Multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage and related manufacturing methods - Patents.com

Abstract

A multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage, and an associated antenna module manufacturing method. The multi-sided antenna module includes an integrated circuit (IC) die(s) disposed on a first side of the package substrate. The multi-sided antenna module further includes a first substrate antenna layer and a second substrate antenna layer disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes a first antenna(s) disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes a second antenna(s) disposed on a second side of the package substrate opposite the first side of the package substrate. In this manner, the multi-sided antenna module including antennas on multiple sides of the package substrate provides antenna coverage extending from both sides of the package substrate to provide coverage in multiple directions.

Description

[Technical field]

[0001] Priority Application This application claims priority to U.S. patent application Ser. No. 17 / 474,524, filed Sep. 14, 2021, entitled "MULTI-SIDED ANTENNA MODULE EMPLOYING ANTENNAS ON MULTIPLE SIDES OF A PACKAGE SUBSTRATE FOR ENHANCED ANTENNA COVERAGE, AND RELATED FABRICATION METHODS," which is incorporated by reference herein in its entirety. [Background technology]

[0002] I. Field of Disclosure The field of the disclosure relates to antenna modules (also called "antenna-in-package" (AiP)) that integrate an antenna with an integrated circuit (IC) package to integrate a radio-frequency (RF) chip(s) with the antenna(s).

[0003] II. Background Modern smartphones and other portable devices have expanded the use of different wireless links using various technologies in different radio frequency bands. For example, fifth generation (5G) cellular networks, commonly referred to as 5G new radio (NR), include frequencies in the range of 24.25 gigahertz (GHz) to 86 gigahertz (GHz), with the lower 19.25 GHz (24.25 GHz to 43.5 GHz) often used for mobile devices. This frequency spectrum for 5G communications is in the millimeter wave (mmWave) or millimeter band range. mmWave allows for higher data rates than lower frequencies, such as those used for Wi-Fi and current cellular networks.

[0004] Radio frequency (RF) transceivers supporting the mmWave spectrum are incorporated into mobile devices and other portable devices designed to support mmWave communication signals. To support the integration of RF transceivers in devices, the RF transceivers may be integrated into an RF integrated circuit (IC) (RFIC) transceiver chip ("RFIC chip") provided as part of an IC package, also referred to as an RFIC package. A conventional RFIC package includes one or more RFIC chips, a power management IC (PMIC), and passive electrical components (e.g., inductors, capacitors, etc.) mounted on one side of a package substrate as a support structure. The package substrate supports the metallization structure and provides inter-chip and external signal interfaces to the RFIC chip(s). The RFIC package may be provided as an antenna module when it is desired to integrate one or more antennas in the same package as the RFIC chip(s). This is also referred to as "antenna-in-package" (AiP). In an antenna module, one or more antennas capable of receiving and radiating electrical RF signals as electromagnetic (EM) signals are integrated directly into an IC package. The antenna module may include multiple antennas, also referred to as antenna arrays, to provide signal coverage in a larger desired area around the IC package. The antenna elements may be mounted to a package substrate of the IC package and electrically coupled to the RFIC chip(s) in the antenna module via one or more metallization structures in the package substrate. For example, the RFIC chip(s) may be mounted on a first planar surface on a first, upper side of the package substrate of the antenna module, and the antenna array may be mounted on a second planar surface on a second, lower side of the package substrate opposite the first side to provide a planar antenna module. The antenna radiation pattern extends out of the second planar surface in a direction perpendicular to the second planar surface to provide directional antenna coverage.To provide antenna coverage in multiple directions, multiple antenna modules may be provided at different physical locations on an RF device, such as a mobile phone. Summary of the Invention

[0005] The embodiments disclosed in the detailed description include a multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage. A related method of manufacturing the antenna module is also disclosed. The antenna module includes a layer including one or more integrated circuit (IC) dies (e.g., radio frequency (RF) IC (RFIC) dies) disposed on a first side of the package substrate. The package substrate provides mounting support for the IC dies and also includes one or more metallization layers including metal interconnects to provide an electrical interface for signal routing to the IC dies. In an exemplary embodiment, to include additional directions of antenna coverage in the multi-sided antenna module, the multi-sided antenna module further includes a first substrate antenna and a second substrate antenna layer disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes one or more first antennas disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes one or more second antennas disposed on a second side of the package substrate opposite the first side of the package substrate. The first and second antennas of the respective first and second substrate antenna layers are electrically coupled to the IC die(s) via metal interconnects of the metallization layer(s) of the package substrate. The first antenna(s) of the first substrate antenna layer have an antenna radiation pattern extending in a first direction out of a first side of the package substrate. For example, the first antenna(s) may include patch antenna(s) oriented parallel to a first surface of the first side of the package substrate to provide an antenna radiation pattern extending out of and away from the first side of the package substrate in a direction perpendicular to the package substrate. The second antenna(s) of the second substrate antenna layer have an antenna radiation pattern extending out of and away from the second side of the package substrate in a second direction.For example, the second antenna(s) may include a patch antenna(s) oriented parallel to the second surface of the second side of the package substrate to provide an antenna radiation pattern that extends out and away from the second side of the package substrate in a direction perpendicular to the package substrate.

[0006] In this manner, a multi-sided antenna module including antennas on multiple sides of a package substrate provides antenna coverage extending from both sides of the package substrate to provide antenna coverage in multiple directions. By providing a multi-sided antenna module employing antennas on multiple sides of a package substrate, additional antenna coverage directions for an RF device incorporating the multi-sided antenna module can be achieved with fewer antenna modules than would be required if such antenna module had antenna coverage in a single direction. Because each multi-sided antenna module includes an IC die(s), employing a multi-sided antenna module can reduce the number of IC dies employed in an RF device to achieve the desired multi-directional antenna coverage, for reduced cost and reduced area required in the RF device for such antenna modules.

[0007] In another exemplary aspect, interference between the IC die and a first substrate antenna layer on a first side of the package substrate can be mitigated by an RF shield disposed between the IC die and the first substrate antenna layer. For example, the first substrate antenna layer can be mounted to a layer surface(s) disposed above the RF shield on the first side of the package substrate.

[0008] There are different exemplary aspects in which the first antenna(s) disposed on the first side of the package substrate of the multi-sided antenna module can be electrically coupled to the package substrate for electrical connectivity to the IC die(s). In one exemplary aspect, the first antenna(s) is coupled to a layer stack disposed on an RF shield for the IC die(s). The layer stack includes a metal layer (e.g., a copper layer) that extends on a surface of the RF shield, down a sidewall of a package mold formed on the IC die(s), and down to a metal pad on a first surface of the first side of the package substrate. The metal pad is electrically coupled to a metal interconnect of an upper metallization layer adjacent to the first surface of the first side of the package substrate, and the metal interconnect is electrically coupled to the RFIC die(s). In another exemplary embodiment, a vertical channel is formed in the package mold adjacent a side of the IC die(s) to couple the first antenna(s) to the package substrate for electrical connectivity to the IC die(s). The vertical channel extends downward to a first surface of the package substrate. An RF shield can be placed on top of the package mold after the vertical channel is formed such that the RF shield is disposed around the package mold surrounding the RFIC die(s). A metal interconnect is formed in the vertical channel and electrically coupled to a metal interconnect of a top metallization layer adjacent a first surface of the first side of the package substrate, the metal interconnect being electrically coupled to the RFIC die(s). The first antenna(s) is mounted above the vertical channel and extends between the top surfaces of both sides of the vertical channel(s) of the package mold. The first antenna(s) is electrically coupled to the metal interconnect formed in the vertical channel.

[0009] In this regard, in one exemplary aspect, an antenna module is provided. The antenna module includes a package substrate having a first side and a second side opposite the first side. The antenna module also includes a first substrate antenna layer disposed on the first side of the package substrate and including one or more first antennas. The antenna module also includes a first layer including one or more IC dies. The first layer is disposed on the first side of the package substrate between the package substrate and the first substrate antenna layer. The antenna module also includes a second substrate antenna layer disposed on the second side of the package substrate and including one or more second antennas.

[0010] In another exemplary aspect, a method of manufacturing an antenna module is provided. The method includes providing a package substrate having a first surface on a first side and a second surface on a second side opposite the first side. The method also includes disposing a second substrate antenna layer comprising one or more second antennas adjacent to the second surface on the second side of the package substrate. The method also includes disposing a first layer comprising one or more integrated circuit (IC) dies adjacent to the first surface on the first side of the package substrate. The method also includes disposing a first substrate antenna layer comprising one or more first antennas adjacent to the first layer such that the first layer is disposed between the first substrate antenna layer and the package substrate on the first side of the package substrate. [Brief description of the drawings]

[0011] [Figure 1A] FIG. 2 is a side view of an exemplary multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage. [Figure 1B] FIG. 2 is a side view of an exemplary multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage. [Figure 1C] FIG. 2 is a side view of an exemplary multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage. [Diagram 2] A side perspective view of an exemplary radio frequency (RF) device including a multi-side antenna module such as the multi-side antenna modules of FIGS. 1A-1C that employ antennas on multiple sides of a package substrate to improve antenna coverage. [Diagram 3] A flowchart showing an exemplary manufacturing process for manufacturing the multi-side antenna modules of FIGS. 1A-1C. [Figure 4A] A flowchart showing another exemplary manufacturing process for manufacturing a multi-side antenna module, including but not limited to the multi-side antenna modules of FIGS. 1A-1C, that employs antennas on multiple sides of a package substrate, mounts a second antenna(s) on the IC die side of the package substrate, and employs an outer substrate having an integrated metal layer for electrically coupling the second antenna(s) to the package substrate. [Figure 4B] A flowchart showing another exemplary manufacturing process for manufacturing a multi-side antenna module, including but not limited to the multi-side antenna modules of FIGS. 1A-1C, that employs antennas on multiple sides of a package substrate, mounts a second antenna(s) on the IC die side of the package substrate, and employs an outer substrate having an integrated metal layer for electrically coupling the second antenna(s) to the package substrate. [Figure 5A] Shows exemplary manufacturing stages during the manufacture of a multi-side antenna module according to the exemplary manufacturing processes of FIGS. 4A and 4B. [Figure 5B] Shows exemplary manufacturing stages during the manufacture of a multi-side antenna module according to the exemplary manufacturing processes of FIGS. 4A and 4B. [Figure 5C] Shows exemplary manufacturing stages during the manufacture of a multi-side antenna module according to the exemplary manufacturing processes of FIGS. 4A and 4B. [Figure 5D] Shows exemplary manufacturing stages during the manufacture of a multi-side antenna module according to the exemplary manufacturing processes of FIGS. 4A and 4B. [Figure 5E] 4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 6] FIG. 13 is a side view of another exemplary multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage, with metal interconnects disposed in channels formed in a package molding of an IC die(s) down to a first surface of a first side of the package substrate to electrically connect a second antenna on a first side of the package substrate to the package substrate. [Figure 7A] 7 is a flowchart illustrating another exemplary manufacturing process for manufacturing a multi-sided antenna module, including but not limited to the multi-sided antenna module of FIG. 6 , employing antennas on multiple sides of a package substrate for improved antenna coverage, and having a metal interconnect disposed within a channel formed in a package mold of an IC die(s) down to a first surface of a first side of a package substrate to electrically connect a second antenna on the first side of the package substrate to the package substrate. [Figure 7B] 7 is a flowchart illustrating another exemplary manufacturing process for manufacturing a multi-sided antenna module, including but not limited to the multi-sided antenna module of FIG. 6 , employing antennas on multiple sides of a package substrate for improved antenna coverage, and having a metal interconnect disposed within a channel formed in a package mold of an IC die(s) down to a first surface of a first side of a package substrate to electrically connect a second antenna on the first side of the package substrate to the package substrate. [Figure 8A] 4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 8B] 4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 8C]4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 8D] 4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 8E] 4C illustrates an exemplary manufacturing stage during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process of FIGS. 4A and 4B. [Figure 9] A block diagram of an exemplary wireless communication device including RF components provided in one or more IC packages, one or more of which may include a multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage, including, but not limited to, the multi-sided antenna modules of Figures 1A-1C, 5A-5E, 6, and 8A-8E, by any of the manufacturing processes of Figures 3-4B and 7A-7B. [Figure 10] A block diagram of an exemplary processor-based system that may include RF components provided in one or more IC packages, one or more of which may include a multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage, including, but not limited to, the multi-sided antenna modules of Figures 1A-1C, 5A-5E, 6, and 8A-8E, by any of the manufacturing processes of Figures 3-4B and 7A-7B. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Some exemplary aspects of the present disclosure will now be described with reference to the drawings. The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects.

[0013] The embodiments disclosed in the detailed description include a multi-sided antenna module employing antennas on multiple sides of a package substrate for improved antenna coverage. Related antenna module manufacturing methods are also disclosed. The multi-sided antenna module includes a layer including one or more integrated circuit (IC) dies (e.g., radio frequency (RF) IC (RFIC) dies) disposed on a first side of a package substrate. The package substrate provides mounting support for the IC dies and also includes one or more metallization layers including metal interconnects to provide an electrical interface for signal routing to the IC dies. In an exemplary embodiment, to include additional directions of antenna coverage in the multi-sided antenna module, the multi-sided antenna module further includes a first substrate antenna and a second substrate antenna layer disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes one or more first antennas disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes one or more second antennas disposed on a second side of the package substrate opposite the first side of the package substrate. The first and second antennas of the respective first and second substrate antenna layers are electrically coupled to the IC die(s) via metal interconnects of the metallization layer(s) of the package substrate. The first antenna(s) of the first substrate antenna layer have an antenna radiation pattern extending in a first direction out of a first side of the package substrate. For example, the first antenna(s) may include patch antenna(s) oriented parallel to a first surface of the first side of the package substrate to provide an antenna radiation pattern extending out of and away from the first side of the package substrate in a direction perpendicular to the package substrate. The second antenna(s) of the second substrate antenna layer have an antenna radiation pattern extending out of and away from the second side of the package substrate in a second direction.For example, the second antenna(s) may include a patch antenna(s) oriented parallel to the second surface of the second side of the package substrate to provide an antenna radiation pattern that extends out and away from the second side of the package substrate in a direction perpendicular to the package substrate.

[0014] In this manner, a multi-sided antenna module including antennas on multiple sides of a package substrate provides antenna coverage extending from both sides of the package substrate to provide antenna coverage in multiple directions. By providing a multi-sided antenna module employing antennas on multiple sides of a package substrate, additional antenna coverage directions for an RF device incorporating the multi-sided antenna module can be achieved with fewer antenna modules than would be required if such antenna module had antenna coverage in a single direction. Because each multi-sided antenna module includes an IC die(s), employing a multi-sided antenna module can reduce the number of IC dies employed in an RF device to achieve the desired multi-directional antenna coverage, resulting in reduced cost and reduced area required in the RF device for such antenna modules.

[0015] In this regard, Figures 1A-1C are side views of an exemplary multiple-sided antenna module 100 employing a first antenna 102 and a second antenna 104 on respective first and second sides 106F and 106S of a package substrate 108 for improved antenna coverage. In this example, as shown in Figure 1A, the second antenna 104 is disposed on the second side 106S of the package substrate 108 opposite the first side 106F on which the first antenna 102 is disposed. As will be described in more detail below, to include additional directions of antenna coverage in the multi-sided antenna module 100, the multi-sided antenna module 100 includes a first substrate antenna layer 110F and a second substrate antenna layer 110S disposed on respective first and second sides 106F and 106S of the package substrate 108. The first substrate antenna layer 110F includes a plurality of first antennas 102(1)-102(4) disposed on a first side 106F of the package substrate 108 adjacent to the IC dies 112(1)-112(4) of the first layer 114. For example, the IC dies 112(1)-112(4) may be RFIC dies that include circuitry related to processing, transmitting, and / or receiving RF signals. The IC dies 112(1)-112(4) are electrically coupled to one or more of the first antennas 102(1)-102(4) and the second antennas 104(1)-104(4) via the package substrate 108 for receiving and transmitting RF signals.

[0016] 1A , including first antennas 102(1)-102(4) and second antennas 104(1)-104(4) on first and second sides 106F, 106S of package substrate 108, provides antenna coverage extending from both first and second sides 106F, 106S of package substrate 108 to provide antenna coverage in multiple directions. First antennas 102(1)-102(4) and second antennas 104(1)-104(4) have respective first and second antenna radiation patterns 116F, 116S that extend from package substrate 108 in first and second directions 118F, 118S opposite from each other in this example. Thus, in this example, by disposing the first antennas 102(1)-102(4) of the first substrate antenna layer 110F on the first side 106F of the package substrate 108, the first antennas 102(1)-102(4) can be oriented to have a first antenna radiation pattern 116F that extends in a first direction 118F out of the package substrate 108 and away from the package substrate in a vertical direction (Z-axis direction). In this regard, the first antenna radiation pattern 116F extends in a first direction 118F that does not intersect the package substrate 108. Additionally, in this example, by disposing the second antennas 104(1)-104(4) of the second substrate antenna layer 110S on the second side 106S of the package substrate 108, the second antennas 104(1)-104(4) can be oriented to have a second antenna radiation pattern 116S that extends in a second direction 118S out of the second side 106S of the package substrate 108 and away from the package substrate in a vertical direction (Z-axis direction). In this regard, the second antenna radiation pattern 116S extends in the second direction 118S that does not intersect the package substrate 108.

[0017] FIG 1B shows further details of the multi-sided antenna module 100 of FIG 1A. Referring to FIG 1B, the IC dies 112(1)-112(4) are encapsulated in a package mold 120 over the IC dies 112(1)-112(4) by overmolding the IC dies 112(1)-112(4) with a molding compound 122. An optional RF shield 124 is disposed over the IC dies 112(1)-112(4) of the first layer 114 to shield the IC dies 112(1)-112(4) from electromagnetic (EM) interference. The second substrate antenna layer 110S includes a plurality of second antennas 104(1)-104(4) disposed on a second side 106S of the package substrate 108 opposite the first side 106F of the package substrate 108 in the vertical direction (Z-axis direction). The first antennas 102(1)-102(4) and second antennas 104(1)-104(4) of the respective first and second substrate antenna layers 110F and 110S are electrically coupled to one or more of the IC dies 112(1)-112(4) via metal interconnects 126 of one or more metallization layers 128 of the package substrate 108.

[0018] For example, the first antennas 102(1)-102(4) can be patch antennas oriented parallel to a first surface 130F of a first side 106F of the package substrate 108. This orientation of the first antennas 102(1)-102(4) provides a first antenna radiation pattern 116F ( FIG. 1A ) that extends in a first direction 118F away from and away from the first side 106F of the package substrate 108 and is orthogonal to the first surface 130F of the package substrate 108 in a vertical direction (Z-axis direction). Similarly, the second antennas 104(1)-104(4) can be patch antennas oriented parallel to a second surface 130S of a second side 106S of the package substrate 108. This orientation of second antennas 104(1)-104(4) provides a second antenna radiation pattern 116S (FIG. 1A) that extends in a second direction 118S away from first side 106F of packaging substrate 108 and is perpendicular to second surface 130S of package substrate 108 in the vertical direction (Z-axis direction).

[0019] Thus, similar to the multi-sided antenna module 100 of FIG. 1A, additional antenna coverage directions for an RF device incorporating the multi-sided antenna module 100 can be achieved with fewer antenna modules than would be required if such antenna module had antenna coverage in a single direction. By employing the multi-sided antenna module 100 in an RF device, the total number of IC dies employed in the RF device to achieve the desired multi-directional antenna coverage can be reduced for cost reduction and area reduction because fewer multi-sided antenna modules 100 may be required to achieve the desired antenna coverage. This is illustrated by way of example in FIG. 2, which is a side perspective view of an exemplary RF device 200 including the multi-sided antenna module 100 of FIG. 1 and another antenna module 202 that does not have antenna coverage in multiple directions. For example, the RF device 200 can be a fifth generation (5G) wireless device configured to transmit and receive 5G cellular RF signals in the frequency spectrum from 450 megahertz (450 MHz) to 6 gigahertz (GHz) and from 24.25 GHz to 52.6 GHz, as a non-limiting example. As shown in FIG. 2, the multi-sided antenna module 100 has a first antenna radiation pattern 116F and a second antenna radiation pattern 116S that extend out from the multi-sided antenna module 100 in respective first and second directions 118F and 118S. The first antennas 102(1)-102(4) and the second antennas 104(1)-104(4) of the multi-sided antenna module 100 of the RF device 200 can be designed to support the 5G frequency spectrum and thus can be 5G antennas. The respective first and second antenna radiation patterns 116F and 116S extend in the first and second directions 118F and 118S in the horizontal direction (Y-axis direction) in this example due to the orientation of the RF device 200 in FIG. 2 and how the multi-sided antenna module 100 is oriented in the RF device 200.In contrast, the antenna module 202 of the RF device 200 includes an antenna on only a single side of its packaging substrate and therefore has an antenna radiation pattern 116 in a single direction 206 .

[0020] 1C is a partial side view of the multi-sided antenna module 100 of FIGS. 1A and 1B to show additional example details of how the first antennas 102(1)-102(4) and second antennas 104(1)-104(4) of the first and second substrate antenna layers 110F and 110S may be electrically coupled to the package substrate 108 to support electrical connectivity between the first and second antennas 102(1)-102(4) and the IC dies 112(1)-112(4). The second antennas 104(1)-104(2) of the second substrate antenna layer 110S are electrically coupled to the IC dies 112(1)-112(4) via metal interconnects 126 of a metallization layer 128 of the package substrate 108. Second antennas 104(1)-104(2) of second substrate antenna layer 110S are disposed directly adjacent to package substrate 108 with no intervening layers of IC dies on the second side such that second antennas 104(1)-104(2) may be directly coupled to one or more of IC dies 112(1)-112(4) through metallization layer 128 of package substrate 108. Metal interconnects 126 electrically coupled to second antennas 104(1)-104(4) are connected to metal pad(s) 150F of second surface 146S of package substrate 108 that are coupled to one or more of IC dies 112(1)-112(4).

[0021] 1C, the multi-sided antenna module 100 includes a conductive substrate 132 disposed horizontally on the package molding 120 between the package molding 120 and the first substrate antenna layer 110F to electrically couple the first antennas 102(1)-102(4) to one or more of the IC dies 112(1)-112(4). In this example, the conductive substrate 132 includes a first dielectric layer 134, a second dielectric layer 136, and a conductive layer 138 of a metal material 141 disposed between the first dielectric layer 134 and the second dielectric layer 136. The first dielectric layer 134 and the second dielectric layer 136 insulate and separate the conductive layer 138 to prevent shorting of the conductive layer 138 and provide flexibility to the conductive substrate 132 to avoid damage to the conductive layer 138. The conductive layer 138 is disposed on a first surface 140 of the package mold 120 and fixed to the package mold 120 via an adhesive layer 142 disposed between the conductive substrate 132 and the package mold 120. To electrically couple the conductive layer 138 to the metal interconnect 126 in the metallization layer 128 of the package substrate 108, the conductive substrate 132 is also disposed on the sidewall 144 of the package mold 120 so as to extend downward to the first surface 146F of the package substrate 108. This creates a shoulder region 148 adjacent to the sidewall 144 of the package mold 120 and the package substrate 108. The conductive substrate 132 then extends from the sidewall 144 of the package mold 120 to the shoulder region 148 in contact with the first surface 146F of the first side 106F of the package substrate 108. Disposed on the first surface 146F of the package substrate 108 are first contact pads 152F that are coupled to the conductive layer 138 of the conductive substrate 132 and to the metal interconnects 126 of the metallization layer 128 adjacent to the first surface 146F of the package substrate 108 to provide signal routing paths between the first antennas 102(1)-102(4) and the IC dies 112(1)-112(4).

[0022] Multi-sided antenna modules, such as the multi-sided antenna module 100 of Figures 1A-1C, can be manufactured according to different manufacturing processes. For example, Figure 3 is a flow chart illustrating an exemplary manufacturing process 300 for manufacturing a multi-sided antenna module, such as the multi-sided antenna module 100 of Figures 1A-1C. The manufacturing process 300 of Figure 3 will be described with reference to the multi-sided antenna module 100 of Figures 1A-1C, for example.

[0023] In this regard, a first step in an exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 of Figures 1A-1C is to provide a package substrate 108 having a first surface 146F on a first side 106F and a second surface 146S on a second side 106S opposite the first side 106S (block 302 of Figure 3). A next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to position a second substrate antenna layer 110S comprising one or more second antennas 104(1)-104(4) adjacent the second surface 146S on the second side 106S of the package substrate 108 (block 304 of Figure 3). The next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to place a first layer 114 comprising one or more IC dies 112(1)-112(4) adjacent to a first surface 146F of a first side 106F of a package substrate 108 (block 306 of FIG. 3). The next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to place a first substrate antenna layer 110F comprising one or more first antennas 102(1)-102(4) adjacent to the first layer 114 such that the first layer 114 is disposed between the first substrate antenna layer 110F and the package substrate 108 on the first side 106F of the package substrate 108 (block 308 of FIG. 3).

[0024] Other manufacturing processes may be employed to manufacture the exemplary multi-sided antenna module 100 of Figures 1A-1C. In this regard, Figures 4A-4B are a flow chart illustrating another exemplary manufacturing process 400 for manufacturing the multi-sided antenna module 100 of Figures 1A-1C. Figures 5A-5E illustrate exemplary manufacturing stages 500A-500E during the manufacturing of the multi-sided antenna module 100 of Figures 1A-1C according to the exemplary manufacturing process 400 of Figures 4A-4B. The manufacturing process 400 of Figures 4A and 4B will be described in conjunction with the manufacturing stages 500A-500E of Figures 5A-5E.

[0025] In this regard, as shown in manufacturing stage 500A of FIG. 5A, a first step of the manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIGS. 1A-1C includes providing a package substrate 108 and disposing a second substrate antenna layer 110S comprising the second antennas 104(1)-104(4) adjacent to a second surface 146S of a second side 106S of the package substrate 108 (block 402 of FIG. 4A). As shown in manufacturing stage 500B of FIG. 5B, a next step of the manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIGS. 1A-1C includes disposing a first layer 114 comprising the IC dies 112(1)-112(4) adjacent to a first surface 146F of a first side 106F of the package substrate 108 (block 404 of FIG. 4A). As shown in manufacturing stage 500C of FIG. 5C, a next step in the manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIG. 1A-1C includes overmolding the IC dies 112(1)-112(4) of the first layer 114 with molding compound 122 to form a package mold 120 over the IC dies 112(1)-112(4) (block 406 of FIG. 4A). The manufacturing process 400 may also include forming an RF shield 124 adjacent to the first layer 114 and the package mold 120 and over the IC dies 112(1)-112(4) to RF shield the IC dies 112(1)-112(4) of the first layer 114 (block 406 of FIG. 4A).

[0026] As shown in manufacturing stage 500D of FIG. 5D, the next step of the manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIG. 1A-1C includes disposing the conductive substrate 132 on the package mold 120 and extending the conductive substrate 132 to contact the first surface 146F of the package substrate 108 on the sidewall 144 of the package mold 120 (block 408 of FIG. 4B). First, an adhesive layer 142 may be disposed on the package mold 120 before the conductive substrate 132 is applied to secure the conductive substrate 132 to the package mold 120. As shown in manufacturing stage 500E of FIG. 5E, the next step in the manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIGS. 1A-1C includes disposing the first substrate antenna layer 110F having the first antennas 102(1)-102(4) adjacent to the conductive substrate 132 above the package mold 120 such that the first layer 114 of the IC dies 112(1)-112(4) is disposed between the first substrate antenna layer 110F and the package substrate 108 on the first side 106F of the package substrate (108) (block 410 of FIG. 4B). The first antennas 102(1)-102(4) are disposed in contact with the conductive substrate 132 to electrically couple the first antennas 102(1)-102(4) to the package substrate 108 and then to one or more of the IC dies 112(1)-112(4).

[0027] FIG. 6 is a side view of another exemplary multi-sided antenna module 600 that may also employ first and second antennas 102 and 104 on separate first and second sides 106F and 106S of a package substrate 108 for improved antenna coverage. Common components between the multi-sided antenna module 600 of FIG. 6 and the multi-sided antenna module 100 of FIGS. 1A-1C are indicated with common element numbers. The description of these common components in the multi-sided antenna module 100 of FIGS. 1A-1C is also applicable to the multi-sided antenna module 600 of FIG. 6. As described below, the multi-sided antenna module 600 of FIG. 6 does not include a conductive substrate 132 as provided in the multi-sided antenna module 100 of FIGS. 1A-1C to electrically couple the first antennas 102(1)-102(4) in the first substrate antenna layer 110F to the package substrate 108. Instead, as described in more detail below and shown in FIG. 6, the multi-sided antenna module 600 includes channels 602(1)-602(4), which in this example are vertical channels 602(1)-602(4) that extend in the Z-axis direction. The vertical channels 602(1)-602(4) are disposed between the IC dies 112(1)-112(4) of the first layer 114 to provide areas for the individual metal interconnects 604(1)-604(4) to extend down to the package substrate 108. In this manner, it is not necessary to provide a conductive layer around the sidewalls of the package mold that extends down to the package substrate 108 as in the multi-sided antenna module 100 of FIGS. 1A-1C.

[0028] In this regard, as shown in FIG. 6, the vertical channels 602(1)-602(4) are disposed through the package mold 120 and down to the first surface 108F of the package substrate 146. The vertical channels 602(1)-602(4) extend in a vertical direction (Z-axis direction) perpendicular to the first surface 146F of the package substrate 108, in this example. For example, the vertical channels 602(1)-602(4) may be laser drilled in the package mold 120 when manufacturing the multi-sided antenna module 600. The metal interconnects 604(1)-604(4) formed from a metal material are disposed within the vertical channels 602(1)-602(4). Metal interconnects 604(1)-604(4) extend down to first surface 146F of package substrate 108 in vertical channels 602(1)-602(4) and contact metal interconnects 126 in metallization layer 128 of package substrate 108. RF shielding material is disposed over package mold 120 with vertical channels 602(1)-602(4) disposed therein to form individual RF shields 606(1)-606(4) for individual IC die 112(1)-112(4). Thus, when first substrate antenna layer 110F having first antennas 102(1)-102(4) is provided in multi-sided antenna module 600, first antennas 102(1)-102(4) are positioned to straddle respective vertical channels 602(1)-602(4) formed in package mold 120 and contact metal interconnects 604(1)-604(4), thereby electrically coupling first antennas 102(1)-102(4) to package substrate 108 via metal interconnects 604(1)-604(4).

[0029] The multi-sided antenna module 600 of FIG. 6 may be manufactured according to the manufacturing process 300 of FIG. 3. The multi-sided antenna module 600 of FIG. 6 may also be manufactured according to other manufacturing processes. In this regard, FIGS. 7A and 7B are a flow chart illustrating another exemplary manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6. FIGS. 8A-8E illustrate exemplary manufacturing stages 800A-800E during the manufacturing of the multi-sided antenna module 600 of FIG. 6 according to the exemplary manufacturing process 700 of FIGS. 7A and 7B. The manufacturing process 800 of FIGS. 7A and 7B will be described in conjunction with the manufacturing stages 800A-800E of FIGS. 8A-8E.

[0030] In this regard, as shown in manufacturing stage 800A of FIG. 8A, a first step in a manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6 includes providing a package substrate 108 and disposing a second substrate antenna layer 110S including the second antennas 104(1)-104(4) adjacent a second surface 146S of a second side 106S of the package substrate 108 (block 702 of FIG. 7A). As shown in manufacturing stage 800B of FIG. 8B, a next step in a manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6 includes disposing a first layer 114 including the IC dies 112(1)-112(4) adjacent a first surface 146F of a first side 106F of the package substrate 108 (block 704 of FIG. 7A). As shown in manufacturing stage 800C of FIG. 8C, a next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6 includes overmolding the IC dies 112(1)-112(4) of the first layer 114 with molding compound 122 to form a package mold 120 over the IC dies 112(1)-112(4) (block 706 of FIG. 7A). The manufacturing process 700 may also include forming an RF shield 124 adjacent to the first layer 114 and the package mold 120 and over the IC dies 112(1)-112(4) to RF shield the IC dies 112(1)-112(4) of the first layer 114 (block 706 of FIG. 7A).

[0031] As shown in manufacturing stage 800D of FIG. 8D , the next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6 includes forming vertical channels 602(1)-602(4) in the package mold 120 down to the first surface 146F of the package substrate 108 (block 708 of FIG. 7B ). This forms openings in the RF shield 124 for forming separate RF shields 606(1)-606(4) adjacent the individual IC dies 112(1)-112(4). By way of example, the vertical channels 602(1)-602(4) can be formed by laser drilling openings in the package mold 120. A metal material may then be disposed within the vertical channels 602(1)-602(4) to form metal interconnects 604(1)-604(4) in the vertical channels 602(1)-602(4) that are electrically coupled to the metal interconnects 126 of the package substrate 108 (block 708 of FIG. 7B). Then, as shown in manufacturing stage 800E of FIG. 8D, the next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 of FIG. 6 includes disposing the first antennas 102(1)-102(4) of the first substrate antenna layer 110F over the package mold 120 and over the vertical channels 602(1)-602(4) (block 710 of FIG. 7B). In this example, they are positioned to straddle respective vertical channels 602(1)-602(4) formed in package mold 120 and contact metal interconnects 604(1)-604(4), thereby allowing first antennas 102(1)-102(4) to be electrically coupled to package substrate 108 via metal interconnects 604(1)-604(4).

[0032] Multi-sided antenna modules employing antennas on multiple sides of a package substrate for improved antenna coverage according to any embodiment disclosed herein, including but not limited to the multi-sided antenna modules of Figures 1A-1C, 5A-5E, 6, and 8A-8E, and according to any of the manufacturing processes of Figures 3-4B and 7A-7B, may be provided or integrated into any wireless communication device and / or processor-based device. Examples include, but are not limited to, set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, global positioning system (GPS) devices, mobile phones, cellular phones, smartphones, session initiation protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smart watches, health or fitness trackers, eyewear, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, drones, and multicopters.

[0033] FIG. 9 illustrates an exemplary wireless communication device 900 including an RF component formed from one or more ICs 902, any of which may be included in a multi-sided antenna module 903 employing antennas on multiple sides of a package substrate for improved antenna coverage according to any aspect disclosed herein, including, but not limited to, the multi-sided antenna modules of FIGS. 1A-1C, 5A-5E, 6, and 8A-8E, according to any of the manufacturing processes of FIGS. 3-4B and 7A-7B. The wireless communication device 900 may include, or be provided within, any of the above-mentioned devices, as examples. As shown in FIG. 9, the wireless communication device 900 includes a transceiver 904 and a data processor 906. The data processor 906 may include a memory for storing data and program codes. The transceiver 904 includes a transmitter 908 and a receiver 910 supporting bidirectional communication. In general, wireless communication device 900 may include any number of transmitters 908 and / or receivers 910 for any number of communication systems and frequency bands. All or a portion of transceiver 904 may be implemented on one or more analog ICs, RFICs, mixed-signal ICs, etc.

[0034] The transmitter 908 or receiver 910 may be implemented using a super-heterodyne architecture or a direct-conversion architecture. In a super-heterodyne architecture, the signal is frequency converted between RF and baseband in multiple stages in the receiver 910, for example, from RF to intermediate frequency (IF) in one stage and then from IF to baseband in another stage. In a direct-conversion architecture, the signal is frequency converted between RF and baseband in one stage. The super-heterodyne architecture and the direct-conversion architecture may use different circuit blocks and / or have different requirements. In the wireless communication device 900 in FIG. 9, the transmitter 908 and receiver 910 are implemented using a direct-conversion architecture.

[0035] On the transmit path, a data processor 906 processes data to be transmitted and provides I and Q analog output signals to a transmitter 908. In the exemplary wireless communication device 900, the data processor 906 includes digital-to-analog converters (DACs) 912(1) and 912(2) to convert digital signals generated by the data processor 906 into I and Q analog output signals, e.g., I and Q output currents, for further processing.

[0036] Within the transmitter 908, low pass filters 914(1) and 914(2) filter the I and Q analog output signals, respectively, to remove unwanted signals caused by the previous digital-to-analog conversion. Amplifiers (AMP) 916(1), 916(2) amplify the signals from low pass filters 914(1), 914(2), respectively, and provide I and Q baseband signals. An upconverter 918 upconverts the I, Q, and Q baseband signals using I and Q LO signals from a transmit (TX) local oscillator (LO) signal generator 922 through mixers 920(1), 920(2) to provide an upconverted signal 924. A filter 926 filters the upconverted signal 924 to remove unwanted signals caused by frequency upconversion as well as noise in the receive frequency band. A power amplifier (PA) 928 amplifies the upconverted signal 924 from filter 926 to obtain a desired output power level and provides a transmit RF signal. The transmit RF signal is routed through a duplexer or switch 930 and transmitted via an antenna 932.

[0037] In the receive path, an antenna 932 receives a signal transmitted by a base station and provides a received RF signal, which is routed through a duplexer or switch 930 and provided to a low noise amplifier (LNA) 934. The duplexer or switch 930 is designed to operate at a particular RX-to-TX duplexer frequency separation such that the receive (RX) signal is separated from the TX signal. The received RF signal is amplified by the LNA 934 and filtered by a filter 936 to obtain a desired RF input signal. Downconversion mixers 938(1), 938(2) mix the output of the filter 936 with I RX LO and Q RX LO signals (i.e., LO_I and LO_Q) from a RX LO signal generator 940 to generate I and Q baseband signals. The I and Q baseband signals are amplified by AMPs 942(1), 942(2) and further filtered by low-pass filters 914(1), 914(2) to obtain I and Q analog input signals, which are provided to data processor 906. In this example, data processor 906 includes analog-to-digital converters (ADCs) 946(1), 946(2) to convert the analog input signals to digital signals for further processing by data processor 906.

[0038] In the wireless communication device 900 of FIG. 9, a TX LO signal generator 922 generates an I TX LO signal and a Q TX LO signal used for frequency up-conversion, and a RX LO signal generator 940 generates an I RX LO signal and a Q RX LO signal used for frequency down-conversion. Each LO signal is a periodic signal having a particular fundamental frequency. A TX phase-locked loop (PLL) circuit 948 receives timing information from the data processor 906 and generates a control signal used to adjust the frequency and / or phase of the TX LO signal from the TX LO signal generator 922. Similarly, a RX PLL circuit 950 receives timing information from the data processor 906 and generates a control signal used to adjust the frequency and / or phase of the RX LO signal from the RX LO signal generator 940.

[0039] FIG. 10 illustrates an example of a processor-based system 1000. A component of the processor-based system 1000 is an IC 1002. Some or all of the ICs 1002 of the processor-based system 1000 can be provided as an IC package 1004 employing a multi-sided antenna module 903 employing antennas on multiple sides of a package substrate for improved antenna coverage according to any of the aspects disclosed herein, including but not limited to the multi-sided antenna modules of FIGS. 1A-1C, 5A-5E, 6, and 8A-8E, according to any of the manufacturing processes of FIGS. 3-4B and 7A-7B. In this example, the processor-based system 1000 may be formed as an IC package 1004 as a system-on-chip (SoC) 1006. The processor-based system 1000 includes a central processing unit (CPU) 1008 including one or more processors 1010, which may also be referred to as CPU cores or processor cores. The CPU 1008 may have a cache memory 1012 coupled to the CPU 1008 for rapid access to temporarily stored data. The CPU 1008 may be coupled to a system bus 1014 to interconnect master and slave devices included within the processor-based system 1000. As is well known, the CPU 1008 communicates with these other devices by exchanging address, control, and data information via the system bus 1014. For example, the CPU 1008 may communicate bus transaction requests to a memory controller 1016, as an example of a slave device. Although not shown in FIG. 10, multiple system buses 1014 may be provided, with each system bus 1014 constituting a different fabric.

[0040] Other master and slave devices may be connected to the system bus 1014. As shown in FIG. 10, these devices may include, by way of example, a memory system 1020 including a memory controller 1016 and a memory array(s) 1018, one or more input devices 1022, one or more output devices 1024, one or more network interface devices 1026, and one or more display controllers 1028. Each of the memory system 1020, the one or more input devices 1022, the one or more output devices 1024, the one or more network interface devices 1026, and the one or more display controllers 1028 may be provided in the same or different IC packages. The input device(s) 1022 may include any type of input device, including, but not limited to, input keys, switches, voice processors, and the like. The output device(s) 1024 may include any type of output device, including, but not limited to, audio, video, other visual indicators, and the like. The network interface device(s) 1026 may be any device configured to enable the exchange of data to and from the network 1030. The network 1030 may be any type of network, including, but not limited to, a wired or wireless network, a private or public network, a local area network (LAN), a wireless local area network (WLAN), a wide area network (WAN), a BLUETOOTH network, and the Internet. The network interface device(s) 1026 may be configured to support any type of communication protocol desired.

[0041] The CPU 1008 may also be configured to access a display controller(s) 1028 via the system bus 1014 to control information sent to one or more displays 1032. The display controller(s) 1028 send information to the display(s) 1032 for display via one or more video processors 1034, which process the information to be displayed into a format suitable for the display(s) 1032. The display controller(s) 1028 and the video processor(s) 1034 may be included in the same or different IC package as the IC package 1004, and may be included in the same or different IC package 1004 that contains the CPU 1008, for example. The display(s) 1032 may include any type of display, including, but not limited to, a cathode ray tube (CRT), a liquid crystal display (LCD), a plasma display, a light emitting diode (LED) display, etc.

[0042] Those skilled in the art will further appreciate that the various exemplary logic blocks, modules, circuits, and algorithms described in connection with the aspects disclosed herein may be implemented as electronic hardware, instructions stored in a memory or in another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein may be any type and size of memory and may be configured to store any type of information desired. To clearly illustrate this interchangeability, various exemplary components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. How such functionality is implemented depends on the particular application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in various ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0043] The various example logic blocks, modules, and circuits described in connection with the aspects disclosed herein may be implemented or performed using a processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The processor may be a microprocessor, but alternatively the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0044] Aspects disclosed herein may be embodied in hardware and instructions stored in the hardware and may reside in, for example, a Random Access Memory (RAM), a flash memory, a Read Only Memory (ROM), an Electrically Programmable ROM (EPROM), an Electrically Erasable Programmable ROM (EEPROM), a register, a hard disk, a removable disk, a CD-ROM, or any other form of computer readable medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. Alternatively, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and the storage medium may reside as discrete components in a remote station, base station, or server.

[0045] It should also be noted that the operational steps described in any of the exemplary aspects herein are described to provide examples and explanations. The described operations may be performed in many different sequences other than the sequence shown. Furthermore, an operation described in a single operational step may actually be performed in several different steps. In addition, one or more operational steps discussed in the exemplary aspects may be combined. It should be understood that many different modifications may be made to the operational steps shown in the flowchart diagrams, as would be readily apparent to one of ordinary skill in the art. Those skilled in the art will also understand that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0046] The above description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other examples. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0047] Example implementations are described in the following numbered aspects / clauses. 1. A package substrate having a first side and a second side opposite the first side; a first substrate antenna layer disposed on a first side of the package substrate, the first substrate antenna layer comprising one or more first antennas; a first layer comprising one or more integrated circuit (IC) dies and disposed on a first side of the package substrate between the package substrate and the first substrate antenna layer; a second substrate antenna layer disposed on a second side of the package substrate and including one or more second antennas; An antenna module comprising:

[0048] 2. The antenna module described in clause 1, further comprising a radio frequency (RF) shield disposed between the first layer and the first substrate antenna layer.

[0049] 3. One or more first antennas are electrically coupled to the package substrate; one or more second antennas electrically coupled to the package substrate; 3. An antenna module according to clause 1 or 2.

[0050] 4. A conductive layer including a conductive material disposed between the first layer and the first substrate antenna layer; a conductive layer electrically coupled to each first antenna of the one or more first antennas; the conductive layer is electrically coupled to at least one metal interconnect in a metallization layer of the package substrate; 4. An antenna module according to any one of clauses 1 to 3.

[0051] 5. A package mold disposed over the one or more IC dies, the package mold having a sidewall; A conductive layer is further disposed on a sidewall of the package mold. 5. An antenna module as claimed in claim 4.

[0052] 6. The package substrate extends horizontally beyond the vertical plane of the sidewall of the package mold to create a shoulder region adjacent the sidewall of the package mold and the package substrate; a conductive layer extends from the sidewall of the package mold to a shoulder region in contact with a first surface of the first side of the package substrate; 6. An antenna module as claimed in claim 5.

[0053] 7. A conductive substrate comprising a first dielectric layer, a second dielectric layer, and a conductive layer disposed between the first dielectric layer and the second dielectric layer; a conductive substrate disposed between the first substrate antenna layer and the first layer; 7. An antenna module according to any one of clauses 4 to 6.

[0054] 8. The antenna module described in any of clauses 5 to 7, further comprising an adhesive layer disposed between the conductive layer and the package mold, bonding the conductive layer to the package mold.

[0055] 9. Further comprising one or more antenna metal interconnects extending from the first surface of the first substrate antenna layer to a first surface of the first side of the package substrate; one or more antenna metal interconnects each coupled to a first antenna of the one or more first antennas in the first substrate antenna layer and to a metal interconnect in a metallization layer of the package substrate; 4. An antenna module according to any one of clauses 1 to 3.

[0056] 10. Further comprising one or more channels extending from the first surface of the first substrate antenna layer to the first surface of the package substrate; each antenna metal interconnect of the one or more antenna metal interconnects is disposed within one of the one or more channels; 10. An antenna module as claimed in claim 9.

[0057] 11. The antenna module of clause 10, wherein each channel of the one or more channels is adjacent to one IC die of the one or more IC dies of the first layer.

[0058] 12. A package mold disposed over the one or more IC dies, 12. The antenna module of claim 10 or 11, wherein the one or more channels each extend downward from a first surface of the first substrate antenna layer, through the package molding, to a first surface of the package substrate.

[0059] 13. The antenna module of any of clauses 10 to 12, wherein each first antenna of the one or more first antennas extends horizontally across two adjacent channels of the one or more channels.

[0060] 14. One or more first antennas are oriented in a first substrate antenna layer to have a first antenna radiation pattern that extends in a first direction that does not intersect the package substrate; one or more second antennas are oriented in a second substrate antenna layer to have a second antenna radiation pattern that extends in a second direction that does not intersect the package substrate; 14. An antenna module according to any one of clauses 1 to 13.

[0061] 15. A first substrate antenna layer is disposed on a first surface of a first side of the package substrate; a second substrate antenna layer disposed on a second surface of the second side of the package substrate; one or more first antennas are oriented in the first substrate antenna layer to have a first antenna radiation pattern that extends in a first direction perpendicular to the first surface of the package substrate; one or more second antennas are oriented in the second substrate antenna layer to have a second antenna radiation pattern that extends in a second direction perpendicular to the first surface of the package substrate; 15. An antenna module according to any one of clauses 1 to 14.

[0062] 16. A first substrate antenna layer is disposed on a first surface of a first side of the package substrate; a second substrate antenna layer disposed on a second surface of the second side of the package substrate; one or more first antennas are oriented in the first substrate antenna layer to have a first antenna radiation pattern that does not intersect the package substrate and extends in a first direction that is perpendicular to a first surface of the package substrate; one or more second antennas are oriented in the second substrate antenna layer to have a second antenna radiation pattern in a second direction that does not intersect the package substrate and is perpendicular to a second surface of the package substrate; 15. An antenna module according to any one of clauses 1 to 14.

[0063] 17. The one or more first antennas each comprise one or more first patch antennas parallel to the package substrate; the one or more second antennas each comprising one or more second patch antennas parallel to the package substrate; 17. An antenna module according to any one of clauses 1 to 16.

[0064] 18. The antenna module of any of clauses 1 to 18, wherein the antenna comprises a 5G antenna.

[0065] 19. The antenna module of any of clauses 1 to 18 integrated into a device selected from the group consisting of a set-top box, an entertainment unit, a navigation device, a communication device, a fixed location data unit, a mobile location data unit, a Global Positioning System (GPS) device, a mobile phone, a cellular phone, a smartphone, a Session Initiation Protocol (SIP) phone, a tablet, a phablet, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, an avionics system, a drone, and a multicopter.

[0066] 20. A method for manufacturing an antenna module, comprising: providing a package substrate having a first surface on a first side and a second surface on a second side opposite the first side; disposing a second substrate antenna layer comprising one or more second antennas adjacent a second surface of a second side of the package substrate; disposing a first layer comprising one or more integrated circuit (IC) dies adjacent a first surface of a first side of a package substrate; disposing a first substrate antenna layer comprising one or more first antennas adjacent to the first layer such that the first layer is disposed on a first side of the package substrate between the first substrate antenna layer and the package substrate; The method includes:

[0067] 21. Electrically coupling one or more first antennas to a package substrate; electrically coupling one or more second antennas to the package substrate; 21. The method of claim 20, further comprising:

[0068] 22. Further comprising overmolding the one or more IC dies of the first layer with a molding compound to form a package mold over the one or more IC dies; 22. The method of claim 20 or 21, wherein disposing the first substrate antenna layer includes disposing a first substrate antenna layer comprising one or more first antennas on the package mold such that the first layer is disposed on a first side of the package substrate between the first substrate antenna layer and the package substrate.

[0069] 23. The method of clause 22, further comprising forming a radio frequency (RF) shield adjacent to the first layer to RF shield one or more IC dies in the first layer.

[0070] 24. The method further comprising forming a conductive layer adjacent to the first layer, the conductive layer comprising a conductive material; disposing the first substrate antenna layer includes disposing a first substrate antenna layer comprising one or more first antennas adjacent to the conductive layer such that the first layer is disposed between the conductive layer and the package substrate on a first side of the package substrate; The method is electrically coupling a conductive layer to each first antenna of the one or more first antennas; electrically coupling the conductive layer to at least one metal interconnect in a metallization layer of a package substrate; 24. The method of any of clauses 20 to 23, further comprising:

[0071] 25. Overmolding the one or more IC dies of the first layer with a molding compound to form a package mold over the one or more IC dies, the package mold comprising a sidewall; disposing the first substrate antenna layer includes disposing a first substrate antenna layer comprising one or more first antennas on the package mold such that the first layer is disposed on a first side of the package substrate between the first substrate antenna layer and the package substrate; The method is 25. The method of claim 24, further comprising forming a conductive layer on a sidewall of the package mold.

[0072] 26. The method of claim 25, wherein forming the conductive layer further includes positioning the conductive layer to extend adjacent to a sidewall of the package mold to a shoulder region adjacent to the sidewall of the package mold, and wherein the package substrate contacts the first surface of the package substrate.

[0073] 27. The method of claim 25, further comprising forming a conductive substrate adjacent to the first layer, the conductive substrate comprising a first dielectric layer, a second dielectric layer, and a conductive layer disposed between the first dielectric layer and the second dielectric layer.

[0074] 28. The method of clause 27, further comprising disposing an adhesive layer between the conductive substrate and the package mold to bond the conductive substrate to the package mold.

[0075] 29. Forming one or more antenna metal interconnects extending from a first surface of the first substrate antenna layer to a first surface of the first side of the package substrate; coupling each of the one or more antenna metal interconnects to a first antenna of the one or more first antennas in the first substrate antenna layer and to a metal interconnect in a metallization layer of the package substrate; 29. The method of any of clauses 20 to 28, further comprising:

[0076] 30. Forming one or more channels extending from a first surface of the first substrate antenna layer to a first surface of the first side of the package substrate; disposing each antenna metal interconnect of the one or more antenna metal interconnects disposed within a channel of the one or more channels; 30. The method of claim 29, further comprising:

[0077] 31. Further comprising overmolding the one or more IC dies of the first layer with a molding compound to form a package overmold on the one or more IC dies; 31. The method of claim 30, wherein forming the one or more channels includes laser drilling one or more channels in the package overmold to extend from a first surface of the first substrate antenna layer to a first surface of the first side of the package substrate.

Claims

1. A package substrate having a first side and a second side opposite the first side, A first substrate antenna layer disposed on the first side of the package substrate and comprising one or more first antennas, A first layer comprising one or more integrated circuit (IC) dies and disposed on the first side of the package substrate between the package substrate and the first substrate antenna layer, A second substrate antenna layer disposed on the second side of the package substrate and comprising one or more second antennas, A conductive layer disposed between the first layer and the first substrate antenna layer and continuous under the first substrate antenna layer, An antenna module comprising the above.

2. Further comprising a radio frequency (RF) shield disposed between the first layer and the first substrate antenna layer; or The one or more first antennas are electrically coupled to the package substrate, The one or more second antennas are electrically coupled to the package substrate; The antenna module according to claim 1.

3. The conductive layer comprises a conductive material, The conductive layer is electrically coupled to each first antenna of the one or more first antennas, The conductive layer is electrically coupled to at least one metal interconnect in the metallization layer of the package substrate, The antenna module according to claim 1.

4. Further comprising a package mold disposed on the one or more IC dies, the package mold having sidewalls, The conductive layer is further disposed on the sidewalls of the package mold; or Further comprising a conductive substrate comprising a first dielectric layer, a second dielectric layer, and the conductive layer disposed between the first dielectric layer and the second dielectric layer, The conductive substrate is disposed between the first substrate antenna layer and the first layer, The antenna module according to claim 3.

5. The antenna module according to claim 4, further comprising an adhesive layer disposed between the conductive layer and the package mold and coupling the conductive layer to the package mold.

6. Further comprising one or more antenna metal interconnects extending from a first surface of the first substrate antenna layer to a first surface of the first side of the package substrate. Each of the one or more antenna metal interconnects is coupled to a first antenna among the one or more first antennas in the first substrate antenna layer and a metal interconnect in the metallization layer of the package substrate. The antenna module according to claim 1.

7. The apparatus further comprises one or more channels extending from the first surface of the first substrate antenna layer to the first surface of the package substrate. Each of the antenna metal interconnects among the one or more antenna metal interconnects is disposed within one of the one or more channels. The antenna module according to claim 6.

8. Each of the one or more channels is adjacent to one of the one or more IC dies in the first layer; or The apparatus further comprises a package mold disposed on the one or more IC dies. Each of the one or more channels extends downward from the first surface of the first substrate antenna layer, through the package mold, to the first surface of the package substrate; or Each of the one or more first antennas extends horizontally across two adjacent ones of the one or more channels. The antenna module according to claim 7.

9. The one or more first antennas are oriented in the first substrate antenna layer to have a first antenna radiation pattern extending in a first direction that does not intersect the package substrate. The one or more second antennas are oriented in the second substrate antenna layer to have a second antenna radiation pattern extending in a second direction that does not intersect the package substrate; or The first substrate antenna layer is disposed on the first surface on the first side of the package substrate. The second substrate antenna layer is disposed on the second surface on the second side of the package substrate. The one or more first antennas are oriented in the first substrate antenna layer to have a first antenna radiation pattern extending in a first direction perpendicular to the first surface of the package substrate. The one or more second antennas are oriented in the second substrate antenna layer to have a second antenna radiation pattern extending in a second direction perpendicular to the first surface of the package substrate; or The first substrate antenna layer is disposed on a first surface of the first side of the package substrate, The second substrate antenna layer is disposed on a second surface of the second side of the package substrate, The one or more first antennas are oriented in the first substrate antenna layer to have a first antenna radiation pattern that does not intersect the package substrate and extends in a first direction orthogonal to the first surface of the package substrate, The one or more second antennas are oriented in the second substrate antenna layer to have a second antenna radiation pattern that does not intersect the package substrate and extends in a second direction orthogonal to the second surface of the package substrate; or The one or more first antennas each comprise one or more first patch antennas parallel to the package substrate, The one or more second antennas each comprise one or more second patch antennas parallel to the package substrate; The antenna module according to claim 1.

10. A method of manufacturing an antenna module, comprising: providing a package substrate having a first surface on a first side and a second surface on a second side opposite the first side; disposing a second substrate antenna layer having one or more second antennas adjacent to the second surface of the second side of the package substrate; disposing a first layer having one or more integrated circuit (IC) dies adjacent to the first surface of the first side of the package substrate; disposing a first substrate antenna layer having one or more first antennas adjacent to the first layer such that the first layer is disposed between the first substrate antenna layer and the package substrate on the first side of the package substrate; disposing a conductive layer between the first layer and the first substrate antenna layer, the conductive layer being continuous under the first substrate antenna layer; A method including the above steps.

11. The method further includes overmolding the one or more IC dies in the first layer using a molding compound to form a package mold over the one or more IC dies. Disposing the first substrate antenna layer includes disposing the first substrate antenna layer including the one or more first antennas on the package mold such that the first layer is disposed between the first substrate antenna layer and the package substrate on the first side of the package substrate. Preferably, the method further includes forming a radio frequency (RF) shield adjacent to the first layer to RF shield the one or more IC dies of the first layer. The method according to claim 10.

12. The conductive layer further includes a conductive material. Disposing the first substrate antenna layer includes disposing the first substrate antenna layer including the one or more first antennas adjacent to the conductive layer such that the first layer is disposed between the conductive layer and the package substrate on the first side of the package substrate. The method includes electrically coupling the conductive layer to each of the one or more first antennas among the one or more first antennas; and electrically coupling the conductive layer to at least one metal interconnect in the metallization layer of the package substrate. The method according to claim 10, further comprising the above.

13. Overmolding the one or more IC dies of the first layer using a molding compound to form a package mold on the one or more IC dies, the package mold having sidewalls. Disposing the first substrate antenna layer includes disposing the first substrate antenna layer including the one or more first antennas on the package mold such that the first layer is disposed between the first substrate antenna layer and the package substrate on the first side of the package substrate. The method includes The method according to claim 12, further comprising forming the conductive layer on the sidewall of the package mold.

14. Forming the conductive layer further includes disposing the conductive layer to extend adjacent to the sidewall of the package mold up to a shoulder region adjacent to the sidewall of the package mold, the package substrate contacting the first surface of the package substrate; or Further comprising forming a conductive substrate adjacent to the first layer, the conductive substrate comprising a first dielectric layer, a second dielectric layer, and the conductive layer disposed between the first dielectric layer and the second dielectric layer; Preferably, further comprising disposing an adhesive layer between the conductive substrate and the package mold to bond the conductive substrate to the package mold, The method according to claim 13.

15. Forming one or more antenna metal interconnects extending from a first surface of the first substrate antenna layer to a first surface of the first side of the package substrate; Coupling each of the one or more antenna metal interconnects to a first antenna of the one or more first antennas in the first substrate antenna layer and a metal interconnect in a metallization layer of the package substrate; Further comprising, Preferably, Forming one or more channels extending from the first surface of the first substrate antenna layer to the first surface of the first side of the package substrate; Disposing each antenna metal interconnect of the one or more antenna metal interconnects disposed within one of the one or more channels within one of the one or more channels; Further comprising, Preferably, Further comprising overmolding the one or more IC dies of the first layer using a molding compound to form a package overmold on the one or more IC dies; Forming the one or more channels includes laser drilling the one or more channels into the package overmold so as to extend from the first surface of the first substrate antenna layer to the first surface of the first side of the package substrate; The method according to claim 10.

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