Chip collection system, chip transport device, chip collection device, and chip collection method

Abstract

To provide a chip collection system capable of appropriately collecting discharged scraps of tape materials from a production line, a chip transport device, a chip collection device, and a chip collection method.SOLUTION: The chip collection system (component mounting system 1) includes: a chip transport device that includes a transport section that transports chips of a tape material discharged from the tape feeder and line storage units G(1) to G(3) for storing chips transported by the transport unit; and a chip collection device 40 that collects chips stored in the line storage units G(1) to G(3) into a central storage unit Gc by negative pressure. The line storage units G(1) to G(3) are provided on the production lines L1 to L3, each of which includes a component mounting device including a tape feeder, and the chip collection device 40 is at an accessible position.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a chip collection system, a chip transport device, a chip collection device, and a chip collection method for collecting chips of a tape member discharged from a tape feeder. [Background technology]

[0002] In a component mounting device, a tape feeder transports a tape member (carrier tape) on which many components are lined up and stored, and the tape member is then mounted on a board. After components are supplied, the tape member is discharged from the tape feeder and cut to a predetermined length by a cutter device, and collected as scraps of the tape member. Patent Document 1 discloses a production line in which scraps of the tape member discharged from a plurality of tape feeders are compressed by air and transported to an air outlet through a collection path (duct), the scraps transported to the air outlet are transported by a conveyer to the top of a compression section, and the scraps compressed by the compression section are collected in a storage section provided below. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-77059 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional techniques including Patent Document 1, although scraps of tape materials discharged from a plurality of tape feeders are collected in one storage section and collected, the following problems arise from the configuration in which the scraps are transported to the compression section by a conveyor. That is, there is a problem that the scraps get caught in between the rotating conveyor belt due to the air blown out from the air outlet together with the scraps. In addition, since a conveyor and a storage section for transporting the scraps need to be provided for each production line, there is also a problem that on a floor where a plurality of production lines are arranged, the scraps of tape materials need to be collected by going around the plurality of storage sections.

[0005] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide a chip collection system, a chip transport device, a chip collection device, and a chip collection method that are capable of appropriately collecting chips of tape materials discharged from a production line. [Means for solving the problem]

[0006] The chip collection system of the present invention comprises a chip transporting device having a transport section that transports chips of a tape material discharged from a tape feeder and a line storage section that stores the chips transported by the transport section, and a chip collection device that collects the chips stored in the line storage section in a central storage section by negative pressure, wherein the line storage section is provided in a production line including a component mounting device having the tape feeder, and is provided in a position accessible to the chip collection device.

[0007] The chip transporting device of the present invention is a chip transporting device that transports chips of a tape material discharged from a tape feeder, and has a transporting section that transports the chips, and a line storage section that stores the chips transported by the transporting section, the line storage section being provided on a production line including a component mounting device having the tape feeder, and being provided in a position accessible to a chip recovery device that uses negative pressure to recover the chips stored in the line storage section of the chip transporting device into a central storage section.

[0008] The chip collection device of the present invention is a chip collection device that collects chips of a tape material discharged from a tape feeder in a centralized storage section, and has a conveying section that conveys the chips and a line storage section that stores the chips conveyed by the conveying section.The line storage section of the chip transporting device is provided on a production line that includes a component mounting device having the tape feeder, and the chip collection device is provided in a position accessible to the line storage section and collects the chips in the centralized storage section by negative pressure.

[0009] The chip collection method of the present invention is a chip collection method for collecting chips of a tape material discharged from a tape feeder in a centralized storage section, the chip collection device having a conveying section for conveying the chips and a line storage section for storing the chips conveyed by the conveying section, the line storage section being provided on a production line including a component mounting device having the tape feeder, and the chip collection device for collecting the chips stored in the line storage section by negative pressure being provided in a position accessible to the line storage section, with the conveying section conveying the chips to the line storage section, and the chip collection device collecting the chips transported to the line storage section in the centralized storage section by the negative pressure. Effect of the Invention

[0010] According to the present invention, scraps of the tape material discharged from the production line can be appropriately collected. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is an explanatory diagram showing a configuration of a component mounting system according to an embodiment of the present invention; [Diagram 2] FIG. 1 is an explanatory diagram showing a configuration of a production line equipped with a component mounting system according to an embodiment of the present invention. [Diagram 3] FIG. 1 is a side view showing a configuration of a main part of a component mounting device provided in a component mounting system according to an embodiment of the present invention. [Figure 4] FIG. 1 is a perspective view showing a configuration of a chip conveying device provided in a component mounting system according to an embodiment of the present invention; [Diagram 5] FIG. 1 is a side view (a) showing a discharge portion of a feeder cart and a receiving opening of a duct of a chip transport device provided in a component mounting system according to an embodiment of the present invention; [Figure 6] 1A and 1B are explanatory views showing a state in which a discharge opening of a discharge part of a feeder cart provided in a component mounting system according to an embodiment of the present invention is in contact with a receiving opening of a duct of a chip conveying device; [Figure 7] FIG. 1A is an explanatory diagram showing a state where chips are discharged from a chute of a feeder cart provided in a component mounting system according to an embodiment of the present invention; FIG. 1B is an explanatory diagram showing a state where the discharged chips are blown away by air; [Figure 8] 1A, 1B, and 1C are explanatory diagrams illustrating the transportation of chips in a chip transportation device provided in a component mounting system according to an embodiment of the present invention. [Figure 9] FIG. 1 is an explanatory diagram showing a state in which chips are collected by a chip collection device in a line storage unit of a chip transport device provided in a component mounting system according to an embodiment of the present invention; FIG. 2 is an explanatory diagram showing a state in which chips are collected by an operator; [Figure 10] FIG. 2A is a side cross-sectional view illustrating chip collection into a centralized storage unit in a chip collection device provided in a component mounting system according to an embodiment of the present invention; FIG. 2B is a plan view illustrating replacement of a chip separation filter; [Figure 11] FIG. 1 is a block diagram showing a configuration of a control system of a component mounting system according to an embodiment of the present invention. [Figure 12] FIG. 1 is a timing chart for explaining a method for collecting chips in a line storage unit in a chip transport device of a component mounting system according to an embodiment of the present invention. [Figure 13] FIG. 1 is a timing chart for explaining a method for collecting chips in a centralized storage unit in a component mounting system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation, and can be modified as appropriate according to the specifications of the component mounting system (chip collection system), component mounting device, feeder cart, chip transport device, and chip collection device. In the following, corresponding elements in all drawings are given the same reference numerals, and duplicated explanations will be omitted.

[0013] In Fig. 1 and in some parts described later, the X-axis (left-right direction in Fig. 1) in the substrate transport direction and the Y-axis (left-right direction in Fig. 1) perpendicular to the substrate transport direction are shown as two axes perpendicular to each other in a horizontal plane. Also, in Fig. 3 and in some parts described later, the Z-axis (up-down direction in Fig. 3) is shown as a height direction perpendicular to the horizontal plane.

[0014] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The component mounting system 1 includes multiple (three in this example) production lines L1-L3 installed on a production floor Fp in a building B, and a chip collection device 40 and a positive pressure supply device 41 installed in a machine room Fm. The machine room Fm is provided with an entrance 2 for entering and exiting from outside the building B. The multiple production lines L1-L3 include multiple component mounting devices M1-M3 and a chip transport device 30 (see Fig. 2).

[0015] The component mounting system 1 has a function of producing a mounted board with components mounted on a board, and also a function of a chip collection system that collects chips of a tape material that supplies components in a centralized storage unit Gc of a machine room Fm. The number of production lines L1 to L3 provided in the component mounting system 1 is not limited to three, and may be one, two, or four or more. Thus, in the component mounting system 1 (chip collection system), the machine room Fm (second floor) is an area different from the production floor Fp (first floor) on which the component mounting devices M1 to M3 are installed. The machine room Fm is an area having the entrance 2 of the building B on which the component mounting devices M1 to M3 are installed. The component mounting system 1 (chip collection system) may be configured such that the centralized storage unit Gc (chip collection device 40) is provided on the production floor Fp (first floor).

[0016] Next, the configuration of the production lines L1 to L3 will be described with reference to Fig. 2. The three production lines L1 to L3 have the same configuration, and here, the production line L1 will be described as an example. The production line L1 is equipped with multiple (here, three) component mounting devices M1 to M3 and a chip conveying device 30. The component mounting devices M1 to M3 are installed above the conveying section D (main duct Dm, sub duct Ds) of the chip conveying device 30 (see Fig. 3).

[0017] The number of component mounting devices M1-M3 provided on production line L1 is not limited to three, and may be one, two, or four or more. Furthermore, production line L1 may be configured to include a printing device that prints cream solder on the board upstream of component mounting devices M1-M3, and a reflow device that melts the cream solder for soldering downstream (not shown).

[0018] Next, the configuration of component mounting devices M1 to M3 will be described with reference to Fig. 3. The three component mounting devices M1 to M3 have the same configuration, and here, component mounting device M1 will be described as an example. In the following description, the left side along the Y axis in Fig. 3 (the lower side in Figs. 1 and 2) will be referred to as the "front" and the right side (the upper side in Figs. 1 and 2) as the "rear". Component mounting device M1 comprises a component mounting main body 3 and two feeder carts 4. The feeder carts 4 are detachably connected to component supply units 5 on the front and rear sides of the component mounting main body 3, respectively (arrow a in Fig. 2).

[0019] A plurality of tape feeders 6 are mounted on the upper surface of the feeder cart 4 in a line along the X-axis. A reel 8 around which a tape material T is wound, which stores components 7 to be supplied to the component mounting main body 3, is rotatably held on the feeder cart 4. The tape feeder 6 transports the tape material T stored on the reel 8 in the tape feed direction to supply the components 7 to the component mounting main body 3. When the feeder cart 4 is mounted on the component supply unit 5, the plurality of tape feeders 6 are connected to a mounting control device 9 provided in the component mounting main body 3 via the feeder cart 4. The mounting control device 9 transmits a supply command for the components 7 to the tape feeder 6, and the tape feeder 6 that receives the command feeds the tape material T to supply the components 7 to the component removal position.

[0020] 3, two board transport mechanisms 11 are arranged side by side in front and behind on the upper surface of the base 10 of the component mounting main body 3, between the front and rear component supply units 5. Each board transport mechanism 11 transports, positions, and holds a board 12 along the X-axis. Two mounting heads 14 are installed above the board transport mechanisms 11 and are moved horizontally (in the X-axis and Y-axis directions) by a head moving mechanism 13.

[0021] The placement control device 9 controls the head moving mechanism 13 and the placement head 14 to perform a component placement operation in which the placement head 14 picks up the components 7 supplied to the component pick-up position by the tape feeder 6 and transfers and mounts them at the placement point of the board 12 held by the board transport mechanism 11. A body cover 15 that can be opened and closed freely is provided above the feeder cart 4 to prevent an operator from touching the moving mechanisms such as the placement head 14 during the component placement operation.

[0022] 3, a chute 16 is provided on the side of the feeder cart 4 that is coupled to the base 10, for guiding downward the empty tape material T discharged from the tape feeders 6. A cutter 17 is provided on the chute 16 for cutting the empty tape material T. The cutter 17 is controlled by the mounting control device 9, and when the empty tape material T discharged from any of the tape feeders 6 reaches a predetermined length (e.g., 10 cm), it cuts all the empty tape materials T at once.

[0023] In Figs. 3, 5 and 7, the lower part of the chute 16 is connected to an upper opening 18a formed on the upper surface of a receiving section 18 installed below the chute 16. The receiving section 18 receives the chips Ts of the tape material T that have passed through the chute 16. An overlapping section 19 that extends upward and surrounds the upper opening 18a is provided on the upper surface of the receiving section 18. The receiving section 18 is fixed to the chute 16 with the lower part of the chute 16 inserted into the overlapping section 19 and connected to the upper opening 18a, thereby preventing the chips Ts from leaking out from the gap between the chute 16 and the upper opening 18a. That is, the chute 16 and the receiving section 18 are provided so as to communicate with each other without any gaps. The receiving section 18 does not need to be fixed to the chute 16, and may be configured so as to communicate with the chute 16 without any gaps.

[0024] A discharge opening 18b for discharging chips Ts received by the receiving unit 18 is formed on the side surface of the receiving unit 18 facing the base 10 (the rear side in the Y-axis direction in the case of the feeder cart 4 connected to the front side). When the feeder cart 4 is connected to the component mounting main body 3, the discharge opening 18b of the receiving unit 18 comes into contact with a receiving opening Dsa at the tip of a sub-duct Ds of the chip conveying device 30 installed below the component mounting main body 3. In other words, the receiving opening Dsa of the sub-duct Ds opens to the feeder cart 4 side (the front side in the Y-axis direction in the case of the component supply unit 5 on the front side).

[0025] 7, inside receiving section 18, fulcrum 20 is provided on the opposite side of upper opening 18a from discharge opening 18b, and a flat guide plate 21 that is rotatable around the axis of fulcrum 20 in the X-axis direction is disposed. Also, inside receiving section 18, in front of the wall facing discharge opening 18b, an air discharge section 22 that discharges air in a direction toward discharge opening 18b is disposed. That is, receiving section 18 has air discharge section 22 that discharges air in a direction toward discharge opening 18b.

[0026] The air (positive pressure) supplied by the air discharge unit 22 is supplied from a positive pressure supply device 41 installed in the machine room Fm through an air supply path (not shown). Six cart valves Vtf1-Vtf3, Vtr1-Vtr3 are arranged in the air supply path corresponding to the feeder carts 4 mounted in front of and behind the component mounting devices M1-M3 equipped in the production line L1 (see FIG. 11).

[0027] 11, the opening and closing of the cart valves Vtf1-Vtf3, Vtr1-Vtr3 is controlled by a first control unit 51 provided in the system control device 50. That is, when the cart valves Vtf1-Vtf3, Vtr1-Vtr3 are opened by the first control unit 51, air is discharged from the air discharge unit 22. On the other hand, when the cart valves Vtf1-Vtf3, Vtr1-Vtr3 are closed by the first control unit 51, the discharge of air from the air discharge unit 22 stops.

[0028] 7(a), when air is not being discharged from the air discharge portion 22, the guide plate 21 is in a position in which the discharge opening 18b side is lowered. In this state, the chute 16 descends (arrow b), and the chips Ts that enter the inside of the receiver 18 from the upper opening 18a are guided along the upper surface of the guide plate 21 toward the discharge opening 18b.

[0029] 7(b), when air is discharged from the air discharge portion 22, the discharged air rotates the guide plate 21 upward (arrow c), and the upper opening 18a is closed by the guide plate 21. In addition, the chips Ts that have entered the inside of the receiving portion 18 by the discharged air are pushed out toward the back of the sub-duct Ds (toward the main duct Dm) through the discharge opening 18b and the receiving opening Dsa (arrow d).

[0030] As described above, the receiving unit 18 receives chips Ts of the tape material T that have passed through the chute 16 and discharges them from the discharge opening 18b. The chute 16 and the receiving unit 18 also form a discharge unit 23 that receives chips Ts of the tape material T and discharges them from the discharge opening 18b (FIG. 3). That is, the feeder carts 4 of the component mounting devices M1 to M3 have the discharge unit 23 that receives the chips Ts and discharges them from the discharge opening 18b. The chip transport device 30 also has a sub-duct Ds that receives the chips Ts discharged from the discharge opening 18b from a receiving opening Dsa.

[0031] Next, the configuration of the chip transport device 30 provided in the production line L1 will be described. In Fig. 2 and Fig. 4, the chip transport device 30 includes two main ducts Dm, six sub-ducts Ds, and a positive pressure opening and closing unit 31. The chip transport device 30 has a function of transporting chips Ts discharged from the feeder cart 4 to the line storage unit G. The main duct Dm is a tubular member extending in the arrangement direction of the component mounting devices M1 to M3 (X-axis direction), and is installed on the floor surface of the production floor Fp. Two main ducts Dm are installed side by side, one in front of the other.

[0032] Three sub-ducts Ds corresponding to the three feeder carts 4 connected to the front side are connected to the front side of the main duct Dm installed on the front side. Also, three sub-ducts Ds corresponding to the three feeder carts 4 connected to the rear side are connected to the rear side of the main duct Dm installed on the rear side. In the sub-ducts Ds, a receiving opening Dsa is opened at the tip end on the opposite side to the one end connected to the main duct Dm.

[0033] 2, one end of each of the two main ducts Dm is connected to a positive pressure opening and closing unit 31, and the other end is connected to a line housing unit G. Air (positive pressure) is supplied to the positive pressure opening and closing unit 31 from a positive pressure supply device 41 installed in the machine room Fm through a positive pressure supply pipe Pp. The positive pressure opening and closing unit 31 is provided with a duct valve Vdf for switching between discharging and stopping the air supplied to the main duct Dm installed on the front side, and a duct valve Vdr for switching between discharging and stopping the air supplied to the main duct Dm installed on the rear side.

[0034] The opening and closing of the duct valves Vdf, Vdr is controlled by a first control unit 51 provided in the system control device 50. That is, when the duct valves Vdf, Vdr are opened by the first control unit 51, air is discharged from the positive pressure opening and closing unit 31 to the main duct Dm. On the other hand, when the duct valves Vdf, Vdr are closed by the first control unit 51, the discharge of air from the positive pressure opening and closing unit 31 to the main duct Dm stops.

[0035] Fig. 8 is a schematic diagram for explaining the internal structure and function of the main duct Dm and sub-duct Ds on the front side of the chip conveying device 30, and the front feeder cart 4 in a state where it is connected to the component mounting devices M1 to M3. In Fig. 8, a connection opening Dma is formed at the connection point between the side wall of the main duct Dm and the sub-duct Ds. An opening / closing plate 32 for opening and closing the connection opening Dma is disposed inside the main duct Dm. The opening / closing plate 32 is provided rotatably around an axis in the Z-axis direction (up and down direction) via a hinge 33 provided on the inner surface of the side wall of the main duct Dm on the positive pressure opening / closing unit 31 side from the connection opening Dma.

[0036] Next, with reference to Fig. 8(a) to Fig. 8(c), a method for transporting chips Ts of the tape material T to the line storage unit G in the feeder cart 4 and the chip transport device 30 will be described. Fig. 8(a) shows a state in which air is not discharged from the air discharge unit 22 and the positive pressure opening and closing unit 31 provided in the receiving unit 18 of the feeder cart 4 (for example, the state of the cart 2 between time T1 and time T3 in Fig. 12). In this state, the opening and closing plate 32 is closed to block the connection opening Dma. Also, chips Ts that have passed through the chute 16 fall into the receiving unit 18 from time to time (arrow b in Fig. 7(a)).

[0037] In Fig. 8(b), when air is discharged from the air discharge unit 22 without air being discharged from the positive pressure opening / closing unit 31, the discharged air causes the opening / closing plate 32 to rotate (arrow e) toward the inside of the main duct Dm, opening the connection opening Dma, and pushing the chips Ts received in the receiving unit 18 or the sub-duct Ds through the sub-duct Ds into the main duct Dm (see Fig. 7(b)). That is, Fig. 8(b) shows a state in which the first control unit 51 closes the duct valve Vdf and opens any one of the carriage valves Vtf1 to Vtf3 (for example, the state of the carriage 2 between time T3 and time T4 in Fig. 12).

[0038] In Fig. 8(c), when air is discharged from the positive pressure opening and closing unit 31 without air being discharged from the air discharge unit 22, the discharged air causes the opening and closing plate 32 to rotate in the direction of the connection opening Dma (arrow f), closing the connection opening Dma, and the chips Ts in the main duct Dm are pushed in the direction of the line housing unit G (arrow g) and housed in the line housing unit G (see Fig. 9(a)). That is, Fig. 8(c) shows a state in which the first control unit 51 opens the duct valve Vdf and closes the cart valves Vtf1 to Vtf3 (for example, the state between time T4 and time T5 in Fig. 12).

[0039] Next, the configuration of the line housing G will be described with reference to Figures 4 and 9. The two main ducts Dm of the chip transport device 30 communicate with the inside of the line housing G. The ends of the two main ducts Dm penetrate the side of the line housing G and enter the inside of the line housing G. In addition, the line negative pressure supply pipe P1 (P2, P3) communicating with the chip collection device 40 penetrates from the ceiling of the line housing G and the end enters the inside of the line housing G. A skirt portion 34 that spreads downward is provided at the end where the line opening Pa1 (Pa2, Pa3) of the line negative pressure supply pipe P1 opens.

[0040] A negative pressure is supplied to the line negative pressure supply pipe P1 from the chip collection device 40, as described below. A line valve Vb whose opening and closing is controlled by the first control unit 51 is disposed in the line negative pressure supply pipe P1. When the line valve Vb is opened by the first control unit 51, negative pressure is supplied to the skirt portion 34 through the line negative pressure supply pipe P1. When the line valve Vb is closed by the first control unit 51, the supply of negative pressure to the skirt portion 34 is stopped.

[0041] In FIG. 9(a), a tray 35 is disposed near the bottom inside the line housing G. The chips Ts transported by the chip transport device 30 to the inside of the line housing G (arrow h) are collected in the tray 35. When the line valve Vb is open and negative pressure is supplied to the skirt portion 34, the chips Ts transported by positive pressure to the inside of the line housing G are sucked up by the line negative pressure supply pipe P1 (arrow i) and collected to the chip collection device 40. In this way, the chips Ts transported to the line housing G are more efficiently collected in the chip collection device 40 by adding the positive pressure supplied from the main duct Dm to the negative pressure supplied from the line negative pressure supply pipe P1.

[0042] 9(b), when chips Ts transported to the line housing G are to be collected from the line housing G, the duct valves Vdf, Vdr and the line valve Vb are closed to stop the discharge of air from the main duct Dm and the supply of negative pressure from the line negative pressure supply pipe P1. In this state, the operator opens the line housing collection door 36 arranged in the line housing G and collects the chips Ts accumulated in the tray 35 from the line housing collection opening Ga that opens into the line housing G (arrow j). Thus, the line housing G has the line housing collection door 36 (first door) for taking out the chips Ts from the line housing G.

[0043] 9, the line housing unit G is equipped with a weight measuring unit Sw that measures the weight of the tray 35. The measurement result by the weight measuring unit Sw is transmitted to a determination unit 53 (FIG. 11) provided in the system control device 50. The determination unit 53 calculates the weight of the chips Ts in the line housing unit G from the difference between the weight of the tray 35 measured by the weight measuring unit Sw and the weight of an empty tray 35 with no chips Ts accumulated therein. In this way, the weight measuring unit Sw is a measurement unit provided in the line housing unit G that measures the weight of the chips Ts in the line housing unit G.

[0044] The line housing unit G also includes a position detection unit Sp, such as an optical sensor, that detects when the chips Ts have accumulated to a preset collection height. The detection result by the position detection unit Sp is transmitted to the determination unit 53. When the determination unit 53 receives a detection result from the position detection unit Sp indicating that the chips Ts have been detected (for example, that the detection light emitted by the position detection unit Sp has been blocked by the chips Ts), it determines that the chips Ts in the line housing unit G have accumulated to the collection height. In this way, the position detection unit Sp is a detection unit that detects the chips Ts at a predetermined height (collection height) in the line housing unit G that the line housing unit G has.

[0045] Next, the configuration of the contact portion between the discharge opening 18b of the discharge portion 23 of the feeder cart 4 and the receiving opening Dsa of the sub-duct Ds of the chip transport device 30 will be described with reference to Figs.

[0046] In FIG. 5, an upper plate 25 having a width W2 larger than the width W1 (length in the X-axis direction) of the receiving portion 18 is disposed on the upper surface of the receiving portion 18 of the discharge portion 23. That is, both ends of the upper plate 25 in the X-axis direction laterally protrude beyond the receiving portion 18. The receiving portion 18 is disposed in a notch 4b formed in a bottom plate 4a fixed to the feeder cart 4. The notch 4b opens on the subduct Ds side (in the case of the feeder cart 4 connected to the front side, on the rear side in the Y-axis direction), and the width W3 (length in the X-axis direction) is wider than the width W1 of the receiving portion 18. The receiving portion 18 is inserted into the notch 4b from the subduct Ds side so that the upper plate 25 is positioned on the bottom plate 4a of the feeder cart 4.

[0047] At the positions of both sides of the upper plate 25 protruding from the receiving portion 18 and overlapping with the bottom plate 4a, relief holes 25a are formed penetrating vertically. A stepped pin 26 is connected to the bottom plate 4a by penetrating the relief hole 25a. The lengths of the relief hole 25a in the X-axis direction and the Y-axis direction are larger than the diameter of the pin portion 26a of the stepped pin 26 connected to the bottom plate 4a. In addition, the flange portion 26b of the stepped pin 26 located above the bottom plate 4a is larger than the lengths of the relief hole 25a in the X-axis direction and the Y-axis direction. In other words, the flange portion 26b is set to a size that does not fall out of the relief hole 25a.

[0048] 5(a), a rear plate 4c extending downward is disposed on the underside of the bottom plate 4a at a position behind the cutout portion 4b (for the feeder cart 4 connected to the front side, the front side in the Y-axis direction). A biasing portion 27 constituted by an elastic body such as a spring, one end of which is connected to the rear plate 4c and the other end of which is connected to the receiving portion 18, is disposed between the rear plate 4c and the receiving portion 18. The biasing portion 27 biases the discharge portion 23 including the receiving portion 18 toward the sub-duct Ds side (for the feeder cart 4 connected to the front side, the rear side in the Y-axis direction).

[0049] The receiving portion 18, which has been biased by the biasing portion 27 to move toward the subduct Ds side, stops when the pin portion 26a of the penetrating stepped pin 26 abuts against the inner wall of the relief hole 25a on the side opposite the subduct Ds (the state shown in FIG. 5(a)). When the receiving portion 18 is pushed from the subduct Ds side, it moves a movement allowance distance Ym in the Y-axis direction toward the side opposite the subduct Ds, and stops when the pin portion 26a abuts against the inner wall of the relief hole 25a on the subduct Ds side (not shown).

[0050] In FIG. 5, the receiving portion 18 can move in the X-axis direction by the movement margin distance Xm. That is, the receiving portion 18 can move by the movement margin distance Xm from the state where the pin portion 26a abuts against one wall of the relief hole 25a in the X-axis direction (the state of FIG. 5(b)) to the state where the pin portion 26a abuts against the other wall. In addition, when no external force is applied to the receiving portion 18 in the Z-axis direction (up and down direction) other than gravity (the state of FIG. 5(a)), the lower surface of the upper plate 25 abuts against the upper surface of the bottom plate 4a and stops. In this state, there is a margin of movement margin distance Zm in the Z-axis direction between the upper surface of the upper plate 25 and the lower surface of the flange portion 26b of the stepped pin 26. When the receiving portion 18 is moved upward, it rises by the movement margin distance Zm in the Z-axis direction, and the upper surface of the upper plate 25 abuts against the lower surface of the flange portion 26b of the stepped pin 26 and stops (not shown).

[0051] In this way, the discharge section 23 is installed so as to be movable in the direction in which the feeder cart 4 is connected to the subduct Ds (component mounting main body 3). The feeder cart 4 also has a biasing section 27 that biases the discharge section 23 toward the subduct Ds. The escape hole 25a and the stepped pin 26 of the upper plate 25 constitute a restricting section R that restricts movement of the receiving section 18 (discharge section 23) in the Y-axis direction (the direction in which the feeder cart 4 is connected to the subduct Ds (component mounting main body 3)), the X-axis direction (the direction intersecting the direction in which the feeder cart 4 is connected to the subduct Ds in the horizontal plane), or the Z-axis direction (the up-down direction).

[0052] 5, the discharge unit 23 moves in the direction of the subduct Ds, but the subduct Ds may move in the direction of the discharge unit 23. The biasing unit 27 may bias either the discharge unit 23 or the subduct Ds so that one of them moves toward the other. The discharge unit 23 may have a configuration in which the receiving unit 18 is fixed to the chute 16 and the receiving unit 18 and the chute 16 move vertically together, or may have a configuration in which the chute 16 is fixed to the feeder cart 4 and only the receiving unit 18 moves vertically.

[0053] 4 and 5, positioning pins 28 protruding in a direction toward the subduct Ds are provided on both side surfaces in the X-axis direction of the receiving portion 18. Furthermore, extension portions 37 and 38 extending in the X-axis direction are provided on both side surfaces in the X-axis direction of the subduct Ds, beside the receiving opening Dsa. One extension portion 37 has a positioning hole 37a of approximately the same size as the positioning pin 28 formed therethrough. The other extension portion 38 has a positioning elongated hole 38a longer in the X-axis direction than the positioning hole 37a formed therethrough.

[0054] 5 and 6, in the process of connecting the feeder cart 4 to the component mounting main body 3, the pair of positioning pins 28 engage with the positioning hole 37a of the extension portion 37 and the positioning elongated hole 38a of the extension portion 38. At this time, even if there is a misalignment between the position of the discharge portion 23 of the feeder cart 4 and the installation position of the sub-duct Ds of the chip conveying device 30, the misalignment in the X-axis direction is adjusted by the adjustment margin of the positioning elongated hole 38a. Moreover, the misalignments in the X-axis direction, Y-axis direction, and Z-axis direction are adjusted within the ranges of the movement margin distance Xm in the X-axis direction, the movement margin distance Ym in the Y-axis direction, and the movement margin distance Zm in the Z-axis direction that the regulating portion R has.

[0055] Figures 6(a) and 6(b) show schematic views from the side near the connection point between the discharge section 23 of the feeder cart 4 and the sub-duct Ds of the chip conveying device 30 after the feeder cart 4 is connected to the component mounting main body 3.

[0056] 6(a) shows a case where there is no misalignment between the discharge portion 23 of the feeder cart 4 and the sub-duct Ds of the chip transport device 30. The discharge opening 18b of the discharge portion 23 and the receiving opening Dsa of the sub-duct Ds come into contact with each other from the direction in which the feeder cart 4 is connected to the component mounting main body 3. Then, when the feeder cart 4 is connected to the component mounting main body 3, the discharge portion 23 (receiving portion 18) is pressed against the sub-duct Ds by the biasing portion 27. As a result, when the feeder cart 4 is connected to the component mounting main body 3, the discharge opening 18b comes into contact with the receiving opening Dsa so that the chips Ts discharged from the discharge portion 23 to the sub-duct Ds do not leak to the outside.

[0057] 6(b) shows a state in which the positions of the discharge part 23 of the feeder cart 4 and the sub-duct Ds of the chip transport device 30 are misaligned by ΔX (not shown) in the X-axis direction, ΔY in the Y-axis direction, and ΔZ in the Z-axis direction. Even if there is a misalignment (ΔX, ΔY, ΔZ) between the discharge part 23 and the sub-duct Ds, the biasing part 27 and the regulating part R adjust the positions within the range of the movement margin distance (Xm, Ym, Zm). This prevents the chips Ts from leaking to the outside from the connection point between the discharge part 23 and the sub-duct Ds.

[0058] In this way, the pair of positioning pins 28 form a pair of protrusions provided on both sides of the discharge opening 18b. The positioning hole 37a and the positioning elongated hole 38a form a pair of holes that engage with the pair of protrusions provided on both sides of the receiving opening Dsa. The pair of protrusions are positioning portions provided in the discharge portion 23, and the pair of holes are positioned portions provided in the subduct Ds. Note that the subduct Ds may have a positioning portion with a pair of protrusions, and the discharge portion 23 may have a positioned portion with a pair of holes.

[0059] That is, it is sufficient that one of the discharge section 23 or the sub-duct Ds has a positioning portion for positioning it relative to the other, and the other has a positioned portion that is positioned by the positioning portion. One of the pair of holes (positioning elongated hole 38a) has an adjustment margin for adjusting the position of the receiving section 18 relative to the sub-duct Ds when engaging with the protrusion. This allows the positions of the discharge opening 18b of the discharge section 23 and the receiving opening Dsa of the sub-duct Ds to be positioned during the process of connecting the feeder cart 4 to the component mounting main body 3. Note that the positioning hole 37a and the positioning elongated hole 38a are not limited to holes that penetrate the extension sections 37 and 38, and may be recesses that do not penetrate.

[0060] 5 and 6, the receiving section 18 (discharge section 23) is in contact with the subduct Ds, and an elastically deformable elastic member 29 such as hard sponge or rubber is disposed around the discharge opening 18b. When the feeder cart 4 is connected to the component mounting main body 3, the elastically deformable elastic member 29 fills the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa. This prevents chips Ts from leaking out from the connection point between the discharge section 23 and the subduct Ds even if there is a misalignment between the positions of the discharge opening 18b and the receiving opening Dsa.

[0061] In this way, the feeder cart 4 has the elastic member 29 that elastically deforms to fill the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa when the discharge unit 23 is positioned with respect to the subduct Ds. The elastic member 29 may be disposed around the receiving opening Dsa of the subduct Ds. That is, it is sufficient that the component mounting devices M1 to M3 are provided with the elastic member 29 that elastically deforms to fill the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa when one of the discharge unit 23 and the subduct Ds is positioned with respect to the other.

[0062] As described above, the feeder cart 4 of this embodiment is connected to the component mounting device M1-M3 including the component mounting main body 3 that holds the tape feeder 6 and mounts the components 7 supplied from the tape feeder 6 on the board 12. The feeder cart 4 has a discharge section 23 that passes through the chips Ts of the tape material T discharged from the tape feeder 6 and discharges them from the discharge opening 18b, and the discharge opening 18b contacts the receiving opening Dsa of the sub-duct Ds of the chip conveying device 30 that conveys the chips Ts to the line accommodation section G (accommodation section) so that the chips Ts discharged from the discharge section 23 do not leak to the outside when the feeder cart 4 is connected to the component mounting main body 3. This makes it possible to prevent the chips Ts of the tape material T from leaking out from the connection point between the feeder cart 4 and the chip conveying device 30.

[0063] Moreover, the component mounting devices M1 to M3 of this embodiment include the feeder cart 4 and the component mounting main body 3, and have a discharge section 23 that passes through and discharges chips Ts of the tape material T discharged from the tape feeder 6 from a discharge opening 18b, and the discharge opening 18b contacts a receiving opening Dsa of a sub-duct Ds of a chip conveying device 30 that conveys the chips Ts to a line accommodation section G (accommodation section) so that the chips Ts discharged from the discharge section 23 do not leak to the outside when the feeder cart 4 is connected to the component mounting main body 3. This makes it possible to prevent the chips Ts of the tape material T from leaking out from the connection point between the feeder cart 4 and the chip conveying device 30.

[0064] The chip transport device 30 of this embodiment has a sub-duct Ds that receives the chips Ts from the receiving opening Dsa, and the discharge opening 18b of the discharge section 23, which passes through and discharges the chips Ts of the component mounting devices M1 to M3 including the feeder cart 4 and the component mounting main body 3, contacts the receiving opening Dsa so that the chips Ts discharged from the discharge section 23 to the sub-duct Ds do not leak to the outside when the feeder cart 4 is connected to the component mounting main body 3, and transports the chips Ts of the tape material T discharged from the tape feeder 6 to the line storage section G (storage section). This makes it possible to prevent the chips Ts of the tape material T from leaking out from the connection point between the feeder cart 4 and the chip transport device 30.

[0065] The component mounting system 1 of this embodiment is a chip collection system that includes component mounting devices M1-M3 including the feeder cart 4 and the component mounting main body 3, and a chip transport device 30, and the discharge opening 18b contacts the receiving opening Dsa so that the chips Ts discharged from the discharge section 23 to the sub-duct Ds do not leak to the outside when the feeder cart 4 is connected to the component mounting main body 3, and transports the chips Ts of the tape material T discharged from the tape feeder 6 to the line storage section G (storage section). The chip collection system of this embodiment can prevent the chips Ts of the tape material T from leaking out from the connection point between the feeder cart 4 and the chip transport device 30.

[0066] Next, the configuration of the chip collection device 40 provided in the component mounting system 1 (chip collection system) will be described with reference to Fig. 1 and Fig. 10. As described above, the sub duct Ds and main duct Dm of the chip conveying device 30 provided in each of the production lines L1 to L3 constitute a conveying section D (Fig. 2) that conveys chips Ts of the tape material T discharged from the tape feeder 6. The chip conveying device 30 has the conveying section D and a line storage section G that stores the chips Ts conveyed by the conveying section D. The conveying section D conveys the chips Ts discharged from the tape feeder 6 to the line storage section G by positive pressure (air).

[0067] The line openings Pa1-Pa3 of the line negative pressure supply pipes P1-P3, which communicate with the chip collection device 40, are connected to the line accommodation sections G(1)-G(3) of the production lines L1-L3, respectively (see FIG. 9). The chip collection device 40, which is provided away from the production lines L1-L3, is connected to a collection opening Pca of the concentrated negative pressure supply pipe Pc. Furthermore, the line negative pressure supply pipes P1-P3 of the production lines L1-L3 are connected to the concentrated negative pressure supply pipe Pc.

[0068] 10(a), the chip collection device 40 has therein a concentrated storage section Gc and a negative pressure supply chamber 42. The concentrated storage section Gc and the negative pressure supply chamber 42 are separated by a partition wall 43 and a partition filter 44 located therebetween. The partition filter 44 is attached to an attachment section 43a formed on the upper part of the partition wall 43. The mesh size of the partition filter 44 is set to allow air to pass through but not allow chips Ts of the tape material T of a predetermined size or larger to pass through.

[0069] In FIG. 10(b), a filter attachment opening 43b communicating with the attachment portion 43a is opened on the side of the chip collection device 40. The partition filter 44 is attached to the attachment portion 43a through the filter attachment opening 43b. In this way, the partition filter 44 (filter) is provided between the concentrated storage portion Gc and the space (negative pressure supply chamber 42) in which the negative pressure supply portion NP is provided, and chips Ts of a predetermined size or larger are retained in the concentrated storage portion Gc without passing through the partition filter 44. In addition, the chip collection device 40 has an attachment portion 43a to which the partition filter 44 can be slid and attached. This allows the partition filter 44 to be easily replaced.

[0070] 10(a), a negative pressure supply unit NP that generates negative pressure is installed in the negative pressure supply chamber 42. The negative pressure supply unit NP is controlled by a second control unit 52 (FIG. 11) provided in the system control device 50. An exhaust opening 42a that communicates with the negative pressure supply chamber 42 is formed on the rear surface of the chip collection device 40. An exhaust filter 45 is disposed in the exhaust opening 42a. The mesh size of the exhaust filter 45 is such that it allows air to pass through but does not allow small chips Ts and dust that have passed through the partition filter 44 to pass through.

[0071] 10(a), a collection container 46 with an open top is placed in the concentrated storage section Gc. A baffle plate 47 is provided on the ceiling of the concentrated storage section Gc between the collection opening Pca of the concentrated negative pressure supply pipe Pc and the partition filter 44 to prevent the chips Ts that have entered the concentrated storage section Gc from the collection opening Pca from being sucked directly toward the partition filter 44.

[0072] When the negative pressure supply unit NP is operated, the air in the centralized storage unit Gc is exhausted to the negative pressure supply chamber 42 through the partition filter 44. This generates negative pressure in the centralized storage unit Gc, and the chips Ts stored in the line storage units G(1) to G(3) are collected in the centralized storage unit Gc through the centralized negative pressure supply pipe Pc and the line negative pressure supply pipes P1 to P3 (arrow k). The chips Ts collected in the centralized storage unit Gc are collected in a collection container 46. The air exhausted from the centralized storage unit Gc to the negative pressure supply chamber 42 is exhausted to the outside of the chip collection device 40 through the exhaust filter 45.

[0073] In FIG. 10(b), a centralized storage section recovery opening Gca that communicates with the centralized storage section Gc is formed on the side of the chip recovery device 40. When the chip recovery device 40 is in operation, the centralized storage section recovery opening Gca is closed by the centralized storage section recovery door 48. When recovering chips Ts accumulated in the recovery container 46, the worker opens the centralized storage section recovery door 48 with the negative pressure supply unit NP stopped, and removes the recovery container 46 from the centralized storage section recovery opening Gca. The worker also returns the empty recovery container 46 to the centralized storage section Gc, and closes the centralized storage section recovery door 48. In this way, the centralized storage section Gc has a centralized storage section recovery door 48 (second door) for removing chips Ts from the centralized storage section Gc.

[0074] 1, as described above, the line negative pressure supply pipes P1-P3 and the concentrated negative pressure supply pipe Pc in this embodiment are a tubular recovery path P in which the line openings Pa1-Pa3 are connected to the line accommodation units G(1)-G(3) and the recovery opening Pca is connected to the concentrated accommodation unit Gc. The component mounting system 1 (chip recovery system) includes a plurality of line accommodation units G(1)-G(3), each of which is provided for a respective one of the production lines L1-L3.

[0075] The recovery path P has a first path (concentrated negative pressure supply pipe Pc) and a plurality of second paths (line negative pressure supply pipes P1-P3) branching off from the first path. The first path has a recovery opening Pca, and the plurality of second paths have line openings Pa1-Pa3, each of which is connected to a respective one of the plurality of line housing portions G(1)-G(3).

[0076] In Figure 10, the concentrated storage section Gc connected to the recovery opening Pca of the tubular recovery path P in which the line openings Pa1 to Pa3 are connected to the line storage sections G(1) to G(3), and the negative pressure supply section NP that supplies negative pressure from the recovery opening Pca to the recovery path P to transport the chips Ts stored in the line storage sections G(1) to G(3) to the concentrated storage section Gc constitute a recovery means Q that recovers the chips Ts stored in the line storage sections G(1) to G(3) in the concentrated storage section Gc by negative pressure.

[0077] In FIG. 1, the line accommodation units G(1)-G(3) are provided on the production lines L1-L3 including the component mounting devices M1-M3 having the tape feeders 6, and are provided at positions where the chips Ts of the tape material T discharged from the line accommodation units G(1)-G(3) can be collected to the centralized storage unit Gc through the collection path P by the negative pressure generated by the negative pressure supply unit NP. That is, the length of the collection path P from the centralized storage unit Gc to the line accommodation units G(1)-G(3) is set in consideration of the negative pressure supplying capacity of the negative pressure supply unit NP. That is, the line accommodation units G(1)-G(3) are provided at positions where the collection means Q can access them. This allows the chips Ts of the tape material T discharged from the production lines L1-L3 to be appropriately collected to the centralized storage unit Gc.

[0078] In Fig. 1, a centralized valve Vc is provided in the centralized negative pressure supply pipe Pc (first path) between the branch to the line negative pressure supply pipes P1 to P3 (second path) and the centralized storage section Gc. In addition, line valves Vb(1) to Vb(3) are provided in the multiple line negative pressure supply pipes P1 to P3 (second path) between the branch from the centralized negative pressure supply pipe Pc (first path) and the line storage sections G(1) to G(3), respectively. Opening and closing of the line valves Vb(1) to Vb(3) is controlled by a first control section 51 provided in the system control device 50. Opening and closing of the centralized valve Vc is controlled by a second control section 52 provided in the system control device 50 (Fig. 11).

[0079] In this way, the recovery path P includes a valve (centralized valve Vc) provided in the first path (centralized negative pressure supply pipe Pc) and valves (line valves Vb(1) to Vb(3)) provided in each of the second paths (line negative pressure supply pipes P1 to P3). The component mounting system 1 (chip recovery system) also includes a first control unit 51 that controls the opening and closing of the valves (line valves Vb(1) to Vb(3)) provided in each of the second paths (line negative pressure supply pipes P1 to P3), and a second control unit 52 that controls the opening and closing of the valve (centralized valve Vc) provided in the first path (centralized negative pressure supply pipe Pc). Note that the valves (line valves Vb(1) to Vb(3)) do not need to be provided in all of the second paths (line negative pressure supply pipes P1 to P3), and may be provided in at least one of the second paths. As another embodiment, none of the second paths (line negative pressure supply pipes P1 to P3) may be provided with the valves (line valves Vb(1) to Vb(3)).

[0080] Further, the chip conveying device 30, which conveys the chips Ts of the tape material T discharged from the tape feeder 6, has a conveying section D which conveys the chips Ts, and line accommodation sections G(1) to G(3) which accommodate the chips Ts conveyed by the conveying section D. The line accommodation sections G(1) to G(3) are provided on the production lines L1 to L3 including the component mounting devices M1 to M3 having the tape feeder 6, and are provided at positions accessible to a chip collecting device 40 (collecting means Q) which collects the chips Ts accommodated in the line accommodation sections G(1) to G(3) of the chip conveying device 30 in a concentrated storage section Gc by negative pressure. This allows the chips Ts of the tape material T discharged from the production lines L1 to L3 to be appropriately collected in the concentrated storage section Gc.

[0081] The chip collection device 40, which collects the chips Ts of the tape material T discharged from the tape feeder 6 in the concentrated storage section Gc, has a collection means Q that collects the chips Ts by negative pressure. The chip transport device 30 has a transport section D that transports the chips Ts and line storage sections G(1) to G(3) that store the chips Ts transported by the transport section D. The line storage sections G(1) to G(3) of the chip transport device 30 are provided on the production lines L1 to L3 including the component mounting devices M1 to M3 having the tape feeder 6, and the chip collection device 40 (collection means Q) is provided at a position accessible to the line storage sections G(1) to G(3). This allows the chips Ts of the tape material T discharged from the production lines L1 to L3 to be appropriately collected in the concentrated storage section Gc.

[0082] The component mounting system 1 is a chip collection system including a chip conveying device 30 having a conveying section D that conveys chips Ts of the tape material T discharged from the tape feeder 6 and line storage sections G(1)-G(3) that store the chips Ts conveyed by the conveying section D, and a chip collection device 40 (collection means Q) that collects the chips Ts stored in the line storage sections G(1)-G(3) in a centralized storage section Gc by negative pressure. The line storage sections G(1)-G(3) are provided on the production lines L1-L3 including the component mounting devices M1-M3 having the tape feeders 6, and are provided at positions accessible to the chip collection device 40 (collection means Q). This allows the chips Ts of the tape material T discharged from the production lines L1-L3 to be appropriately collected in the centralized storage section Gc.

[0083] Next, with reference to Figs. 11 to 13, a chip collection method for collecting chips Ts of the tape material T discharged from the tape feeder 6 in the concentrated storage unit Gc by the component mounting system 1 (chip collection system) will be described.

[0084] 11, the system control device 50 included in the component mounting system 1 includes a first control unit 51, a second control unit 52, and a determination unit 53. The first control unit 51 controls the opening and closing of the line valves Vb(1) to Vb(3), duct valves Vdf(1) to Vdf(3), and Vdr(1) to Vdr(3), and cart valves Vtf1(1) to Vtf3(3), and Vtr1(1) to Vtr3(3) included in the production lines L1 to L3.

[0085] The second control unit 52 controls the opening and closing of the centralized valve Vc and the negative pressure supply unit NP of the chip collection device 40. The determination unit 53 determines the amount of chips Ts stored in the line storage units G(1) to G(3) based on signals sent from position detection units Sp(1) to Sp(3) (detection units) and weight measurement units Sw(1) to Sw(3) (measurement units) of the line storage units G(1) to G(3) equipped in the production lines L1 to L3.

[0086] Fig. 12 is a timing diagram of a chip collection method in which chips Ts of the tape material T discharged from the tape feeder 6 are transported to line storage sections G(1) to G(3) (storage sections) by the feeder cart 4 and the chip transport device 30. Here, the transport of chips Ts by the chip transport device 30 will be described with reference to Figs. 7 to 9, using the transport section D and the feeder cart 4 on the front side of the chip transport device 30 of the production line L1 as an example. The same applies to the transport section D and the feeder cart 4 on the rear side of the production line L1, and the chip transport devices 30 of the other production lines L2 to L3, and so description thereof will be omitted.

[0087] In FIG. 12, while the chips Ts are being transported to the line storage section G(1), the negative pressure supply section NP is operated by the second control section 52, and the centralized valve Vc is also open. That is, negative pressure is supplied from the chip collection device 40 to the line valve Vb(1). Also, when the chip transport device 30 is not transporting the chips Ts (for example, from time T0 to T1, or after time T7), the line valve Vb(1), duct valve Vdf(1), and cart valves Vtf1(1) to Vtf3(1) are all closed. During that time, in the discharge section 23 of the feeder cart 4, the chips Ts pass through the chute 16 and fall into the receiver 18 (arrow b in FIG. 7(a), FIG. 8(a)).

[0088] In Fig. 12, the first control unit 51 opens the carriage valve Vtf1(1) of the component mounting device M1 between time T1 and time T2 to discharge air from the air discharge unit 22 (Figs. 7(b) and 8(b)). As a result, the chips Ts discharged from the discharge opening 18b are pushed out to the main duct Dm through the sub-duct Ds. The first control unit 51 closes the carriage valve Vtf1(1) at time T2.

[0089] Next, the first control unit 51 opens the line valve Vb(1) and the duct valve Vdf(1) from time T2 to time T3. As a result, air is discharged from the positive pressure opening and closing unit 31 to the main duct Dm, and at the same time, negative pressure is supplied to the skirt portion 34 of the line housing unit G(1) through the line negative pressure supply pipe P1. As a result, the chips Ts in the main duct Dm are transported to the line housing unit G(1) (arrow g in FIG. 8(c) and arrow h in FIG. 9(a)). In addition, the chips Ts collected in the line housing unit G(1) are sucked toward the chip collection device 40 by the negative pressure supplied from the line negative pressure supply pipe P1 (arrow i in FIG. 9(a)). The first control unit 51 closes the line valve Vb(1) and the duct valve Vdf(1) at time T3.

[0090] 12, the first control unit 51 similarly opens the carriage valve Vtf2(1) of the component mounting device M2 to discharge air from the air discharge unit 22 during the period from time T3 to time T4, and pushes out the chips Ts discharged from the discharge opening 18b to the main duct Dm. Next, the first control unit 51 opens the line valve Vb(1) and the duct valve Vdf(1) during the period from time T4 to time T5, and discharges air from the positive pressure opening and closing unit 31 to the main duct Dm, and transports the chips Ts in the main duct Dm to the line accommodation unit G(1). After that, similarly, the first control unit 51 pushes out the chips Ts of the component mounting device M3 to the main duct Dm (times T5 to T6), and transports the chips Ts in the main duct Dm to the line accommodation unit G(1) (times T6 to T7).

[0091] In this way, the first control unit 51 sequentially opens and closes the carriage valves Vtf1(1) to Vtf3(1) to discharge air from the air discharge unit 22 and pushes the chips Ts to the main duct Dm. That is, the discharge unit 23 discharges air in a direction toward the discharge opening 18b. Then, the first control unit 51 opens and closes the line valve Vb(1) and the duct valve Vdf(1) to transport the chips Ts in the main duct Dm to the line housing unit G(1). That is, the chip transport device 30 collects the chips Ts discharged from the discharge opening 18b in the line housing unit G(1) through the transport unit D (duct). In this way, the positive pressure supplied by the positive pressure supply device 41 can be used efficiently by sequentially opening and closing the carriage valves Vtf1(1) to Vtf3(1).

[0092] 13 is a timing diagram of a chip collection method for collecting chips Ts stored in the line storage units G(1) to G(3) of the production lines L1 to L3 in the centralized storage unit Gc of the chip collection device 40. Here, in each of the production lines L1 to L3, the chips Ts discharged from the component mounting devices M1 to M3 are sequentially pushed out to the main duct Dm of the transfer unit D by the method shown in FIG. For example, in the production line L1, except for the time between time T11 and time T12 when the line valve Vb(1) and the duct valve Vdf(1) are open, the first control unit 51 sequentially opens and closes the cart valves Vtf1(1) to Vtf3(1) and Vtr1(1) to Vtr3(1) to eject air from the air ejection unit 22 to eject the chips Ts to the main duct Dm.

[0093] 13, when the chip collection device 40 collects chips Ts in the centralized storage unit Gc (times T10 to T15), the negative pressure supply unit NP is operated by the second control unit 52 and the centralized valve Vc is also open. Then, the first control unit 51 controls the line valves Vb(1) to Vb(3) provided in each of the multiple line negative pressure supply pipes P1 to P3 (second paths) so that the line valves Vb(1) to Vb(3) are opened and closed in sequence.

[0094] For example, the first control unit 51 opens the line valve Vb(1) and duct valves Vdf(1), Vdr(1) of the production line L1 during the period from time T11 to time T12, and closes the line valves Vb(2), Vb(3) and duct valves Vdf(2), Vdr(2), Vdf(3), Vdr(3) of the other production lines L2, L3. As a result, negative pressure is supplied only to the line accommodation unit G(1) of the production line L1 through the line negative pressure supply pipe P1 (arrow i in FIG. 9(a)). In addition, positive pressure is supplied to the main duct Dm of the conveying unit D of the production line L1 from the positive pressure opening and closing unit 31 (arrow h in FIG. 9(a)). As a result, the chips Ts in the main duct Dm are conveyed to the line accommodation unit G(1), and are further collected in the concentrated accommodation unit Gc through the line negative pressure supply pipe P1 and the concentrated negative pressure supply pipe Pc (arrow k in FIG. 10(a)).

[0095] Similarly, the first control unit 51 opens the line valve Vb(2) and duct valves Vdf(2), Vdr(2) of the production line L2 between time T12 and time T13, and closes the line valves Vb(1), Vb(3) and duct valves Vdf(1), Vdr(1), Vdf(3), Vdr(3) of the other production lines L1 and L3. This allows the chips Ts to be collected from the production line L2 to the centralized storage unit Gc. In addition, the first control unit 51 opens the line valve Vb(3) and duct valves Vdf(3), Vdr(3) of the production line L3 between time T13 and time T14, and closes the line valves Vb(1), Vb(2) and duct valves Vdf(1), Vdr(1), Vdf(2), Vdr(2) of the other production lines L1 and L2. This allows the chips Ts to be collected from the production line L3 to the centralized storage unit Gc.

[0096] Thus, in the chip collection method of the present embodiment, the transport section D of the chip transport device 30 transports the chips Ts to the line accommodation sections G(1)-G(3), and the chip collection device 40 uses negative pressure to collect the chips Ts transported to the line accommodation sections G(1)-G(3) in the centralized storage section Gc. This allows the chips Ts of the tape material T discharged from the production lines L1-L3 to be properly collected. Furthermore, the first control section 51 controls the line valves Vb(1)-Vb(3) to open and close sequentially, allowing efficient use of the negative pressure supplied by the negative pressure supply section NP.

[0097] In FIG. 13, when the chips Ts are taken out of the centralized storage section Gc (times T15 to T16), the second control section 52 stops the negative pressure supply section NP and closes the centralized valve Vc provided in the centralized negative pressure supply pipe Pc (first path). This makes the pressure in the centralized storage section Gc the same as the pressure outside the chip collection device 40. In addition, the chips Ts are prevented from falling from the centralized negative pressure supply pipe Pc into the centralized storage section Gc. In this state, the worker can collect the chips Ts by opening the centralized storage section collection door 48 (second door) and taking out the collection container 46 from the centralized storage section collection opening Gca. In this way, the negative pressure supply section NP is stopped when the chips Ts are taken out of the centralized storage section Gc.

[0098] 13, the first control unit 51 collects the chips Ts from the production lines L1 to L3 in sequence at a predetermined time, but the chip collection method is not limited to this method. For example, when the amount of chips Ts collected in the line accommodation units G(1) to G(3) of the production lines L1 to L3 exceeds a predetermined threshold, the first control unit 51 may open and close the line valves Vb(1) to Vb(3) and the duct valves Vdf(1) to Vdf(3), Vdr(1) to Vdr(3) to collect the chips Ts from the line accommodation units G(1) to G(3).

[0099] In this case, the judgment unit 53 judges from which of the line housing units G(1) to G(3) the chips Ts should be collected, based on information received from the position detection units Sp(1) to Sp(3) or weight measurement units Sw(1) to Sw(3) provided in the line housing units G(1) to G(3).

[0100] For example, when the position detection unit Sp(1) (detection unit) of the line housing unit G(1) detects the chips Ts (detects that the chips Ts have reached a predetermined height), the determination unit 53 sends a command to the first control unit 51 to collect the chips Ts from the line housing unit G(1). Also, when the determination unit 53 determines that the weight of the chips Ts in the line housing unit G(1) measured by the weight measurement unit Sw(1) (measurement unit) has reached a predetermined value or more, it sends a command to the first control unit 51 to collect the chips Ts from the line housing unit G(1). The first control unit 51, which has received the command, controls the valves so that negative pressure is supplied to the collection path P connected to the line housing unit G(1) from the chip collection device 40 and positive pressure is supplied to the main duct Dm of the production line L1.

[0101] In this way, the negative pressure supplied by the negative pressure supply unit NP can be used efficiently by opening the corresponding line valves Vb(1) to Vb(3) only when the chips Ts are collected from the line housing units G(1) to G(3). Furthermore, the second control unit 52 may control the negative pressure supply unit NP to operate and open the centralized valve Vc only when the chips Ts are collected from the line housing units G(1) to G(3). In other words, the second control unit 52 may control the negative pressure supply unit NP and the centralized valve Vc provided in the centralized negative pressure supply pipe Pc (first path) so that negative pressure is intermittently supplied to the collection path P. This can reduce power consumption by the negative pressure supply unit NP. [Industrial Applicability]

[0102] The scrap collection system, scrap transport device, scrap collection device, and scrap collection method of the present invention have the effect of being able to properly collect scraps of tape materials discharged from a production line, and are useful in the field of mounting components to substrates. [Explanation of symbols]

[0103] 1 Parts mounting system (chip collection system) 2 Loading entrance 6 Tape Feeder 30 Chip transport device 36 Line storage area recovery door (first door) 40 Chip collection device 43a Mounting part 44 Partition Filter (Filter) 48 Centralized Storage Area Recovery Door (No. 2 Door) B Building D Conveyor section Fp Production Floor (1st Floor) Fm Machine room (2nd floor) G, G(1)~G(3) Line storage section Gc central containment area L1~L3 production lines M1~M3 Component placement device NP negative pressure supply unit P Recovery Route P1~P3 Line negative pressure supply pipe (second line) Pa1~Pa3 line opening Pc Centralized negative pressure supply pipe (1st line) Pca recovery opening Sp Position detection unit (detection unit) Sw Weight measurement section (measurement section) T tape material Ts chips Vb(1)~Vb(3) Line valves Vc central valve

Claims

1. a chip transport device including a transport section that transports chips of a tape member discharged from a tape feeder, and a line storage section that stores the chips transported by the transport section; a chip collecting device that collects the chips stored in the line storage unit into a central storage unit by negative pressure, A chip recovery system, wherein the line accommodation unit is provided in a production line including a component mounting device having the tape feeder, and is provided at a position accessible to the chip recovery device.

2. The chip collection device is provided away from the production line, The concentrated storage section is connected to a collection opening of a tubular collection path having a line opening connected to the line storage section; The chip collection system according to claim 1 , further comprising: a negative pressure supply unit that supplies negative pressure from the collection opening to the collection path to transport the chips stored in the line storage unit to the central storage unit.

3. A plurality of the line housings are provided, Each of the plurality of line accommodating units is provided in each of the plurality of production lines, The recovery path includes a first path and a plurality of second paths branching from the first path, The first passage has the collection opening, The second paths each have the line opening, The chip collection system of claim 2 , wherein each of the plurality of line openings is connected to a respective one of the plurality of line housings.

4. The chip collection system of claim 3 further comprising a valve in the first passage.

5. The swarf collection system of claim 3 further comprising a valve in at least one of the plurality of second passages.

6. The swarf collection system of claim 5 further comprising a valve in each of the plurality of second passages.

7. The chip collection system according to claim 6 , further comprising a first control unit that controls the valves provided in each of the plurality of second paths so that the valves are opened and closed in sequence.

8. The chip collection system according to claim 3 , further comprising a second control unit that controls the negative pressure supply unit and a valve provided in the first path so that negative pressure is intermittently supplied to the collection path.

9. The line storage unit has a measuring unit that measures a weight of the chips in the line storage unit, The chip collection system according to claim 7 , wherein the first control unit controls so that negative pressure is supplied to the collection path when the weight measured by the measurement unit is equal to or greater than a predetermined value.

10. The line storage unit has a detection unit that detects the chips at a predetermined height within the line storage unit, The chip collection system according to claim 7 , wherein the first control unit performs control so that negative pressure is supplied to the collection path when the detection unit detects the chips.

11. The chip collection system according to claim 2 , wherein the line housing has a first door for removing the chips from the line housing.

12. The concentrated storage section has a second door for removing the chips from the concentrated storage section, The chip recovery system according to claim 2 , wherein the negative pressure supply unit is stopped when the chips are removed from the concentrated storage unit.

13. The concentrated storage section has a second door for removing the chips from the concentrated storage section, 8. The chip recovery system according to claim 4, wherein, when the chips are removed from the concentrated storage section, the negative pressure supply section is stopped, and further, a valve provided in the first line is closed.

14. a filter is provided between the concentrated storage section and a space in which the negative pressure supply section is provided, The chip collection system according to claim 2 , wherein the chips having a predetermined size or larger do not pass through the filter and are retained in the concentrated storage section.

15. The chip collection system according to claim 14 , wherein the chip collection device has a mounting portion onto which the filter can be slidably mounted.

16. 8. The chip recovery system according to claim 2, wherein the centralized storage section is provided on a first floor on which the component mounting device is installed, or on a second floor different from the first floor.

17. The chip recovery system according to claim 16 , wherein the centralized storage unit is provided in an area having an entrance of a building in which the component mounting device is installed.

18. The chip collection system according to claim 1 , wherein the transport section transports the chips discharged from the tape feeder to the line storage section by positive pressure.

19. A chip transport device that transports chips of a tape member discharged from a tape feeder, A conveying unit that conveys the chips; a line storage unit that stores the chips transported by the transport unit, The line storage section is provided on a production line including a component mounting device having the tape feeder, and is provided in a position accessible to a chip collection device that uses negative pressure to collect the chips stored in the line storage section of the chip transport device into a central storage section.

20. A scrap collection device that collects scraps of a tape member discharged from a tape feeder in a concentrated storage unit, a chip transporting device including a transporting unit that transports the chips and a line storage unit that stores the chips transported by the transporting unit, the line storage unit being provided in a production line including a component mounting device having the tape feeder, The chip collection device is provided at a position accessible to the line storage unit, and collects the chips in a centralized storage unit by negative pressure.

21. A scrap collection method for collecting scraps of a tape member discharged from a tape feeder in a concentrated storage unit, comprising: a chip transporting device including a transporting section that transports the chips and a line storage section that stores the chips transported by the transporting section, the line storage section being provided in a production line including a component mounting device having the tape feeder, A chip collecting device that collects the chips stored in the line storage section by negative pressure is provided at a position accessible to the line storage section, The conveying unit conveys the chips to the line storage unit, The chip recovery method, wherein the chip recovery device recovers the chips transported to the line storage section into the centralized storage section by using the negative pressure.

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