Lighting device for vehicle and lamp for vehicle

Abstract

To provide a lighting device for a vehicle which can improve the use efficiency of light which is irradiated from a light emitting element, and a lamp for the vehicle.SOLUTION: A lighting device for a vehicle comprises: a socket; a baseboard adhering to one end part side of the socket; a light emitting element arranged at a first face of the baseboard at a side opposite to the socket side; and a reflection part formed into a film shape, and provided at a second face of the baseboard opposing the first face. The baseboard is irradiated with light from the light emitting element, and allows the permeation of a part of the light which is made incident to the first face. A reflection rate of the reflection part of the light incident to the first face is higher than that of the baseboard.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with lamps having filaments. Such vehicle lighting devices include a socket and a light emitting module provided on one end side of the socket. The light emitting module includes, for example, a substrate and a light emitting element provided on the substrate.

[0003] Here, the light-emitting element mainly emits light from the top surface. The light emitted from the top surface of the light-emitting element is mainly emitted toward the front side of the vehicle lighting device. However, a part of the light emitted toward the front side of the vehicle lighting device may be reflected by an element such as a reflector provided around the light-emitting element and enter the surface of the substrate. Also, for example, in the case of a chip-shaped light-emitting element, light is also emitted from the side surface of the light-emitting element. The light emitted from the side surface of the light-emitting element is more likely to enter the surface of the substrate.

[0004] A part of the light incident on the front surface of the substrate passes through the substrate and is emitted to the outside from the rear surface of the substrate. If a part of the light emitted from the light-emitting element is not irradiated to the front side of the vehicle lighting device, the utilization efficiency of the light emitted from the light-emitting element will decrease. In recent years, there has been a demand for vehicle lighting devices with higher luminous flux, and it has been desired to improve the efficiency of using light emitted from light-emitting elements. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2013-247061 A Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a vehicle lighting device and a vehicle lamp capable of improving the efficiency of use of light emitted from a light-emitting element. [Means for solving the problem]

[0007] A vehicle lighting device according to an embodiment includes a socket, a substrate bonded to one end of the socket, a light-emitting element provided on a first surface of the substrate opposite the socket, and a reflector having a film shape and provided on a second surface of the substrate opposite the first surface. The substrate is capable of transmitting a portion of the light irradiated from the light-emitting element and incident on the first surface. The reflector has a higher reflectance for the light incident on the first surface than the substrate. Effect of the Invention

[0008] According to the embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can improve the efficiency of use of light emitted from a light-emitting element. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is a schematic plan view of a light-emitting module. [Figure 4] 11 is a schematic plan view illustrating a case where a reflecting portion is provided in a partial region of the rear surface of a substrate. FIG. [Diagram 5] 1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0011] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0012] FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. FIG. 3 is a schematic plan view of the light-emitting module 20. As shown in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40, for example.

[0013] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 may be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0014] The bayonet 12 is provided, for example, on a side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to a housing 101 of a vehicle lamp 100 described later. The bayonet 12 may be used for a twist lock.

[0015] The flange 13 has a plate shape. The flange 13 has, for example, a substantially circular plate shape. A side surface of the flange 13 is located outward of the vehicle lighting device 1 from a side surface of the bayonet 12.

[0016] The heat dissipating fin 14 is provided on the side of the flange 13 opposite to the mounting portion 11. At least one heat dissipating fin 14 may be provided. For example, as shown in Figs. 1 and 2, a plurality of heat dissipating fins 14 may be provided on the socket 10. The plurality of heat dissipating fins 14 may be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate or cylinder shape.

[0017] The connector holder 15 is provided on the opposite side of the flange 13 to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0018] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. The socket 10 can be made of a metal such as an aluminum alloy, for example.

[0019] The socket 10 can also be made of, for example, a highly thermally conductive resin. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or Nylon mixed with a filler using carbon or aluminum oxide. If the socket 10 contains a highly thermally conductive resin, the heat generated in the light-emitting module 20 can be efficiently dissipated. Also, the weight of the socket 10 can be reduced.

[0020] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The power supply terminals 31 may be rod-shaped. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, and the like of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

[0021] When the socket 10 is formed using, for example, a highly thermally conductive resin containing a filler using carbon, or a metal, the socket 10 becomes conductive. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. Note that when the socket 10 is formed using an insulating highly thermally conductive resin (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. For example, the holding portion 32 can be pressed into a hole provided in the socket 10 or adhered to the inner wall of the hole.

[0022] The heat transfer section 40 has a plate shape and is provided between the socket 10 and the light emitting module 20 (substrate 21). As shown in Fig. 1 and Fig. 2, the heat transfer section 40 can be adhered to, for example, the bottom surface 11a1 of the recess 11a. The heat transfer section 40 can be adhered to the inside of a recess provided in the bottom surface 11a1 of the recess 11a, attached to the inside of the recess via thermally conductive grease (heat dissipating grease), or embedded in the inside of the recess by insert molding.

[0023] The heat transfer unit 40 is made of a material with high thermal conductivity. For example, the heat transfer unit 40 is made of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. Note that if the socket 10 is made of a metal or if the amount of heat generated in the light-emitting module 20 is small, the heat transfer unit 40 can be omitted.

[0024] The light emitting module 20 (substrate 21) is adhered to one end side of the socket 10. For example, the light emitting module 20 is adhered onto the heat transfer section 40. As shown in FIGS. 1, 2, and 3, a light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, a circuit element 25, and a reflecting portion 26.

[0025] Although the case where the substrate 21 is bonded onto the heat transfer section 40 has been exemplified, when the heat transfer section 40 is omitted, the substrate 21 is bonded, for example, to the bottom surface 11a1 of the recess 11a. The adhesive for bonding the substrate 21 is preferably an adhesive with high thermal conductivity. For example, the adhesive may be an adhesive containing a filler made of a conductive material or an inorganic material. When the adhesive hardens, an adhesive layer 21b is formed between the substrate 21 and one end side of the socket 10 (the heat transfer section 40 or the bottom surface 11a1 of the recess 11a).

[0026] The substrate 21 has a plate shape. The planar shape of the substrate 21 (the shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially rectangular. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0027] Moreover, a wiring pattern 21a is provided on a surface 21c (a surface of the substrate 21 opposite to the socket 10 side; corresponding to an example of a first surface) of the substrate 21. The wiring pattern 21a is formed, for example, from a material mainly composed of silver or a material mainly composed of copper. In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor described later, etc. The covering portion may include, for example, a glass material.

[0028] The light-emitting element 22 is provided on the substrate 21 (surface 21c of the substrate 21). The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. The vehicle lighting device 1 (light-emitting module 20) illustrated in Figs. 1, 2, and 3 is provided with a plurality of light-emitting elements 22. When a plurality of light-emitting elements 22 is provided, the plurality of light-emitting elements 22 can be connected in series.

[0029] The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like.

[0030] The light emitting element 22 may be a chip-shaped light emitting element, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, or a light emitting element having a lead wire such as a bullet type. The light emitting element 22 illustrated in Figs. 1, 2, and 3 is a chip-shaped light emitting element. In this case, in consideration of the miniaturization of the light emitting module 20 and thus the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light emitting element. In the following, as an example, a case where the light emitting element 22 is a chip-shaped light emitting element will be described.

[0031] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 may be any of an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip chip type light-emitting element.

[0032] The frame portion 23 is provided on the substrate 21. The frame portion 23 is bonded to the substrate 21. The frame portion 23 has a frame shape and surrounds the light emitting element 22. The outline (outline of the planar shape) of the frame portion 23 when viewed from a direction along the central axis 1a of the vehicle lighting device 1 can be appropriately changed according to the required light distribution characteristics, luminance distribution, etc. For example, the outline of the planar shape of the frame portion 23 can be a circle, a rectangle, an ellipse, etc. The outline of the planar shape of the frame portion 23 illustrated in FIG. 1 and FIG. 3 is a circle.

[0033] The frame 23 is formed of, for example, a resin. The resin may be, for example, a thermoplastic resin such as polybutylene terephthalate (PBT), polycarbonate (PC), PET, nylon, polypropylene (PP), polyethylene (PE), or polystyrene (PS).

[0034] Frame 23 has a function of defining the formation range of sealing portion 24 and a function of a reflector. Therefore, frame 23 may contain titanium oxide particles or a white resin in order to improve reflectance.

[0035] The frame portion 23 may be omitted. In the case where the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is provided on the substrate 21. However, if the frame portion 23 is provided, the utilization efficiency of the light emitted from the light-emitting element 22 can be improved. In addition, since the area where the sealing portion 24 is formed can be reduced, the light-emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller.

[0036] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, silicone resin. The sealing portion 24 may also contain a phosphor.

[0037] In addition, optical elements and the like can be provided as necessary. Examples of the optical elements include a convex lens, a concave lens, a light guide, etc. The optical elements can be provided on the sealing portion 24, for example.

[0038] The circuit element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided on the substrate 21. The circuit element 25 is provided, for example, on the periphery of the frame portion 23, and is electrically connected to the wiring pattern 21a. The circuit element 25 is electrically connected to the light-emitting element 22 via the wiring pattern 21a.

[0039] The circuit elements 25 illustrated in FIG. 1 and FIG. 3 include a protection element 25a, a resistor 25b, and a control element 25c. However, the type of the circuit element 25 is not limited to the exemplified ones, and can be changed appropriately depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, a computing element, etc., in addition to those mentioned above.

[0040] The protective element 25a is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The protective element 25a may be, for example, a diode. The protective element 25a illustrated in Figs. 1 and 3 is a surface-mounted diode.

[0041] The resistor 25b may be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), a film resistor formed by using a screen printing method, etc. The resistor 25b illustrated in Fig. 1 and Fig. 3 is a film resistor.

[0042] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25b connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25b is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0043] When the resistor 25b is a surface mount resistor or a resistor with leads, the resistor 25b having an appropriate resistance value is selected according to the forward voltage characteristics of the light emitting element 22. When the resistor 25b is a film resistor, the resistance value can be increased by removing a part of the resistor 25b. For example, by irradiating a laser beam onto a film resistor, a part of the film resistor can be easily removed. Note that the number, arrangement, size, etc. of the resistors 25b are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0044] The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22 or to perform temperature derating. However, the functions and uses of the control element 25c are not limited to those exemplified. The control element 25c can be, for example, a transistor or an integrated circuit. The control element 25c exemplified in FIG. 1 and FIG. 3 is a surface-mounted integrated circuit.

[0045] Here, the light emitting element 22 mainly emits light from the upper surface. The light emitted from the upper surface of the light emitting element 22 is mainly emitted toward the front side of the vehicle lighting device 1. However, a part of the light irradiated toward the front side of the vehicle lighting device 1 may be incident on the inner wall of the frame portion 23 or the inner wall of the recess 11a of the socket 10, and may be reflected by these and enter the surface 21c of the substrate 21.

[0046] Furthermore, for example, in the case of a chip-shaped light-emitting element 22, about 20% of the total luminous flux is irradiated from the side surface of the light-emitting element 22. A part of the light irradiated from the side surface of the light-emitting element 22 may be incident on the surface 21c of the substrate 21. A part of the light irradiated from the side surface of the light-emitting element 22 may be reflected by the inner wall of the frame portion 23 and may be incident on the surface 21c of the substrate 21.

[0047] Also, in the case of a surface-mounted light-emitting element 22 or a light-emitting element 22 having a lead wire such as a bullet-type light-emitting element, a part of the irradiated light is irradiated to the side of the light-emitting element 22. A part of the light irradiated to the side of the light-emitting element 22 is incident on the inner wall of the recess 11a of the socket 10. A part of the light incident on the inner wall of the recess 11a may be reflected by the inner wall of the recess 11a and be incident on the surface 21c of the substrate 21.

[0048] That is, regardless of the type of the light emitting element 22, a part of the light irradiated to the front side of the light emitting element 22 or the side of the light emitting element 22 may be incident on the surface 21c of the substrate 21. In this case, as described above, the substrate 21 is formed of an inorganic material such as ceramics, or an organic material such as paper phenol or glass epoxy. Therefore, the substrate 21 transmits a part of the light incident on the surface 21c. The light transmitted through the substrate 21 is emitted to the outside of the substrate 21 from the back surface 21d of the substrate 21 (the surface facing the surface 21c; corresponding to an example of the second surface). If a part of the light irradiated from the light emitting element 22 is not irradiated to the front side of the vehicle lighting device 1 but is irradiated toward the back side of the vehicle lighting device 1, the utilization efficiency of the light irradiated from the light emitting element 22 is reduced.

[0049] Therefore, the light emitting module 20 according to the present embodiment is provided with a reflecting portion 26. As shown in FIG.

[0050] The reflecting portion 26 has a lower transmittance for the light irradiated from the light emitting element 22 than the substrate 21. For example, the reflecting portion 26 has a higher reflectance for the light incident on the surface 21c of the substrate 21 than the substrate 21. In this way, the light that has passed through the substrate 21 and is incident on the reflecting portion 26 can be reflected toward the surface 21c side of the substrate 21 (the front side of the vehicle lighting device 1). If the light that is incident on the substrate 21 is reflected by the reflecting portion 26 toward the front side of the vehicle lighting device 1, the utilization efficiency of the light irradiated from the light emitting element 22 can be improved.

[0051] The material of the reflective portion 26 is preferably a material having a high reflectance to the light (visible light) irradiated from the light emitting element 22. The material of the reflective portion 26 may be, for example, a metal. The material of the reflective portion 26 may be, for example, silver, a silver alloy, copper, a copper alloy, gold, a gold alloy, platinum, aluminum, an aluminum alloy, or the like. In this case, if the material of the reflective portion 26 is silver or aluminum, the light incident on the reflective portion 26 can be efficiently reflected. In addition, if the reflective portion 26 contains the same material as the wiring pattern 21a, the wiring pattern 21a and the reflective portion 26 can be formed in sequence in the process of forming the wiring pattern 21a. Therefore, it is possible to simplify the manufacturing process and reduce the manufacturing cost.

[0052] There is no particular limitation on the thickness of the reflecting portion 26. However, if the thickness of the reflecting portion 26 is too thin, there is a risk that a part of the light incident on the reflecting portion 26 will transmit through the reflecting portion 26. Therefore, the thickness of the reflecting portion 26 is preferably 10 μm or more.

[0053] Furthermore, if the reflective portion 26 containing metal is electrically connected to the wiring pattern 21a, a short circuit or the like may occur in the light-emitting circuit having the light-emitting element 22. Therefore, the reflective portion 26 is not electrically connected to the wiring pattern 21a. In other words, the reflective portion 26 and the wiring pattern 21a are insulated from each other via the substrate 21.

[0054] Moreover, the reflecting portion 26 can be provided over the entire area of ​​the rear surface 21d of the substrate 21. In this way, the light transmitted through the substrate 21 can be reliably reflected. The reflecting portion 26 can also be provided in an area where light transmitted through the substrate 21 is likely to be incident. If the reflecting portion 26 is provided in a partial area of ​​the rear surface 21d of the substrate 21, the material cost of the reflecting portion 26 can be reduced, and thus the manufacturing cost can be reduced. If the reflecting portion 26 is provided in a partial area of ​​the rear surface 21d of the substrate 21, unevenness is formed on the rear surface 21d of the substrate 21. Therefore, the unevenness (reflecting portion 26) on the rear surface 21d side of the substrate 21 is provided inside the adhesive layer 21b, and an anchor effect is exerted, and the bonding strength between the light emitting module 20 (substrate 21) and one end side of the socket 10 can be increased.

[0055] As described above, the wiring pattern 21a, the light emitting element 22, the frame portion 23, and the circuit element 25 are provided on the surface 21c of the substrate 21. These elements hardly transmit the light irradiated from the light emitting element 22. Therefore, almost no light irradiated from the light emitting element 22 is incident on the region of the surface 21c of the substrate 21 where these elements are provided.

[0056] FIG. 4 is a schematic plan view illustrating a case where the reflecting portion 26 is provided in a partial region of the rear surface 21d of the substrate 21. As shown in FIG. FIG. 4 is a schematic plan view of the reflecting portion 26 as viewed from the front surface 21c side of the substrate 21. As shown in FIG.

[0057] 4, when the reflecting portion 26 is viewed from the front surface 21c side of the substrate 21 in the direction along the central axis 1a of the vehicle lighting device 1, the reflecting portion 26 can be arranged not to overlap with the wiring pattern 21a, the light-emitting element 22, the frame portion 23, and the circuit element 25. As described above, the frame portion 23 may be omitted. Therefore, the reflecting portion 26 can be arranged not to overlap with at least the wiring pattern 21a, the light-emitting element 22, and the circuit element 25.

[0058] In this way, the light transmitted through the substrate 21 can be reflected to the surface 21c side of the substrate 21 (the front side of the vehicle lighting device 1), and manufacturing costs can be reduced and the bonding strength between the light-emitting module 20 (substrate 21) and one end side of the socket 10 can be increased.

[0059] In the above, the light emitting element 22 is a chip-shaped light emitting element, but the same applies when the light emitting element 22 is a surface mount type light emitting element or a light emitting element having a lead wire.

[0060] (Vehicle lighting fixtures) In one embodiment of the present invention, a vehicle lamp 100 can be provided that includes a vehicle lighting device 1. The above-mentioned description of the vehicle lighting device 1 and modified versions of the vehicle lighting device 1 (for example, a device in which a person skilled in the art appropriately adds, deletes, or modifies components and has the features of the present invention) can all be applied to the vehicle lamp 100.

[0061] In the following, as an example, a case where the vehicular lamp 100 is a rear combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a rear combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0062] FIG. 5 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 5, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0063] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that, although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0064] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0065] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0066] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Fig. 5 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0067] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0068] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from coming off the housing 101.

[0069] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like provided outside the vehicle lamp 100 is electrically connected to the connector 105. Therefore, by fitting the connector 105 to ends of the multiple power supply terminals 31, the lighting circuit or the like can be electrically connected to the light-emitting element 22.

[0070] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0071] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other.

[0072] Below, additional notes regarding the above-described embodiment are given.

[0073] (Appendix 1) Socket and; A substrate bonded to one end side of the socket; a light emitting element provided on a first surface of the substrate opposite to the socket; a reflecting portion having a film shape and provided on a second surface of the substrate opposite to the first surface; Equipped with the substrate is capable of transmitting a portion of light that is irradiated from the light-emitting element and incident on the first surface; The reflectance of the light incident on the first surface of the reflective portion is higher than that of the substrate.

[0074] (Appendix 2) A wiring pattern provided on the first surface of the substrate; a circuit element provided on the first surface of the substrate and electrically connected to the light emitting element via the wiring pattern; Further comprising: 2. The vehicle lighting device according to claim 1, wherein when the reflective portion is viewed from the first surface side of the substrate in a direction along a central axis of the vehicle lighting device, the reflective portion does not overlap with the wiring pattern, the light-emitting element, and the circuit element.

[0075] (Appendix 3) 3. The vehicle lighting device according to claim 2, wherein the reflective portion includes a metal and is not electrically connected to the wiring pattern.

[0076] (Appendix 4) 4. The vehicle lighting device according to claim 2, wherein the reflective portion contains the same material as the wiring pattern.

[0077] (Appendix 5) A vehicle lighting device according to any one of appendix 1 to 4; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with: [Explanation of symbols]

[0078] REFERENCE SIGNS LIST 1 vehicle lighting device, 1a central axis, 10 socket, 11 mounting portion, 20 light emitting module, 21 substrate, 21a wiring pattern, 21b adhesive layer, 21c front surface, 21d rear surface, 22 light emitting element, 23 frame portion, 25 circuit element, 26 reflecting portion, 100 vehicle lamp, 101 housing

Claims

1. A socket; A substrate bonded to one end side of the socket; a light emitting element provided on a first surface of the substrate opposite to the socket; a reflecting portion having a film shape and provided on a second surface of the substrate opposite to the first surface; Equipped with the substrate is capable of transmitting a portion of light that is irradiated from the light-emitting element and incident on the first surface; The reflectance of the light incident on the first surface of the reflective portion is higher than that of the substrate.

2. A wiring pattern provided on the first surface of the substrate; a circuit element provided on the first surface of the substrate and electrically connected to the light emitting element via the wiring pattern; Further comprising:

2. The vehicle lighting device according to claim 1, wherein when the reflecting portion is viewed from the first surface side of the substrate in a direction along a central axis of the vehicle lighting device, the reflecting portion does not overlap with the wiring pattern, the light-emitting element, and the circuit element.

3. The vehicle lighting device according to claim 2 , wherein the reflecting portion includes a metal and is not electrically connected to the wiring pattern.

4. The vehicle lighting device according to claim 2 or 3, wherein the reflecting portion contains the same material as the wiring pattern.

5. The vehicle lighting device according to claim 1; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

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