Robotic polishing system and method

Abstract

A polishing operation monitoring system is presented that includes a particle tracking system that receives positions of abrasive particles on an abrasive article surface from a particle position acquisition unit. The system also includes a polishing operation parameter acquisition unit that acquires a current set of operating parameters of the polishing machine using a communication component. The system also includes a polishing volume calculation unit that calculates a polished volume of the workpiece surface contacted by the abrasive article surface based on the tracked paths of the abrasive particles and the current set of operating parameters. The system also includes a polishing parameter adjustment unit that provides a new set of operating parameters for the polishing system based on the calculated polished volume. The polishing system implements the new set of operating parameters.

Description

[Background technology]

[0001] Many industries require the preparation of surfaces of components or replacement parts for various purposes. Typical surface preparation processes include, for example, physically abrading the surface, i.e., "scuffing." Typical operations often include, for example, sanding and polishing. Different tools, materials, and fluids may be utilized for surface preparation and for repairing surface defects. Summary of the Invention

[0002] A polishing operation monitoring system is presented that includes a particle tracking system that receives positions of abrasive particles on an abrasive article surface from a particle position acquisition unit. The system also includes a polishing operation parameter acquisition unit that acquires a current set of operating parameters of the polishing machine using a communication component. The system also includes a polishing volume calculation unit that calculates a polished volume of the workpiece surface contacted by the abrasive article surface based on the tracked paths of the abrasive particles and the current set of operating parameters. The system also includes a polishing parameter adjustment unit that provides a new set of operating parameters for the polishing system based on the calculated polished volume. The polishing system implements the new set of operating parameters. [Brief description of the drawings]

[0003] The present disclosure may be more fully understood from the following detailed description of various embodiments of the disclosure when considered in conjunction with the accompanying drawings, in which: [Figure 1] 1 is a schematic diagram of a robotic polishing system in which embodiments of the present invention are useful. [Diagram 2] FIG. 1 is a schematic diagram of an abrasive article having a plurality of shaped abrasive particles. [Figure 3A] 1 shows an abrasive particle configuration of an abrasive article. [Figure 3B] 1 shows an abrasive particle configuration of an abrasive article. [Figure 4] 1 shows a schematic diagram of an abrasive article during an abrasive operation. [Figure 5A]1 illustrates a method for selecting parameters for a robotic polishing system, according to an embodiment herein. [Figure 5B] 1 illustrates a robotic polishing system, according to an embodiment herein. [Figure 6] 1 illustrates a parameter set generator according to an embodiment herein. [Figure 7] 1 illustrates an exemplary computing system that may be used in accordance with embodiments herein. [Figure 8] 1 illustrates an exemplary computing system that may be used in accordance with embodiments herein. [Figure 9] 1 illustrates an exemplary computing system that may be used in accordance with embodiments herein. [Figure 10] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 11] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 12A] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 12B] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 13A] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 13B] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 14A] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 14B] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 14C] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 14D] 1 shows a polishing system and parameter generation results described in an embodiment. [Figure 14E] 1 shows a polishing system and parameter generation results described in an embodiment.

[0004] In the drawings, like reference numbers refer to like elements. The above-identified drawings may not be drawn to scale and illustrate various embodiments of the present disclosure, however, other embodiments are also contemplated, as noted in the Detailed Description. In all cases, the disclosure describes the disclosure disclosed herein by way of representing exemplary embodiments, and not by way of express limitation. It should be understood that numerous other modifications and embodiments may be devised by those skilled in the art that are within the scope and spirit of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0005] The present disclosure provides automated systems and methods using a robotic polishing system on an end-of-arm system with a mountable tool for treating (e.g., scuffing, sanding, polishing, etc.) an object surface or interior. The processing tool can be mounted on an end effector at the end of a powered robotic arm along with a fluid removal tool, allowing the processing tool to move between various regions on or within a workpiece. The process tool may include a functional component configured to contact and prepare the object surface, one or more sensors configured to detect work status information of the end effector tool, a dispenser for fluid while the functional component contacts and prepares the object surface, and / or a control circuit that receives signals from the sensors and processes the signals to generate status information for the tool.

[0006] FIG. 1 is a schematic diagram of a robotic polishing system in which embodiments of the present invention are useful. The system 100 generally includes two units, a visual inspection system 110 and a polishing system 120, each of which may include subunits. Both systems may be controlled by motion controllers 112, 122, respectively, which may receive instructions from one or more application controllers 150. The application controllers may receive input from or provide output to a user interface 160. The polishing unit 120 includes a force control unit 124, which may be aligned with an end effector 126. As shown in FIG. 1, the force control unit 124 may be coupled to the end effector 126, each of which is coupled to a tool 128. The tool 128 may be configured as further described, such as those described in U.S. Provisional Patent Applications Nos. 62 / 940950 and 62 / 940960, both filed November 2, 2019. However, other arrangements are expressly contemplated. The visual inspection unit 110 may detect areas on the work surface 130 that may then be polished by the polishing unit 120 .

[0007] 2 is a schematic diagram of an abrasive article having a plurality of shaped abrasive particles. For example, often an abrasive tool, such as coated abrasive article 200, is bonded to the end of tool 128. As shown in FIG. 2, abrasive article 200 includes a plurality of shaped abrasive particles 210 on a backing 220. In some embodiments, particles 210 are a first type of abrasive particles, and a second type of abrasive particles are also present. For example, particles 210 may be shaped abrasive particles, and crushed abrasive particles may be present between particles 210 on backing 220.

[0008] Each of the particles 210, in some embodiments, has a microreplicated shape. For example, in some embodiments, each of the abrasive particles 210 is shaped like a tetrahedron, an equilateral triangle, or another suitable shape. Each of the abrasive particles 210, in some embodiments, has one or more abrasive tips that are oriented to point away from the backing 220.

[0009] During a polishing operation, the polishing efficiency of the abrasive article 200 may vary from moment to moment based on the number and sharpness of the individual particles 210 in contact with the work surface, the roughness of the work surface itself, and the parameters of the robotic system (e.g., speed, type of movement, applied force, etc.). Currently, it is possible to know and adjust the parameters of the robotic system in-situ, but it is not easy to know the current polishing efficiency of the abrasive article 200, or the roughness of the work surface. If these two values ​​are known, it becomes easier to select parameters for the robotic system. An additional problem faced in metal polishing operations is the surface quality at the end of the polishing operation, and it is important for many end products to be substantially free of scratches.

[0010] In embodiments herein, by determining the placement and wear level of individual abrasive particles 212, an assessment of the current abrasive efficiency of the article 200 can be made. This can be extrapolated to a larger number of particles 210. It is possible to simulate the cutting performance of an abrasive article as it wears down. Typically, cutting performance tends to decrease over time. If the cutting performance trend is known for each material and abrasive, cutting performance can be simulated, and the wear level needs to be scanned periodically to ensure that the simulation remains accurate over time. It may need to be combined with a cleaning system that can remove enough debris from the surface to clearly capture the wear via the imaging system.

[0011] 3A and 3B show the abrasive particle arrangement of an abrasive article. FIG. 3A shows an enlarged view of a TRIZACT™ abrasive disc, which is frequently used in the automotive paint finishing industry, as well as for other automotive part finishing. The TRIZACT™ particles 300 are tetrahedral in shape and are packed into a grain pattern 310 on an abrasive backing. Prior to use, the particles are covered with a coating 320, such as a size coat or supersize coat, used to increase adhesion to the backing or to provide a functional benefit during the abrasive operation. The abrasive particles 300 have a discernible grain tip 330 with a wear volume that can be estimated based on the roundness seen in the image of FIG. 3A.

[0012] Because the systems and methods herein use the position of one particle 300 to determine the position of other particles on the backing, they can provide increased benefit and accuracy for closely packed particles, such as particles 300 in microreplicated pattern 310. However, the systems and methods herein can still be useful for abrasive articles, such as article 350 shown in Figure 3B.

[0013] Figure 3B shows an abrasive article 350 having abrasive particles 360. The abrasive particles 360 are generally deposited in a row-and-space pattern 370, with secondary particles 380 between the shaped abrasive particles 360. Although not all abrasive particles 360 will fall precisely within the pattern 370, an image of the abrasive surface of the abrasive particles 350, such as that shown in Figure 3B, can provide an estimate of wear based on the average number of abrasive particles and the tip rounding shown in the imaged portion of the abrasive article 350, such as the image in Figure 3B.

[0014] 4 shows a schematic diagram of an abrasive article during an abrasive operation. Several operating parameters can be adjusted during operation to increase the cut rate or cutting performance of the abrasive article 400. The abrasive article 400, in embodiments herein, may be an abrasive disk, abrasive pad, or an abrasive belt. However, when coupled to a powered robotic arm, the abrasive article contacts the work surface and moves across the work surface at a set or dynamic speed. The abrasive article 400 includes a plurality of abrasive particles 402, 404 on a backing 410.

[0015] For example, a force may be applied to the abrasive article 400 by a force control to bring the abrasive particles 402, 404 into contact with the work surface. Depending on where the force is applied, e.g., distance from the center of the abrasive disc, the force applied to each individual particle may be different, so that, for example, a particle 402 at a distance 432 from the center of the abrasive disc is subjected to a force 412, while an abrasive particle 404 at a distance 434 from the center of the abrasive disc is subjected to a force 414. The difference in the applied forces 412, 414 may cause the abrasive particles across the surface of the abrasive disc to wear unevenly. However, in some embodiments, the size of the abrasive disc 400 may be small enough that the difference is negligible and may not be a consideration.

[0016] Once the abrasive particle positions on the abrasive article have been identified as described herein, another important step is to map the path of the abrasive particle as it contacts the work surface. Thus, the particle motion 420 (e.g., by vibrational motion) and article motion 440 (e.g., rotation or translation of the abrasive article) may need to be known as well. These parameters may be obtainable from a robotic polishing system in some embodiments.

[0017] 5A illustrates a method for selecting parameters for a robotic polishing system according to an embodiment herein. Method 500 can be used to calculate an improved set of parameters from a current set of parameters. In addition, method 500 also outputs a predicted surface roughness based on the characteristics (position, sharpness, etc.) of the detected abrasive particles.

[0018] At block 510, current input parameters for the polishing operation are received. The parameters may be received directly from the robotic polishing system, or from a controller associated with the robotic polishing system, or from another source. The current input parameters may include abrasive particle position 512, which may be detected by a sensor, such as a light-based sensor, a laser-based sensor, an optical sensor, or another suitable sensor, and / or may be obtained based on known abrasive article type, particle density, etc. Vibration parameters 514 of the abrasive article, and thus of individual abrasive particles, may also be obtained. The vibration parameters 514 may include both frequency and amplitude. Relative movement parameters 516 of the abrasive article and workpiece may also be obtained. For example, the abrasive article may be moved in a linear, rotational, orbital, or random orbital motion, and the workpiece surface may also be moving during the polishing operation. Information regarding abrasive article quality 518, such as the amount of tip deterioration (e.g., current sharpness) and / or the feed rate of the abrasive article may also be obtained. Other parameters 522, such as the force applied to the abrasive article, may also be obtained.

[0019] At block 520, the paths of the abrasive particles are calculated. The polishing path of each abrasive particle is calculated based on the known position of the abrasive particle on the surface of the abrasive article, the known vibrational motion of the abrasive article, and the relative motion of the abrasive article with respect to the workpiece. In some embodiments, for example, when the shaped abrasive particles are distributed in an imperfect pattern on the surface, the average expected position of the abrasive particles is used. However, in other embodiments, the exact position of each particle is essentially known based on the known position of one abrasive particle due to the matrix arrangement of the particles. There may be some exceptions due to shelling or incomplete particle embedding.

[0020] Based on known parameters of how the robotic abrasive machine moves the abrasive article, the movement of each abrasive particle can be extrapolated; the oscillating back and forth motion combined with the rotational motion creates a path.

[0021] At block 530, the abrasive passes per area are calculated. Using the known path of each abrasive particle, the surface of the workpiece can be segmented so that the number of times each abrasive grain passes through a surface region can be calculated, for example, the number of times an abrasive particle passes through a segmented area from left to right due to vibration through the area segment, and how often a particle passes through that area due to rotational motion.

[0022] In block 550, obtain experimental polishing amount correction. As described above with respect to FIG. 3B, in some cases, the abrasive article only has an average grain density and an average grain pattern. However, experimental correction can be calculated for a known product. The experimental polishing amount correction is calculated by determining the amount of abrasive volume per unit distance versus relative speed, and the amount of cut of a carbon steel rod is measured per revolution, and a calibration curve is made accordingly. The amount of cut is calculated by weight difference.

[0023] In block 555, the power function coefficients are determined using the experimental data of relative speed from step 550. In some embodiments, the power function is available, for example from the manufacturer of the abrasive article, and can be obtained, for example, in step 510, and the cut data is compared to the rotational speed and a curve is plotted according to the function. w=αv β equation 1 where w is the polishing amount per unit distance and v is the velocity.

[0024] The removal rate is calculated at block 540. The removal rate per segmented area of ​​the work surface is calculated using an experimentally derived correction factor using Equation 2 below.

number

[0025] In block 560, the post-polishing roughness of the workpiece surface is calculated by determining a roughness curve from the calculation result of Equation 2. From the resulting polishing map (polishing amount per unit distance), the relative polishing depth of each point along the surface can be calculated. A profile curve is then determined, for example the curve in FIG. 12B. The higher the value on the profile curve, the deeper the polishing. The roughness curve can be determined by applying a high pass filter to the profile curve. The roughness curve is then used to calculate the surface roughness.

[0026] At block 580, the calculation steps of blocks 520, 530, 540 and 560 are iteratively recalculated by varying one or more of the input parameters to determine an improved set of parameters.

[0027] Once the preferred set of parameters is determined in block 570, the new parameter set is output. In some embodiments, the output parameter set is the calculated surface roughness associated with the new parameter set. The parameter set may include any suitable polishing system parameters. FIG. 5B illustrates one such system, the parameters of which may be generated and output. The system 5000 includes an oscillating motor 5002. The parameter set includes an oscillation frequency that may vary between 100-1400 cpm and an oscillation amplitude that may vary between 0.1-2.0 mm. The parameter set may also include an air regulator 5004, a pressure in an air cylinder 5006, and a down pressure 5008. The parameter set may also include an oscillation direction 5012. The parameter set may specify a backup pad 5014. The pressure set may also set the workpiece speed of the workpiece 5016. For example, the valve may rotate between 100-2000 rpm.

[0028] In the case of molded abrasive structures, such as Trizact® sold by 3M Company, the 3D patterns are well controlled during manufacturing, resulting in abrasive tips that have the same height and are uniformly aligned. It may even be possible to know the location of the abrasive particles without imaging the abrasive structure.

[0029] Abrasive structures with regularly or evenly spaced and aligned abrasive particles, such as Cubitron II® sold by 3M Company, may have an average abrasive particle density, and the tip position is not controlled very accurately. Such abrasive structures require imaging of the abrasive article surface to obtain accurate position information. However, regularly spaced abrasive particle structures may still be easier than conventional abrasive structures, since the size and shape of the precision shaped abrasive grains are uniformly controlled. In addition, the tip density is relatively small (due to the larger tip size), which reduces the computational burden on the software / hardware.

[0030] Conventional abrasives have a wider variation and fluctuation in abrasive particles, therefore camera imaging information is required, and calculations are more difficult due to the variety of shapes / sizes / locations and greater density of tips (requiring more tips to calculate), however, calculation curves can still be created and applied given sufficient imaging information.

[0031] 6 illustrates a parameter set generator, according to embodiments herein. System 600 may be useful in some embodiments for initially setting up a robotic polishing system, such as system 610. In other embodiments, system 610 may operate between operations or simultaneously when a request for a new parameter set is received by parameter set generator 600.

[0032] In addition to iteratively calculating improved parameter sets, the parameter set generator 600 outputs the polishing cut rate and surface roughness based on inputs received from the polishing system 610 or other sources. The polishing system 610 may provide information regarding the current set of parameter settings, which may be default settings, last operating settings, current operating settings, etc. For example, the polishing system 610 may have a vibration frequency 602 and a vibration amplitude 604. The polishing system 610 is coupled with a current abrasive article, which has a number of abrasive particles exposed on a backing or through a resin. Each abrasive particle has an associated wear volume 606, and the abrasive particles are present in a pattern 608. The abrasive article may also move during the polishing operation, for example, an abrasive belt may be fed through the polishing system 610 at a feed rate 612, or an abrasive disk may move in a linear, rotational, orbital, or random orbital pattern. The polishing system 610 may also include other parameters or components.

[0033] The abrasive article evaluation unit 620 may evaluate the current state of the abrasive article. For example, the abrasive article evaluation unit may first detect the abrasive particle position within the abrasive article using a particle position sensor 622. The particle position sensor 622 may be any sensor capable of detecting position information regarding the abrasive particle. For example, an optical sensor such as a camera may capture information about the abrasive article including the position of one or more abrasive particles, or a touch sensor or LIDAR system. In addition, an end effector, sander, or force control unit may also be capable of detecting and providing particle position and serving as the particle position acquisition unit 632.

[0034] The abrasive article evaluation unit 620 may also obtain wear information for the abrasive article using a particle wear detection unit 624, for example, based on the detected wear of the abrasive particles. The abrasive article evaluation unit may have other functions 626. For example, in embodiments where the pattern 608 of abrasive particles is an incomplete pattern, the other functions 626 may determine an average particle position based on the detected particle positions and / or determine an average wear based on the detected wear of some particles.

[0035] The abrasive cut calculator 630 receives position information of one or more abrasive particles on the abrasive article using the particle position acquirer 632. The position information may be received from the abrasive system 610, for example, as a known particle pattern recognized by the abrasive system 610 or the abrasive article assessor 620. In response, a CAD drawing of, for example, a TRIZACT® mold may be acquired. The known particle pattern may be acquired from a database containing CAD drawings for known particle patterns. The position information may also be received directly from a sensor that serves to capture such position information, such as the position detector 622. In one embodiment, the particle position acquirer 632 is the device 716 (particularly the processor 717, the I / O 723, and / or the memory 721).

[0036] Based on the obtained particle positions, the abrasive article segmenter 634 may segment the abrasive article into several sub-portions, for example, based on the circumferential and radial directions. The particle path generator 636 may determine the path of each abrasive particle during the polishing operation based on the parameters received from the polishing system 610.

[0037] Different abrasive materials may behave differently than expected and may require correction factors from the expected calculation. The correction factors may be represented by the correction factors α and β in Equation 1. The correction calculator 642 may calculate the correction factors based on the data provided for a given type of abrasive article. However, in other embodiments, the correction factors may be known from a previous calculation and the correction obtainer 644 may obtain them from a database (not shown in FIG. 6). Using the correction factors, the abrasive cut generator 638 may generate an abrasive cut profile. The abrasive cut profile may be communicated using the abrasive cut communication unit.

[0038] The parameter set generator 600 may also output the surface roughness calculated by the surface roughness calculator 650. A roughness curve is generated by a roughness curve generator 652 based on the polishing cut profile generated by the polishing cut generator 638. The surface roughness communication unit can provide the surface roughness curve as an output of the calculation.

[0039] The grinding cut calculator 630 and the surface roughness calculator 650 are particularly useful for understanding the performance of the grinding system 610 for a particular set of parameters. It may be useful to have a cutting and surface roughness profile to better understand how or why the system 610 is performing. For example, a given abrasive article may leave undesirable scratches on the surface, and understanding the current performance behavior for the current parameter set may help troubleshoot the results. If normal curve data is available for the actual calculated curve, the grinding cut calculator 630 and the surface roughness calculator 650 can be used to experimentally determine what is different from the normal curve.

[0040] However, the parameter set generator 600 may generate new parameter sets based on the calculated polishing cut and surface roughness. If it is desired to increase the cut rate, the parameters may be altered to increase the polishing cut rate. In one embodiment, the parameter set generator 600 may use an iterative portion 602 to alter the potential parameters 602-612 until the polishing cut rate is maximized. The parameter set generator 600 may use an iterative portion 602 to alter the potential parameters 602-612 until the desired surface roughness is achieved.

[0041] The parameter set generator 600 may also have other functions 604. For example, in addition to receiving parameters from the polishing system 610, in embodiments where the workpiece surface is not stationary, additional parameters, such as parameters of the workpiece surface control 670, may be considered to improve performance. The motion control 672 may provide information regarding the motion pattern of the workpiece surface, such as a linear motion pattern, a rotational motion pattern, an orbital motion pattern, a random orbital motion pattern, or another motion pattern. The speed control 674 may provide information regarding the speed at which the workpiece surface moves. The force control 676 may provide information regarding the force with which the workpiece surface contacts the polishing system. Although the force control 676 is shown as part of the workpiece surface control 670, it is expressly contemplated that in other embodiments, the force control 676 may be part of the polishing system 610.

[0042] The parameters generated by the parameter set generator 600 may be sent directly to the polishing system 610 and / or the workpiece surface controller 670 by a parameter output unit 660. The new parameter set may be sent as a command to adjust 664 the current polishing operation in situ. The new parameter set may also be sent as instructions for a new polishing operation 662. The new parameter set may also be communicated in another manner 668, such as sent as a report to a display or other reporting system.

[0043] It should also be noted that elements of the systems described herein, or portions thereof, can be located on a wide variety of different devices, including, but not limited to, servers, desktop computers, laptop computers, embedded computers, industrial controllers, tablet computers, or other mobile devices, such as palmtop computers, cell phones, smartphones, multimedia players, personal digital assistants, and the like.

[0044] 7-9 illustrate exemplary computing systems that may be used in accordance with embodiments herein.

[0045] 7 is a simplified block diagram of one exemplary embodiment of a handheld or mobile computing device that may be used as a user or client handheld device 716 on which the system of the present application (or a portion thereof) may be deployed. For example, a mobile device may be deployed in an operator compartment of the parameter set generator 600 for use in generating, processing, or displaying data. FIG. 8 is another embodiment of a handheld or mobile device.

[0046] 7 provides a schematic block diagram of components of a client device 716 that may execute some of the components shown and described herein. The client device 716 executes and interacts with some of the devices. The device 716 is provided with a communication link 713 that allows the handheld device to communicate with other computing devices and under some embodiments provides a channel for automatically receiving information, such as by scanning. Examples of communication link 713 include wireless services used to provide cellular access to a network, as well as protocols that provide local wireless connections to a network, to enable communication via one or more communication protocols.

[0047] In another embodiment, the application may be received on a removable Secure Digital (SD) card that is connected to the interface 715. The interface 715 and communication link 713 communicate with a processor 717 (which may also embody a processor) along a bus 719 that is also connected to memory 721 and input / output (I / O) components 723, as well as a clock 725 and a position information system 727.

[0048] I / O components 723, in one embodiment, are provided to facilitate input and output operations and devices 916 may include input components such as buttons, touch sensors, optical sensors, microphones, touch screens, proximity sensors, accelerometers, orientation sensors, etc., and output components such as display devices, speakers, and / or printer ports. Other I / O components 723 may be used as well.

[0049] Clock 725 illustratively comprises a real-time clock component that outputs the time and date, and may also provide timing functions for processor 717.

[0050] Illustratively, the location information system 727 includes components that output the current geographic location of the device 716. This may include, for example, a global positioning system (GPS) receiver, a LORAN system, a dead reckoning system, a cellular triangulation system, or other positioning systems. It may also include, for example, mapping or navigation software that generates desired maps, navigation routes, and other geographic features.

[0051] Memory 721 stores operating system 729, network settings 731, applications 733, application configuration settings 735, data storage 737, communication drivers 739, and communication configuration settings 741. Memory 721 can include all types of tangible, volatile and non-volatile computer readable memory devices. It can also include computer storage media (discussed below). Memory 721 stores computer readable instructions that, when executed by processor 717, cause the processor to perform computer-implemented steps or functions in accordance with the instructions. Processor 717 can also be activated by other components to facilitate their functions.

[0052] 8 shows that the device may be a smartphone 871. The smartphone 871 has a touch-sensitive display 873 that displays icons or tiles or other user input mechanisms 875 that can be used by a user to run applications, make calls, perform data transfer operations, etc. Generally, smartphones 871 are built on mobile operating systems and offer more advanced computing capabilities and connectivity than feature phones.

[0053] It should be noted that other configurations of device 816 are possible.

[0054] FIG. 9 is a block diagram of a computing environment that can be used in the embodiments shown in the preceding figures.

[0055] 9 is an example of a computing environment in which elements of the systems and methods described herein, or portions thereof (for example), may be deployed. Referring to FIG. 9, an exemplary system for implementing some embodiments includes a general-purpose computing device in the form of a computer 910. Components of the computer 910 may include, but are not limited to, a processing unit 920 (which may include a processor), a system memory 930, and a system bus 921 that couples various system components, including the system memory, to the processing unit 920. The system bus 921 may be any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, and a local bus using any of a variety of bus architectures. The memory and programs described with respect to the systems and methods described herein may be deployed in the corresponding portions of FIG. 9.

[0056] Computer 910 typically includes a variety of computer readable media. Computer readable media may be any available media that can be accessed by computer 910, including both volatile and nonvolatile media, and removable and non-removable media. By way of example, and not limitation, computer readable media may include computer storage media and communication media. Computer storage media is distinct from and does not include modulated data signals or carrier waves. Computer storage media includes hardware storage media, including both volatile and nonvolatile, removable and non-removable media, implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory, or other memory technology, CD-ROM, digital versatile disk (DVD), or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage, or other magnetic storage devices, or any other medium that can be used to store the desired information and that can be accessed by computer 910. Communication media may embody computer readable instructions, data structures, program modules or other data in a transport mechanism and include any information delivery media. The term "modulated data signal" means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal.

[0057] The system memory 930 includes computer storage media in the form of volatile and / or nonvolatile memory such as read only memory (ROM) 931 and random access memory (RAM) 932. A basic input / output system (BIOS) 933, containing the basic routines that help to transfer information between elements within the computer 910, such as during start-up, is typically stored in ROM 931. RAM 932 typically contains data and / or program modules that are immediately accessible to and / or presently being operated on by the processing unit 920. By way of example, and not limitation, FIG. 9 illustrates operating system 1134, application programs 935, other program modules 936, and program data 937.

[0058] The computer 910 may also include other removable / non-removable, volatile / non-volatile computer storage media. By way of example only, Figure 9 illustrates a hard disk drive 941, a non-volatile magnetic disk 952, an optical disk drive 955, and a non-volatile optical disk 956, which read from or write to non-removable, non-volatile magnetic media. The hard disk drive 941 is typically connected to the system bus 921 through a non-removable memory interface, such as interface 940, and the optical disk drive 955 is typically connected to the system bus 921 by a removable memory interface, such as interface 950.

[0059] Alternatively, or in addition, the functions described herein may be performed, at least in part, by one or more hardware logic components. For example, and without limitation, exemplary types of hardware logic components that may be used include Field-programmable Gate Arrays (FPGAs), Application-specific Integrated Circuits (ASICs), Application-specific Standard Products (ASSPs), System-on-a-chip systems (SOCs), Complex Programmable Logic Devices (CPLDs), etc.

[0060] The drives and their associated computer storage media discussed above and illustrated in Figure 9 provide storage of computer readable instructions, data structures, program modules and other data for the computer 910. In Figure 9, for example, hard disk drive 941 is illustrated as storing operating system 1144, application programs 945, other program modules 946, and program data 947. Note that these components can either be the same as or different from operating system 934, application programs 935, other program modules 936, and program data 937.

[0061] A user may enter commands and information into the computer 910 through input devices such as a keyboard 962, a microphone 963, and a pointing device 961, such as a mouse, trackball, or touch pad. Other input devices (not shown) may include a joystick, game pad, satellite receiver, scanner, or the like. These and other input devices are connected to the processing unit 920 through a user input interface 960 that is often coupled to the system bus, although they may be connected by other interface and bus structures. A visual display 991 or other type of display device is also connected to the system bus 921 via an interface, such as a video interface 990. In addition to the monitor, computers may also include other peripheral output devices, such as speakers 997 and printer 996, which may be connected through an output peripheral interface 995.

[0062] The computer 910 operates in a networked environment using logical connections, such as a Local Area Network (LAN) or a Wide Area Network (WAN), to one or more remote computers, such as a remote computer 980.

[0063] When used in a LAN networking environment, the computer 910 is connected to the LAN 971 through a network interface or adapter 970. When used in a WAN networking environment, the computer 910 typically includes a modem 972 or other means for establishing communications over the WAN 1173, such as the Internet. In a networked environment, program modules may be stored in remote memory storage devices. Figure 9 illustrates, for example, that remote application programs 985 may reside on the remote computer 980.

[0064] A polishing operation monitoring system is presented that includes a particle tracking system that receives positions of abrasive particles on an abrasive article surface from a particle position acquisition unit. The system also includes a polishing operation parameter acquisition unit that acquires a current set of operating parameters of the polishing machine using a communication component. The system also includes a polishing volume calculation unit that calculates a polished volume of the workpiece surface contacted by the abrasive article surface based on the tracked paths of the abrasive particles and the current set of operating parameters. The system also includes a polishing parameter adjustment unit that provides a new set of operating parameters for the polishing system based on the calculated polished volume. The polishing system implements the new set of operating parameters.

[0065] The system may be implemented such that a communications component communicates the new set of operating parameters to the polishing machine.

[0066] The system may be implemented such that the polishing machine is remote from the polishing performance monitoring system.

[0067] The system may be implemented such that the polishing parameter adjuster uses an iterative process to provide a new set of operating parameters.

[0068] The system may also include a surface roughness calculation unit that calculates the surface roughness of the workpiece surface based on the calculated polishing volume.

[0069] The system may be implemented such that the surface roughness is calculated based on the geometric shape of the abrasive particles.

[0070] The system may be implemented such that the surface roughness is calculated based on the relative positions of the abrasive particles within the plurality of abrasive particles.

[0071] The system may be implemented such that the surface roughness is calculated based on the orientation of the abrasive particles.

[0072] The system may be implemented such that the polishing volume calculation unit calculates the polishing volume based on the velocity of the tracked abrasive particles.

[0073] The system may be implemented such that the current set of operating parameters includes the vibration frequency of the polishing system, the vibration amplitude of the polishing system, the rotational speed of the polishing system, the rotational speed of the workpiece surface, or the force applied to the abrasive article by the polishing system.

[0074] The system may be implemented such that the current set of operational settings is the last operational set of the polishing machine's operational settings.

[0075] The system may be implemented such that the current set of operational settings is a default set of operational settings for the polishing machine.

[0076] The system may be implemented such that the current set of operating settings is obtained in-situ.

[0077] The system may be implemented such that the particle position acquisition portion is a sensor.

[0078] The system may be implemented such that the sensor is an optical sensor.

[0079] The system may be implemented such that the sensor is a camera.

[0080] The system may be implemented such that the sensor is the force control unit.

[0081] A method of adjusting operating parameters for a robotic polishing system is presented. The method includes detecting a position of an abrasive particle on an abrasive article using a sensor. The method also includes obtaining a first set of operating parameters for the robotic polishing system from a computing system associated with the robotic polishing system. The method also includes calculating a path of the detected abrasive particle on a work surface in contact with the abrasive article. The method also includes calculating a first volumetric cut rate of the abrasive article based on the calculated path and the obtained operating parameters. The method also includes selecting a second set of operating parameters for the robotic polishing system. The second set of operating parameters produces a second volumetric cut rate different from the first volumetric cut rate.

[0082] The method may be implemented such that the second volumetric cutting rate is greater than the first volumetric cutting rate.

[0083] The method may be implemented such that the sensor is an optical sensor.

[0084] The method may be implemented such that the sensor is a camera.

[0085] The method may also include detecting the amount of wear of the abrasive particles.

[0086] The method may also include calculating a surface roughness of the workpiece surface.

[0087] The method may be implemented such that calculating the surface roughness includes calculating a relative velocity of the detected abrasive particles along the path.

[0088] The method may be implemented such that calculating the first volumetric cutting rate includes applying a polishing amount compensation.

[0089] The method may be implemented such that the first set of operating parameters includes a vibration frequency, a vibration amplitude, a relative velocity between the polishing system and the work surface, and a force applied to the abrasive article or abrasive article federate.

[0090] The method may be implemented such that the first set of motion settings is a final set of motion settings of the robotic polishing system.

[0091] The method may be implemented such that the first set of operational settings is a default set of operational settings for the robotic polishing system.

[0092] The method may be implemented such that the first set of operating settings is obtained in-situ.

[0093] The method may also include detecting a relative position of the detected abrasive particle within the plurality of abrasive particles.

[0094] The method may also include detecting a geometric shape of the detected abrasive particles.

[0095] The method may also include detecting an orientation of the detected abrasive particles. EXAMPLES

[0096] Example 1 The engine valves are polished using a rotational motion of the valve and an oscillatory motion of the abrasive, as shown in Figure 10. However, although this example shows valve polishing, it is expressly contemplated that the systems and methods described herein may be useful for other automotive components, such as engine parts like crankshafts or transmission parts.

[0097] TRIZACT® abrasive grains are used in this application. The important parameters in this process are the position of the abrasive tip, the vibration frequency, the vibration amplitude, the valve rotation speed, and the abrasive feed rate. The machine shown in FIG. 12A was provided by Sanshine co.ltd. The position information of TRIZACT® abrasive grains was obtained as matrix data from the mold shape for microreplication. The position information was downloaded from the cloud server. In this example, the pattern of TRIZACT® abrasive grains was 130 μm pitch with regularity as row / matrix. The width and length were both 25 mm.

[0098] The cutting performance was evaluated based on the polishing path, and the numerical analysis software MATLAB was used for the analysis. The polishing path can be calculated from the machining process parameters. 2 The path was calculated using an abrasive tip of 10 mm thickness. The material was S45C with a thickness of 10 mm. The force setting was 2 mm and the hardness of the contact wheel was 70. The rotation speeds were 1289 rpm, 827 rpm, 597 rpm, 249 rpm and 18 rpm. The polishing time was 15 seconds and the test was repeated three times for each speed. The amount of cut was calculated from the difference in weight before and after. In addition, the area of ​​abrasive use changed at each speed, so the length of wear was checked and the steady amount of cut was calculated by that length.

[0099] The number of polishing passes in each divided area was calculated to obtain a polishing density map, as shown in Figure 11. However, the polishing density is not sufficient to evaluate the cutting performance, because the cutting performance is considered to be speed-dependent, and the relative speed is different for each area on the valve surface.

[0100] Therefore, the effect of speed should be considered on cutting performance. To investigate the effect of speed, a basic experiment was conducted using a lathe as shown in FIG. 12A. The amount of cut of a carbon steel bar was measured for each rotation speed. FIG. 12B shows the experimental results. From the results, it was found that the amount of cut per unit distance decreases exponentially with respect to the speed. Note that the unit of the amount of cut is distance, not time. The reason for this exponential decrease is thought to be the effect of the lubricant. From the experimental results, the polishing density was corrected to obtain the polishing amount map shown in FIG. 7.

[0101] The surface roughness is evaluated from this polishing amount map. A profile curve can be obtained by extracting the value on the horizontal axis of the polishing amount map. Next, as shown in FIG. 13A, a high-pass filter is applied to the profile curve to evaluate the roughness curve. From this roughness curve, a hypothetical value for the surface roughness is evaluated. This value can be made more accurate by finely dividing the evaluation area and increasing the resolution.

[0102] To find the best parameter set, the vibration frequency, vibration amplitude and valve rotation speed were varied as shown in Table 1.

[0103] [Table 1]

[0104] FIG. 13B shows the polishing amount results for all patterns. A point in the figure indicates the average polishing amount obtained with one parameter set. The colors indicate the polishing amount levels, with a higher polishing amount of about 0.4 at the center and a lower polishing amount that drops to about 0.2 near the edge. The results yielded the best parameter set, as shown in Table 2. Instead of using the maximum speed as a parameter, it was found that it is necessary to set appropriate parameters by considering the speed dependency of the cutting amount.

[0105] [Table 2]

[0106] Example 2 To verify this evaluation method, a simple experiment was conducted using an engine valve as shown in FIG. 14A. The experimental conditions are shown in Table 3. In this experiment, only the vibration frequency was changed. FIG. 14B and FIG. 14C show the roughness curves evaluated by the developed method using the parameters of Set 1 and Set 2. FIG. 14D shows the assumed values ​​of the surface roughness evaluated from the roughness curve. As shown in FIG. 14D, the surface roughness evaluated by the conditions of Set 2 had a lower surface roughness. FIG. 14E shows the results of the surface roughness evaluated by the experiment. As shown in FIG. 14E, the engine valve polished by the conditions of Set 2 had a finer surface roughness. From these results, it was found that the evaluation results of the developed method correlate with the experimental results. Therefore, it is concluded that the developed method is capable of evaluating values ​​related to surface roughness.

[0107] [Table 3]

Claims

Claim 1 A grinding operation monitoring system, comprising: a particle tracking system that receives, from a particle position acquisition unit, the positions of abrasive particles on the surface of a workpiece being ground; a grinding operation parameter acquisition unit that uses a communication component to acquire a current set of operation parameters of a grinding machine; a grinding volume calculation unit that calculates a grinding volume of a machined surface contacted by the surface of the workpiece being ground based on the path of the tracked abrasive particles and the current set of operation parameters; a grinding parameter adjustment unit that provides a new set of operation parameters for the grinding system based on the calculated grinding volume, and the grinding system implements the new set of operation parameters. A grinding operation monitoring system. Claim 2 A surface roughness calculation unit that calculates the surface roughness of the machined surface based on the calculated grinding volume, The system according to claim 1, further comprising. Claim 3 The system according to claim 1 or 2, wherein the grinding volume calculation unit calculates the grinding volume based on the velocity of the tracked abrasive particles. Claim 4 The current set of operation parameters includes the frequency of the grinding system, the vibration amplitude of the grinding system, the rotational speed of the grinding system, the rotational speed of the machined surface, or the force applied to the workpiece being ground by the grinding system, and the current set of operation parameters is the last operation setting of the grinding machine, the default operation setting of the grinding machine, or an operation setting obtained on-site. The system according to claim 1. Claim 5 A method for adjusting operation parameters for a robotic grinding system, comprising: using a sensor to detect the positions of abrasive particles on a workpiece being ground; acquiring, from a computing system associated with the robotic grinding system, a first set of operation parameters for the robotic grinding system; calculating the path of the detected abrasive particles on a machined surface in contact with the workpiece being ground; calculating a first volumetric cutting rate of the workpiece being ground based on the calculated path and the acquired operation parameters; selecting a second set of operation parameters for the robotic grinding system, wherein the second set of operation parameters generates a second cutting volume rate different from the first volumetric cutting rate, A method for adjusting operation parameters for a robotic grinding system, including. Claim 6 Detecting the wear amount of the abrasive particles The method according to claim 5, further comprising this.

7. Calculating the surface roughness of the surface to be machined The method according to claim 5, further comprising this.

8. The first set of the operation parameters includes a frequency, an oscillation amplitude, a relative speed between the polishing system and the surface to be machined, a force applied to the polishing article, or a wear rate of the polishing article, and these are the last operation settings of the robot polishing system, the default operation settings of the robot polishing system, or the settings obtained on-site. The method according to claim 5.

9. Detecting the relative positions of the detected abrasive particles within a plurality of abrasive particles The method according to claim 5, further comprising this.

10. The method according to claim 5, further comprising detecting the geometric shape of the detected abrasive particles.

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