Silylated Organic Modified Compounds
JP2024541447A5Pending Publication Date: 2025-10-22MOMENTIVE PERFORMANCE MATERIALS INC
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Patent Information
- Application Number
- JP2024529925
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-11-24
- Filing Date
- 2022-11-17
- Publication Date
- 2025-10-22
AI Technical Summary
Technical Problem
Existing silylated organically modified compounds do not provide sufficient interfacial bonding between organic resins and inorganic substrates, such as metals, glasses, and ceramics, which is crucial for industrial applications like flexible copper clad laminates.
Method used
Development of silylated organically modified compounds with specific moieties that form coordinated hydrogen bonds, enhancing interfacial bonding by incorporating moieties with formula (A) and (B), which react with both inorganic substrates and organic resins, forming strong chemical bonds.
Benefits of technology
The new compounds improve interfacial bonding between resin and substrate, providing enhanced adhesion and reliability in industrial applications.
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Smart Images
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Abstract
At least one moiety having the formula (A): [C27] JPEG2024541447000029.jpg70166 wherein subscript a is 1 or 2, each of D is independently NH or O, each of X, Y and Z is independently unsubstituted or substituted C or N, the dotted lines between X, Y and Z indicate an optional double bond between either X and Y or Y and Z, with the proviso that if any of X, Y or Z is a substituted N atom, then such substituted N atom does not participate in a double bond; and each of Q is independently O or S. At least two moieties having the formula (B): [C28] JPEG2024541447000030.jpg28162 A silylated organically modified compound is provided, comprising:
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