Nano-micron semiconductor integrated circuit

Abstract

To solve a problem in which there is a demand for smaller semiconductor integrated circuits, but current manufacturing methods have limitations, making it necessary to create new manufacturing methods.SOLUTION: Instead of using metal wire or liquid materials as materials for electronic circuits, nanopowder is manufactured by finely powdering good conductors such as carbon-based conductors, and used as the material.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an application technology of semiconductor integrated circuits and nanopowder processing technology. [Background technology]

[0002] Semiconductor integrated circuit manufacturing technology

[0003] Nano powder processing technology (fine powder processing technology) Summary of the Invention [Problem to be solved by the invention]

[0004] Semiconductor integrated circuits, used in computers and a variety of electrical appliances, have become increasingly miniaturized. However, while there is a demand for even smaller circuits (miniaturization), there is a limit to how far the circuits can be miniaturized using current manufacturing methods (production technologies). [Means for solving the problem]

[0005] Conventional methods for manufacturing semiconductor integrated circuits involve using metals such as copper as the material for the electronic circuits, which are the pathways for electricity, and stretching them into thin, thread-like shapes. However, there were limitations to how thin the wire could be processed. There were issues with making the wire too thin, as it would break, and with the electrical conductivity of copper, even the slightest gap meant that electricity would not flow. To address this issue, carbon-based conductors such as carbon isotopes are used to create nanopowders through fine powder processing. This material is then affixed to a circuit board to create an electronic circuit. The nanopowder makes it possible to create circuits with dimensions that were previously difficult to fabricate, and because carbon isotopes are far more conductive than copper, electricity can pass through even tiny gaps between the powder particles (electrons can jump between the gaps). In addition, if volcanic ash, which has properties similar to carbon-based conductors, is processed into nanopowder and used, production costs can be reduced. Furthermore, by applying optical film technology to these nanopowders and turning infrared blocking materials into nanopowders, and mixing them in the right proportions, a cooling effect against Joule heat can be obtained. In this way the problem is solved.

Claims

1. A method of using "nanopowders of carbon-based good conductors" such as carbon allotropes as materials for electronic circuits of semiconductor integrated circuits, instead of metals such as copper and aluminum that have been mainly used conventionally. Conventional electronic circuits of semiconductor integrated circuits have been fabricated by methods such as inserting and fixing a wire material (such as a copper wire) that is thinly stretched like a thread made of a metal such as copper into a circuit board, or printing a liquid material processed into a solution state made of a metal such as aluminum onto a circuit board. In contrast, a method of fabricating an electronic circuit by fixing nanopowders obtained by finely processing a carbon-based good conductor such as a carbon allotrope, which has higher conductivity than copper, a highly conductive metal, to a circuit board at the nanolevel. (The carbon-based good conductor includes coal in view of the concept of a good conductor of organic substances containing a large amount of carbon.) (There are multiple methods for fixing nanopowders to a circuit board, such as adhesives, static electricity, laser printing, etc., and the manufacturing method is not limited.)

2. A method of using volcanic ash, which is not a carbon-based good conductor (organic substance-based) but has similar properties, as a material for electronic circuits of semiconductor integrated circuits. A method of fabricating an electronic circuit by fixing nanopowders obtained by finely processing volcanic ash to a circuit board at the nanolevel.

3. A method of using a material (mixed nanopowder) in which an optical film that blocks infrared rays or nanopowders obtained by processing a material having the same chemical composition as the film into a fine powder form are blended in an appropriate ratio as a material for electronic circuits of semiconductor integrated circuits in the methods described in Claim 1 and Claim 2.

4. Parts and devices using the methods described in Claim 1, Claim 2, and Claim 3.

5. Services and undertakings using the parts and devices described in Claim 4.