Metallization Materials

JP2024534466A5Inactive Publication Date: 2025-10-30NANHAI NANXIN NON WOVEN CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024517038
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2021-09-17
Publication Date
2025-10-30
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Conventional metallized materials face issues with electrical hazards, lack of breathability, and flexibility due to direct metal coating on substrates, and unreliable adhesion methods like laminating thin metal foils.

Method used

A metallized material design featuring a substrate with a nonwoven or film layer, a metal coating layer (MCL) between the substrate and a transparent coating layer (TCL), and an optional protective layer, allowing for a removable carrier layer to prevent direct exposure and enhance flexibility and breathability.

Benefits of technology

The design provides a non-conductive, highly reflective, and breathable metallized material suitable for medical and outdoor applications, reducing heat loss and electrical hazards while maintaining flexibility and vapor permeability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000026_0000
    Figure 00000026_0000
  • Figure 00000026_0001
    Figure 00000026_0001
  • Figure 00000026_0002
    Figure 00000026_0002
Patent Text Reader

Abstract

A metallized material is provided that includes (i) a substrate that includes a nonwoven, a film, or a combination thereof, (ii) a metal coating layer (MCL), and (iii) a transparent coating layer (TCL), where the MCL is located directly or indirectly between the substrate and the TCL. A peelable metallized material is provided that includes a metallized material and a removable carrier layer located directly adjacent to the TCL. A peelable metallized material and a method of making the metallized material are also provided.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] Inventive embodiments of the present disclosure generally relate to a metallized material (e.g., a sheet, blanket, etc.) comprising: (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL), where the MCL is located directly or indirectly between the substrate and the TCL. Inventive embodiments of the present disclosure also relate to a peelable metallized material, where the peelable metallized material comprises a metallized material and a removable carrier layer located directly adjacent to the TCL. [Background technology]

[0002] Metallized materials, such as metallized blankets, are traditionally made by applying a metal coating to a base substrate, such as a nonwoven fabric or film. Such metallized materials, for example, provide a mechanism for retaining a great deal of a user's body heat. In this regard, metallized materials (also known as space blankets, Mylar blankets, first aid blankets, safety blankets, thermal blankets, etc.) are made by applying a heat-reflective metal coating to a thin plastic film or nonwoven fabric. Ideally, the metallized material reflects around 90% of the user's body heat to reduce heat loss from the user's body.

[0003] Some such metallized materials have been manufactured by directly coating a metal layer (e.g., a metal coating) onto a plastic film or plastic nonwoven fabric, for example, by a vacuum coating process, a chemical coating process, or an electrostatic coating process. Because the metal coating on the plastic film and / or nonwoven fabric is conductive, a significant electrical hazard can exist when such metallized materials are used in conjunction with diathermy or metal operating tables.

[0004] Another drawback of some metallized materials relates to their lack of breathability and / or flexibility. In this regard, a desirable level of vapor permeability and / or flexibility (e.g., flexibility to easily conform to the user's body) may also be required for such metallized blankets in applications involving heat retention.

[0005] Furthermore, the conventional method of directly coating a metal layer onto a nonwoven fabric or film cannot achieve sufficient specular reflection due to the small amount of metal deposited on the nonwoven fabric or film. That is, directly coating a metal layer onto a supporting substrate (e.g., a film or nonwoven fabric) often requires a larger amount of metal to be deposited onto the supporting substrate to achieve a desired level of reflectance, which may adversely affect the breathability and / or flexibility mentioned above.

[0006] An alternative method of producing such metallized materials involves adhesively laminating a thin metal foil sheet to a supporting substrate (e.g., a plastic film or plastic nonwoven). However, such an approach can be particularly challenging and unreliable. For example, if the metal foil sheet is too thin, it can easily tear during the lamination process. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been made to solve the problems in the conventional techniques described above. [Means for solving the problem]

[0008] One or more embodiments of the present invention may address one or more of the problems described above. Some embodiments according to the present invention provide a metallized material that includes: (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL), where the MCL is located directly or indirectly between the substrate and the TCL.

[0009] In another aspect, the present invention provides a peelable metallized material, which includes a metallized material as described and disclosed herein and a removable carrier layer located directly adjacent to the TCL, e.g., the carrier layer may be selectively removed or peeled away leaving behind the TCL.

[0010] In another aspect, the present invention provides a method of making a peelable metallized material, the method comprising: (i) providing or forming a metal-containing intermediate material comprising: (a) a carrier layer; (b) a transparent coating layer (TCL) located immediately adjacent to the carrier layer; (c) a metal coating layer (MCL) located immediately adjacent to the TCL; and (d) an optional protective coating directly or indirectly adjacent to the MCL, wherein the MCL is located between the protective coating and the TCL; (ii) providing or forming a substrate comprising at least one nonwoven, at least one film, or a combination thereof; and (iii) adhering the metal-containing intermediate material to the substrate to provide a peelable metallized material, as disclosed and described herein.

[0011] Furthermore, in another aspect, the present invention provides a method of manufacturing a metallized material, the method including the steps of (i) providing a peelable metallized material as described and disclosed herein, or forming a peelable metallized material by a method as described and disclosed herein, and (ii) removing the carrier layer to provide a metallized material as described and disclosed herein.

[0012] The present invention will now be described in more detail with reference to the accompanying drawings, in which some, but not all, embodiments of the invention are shown. Indeed, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference characters refer to like elements throughout. The drawings are as follows: [Brief description of the drawings]

[0013] [Figure 1A] 1 illustrates a metallized material having a film layer melt extruded directly onto a nonwoven layer according to some embodiments of the present invention. [Figure 1B] 1 illustrates a metallized material having a film layer adhesively bonded to a nonwoven layer according to some embodiments of the present invention. [Diagram 2] 2 shows an expanded view of a non-conductive metallization layer according to some embodiments of the present invention. [Diagram 3] 1 illustrates a process for depositing a metallic coating layer (MCL) onto a release liner comprising a carrier layer and a transparent coating layer (TCL) / release coating according to some embodiments of the present invention. [Figure 4A] 1 illustrates a process for forming a composite as a substrate for use in metallization materials according to some embodiments of the present invention. [Figure 4B] 1 illustrates another process for forming a composite as a substrate for use in metallization materials according to some embodiments of the present invention. [Figure 5A] 1 illustrates a process for transferring an MCL to a substrate and then removing the carrier layer according to some embodiments of the present invention. [Figure 5B] 13 illustrates another process for transferring an MCL to a substrate and then removing the carrier layer according to some embodiments of the present invention. [Figure 6] An image of an example of a metallized material, showing the MCL through the TCL. [Figure 7] Image of another example of metallized material, showing the MCL through the TCL. [Figure 8] Image of another example of metallized material, showing the MCL through the TCL. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present invention will now be described in more detail with reference to the accompanying drawings, in which some, but not all, embodiments of the invention are shown. Indeed, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0015] Some embodiments of the present invention generally relate to a metallized material (e.g., a non-conductive metallized material) that includes a substrate, which may include one or more nonwoven layers and / or one or more plastic film layers, a metal coating layer (MCL), and a transparent coating layer (TCL), where the MCL is located directly or indirectly between the TCL and the substrate. For example, the TCL may define an outermost layer of the metallized material, the film layer may define a second outermost layer of the metallized material, and the MCL constitutes at least one layer between the two outermost layers of the metallized material. For example, the metallized material may include a composite product that includes an MCL as described herein, directly or indirectly encapsulated between the TCL and the substrate or other optional intermediate layer. In this regard, the MCL is not directly exposed to the external environment. Thus, the MCL is shielded from the external environment, severely reducing or eliminating any electrical conductivity that may otherwise be associated with the MCL. The metallized material may be, for example, a non-conductive metallized material because the MCL does not come into contact with the outside environment, e.g., the MCL is not an electrical hazard (e.g., in an operating room environment).

[0016] According to some embodiments of the present invention, the substrate may be one or more nonwoven layers, one or more film layers, or a combination thereof (e.g., a composite including both at least one nonwoven layer and at least one film layer), and may comprise a desired level of flexibility (e.g., flexibility as measured by a handle-o-meter) to provide sufficient drapeability and / or wrapability (e.g., the ability to envelop a user), and / or a desired level of breathability (e.g., the ability to allow vapor to pass through the substrate and exit on the opposite side of a metallized material), and / or a desired level of liquid penetration resistance as measured by hydrostatic head.

[0017] The MCL, according to some embodiments of the present invention, comprises a highly reflective metal or metal alloy (e.g., aluminum (or its alloy), gold (or its alloy), copper (or its alloy), or silver (or its alloy)). Optionally, the metallization material may include a protective coating. The protective coating may be provided as a separate layer, with the MCL sandwiched directly or indirectly between the TCL and the protective coating.

[0018] The TCL can be transparent to electromagnetic radiation generally associated with mammals (e.g., humans), as discussed below, such that radiation or heat emitted by the user passes through the TCL and is reflected back to the MCL by the user. That is, in use, the TCL is typically located proximate to the user, while the substrate is located distal to the user. The MCL can, for example, be deposited directly on the TCL, where the TCL can function as a release coating or release liner applied to the carrier layer. The adhesive strength between the TCL and the carrier layer can be lower than the adhesive strength between the MCL and an optional protective coating or substrate. Thus, the carrier layer can be removed (e.g., peeled) to leave the TCL adhered to the MCL, whereby the TCL defines one of the outermost layers of the metallized material.

[0019] According to some embodiments of the present invention, the metallized material may be used as a reflective and thermal layer to reduce heat loss from the human body. In this regard, the metallized material may be provided in the form of gowns, face masks, sterilization wraps, headwear, surgical drapes, medical thermal blankets, and outdoor thermal blanket applications that have high reflectivity, non-conductivity, good flexibility, sufficient pliability, and breathability. For example, in cold weather outdoors, wrapping the user's body with the metallized material may help prevent radiant heat loss and reduce hypothermia.

[0020] The terms "substantial" or "substantially" may, according to some embodiments of the invention, include the entire amount specified, or, according to other embodiments of the invention, may include nearly the entire amount, but not the entire amount specified (e.g., 95%, 96%, 97%, 98%, or 99% of the entire amount specified).

[0021] The term "polymer" or "polymeric" as used interchangeably herein may include homopolymers, copolymers (e.g., block copolymers, graft copolymers, random copolymers, and alternating copolymers, etc.), terpolymers, etc., as well as blends and modifications thereof. Furthermore, unless specifically limited otherwise, the term "polymer" or "polymeric" is intended to include all possible structural isomers, stereoisomers, including but not limited to geometric isomers, optical isomers, or enantiomers, and / or any chiral molecular configurations of such polymer or polymeric material. These configurations include, but are not limited to, isotactic, syndiotactic, and atactic configurations of such polymer or polymeric material. The term "polymer" or "polymeric" is also intended to include polymers made from various catalyst systems, including but not limited to Ziegler-Natta catalyst systems and metallocene / single-site catalyst systems. The term "polymer" or "polymeric" is also intended to include polymers produced by fermentation processes or biologically derived polymers, according to some embodiments of the present invention.

[0022] As used herein, the terms "nonwoven" and "nonwoven web" may include webs having a structure of individual fibers, filaments, and / or threads that are interleaved but not in a identifiable repeating manner as found in knitted or woven fabrics. Nonwoven fabrics or webs, according to some embodiments of the present invention, may be formed by any process conventionally known in the art (e.g., meltblowing, spunbonding, needlepunching, hydroentangling, airlaid, bonded carded web, etc.). As used herein, "nonwoven web" may include a plurality of individual fibers that are not processed in an integrated process.

[0023] As used herein, the terms "fabric" and "nonwoven fabric" may encompass a web of fibers in which a plurality of fibers are mechanically entangled or interconnected, fused to one another, or chemically bonded to one another. For example, a nonwoven web of individually laid fibers may be treated with a bonding or consolidation process to bond at least a portion of the individual fibers together to form a coherent (e.g., bonded) web of interconnected fibers.

[0024] As used herein, the terms "consolidated" and "consolidation" may include bringing at least a portion of the fibers of a nonwoven web into closer proximity or attachment therebetween (e.g., thermally fusing together, chemically bonding together, and / or mechanically entangling together) to form one or more bond sites that function to provide greater resistance to external forces (e.g., abrasive and tensile forces) than a non-consolidated web. The bond site or sites may include, for example, discrete or localized regions of the web material that have been softened or melted, for example, and optionally subsequently or simultaneously compressed to form discrete or localized deformations of the web material. Additionally, the term "consolidated" may encompass an entire nonwoven web that has been treated to bring at least a portion of the fibers into closer proximity or attachment therebetween (e.g., thermally fuse to one another, chemically bond to one another, and / or mechanically entangle one another), such as by thermal bonding or mechanical entanglement (e.g., hydroentanglement), just to name a few examples. Such webs may be considered "consolidated nonwovens," "nonwoven fabrics," or simply "fabrics," according to some embodiments of the present invention.

[0025] As used herein, the term "staple fiber" may encompass cut fibers from a filament. According to some embodiments, any type of filament material may be used to form the staple fibers. For example, the staple fibers may be formed from polymeric and / or elastomeric fibers. Non-limiting examples of materials may include polyolefins (e.g., polypropylene or polypropylene-containing copolymers), polyethylene terephthalate, and polyamides. The average length of the staple fibers may be, by way of example only, from about 2 centimeters to about 15 centimeters.

[0026] As used herein, the term "spunbond" may include fibers formed by extruding molten thermoplastic material as filaments from a plurality of fine, usually circular, spinneret capillaries, the diameter of the extruded filaments then rapidly decreasing. In accordance with one embodiment of the present invention, spunbond fibers are typically non-tacky when deposited on a collecting surface and may be typically continuous as disclosed and described herein. It should be noted that spunbonds used in some composites of the present invention may include nonwoven fabrics described in the literature as SPINLACE®. Spunbond fibers may include, for example, long fibers.

[0027] The term "continuous fibers" as used herein means fibers that are not cut from their original length before being formed into a nonwoven web or fabric. Continuous fibers may have an average length of greater than about 15 centimeters to greater than 1 meter, up to the length of the web or fabric being formed. For example, continuous fibers as used herein may include fibers having a fiber length of at least 1,000 times the average fiber diameter, e.g., fibers having a fiber length of at least about 5,000, 10,000, 50,000, or 100,000 times the average fiber diameter.

[0028] As used herein, the term "meltblown" may include fibers formed by extruding molten thermoplastic material as molten threads or filaments through a plurality of fine die capillaries into a converging high-velocity (usually hot) gas stream (e.g., air stream) that attenuates the filaments of molten thermoplastic material and reduces their diameter (which may be reduced to the diameter of a microfiber). According to one embodiment of the present invention, the die capillaries may be circular. The meltblown fibers are then carried by the high-velocity gas stream and deposited on a collecting surface to form a web of randomly distributed meltblown fibers. Meltblown fibers may include microfibers that may be continuous or discontinuous and that are typically tacky when deposited on a collecting surface. However, meltblown fibers are shorter in length than spunbond fibers.

[0029] As used herein, the term "monolithic" film may include any film that is continuous and substantially free or devoid of pores (e.g., no pores at all). In some alternative embodiments of the present invention, a "monolithic" film may include less pore structure than would be found in a microporous film. According to some non-limiting exemplary embodiments of the present invention, a monolithic film may act as a barrier to liquids and particulate matter while allowing water vapor to pass through. Furthermore, without wishing to be bound by theory, achieving and maintaining high breathability can provide an article that is more comfortable to wear, since the movement of water vapor through the laminate structure helps reduce and / or limit discomfort caused by excess moisture being trapped against the skin. A "monolithic" film may include, for example, a highly breathable polymer.

[0030] As used herein, the term "highly breathable polymer" may encompass any polymer or elastomer that is selectively permeable to water vapor but substantially impermeable to liquid water and capable of forming a breathable film, e.g., a highly breathable polymer can absorb and desorb water vapor and provide a barrier to liquids (e.g., water, blood, etc.). For example, a highly breathable polymer can absorb water vapor from one side of the film and release water vapor to the other side of the film, thereby allowing water vapor to be transported through the film. Because a highly breathable polymer can provide breathability to a film, a film formed from such a polymer need not contain pores (e.g., a monolithic film). According to some embodiments of the present invention, a "highly breathable polymer" is a polymer that, when formed into a film, has a moisture vapor transmission rate (MVTR) of at least 500 g / m2 per day. 2 According to some embodiments of the present invention, a "highly breathable polymer" may include any thermoplastic polymer or elastomer having an MVTR of at least 750 g / m per day when formed into a film (e.g., a film having a thickness of about 25 microns or less). 2 Or at least 1000g / m 2 According to some embodiments of the present invention, the highly breathable polymer may include, for example, any one or any combination of polyether block amide copolymers (e.g., PEBAX® from Arkema Group), polyester block amide copolymers, copolyester thermoplastic elastomers (e.g., ARNITEL® from DSM Engineering Plastics, or HYTREL® from EI DuPont de Nemours and Company), or thermoplastic urethane elastomers (TPUs).

[0031] The term "microporous" film as used herein may include a polymeric film layer having a plurality of micropores dispersed throughout the body of the film. For example, microporous films may generally be produced by dispersing finely divided particles of a non-hygroscopic filler material, such as inorganic salts (e.g., calcium carbonate), in a suitable polymer, then forming a film of the filled polymer and stretching the film to obtain good porosity for good absorption or transmission of water vapor. For example, the breathability of a microporous film may depend on forming a tortuous pore path throughout the film by stretching the filler-impregnated film to obtain the desired porosity (e.g., pore formation). Furthermore, the barrier properties of such microporous films are affected by the surface tension of the liquid to which they are exposed (e.g., isopropyl alcohol penetrates microporous films more easily than water), and microporous films transmit odors more easily than solid films (e.g., monolithic films).

[0032] As used herein, the term "layer" may encompass any loosely recognizable combination of similar material types and / or functions that reside in the XY plane.

[0033] All whole number endpoints disclosed herein that can create smaller ranges within a given range disclosed herein are within the scope of some embodiments of the invention. For example, a disclosure of about 10 to about 15 encompasses disclosures of intermediate ranges, such as about 10 to about 11, about 10 to about 12, about 13 to about 15, about 14 to about 15, etc. Furthermore, all single decimals (e.g., numbers rounded to the nearest tenth) that can create smaller ranges within a given range disclosed herein are within the scope of some embodiments of the invention. For example, a disclosure of about 1.5 to about 2.0 encompasses disclosures of intermediate ranges, such as about 1.5 to about 1.6, about 1.5 to about 1.7, about 1.7 to about 1.8, etc.

[0034] In one aspect, the present invention provides a metallized material comprising: (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL), the MCL being located directly or indirectly between the substrate and the TCL. Optionally, a protective layer (described in more detail below) may be located between the substrate and the MCL. According to some embodiments of the present invention, the substrate may comprise a composite comprising, for example, a first nonwoven layer and a first film layer. For example, the composite may comprise a first film layer melt extruded directly onto the first nonwoven layer. For example, FIG. 1 illustrates a metallized material 1, where the substrate comprises a first nonwoven layer 20 and a first film layer 30. As shown in FIG. 1A, the first film layer 30 is melt extruded directly onto the first film layer 20 (e.g., there is no adhesive at the interface between the two). An adhesive layer 21 (e.g., a second adhesive layer) is located directly between the first nonwoven layer 20 and the protective coating 14. As also shown in FIG. 1A, the metallized material 1 includes an MCL 12 that is located directly between the protective coating 14 and the TCL 16. Alternatively, the composite may include a first adhesive layer that is located between the first nonwoven layer and the first film layer to bond the first nonwoven layer and the first film layer. For example, FIG. 1B shows a metallized material 1 similar to that of FIG. 1A, but including a first adhesive layer 31 that is located directly between the first nonwoven layer 20 and the first film layer 30.

[0035] According to some embodiments of the present invention, the metallized material includes a first adhesive layer, the first adhesive layer being located between the first film layer and the first nonwoven layer and including a first discontinuous pattern. The discontinuous adhesive pattern may, for example, reduce reduced breathability by including non-adhesive areas that do not impede the passage of water vapor. For example, the first discontinuous pattern may include a first plurality of discrete adhesive islands surrounded by areas without adhesive. For example, the first discontinuous pattern may include a continuous non-adhesive area and a plurality of adhesive islands surrounded by continuous non-adhesive areas. Alternatively, the first discontinuous pattern may include a first plurality of discrete islands that are free of adhesive and surrounded by areas of adhesive. The areas of adhesive may include a continuous network of adhesive. According to some embodiments of the present invention, the first adhesive layer may include a first discontinuous pattern, the first discontinuous pattern may include a first plurality of independent and distinct adhesive lines. For example, the first plurality of independent and distinct adhesive lines may be in a straight, arcuate, or zigzag configuration. As an alternative to a discontinuous adhesive pattern, the first adhesive layer may include a first continuous coating, the first continuous coating covering substantially all of the interface between the first nonwoven layer and the first film layer.

[0036] According to some embodiments of the present invention, the first adhesive layer may have a basis weight of about 0.2 to about 5 gsm, such as at least about any of 0.25, 0.5, 0.75, 1, 1.5, 2, and 2.5 gsm, and / or at most about any of 5, 4, 3, and 2.5 gsm. Additionally or alternatively, the first adhesive layer may include a variety of adhesive materials, non-limiting examples of which include, for example, a moisture-resistant pressure sensitive adhesive, an acrylic hot melt adhesive, or a combination thereof.

[0037] According to some embodiments of the present invention, the nonwoven fabric (e.g., the first nonwoven fabric layer) may comprise one or more spunbond layers, one or more meltblown layers, one or more needlepunched layers, one or more hydroentangled layers, one or more carded layers, one or more airlaid layers, one or more wetlaid layers, one or more submicron layers, or any combination thereof. For example, the nonwoven fabric (e.g., the first nonwoven fabric layer) may comprise a spunbond-meltblown-spunbond (SMS) structure, where each "S" may comprise from about 1 to about 5 spunbond layers, and "M" may comprise from about 1 to about 5 meltblown layers. According to some embodiments of the present invention, the nonwoven fabric (e.g., the first nonwoven fabric layer) may comprise one or more synthetic polymers, such as one or more polyolefins (e.g., polypropylene, polyethylene, etc.), one or more polyesters, one or more polyamides, or any combination thereof. In yet another example, the nonwoven fabric (e.g., the first nonwoven layer) may also include natural and / or synthetic cellulose fibers, such as cotton, pulp, viscose, and rayon. For example, one or more layers may include natural and / or synthetic cellulose fibers that may be sandwiched between two spunbond layers. Additionally or alternatively, the nonwoven fabric (e.g., the first nonwoven layer) may be provided as a nonwoven web (e.g., a nonwoven web that is not consolidated) or as a nonwoven fabric consolidated by any means disclosed herein. For example, the nonwoven fabric may be consolidated by thermal calendaring, ultrasonic bonding, mechanical bonding (e.g., hydroentanglement), chemical bonding, or any combination thereof.

[0038] According to some embodiments of the present invention, the nonwoven fabric (e.g., the first nonwoven fabric layer) may have a basis weight of from about 5 to about 500 gsm, e.g., at least about any of 5, 6, 8, 10, 12, 15, 25, 50, 75, 100, 150, 200, and 250 gsm, and / or at most about any of 500, 450, 400, 350, 300, and 250 gsm.

[0039] According to some embodiments of the present invention, the film (e.g., the first film layer) may comprise a single layer microporous film or a single layer monolithic film. Alternatively, the film (e.g., the first film layer) may comprise a multilayer film including one or more microporous films and / or one or more monolithic films. The film (e.g., the first film layer) may have an average thickness of about 5 to about 150 microns, e.g., at least about any of 5, 10, 15, 20, 25, 30, 40, 50, 60, 70, and 75 microns, and / or at most about any of 150, 125, 100, 90, 80, and 75 microns.

[0040] According to some embodiments of the present invention, the film (e.g., the first film layer) has a moisture vapor transmission rate (MVTR) of at least about 25 g / m per 24 hours as measured by ASTM E96D. 2 For example, at least about 25, 50, 75, 100, 125, 150, 175, and 200 g / m per 24 hours as measured by ASTM E96D. 2 and / or up to about 500, 450, 400, 350, 300, 275, 250, 225, and 200 g / m per 24 hours as measured by ASTM E96D. 2 Additionally or alternatively, the film (e.g., the first film layer) may have a hydrostatic head (HSH) of at least about 50 mbar as measured by AATCC 127 (60 mbar / min), such as at least about any of 50, 60, 75, 80, 100, and 125 mbar as measured by AATCC 127 (60 mbar / min), and / or at most about any of 200, 175, 150, and 125 mbar as measured by AATCC 127 (60 mbar / min).

[0041] According to some embodiments of the present invention, the film (e.g., the first film layer) may comprise a synthetic polymer (e.g., one or more polyolefins (e.g., polypropylene, polyethylene, etc.), one or more polyesters, or a combination thereof), and / or one or more biopolymers (e.g., one or more polylactic acids).

[0042] As mentioned above, the metallization material may include a protective coating located between the MCL and the substrate. For example, FIG. 2 is an expanded view of a non-conductive metallization layer according to some embodiments of the present invention, which includes a release liner 10 including a carrier layer 11 and a TCL 16. The TCL 16 is directly sandwiched between the carrier layer 11 and the MCL 12. FIG. 2 shows an exemplary embodiment including an optional protective coating layer 14. According to some embodiments of the present invention, the carrier layer may include polyester, polyvinyl chloride, polypropylene, polyethylene, thermoplastic polyurethane, paper, or any combination thereof. In this regard, the first adhesive strength between the carrier layer and the TCL is lower than the second adhesive strength between the TCL and the MCL. Thus, the carrier layer can be removed or separated from the TCL while the TCL remains attached to the MCL, and the carrier layer operates or functions as a release coating in this aspect. The TCL may include, for example, a thermal release coating or a low temperature release coating. The TCL may be, for example, a glossy, matte, or non-glossy type finish, for example, to provide a glossy, matte, or non-glossy appearance. As described herein, the TCL may include, for example, cellulose acetate-based, silicone-based, and / or fluoride-based materials. As also described herein, the TCL is generally transparent to take advantage of the high reflectance properties of the MCL.

[0043] Figure 3 illustrates a process for depositing an MCL onto a release liner including a carrier layer and a TCL (e.g., release coating) according to some embodiments of the present invention. As shown in Figure 3, a release liner 50 including a carrier layer 11 and a TCL 16, collectively shown as "A" in Figure 3, is unwound from a roll and conveyed through a vacuum coating step 60, which deposits an MCL directly onto the TCL layer 16. The metallized release liner including the carrier layer 11, the TCL 16, and the MCL 12, collectively shown as "B" in Figure 3, may be collected on a take-up roll 55.

[0044] According to some embodiments of the present invention, the protective coating may comprise a variety of materials. Non-limiting examples of protective coatings may include alkyd coatings, epoxy coatings, polyester coatings, acrylate coatings, polyurethane coatings, or combinations thereof. Additionally or alternatively, the protective coating may have an average thickness of about 5 to about 150 microns, such as at least about any of 5, 10, 15, 20, 25, 30, 40, 50, 60, 70, and 75 microns, and / or at most about any of 150, 125, 100, 90, 80, and 75 microns. Additionally or alternatively, the protective coating may have a basis weight of at least about 0.2 gsm, such as at least about any of 0.2, 0.4, 0.5, 0.75, 1, 1.5, and 2 gsm, and / or at most about any of 5, 4, 3.5, 3, 2.5, and 2 gsm.

[0045] According to some embodiments of the invention, the metallized material may also include a second adhesive layer, the second adhesive layer being located between the protective coating and the substrate and adhering the protective coating to the substrate, for example, directly adhering the second adhesive layer to the nonwoven. For example, the second adhesive layer may include a second discontinuous pattern, the second discontinuous pattern may include a second plurality of discrete adhesive islands surrounded by areas without adhesive. Alternatively, the second adhesive layer may include a second discontinuous pattern, the second discontinuous pattern including a second plurality of discrete islands that are free of adhesive and surrounded by areas of adhesive. According to some embodiments of the invention, the second discontinuous pattern may include a second plurality of independent and distinct adhesive lines, the second plurality of independent and distinct adhesive lines may be in a straight, arcuate, or zigzag form. Alternatively, the second adhesive layer may include a second continuous coating, the second continuous coating covering substantially all of the interface between the first nonwoven layer and the protective coating.

[0046] According to some embodiments of the present invention, the second adhesive layer may comprise a variety of adhesive materials, including, but not limited to, heat cured or crosslinked methacrylate adhesives, moisture cured reactive polyurethanes, moisture resistant pressure sensitive adhesives, acrylic hot melt adhesives, or combinations thereof. Additionally or alternatively, the second adhesive layer may have a basis weight of about 1 to about 10 gsm, such as at least about any of 1, 2, 3, 4, and 5 gsm, and / or at most about any of 10, 9, 8, 7, 6, and 5 gsm.

[0047] According to some embodiments of the invention, the protective layer may be directly between and adjacent to the MCL and the second adhesive layer, and the second adhesive layer may be directly between and adjacent to the protective layer and the substrate (e.g., the first nonwoven layer).

[0048] As discussed above, the MCL comprises a highly reflective metal or metal alloy. The highly reflective metal or metal alloy reflects at least about 80% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns), or, for example, reflects at least about 85%, or at least about 90%, or at least about 95% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns (e.g., at a wavelength of 12 microns)). According to some embodiments of the present invention, the highly reflective metal or metal alloy may comprise aluminum or an alloy thereof, gold or an alloy thereof, copper or an alloy thereof, silver or an alloy thereof, or any combination thereof. According to some embodiments of the invention, the MCL can have an average thickness of about 100 nm to about 1,000 nm, e.g., at least about any of 100, 200, 300, 400, and 500 nm, and / or at most about any of 1000, 900, 800, 700, 600, and 500 nm. Additionally or alternatively, the MCL is formed by a vacuum coating process, e.g., thermal evaporation, E-beam evaporation, sputtering, arc ion plating, plasma enhanced chemical vapor deposition, or atomic layer deposition.

[0049] According to some embodiments of the invention, the TCL is immediately adjacent to the MCL. The TCL may, for example, be at least 75% transmissive to electromagnetic radiation over all wavelengths from about 1 to about 20 microns (e.g., over all wavelengths from about 8 to about 15 microns, e.g., over all wavelengths from about 10 to about 14 microns (e.g., at a wavelength of 12 microns)). As discussed above, the TCL may comprise a cellulose acetate based material, a silicone based material, a fluoride based material, or a combination thereof.

[0050] According to some embodiments of the present invention, the metallized material has a moisture vapor transmission rate (MVTR) of at least about 25 g / m per 24 hours as measured by ASTM E96D. 2For example, at least about 25, 50, 75, 100, 125, 150, 175, and 200 g / m per 24 hours as measured by ASTM E96D. 2 and / or up to about 500, 450, 400, 350, 300, 275, 250, 225, and 200 g / m per 24 hours as measured by ASTM E96D. 2 Additionally or alternatively, the metallized material may have a hydrostatic head (HSH) of at least about 50 mbar as measured by AATCC 127 (60 mbar / min), such as at least about any of 50, 60, 75, 80, 100, and 125 mbar as measured by AATCC 127 (60 mbar / min), and / or at most about any of 200, 175, 150, and 125 mbar as measured by AATCC 127 (60 mbar / min). Additionally or alternatively, the metallized material may reflect at least about 80% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns or across all wavelengths from about 10 to about 13 microns (e.g., at a wavelength of 12 microns)), or, for example, may reflect at least about 85%, or at least about 90%, or at least about 95% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns or across all wavelengths from about 10 to about 13 microns (e.g., at a wavelength of 12 microns)).

[0051] According to some embodiments of the invention, the metallized material is non-conductive. As mentioned above, the TCL may define an outermost layer of the metallized material, the film layer (e.g., a first film layer) may define a second outermost layer of the metallized material, and the MCL constitutes at least one layer between the two outermost layers of the metallized material. For example, the metallized material may include a composite product including an MCL as described herein, directly or indirectly encapsulated between the TCL and a substrate or other optional intermediate layer. In this regard, the MCL is not directly exposed to the external environment. Thus, the MCL is shielded from the external environment, severely reducing or eliminating any electrical conductivity that may otherwise be associated with the MCL. The metallized material may be, for example, a non-conductive metallized material, since the MCL does not come into contact with the external environment. For example, the MCL is not an electrical hazard (e.g., in an operating room environment). According to some embodiments of the present invention, the metallization material has a conductivity of about 5.0×10 as measured by IST 40.1 (i.e., test method for surface resistivity, which is the inverse of surface conductivity). -11 S / m (i.e., electrical resistivity is approximately 1.0×10 9 Ω m), for example, about 4.0×10 -11 Less than S / m, or about 3.0×10 -11 Less than S / m, or about 2.0×10 -11 Less than S / m or about 1.0×10 -11 It is less than S / m.

[0052] In another aspect, the present invention provides a peelable metallized material, the peelable metallized material comprising a metallized material as described and disclosed herein and a removable carrier layer located directly adjacent to the TCL. For example, the carrier layer may be selectively removed or peeled away leaving the TCL. According to some embodiments of the present invention, the carrier layer may have an average thickness of about 25 to about 100 microns, e.g., at least about any of 25, 30, 40, and 50 microns, and / or at most about any of 100, 90, 80, 70, 60, and 50 microns. Additionally or alternatively, the carrier layer may comprise polyester, polyvinyl chloride, polypropylene, polyethylene, thermoplastic polyurethane, paper, or any combination thereof. As discussed above, the peelable metallized material may have a first adhesive strength between the carrier layer and the TCL and a second adhesive strength between the TCL and the MCL, the second adhesive strength being greater than the first adhesive strength. The carrier layer may then be removed (eg, peeled away) to leave the TCL adhered to the MCL, whereby the TCL defines one of the outermost layers of metallization material.

[0053] In another aspect, the present invention provides a method of making a peelable metallized material, the method comprising: (i) providing or forming a metal-containing intermediate material comprising: (a) a carrier layer; (b) a transparent coating layer (TCL) located immediately adjacent to the carrier layer; (c) a metal coating layer (MCL) located immediately adjacent to the TCL; and (d) an optional protective coating directly or indirectly adjacent to the MCL, wherein the MCL is located between the protective coating and the TCL; (ii) providing or forming a substrate comprising at least one nonwoven, at least one film, or a combination thereof; and (iii) adhering the metal-containing intermediate material to the substrate to provide a peelable metallized material, as disclosed and described herein.

[0054] According to some embodiments of the present invention, the method may include forming a metal-containing intermediate material, which may include (a) providing or forming a carrier layer, (b) depositing a TCL directly onto the carrier layer, (c) depositing an MCL directly onto the TCL, and (d) optionally depositing a protective coating directly or indirectly onto the MCL. FIG. 3 illustrates a method of forming a metal-containing intermediate material, as described above. Although FIG. 3 does not show the deposition of an optional protective coating, the protective coating may be applied to the MCL by roll coating, knife coating, die coating, spray coating, or printing. As described above, depositing the MCL directly onto the TCL may be performed by a vacuum coating method, such as thermal evaporation, E-beam evaporation, sputtering, arc ion plating, plasma enhanced chemical vapor deposition, or atomic layer deposition. Forming a substrate may include, for example, manufacturing a composite including a first nonwoven layer and a first film layer. According to some embodiments of the present invention, the step of producing the composite may include melt extruding the first film layer directly onto the first surface of the first nonwoven layer. Alternatively, the step of producing the composite may include adhesively bonding the first film layer to the first surface of the first nonwoven layer via a first adhesive layer, as described above. For example, the formation of the first adhesive layer may be performed by roll coating, knife coating, die coating, or spray coating.

[0055] According to some embodiments of the present invention, the step of adhering the metal-containing intermediate material to the substrate to provide a releasable metallized material may include adhesively adhering the metal-containing intermediate material directly to the substrate via a second adhesive layer, as described above. According to some embodiments of the present invention, for example, the second adhesive layer may be deposited on the substrate (e.g., directly on the first nonwoven layer) and then the substrate and the metal-containing intermediate material are laminated together, with the second adhesive layer being located between and adjacent the substrate and the MCL, or between and adjacent the substrate and the optional protective layer. According to some embodiments of the present invention, for example, the second adhesive layer may be deposited on the metal-containing intermediate material and then the substrate and the metal-containing intermediate material are laminated together, with the second adhesive layer being located between and adjacent the substrate and the MCL, or between and adjacent the substrate and the optional protective layer. According to some embodiments of the invention, the second adhesive layer is located between and adjacent the first nonwoven layer and the MCL or between and adjacent the first nonwoven layer and the optional protective layer.

[0056] According to some embodiments of the present invention, the substrate may include a first nonwoven layer, and the step of adhering the metal-containing intermediate material to the substrate may include adhesively adhering the first nonwoven layer directly to the MCL or to an optional protective layer via a second adhesive layer. The method may also include adhering a first film layer to the first nonwoven layer after the step of adhering the first nonwoven layer directly to the MCL or to an optional protective layer via a second adhesive layer. For example, adhering the first film layer to the first nonwoven layer may include melt extruding the first film layer directly onto the first surface of the first nonwoven layer. Alternatively, adhering the first film layer to the first nonwoven layer may include adhesively adhering the first film layer to the first surface of the first nonwoven via a first adhesive layer, as described above.

[0057] FIG 4A illustrates a process for forming a composite as a substrate for use in metallization materials, according to some embodiments of the present invention. As shown in FIG 4A, a first nonwoven layer 20 is unwound from a roll and conveyed through a first adhesive application station 32, where a first adhesive 31 is deposited on the first nonwoven layer. After the first adhesive 31 is deposited on the first nonwoven layer 20, the adhesive-coated first nonwoven layer is adhesively laminated to a first film layer 30 (e.g., a breathable film layer) in step 34, and then undergoes a drying and / or cooling step 36 before being collected into a composite roll 37. In this regard, FIG 4A illustrates an exemplary embodiment in which a first nonwoven layer and a first film layer are adhesively bonded together. Although FIG. 4A shows a step of applying an adhesive to the first nonwoven layer before laminating / bonding it to the first film layer, the adhesive may alternatively be coated onto or onto the first film layer before laminating / bonding it to the first nonwoven layer.

[0058] Figure 4B illustrates another process for forming a composite as a substrate for use in metallized materials, according to some embodiments of the present invention. As shown in Figure 4A, a first nonwoven layer 20 is unwound from a roll and a first film layer 25 is melt extruded directly onto the unwound first nonwoven layer 20. The newly formed composite may then undergo a drying and / or cooling step 26 and be collected onto a composite roll 38.

[0059] 5A, the composite roll 37 or 38 may be unwound and the composite conveyed through a second adhesive station 22 where a second adhesive 21 is deposited on the first nonwoven layer of the composite, followed by a heating step 23. The heating step 23 may result in the second adhesive being cured or cured, after which the adhesive coated composite is laminated / bonded to a metal-containing intermediate material 55 in step 24, followed by a drying and / or cooling step 27 to provide a peelable metallized material.

[0060] 5B, the metal-containing intermediate material 55 may be unwound and conveyed through a third adhesive station 65 where a second adhesive is deposited on the metal-containing intermediate material's protective coating (if present) or MCL (if no protective coating is present) followed by curing or curing of the second adhesive in a heating step 70. The adhesive-coated metal-containing intermediate material may then be laminated / bonded to composite 37 or 38 followed by a drying and / or cooling step 80 to provide a peelable metallized material.

[0061] In yet another aspect, the present invention provides a method of manufacturing a metallized material, the method comprising: (i) providing a peelable metallized material as described and disclosed herein, or forming a peelable metallized material by a method as described and disclosed herein, and (ii) removing a carrier layer to provide a metallized material as described and disclosed herein. For example, the method may include removing the carrier layer by a delamination process, where the carrier layer is separated from the TCL, the TCL defining an outermost layer of the metallized material.

[0062] For example, Figure 5A illustrates a delamination step 28 in which the carrier layer is separated and collected on carrier roll 11 and the remaining metallization material 1 is collected on another roll. Similarly, Figure 5B illustrates a delamination step 85 in which the carrier layer is separated and collected on carrier roll 11 and the remaining metallization material 1 is collected on another roll.

[0063] Working Example

[0064] The present disclosure is further illustrated by the following examples, which should not be construed as limiting in any way, i.e., the specific features described in the following examples are merely illustrative rather than limiting.

[0065] Example 1

[0066] raw materials:

[0067] A 25 micron release liner comprising a clear PET carrier layer with a gloss type cellulose acetate clear coating layer (TCL) as the release coating. The metal utilized in forming the MCL was 99.80% pure aluminum wire. The protective coating was formed from an acrylate based material. A composite substrate was used in which the nonwoven layer was a 9gsm SMS nonwoven bonded to a 12gsm breathable polyethylene film layer with an acrylic hot melt adhesive. The SMS nonwoven was bonded to the protective coating with a cross-linked methacrylate adhesive.

[0068] process:

[0069] A 5,000 Å aluminum MCL was formed on top of the cellulose acetate-based TCL and deposited on a PET carrier layer with a roll-to-roll thermal evaporator. A 2 gsm acrylate-based protective coating was coated onto the MCL by roll coating. A 9 gsm nonwoven layer was then adhered to a 12 gsm breathable PE film with a spray coating of 2 gsm acrylic hot melt adhesive. A 4 gsm layer of cross-linked methacrylate adhesive was coated onto the nonwoven side of the nonwoven-film composite formed above by roll coating. The protective coating covering the MCL was then laminated / adhered to the SMS nonwoven web with the cross-linked methacrylate adhesive and they were bonded together by pressing and curing. Finally, the carrier layer was removed by a delamination process; that is, the carrier layer (i.e., PET) was wound onto a first spool and the resulting metallized material was wound onto a second roll. Test results for this metallized material are summarized in Table 1. Figure 6 is an image of the resulting metallized material, with the MCL visible through the TCL. [Table 1]

[0070] Example 2

[0071] raw materials:

[0072] A 30 micron release liner comprising a clear PVC carrier layer with a matte type cellulose acetate clear coating layer (TCL) as the release coating. The metal utilized in forming the MCL was 99.80% pure aluminum wire. The protective coating was formed from an acrylate based material. A composite substrate was used in which the nonwoven layer was a 9 gsm SMS nonwoven bonded to a 12 gsm breathable thermoplastic elastomer (TPE) film layer with an acrylic hot melt adhesive. The SMS nonwoven was bonded to the protective coating with a cross-linked methacrylate adhesive.

[0073] process:

[0074] A 6,000 Å aluminum MCL was formed on top of the cellulose acetate-based TCL and deposited on a PET carrier layer with a roll-to-roll thermal evaporator. A 2 gsm acrylate-based protective coating was coated onto the MCL by spray coating. A 9 gsm nonwoven layer was then adhered to a 12 gsm breathable TPE film with a 2 gsm spray coating of acrylic hot melt adhesive. A 3 gsm layer of cross-linked methacrylate adhesive was roll coated onto the nonwoven side of the nonwoven-film composite formed above. The protective coating covering the MCL was then laminated / adhered to the SMS nonwoven web with the cross-linked methacrylate adhesive and bonded together by pressing and curing. Finally, the carrier layer was removed by a delamination process; that is, the carrier layer (i.e., PET) was wound onto a first spool and the resulting metallized material was wound onto a second roll. Test results for this metallized material are summarized in Table 2. FIG. 7 shows an image of the resulting metallized material, with the MCL visible through the TCL. [Table 2]

[0075] Example 3

[0076] raw materials:

[0077] A 75 micron release liner comprising a paper carrier layer with a matte type silicone based clear coating layer (TCL) as the release coating. The metal utilized in forming the MCL was 99.80% pure aluminum wire. The protective coating was formed from an acrylate based material. A composite substrate was used in which the nonwoven layer was a 9 gsm SMS nonwoven with a melt extrusion of a 12 gsm cast PE film layer onto the 9 gsm SMS nonwoven. The SMS nonwoven was adhered to the protective coating with a cross-linked methacrylate adhesive.

[0078] process:

[0079] A 4,000 Å aluminum MCL was formed on top of the silicone-based TCL and deposited on a paper carrier layer in a roll-to-roll thermal evaporator. A 1 gsm acrylate-based protective coating was coated onto the MCL by roll coating. A 12 gsm PE film was then melt extruded directly onto the 9 gsm nonwoven. A 5 gsm layer of cross-linked methacrylate adhesive was roll-coated onto the nonwoven side of the nonwoven-film composite formed above. The protective coating covering the MCL was then laminated / bonded to the SMS nonwoven web with a cross-linked methacrylate adhesive, and they were bonded together by pressing and curing. Finally, the carrier layer was removed by a delamination process; that is, the carrier layer (i.e., paper) was wound onto a first spool and the resulting metallized material was wound onto a second roll. Test results for this metallized material are summarized in Table 3. Figure 8 is an image of the resulting metallized material, with the MCL visible through the TCL.

[0080] [Table 3]

[0081] Non-Limiting Exemplary Embodiments

[0082] The following exemplary embodiments are for purposes of illustration only and emphasize that the features described in this application may be interchanged in various manners or configurations.

[0083] Example 1. A metallized material comprising: (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL), wherein the MCL is located directly or indirectly between the substrate and the TCL.

[0084] Example 2. The metallized material of example 1, wherein the substrate comprises a composite comprising a first nonwoven layer and a first film layer.

[0085] Example 3. The metallized material of Example 2, wherein the composite comprises a first film layer melt extruded directly onto a first nonwoven layer.

[0086] Example 4. The metallized material of example 2, wherein the composite further comprises a first adhesive layer located between the first nonwoven layer and the first film layer and adhering the first nonwoven layer to the first film layer.

[0087] Example 5. 5. The metallized material of example 4, wherein the first adhesive layer comprises a first discontinuous pattern, the first discontinuous pattern comprising a first plurality of discrete adhesive islands surrounded by areas without adhesive.

[0088] Example 6. 5. The metallized material of example 4, wherein the first adhesive layer comprises a first discontinuous pattern, the first discontinuous pattern comprising a first plurality of discrete islands that are free of adhesive and surrounded by areas of adhesive.

[0089] Example 7. The metallized material of example 4, wherein the first adhesive layer comprises a first discontinuous pattern, the first discontinuous pattern comprising a first plurality of independent and distinct adhesive lines, the first plurality of independent and distinct adhesive lines may be in a straight, arcuate, or zigzag form.

[0090] Example 8. The metallized material of example 4, wherein the first adhesive layer comprises a first continuous coating, the first continuous coating covering substantially all of the interface between the first nonwoven layer and the first film layer.

[0091] Example 9. The metallized material of Examples 4-8, wherein the first adhesive layer has a basis weight of about 0.2 to about 5 gsm, e.g., at least about any of 0.25, 0.5, 0.75, 1, 1.5, 2, and 2.5 gsm, and / or at most about any of 5, 4, 3, and 2.5 gsm.

[0092] Example 10. The metallized material of any one of Examples 4-9, wherein the first adhesive layer comprises a moisture resistant pressure sensitive adhesive, an acrylic hot melt adhesive, or a combination thereof.

[0093] Example 11. The metallized material of examples 1-10, wherein the nonwoven fabric comprises one or more spunbond layers, one or more meltblown layers, one or more needlepunched layers, one or more hydroentangled layers, one or more carded layers, one or more submicron layers, or any combination thereof.

[0094] Example 12. The metallized material of example 11, wherein the nonwoven comprises a spunbond-meltblown-spunbond structure.

[0095] Example 13. The metallized material of Examples 11-12, wherein the nonwoven fabric has a basis weight of about 5 to about 500 gsm, e.g., at least about any of 5, 6, 8, 10, 12, 15, 25, 50, 75, 100, 150, 200, and 250 gsm, and / or at most about any of 500, 450, 400, 350, 300, and 250 gsm.

[0096] Example 14. The metallized material of any one of claims 11 to 13, wherein the nonwoven fabric comprises a synthetic polymer, for example, one or more polyolefins, one or more polyesters, one or more polyamides, or any combination thereof.

[0097] Example 15. 15. The metallized material of any one of claims 11 to 14, wherein the nonwoven fabric comprises a natural cellulosic material, a synthetic cellulosic material, or any combination thereof.

[0098] Example 16. The metallized material of any one of Examples 1 to 15, wherein the film comprises a single layer microporous film or a single layer monolithic film.

[0099] Example 17. The metallized material of any one of Examples 1-15, wherein the film comprises a multilayer film comprising one or more microporous films and / or one or more monolithic films.

[0100] Example 18. The metallized material of Examples 1-17, wherein the film has an average thickness of about 5 to about 150 microns, e.g., at least about any of 5, 10, 15, 20, 25, 30, 40, 50, 60, 70, and 75 microns, and / or at most about any of 150, 125, 100, 90, 80, and 75 microns.

[0101] Example 19. The film has a moisture vapor transmission rate (MVTR) of at least about 25 g / m per 24 hours as measured by ASTM E96D. 2For example, at least about 25, 50, 75, 100, 125, 150, 175, and 200 g / m per 24 hours as measured by ASTM E96D. 2 and / or a maximum of about 500, 450, 400, 350, 300, 275, 250, 225, and 200 g / m per 24 hours as measured by ASTM E96D. 2 The metallized material according to any one of Examples 1 to 18.

[0102] Example 20. The metallized material of Examples 1-19, wherein the film has a hydrostatic head (HSH) of at least about 50 mbar as measured by AATCC 127 (60 mbar / min), e.g., at least about any of 50, 60, 75, 80, 100, and 125 mbar as measured by AATCC 127 (60 mbar / min), and / or at most about any of 200, 175, 150, and 125 mbar as measured by AATCC 127 (60 mbar / min).

[0103] Example 21. The metallized material of any one of Examples 1-20, wherein the film comprises a synthetic polymer (e.g., one or more polyolefins, one or more polyesters, or a combination thereof) and / or one or more biopolymers (e.g., one or more polylactic acids).

[0104] Example 22. The metallized material of examples 1-21, further comprising a protective coating positioned between the MCL and the substrate.

[0105] Example 23. 23. The metallized material of example embodiment 22, wherein the protective coating comprises an alkyd coating, an epoxy coating, a polyester coating, an acrylate coating, a polyurethane coating, or a combination thereof.

[0106] Example 24. The metallized material of Examples 22-23, wherein the protective coating has an average thickness of about 5 to about 150 microns, e.g., at least about any of 5, 10, 15, 20, 25, 30, 40, 50, 60, 70, and 75 microns, and / or at most about any of 150, 125, 100, 90, 80, and 75 microns.

[0107] Example 25. The metallized material of Examples 22-24, wherein the protective coating has a basis weight of at least about 0.2 gsm, e.g., at least any of about 0.2, 0.4, 0.5, 0.75, 1, 1.5, and 2 gsm, and / or at most any of about 5, 4, 3.5, 3, 2.5, and 2 gsm.

[0108] Example 26. The metallized material of Examples 22-25, further comprising a second adhesive layer, the second adhesive layer being located between the protective coating and the substrate and adhering the protective coating to the substrate, e.g., directly to the nonwoven fabric with the second adhesive layer.

[0109] Example 27. The metallized material of any one of Examples 22-26, wherein the second adhesive layer comprises a second discontinuous pattern, the second discontinuous pattern comprising a second plurality of discrete adhesive islands surrounded by areas without adhesive.

[0110] Example 28. The metallized material of any one of Examples 22-26, wherein the second adhesive layer includes a second discontinuous pattern, the second discontinuous pattern including a second plurality of discrete islands that are free of adhesive and surrounded by areas of adhesive.

[0111] Example 29. The metallized material of Examples 22-26, wherein the second adhesive layer comprises a second discontinuous pattern, the second discontinuous pattern comprises a second plurality of independent and distinct adhesive lines, and the second plurality of independent and distinct adhesive lines may be in a straight, arcuate, or zigzag form.

[0112] Example 30. The metallized material of Examples 22-26, wherein the second adhesive layer comprises a second continuous coating, the second continuous coating covering substantially all of the interface between the first nonwoven layer and the protective coating.

[0113] Example 31. The metallized material of Examples 22-30, wherein the second adhesive layer comprises a heat cured or crosslinked methacrylate adhesive, a moisture cured reactive polyurethane, a moisture resistant pressure sensitive adhesive, an acrylic hot melt adhesive, or a combination thereof, and the second adhesive layer has a basis weight of about 1 to about 10 gsm, e.g., at least about any of 1, 2, 3, 4, and 5 gsm, and / or at most about any of 10, 9, 8, 7, 6, and 5 gsm.

[0114] Example 32. The metallized material of Example 31, wherein the protective layer is directly between and adjacent to the MCL and the second adhesive layer, and the second adhesive layer is directly between and adjacent to the protective layer and the substrate.

[0115] Example 33. The metallized material of any one of claims 1-32, wherein the MCL comprises a highly reflective metal or a highly reflective metal alloy.

[0116] Example 34. The highly reflective metal or metal alloy reflects at least about 80% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns), or, for example, at least about 85%, or at least about 90%, or at least about 95% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns).

[0117] Example 35. 35. The metallized material of embodiment 33-34, wherein the highly reflective metal or highly reflective metal alloy comprises aluminum or an alloy thereof, gold or an alloy thereof, copper or an alloy thereof, silver or an alloy thereof, or any combination thereof.

[0118] Example 36. The metallized material of Examples 33-35, wherein the MCL has an average thickness of about 100 nm to about 1,000 nm, e.g., at least about any of 100, 200, 300, 400, and 500 nm and / or at most about any of 1000, 900, 800, 700, 600, and 500 nm.

[0119] Example 37. The metallized material of Examples 33-35, wherein the MCL is formed by a vacuum coating method, for example, thermal evaporation, E-beam evaporation, sputtering, arc ion plating, plasma enhanced chemical vapor deposition, or atomic layer deposition.

[0120] Example 38. The metallized material of Examples 1-37, wherein the TCL is directly adjacent to the MCL.

[0121] Example 39. The metallized material of Examples 1-38, wherein the TCL has a transmittance of at least 75%, e.g., at least 80%, 85%, 90%, 95%, or 99%, to electromagnetic radiation over all wavelengths from about 1 to about 20 microns (e.g., over all wavelengths from about 8 to about 15 microns, e.g., over all wavelengths from about 10 to about 14 microns).

[0122] Example 40. The metallized material of any one of Examples 1-39, wherein the TCL comprises a cellulose acetate-based material, a silicone-based material, a fluoride-based material, or a combination thereof.

[0123] Example 41. The metallized material of any one of Examples 1 to 40, wherein the TCL comprises a glossy type finish, a matte type finish, or a non-glossy type finish.

[0124] Example 42. The metallized material has a moisture vapor transmission rate (MVTR) of at least about 25 g / m per 24 hours as measured by ASTM E96D. 2 For example, at least about 25, 50, 75, 100, 125, 150, 175, and 200 g / m per 24 hours as measured by ASTM E96D. 2 and / or a maximum of about 500, 450, 400, 350, 300, 275, 250, 225, and 200 g / m per 24 hours as measured by ASTM E96D. 2 The metallized material according to any one of Examples 1 to 41.

[0125] Example 43. The metallized material of any one of Examples 1-42, wherein the metallized material has a hydrostatic head (HSH) of at least about 50 mbar as measured by AATCC 127 (60 mbar / min), e.g., at least about any of 50, 60, 75, 80, 100, and 125 mbar as measured by AATCC 127 (60 mbar / min), and / or at most about any of 200, 175, 150, and 125 mbar as measured by AATCC 127 (60 mbar / min).

[0126] Example 44. The metallized material of Examples 1-43, wherein the metallized material reflects at least about 80% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns or from about 10 to about 13 microns), or, for example, at least about 85%, or at least about 90%, or at least about 95% of electromagnetic radiation across all wavelengths from about 1 to about 20 microns (e.g., across all wavelengths from about 8 to about 15 microns or from about 10 to about 13 microns).

[0127] Example 45. The metallized material of any one of Examples 1 to 44, wherein the metallized material is non-conductive.

[0128] Example 46. The metallized material has a conductivity of approximately 5.0 x 10 -11 The metallized material of Examples 1-44, wherein the .DELTA..times ...

[0129] Example 47. A peelable metallized material comprising: (i) a metallized material according to any one of Examples 1-46; and (ii) a carrier layer located immediately adjacent to a TCL.

[0130] Example 48. The strippable metallized material of Example 47, wherein the carrier layer has an average thickness of about 25 to about 100 microns, e.g., at least about any of 25, 30, 40, and 50 microns, and / or at most about any of 100, 90, 80, 70, 60, and 50 microns.

[0131] Example 49. 49. The peelable metallized material of any one of Examples 47-48, wherein the carrier layer comprises polyester, polyvinyl chloride, polypropylene, polyethylene, thermoplastic polyurethane, paper, or any combination thereof.

[0132] Example 50. The peelable metallized material of Examples 47-49, further comprising a first adhesion strength between the carrier layer and the TCL, and a second adhesion strength between the TCL and the MCL, the second adhesion strength being greater than the first adhesion strength.

[0133] Example 51. 50. A method of manufacturing a peelable metallized material, comprising: (i) providing or forming a metal-containing intermediate material comprising: (a) a carrier layer; (b) a transparent coating layer (TCL) located immediately adjacent to the carrier layer; (c) a metal coating layer (MCL) located immediately adjacent to the TCL; and (d) an optional protective coating directly or indirectly adjacent to the MCL, wherein the MCL is located between the protective coating and the TCL; (ii) providing or forming a substrate comprising at least one nonwoven, at least one film, or a combination thereof; and (iii) adhering the metal-containing intermediate material to the substrate to provide a peelable metallized material according to any of Examples 47-50.

[0134] Example 52. The method of Example 51, wherein the step of forming the metal-containing intermediate material includes the steps of: (a) providing or forming a carrier layer; (b) depositing a transparent coating layer (TCL) directly onto the carrier layer; (c) depositing a metal coating layer (MCL) directly onto the TCL; and (d) optionally, depositing a protective coating directly or indirectly onto the MCL.

[0135] Example 53. The method of any one of Examples 51-52, wherein forming the substrate comprises producing a composite comprising a first nonwoven layer and a first film layer.

[0136] Example 54. 54. The method of example 53, wherein the step of producing the composite comprises melt extruding the first film layer directly onto the first surface of the first nonwoven layer.

[0137] Example 55. 54. The method of example 53, wherein the step of producing a composite includes the step of adhesively adhering a first film layer to a first surface of the first nonwoven via a first adhesive layer.

[0138] Example 56. The method of any one of Examples 51 to 55, wherein adhering the metal-containing intermediate material to the substrate to provide a releasable metallized material comprises adhesively adhering the metal-containing intermediate material directly to the substrate via a second adhesive layer.

[0139] Example 57. The method of example 56, wherein a second adhesive layer is deposited on the substrate and then the substrate and metal-containing intermediate material are laminated together, the second adhesive layer being located between and adjacent the substrate and the MCL or between and adjacent the substrate and the optional protective layer.

[0140] Example 58. 57. The method of example 56, wherein a second adhesive layer is deposited on the metal-containing intermediate material and then the substrate and metal-containing intermediate material are laminated together, the second adhesive layer being located between and adjacent the substrate and the MCL or between and adjacent the substrate and the optional protective layer.

[0141] Example 59. The method of examples 57-58, wherein the second adhesive layer is positioned between and adjacent the first nonwoven layer and the MCL, or between and adjacent the first nonwoven layer and the optional protective layer.

[0142] Example 60. 53. The method of claim 51-52, wherein the substrate comprises a first nonwoven layer, and wherein adhering the metal-containing intermediate material to the substrate comprises adhesively adhering the first nonwoven layer directly to the MCL or adhesively adhering to an optional protective layer via a second adhesive layer.

[0143] Example 61. The method of example 60, further comprising adhering a first film layer to the first nonwoven layer after adhering the first nonwoven layer directly or to the optional protective layer via a second adhesive layer to the MCL.

[0144] Example 62. 62. The method of example 61, wherein adhering the first film layer to the first nonwoven layer comprises melt extruding the first film layer directly onto the first surface of the first nonwoven layer.

[0145] Example 63. 62. The method of example 61, wherein the step of adhering the first film layer to the first nonwoven layer comprises adhesively adhering the first film layer to the first surface of the first nonwoven layer via a first adhesive layer.

[0146] Example 64. A method for producing a metallized material, comprising: (i) providing a peelable metallized material according to any of Examples 47-50 or forming a peelable metallized material according to any of Examples 51-63; and (ii) removing the carrier layer according to any of Examples 1-63 to provide a metallized material.

[0147] Example 65. 65. The method of example 64, wherein removing the carrier layer comprises a delamination process, wherein the carrier layer is separated from the TCL, the TCL defining an outermost layer of metallization material.

[0148] These and other modifications and variations to the present invention may be implemented by those skilled in the art without departing from the spirit and scope of the present invention, which is more particularly set forth in the appended claims. Moreover, it will be understood that aspects of the various embodiments may be interchanged in whole or in part. Moreover, those skilled in the art will appreciate that the above description is merely illustrative and is not intended to limit the invention, as further set forth in such appended claims. Thus, the spirit and scope of the appended claims should not be limited to the exemplary description of the forms contained herein.

Claims

1. (i) a substrate comprising a nonwoven fabric, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL) that is transparent to electromagnetic radiation associated with mammals; and wherein the MCL is located directly or indirectly between the substrate and the TCL; (a) the metallized material has a moisture vapor transmission rate (MVTR) of 25 g / m 2 to 500 g / m 2 per 24 hours as measured by ASTM E96D; (b) the TCL defines a first outer layer of the metallized material and the substrate defines a second outer layer of the metallized material; Metallized materials.

2. The metallized material of claim 1 , wherein the substrate comprises a composite including a first nonwoven layer and a first film layer.

3. The metallized material of claim 2 , wherein the composite comprises the first film layer disposed directly on the first nonwoven layer.

4. 3. The metallized material of claim 2, wherein the composite further comprises a first adhesive layer positioned between the first nonwoven layer and the first film layer to bond the first nonwoven layer and the first film layer, the first adhesive layer having a basis weight of 0.2 to 5 gsm.

5. 3. The metallized material of claim 2, wherein the first film layer comprises (i) a single layer microporous film or a single layer monolithic film, or (ii) a multilayer film comprising one or more microporous films and / or one or more monolithic films.

6. The metallized material of claim 1 further comprising a protective coating positioned between the MCL and the substrate.

7. 7. The metallized material of claim 6, further comprising a second adhesive layer positioned between the protective coating and the substrate to adhere the protective coating to the substrate, e.g., directly to the nonwoven fabric.

8. The metallization material of claim 1 , wherein the MCL comprises a highly reflective metal or a highly reflective metal alloy.

9. The metallization material has a conductivity of 5.0×10 -11 10. The metallized material of claim 1, wherein the tensile strength is less than S / m.

10. (i) the metallized material of claim 1; (ii) a carrier layer located directly adjacent to the TCL, a first adhesive strength between the carrier layer and the TCL, and a second adhesive strength between the TCL and the MCL, the second adhesive strength being greater than the first adhesive strength; Peelable metallized material.

11. 11. The strippable metallized material of claim 10, wherein the carrier layer has an average thickness of 25 to 100 microns, for example, at least any of 25, 30, 40, and 50 microns, and / or at most any of 100, 90, 80, 70, 60, and 50 microns.

12. 1. A method for producing a peelable metallized material, comprising: (i) providing or forming a metal-containing intermediate material, the metal-containing intermediate material including: (a) a carrier layer; (b) a transparent coating layer (TCL) located immediately adjacent to the carrier layer; (c) a metal coating layer (MCL) located immediately adjacent to the TCL; and (d) an optional protective coating located directly or indirectly adjacent to the MCL, the MCL being located between the protective coating and the TCL; (ii) providing or forming a substrate comprising at least one nonwoven fabric, at least one film, or a combination thereof; (iii) adhering the metal-containing intermediate material to the substrate to provide the releasable metallized material; Upon removal of the carrier layer, (a) the metallized material has a moisture vapor transmission rate (MVTR) of 25 g / m 2 to 500 g / m 2 per 24 hours as measured by ASTM E96D; and (b) the TCL defines a first outer layer of the metallized material and the substrate defines a second outer layer of the metallized material. method.

13. 13. The method of claim 12, wherein the step of forming the metal-containing intermediate material comprises: (a) providing or forming a carrier layer; (b) depositing a transparent coating layer (TCL) directly onto the carrier layer; (c) depositing a metallic coating layer (MCL) directly onto the TCL; and (d) optionally depositing a protective coating directly or indirectly onto the MCL.

14. 1. A method for producing a metallized material, comprising: (i) providing a strippable metallized material according to any one of claims 10; (ii) removing the carrier layer to provide a metallized material; A method comprising:

15. 15. The method of claim 14, wherein the step of removing the carrier layer comprises a delamination process, wherein the carrier layer is separated from the TCL, the TCL defining the outermost layer of the metallization material.

16. The metallized material of claim 1, wherein the TCL is at least 75% transparent to electromagnetic radiation across all wavelengths from 8 to 15 microns.

17. The metallized material of claim 1, wherein the TCL is at least 75% transparent to electromagnetic radiation across all wavelengths from 10 to 14 microns.

18. The metallized material of claim 1, wherein the TLC is at least 75% transparent to electromagnetic radiation over the entire wavelength range of 12 microns.

19. The metallized material of claim 1, wherein the TCL comprises a cellulose acetate-based material.

20. The metallized material of claim 1, wherein the TCL comprises a silicon-based material.

21. The metallized material of claim 1, wherein the MCL is located adjacent to and between the TCL and the substrate.