Production management apparatus, substrate processing apparatus, production management method, and program

Abstract

To provide a production management apparatus capable of solving a problem occurring in a substrate processing apparatus in a short time.SOLUTION: A production management apparatus 2 includes: a state monitoring unit 231 configured to detect deterioration of apparatus quality on the basis of information indicating a result of a mounting related operation acquired from a substrate processing apparatus 1 including an execution unit for executing the mounting related operation with respect to a substrate; a manufacturing instruction unit 260 configured to cause the substrate processing apparatus 1 to execute deterioration countermeasure processing for performing a countermeasure against the deterioration in the apparatus quality; an effect verification unit 240 configured to verify whether the result of the mounting related operation by the substrate processing apparatus 1 in which the deterioration countermeasure processing is executed is improved; and a rollback processing unit 250 configured to execute, when the result of the mounting related operation by the substrate processing apparatus 1 in which operating conditions changing processing for changing operating conditions of the mounting related operation by the execution unit is executed as the deterioration countermeasure processing is not improved, rollback processing for returning a value indicated by operating conditions after changing to a value before changing, before causing the substrate processing apparatus 1 to execute another deterioration countermeasure processing.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a production management device that manages a board processing apparatus that performs mounting-related work on a board. [Background technology]

[0002] Patent Document 1 discloses a technique in which, when a problem occurs in a production device, a work instruction corresponding to the problem is output while updating a countermeasure for the problem, and the work instructions are output in order of priority until the problem is solved by the output work instructions. This increases the possibility that the problem occurring in the production device can be solved in a short time. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 142604 Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology disclosed in Patent Document 1, if the cause of the problem is a component error, a process of changing the operating conditions of the mounting-related work may be output as a work instruction with priority. However, if the problem is not solved by this work instruction, the substrate processing apparatus that performs the mounting-related work is in a state where the changed operating conditions are set. Therefore, if the work according to the next work instruction is performed in this state, it may be difficult to reach the root cause of the problem due to the influence of the changed operating conditions, and it may take a long time to solve the problem.

[0005] Therefore, the present disclosure provides a production management device and the like that can quickly solve problems that occur in a substrate processing apparatus. [Means for solving the problem]

[0006] The production management device according to the present disclosure comprises: a status monitoring unit that detects deterioration in equipment quality based on information indicating results of mounting-related work obtained from a substrate processing apparatus having an execution unit that performs mounting-related work on a substrate; a manufacturing instruction unit that causes the substrate processing apparatus to execute a deterioration countermeasure process to address the deterioration in equipment quality; an effect verification unit that performs an effect verification process after the substrate processing apparatus executes the deterioration countermeasure process, and confirms whether or not results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process have improved; and a rollback processing unit that performs a rollback process to return values ​​indicated by the changed operating conditions to values ​​before the change before the manufacturing instruction unit causes the substrate processing apparatus to execute another deterioration countermeasure process if results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process as the deterioration countermeasure process have not improved.

[0007] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program. Effect of the Invention

[0008] According to the production management device and the like according to the present disclosure, problems occurring in the substrate processing apparatus can be resolved in a short period of time. [Brief description of the drawings]

[0009] [Figure 1] 1 is a diagram showing a mounting line to which a production management device according to an embodiment is applied; [Diagram 2] 1 is a configuration diagram illustrating an example of a production management device according to an embodiment; [Diagram 3] 1 is a configuration diagram showing an example of a substrate processing apparatus according to an embodiment; [Figure 4] 4 is a flowchart showing an example of an operation of the production management device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0011] (Embodiment) A production management device and a substrate processing apparatus according to an embodiment will be described below with reference to FIGS.

[0012] FIG. 1 is a diagram showing a mounting line 40 to which a production management device according to an embodiment of the present invention is applied.

[0013] The mounting line 40 is provided with a plurality of substrate processing apparatuses each having an execution unit that executes mounting-related work on a substrate. The mounting line 40 has a function of producing a mounted substrate by mounting components (electronic components) on a substrate, and also has a function of supplying, transferring, and collecting the substrates to be mounted.

[0014] For example, in the mounting line 40, a board supplying device M1, a board transferring device M2, a printing device M3, mounting devices M4 and M5, a reflow device M6, a board removing device M7, and an inspection device M8 are connected in series in this order. Each device from the board supplying device M1 to the inspection device M8 is connected to the line management device 50 via the communication network 30.

[0015] For example, printing device M3, mounting devices M4 and M5, and inspection device M8 are an example of board processing apparatus 1 (see FIG. 3) equipped with an execution unit that executes mounting-related work on boards transported along mounting line 40. The mounting-related work performed by printing device M3 is solder printing work, the mounting-related work performed by mounting devices M4 and M5 is component mounting work, and the mounting-related work performed by inspection device M8 is board inspection work.

[0016] The board supplied by board supplying device M1 is carried into printing device M3 via board transferring device M2. Printing device M3 performs a solder printing operation on the carried-in board by screen-printing solder for joining components.

[0017] The boards on which the solder has been printed are sequentially delivered to mounting devices M4 and M5. The mounting devices M4 and M5 perform component mounting work to mount components on the boards on which the solder has been printed.

[0018] The mounting devices M4 and M5 each include a base, a board transport unit, a component supply device, and a mounting head. A board is placed on the base. The board transport unit can transport the board delivered from the upstream device to the downstream device. The component supply device can supply components to the mounting head. The component supply device is provided with a plurality of tape feeders for supplying components to the mounting head. The mounting head can pick up components from the tape feeders and move above the board to mount the components on the mounting position of the board. The mounting head is equipped with a suction nozzle that can pick up and hold components and move up and down individually. Component mounting work is performed by such mounting devices M4 and M5.

[0019] After the components are mounted on the board, it is carried into the reflow device M6 and heated according to a specified heating profile. This melts and solidifies the solder for joining the components printed on the heated board. The components are soldered to the board in this way, completing the mounted board with the components mounted on the board. The completed mounted board is then collected by the board collection device M7.

[0020] The inspection device M8 performs a board inspection of the board on which the components are mounted. For example, the inspection device M8 performs an appearance inspection of the board, specifically, inspects the presence or absence of solder bridges and the like, inspects the presence or absence of dust on the board, etc., using a camera, etc. In addition, for example, the inspection device M8 may also perform a continuity inspection of the board.

[0021] Next, the configuration of the production management device 2 will be described with reference to FIG.

[0022] Fig. 2 is a configuration diagram showing an example of a production management device 2 according to an embodiment. In Fig. 2, in addition to the production management device 2, a substrate processing device 1, a storage device 3, a communication unit 4, and a data creation device 5 are also shown.

[0023] The production management device 2 is a device that manages the state of the substrate processing apparatus 1 and the like. The production floor to which the production management device 2 is applied includes, for example, a mounting line 40, an inventory warehouse, a preparation area, and a maintenance area. As described above, the mounting line 40 is provided with the substrate processing apparatus 1, such as the mounting apparatuses M4 and M5, the printing apparatus M3, and the inspection apparatus M8. In the inventory warehouse, materials such as parts, solder, and screen masks are stored. In the preparation area, preparation is performed for the work units, such as the dolly, the feeder, the nozzle and head, and the nozzle changer, as well as the mounting-related materials, such as the parts used in the substrate processing apparatus 1, and the printing-related materials, such as the solder and the mask. In the maintenance area, maintenance is performed for the work units and jigs. For example, the work units are heads and feeders, and the maintenance targets are the head main body constituting the head, one or more spindles provided on the head main body, and one or more nozzles and feeders detachably attached to each of the one or more spindles. The jig referred to here is one that adjusts the feeder, the nozzle, the head, and the like, and may also be one that adjusts the head moving mechanism and the transport mechanism of the equipment. Workers perform work such as production, preparation, and maintenance in each area on the production floor, and transfer parts and work units between each area. For example, the production management device 2 is a computer placed on the production floor. For example, the functions of the production management device 2 may be provided in the line management device 50. The production management device 2 may be a computer provided in one housing, or may be divided into two or more housings and realized by two or more computers. The production management device 2 does not have to be placed on the production floor, and may be a computer such as a server provided outside the production floor. Workers are not limited to people, and include robots, working mechanisms, and automatic guided vehicles that perform the above-mentioned work.

[0024] The production management device 2 is a device that outputs work instructions to workers on the production floor or the substrate processing device 1, etc., depending on the state of the substrate processing device 1, etc. The production management device 2 includes a control unit 210, a memory control unit 220, a countermeasure analysis unit 230, an effect verification unit 240, a rollback processing unit 250, a manufacturing instruction unit 260, and an acquisition unit 270. The production management device 2 is realized by a computer including a processor, a memory, etc. The memory is a ROM (Read Only Memory) and a RAM (Random Access Memory), etc., and can store a program executed by the processor. The control unit 210, the memory control unit 220, the countermeasure analysis unit 230, the effect verification unit 240, the rollback processing unit 250, the manufacturing instruction unit 260, and the acquisition unit 270 are realized by the processor operating according to the program stored in the memory. The storage device 3 may be provided in the production management device 2.

[0025] The equipment quality information, problem discovery rules, cause estimation rules, and action lists are stored in the storage device 3. The equipment quality information is obtained from the substrate processing apparatus 1.

[0026] The control unit 210 is a processing unit that performs overall control of the production management device 2 , and controls the memory control unit 220 , the countermeasure analysis unit 230 , the effect verification unit 240 , the rollback processing unit 250 , the manufacturing instruction unit 260 and the acquisition unit 270 .

[0027] The memory control unit 220 controls the memory device 3 so that the acquisition unit 270 acquires equipment quality information from the memory device 3 and so that the countermeasure analysis unit 230 and others perform processing using problem discovery rules, cause estimation rules, action lists, etc. stored in the memory device 3.

[0028] The acquiring unit 270 acquires information used to monitor the state of the substrate processing apparatus 1 and the like. For example, the acquiring unit 270 acquires equipment quality information (specifically, productivity, quality, or the presence or absence of defects, etc.) of the substrate processing apparatus 1 from the storage device 3. The equipment quality information is an example of information indicating the results of mounting-related work acquired from the substrate processing apparatus 1 including an execution unit that executes mounting-related work on substrates. The equipment quality information may be a sensing history record by a sensor, or may be data input by a person.

[0029] The countermeasure analysis unit 230 includes a state monitoring unit 231 , a countermeasure decision unit 232 , and an arbitration unit 233 .

[0030] The state monitoring unit 231 detects deterioration of the equipment quality based on the equipment quality information. The operation of the state monitoring unit 231 will be described in detail later.

[0031] The countermeasure determining unit 232 estimates the cause of the deterioration of the equipment quality detected by the state monitoring unit 231, and determines a deterioration countermeasure process (countermeasure) for dealing with the deterioration of the equipment quality. The operation of the countermeasure determining unit 232 will be described later in detail.

[0032] When two or more problems occur simultaneously on the mounting line 40 and resources (task units) required for measures to resolve the respective problems overlap, it is difficult to simultaneously execute the two or more measures and verify the effects of the measures individually, so the arbitration unit 233 arbitrates between the two or more measures. For example, while one of the two or more measures is being executed using a certain resource, the arbitration unit 233 locks the resource so that other measures using the resource are not executed.

[0033] The manufacturing instruction unit 260 causes the substrate processing apparatus 1 to execute a deterioration countermeasure process for dealing with the deterioration of the equipment quality. That is, the manufacturing instruction unit 260 causes the substrate processing apparatus 1 to execute the countermeasure determined by the countermeasure determination unit 232.

[0034] After the substrate processing apparatus 1 has performed the deterioration countermeasure processing, the effect verification unit 240 performs an effect verification process to confirm whether or not the results of the mounting-related work performed by the substrate processing apparatus 1 that has performed the deterioration countermeasure processing have improved. The operation of the effect verification unit 240 will be described later in detail.

[0035] When the results of the mounting-related work of the substrate processing apparatus 1 in which the executing unit has executed an operating condition change process for changing the operating conditions of the mounting-related work as a deterioration countermeasure process are not improved, the rollback processing unit 250 executes a rollback process for returning the values ​​indicated by the changed operating conditions to the values ​​before the change before the manufacturing instruction unit 260 causes the substrate processing apparatus 1 to execute another deterioration countermeasure process. The operation of the rollback processing unit 250 will be described in detail later.

[0036] The communication unit 4 is a communication interface for communicating with the substrate processing apparatus 1, the production management apparatus 2, the storage apparatus 3, and the data creation apparatus 5.

[0037] The data creation device 5 creates production data used by the substrate processing apparatus 1 to execute mounting-related work on a substrate. The production data includes component-related information on components to be mounted on a substrate (information indicating the shape and dimensions of the components, so-called component outlines), handling conditions when the substrate processing apparatus 1 (mounting apparatus) executes mounting-related work (mounting position information indicating the mounting position of the components on the substrate, suction position information, shape and dimensions of the nozzle that picks up the components, and movement speed and acceleration of the mounting head equipped with the nozzle), and task unit-related information set for each of a plurality of task units constituting an execution unit used for mounting-related work for the components.

[0038] Next, the configuration of the substrate processing apparatus 1 will be described with reference to FIG.

[0039] Fig. 3 is a configuration diagram showing an example of a substrate processing apparatus 1 according to an embodiment. Fig. 3 shows a plurality of substrate processing apparatuses 1 (two substrate processing apparatuses 1 in this example) in a mounting line 40. Fig. 3 also shows a line management device 50. For example, the substrate processing apparatus 1 is either a printing device M3 that prints solder on lands of a substrate as a mounting-related task, or a mounting device M4 or M5 that mounts components at predetermined positions on the substrate on which solder has been printed as a mounting-related task.

[0040] The substrate processing apparatus 1 includes a main control unit 111, an operation control unit 112, an image processing unit 113, an execution unit 114, a display unit 115, and a notification unit 116. The substrate processing apparatus 1 is realized by a computer including a processor, a memory, and the like. The memory is a ROM, a RAM, and the like, and can store a program executed by the processor. The main control unit 111, the operation control unit 112, the image processing unit 113, the execution unit 114, the display unit 115, and the notification unit 116 are realized by the processor operating in accordance with the program stored in the memory.

[0041] The main control unit 111 is a processing unit that performs overall control of the substrate processing apparatus 1, and controls the operation control unit 112, the image processing unit 113, the display unit 115, and the notification unit .

[0042] The execution unit 114 performs mounting-related work on the board. When the board processing apparatus 1 is the printing apparatus M3, the execution unit 114 has a squeegee unit, a stage, a mask recognition camera, a board recognition camera, etc. as multiple work units, and performs solder printing work as the mounting-related work. When the board processing apparatus 1 is the mounting apparatus M4 or M5, the execution unit 114 has a horizontal movement mechanism, an elevation movement mechanism, a board recognition camera, etc. as multiple work units, and performs component mounting work as the mounting-related work.

[0043] The operation control unit 112 controls the operation of the execution unit 114. When the substrate processing apparatus 1 is the printing apparatus M3, the operation control unit 112 controls the operation of the squeegee unit, stage, etc. When the substrate processing apparatus 1 is the mounting apparatus M4 or M5, the operation control unit 112 controls the horizontal movement mechanism, the lift movement mechanism, etc.

[0044] The image processing unit 113 processes images captured by a camera provided in the substrate processing apparatus 1. When the substrate processing apparatus 1 is the printing apparatus M3, the image processing unit 113 processes images captured by a mask recognition camera and a substrate recognition camera, etc. When the substrate processing apparatus 1 is the mounting apparatus M4 or M5, the image processing unit 113 processes images captured by a substrate recognition camera, etc.

[0045] The display unit 115 displays the current status of the substrate processing apparatus 1 or instructions to an operator who performs work on the substrate processing apparatus 1.

[0046] The notification unit 116 notifies an external device (e.g., the production management device 2 or the storage device 3) of information regarding the results of the mounting-related work for each task unit constituting the execution unit 114 (specifically, information indicating the presence or absence of troubles such as pickup errors, recognition errors, installation errors, and sensor abnormalities, and the frequency of occurrence of such troubles), and receives instructions for operating condition change processing and rollback processing from the production management device 2. The results of the mounting-related work for each task unit referred to here may be the results of the mounting-related work for each of the smallest units of components constituting a task unit (e.g., a spindle).

[0047] The operation control unit 112 executes the operating condition change process and rollback process indicated by the received instruction. Specifically, upon receiving an instruction for the operating condition change process, the operation control unit 112 changes the operating conditions of the implementation-related work performed by the execution unit 114. Furthermore, upon receiving an instruction for the rollback process, the operation control unit 112 executes a process of returning the values ​​indicated by the changed operating conditions to the values ​​before the change.

[0048] Next, the operation of the production management device 2 will be described in detail with reference to FIG.

[0049] FIG. 4 is a flowchart showing an example of the operation of the production management device 2 according to the embodiment.

[0050] First, the acquisition unit 270 acquires the results of the mounting-related work (equipment quality information of the substrate processing apparatus 1 (specifically, information indicating production indexes such as productivity, quality, or defects, or information regarding trouble)) (step S11). The results of the mounting-related work referred to here may be for each action unit, or may be the results of the mounting-related work for each minimum unit component (e.g., spindle) that constitutes a work unit.

[0051] Next, the state monitoring unit 231 detects deterioration of the equipment quality based on the equipment quality information (step S12). For example, the state monitoring unit 231 detects deterioration of the equipment quality by checking the equipment quality information against a problem discovery rule. For example, the state monitoring unit 231 detects whether there is deterioration of the equipment quality for each of a plurality of operation units (e.g., an equipment stage, an equipment table, a feeder cart, a nozzle, a specific part, a head (spindle), a feeder, etc.) constituting the execution unit 114 of the substrate processing apparatus 1.

[0052] For example, the deterioration of equipment quality may include a deterioration in the defect rate based on the results of mounting-related work of each of the multiple work units constituting the execution section 114 of the substrate processing apparatus 1, an increase in non-operating time (in other words, a deterioration in the operating rate) caused by an error in the substrate processing apparatus 1, or a deterioration in the defect rate (e.g., the defect rate of the printing state, the defect rate of the mounting state, etc.) obtained from an inspection section (e.g., inspection device M8) that inspects the solder printing state or the component mounting state. Also, for example, the deterioration of equipment quality may include a deterioration in tact loss (e.g., a deterioration in cycle time or throughput).

[0053] For example, the state monitoring unit 231 may detect deterioration of the equipment quality depending on whether the failure rate of each of the multiple task units (mounting failure rate, printing failure rate, etc.) indicated by the equipment quality information exceeds a threshold value set for the failure rate of each of the multiple task units indicated by the problem discovery rule. The failure rate can be calculated, for example, by the number of pickup errors / total pickup count, the number of mounting errors / total pickup count, or the total number of errors / total pickup count. In addition, for example, the state monitoring unit 231 may detect deterioration of the equipment quality depending on whether the NG rate of the inspection result of the inspection device M8 indicated by the equipment quality information exceeds a threshold value set for the NG rate indicated by the problem discovery rule. The failure rate of each task unit referred to here may be the failure rate of each component (e.g., spindle) of the smallest unit that constitutes the task unit.

[0054] Next, the production management device 2 starts a deterioration handling process loop (step S13). Specifically, the production management device 2 repeats the processes from step S14 to step S17 until the state becomes "improved" in step S15.

[0055] The manufacturing instruction unit 260 causes the substrate processing apparatus 1 to execute a deterioration countermeasure for dealing with the deterioration of the equipment quality (step S14). The deterioration countermeasure (countermeasure) for dealing with the deterioration of the equipment quality is determined by the countermeasure determination unit 232.

[0056] For example, the countermeasure determination unit 232 determines countermeasures based on the detected deterioration of the device quality and the factor inference rule and the action list stored in the storage device 3. For example, the factor inference rule includes a plurality of factors, the action list includes a plurality of countermeasures, and each of the plurality of factors is associated with each of the plurality of countermeasures. For example, when a single factor is associated with a plurality of countermeasures, priorities are set for the plurality of countermeasures.

[0057] For example, suppose that a factor that is included in the factor inference rule, that is, that a specific nozzle has a tendency to have a high defect rate, is associated with a measure to clean the specific nozzle and a measure to replace the specific nozzle, that is included in the action list. For example, if a deterioration in equipment quality indicates that a specific nozzle has a high defect rate, then of the two measures above, the measure with the higher priority is determined.

[0058] For example, a factor that a specific feeder has a tendency to have a high defect rate, which is included in the factor estimation rule, is associated with measures included in the action list, such as an instruction to check the specific feeder and an instruction to take measures, an instruction to check the malfunction of the specific feeder and an instruction to take measures, a measure to clean the specific feeder, and a measure to replace the specific feeder. For example, if deterioration in equipment quality indicates that the defect rate of the specific feeder is high, the measure with the highest priority among the above four measures is determined.

[0059] For example, assume that a factor that indicates that a specific cart has a high tendency to have defects, which is included in the factor estimation rule, corresponds to a measure that indicates that a specific cart is attached and checked, which is included in the action list. For example, if a deterioration in equipment quality indicates that a specific cart has a high defect rate, the above measure is determined.

[0060] For example, the cause of the cause estimation rule that the operating conditions (production data) of the substrate processing apparatus 1 whose equipment quality has deteriorated have been changed recently is associated with the action list that includes a measure to correct the production data (component-related information, handling conditions, etc.) to the previous data since the production data has been changed, a measure to review the production data since the production data has been changed, a measure to correct the pickup position information to the previous data since the pickup position information has been changed, and a measure to perform pickup position teaching since the pickup position information has been changed. The handling conditions are information indicating control parameters when the substrate processing apparatus 1 (mounting apparatus) picks up and mounts components. The pickup position information is information indicating the position (horizontal position and vertical position) when the component is picked up by the nozzle, and is an example of a control parameter. The handling conditions include at least one of the type of nozzle (pickup nozzle or chuck) that picks up the components, the shape and dimensions of the nozzle, the moving speed and acceleration of the mounting head equipped with the nozzle, and the pickup position information. For example, if the production data of the substrate processing apparatus 1 whose equipment quality has deteriorated has been changed, the measure with the higher priority is determined from the measures to correct the production data to the previous data and to review the production data. From the viewpoint of resource locking, which will be described later, from the time a high-priority measure is implemented until the effectiveness of the measure is verified, other measures for the production data among the feeder, head (nozzle), and production data cannot be implemented. Also, other measures may be prevented from being implemented for multiple work units that perform mounting-related work according to the production data.

[0061] For example, a factor included in the factor estimation rule that the operating conditions (unit parameters: information related to the work unit) of the substrate processing apparatus 1 whose equipment quality has deteriorated have been changed recently is associated with a measure included in the action list, which is to correct the unit parameters (head offset, suction position offset, reference point, reference mark, origin position, load coefficient, etc.) related to the head (nozzle) to the previous state since they have been changed, and a measure to instruct calibration since the unit parameters related to the head (nozzle) have been changed. For example, if the unit parameters related to the head (nozzle) of the substrate processing apparatus 1 whose equipment quality has deteriorated have been changed, the measure with the higher priority is determined from the viewpoint of resource locking, which will be described later, until the effect verification process of the measure is performed after the measure with the higher priority is performed, other measures for the feeder, head (nozzle), and head (nozzle) among the production data cannot be performed.

[0062] For example, a factor included in the factor estimation rule that the operating conditions (unit parameters related to the feeder unit) of the substrate processing apparatus 1 whose equipment quality has deteriorated have been changed recently is associated with a countermeasure included in the action list, which is to adjust the feeder unit because the unit parameters related to the feeder unit (first origin, XY point, etc.) have been changed (for example, to adjust the pitch in the tape feed direction when the component tape is fed by the sprocket equipped in the feeder unit), and a countermeasure included in the action list, which is to correct the pickup position when the nozzle picks up the component because the unit parameters related to the feeder unit (second origin) have been changed. For example, if the unit parameters related to the feeder unit of the substrate processing apparatus 1 whose equipment quality has deteriorated (for example, at least one of the first origin and the second origin) have been changed, the countermeasure with the higher priority among the above two countermeasures (adjustment of the feeder feed pitch and correction of the pickup position) is determined. From the viewpoint of resource locking described later, from the time when the countermeasure with the higher priority is executed until the effect verification process of the countermeasure is performed, other countermeasures for the feeder among the feeder, head (nozzle), and production data cannot be executed.

[0063] Here, the correction of the pickup position means correcting a target position when controlling the position of a mounting head equipped with a nozzle. The target position is a position in a coordinate system (e.g., an XY coordinate system) that represents a moving plane on which the mounting head moves. For example, an image including a component picked up by the mounting head is acquired, and the amount of deviation between a predetermined position (e.g., a center position) of the picked up component and a predetermined position (e.g., a center position) of the nozzle is acquired by analyzing the image, and the target position is corrected based on the amount of deviation. The amount of deviation here includes the amount of deviation in the tape feed direction of the tape feeder and the amount of deviation in a direction intersecting the tape feed direction. Even if the amount of deviation becomes equal to or greater than a predetermined value due to a data change of the second origin, the amount of deviation can be made less than the predetermined value by correcting the pickup position as described above, and as a result, deterioration of the device quality may be improved.

[0064] For example, the substrate processing apparatus 1 executes mounting-related work based on the production data created by the data creation apparatus 5, but the operating conditions of the mounting-related work may be changed by an operator or the like. In this case, for example, the manufacturing instruction unit 260 executes an operating condition change process described later when the operating conditions of the mounting-related work related to the work unit in which the deterioration of the equipment quality is detected have been changed. For example, when the operating conditions of the mounting-related work related to the work unit in which the deterioration of the equipment quality is detected have been changed from the first condition to the second condition, the operating condition change process is executed and the operating conditions are changed from the second condition to the first condition, assuming that the change from the first condition to the second condition may be the cause of the deterioration of the equipment quality. As a result, when the change from the first condition to the second condition was the cause of the deterioration of the equipment quality, the result of the mounting-related work may be improved.

[0065] For example, when any of the component-related information about the component to be mounted on the board, the handling conditions, and the task unit-related information set for each of the multiple task units constituting execution unit 114 used for the mounting-related task of the component has been changed as the operating conditions for the mounting-related task performed by the task unit in which deterioration of equipment quality has been detected, manufacturing instruction unit 260 executes an operating condition change process described below. In this way, the operating condition change process may be executed when any of the component-related information, handling conditions, and task unit-related information that can return the value indicated by the operating condition and that can improve the results of the mounting-related task by returning the value indicated by the operating condition has been changed.

[0066] Next, after the substrate processing apparatus 1 has executed the deterioration countermeasure process, the effect verification unit 240 performs an effect verification process to confirm whether or not the results of the mounting-related work performed by the execution unit 114 of the substrate processing apparatus 1 that executed the deterioration countermeasure process have improved (step S15). That is, the effect verification unit 240 confirms whether or not the deterioration of the equipment quality has been improved based on the equipment quality information acquired after the substrate processing apparatus 1 has executed the deterioration countermeasure process. For example, the effect verification unit 240 can confirm whether or not the deterioration of the equipment quality has been improved by comparing the equipment quality information acquired after the substrate processing apparatus 1 has executed the deterioration countermeasure process with the problem discovery rule.

[0067] If it is confirmed that the results of the mounting-related work performed by the substrate processing apparatus 1 have not improved ("not improved" in step S15), the rollback processing unit 250 determines whether the deterioration countermeasure process executed by the substrate processing apparatus 1 is an operating condition change process (step S16).

[0068] The operating condition change process is a process for changing the operating conditions of the mounting-related work by the execution unit 114. For example, the operating condition change process is a process for changing either the component-related information related to the component to be mounted on the board or the task unit-related information set for each of the multiple task units constituting the execution unit 114 used for the mounting-related work of the component. Specifically, the operating condition change process is a deterioration countermeasure process (measure) for correcting the production data (component outer shape, pickup position information, etc.) to the state before the change because the production data has been changed, a deterioration countermeasure process for reviewing the data because the production data has been changed, a deterioration countermeasure process for correcting the pickup position information to the state before the change because the pickup position information has been changed, and a deterioration countermeasure process for correcting the task unit-related information (head offset, pickup position offset, reference point, reference mark, origin position, load coefficient, etc.) to the state before the change because the task unit-related information has been changed.

[0069] For example, the operating condition change process may change the production data, or the original data of the production data may be changed, or a correction amount according to the change may be output to a driver that controls a head or feeder based on the production data.

[0070] Note that the deterioration countermeasure process accompanying the detection of an abnormality by a sensor for detecting an abnormality in the working unit (e.g., spindle, nozzle, head body to which the nozzle is attached, feeder, etc.) is not subject to the operating condition change process. For example, if a sensor detects an abnormality in the working unit (e.g., a nozzle malfunction (e.g., a clogged nozzle, a bent nozzle, a dirty nozzle, etc.)), a deterioration countermeasure process such as cleaning or replacing the working unit is performed, but this is because deterioration countermeasure process such as cleaning or replacement is not a process of changing the operating conditions (specifically, changing part-related information, handling conditions, or working unit-related information).

[0071] If the rollback processing unit 250 determines that the deterioration countermeasure processing executed by the substrate processing apparatus 1 is not an operating condition change processing (No in step S16), in order to get to the root cause of the problem, processing from step S14 onwards is performed for other deterioration countermeasure processing until it is confirmed in step S15 that the results of the mounting-related work by the substrate processing apparatus 1 have improved.

[0072] When the rollback processing unit 250 determines that the deterioration countermeasure processing that it has caused the substrate processing apparatus 1 to execute is the operating condition change processing (Yes in step S16), it causes the substrate processing apparatus 1 to execute the rollback processing (step S17) before the manufacturing instruction unit 260 causes the substrate processing apparatus 1 to execute another deterioration countermeasure processing. The rollback processing is a processing for returning values ​​indicated by the operating conditions changed by the operating condition change processing to values ​​before the changes.

[0073] For example, if the operating conditions have been changed from the first conditions to the second conditions by an operator or the like, and it is determined that the change from the first conditions to the second conditions may be the cause of deterioration in equipment quality, an operating condition change process is executed and the operating conditions are changed from the second conditions to the first conditions. If the results of the mounting-related work are not improved by this operating condition change process, it is determined that the change from the first conditions to the second conditions was not the cause of the deterioration in equipment quality, and a rollback process is executed, for example, to return the operating conditions from the first conditions to the second conditions.

[0074] In addition, when there are multiple task units related to the operation condition change processing executed by the substrate processing apparatus 1, if any of the multiple task units executes another deterioration countermeasure processing before the rollback processing is completed, it may be difficult to reach the true cause of the problem. Therefore, when the operation condition change processing does not improve the results of the mounting-related work, the arbitration unit 233 may prohibit the execution of another deterioration countermeasure processing for the multiple task units related to the operation condition change processing until the rollback processing is completed. In other words, when the rollback processing is executed, the arbitration unit 233 locks the multiple task units related to the operation condition change processing, and continues to lock the multiple task units until the rollback processing is completed. By prohibiting the execution of another deterioration countermeasure processing for the multiple task units until the rollback processing is completed, it is possible to suppress the execution of another deterioration countermeasure processing in a state where the operation conditions are changed, and it becomes easier to reach the true cause of the problem.

[0075] Then, in order to get to the root cause of the problem, the processes from step S14 onwards are carried out for other countermeasures against deterioration until it is confirmed in step S15 that the results of the mounting-related work by the substrate processing apparatus 1 are improved.

[0076] When it is confirmed that the result of the mounting-related work performed by the substrate processing apparatus 1 has improved ("improved" in step S15), the production management device 2 ends the deterioration countermeasure processing loop (step S18).

[0077] As described above, if the results of the mounting-related work of the substrate processing apparatus 1 that has executed the operating condition change process do not improve, a rollback process is performed, and the substrate processing apparatus 1 in a state in which the changed operating conditions are set is returned to the substrate processing apparatus 1 in a state in which the operating conditions before the change were set. Since other deterioration countermeasure processes are performed after returning to the state in which the operating conditions before the change were set, it is possible to suppress the influence of the changed operating conditions. This makes it easier to reach the root cause of the problem, and the problem that occurred in the substrate processing apparatus can be solved in a short time.

[0078] (Other embodiments) Although the production management device 2 and the substrate processing device 1 of the present disclosure have been described based on the embodiments, the present disclosure is not limited to the above-mentioned embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the present embodiments and forms constructed by combining components in different embodiments are also included within the scope of the present disclosure.

[0079] For example, in the above embodiment, the production management device 2 includes the arbitration unit 233 . However, the production management device 2 does not necessarily need to include the arbitration unit 233 .

[0080] For example, the present disclosure can be realized not only as the production management device 2, but also as a production management method including steps (processing) performed by the components that make up the production management device 2.

[0081] As shown in FIG. 4, the production management method includes a status monitoring step (step S11) of detecting deterioration in equipment quality based on information indicating the results of mounting-related work acquired from a substrate processing apparatus 1 having an execution unit 114 that executes mounting-related work on a substrate, a manufacturing instruction step (step S14) of causing the substrate processing apparatus 1 to execute a deterioration countermeasure process to deal with the deterioration in equipment quality, an effect verification step (step S15) of performing an effect verification process after the substrate processing apparatus 1 executes the deterioration countermeasure process to confirm whether the results of the mounting-related work by the substrate processing apparatus 1 that executed the deterioration countermeasure process have improved or not, and a rollback processing step (step S17) of performing a rollback process to return the values ​​indicated by the changed operating conditions to the values ​​before the change before causing the substrate processing apparatus 1 to execute another deterioration countermeasure process in the manufacturing instruction step.

[0082] For example, the present disclosure can be realized as a program for causing a computer (processor) to execute steps included in the production management method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0083] For example, when the present disclosure is realized by a program (software), each step is executed by executing the program using hardware resources such as a computer's CPU, memory, input / output circuit, etc. In other words, each step is executed by the CPU acquiring data from the memory or input / output circuit, etc., performing calculations, and outputting the calculation results to the memory or input / output circuit, etc.

[0084] In the above embodiment, each component included in the production management device 2 and the substrate processing device 1 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

[0085] Some or all of the functions of the production management device 2 and the substrate processing device 1 according to the above-mentioned embodiment are typically realized as an LSI, which is an integrated circuit. These may be individually integrated into one chip, or may be integrated into one chip that includes some or all of them. The integrated circuit is not limited to an LSI, and may be realized by a dedicated circuit or a general-purpose processor. An FPGA (Field Programmable Gate Array) that can be programmed after the LSI is manufactured, or a reconfigurable processor that can reconfigure the connections and settings of circuit cells inside the LSI may be used.

[0086] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or other derived technologies, that technology may naturally be used to integrate the components included in the production management device 2 and the substrate processing device 1.

[0087] In addition, the present disclosure also includes forms obtained by applying various modifications to the embodiments that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present disclosure.

[0088] (Additional Note) The above description of the embodiments discloses the following techniques.

[0089] (Technology 1) A production management device comprising: a status monitoring unit that detects deterioration of equipment quality based on information indicating results of mounting-related work acquired from a substrate processing apparatus having an execution unit that executes mounting-related work on a substrate; a manufacturing instruction unit that causes the substrate processing apparatus to execute a deterioration countermeasure process to counter the deterioration of equipment quality; an effect verification unit that performs an effect verification process after the substrate processing apparatus executes the deterioration countermeasure process, and confirms whether or not results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process have improved; and a rollback processing unit that performs a rollback process to return values ​​indicated by the changed operating conditions to values ​​before the change before the manufacturing instruction unit causes the substrate processing apparatus to execute another deterioration countermeasure process, if results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process as the deterioration countermeasure process have not improved.

[0090] According to this, if the results of the mounting-related work of the substrate processing apparatus that has executed the operating condition change process do not improve, a rollback process is performed, so that the substrate processing apparatus in a state in which the changed operating conditions are set is returned to the substrate processing apparatus in a state in which the operating conditions before the change were set. Since other deterioration countermeasure processes are performed after returning to the state in which the operating conditions before the change were set, it is possible to suppress the influence of the changed operating conditions. This makes it easier to reach the root cause of the problem, and the problem that occurred in the substrate processing apparatus can be solved in a short time.

[0091] (Technology 2) The execution unit includes a plurality of work units, and the production management device includes an arbitration unit that, if the results of the implementation-related work do not improve as a result of the operating condition change process, prohibits other deterioration response processes from being executed on the plurality of work units related to the operating condition change process until the rollback process is completed.

[0092] In the case where there are multiple operation units related to the operation condition change process executed by the substrate processing apparatus, if any of the multiple operation units executes another deterioration countermeasure process before the rollback process is completed, it may be difficult to reach the true cause of the problem. Therefore, by prohibiting the execution of another deterioration countermeasure process for the multiple operation units until the rollback process is completed, it is possible to suppress the execution of another deterioration countermeasure process in a state where the operation conditions have been changed, and it becomes easier to reach the true cause of the problem.

[0093] (Technology 3) The production management device described in Technology 1 or 2, wherein the status monitoring unit detects deterioration in equipment quality of each of the multiple work units that make up the execution unit, and the manufacturing instruction unit executes the operating condition change process when the operating conditions of the mounting-related work related to the work unit in which deterioration in equipment quality has been detected have been changed.

[0094] For example, if the operating conditions of a mounting-related task related to a task unit in which deterioration of equipment quality has been detected have been changed from a first condition to a second condition, it is possible that the change from the first condition to the second condition is the cause of the deterioration of equipment quality, and an operating condition change process is executed to change the operating conditions from the second condition to the first condition. If the results of the mounting-related task are not improved by this operating condition change process, it is determined that the change from the first condition to the second condition was not the cause of the deterioration of equipment quality, and a rollback process is executed to, for example, return the operating conditions from the first condition to the second condition.

[0095] (Technology 4) The production management device according to Technology 3, wherein the manufacturing instruction unit executes the operating condition change process when any of the component-related information about the component to be mounted on a board, the handling conditions, and the work unit-related information set for each of the multiple work units constituting the execution unit used for the mounting-related work of the component has been changed as the operating conditions of the mounting-related work performed by the work unit in which a deterioration in equipment quality has been detected.

[0096] In this way, an operating condition change process may be executed when the component-related information, handling conditions, and work unit-related information have been changed, which can return the values ​​indicated by the operating conditions and which may improve the results of the mounting-related work by returning the values ​​indicated by the operating conditions.

[0097] (Technology 5) A production management device according to any one of Technologies 1 to 4, wherein the operating condition change process is a process of changing any one of component-related information regarding a component to be mounted on a board, handling conditions, and work unit-related information set for each of a plurality of work units constituting the execution section used for the mounting-related work of the component.

[0098] In this manner, the operating condition change process may be a process for changing part-related information, handling conditions, and operation unit-related information.

[0099] (Technology 6) The production management device according to any one of Technologies 1 to 5, wherein the deterioration of equipment quality includes an increase in a defect rate based on the results of the mounting-related work of each of a plurality of work units constituting the execution section of the substrate processing apparatus.

[0100] According to this, when the defect rate worsens, a process for dealing with the deterioration can be executed.

[0101] (Technical 7) The production management device according to any one of Technical 1 to Technical 6, wherein deterioration in equipment quality includes an increase in downtime caused by an error in the substrate processing equipment.

[0102] According to this, when the non-operating time increases, a deterioration countermeasure process can be executed.

[0103] (Technology 8) The production management device according to any one of Technologies 1 to 7, wherein the substrate processing device is either a printing device that prints solder on lands of a substrate as the mounting-related work, or a mounting device that mounts components at predetermined positions on a substrate on which solder has been printed as the mounting-related work, and the deterioration of device quality includes a deterioration of the defect rate obtained from an inspection unit that inspects the solder printing state or the component mounting state.

[0104] This makes it possible to quickly solve problems occurring in the printing device or mounting device as a substrate processing apparatus.

[0105] (Technology 9) A substrate processing apparatus comprising: an execution unit that performs mounting-related work on a substrate; an operation control unit that controls the operation of the execution unit; and a notification unit that notifies an external device of information regarding the results of the mounting-related work of each of a plurality of work units that constitute the execution unit, and receives instructions for the operating condition change processing and the rollback processing from a production management device described in any one of Technologies 1 to 8, wherein the operation control unit executes the operating condition change processing and the rollback processing indicated by the received instructions.

[0106] According to this, it is possible to provide a substrate processing apparatus capable of solving problems occurring in the substrate processing apparatus in a short period of time.

[0107] (Technology 10) A production management method including: a status monitoring step of detecting deterioration in equipment quality based on information indicating results of mounting-related work acquired from a substrate processing apparatus having an execution unit that executes mounting-related work on a substrate; a manufacturing instruction step of causing the substrate processing apparatus to execute a deterioration countermeasure process to address the deterioration in equipment quality; an effect verification step of performing an effect verification process after the substrate processing apparatus executes the deterioration countermeasure process, to confirm whether or not results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process have improved; and a rollback processing step of performing a rollback process to return values ​​indicated by the changed operating conditions to values ​​before the change, before causing the substrate processing apparatus to execute another deterioration countermeasure process in the manufacturing instruction step, if results of the mounting-related work by the substrate processing apparatus that executed the deterioration countermeasure process as the deterioration countermeasure process have not improved.

[0108] According to this, it is possible to provide a production management method capable of quickly solving problems occurring in the substrate processing apparatus.

[0109] (Technology 11) A program for causing a computer to execute the production management method described in Technology 10.

[0110] This makes it possible to provide a program that can quickly solve a problem that occurs in a substrate processing apparatus. [Industrial Applicability]

[0111] The present disclosure can be used to manage a substrate processing apparatus. [Explanation of symbols]

[0112] 1. Substrate Processing Equipment 2 Production control device 3 Storage device 4. Communications Department 5 Data creation device 30 Communication Network 40 Mounting Line 50 Line management device 111 Main control unit 112 Motion control section 113 Image Processing Unit 114 Executive Department 115 Display section 116 Notification Department 210 Control section 220 Memory control unit 230 Countermeasures Analysis Department 231 Status Monitoring Unit 232 Countermeasures Decision-Making Department 233 Mediation Department 240 Efficacy Verification Department 250 Rollback processing section 260 Manufacturing Instruction Department 270 Acquisition Department M1 board supply device M2 Substrate transfer device M3 printing device M4, M5 mounting device M6 Reflow Machine M7 Board recovery device M8 Inspection Equipment

Claims

1. a state monitoring unit that detects deterioration of equipment quality based on information indicating a result of a mounting-related operation acquired from a substrate processing apparatus including an execution unit that executes a mounting-related operation on a substrate; and a manufacturing instruction unit that causes the substrate processing apparatus to execute a deterioration countermeasure process for countering deterioration in equipment quality; an effect verification unit that performs an effect verification process to confirm whether or not a result of the mounting-related work performed by the substrate processing apparatus that has performed the deterioration countermeasure process has improved after the substrate processing apparatus has performed the deterioration countermeasure process; a rollback processing unit that, when a result of the mounting-related work of the substrate processing apparatus in which an operating condition change process for changing an operating condition of the mounting-related work by the execution unit is executed as a deterioration countermeasure process, executes a rollback process for returning a value indicated by the changed operating condition to a value before the change before the manufacturing instruction unit causes the substrate processing apparatus to execute another deterioration countermeasure process. Production control device.

2. The execution unit includes a plurality of task units; the production management device further comprising an arbitration unit that, when the result of the mounting-related work is not improved by the operation condition change process, prohibits execution of other deterioration countermeasure processes for the plurality of task units related to the operation condition change process until the rollback process is completed; The production management device according to claim 1.

3. The status monitoring unit detects deterioration of device quality of each of the plurality of task units constituting the execution unit, the manufacturing instruction unit executes the operation condition change process when an operation condition of the mounting-related operation related to the operation unit in which deterioration of equipment quality has been detected has been changed. The production management device according to claim 1.

4. the manufacturing instruction unit executes the operating condition change process when any of the component-related information related to the component to be mounted on the board, the handling conditions, and the operating unit-related information set for each of the multiple operating units constituting the execution unit used for the mounting-related work of the component has been changed as the operating conditions of the mounting-related work performed by the operating unit in which deterioration of equipment quality has been detected; The production management device according to claim 3.

5. the operation condition change process is a process of changing any one of component-related information related to a component to be mounted on a board, handling conditions, and task unit-related information set for each of a plurality of task units constituting the execution unit used for the mounting-related work of the component; The production management device according to claim 1.

6. the deterioration of the equipment quality includes a deterioration of a defect rate based on the results of the mounting-related work of each of a plurality of operation units constituting the execution part of the substrate processing apparatus; The production management device according to claim 1.

7. The deterioration of equipment quality includes an increase in downtime caused by an error in the substrate processing apparatus. The production management device according to claim 1.

8. the substrate processing apparatus is either a printing apparatus that prints solder on lands of a substrate as the mounting-related work, or a mounting apparatus that mounts components at predetermined positions on a substrate on which solder has been printed as the mounting-related work, The deterioration of equipment quality includes a deterioration of the defect rate obtained from an inspection section that inspects the solder printing state or the component mounting state. The production management device according to claim 1.

9. an execution unit that performs mounting-related work on the board; An operation control unit that controls the operation of the execution unit; a notification unit that notifies an external device of information regarding the results of the mounting-related tasks of each of the task units constituting the execution unit, and receives instructions for the operating condition change process and the rollback process from the production management device according to claim 1; the operation control unit executes the operation condition change process and the rollback process indicated by the received instruction. Substrate processing equipment.

10. a state monitoring step of detecting deterioration of equipment quality based on information indicating a result of a mounting-related operation acquired from a substrate processing apparatus including an execution unit that executes a mounting-related operation on a substrate; a manufacturing instruction step of causing the substrate processing apparatus to execute a deterioration countermeasure process for countering deterioration of the apparatus quality; an effect verification step of performing an effect verification process to confirm whether or not a result of the mounting-related work by the substrate processing apparatus that has performed the deterioration countermeasure process has improved after the substrate processing apparatus has performed the deterioration countermeasure process; a rollback processing step of executing a rollback process for returning a value indicated by the changed operating condition to a value before the change, before causing the substrate processing apparatus to execute another deterioration countermeasure process in the manufacturing instruction step, when a result of the mounting-related work of the substrate processing apparatus in which an operating condition change process for changing an operating condition of the mounting-related work by the execution unit is not improved, Production management methods.

11. A program for causing a computer to execute the production management method according to claim 10.

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