Connection structure for electronic components

Abstract

To inhibit contact failure in electronic components compliant with the M.2 standard.SOLUTION: A connection structure 1 for an electronic component 10 compliant with the M.2 standard is provided. The electronic component 10 comprises: one end 11 where a group of terminals is arranged; and another end 12, opposite the one end 11, which has a semicircular recess formed therein. The structure comprises: a socket 20 into which the one end 11 is inserted; and a bracket 40 that holds the other end 12 and is elastically deformable in the insertion direction of the socket 20 (X-axis direction).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a connection structure for electronic components that conforms to the M.2 (M.2) standard. [Background technology]

[0002] The following Patent Document 1 discloses a solid state drive (SSD) mounted on an electronic device such as a personal computer. This SSD is compatible with the M.2 standard and has a board, a memory mounted on the board, a terminal provided at one end in the longitudinal direction of the board, and a first mounting part provided at the other end in the longitudinal direction of the board. The housing of the electronic device includes a socket connected to the terminal of the SSD, and a second mounting part to which the first mounting part of the SSD is attached by a conductive screw. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7208553 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned conventional technology, when an external force is applied to the electronic device and bending occurs, sliding occurs at one end side (socket side) of the SSD because the other end of the SSD is fixed by a screw. This can cause damage to the plating of the SSD terminals due to rubbing against the connection terminals in the socket, resulting in a problem of poor contact.

[0005] The present invention has been made in consideration of the above problems, and has an object to suppress poor contact in electronic components that comply with the M.2 standard. [Means for solving the problem]

[0006] In order to solve the above problems, one aspect of the present invention is a connection structure for an electronic component that complies with the M.2 standard, wherein the electronic component has one end at which a group of terminals is arranged and another end opposite the one end at which a semicircular recess is formed, and is equipped with a socket into which the one end is inserted, and a bracket that holds the other end and is elastically deformable in the insertion direction of the socket.

[0007] In the electronic component connection structure, the bracket may include a leaf spring portion bent into a crank shape so as to be elastically deformable in the insertion direction of the socket.

[0008] In the above-described electronic component connection structure, the leaf spring portion may be provided in a plurality of portions spaced apart from one another in a width direction of the electronic component.

[0009] In the above electronic component connection structure, the bracket may include a clamp portion that clamps the other end portion of the electronic component in a thickness direction.

[0010] In addition, in the above-described electronic component connection structure, a ground pattern may be formed along the semicircular recess at the other end, the clamp portion may be in contact with the ground pattern, and the bracket may be conductive and may connect the ground pattern to ground. Effect of the Invention

[0011] According to one aspect of the present invention, it is possible to prevent poor contact in electronic components that comply with the M.2 standard. [Brief description of the drawings]

[0012] [Figure 1] 1 is a cross-sectional view showing a connection structure of an electronic component according to an embodiment of the present invention. [Diagram 2] FIG. 4 is a perspective view showing a configuration of the other end side of the electronic component in one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0014] Fig. 1 is a cross-sectional view showing a connection structure 1 of an electronic component 10 in one embodiment of the present invention. Fig. 2 is a perspective view showing a configuration of another end portion 12 side of the electronic component 10 in one embodiment of the present invention. Fig. 1 is a cross-sectional view taken along line AA shown in Fig. 2. The electronic component 10 is an electronic component that complies with the M.2 standard, and is, for example, a communication device that performs wireless communication with an external device (not shown). Note that the electronic component 10 may be a solid state drive (SSD) or any other electronic component that complies with the M.2 standard.

[0015] The electronic component 10 is attached to a base portion 2 arranged inside the housing of an electronic device (e.g., a laptop computer) via a socket 20, a stud 30, a screw 31, and a bracket 40. The base portion 2 is, for example, a motherboard of the laptop computer. Note that the base portion 2 is not limited to a motherboard, and may be a plate member arranged inside the housing, or may be the housing itself.

[0016] The electronic component 10 has a rectangular plate-like outer shape. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member may be described with reference to this XYZ orthogonal coordinate system. The X-axis direction is the longitudinal direction of the electronic component 10 (also referred to as the insertion direction into the socket 20). The Y-axis direction is the width direction of the electronic component 10 (also referred to as the short-side direction of the electronic component 10) that is perpendicular to the X-axis direction. The Z-axis direction is the thickness direction of the electronic component 10 that is perpendicular to the X-axis and Y-axis directions.

[0017] Electronic component 10 has one end 11 on which a group of terminals (not shown) is arranged, and the other end 12 on the opposite side to one end 11 on which a semicircular recess 13 (see FIG. 2) is formed. One end 11 and the other end 12 form both ends in the longitudinal direction (X-axis direction) of electronic component 10. One end 11 has a group of comb-teeth-shaped terminals such as "B Key", "M Key", and "B&M Key" formed thereon.

[0018] 2, a ground pattern 14 is formed along a semicircular recess 13 at the other end 12. The ground pattern 14 is formed in a semicircular arc shape when viewed in the thickness direction (Z-axis direction) of the electronic component 10. By dropping this ground pattern 14 to the ground potential, noise in the wireless communication of the electronic component 10 can be suppressed.

[0019] 1, one end 11 of electronic component 10 is inserted into socket 20. Socket 20 opens toward the -X side (one end 11 side). Inside the opening of socket 20, connection terminals 21 and 22 are provided, which come into contact with the terminal group of one end 11 of electronic component 10 from the Z-axis direction.

[0020] The other end 12 of the electronic component 10 is held by a bracket 40. The bracket 40 is formed by pressing, bending, or the like a metal plate such as stainless steel. The bracket 40 includes a fixing portion 41 fixed by a stud 30 and a screw 31, a clamping portion 42 that clamps the other end 12 of the electronic component 10, and a leaf spring portion 43 provided between the fixing portion 41 and the clamping portion 42.

[0021] The fixing portion 41 has a through hole 41a formed therethrough in the Z-axis direction. The upper end of a stud 30 standing upright from the base portion 2 is inserted into the through hole 41a. The upper end of the stud 30 has a screw hole formed therein into which the screw 31 is screwed. The peripheral portion of the through hole 41a is fastened and fixed in the Z-axis direction by the stud 30 and the screw 31 so that there is no play (gap).

[0022] The clamp portion 42 clamps the other end portion 12 in the thickness direction (Z-axis direction) of the electronic component 10. The clamp portion 42 includes a terminal contact piece 42a and a support piece 42b. As shown in Fig. 2, the terminal contact piece 42a is disposed at a position corresponding to the ground pattern 14 in the Y-axis direction, and contacts the ground pattern 14 in the Z-axis direction. The terminal contact piece 42a is bent in a V-shape when viewed from the Y-axis direction.

[0023] The support pieces 42b are formed in a pair on both sides of the terminal contact piece 42a in the Y-axis direction. The support pieces 42b extend planarly along the XY plane. The support pieces 42b support the other end 12 of the electronic component 10 from the -Z side. On the other hand, the terminal contact piece 42a contacts the ground pattern 14 from the +Z side of the other end 12 of the electronic component 10.

[0024] The gap between terminal contact piece 42a and support piece 42b in the Z-axis direction is slightly narrower than the thickness of electronic component 10, and terminal contact piece 42a is in a slightly elastically deformed state in contact with ground pattern 14. Bracket 40 is conductive, and ground pattern 14 is electrically grounded via bracket 40, stud 30, and screw 31.

[0025] 1, the leaf spring portion 43 has a shape bent into a crank shape when viewed from the Y-axis direction. The leaf spring portion 43 is elastically deformable in the insertion direction (X-axis direction) of the socket 20. Note that the leaf spring portion 43 preferably has a spring property that allows it to elastically deform in the X-axis direction with a force less than the maximum static friction force between the one end portion 11 and the connection terminals 21, 22 so that the one end portion 11 of the electronic component 10 inserted into the socket 20 does not slide when the base portion 2 is bent.

[0026] 2, a plurality of leaf spring portions 43 (three in this embodiment) are provided at intervals in the width direction (Y-axis direction) of electronic component 10. Bracket 40 is provided with step portion 44, and the remaining portion of step portion 44 with a pair of notches 45 formed therein constitutes leaf spring portion 43.

[0027] The step portion 44 includes a first portion 44a, a second portion 44b, and a third portion 44c. The first portion 44a extends along the XY plane and forms the fixed portion 41. The third portion 44c is disposed at a lower position (-Z side) than the first portion 44a, extends along the XY plane, and forms the support piece 42b.

[0028] The second portion 44b extends along the YZ plane and connects the +X side end of the first portion 44a and the -X side end of the third portion 44c in the Z axis direction. The notch 45 is formed to include a part of the first portion 44a, the second portion 44b, and a part of the third portion 44c. This reduces the rigidity of the step portion 44, making it easier for the bracket 40 to elastically deform in the X axis direction.

[0029] According to the connection structure 1 for electronic component 10 configured as above, when an external force is applied to base portion 2 shown in Fig. 1 and base portion 2 is bent, for example, in a convex shape toward the -Z side, the relative distance in the X-axis direction between socket 20 and stud 30 is slightly shortened. At this time, bracket 40 elastically deforms in the X-axis direction (insertion direction of socket 20), absorbing the fluctuation in the relative distance in the X-axis direction between socket 20 and stud 30 and suppressing one end 11 of electronic component 10 from sliding within socket 20. As a result, the plating of the terminal group provided at one end 11 is not damaged by sliding, and poor contact can be suppressed.

[0030] Furthermore, bracket 40 has a clamp portion 42 that clamps the other end 12 of electronic component 10. Clamp portion 42 maintains contact with ground pattern 14, and leaf spring portion 43 elastically deforms in the X-axis direction, so ground pattern 14 is not damaged by sliding and poor contact can be suppressed. This allows ground pattern 14 to be reliably grounded, and noise generation in wireless communication of electronic component 10 can be suppressed.

[0031] Thus, according to the present embodiment described above, the connection structure 1 for electronic component 10 conforming to the M.2 standard includes electronic component 10 having one end 11 where a group of terminals are arranged and the other end 12 opposite to one end 11 and where semicircular recess 13 is formed, and includes a socket 20 into which one end 11 is inserted, and a bracket 40 that holds the other end 12 and is elastically deformable in the insertion direction (X-axis direction) of socket 20. With this configuration, contact failure can be suppressed in electronic component 10 conforming to the M.2 standard.

[0032] In the connection structure 1 for the electronic component 10, the bracket 40 includes the leaf spring portion 43 bent into a crank shape so as to be elastically deformable in the insertion direction (X-axis direction) of the socket 20. With this configuration, the leaf spring portion 43 is bent into a crank shape, so that the leaf spring portion 43 can easily be elastically deformed in the X-axis direction.

[0033] Moreover, in the connection structure 1 for the electronic component 10, a plurality of leaf spring portions 43 are provided at intervals in the width direction (Y-axis direction) of the electronic component 10. According to this configuration, the presence of the notches 45 between the leaf spring portions 43 reduces the rigidity of the step portions 44, making it easier for the leaf spring portions 43 to be elastically deformed with a small force.

[0034] In the connection structure 1 for the electronic component 10, the bracket 40 includes a clamp portion 42 that clamps the other end portion 12 in the thickness direction (Z-axis direction) of the electronic component 10. With this configuration, even if the leaf spring portion 43 is elastically deformed, the contact state between the other end portion 12 and the clamp portion 42 can be maintained.

[0035] In addition, in the connection structure 1 for the electronic component 10, a ground pattern 14 is formed along the semicircular recess 13 of the other end 12, the clamp portion 42 contacts the ground pattern 14, and the bracket 40 is conductive and grounds the ground pattern 14. With this configuration, when the electronic component 10 is a communication device, the ground pattern 14 can be grounded to suppress the generation of noise in wireless communication.

[0036] Although the embodiment of the present invention has been described in detail above with reference to the drawings, the specific configuration is not limited to the above embodiment, and the present invention also includes designs that do not deviate from the gist of the present invention. The configurations described in the above embodiment can be arbitrarily combined as long as they are not inconsistent. [Explanation of symbols]

[0037] REFERENCE SIGNS LIST 1 connection structure, 2 base portion, 10 electronic component, 11 one end portion, 12 other end portion, 14 ground pattern, 20 socket, 21 connection terminal, 22 connection terminal, 30 stud, 31 screw, 40 bracket, 41 fixing portion, 41a through hole, 42 clamp portion, 42a terminal contact piece, 42b support piece, 43 leaf spring portion, 44 step portion, 44a first portion, 44b second portion, 44c third portion, 45 notch portion

Claims

1. A connection structure for electronic components conforming to the M.2 standard, the electronic component has one end portion on which a terminal group is arranged and another end portion opposite to the one end portion and on which a semicircular recess is formed, a socket into which the one end is inserted; a bracket that holds the other end and is elastically deformable in the insertion direction of the socket.

2. 2. The electronic component connection structure according to claim 1, wherein the bracket comprises a leaf spring portion bent into a crank shape so as to be elastically deformable in an insertion direction of the socket.

3. The electronic component connection structure according to claim 2 , wherein the leaf spring portion comprises a plurality of leaf spring portions provided at intervals in a width direction of the electronic component.

4. 4. The electronic component connection structure according to claim 1, wherein the bracket includes a clamp portion that clamps the other end of the electronic component in a thickness direction of the electronic component.

5. A ground pattern is formed along the semicircular recess at the other end, the clamp portion contacts the ground pattern, The electronic component connection structure according to claim 4 , wherein the bracket is conductive and connects the ground pattern to ground.

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