Housing structure and actuator provided with the housing structure

JP2024175273AInactive Publication Date: 2024-12-18MINEBEAMITSUMI INC
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Patent Information

Application Number
JP2023092929
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2024-12-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

To provide housing structure and an actuator, in each of which heat of an electronic component mounted on a circuit board can be efficiently released.SOLUTION: Housing structure of the present invention comprises: a housing (130) having a first casing (110) and a second casing (120); and a circuit board (900) arranged inside the housing (130). The first casing (110) has a first wall (117) extending from the first casing (110) to the circuit board (900), the second casing (120) has a second wall (127) extending from the second casing (120) to the circuit board (900), and the circuit board (900) comes in contact with the first wall (117) and the second wall (127).SELECTED DRAWING: Figure 4
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