Polyamide Composition

Abstract

The present invention relates to a polyamide composition, the polyamide being a polycondensation reaction product of an acid component and an amine component, The acid component is per mole of the acid component. - 30-50 mol % of fatty acid dimers; - 30-50 mol % of aliphatic diacids; -0-10 mol % of a chain limiter; Including, The amine component is - 10 to 40 mol % of alicyclic diamines; and - 50-80 mol % of aliphatic diamines containing 3-12 carbon atoms; - 0-15 mol % of polyetheramines; Including, The polyamide composition comprises Viscosity of 4 Pa ​​s or less at -185 °C; and Softening point: -150℃~170℃ The present invention relates to a polyamide composition having the following formula:

Description

[Technical field]

[0001] The present invention relates to a polyamide composition, uses thereof, and further to a molded article obtained therefrom and a method for producing the same.

[0002] The polyamide composition is particularly suitable as a hot melt adhesive for low pressure and low temperature overmolding of heat sensitive batteries, such as lithium polymer batteries. [Background technology]

[0003] Many portable electronic devices are equipped with batteries and can be used without being connected to a power grid. To give the battery sufficient strength, to protect it from environmental conditions, and to prevent improper handling by users, the battery is generally packaged in a protective casing. Generally, the battery casing can be formed by low pressure injection overmolding starting from a plastic, for example polyamide.

[0004] Although batteries exhibiting satisfactory performance are already available, e.g. lithium-ion batteries, new technological (e.g. battery life, performance, weight), industrial (e.g. starting materials), and / or regulatory (e.g. interoperability, recyclability) constraints necessitate the development of alternative technologies, such as lithium-polymer batteries.

[0005] Lithium polymer batteries (or lithium-ion polymer batteries) - also written as LiPO, LIP, Li-poly, lithium-poly - are rechargeable batteries that use a polymer electrolyte instead of a liquid electrolyte. These batteries have the advantage that they can be replaced without destroying or damaging the electronic device in which they are installed. This extends the life of the electronic device. In addition, the batteries can be recycled if the electronic device in which they are installed fails. Finally, these batteries show satisfactory performance. On the other hand, they have the disadvantage that they are sensitive to temperature and pressure. For example, the conventional low-pressure overmolding method used for lithium-ion batteries is not suitable because it uses plastics, such as polyamides, which must be injected at high temperatures, generally above 200 °C, especially due to their high viscosity.

[0006] Overmolding techniques and / or different polyamide compositions are well known.

[0007] However, there is a real need to provide new polyamide adhesive compositions suitable for low pressure and low temperature injection molding processes. In particular, there is a need to provide polyamide compositions suitable for overmolding processes of heat sensitive elements, in particular lithium polymer batteries. In particular, there is a need to provide polyamide compositions suitable for overmolding processes of heat sensitive elements, which are also suitable (after overmolding) to withstand the heat generated by said batteries during operation.

[0008] In particular, there is a need to provide polyamide compositions that can be injection molded at lower temperatures than conventional overmolding processes while retaining good mechanical and thermal properties.

[0009] There is also a need to provide a polyamide composition that can be easily recycled after it has been injection molded onto a heat sensitive device. Summary of the Invention

[0010] The present invention provides a polyamide composition comprising a polyamide that is a polycondensation product of an acid component and an amine component, The acid component is per mole of the acid component. -30-50 mol% fatty acid dimers; - 30-50 mol% of aliphatic diacids; -0-10 mol% of chain limiter; Including, The amine component is - 10 to 40 mol % of alicyclic diamines; and - 50-80 mol % of aliphatic diamines containing 3-12 carbon atoms; - 0-15 mol% polyetheramines; Including, The polyamide composition comprises Viscosity of 4 Pa ​​s or less at -185 °C; and Softening point in the range of -150℃~170℃, The present invention relates to a polyamide composition having the following formula:

[0011] Viscosity is measured according to standard ASTM D3236-15(2021) using a Brookfield apparatus and an SC4-A27 needle.

[0012] The polyamide composition according to the present invention preferably has a viscosity at 185°C in the range of 0.5 to 4 Pa·s, more preferably 1 to 4 Pa·s, and even more preferably 2 to 3.5 Pa·s.

[0013] The softening point can be measured according to standard ASTM D3461-18(2018) using a cup-and-ball apparatus and a temperature gradient of 2 °C / min.

[0014] The polyamide composition preferably has a softening point in the range of 150°C to 165°C, and even more preferably 155°C to 165°C.

[0015] Fatty Acid Dimer The acid component may contain 40 to 50 mol %, preferably 42 to 49 mol %, and even more preferably 44 to 49 mol % of fatty acid dimers per mole of the acid component.

[0016] Fatty acid dimers are polymerized fatty acids and refer to compounds resulting from the coupling reaction of unsaturated fatty acids, resulting in a mixture of products with two acid functional groups. Fatty acid dimers can be obtained by dimerization reactions of unsaturated monocarboxylic acids. Fatty acid dimers are thus reaction products of the coupling of unsaturated monocarboxylic acids. Unsaturated monocarboxylic acids are those with 10 to 22 carbon atoms (C 10 ~C 22 ) unsaturated monocarboxylic acids; preferably containing 12 to 18 carbon atoms (C 12 ~C 18 ); very preferably containing 16 to 18 carbon atoms (C 16 ~C 18 The unsaturated monocarboxylic acids may be selected from the group consisting of carboxylic acids,

[0017] The fatty acid dimers can be obtained from unsaturated monocarboxylic acids by well-known processes, for example as described in U.S. Patent Applications Nos. 2,793,219 and 2,955,121. The unsaturated monocarboxylic acids can be selected from oleic acid, linoleic acid, linolenic acid and mixtures thereof.

[0018] Depending on whether crude or distilled, fatty acid dimers can exhibit dimer contents ranging from 75% to over 98%, with higher or lower amounts of monomers, trimers and higher homologues depending on the commercial grade.

[0019] Fatty acid dimers are commercially available under the names Radiacid® from Oleon, Pripol® from Croda and Unydime® from Kraton.

[0020] aliphatic diacid Throughout this specification, the expressions "diacid," "carboxylic diacid," and "dicarboxylic acid" refer to the same product.

[0021] The acid component may contain 35-50 mol %, preferably 39-50 mol %, and even more preferably 42-48 mol % of an aliphatic diacid per mole of the acid component.

[0022] The aliphatic diacid may be selected from saturated aliphatic dicarboxylic acids, preferably saturated, linear or branched aliphatic dicarboxylic acids.

[0023] The dicarboxylic acids are succinic acid (butanedioic acid) (C4), glutaric acid (pentanedioic acid) (C5), adipic acid (hexanedioic acid) (C6), pimelic acid (heptanedioic acid) (C7), suberic acid (octanedioic acid) (C8), azelaic acid (nonanedioic acid) (C9), sebacic acid (decanedioic acid) (C10), and sebacic acid (decanedioic acid) (C11). 10 ), undecane diacid (C 11 ), dodecanedioic acid (C 12 ), brassylic acid (tridecanedioic acid) (C 13 ), tetradecanedioic acid (C 14 ), pentadecanedioic acid (C 15 ), thapsic acid (hexadecanedioic acid) (C 16 ) and mixtures thereof, even more preferably azelaic acid (C9), sebacic acid (C 10 ), dodecanedioic acid (C 12 ) and mixtures thereof.

[0024] Preferably, the saturated aliphatic dicarboxylic acid has 4 to 22 carbon atoms (C 4~22 ), and even more preferably, 6 to 20 (C 6~20 ), and even more preferably, 9 to 18 (C 9~18 ).

[0025] According to one embodiment, sebacic acid (C 10 ) or dodecanedioic acid (C 12 ) accounts for at least 75 mol %, preferably at least 80 mol %, of the aliphatic dicarboxylic acids.

[0026] The acid component comprises a total of at least 70 mol %, preferably at least 80 mol %, and even more preferably at least 90 mol % fatty acid dimers and aliphatic diacids.

[0027] Chain Limiter The polyamides may be synthesized in the presence of one or more chain limiters.

[0028] The chain limiter may be selected from monocarboxylic acids, which may contain at least one heteroatom (O, S, Cl, F), or the corresponding esters, or monoisocyanates.

[0029] Preferably, the chain limiter is a monocarboxylic acid.

[0030] The monocarboxylic acid may be selected from aliphatic monocarboxylic acids, cycloaliphatic acids, aromatic monocarboxylic acids and mixtures thereof.

[0031] The monocarboxylic acid may be an aliphatic monocarboxylic acid selected from acetic acid, propionic acid, lactic acid, valeric acid, caproic acid, capric acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid or mixtures thereof.

[0032] The alicyclic acid may be cyclohexanecarboxylic acid.

[0033] The aromatic monocarboxylic acid may be selected from benzoic acid, toluic acid, α-naphthalene carboxylic acid, β-naphthalene carboxylic acid, methylnaphthalene carboxylic acid, phenyl acetic acid and mixtures thereof.

[0034] Preferably, the chain limiter is an aliphatic monocarboxylic acid.

[0035] Examples include Radiacid® products available from Oleon.

[0036] The acid component may contain 1 to 10 mol %, preferably 3 to 10 mol %, and more preferably 4 to 8 mol % of a chain limiter per mole of the acid component.

[0037] Aliphatic Diamines The amine component may contain 50 to 75 mol %, preferably 55 to 75 mol %, and more preferably 55 to 70 mol % of an aliphatic diamine containing 3 to 12 carbon atoms per mole of the amine component.

[0038] The aliphatic diamine may be selected from saturated, linear or branched aliphatic diamines containing from 3 to 12 carbon atoms.

[0039] Advantageous branched aliphatic diamines include 2-methylpentamethylenediamine, 1,3-pentanediamine, methylpentanediamine, and trimethylhexamethylenediamine.

[0040] Preferably, the aliphatic diamine has the formula H2N-(CH2) where n is in the range of 3 to 12. n —NH2 saturated linear aliphatic diamines.

[0041] The aliphatic diamine may be from the group consisting of propane diamine, butane diamine, pentane diamine, hexane diamine, decane diamine and mixtures thereof.

[0042] More preferably, the aliphatic diamine is hexanediane.

[0043] Alicyclic diamine The amine component may contain 20 to 40 mol %, preferably 25 to 40 mol %, and even more preferably 25 to 35 mol % of an alicyclic diamine per mole of the amine component.

[0044] Alicyclic diamines include bis(3,5-dialkyl-4-aminocyclohexyl)methane, bis(3,5-dialkyl-4-aminocyclohexyl)ethane, bis(3,5-dialkyl-4-aminocyclohexyl)propane, bis(3,5-dialkyl-4-aminocyclohexyl)butane, bis(3-methyl-4-aminocyclohexyl)methane (BMACM or MACM), bis(p-aminocyclohexyl)methane (PACM), isopropylidene, The diamine may be selected from among diphenyl(cyclohexylamine) (PACP), isophoronediamine, piperazine, aminoethylpiperazine, dimethylpiperazine, 4,4'-trimethylenedipiperidine, 1,4-cyclohexanediamine, alicyclic diamines having a carbon skeleton (e.g., norbornylmethane, cyclohexylmethane, dicyclohexylpropane, di(methylcyclohexyl), di(methylcyclohexyl)propane), and mixtures thereof.

[0045] Preferably, the cycloaliphatic diamine is piperazine.

[0046] A non-exhaustive list of these alicyclic diamines is given in "Cycloaliphatic Amines" (Encyclopedia of Chemical Technology, Kirk-Othmer, 4th Edition (1992), pp. 386-405).

[0047] Polyetheramines The amine component may contain 2 to 15 mol %, preferably 5 to 15 mol %, and even more preferably 5 to 12 mol % of polyetheramine per mole of the amine component.

[0048] The polyetheramine can be selected from polyoxyalkylene diamines having a number average molecular weight (Mn) in the range of 200 to 4000 g / mol.

[0049] Preferably, the polyoxyalkylene chain has an amine group at the chain end.

[0050] The polyetheramine may be selected from polyoxypropylene diamine, polyoxybutylene diamine, bis(diaminopropyl)polytetrahydrofuran, and mixtures thereof.

[0051] Preferably, the polyetheramine is a polyoxypropylene diamine.

[0052] Polyetheramines are commercially available from Huntsman under the name Jeffamine® and from BASF under the name Baxxodur®.

[0053] polyamide According to one embodiment, the amine component does not include fatty amine dimers.

[0054] Preferably, the amine component does not contain ethylenediamine (EDA). The inventors have advantageously demonstrated that, despite the absence of ethylenediamine, the polyamide composition exhibits good injection and demolding properties and imparts satisfactory mechanical properties to molded articles.

[0055] The polyamide may have a weight average molecular weight in the range of 5,000 to 200,000 g / mol, preferably 10,000 to 150,000 g / mol, and even more preferably 30,000 to 100,000 g / mol.

[0056] The weight average molecular weight (Mw) of the polyamide can be measured by gel permeation chromatography (GPC).

[0057] The -COOH / (-NH and / or -NH2) molar ratio in the polyamide may range from 0.95 to 1.30, preferably from 0.98 to 1.20, preferably from 1.00 to 1.15.

[0058] The -COOH / (-NH and / or -NH2) molar ratio between the carboxyl functions and the primary and / or secondary amine functions, the content of which is expressed in mg KOH / g, is determined potentiometrically.

[0059] The polyamide can be terminated with an acid on the one hand or with an amine on the other hand or with a mixture of an acid and an amine. Preferably, the polyamide is terminated with an acid.

[0060] The polyamide according to the invention may have an acid number AN ranging from 0.28 to 17 mg KOH / g, preferably from 0.5 to 15 mg KOH / g, very preferably from 1 to 12 mg KOH / g.

[0061] The acid number (AN) is determined potentiometrically according to standard ASTM D4662 and standard ISO 2114 and represents the amount of carboxyl functional groups expressed as milligrams of potassium hydroxide (mg KOH / g) required to neutralize the acidity of 1 gram of polyamide.

[0062] According to one embodiment, the polyamide is the product of polycondensation of an acid component and an amine component, The acid component is per mole of the acid component. - 42-49 mol% fatty acid dimers; - 39-50 mol% of aliphatic diacids; -3-10 mol% of chain limiter; Including, The amine component is - 25 to 40 mol % of alicyclic diamines; and - 55-75 mol % of aliphatic diamines containing 3-12 carbon atoms; - 5-15 mol% polyetheramines; Including, The -COOH / (-NH and / or -NH2) molar ratio is preferably in the range of 0.98 to 1.20, and even more preferably 1.00 to 1.15.

[0063] The polyamide may have a viscosity at 185° C. of 4 Pa·s or less, preferably in the range of 0.5 to 4 Pa·s, more preferably 1 to 4 Pa·s, and even more preferably 2 to 3.5 Pa·s.

[0064] The polyamide may have a softening point in the range of 150°C to 170°C.

[0065] The polyamides can be obtained by polycondensation of the acid and amine components according to conventional processes. They can in particular be prepared by mixing the reactants and then heating them to a temperature of 100° C. or more, preferably 150° C. or more, and even more preferably 200° C. or more.

[0066] The reaction may be carried out under an inert atmosphere, such as under a nitrogen atmosphere.

[0067] A second stage of heating at a pressure of 500-50,000 Pa (5-500 mbar) can be carried out to allow removal of traces of water and all volatile compounds.

[0068] Polyamide Composition The polyamide composition is preferably a hot melt adhesive composition.

[0069] The polyamide composition may comprise more than 90% by weight, preferably more than 92% by weight, and even more preferably more than 95% by weight of said polyamide, based on the total weight of said polyamide composition.

[0070] The polyamide composition may contain at least one additive in addition to the polyamide obtained by polycondensation of the acid component and the amine component.

[0071] The additives may be selected from fillers, antioxidants or stabilizers, mold release agents, surfactants, pigments and mixtures thereof.

[0072] The release agent may, for example, be ethylene bisstearic acid amide.

[0073] Among the pigments, mention may be made, for example, of carbon black.

[0074] The antioxidant may include, for example, an amine compound, a phenolic compound, or a phosphorus compound.

[0075] The polyamide composition may contain from 0% to 10%, preferably from 1% to 8%, and even more preferably from 1% to 6% of additives based on the total weight of the adhesive composition.

[0076] In one embodiment, the polyamide composition does not include a tackifying resin.

[0077] The polyamide composition can be obtained by simple mixing of the components, for example by mixing a polyamide as defined above and, optionally, one or more additives.

[0078] The polyamide composition may have a glass transition temperature Tg in the range of 0°C to -67°C, preferably -10°C to -60°C, and even more preferably -40°C to -60°C.

[0079] The glass transition temperature of the composition can be measured by differential scanning calorimetry, in particular according to the following method: a first step of heating from -70°C to 250°C at 30 K / min, then cooling from 250°C to -70°C at 10 K / min, maintaining at -70°C for 10 min, then heating to 250°C at 15 K / min, all under an inert atmosphere.

[0080] Surprisingly, the inventors have demonstrated that the polyamide composition according to the invention is particularly suitable for the manufacture of casings for batteries, in particular lithium polymer batteries, because it can be injected at low pressure and low temperature, in particular at temperatures below 185° C., which is particularly suitable for the overmolding of heat-sensitive elements, in particular heat-sensitive batteries. Moreover, the viscosity and softening point of the polyamide composition are lower than those of the known polyamide compositions used in battery overmolding processes, while the casings thus obtained by overmolding exhibit satisfactory mechanical and thermal properties, in particular satisfactory impact strength (especially elongation at break and tensile strength), in the high temperature gradients in use (for example as a function of the seasons and the heating of the electronic device). Moreover, the polyamide composition advantageously exhibits good injection and demolding properties (this is because the polyamide composition advantageously exhibits a rapid uptake of cohesion that allows easy removal from the mould). Moreover, the polyamide composition advantageously withstands the heat-inducing (temperatures above 100° C.) conditions of use of the battery, without the overmolding composition yielding. Finally, the adhesion of the injection molded polyamide composition to various types of substrates (eg, aluminum-polyester substrates) is satisfactory.

[0081] The polyamide composition advantageously provides a tensile strength of at least 3 MPa. The tensile strength can be measured according to standard ISO 527 by preparing a type 1A test specimen and pulling this test specimen with a dynamometer at a speed of 50 mm / min.

[0082] The polyamide composition may further exhibit a breaking elongation of at least 80%, preferably at least 90%, and even more preferably at least 100%. The breaking elongation may be measured according to standard ISO 527 by preparing a type 1A test specimen and pulling the test specimen with a dynamometer at a speed of 50 mm / min.

[0083] The polyamide composition may further exhibit a Shore D hardness of at least 20, preferably at least 25. The Shore D hardness may be measured according to standard ISO 868 using a durometer, recording the values ​​immediately and after 15 seconds.

[0084] molded product The present invention further relates to a molded article comprising an insert and a polyamide composition as defined above, said insert being at least partially overmolded by the polyamide composition, said insert being a battery, preferably a heat-sensitive battery, very preferably a lithium polymer battery.

[0085] The molded article may further comprise a substrate, which may be made of a material selected from plastic, metal, glass, ceramic or other suitable substances, preferably plastic.

[0086] In particular, the plastic may be an aluminum-polyester composite.

[0087] In one embodiment, the polyamide composition can be injected between the insert and the substrate to ensure adhesion, leak tightness and impact protection of the two parts. In this configuration, the substrate forms the outer casing of the molded article. In another embodiment, the polyamide composition can be injected around the insert and, if present, the substrate. In this configuration, the overmolded polyamide composition forms the outer casing of the molded article. Any alternative configurations can be envisioned.

[0088] The insert around which the polyamide composition is overmolded can be any suitable insert, particularly a battery, especially a rechargeable battery, such as those used in electronic devices such as phones, laptops, electric vehicles, etc. In a preferred embodiment, the insert is a polymer lithium battery.

[0089] The moulded article may be obtained by any suitable moulding method, such as, for example, extrusion, casting, injection moulding, compression moulding or transfer moulding.

[0090] In a preferred embodiment, the molded article is obtained by a molding process by low temperature and low pressure injection as described below.

[0091] Manufacturing method of the molded article: The present invention also relates to a method for producing a molded article.

[0092] A molding process by low temperature and low pressure injection may include the following steps: -Providing moulds; - inserting the part to be adhesively bonded (insert), preferably a lithium polymer battery, into the mold; - heating the polyamide composition to a temperature of less than or equal to 185°C, preferably less than or equal to 175°C, to obtain a molten polyamide composition; The molten polyamide composition is dissolved in water at 0.5 × 10 5 ~50×10 5 Pa, preferably 2 x 10 5 ~40×10 5 injecting at a pressure of 10 Pa; - cooling the injected polyamide composition; - Optionally, removing the resulting molten article from the mold.

[0093] Depending on the configuration, the mold may form an integral part of the molded article (e.g., when the polyamide composition is injected between the insert and the substrate) or may be removed after overmolding of the polyamide composition.

[0094] The use of the polyamide composition to obtain molded articles is particularly advantageous in that it can be molded at low pressure, it exhibits satisfactory flow properties at molding temperatures of 185° C. or less, and it exhibits satisfactory temperature strength in the molded state. These properties are suitable for molding electronic devices that are sensitive to high temperatures and generate heat, especially lithium polymer batteries.

[0095] use The present invention also relates to the use of the polyamide composition as defined above as a hot melt adhesive for the low pressure overmolding of heat sensitive batteries, preferably lithium polymer batteries, and optionally their substrates. EXAMPLES

[0096] The following examples illustrate the invention without limiting it.

[0097] Materials used Fatty acid dimer: Radiacid 0970 (registered trademark) from Oleon (fatty acid dimer, refined, high purity); Fatty monoacids: Radiacid 0411® (fatty monoacid) from Oleon; Fatty diacid 1: Sebacic acid from Casda Biomaterials; Fatty diacid 2: dodecanedioic acid from Chematek; Fatty diacid 3: Azelaic acid from Emery; Aliphatic diamine: hexanediamine from BASF; Cyclic diamine: piperazine from BASF; Polyetheramine: Huntsman Jeffamine D2000® (polyoxypropylenediamine); Antioxidant: Irganox 1010 from BASF; Pigments: Habisol Schwarz H28596, a liquid composition based on carbon black from Habich (carbon black content 2.5-10%); Release agent: Crodamide EBS (ethylene bis stearamide) manufactured by Croda.

[0098] Shore D hardness test: Shore D hardness was measured according to standard ISO 868. The composition was poured into a polyethylene capsule at least 5 mm high. Measurements were recorded with the selected durometer (D) after 15 seconds. Several measurements were taken and the average value was calculated.

[0099] Testing of the inherent mechanical performance qualities was carried out according to standard ISO 527-2017). The measurement of the breaking elongation by the tensile test was carried out according to the protocol shown below.

[0100] The principle of measurement consists in pulling a standard test specimen (see below) made of a moulding in a tensile testing device with a movable jaw moving at a constant speed equal to 50 mm / min, and recording the maximum tensile stress (MPa) and the elongation (%) of the test specimen at the moment of its rupture. The standard test specimen is dumbbell-shaped as indicated in the international standard ISO 527. The thin part of the dumbbell used has a length of 80 mm, a width of 10 mm and a thickness of 4 mm.

[0101] Method for preparing polyamide All reactants are charged into a suitable mixed reactor and heated under nitrogen to 225°C over 4 hours 30 minutes, after which the reactor is kept at this temperature for 2 hours 30 minutes and placed under vacuum at a pressure between 1000 and 5000 Pa for 1 hour.

[0102] TIFF2024525905000001.tif106170

[0103] Preparation of polyamide composition In the reactor, once the polyamide has reached the required specifications, the temperature is maintained at 225°C and additives are added with stirring.

[0104] TIFF2024525905000002.tif98170

[0105] Preparation of molded articles Once the polyamide composition has reached the required specifications, the sample is ready to be removed. The polyamide composition is transferred to a heat gun for injection into a type 1A dumbbell mold for measuring the mechanical properties. A few seconds after injection, the mold is opened and the test specimen is removed from the mold. The test specimen is stored in a heat-sealed aluminum bag for three days to prevent moisture absorption. At the end of the three-day storage period, the test specimen is placed in tension using a dynamometer (see method above).

[0106] TIFF2024525905000003.tif67170

[0107] With comparative composition C3, the molded parts could not be removed from the mold several seconds after injection, and dumbbells could not be prepared for measuring mechanical properties, because the products were soft and lacked cohesion. Overmolding of electronic components and even batteries was also not possible.

[0108] Compositions C1 and C2 (according to the invention), comprising polyamides P1 and P2, respectively, have a viscosity and softening point that are particularly suitable for use as hot-melt adhesives in processes for overmolding heat-sensitive inserts, in particular lithium polymer batteries, and allow to obtain molded articles with satisfactory mechanical and thermal properties. This is because compositions C1 and C2 advantageously lead to molded articles exhibiting tensile strengths of 4.4 MPa (C1) and 5.0 (C2), and satisfactory elongations at break: 93% (C1) and 100% (C2). Furthermore, compositions C1 and C2 advantageously have a rapid uptake of cohesion that allows easy removal from the mold.

Claims

1. A polyamide composition comprising a polyamide which is a polycondensation product of an acid component and an amine component, wherein the acid component per mole of the acid component comprises - 30 to 50 mol% of a fatty acid dimer; - 30 to 50 mol% of an aliphatic diacid; - 0 to 10 mol% of a chain limiter; and the amine component per mole of the amine component comprises - 10 to 40 mol% of an alicyclic diamine; and - 50 to 80 mol% of an aliphatic diamine containing 3 to 12 carbon atoms; - 0 to 15 mol% of a polyetheramine; and the polyamide composition has - a viscosity of 4 Pa·s or less at 185°C; and - a softening point in the range of 150°C to 170°C, a polyamide composition.

2. The composition according to claim 1, characterized in that it has a viscosity at 185°C in the range of 0.5 to 4 Pa·s, preferably 1 to 4 Pa·s, still more preferably 2 to 3.5 Pa·s.

3. The composition according to claim 1, characterized in that it has a softening point in the range of 150°C to 165°C, preferably 155°C to 165°C.

4. The fatty acid dimer is preferably a reaction product of the coupling of an unsaturated monocarboxylic acid selected from unsaturated monocarboxylic acids containing 10 to 22 carbon atoms (C １０ ~C ２２ ), and the composition according to claim 1 is characterized by this.

5. The composition according to claim 1, characterized in that the aliphatic diacid is selected from saturated aliphatic dicarboxylic acids, preferably saturated, linear or branched aliphatic dicarboxylic acids.

6. Sebacic acid (C １０ ) or dodecanedioic acid (C １２ ) occupies at least 75 mol%, preferably at least 80 mol% of the aliphatic dicarboxylic acid, and the composition according to claim 5 is characterized by this.

7. The composition according to claim 1, characterized in that the chain limiter is selected from monocarboxylic acids which can contain at least one heteroatom (O, S, Cl, F), or the corresponding esters, or monoisocyanates, and the chain limiter is preferably an aliphatic monocarboxylic acid.

8. The composition according to claim 1, characterized in that the aliphatic diamine is selected from saturated, linear or branched aliphatic diamines containing 3 to 12 carbon atoms, - the branched aliphatic diamine is preferably selected from 2-methylpentamethylenediamine, 1,3-pentanediamine, methylpentanediamine, and trimethylhexamethylenediamine; - The aliphatic diamine is preferably a saturated straight-chain aliphatic diamine of the formula H ２ N-(CH ２ ) ｎ -NH ２ selected from those where n ranges from 3 to 12 a composition according to claim 1.

9. The composition according to claim 1, characterized in that the aliphatic diamine is hexanediamine.

10. The alicyclic diamine is selected from bis(3,5-dialkyl-4-aminocyclohexyl)methane, bis(3,5-dialkyl-4-aminocyclohexyl)ethane, bis(3,5-dialkyl-4-aminocyclohexyl)propane, bis(3,5-dialkyl-4-aminocyclohexyl)butane, bis(3-methyl-4-aminocyclohexyl)methane (BMACM or MACM), bis(p-aminocyclohexyl)methane (PACM), isopropylidene di(cyclohexylamine) (PACP), isophoronediamine, piperazine, aminoethylpiperazine, dimethylpiperazine, 4,4'-trimethylenedipiperidine, 1,4-cyclohexanediamine, alicyclic diamines having a carbon skeleton (e.g., norbornylmethane, cyclohexylmethane, dicyclohexylpropane, di(methylcyclohexyl), di(methylcyclohexyl)propane), and mixtures thereof, preferably the alicyclic diamine is piperazine, the composition according to claim 1.

11. The composition according to claim 1, characterized in that the amine component does not contain ethylenediamine (EDA).

12. The composition according to claim 1, characterized in that the amine component contains 2 to 15 mol%, preferably 5 to 15 mol%, and still more preferably 5 to 12 mol% of polyetheramine per mole of the amine component.

13. The polyamide is a product of polycondensation of an acid component and an amine component, The acid component per mole of the acid component - 42 to 49 mol% of fatty acid dimer; - 39 to 50 mol% of aliphatic diacid; - 3 to 10 mol% of chain limiter; including The amine component per mole of the amine component - 25 to 40 mol% of alicyclic diamine; and - 55 to 75 mol% of aliphatic diamine containing 3 to 12 carbon atoms; - 5 to 15 mol% of polyetheramine; including -COOH / (-NH and / or -NH ２ ) molar ratio is preferably in the range of 0.98 to 1.20, more preferably in the range of 1.00 to 1.15, the composition according to claim 1, characterized in that.

14. The composition according to claim 1, characterized in that it contains more than 90% by weight, preferably more than 92% by weight, and still more preferably more than 95% by weight of the polyamide defined in any one of claims 1 to 12 based on the total weight of the polyamide composition.

15. The composition according to claim 1, characterized in that it has a glass transition temperature Tg in the range of 0 °C to -67 °C, preferably -10 °C to -60 °C, and more preferably -40 °C to -60 °C.

16. The composition according to claim 1, characterized in that it provides a tensile strength of 3 MPa or more.

17. The composition according to claim 1, characterized in that it exhibits an elongation at break of 80% or more, preferably 90% or more, and more preferably 100% or more.

18. The composition according to claim 1, characterized in that the composition is a hot melt adhesive composition.

19. A molded article comprising an insert, preferably a lithium polymer battery and the polyamide composition according to claim 1, wherein the insert is at least partially overmolded by the polyamide composition.

20. Use of the polyamide composition according to claim 1 as a hot melt adhesive for low pressure overmolding of a heat-sensitive battery.