Housing structure and actuator provided with the housing structure
JP2024175273AInactive Publication Date: 2024-12-18MINEBEAMITSUMI INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- JP2023092929
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 00000000_0000_ABST 
Figure 00000000_0001_ABST
Abstract
To provide housing structure and an actuator, in each of which heat of an electronic component mounted on a circuit board can be efficiently released.SOLUTION: Housing structure of the present invention comprises: a housing (130) having a first casing (110) and a second casing (120); and a circuit board (900) arranged inside the housing (130). The first casing (110) has a first wall (117) extending from the first casing (110) to the circuit board (900), the second casing (120) has a second wall (127) extending from the second casing (120) to the circuit board (900), and the circuit board (900) comes in contact with the first wall (117) and the second wall (127).SELECTED DRAWING: Figure 4
Need to check novelty before this filing date? Find Prior Art
