Overmolded busbars and integrated sensors

By integrating busbars and sensors via polymeric overmolding, the assembly complexity and cost of battery packs are reduced, enabling efficient electrical insulation and real-time monitoring, thus enhancing the reliability of electric vehicle battery packs.

JP2024545992APending Publication Date: 2024-12-17ATIEVA INC(US)
View PDF 11 Cites 0 Cited by

Patent Information

Application Number
JP2024524713
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-10-27
Filing Date
2022-10-26
Publication Date
2024-12-17

AI Technical Summary

Technical Problem

The challenge in manufacturing battery packs for electric vehicles is the high cost and complexity of assembling busbars and integrated sensors, which are crucial for managing electrical energy distribution and monitoring busbar conditions.

Method used

The integration of separate electrical busbars into a single multi-busbar unit through polymeric overmolding, combined with sensors on a flex printed circuit board, simplifies assembly by reducing individual connections and enhances monitoring capabilities.

Benefits of technology

This approach reduces manufacturing complexity and cost while providing efficient electrical insulation and real-time monitoring of busbar conditions, improving the reliability and efficiency of battery packs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2024545992000001_ABST
    Figure 2024545992000001_ABST
Patent Text Reader

Abstract

The vehicle may include a plurality of separate and distinct electrical busbars that are electrically isolated from one another. The device may include a polymer overmold material that mechanically couples the separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the overmold material is provided to the busbars via an injection molding process. The device may include a flex printed circuit board having a plurality of sensors coupled to the single integrated multi-busbar unit, where the sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application claims priority to U.S. Provisional Patent Application No. 63 / 263,094, filed October 27, 2021, and entitled “OVERMOLDED BUSBARS AND INTEGRATED SENSORS,” the disclosure of which is incorporated by reference herein in its entirety.

[0002] The present disclosure relates to electrical busbars, and more particularly to high voltage junction boxes (HVJBs) that may be coupled to battery modules, where the HVJBs include overmolded busbars with integrated sensors. [Background technology]

[0003] In recent years, the world's transportation has begun to transition away from powertrains primarily powered by fossil fuels and toward more sustainable energy sources, particularly electric motors powered by on-board energy storage. To make these new modes of transportation available to a larger segment of the population, vehicle manufacturers are striving to reduce manufacturing costs, including the cost of building battery packs to power the electric motors. Summary of the Invention

[0004] In some embodiments, a vehicle comprises: a plurality of separate and distinct electrical busbars that are electrically isolated from one another; a polymer overmold material that mechanically couples the separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the overmold material is applied to the busbars via an injection molding process; and a flex printed circuit board having a plurality of sensors coupled to the single integrated multi-busbar unit, where the plurality of sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.

[0005] Implementations may include one or more of the following features, alone or in any combination with each other.

[0006] For example, the sensors may include at least one temperature sensor configured to measure a temperature of at least one of the separate and distinct electrical bus bars.

[0007] For example, the sensors may include at least one voltage sensor configured to measure a voltage of at least one of the separate and distinct electrical bus bars relative to a ground voltage.

[0008] For example, the sensor may include at least one strain gauge configured to measure a mechanical property of at least one of the separate and distinct electrical bus bars.

[0009] For example, the flex printed circuit board may include a ribbon cable configured to establish electrical connections between the sensors and an off-board controller.

[0010] For example, the busbar may be part of a high voltage junction box.

[0011] For example, the vehicle may include a battery module having a plurality of electrochemical cells, the separate and distinct electrical bus bars being configured to conduct electricity to the electrochemical cells.

[0012] In some embodiments, an apparatus comprises: a plurality of separate and distinct electrical busbars that are electrically isolated from one another; and a polymer overmold material that mechanically couples the separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, wherein the overmold material is provided to the busbars via an injection molding process; and wherein the single integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that a plurality of sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.

[0013] Implementations may include one or more of the following features, alone or in any combination with each other.

[0014] For example, the polymer overmold material may have a number of receptacles configured to receive the number of sensors.

[0015] For example, the sensors may include at least one temperature sensor configured to measure a temperature of at least one of the separate and distinct electrical bus bars.

[0016] For example, the sensors may include at least one voltage sensor configured to measure a voltage of at least one of the separate and distinct electrical bus bars relative to a ground voltage.

[0017] For example, the sensor may include at least one strain gauge configured to measure a mechanical property of at least one of the separate and distinct electrical bus bars.

[0018] For example, the busbar may be part of a high voltage junction box.

[0019] For example, the electrical busbar may have a number of holes configured to secure the integrated multi-busbar unit to another component of the high voltage junction box.

[0020] In some embodiments, a method of making an integrated multi-busbar unit comprises: placing a plurality of separate and distinct electrical busbars into a mold cavity; injecting a molten polymer material into the mold cavity; curing the polymer material in the mold cavity such that the cured polymer material adheres to the separate and distinct electrical busbars and holds the separate and distinct electrical busbars securely in place in a configuration in which the separate and distinct electrical busbars are electrically insulated from one another, where after the polymer material has cured, the integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that when the flex printed circuit board is coupled to the integrated busbar unit, the plurality of sensors are coupled to the distinct electrical busbars.

[0021] Implementations may include one or more of the following features, alone or in any combination with each other.

[0022] For example, the hardened polymer overmold material may have a number of receptacles configured to receive the number of sensors.

[0023] For example, the electrical busbar may have a number of holes configured to secure the integrated multi-busbar unit to another component. [Brief description of the drawings]

[0024] [Figure 1] 1 is a schematic perspective view of an exemplary vehicle.

[0025] [Diagram 2]FIG. 1 is a schematic perspective view of an example arrangement of multiple separate bus bars that may be integrated into modular components during production for assembly into a vehicle.

[0026] [Diagram 3] FIG. 3 is an exemplary schematic diagram of the busbars of FIG. 2 mechanically connected to each other after being overmolded with a polymeric material.

[0027] [Figure 4] FIG. 4 is a schematic diagram of the overmolded bus bar shown in FIG. 3 when a flexible printed circuit board ("flex PCB") is attached to the bus bar. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] This specification describes example systems and techniques for manufacturing HVJBs using a housing to which a busbar is attached by overmolding the busbar with a polymeric material and integrating multiple sensors with the busbar. Such an approach may simplify production of battery modules and their associated busbars by reducing the number of components (e.g., sensors) that must be individually bonded to the busbar.

[0029] Examples herein refer to battery modules, which are individual components configured to hold and manage multiple electrochemical cells during charging, storage, and use. A battery module can be intended as the sole power source for one or more loads (e.g., electric motors), or more than one battery module of the same or different types can be used. Two or more battery modules can be implemented in a system separately or as part of a larger energy storage unit. For example, a battery pack can include two or more battery modules of the same or different types. The battery module can include control circuitry for managing the charging, storage, and / or use of electrical energy in the electrochemical cells, or the battery module can be controlled by an external component. For example, the battery management system can be implemented on one or more circuit boards (e.g., printed circuit boards). In some implementations, the battery module can be connected to a HVJB that includes control circuitry for managing the charging, storage, and / or use of electrical energy in the electrochemical cells, or the battery module can be controlled by an external component. For example, the battery management system may be implemented on one or more circuit boards (eg, printed circuit boards) within the HVJB.

[0030] The examples herein refer to electrochemical cells. The electrochemical cell may include an electrolyte and two electrodes to store energy and deliver it when in use. In some implementations, the electrochemical cell may be a rechargeable cell. For example, the electrochemical cell may be a lithium-ion cell. In some implementations, the electrochemical cell may act as a galvanic cell when discharged and as an electrolytic cell when charged. The electrochemical cell may have at least one terminal for each of the electrodes. The terminal, or at least a portion thereof, may be located at one end of the electrolytic cell. For example, if the electrochemical cell has a cylindrical shape, one of the terminals may be provided in the center of the end of the cell, and the can forming the cylinder may constitute the other terminal and therefore may also be present at that end. Other shapes of electrochemical cells may be used, including but not limited to prismatic shapes.

[0031] Examples herein refer to molding, which is the process of forming a liquid or pliable material into a shape using a mold. Injection molding is a type of molding process in which molten material is injected into a mold cavity. Overmolding refers to a molding operation in which one or more parts are first placed inside a mold and then molten material is introduced into the mold. This allows the molten material to come into contact with the parts during the molding process, thereby joining them to the final molded component.

[0032] The examples herein refer to molding with a polymeric material, which is a thermoplastic or thermosetting material suitable for molding. The polymeric material is selected by its properties so that the resulting component has properties suitable for the intended use. For example, a polymeric material molded into a housing for holding an electrochemical cell should have, in its final state, appropriate strength and stiffness considering the weight of the cell and its application, and should also have appropriate thermal and electrical properties in view of the charging, storage, and / or use of the electrochemical cell. One example of a polymer that can be molded into a housing for an electrochemical cell is polycarbonate. Polycarbonate materials contain carbonate groups and are usually good insulators, heat resistant, and flame retardant. One or more other materials can be added to the polymeric material prior to molding to change one or more of its properties. In some implementations, the polycarbonate material can have one or more additives. For example, threads of glass and / or other materials can be added to the polycarbonate or other polymeric material.

[0033] Examples herein refer to bus bars, and a battery module may have at least one bus bar. The bus bar is electrically conductive and is used to conduct electricity to the electrochemical cells during charging or from the cells during discharging. The bus bar is made of an electrically conductive material (e.g., metal) and has suitable dimensions taking into account the properties and intended use of the electrochemical cells. In some implementations, the bus bar includes aluminum (e.g., an aluminum alloy). The bus bar may be flat (e.g., flat) or may have one or more curves depending on the shape and intended use of the battery module.

[0034] The examples described herein refer to vehicles. As used herein, a vehicle is a machine that transports passengers or cargo, or both. A vehicle can have one or more motors that use at least one type of fuel, or other energy source (e.g., electricity). Examples of vehicles include, but are not limited to, cars, trucks, and buses. The number of wheels may vary among multiple types of vehicles, and one or more (e.g., all) of the wheels may be used for propulsion of the vehicle. A vehicle may include a passenger compartment that accommodates one or more people. A vehicle may be powered by one or more types of power sources. In some implementations, a vehicle may be powered only by electricity or may use one or more other energy sources in addition to electricity, just to name a few.

[0035] As used herein, the terms “electric vehicle” and “EV” may be used interchangeably and may refer to an all-electric vehicle, a plug-in hybrid vehicle, also referred to as a PHEV, or a hybrid vehicle, also referred to as an HEV, where a hybrid vehicle utilizes multiple propulsion sources, including an electric drive system.

[0036] Examples herein refer to a vehicle chassis. A vehicle chassis is a frame structure that bears the load of the rest of the vehicle. A vehicle chassis can include one or more frames that can be made of steel, aluminum alloy, or another material that is rigid and strong. For example, a vehicle chassis may be made of at least two side rails connected by multiple cross members for structural integrity. One or more other components, including but not limited to a battery pack for an electric or hybrid vehicle, may be integrated or otherwise combined into the vehicle chassis. A subframe is a chassis portion that can hold certain components, including but not limited to a motor, drivetrain, or suspension, to distribute chassis loads and / or isolate vibration and harshness.

[0037] Examples herein refer to a vehicle body. The vehicle body is the main supporting structure of the vehicle to which components and subcomponents are attached. In vehicles having a monocoque construction, the vehicle body and the vehicle chassis are integrated into one another. As used herein, the vehicle chassis is described as supporting the vehicle body even when the vehicle body is an integral part of the vehicle chassis. A vehicle body often includes a passenger compartment with a passenger compartment for one or more passengers; one or more trunks or other storage compartments for cargo; and various panels and other closures that provide protective and / or decorative coverings.

[0038] 1 illustrates one example of a vehicle 100. The vehicle 100 may be used with one or more other examples described elsewhere herein. The vehicle 100 includes a body 102 and a vehicle chassis 104 that supports the body 102. For example, the body 102 here is of a four-door type with a cabin for at least four passengers, and the vehicle chassis 104 has four wheels. In some implementations, other numbers of doors, types of body 102, and / or types of vehicle chassis 104 may be used.

[0039] The vehicle body 102 may have a front portion 106 and a rear portion 108, and a passenger cabin 112 between the front and rear portions. The vehicle 100 may have at least one motor, which may be positioned at one or more locations on the vehicle 100. In some implementations, the motor may be mounted generally near the front portion 106, generally near the rear portion 108, or both. A battery module may be supported by the chassis 104, for example, below the passenger cabin, and may be used to power the motor. The vehicle 100 may have at least one lighting component, which may be positioned at one or more locations on the vehicle 100. For example, the vehicle 100 may have one or more headlights 110 mounted generally near the front portion 106.

[0040] The rear portion 108 of the vehicle 100 may include a trunk compartment, and the front portion 106 of the vehicle 100 may include a front trunk (aka frunk) compartment, each of which is external to the passenger cabin and each of which may be used for storage of vehicle components or personal items. For example, one or more electrical circuit modules may be included in the trunk or frunk, e.g., as part of the HVJB, to manage charging of the batteries in the battery modules and to manage distribution of electrical current from the battery modules to one or more motors in the vehicle. In modern electric vehicles with many battery cells and electrical connections, multiple bus bars may be used to manage distribution of electrical energy to and from the battery cells of the battery modules.

[0041] 2 is a schematic example arrangement of multiple separate bus bars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 that may be integrated into modular components during production for assembly into vehicle 100. The separate bus bars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 may be part of an HVJB that manages the distribution of power from a charging source to the battery modules and from the battery modules to one or more components of the vehicle that require power for their operation, such as, for example, a motor that drives the vehicle's drivetrain, HVAC components, a heater, etc. The separate bus bars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 may be electrically isolated from one another and may provide an electrical conduit from one component of the vehicle (e.g., a battery cell) to another component (e.g., a motor or a charging station). Holes on the conductive bus bars may be used to connect (e.g., fasten) the bus bars to another component.

[0042] FIG. 2 illustrates the busbars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 as being mechanically disconnected from one another, but as being located and oriented in their final position as they will be used in a vehicle.

[0043] 3 is an example schematic diagram of the busbars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 of FIG. 2 mechanically connected to one another after being overmolded with a polymeric material 302 (e.g., a thermoplastic or thermoset material). For example, the busbars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 of FIG. 2 may be placed into a mold cavity, overmolded with molten polymeric material 302, and then cooled to solidify and harden the polymeric material into its final shape and form. During the molding process, the polymeric material may bond to portions of the busbars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220 such that the busbars are held firmly in place relative to one another by the hardened polymeric material.

[0044] In some implementations, the overmolded polymer material 302, after it has cured, may include one or more receptacles or holders 304, 306, 308, 310, 312, 314, 316, 318, 320, 322, 324, 326 formed from a portion of the overmolded material 302 configured to receive one or more sensors that may be used to monitor the condition or performance of the busbars. The sensors used to monitor the condition or performance of the busbars may include, for example, thermistors for measuring the temperature of the busbars, voltmeters and ammeters configured to measure electrical properties of the busbars, strain gauges configured to measure mechanical properties of the busbars, and the like.

[0045] The receptacles 304, 306, 308, 310, 312, 314, 316, 318, 320, 322, 324, 326 may be defined, for example, by one or more raised portions of the overmolded polymeric material 302, which may define a shape complementary to the shape of the sensor to be received in the receptacle. For example, the receptacles 304, 306, 308, 310, 312, 314, 316, 318, 320, 322, 324, 326 may define a rectangular shape, a circular shape, or the like.

[0046] FIG. 4 is an example schematic diagram of the overmolded busbars shown in FIG. 3 when a flexible printed circuit board ("flex PCB") 402 is attached to the busbars. For clarity, the busbars in FIG. 4 are not labeled, but they are the same as the busbars in FIG. 3. The flex PCB 402 may include multiple electrical components that are assembled with or attached to the flex PCB 402 before the flex PCB is attached to the overmolded busbars. Connections to the electrical components may be provided via wires or conductive traces in the flex PCB 402, and the electrical components may be connected to an off-board controller (e.g., a central processing unit, application specific integrated circuit, or the like) via connectors 404 (e.g., ribbon connectors).

[0047] Electrical components included with the flex PCB 402 may include one or more temperature sensors 410, 412, 414, 416, 418, 420, 422, 424, 426, 428. The temperature sensors may include, for example, negative temperature coefficient (NTC) thermistors that output a voltage that is dependent on the temperature of the sensor. The temperature sensors 410, 412, 414, 416, 418, 420, 422, 424, 426, 428 may be positioned on the flex PCB 402 such that when the flex PCB is attached to the overmolded busbars, the temperature sensors are positioned within receptacles formed within the molded polymeric material and are in thermal contact with one or more locations of the individual busbars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220. Mechanical and thermal contact between the temperature sensors 410, 412, 414, 416, 418, 420, 422, 424, 426, 428 and the bus bars can be achieved using an adhesive material with suitable mechanical and thermal properties (e.g., having a relatively high thermal conductivity) such that the temperature measured by the temperature sensors is a close approximation of the temperature of the bus bars.

[0048] Electrical components included with the flex PCB 402 may also include one or more voltage sensors 430, 432. The voltage sensors 430, 432 may be positioned on the flex PCB 402 such that when the flex PCB is attached to the overmolded bus bars, the voltage sensors are positioned within receptacles formed in the molded polymeric material and make electrical contact with one or more locations on the respective bus bars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220. Electrical and thermal contact between 430, 432 may be achieved, for example, by laser welding contacts of the voltage sensors 430, 432 to the bus bars 202, 204, 206, 208, 210, 212, 214, 216, 218, 220. For example, a voltage sensor 430, 432 coupled to a flex PCB 402 may be positioned within a receptacle formed by the polymer material 302 used to overmold the busbar, and then, once the voltage sensor is correctly positioned, a laser light may be provided to the interface between the voltage sensor contact and the busbar to weld the voltage sensor contact to the busbar.

[0049] By providing the sensors 410, 412, 414, 416, 418, 420, 422, 424, 426, 428, 430, 432 on the flex PCB 402 prior to attachment of the flex PCB to the overmolded busbar, the manufacturing complexity of the overmolded busbar can be significantly reduced. For example, individual attachment of multiple thermistors to the busbar can be avoided, rather all thermistors attached to the flex PCB can be attached to the busbar at once. Furthermore, electrical connections between the sensors and the flex PCB can be made before the PCB is placed on the overmolded busbar, thus facilitating assembly of a device that would otherwise require multiple connections to be made in complex mechanical parts.

[0050] The terms "substantially" and "about" used throughout this specification are used to describe and take into account small variations, such as those due to processing variations. For example, they can refer to less than or equal to ±5%, such as less than or equal to ±2%, such as less than or equal to ±1%, such as less than or equal to ±0.5%, such as less than or equal to ±0.2%, such as less than or equal to ±0.1%, such as less than or equal to ±0.05%. Also, as used herein, indefinite articles such as "a" or "an" mean "at least one".

[0051] It will be understood that all combinations of the above concepts, and additional concepts discussed in more detail below (provided that such concepts are not mutually inconsistent), are contemplated as being part of the inventive subject matter disclosed herein. In particular, all combinations of subject matter appearing in this disclosure are contemplated as being part of the inventive subject matter disclosed herein.

[0052] Although several implementations have been described, it will be understood that various modifications can be made without departing from the spirit and scope of the specification.

[0053] Additionally, the logic flows depicted in the figures do not require the particular order shown, or sequential order, to achieve desirable results. Additionally, other processes may be provided to or removed from the illustrated flows, and other components may be added to or removed from the illustrated systems.

[0054] While certain features of the described implementations have been shown as described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. It should be understood that they have been presented by way of example only and not limitation, and that various changes in form and details may be made. Except for mutually exclusive combinations, any portion of the apparatus and / or methods described herein may be combined in any combination. The implementations described herein may include various combinations and / or subcombinations of the functions, components, and / or features of the different implementations described.

[0055] Systems and methods have been described in general terms to aid in the understanding of the details of the invention. In some instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring aspects of the invention. In other instances, specific details have been provided to provide a thorough understanding of the invention. Those skilled in the art will recognize that the invention can be embodied in other specific forms, for example to adapt to a particular system or device or situation or materials or components, without departing from the spirit or essential characteristics thereof. Therefore, the disclosures and descriptions herein are intended to be illustrative, but not limiting, of the scope of the invention. (Other possible items) (Item 1) a plurality of separate and distinct electrical bus bars that are electrically insulated from one another; a polymer overmold material that mechanically bonds the plurality of separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the polymer overmold material is applied to the plurality of separate and distinct electrical busbars via an injection molding process; a flex printed circuit board having a plurality of sensors coupled to the single integrated multi-busbar unit, wherein the plurality of sensors are coupled to the plurality of separate and distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit; A vehicle comprising: (Item 2) 2. The vehicle of claim 1, wherein the plurality of sensors includes at least one temperature sensor configured to measure a temperature of at least one of the plurality of separate and distinct electrical bus bars. (Item 3) 3. The vehicle of claim 1 or 2, wherein the plurality of sensors includes at least one voltage sensor configured to measure a voltage of at least one of the plurality of separate and distinct electrical bus bars relative to a ground voltage. (Item 4) 4. The vehicle of any one of claims 1 to 3, wherein the plurality of sensors includes at least one strain gauge configured to measure a mechanical property of at least one of the plurality of separate and distinct electrical busbars. (Item 5) 5. The vehicle of any one of claims 1 to 4, wherein the flex printed circuit board has a ribbon cable configured to establish an electrical connection between the plurality of sensors and an off-board controller. (Item 6) 6. The vehicle of any one of claims 1 to 5, wherein the plurality of separate and distinct electrical bus bars are part of a high voltage junction box. (Item 7) 7. The vehicle of any one of claims 1 to 6, further comprising a battery module having a plurality of electrochemical cells, the plurality of separate and distinct electrical bus bars being configured to conduct electricity to the plurality of electrochemical cells. (Item 8) a plurality of separate and distinct electrical bus bars that are electrically insulated from one another; and a polymer overmold material that mechanically bonds the plurality of separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the polymer overmold material is applied to the plurality of separate and distinct electrical busbars via an injection molding process; Equipped with wherein the single integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that when the flex printed circuit board is coupled to the integrated busbar unit, the plurality of sensors are coupled to the plurality of separate and distinct electrical busbars. Device. (Item 9) 9. The apparatus of claim 8, wherein the polymer overmold material has a plurality of receptacles configured to receive the plurality of sensors. (Item 10) 10. The apparatus of claim 8 or 9, wherein the plurality of sensors includes at least one temperature sensor configured to measure a temperature of at least one of the plurality of separate and distinct electrical bus bars. (Item 11) 11. The apparatus of any one of claims 8 to 10, wherein the plurality of sensors includes at least one voltage sensor configured to measure a voltage of at least one of the plurality of separate and distinct electrical bus bars relative to a ground voltage. (Item 12) Item 12. The apparatus of any one of items 8 to 11, wherein the plurality of sensors includes at least one strain gauge configured to measure a mechanical property of at least one of the plurality of separate and distinct electrical bus bars. (Item 13) Item 13. The apparatus of any one of items 8 to 12, wherein the plurality of separate and distinct electrical bus bars are part of a high voltage junction box. (Item 14) Item 14. The apparatus of item 13, wherein the plurality of separate and distinct electrical bus bars have a plurality of holes configured to secure the integrated multi-busbar unit to another component of the high voltage junction box. (Item 15) 1. A method of making an integrated multi-busbar unit, the method comprising: placing a plurality of separate and distinct electrical bus bars into the mold cavity; injecting a molten polymeric material into the mold cavity; curing the polymeric material in the mold cavity such that the cured polymeric material adheres to the plurality of separate and distinct electrical bus bars and holds the plurality of separate and distinct electrical bus bars securely in place in a configuration in which the plurality of separate and distinct electrical bus bars are electrically insulated from one another. Equipped with wherein after the polymer material has cured, the integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that when the flex printed circuit board is coupled to the integrated busbar unit, the plurality of sensors are coupled to the different electrical busbars. method. (Item 16) Item 16. The method of item 15, wherein the hardened polymer overmold material has a plurality of receptacles configured to receive the plurality of sensors. (Item 17) Item 17. The method of item 15 or item 16, wherein the electrical busbar has a plurality of holes configured to secure the integrated multi-busbar unit to another component.

Claims

1. a plurality of separate and distinct electrical bus bars that are electrically insulated from one another; a polymer overmold material that mechanically bonds the plurality of separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the polymer overmold material is applied to the plurality of separate and distinct electrical busbars via an injection molding process; a flex printed circuit board having a plurality of sensors coupled to the single integrated multi-busbar unit, wherein the plurality of sensors are coupled to the plurality of separate and distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit; A vehicle comprising:

2. The vehicle of claim 1 , wherein the plurality of sensors includes at least one temperature sensor configured to measure a temperature of at least one of the plurality of separate and distinct electrical bus bars.

3. The vehicle of claim 1 , wherein the plurality of sensors includes at least one voltage sensor configured to measure a voltage of at least one of the plurality of separate and distinct electrical bus bars relative to a ground voltage.

4. The vehicle of claim 1 , wherein the plurality of sensors includes at least one strain gauge configured to measure a mechanical property of at least one of the plurality of separate and distinct electrical bus bars.

5. The vehicle of claim 1 , wherein the flex printed circuit board includes a ribbon cable configured to establish electrical connections between the plurality of sensors and an off-board controller.

6. The vehicle of claim 1 , wherein the plurality of separate and distinct electrical bus bars are part of a high voltage junction box.

7. 7. The vehicle of claim 1, further comprising a battery module having a plurality of electrochemical cells, the plurality of separate and distinct electrical bus bars configured to conduct electricity to the plurality of electrochemical cells.

8. a plurality of separate and distinct electrical bus bars that are electrically insulated from one another; and a polymer overmold material that mechanically bonds the plurality of separate and distinct electrical busbars to one another in a single integrated multi-busbar unit, where the polymer overmold material is applied to the plurality of separate and distinct electrical busbars via an injection molding process; Equipped with wherein the single integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that when the flex printed circuit board is coupled to the integrated busbar unit, the plurality of sensors are coupled to the plurality of separate and distinct electrical busbars. Device.

9. The apparatus of claim 8 , wherein the polymer overmold material has a plurality of receptacles configured to receive the plurality of sensors.

10. The apparatus of claim 8 , wherein the plurality of sensors includes at least one temperature sensor configured to measure a temperature of at least one of the plurality of separate and distinct electrical bus bars.

11. 9. The apparatus of claim 8, wherein the plurality of sensors includes at least one voltage sensor configured to measure a voltage of at least one of the plurality of separate and distinct electrical bus bars relative to a ground voltage.

12. The apparatus of claim 8 , wherein the plurality of sensors includes at least one strain gauge configured to measure a mechanical property of at least one of the plurality of separate and distinct electrical bus bars.

13. Apparatus according to any one of claims 8 to 12, wherein the plurality of separate and distinct electrical bus bars are part of a high voltage junction box.

14. 14. The apparatus of claim 13, wherein the plurality of separate and distinct electrical bus bars have a plurality of holes configured to secure the integrated multi-busbar unit to another component of the high voltage junction box.

15. 1. A method of making an integrated multi-busbar unit, the method comprising: placing a plurality of separate and distinct electrical bus bars into the mold cavity; injecting a molten polymeric material into the mold cavity; curing the polymeric material in the mold cavity such that the cured polymeric material adheres to the plurality of separate and distinct electrical bus bars and holds the plurality of separate and distinct electrical bus bars securely in place in a configuration in which the plurality of separate and distinct electrical bus bars are electrically insulated from one another. Equipped with wherein after the polymer material has cured, the integrated multi-busbar unit is configured to be coupled to the flex printed circuit board having the plurality of sensors such that when the flex printed circuit board is coupled to the integrated busbar unit, the plurality of sensors are coupled to the different electrical busbars. method.

16. The method of claim 15 , wherein the hardened polymer overmold material has a plurality of receptacles configured to receive the plurality of sensors.

17. 17. The method of claim 15 or claim 16, wherein the electrical busbar comprises a plurality of holes configured to secure the integrated multi-busbar unit to another component.

Citation Information

Patent Citations

  • Resin insertion molding method of metallic material

    JP1992263913A

  • Electric joint box

    JP1996265936A

  • Connection structure of electric connection box

    JP1997308047A

  • Circuit unit for high-voltage electrical junction box

    JP2002027636A

  • Battery module, battery system, and electric vehicle

    JP2010257775A