore, the imaging device can prevent insufficient illumination of some areas of the component and can obtain an image that allows stable component recognition.

[0096] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also belong to the technical scope of the present disclosure. In addition, the components in the above-mentioned embodiments may be arbitrarily combined within the scope of the invention. [Industrial Applicability]

[0097] The present disclosure is useful for component mounting devices and imaging devices that can be miniaturized and can increase the speed at which electronic components are mounted. [Explanation of symbols]

[0098] 1 Component mounting equipment 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 Slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Part holding nozzle 28 Parts Recognition Camera 29 Image sensor section 30 Case 31 Lighting unit section 32 Case 33 Reflection lighting section 34 Transillumination unit 35 Side lighting section 35K lighting board 350 Rigid-Flexible PCB 351 Flexible PCB 352 Rigid Board 353 Wiring parts 355 Light emitting element 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 39 Coaxial lighting section 40 Control section 41 Storage section 42 Implementation Information 43 Parts Information 45 Imaging timing information 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit 71 Lens 72 Image sensor B Shielding plate C Reflector P parts W substrate

Claims

1. A component mounting apparatus in which a mounting head takes out a component from a component supply unit and mounts the component on a first board transported on a board transport path in a board transport direction, a component imaging camera that is disposed between the component supply unit and the board transport path along a direction perpendicular to the board transport direction and that images the component taken out by the mounting head from below; the component imaging camera has an illumination unit that illuminates the component picked up by the mounting head, The lighting unit includes: At least one second substrate arranged in a ring shape surrounding the optical axis of the component imaging camera; A plurality of light emitting elements mounted in the annular shape on at least one of the second substrates; a wiring component for supplying power to the plurality of light-emitting elements, the wiring component being attached only to a portion of the second substrate along the orthogonal direction; Component mounting equipment.

2. The second substrate is a flexible substrate. The component mounting apparatus according to claim 1 .

3. the second substrate is a rigid-flexible substrate having a rigid portion and a flexible portion; The plurality of light-emitting elements are mounted on the rigid portion of the rigid-flexible substrate. The component mounting apparatus according to claim 1 .

4. the second substrate is a rigid-flexible substrate having a rigid portion and a flexible portion; the wiring component is attached to the rigid portion of the rigid-flexible substrate; The component mounting device according to claim 1 or 3.

5. The second substrate is disposed approximately parallel to the optical axis of the component imaging camera. The component mounting device according to claim 1 or 3.

6. The lighting unit has a length along the orthogonal direction that is shorter than a length along the substrate transport direction. The component mounting device according to claim 1 or 3.

7. An imaging device that images a component to be mounted on a first board that is taken out from a component supply unit by a mounting head and transported in a board transport direction on a board transport path, comprising: a component supply unit disposed between the component supply section and the board transport path along a direction perpendicular to the board transport direction; taking an image of the component removed by the mounting head from below; an illumination unit that illuminates the component picked up by the mounting head; The lighting unit includes: At least one second substrate arranged in an annular shape surrounding an optical axis of the imaging device; A plurality of light emitting elements mounted in the annular shape on at least one of the second substrates; a wiring component for supplying power to the plurality of light-emitting elements, the wiring component being attached only to a portion of the second substrate along the orthogonal direction; Imaging device.

Images